Reinforced immersed liquid cooling computing node and computing equipment

Abstract

The invention belongs to the field of computing equipment, and particularly discloses a reinforced immersed liquid cooling computing node and computing equipment, the reinforced immersed liquid cooling computing node comprises a box body, the box body is internally provided with a front panel cavity, an immersion cavity and a switching cavity from one end to the other end in sequence, and the front panel cavity, the immersion cavity and the switching cavity are mutually independent; a liquid inlet connector and a liquid outlet connector are formed in the box body, and the liquid inlet connector is communicated with the immersion cavity; a circulation pipeline communicated with the immersion cavity is fixedly connected in the front panel cavity, and the liquid outlet end of the circulation pipeline is communicated with the liquid outlet connector; the calculation function module is detachably installed in the immersion cavity, and cooling liquid is arranged in the immersion cavity; the outlet end of the liquid circulating device is connected with the liquid inlet connector, and the inlet end of the liquid circulating device is connected with the liquid outlet connector. The cooling liquid in the immersion cavity can make direct contact with the calculation function module, the convection heat resistance of the cooling liquid and the heating surface of the calculation function module is reduced, a high heat transfer coefficient is achieved, and heat dissipation of calculation nodes can be effectively achieved when the cooling liquid flows.

Description

Technical Field

[0001] The present application belongs to the field of computing devices, and more specifically, to a reinforced immersion liquid-cooled computing node and computing device. Background Art

[0002] In high-performance computer clusters or cloud computing data centers, a cabinet usually contains multiple computing nodes to improve product integration and reduce space occupied by the computer room.

[0003] In related technologies, computing node heat dissipation generally uses air cooling and cold plate liquid cooling to cool the internal modules. However, air cooling and cold plate liquid cooling are both non-contact indirect heat exchange methods, which require heat exchange with electronic devices through air ducts (flow channels) and shell walls. There is a problem of large thermal resistance, resulting in low heat exchange efficiency. They are only suitable for products with fewer devices and limited application scenarios. For computing nodes with higher heat flux density, the heat dissipation capacity of air cooling and cold plate liquid cooling can no longer meet the requirements. Summary of the invention

[0004] In view of the defects of the prior art, the present application provides a reinforced immersion liquid-cooled computing node and computing equipment, aiming to solve the problem of effectively dissipating heat for computing nodes with high heat flux density.

[0005] The present application provides a reinforced immersion liquid-cooled computing node, which specifically includes a box body, wherein the inside of the box body is provided with a front panel cavity, an immersion cavity and a transfer cavity which are independent of each other in sequence from one end to the other end; the box body is provided with a liquid inlet connection port and a liquid outlet connection port, and the liquid inlet connection port is communicated with the immersion cavity; a flow pipe which is communicated with the immersion cavity is fixedly connected in the front panel cavity, and the liquid outlet end of the flow pipe is communicated with the liquid outlet connection port; a computing function module, wherein the computing function module can be detachably installed in the immersion cavity, and the immersion cavity is provided with cooling liquid; a liquid circulation device, wherein the outlet end of the liquid circulation device is connected with the liquid inlet connection port, and the inlet end of the liquid circulation device is connected with the liquid outlet connection port.

[0006] Through the above technical scheme conceived by the present application, compared with the prior art, since the cooling liquid in the immersion chamber in the present application can directly contact the computing function module, the convective thermal resistance between the cooling liquid and the heating surface of the computing function module is reduced, and a relatively high heat transfer coefficient is achieved. At the same time, the cooling liquid flows in the box body through the adapter cavity and the front panel cavity, which can achieve the beneficial effect of effectively realizing the overall heat dissipation of the computing node.

[0007] As a further preference, the liquid level of the coolant is not lower than the height of the computing function module.

[0008] By adopting the above technical solution, the computing function module is completely immersed in the cooling liquid. When the immersion liquid flows, it can take away the heat on the computing function module to achieve rapid cooling.

[0009] As further preferred, the computing function module divides the immersion chamber into a liquid inlet chamber and a liquid outlet chamber, the liquid inlet connection port is connected to the liquid inlet chamber, and the liquid inlet end of the circulation pipe is connected to the liquid outlet chamber.

[0010] By adopting the above technical solution, the cooling liquid flows from the liquid inlet side to the liquid outlet side, thereby achieving heat dissipation for the computing function module.

[0011] As a further preference, a back plate is fixedly connected to the bottom of the immersion chamber, a mounting groove for mounting the computing function module is provided on the back plate, and a plurality of guide holes connecting the liquid inlet chamber and the liquid outlet chamber are opened on the mounting groove.

[0012] By adopting the above technical solution, the coolant can pass through the guide holes to cool the computing function module and the installation slot, further improving the heat dissipation effect.

[0013] As a further preference, a heat dissipation structure with a plurality of heat sinks is fixedly connected to the computing function module, and the coolant can contact the heat sinks when passing through the guide holes.

[0014] By adopting the above technical solution, the heat sink can conduct and gather the heat of the computing function module, and then the heat on the heat sink can be dissipated through the flow of coolant in the guide holes, thereby improving the cooling efficiency.

[0015] As a further preference, the computing node also includes a liquid level sensor, and the liquid level sensor is installed in the immersion chamber.

[0016] By adopting the above technical solution, the height of the coolant in the immersion chamber can be monitored to avoid overflow caused by excessive coolant in the immersion chamber and poor cooling effect caused by insufficient coolant.

[0017] As further preferred, a mounting opening is provided on the box body, the mounting opening is communicated with the immersion chamber, an upper cover plate is detachably connected to the mounting opening, and a sealing ring is provided between the upper cover plate and the box body.

[0018] By adopting the above technical solution, the computing function module can be installed, disassembled and replaced after the upper cover is opened, and the sealing between the upper cover and the box body can be improved by the sealing ring to avoid leakage of coolant.

[0019] As a further preference, the coolant is a single-phase insulating heat-conducting liquid.

[0020] By adopting the above technical solution, the single-phase insulating thermal conductive liquid has good insulation, thermal conductivity, chemical stability, phase change stability, material compatibility and other characteristics, and can be used in electronic equipment cooling systems to achieve efficient heat dissipation.

[0021] A computing device provided in the present application includes the above-mentioned reinforced immersion liquid-cooled computing node, and also includes an indicator light, a debugging interface area, a filter, an external aviation socket, a liquid inlet connector and a liquid outlet connector, the indicator light and the debugging interface area are both fixedly installed at one end of the box body close to the front panel cavity, the filter is arranged in the adapter cavity, the external aviation socket is fixedly installed at one end of the box body close to the adapter cavity, the liquid inlet connector is fixedly installed at the liquid inlet connection port, and the liquid outlet connector is fixedly installed at the liquid outlet connection port.

[0022] As a further preference, the computing function module includes an integrated CPU computing module, a storage module, a network card module, a synchronization module, an intelligent computing module, a management module, and a power supply module.

[0023] By adopting the above technical solution, the computing efficiency of the computing device is improved and the computing function of the computing device is enhanced.

[0024] In general, the above technical solutions conceived by this application have the following technical advantages compared with the prior art: 1. In this application, the box adopts a three-chamber structure. The coolant in the immersion chamber can directly contact the computing function module, reducing the convection thermal resistance between the coolant and the heating surface of the computing function module, achieving a relatively high heat transfer coefficient. At the same time, the coolant flows in the box through the transfer chamber and the front panel chamber, effectively realizing the overall heat dissipation of the computing node.

[0025] 2. The coolant in the present application passes through the guide holes on the mounting slot to cool the computing function module and the mounting slot. At the same time, the heat sink on the computing function module can conduct and gather the heat. Then, the coolant flows through the guide holes to dissipate the heat on the heat sink, thereby improving the cooling efficiency.

[0026] 3. In the present application, the computing function module can be installed, removed and replaced by opening the upper cover plate, and the sealing ring can improve the sealing between the upper cover plate and the box body to prevent leakage of coolant. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of a reinforced immersion liquid-cooled computing node provided in an embodiment of the present application; Figure 2 It is a schematic diagram of the installation structure of the computing function module provided in the embodiment of the present application; Figure 3It is a schematic diagram of the side view structure of the box body provided in an embodiment of the present application.

[0028] Throughout the drawings, the same reference numerals are used to denote the same elements or structures, wherein: 1. Box body; 11. Front panel cavity; 12. Immersion cavity; 13. Adapter cavity; 14. Liquid inlet connection port; 15. Liquid outlet connection port; 16. Installation opening; 2. Computing function module; 21. Heat dissipation structure; 3. Flow duct; 4. Back panel; 41. Installation slot; 42. Diversion hole; 5. Upper cover; 6. Indicator light; 7. Debug interface area; 8. Filter; 9. External aviation socket; 101. Liquid inlet connector; 102. Liquid outlet connector. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] Reference Figure 1A reinforced immersion liquid-cooled computing node disclosed in the present application includes a box 1 with a rectangular structure and a computing function module 2 installed in the box 1. The box 1 is a 19-inch shelf-type structure with a height of 6U. The box 1 is a reinforced metal material structural frame with a compact structure and sufficient mechanical strength and rigidity. The inside of the box body 1 is provided with a front panel cavity 11, an immersion cavity 12 and a transfer cavity 13 which are independent of each other from one end to the other. The front panel cavity 11, the immersion cavity 12 and the transfer cavity 13 are separated by a partition. The computing function module 2 can be detachably installed in the immersion cavity 12. The immersion cavity 12 is filled with cooling liquid, which can directly contact the computing function module 2, thereby reducing the convection thermal resistance between the cooling liquid and the heating surface of the computing function module 2, achieving a relatively high heat transfer coefficient, and effectively achieving heat dissipation when the cooling liquid flows; a liquid inlet connection port 14 and a liquid outlet connection port 15 are provided at one end of the box body 1 close to the transfer cavity 13, the liquid inlet connection port 14 is connected to the immersion cavity 12, and the cooling liquid at the liquid inlet connection port 14 is evenly diverted into the immersion cavity 12 through a pipeline; the computing node also includes a liquid The circulation device can adopt a liquid circulation pump, the outlet end of the liquid circulation device is connected to the liquid inlet connection port 14, and the inlet end of the liquid circulation device is connected to the liquid outlet connection port 15; the cooling liquid is driven to flow by the liquid circulation device, so that the heat on the computing function module 2 is dissipated after the cooling liquid flows, and the computing node can also include a condenser to cool the circulating cooling liquid. When the cooling liquid flows, it passes through the adapter cavity 13, which can accelerate the cooling of the adapter cavity 13; a circulation pipe 3 is fixedly connected to the front panel cavity 11, and the circulation pipe 3 is connected to the immersion cavity 12 through multiple liquid inlet ends. The liquid outlet end of the circulation pipe 3 passes through the adapter cavity 13 from the bottom of the immersion cavity 12 and is connected to the liquid outlet connection port 15. The cooling liquid flows in the circulation pipe 3 to achieve cooling of the front panel cavity 11.

[0031] In this embodiment, the coolant is a single-phase insulating thermal conductive liquid. Specifically, the coolant is a fluorocarbon single-phase insulating thermal conductive liquid, which has good insulation, thermal conductivity, chemical stability, phase change stability, material compatibility and other characteristics, and can be applied to electronic equipment cooling systems to achieve efficient heat dissipation; the liquid level of the coolant is not lower than the height of the computing function module 2. The computing node also includes a liquid level sensor, which is fixedly installed in the immersion chamber 12. The liquid level sensor can monitor the height of the coolant in the immersion chamber 12 to avoid overflow caused by excessive coolant in the immersion chamber 12 and poor cooling effect caused by too little coolant.

[0032] Furthermore, an installation opening 16 is provided on the box body 1, and the installation opening 16 is connected to the immersion chamber 12. An upper cover plate 5 is detachably connected to the installation opening 16, and a sealing ring is provided between the upper cover plate 5 and the box body 1. After opening the upper cover plate 5, the computing function module 2 can be installed and replaced. The sealing ring can improve the sealing between the upper cover plate 5 and the box body 1 to prevent leakage of the coolant.

[0033] In order to realize the installation of the computing function module 2, the bottom of the immersion chamber 12 is fixedly connected with an ATCA, VPX hybrid bus high-speed backplane 4, and the backplane 4 is provided with a mounting slot 41 for mounting the computing function module 2. The mounting backplane can simultaneously realize the installation of the mounting slot 41. The computing function module 2 is inserted into the mounting slot 41 from the top downward perpendicularly to the front panel cavity 11 and the adapter cavity 13. The interconnection (electrical connection) between the computing function modules 2 is realized through the backplane. Figure 1 As shown, the computing function module 2 divides the immersion chamber 12 into a liquid inlet chamber a and a liquid outlet chamber b, the liquid inlet connection port 14 is connected to the liquid inlet chamber, the liquid inlet end of the circulation pipe 3 is connected to the liquid outlet chamber, and the cooling liquid flows from one side of the liquid inlet chamber to the other side of the liquid outlet chamber, thereby realizing heat dissipation of the computing function module 2; further, a plurality of guide holes 42 connecting the liquid inlet chamber and the liquid outlet chamber are provided on the mounting groove 41, and the cooling liquid can cool the computing function module 2 by passing through the guide holes 42, thereby improving the heat dissipation effect.

[0034] Furthermore, a heat dissipation structure 21 with a plurality of heat sinks is fixedly connected to the computing function module 2. The bottom of the computing function module 2 is plugged and adapted to the mounting slot 41. The heat sink can conduct and gather the heat of the computing function module 2. The coolant can fully contact the heat sink when passing through the guide hole 42. The coolant flows through the guide hole 42 to dissipate the heat on the heat sink. The heat sink can also be replaced with a heat dissipation fin.

[0035] The present application also discloses a computing device, including the above-mentioned reinforced immersion liquid-cooled computing node, and also including an indicator light 6, a debugging interface area 7, a filter 8, an external aviation socket 9, a liquid inlet connector 101 and a liquid outlet connector 102. The indicator light 6 and the debugging interface area 7 are both fixedly installed at one end of the box body 1 close to the front panel cavity 11 and connected to the computing function module 2. The indicator light 6 includes a power indicator light, a status indicator light (when it is lit, it indicates that the operation status of the whole machine is normal), an alarm indicator light (when it is lit, it indicates that the operation status of the whole machine is abnormal) and a liquid level indicator light; the debugging interface area 7 is provided with a USB debugging interface, a network debugging interface and a reset button. The debugging interface area 7 is installed with a cover plate and a conductive rubber strip is provided between the contact surface of the cover plate and the box body 1. Electromagnetic isolation is achieved by the cover plate to avoid electromagnetic leakage. The cover plate is fixedly connected to the box body 1 by riveted hand screws. The filter 8 is fixedly installed in the adapter cavity 13, and the AC input power is filtered by the filter 8 to improve the electromagnetic compatibility of the whole machine. The external aviation socket 9 is fixedly installed at one end of the box 1 close to the adapter cavity 13. The external aviation socket 9 uses an S6 metal rectangular frame connector. The external aviation socket 9 has external AC power input, network signals, optical fiber signals, etc. The AC power input is electrically connected to the filter 8 and the power module to be converted into a DC power supply to power the whole machine. A conductive rubber pad is arranged on the surrounding side of the external aviation socket 9. This type of connector supports optoelectronic mixing, and more targeted contacts can be selected according to different signal types; the selection of this type of connector converges the signals of traditional functional units scattered in various circular connectors, improves the signal density per unit area, and saves space for deploying connectors on the panel; and this type of connector can be plugged in and out with the box 1 to realize plug-in and pull-out operations, and both sides of the box 1 are fixedly connected with movable guide rails to realize movement, which simplifies the node maintenance operation link and improves the maintainability of the computing node. The liquid inlet connector 101 is fixedly installed at the liquid inlet connection port 14, and the liquid inlet connection port 14 is connected to the immersion chamber 12 through the liquid inlet connector 101. The liquid inlet connector 101 is located in the adapter chamber 13 as a whole, and the adapter chamber 13 can be cooled. The liquid outlet connector 102 is fixedly installed at the liquid outlet connection port 15, and the liquid outlet connector 102 is located in the adapter chamber 13 as a whole. The liquid outlet end of the circulation pipeline 3 is connected to the liquid outlet connection port 15 through the liquid outlet connector 102, and the adapter chamber 13 can be cooled further. A positioning pin is also provided at one end of the box body 1 close to the adapter chamber 13, and the positioning pin can ensure that the external aviation socket, the liquid inlet connector 101 and the liquid outlet connector 102 are accurately connected.

[0036] In this embodiment, the computing function module 2 includes an integrated CPU computing module, a storage module, a network card module, a synchronization module, an intelligent computing module, a management module, and a power supply module; wherein the CPU computing module is designed with a dual-channel 64-core processor (single CPU power consumption is not higher than 200W, main frequency 2.2-2.3GHz), which can convert, communicate, process and transmit data, and form external USB, VGA, Gigabit management network, 10 Gigabit network interface configuration, and access the computing data network by outputting 8 groups of 10 Gigabit networks to the outside; the storage module is a large-capacity, high-speed storage module (capacity is not less than 16TB, bandwidth is not less than 4GB / s), the storage module is interconnected with the CPU computing module through PCIe3.0x8, supports use as a cache, and also supports use as hot data computing; the network card module is used to provide 2 10 Gigabit interfaces to the outside, supports dual redundant configuration, supports PTP protocol, supports us-level high-precision time synchronization, and accesses the business network; The step module can support multiple timing modes and has us-level timing function; through the intelligent computing module, the computing node reserves sufficient channel resources (PCIe3.0x16) to expand the intelligent computing card. While providing low-latency and high-performance computing, it can provide heterogeneous computing and intelligent acceleration functions according to different application scenarios to support the subsequent communication needs of big data and artificial intelligence; the management module integrates unit-level ShMC, supports IPMI intelligent management, and coordinates the management chips of various functional modules and various sensors (liquid level sensors, temperature sensors, etc.) and response devices (indicator lights 6, etc.) inside the unit to build an out-of-band centralized management system. It has management functions such as information collection, status monitoring, fault detection and alarm, remote KVM, firmware online update, liquid-cooled CDU communication, etc., which greatly improves the reliability and availability of the system; there are two power modules, and the two power modules form a centralized redundant power supply to avoid the normal operation of the whole machine after one of the power supplies fails.

[0037] It should be understood that expressions such as "include" and "may include" used in this application indicate the existence of the disclosed functions, operations or constituent elements, and do not limit one or more additional functions, operations and constituent elements. In this application, terms such as "include" and / or "have" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components or combinations thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components or combinations thereof.

[0038] It should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0041] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A reinforced immersion liquid-cooled computing node, characterized in that: include A box body (1), wherein the box body (1) is provided with mutually independent front panel chamber (11), immersion chamber (12) and transfer chamber (13) in sequence from one end to the other end; the box body (1) is provided with a liquid inlet connection port (14) and a liquid outlet connection port (15), the liquid inlet connection port (14) being in communication with the immersion chamber (12); a flow pipe (3) in communication with the immersion chamber (12) is fixedly connected in the front panel chamber (11), the liquid outlet end of the flow pipe (3) being in communication with the liquid outlet connection port (15); A computing function module (2), the computing function module (2) being detachably mounted in the immersion chamber (12), wherein a cooling liquid is provided in the immersion chamber (12); A liquid circulation device, wherein the outlet end of the liquid circulation device is connected to a liquid inlet connection port (14), and the inlet end of the liquid circulation device is connected to a liquid outlet connection port (15).

2. A reinforced immersion liquid-cooled computing node according to claim 1, characterized in that: The liquid level of the cooling liquid is not lower than the height of the computing function module (2).

3. A reinforced immersion liquid-cooled computing node according to claim 1, characterized in that: The computing function module (2) divides the immersion chamber (12) into a liquid inlet chamber and a liquid outlet chamber, the liquid inlet connection port (14) is in communication with the liquid inlet chamber, and the liquid inlet end of the circulation pipe (3) is in communication with the liquid outlet chamber.

4. A reinforced immersion liquid-cooled computing node as claimed in claim 3, characterized in that: The bottom of the immersion chamber (12) is fixedly connected to a back plate (4), the back plate (4) is provided with a mounting groove (41) for mounting the computing function module (2), and the mounting groove (41) is provided with a plurality of guide holes (42) connecting the liquid inlet chamber and the liquid outlet chamber.

5. A reinforced immersion liquid-cooled computing node as claimed in claim 4, characterized in that: A heat dissipation structure (21) with a plurality of heat dissipation fins is fixedly connected to the computing function module (2), and the coolant can fully contact the heat dissipation fins when passing through the guide holes (42).

6. A reinforced immersion liquid-cooled computing node according to claim 2, characterized in that: The computing node also includes a liquid level sensor, which is installed in the immersion chamber (12).

7. A reinforced immersion liquid-cooled computing node according to any one of claims 1 to 6, characterized in that: The box body (1) is provided with a mounting opening (16), the mounting opening (16) being in communication with the immersion chamber (12), an upper cover plate (5) being detachably connected to the mounting opening (16), and a sealing ring being provided between the upper cover plate (5) and the box body (1).

8. The reinforced immersion liquid-cooled computing node according to claim 1, characterized in that: The coolant is a single-phase insulating heat-conducting liquid.

9. A computing device, comprising the reinforced immersion liquid-cooled computing node according to any one of claims 1 to 8, characterized in that: The invention also comprises an indicator light (6), a debugging interface area (7), a filter (8), an external aviation socket (9), a liquid inlet connector (101) and a liquid outlet connector (102); the indicator light (6) and the debugging interface area (7) are both fixedly mounted on one end of the box body (1) close to the front panel cavity (11); the filter (8) is arranged in the adapter cavity (13); the external aviation socket (9) is fixedly mounted on one end of the box body (1) close to the adapter cavity (13); the liquid inlet connector (101) is fixedly mounted on the liquid inlet connection port (14); and the liquid outlet connector (102) is fixedly mounted on the liquid outlet connection port (15).

10. The computing device of claim 9, wherein: The computing function module (2) comprises an integrated CPU computing module, a storage module, a network card module, a synchronization module, an intelligent computing module, a management module, and a power supply module.

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