Two-phase liquid cooling system based on nanoparticle deposition boiling enhancement mechanism
By adopting the boiling enhancement mechanism of nanoparticle deposition in the data center cooling system, the problems of low efficiency and high cost of traditional cooling systems in high power and high heat flow dissipation are solved, achieving more efficient cooling effects and lower improvement costs.
Patent Information
- Application Number
- CN202411688550.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2044-11-25
AI Technical Summary
When existing data center cooling systems handle chip heat dissipation with high power and high heat flow, traditional air-cooling systems lack heat exchange coefficients, and the two-phase immersion cooling systems have challenges in angle sensitivity and liquid phase supplementation, resulting in low cooling efficiency and high cost.
Using a boiling enhancement mechanism based on nanoparticle deposition, the high thermal conductivity of the bubble nucleation point and thermal surface is enhanced and the boiling efficiency of the pool is improved. At the same time, the nanoparticle deposition strength is controlled through different thermally conductive materials, selectively strengthening the boiling surface, and improving the efficiency of the cooling system.
It significantly improves boiling capacity and cooling efficiency, reduces improvement costs, and effectively enhances the energy utilization efficiency and cooling capacity of the cooling system without changing the server layout.