Texturing device for preparing back contact battery

Abstract

The invention discloses a texturing device for preparing a back contact battery. The texturing device comprises a texturing groove; the bearing and conveying assembly comprises a bearing and conveying unit, and the bearing and conveying unit comprises a bearing and conveying disc; the driving assembly comprises a driving unit and a transmission unit, the transmission unit comprises a transmission shaft, the transmission shaft is connected with transmission discs, the adjacent transmission discs are connected through connecting rods, and the driving unit is in transmission connection with the transmission discs; the turbulent flow assembly comprises a turbulent flow unit, and the turbulent flow unit comprises a turbulent flow plate. According to the texturing device for preparing the back contact battery, the bearing transmission disc is driven to rotate through the driving assembly, the contact surface is reduced, silicon wafer transmission is achieved, meanwhile, the contact position of a silicon wafer and the bearing transmission disc is changed, and therefore imprint on the back face of the silicon wafer can be reduced; when the driving assembly operates, the spoiler is driven to rotate to promote the flowing of the reaction liquid and the contact reaction with the silicon wafer, so that the texturing quality is improved on the basis of reducing driving sources, simplifying the structure and reducing the energy consumption.

Description

Technical Field

[0001] The invention relates to the technical field of solar cell production, and in particular to a texturing device for preparing a back contact cell. Background Art

[0002] In the production process of back-contact cells, double-sided texturing is an important step. The surface of the silicon wafer is processed by reaction liquid to increase its roughness, thereby guiding light to reflect and refract on the surface of the silicon wafer and improving the photoelectric conversion efficiency of the silicon wafer. The rougher the surface of the silicon wafer, the larger its surface area and the stronger its ability to absorb light.

[0003] In the prior art, for example, Chinese utility model patent No. CN213716924U discloses a texturing tank device for high-efficiency battery cell production. The device drives the reaction liquid to circulate in the tank body through an infusion device, thereby extending the service life of the reaction liquid and reducing the frequency of replacing the reaction liquid. The generated water flow is used to impact the lower surface of the silicon wafer to blow away the attached bubbles, so as to promote the contact between the reaction liquid and the silicon wafer and reduce roller marks, thereby helping to improve the uniformity of the morphology of the back of the silicon wafer and improve the texturing quality.

[0004] However, although the above-mentioned device can promote the contact between the reaction liquid and the silicon wafer, since the lower rollers are distributed side by side in the trough body, the contact position between the lower roller and the bottom surface of the silicon wafer is fixed, so that the bottom surface of the silicon wafer still has residual imprints, and the device mainly relies on the infusion device to drive the reaction liquid to flow continuously. Therefore, the device needs to be provided with a driving source for driving the movement of the silicon wafer and a driving source for driving the reaction liquid to flow, resulting in a complex structure of the device and increased costs. During operation, the reaction liquid is extracted from the bottom and flows upward, impacting the bottom surface of the silicon wafer, which increases energy consumption and reduces the friction between the silicon wafer and the lower roller, thereby affecting the stable transmission and movement of the silicon wafer; although an upper roller is arranged above the lower roller, the position of the upper roller is fixed, resulting in a fixed gap width between the upper roller and the lower roller, which is only suitable for passing silicon wafers of a single thickness.

[0005] Therefore, it is necessary to improve the cell texturing device in the prior art. Summary of the invention

[0006] The purpose of the present invention is to overcome the defects existing in the prior art and provide a texturing device for preparing back contact batteries which reduces the number of driving sources to simplify the structure, reduce energy consumption, ensure stable transmission of silicon wafers and is suitable for processing silicon wafers of different thicknesses.

[0007] In order to achieve the above technical effects, the technical solution of the present invention is: a texturing device for preparing a back contact battery, comprising: A texturing groove, wherein the groove opening of the texturing groove faces upward; A load-bearing transmission component, the load-bearing transmission component includes load-bearing transmission units distributed along the length direction of the texturing groove, the load-bearing transmission unit includes a load-bearing transmission disk whose axis extends in parallel with the width direction of the texturing groove and rotates around its own axis in the texturing groove, the load-bearing transmission disks of two adjacent load-bearing transmission units cooperate with each other to horizontally support the silicon wafer, and a line connecting the centers of the load-bearing transmission disks forms an angle with the length direction of the texturing groove; A driving assembly, the driving assembly includes a driving unit and a transmission unit, the transmission unit includes a transmission shaft, the transmission shaft is fixedly connected to the load-bearing transmission disk coaxially, the end of the transmission shaft is connected to the transmission disk coaxially, the adjacent transmission disks are connected to each other through a connecting rod, and the driving unit is connected to one of the transmission disks; A spoiler assembly, wherein the spoiler assembly includes a spoiler unit connected to the transmission shaft in a one-to-one correspondence, the spoiler unit includes a spoiler plate fixedly connected to the transmission shaft, and the spoiler plate is located on the inner side of the cylindrical surface where the circumferential outer edge of the load-bearing transmission plate is located.

[0008] Preferably, in order to achieve stable transmission of silicon wafers, it also includes an upper pressure assembly arranged directly above the carrying and transmission assembly, and the upper pressure assembly includes an upper pressure sleeve rotating around its own axis on the texturing groove, and a transmission gap is arranged between the horizontal plane where the bottom of the upper pressure sleeve is located and the horizontal plane where the top of the carrying and transmission plate is located.

[0009] Preferably, in order to facilitate the stable transmission of silicon wafers of different thicknesses, the upper pressure assembly further includes an adjustment unit, which is used to adjust the height of the upper pressure sleeve so that the width of the transmission gap is consistent with the thickness of the silicon wafer.

[0010] Preferably, in order to adjust the thickness of the transmission gap, the upper pressure sleeve includes a hollow floating sleeve, an upper pressure shaft is passed through the inner side of the upper pressure sleeve, and the adjustment unit includes a lifting unit, the output end of the lifting unit is connected to a limiting frame, and the limiting frame abuts against the top of the upper pressure shaft.

[0011] Preferably, in order to improve the texturing efficiency, at least two carrying and transmission components are provided and distributed along the width direction of the texturing groove. A partition is also fixed in the texturing groove. The length direction of the partition is consistent with the length direction of the texturing groove. The partition is distributed at intervals along the width direction of the texturing groove, and each carrying and transmission component is sequentially arranged between two adjacent partitions.

[0012] Preferably, in order to reduce the imprint on the surface of the silicon wafer, the circumferential outer edge of the upper pressing sleeve is provided with concave and convex parts distributed or extending along a spiral track, and the spiral track is coaxial with the upper pressing sleeve.

[0013] Preferably, in order to facilitate the stable transmission of silicon wafers, the concave-convex parts extend along a spiral trajectory, the concave-convex parts are arranged in pairs along the axial direction of the upper pressure sleeve and are distributed in a mirror-symmetrical manner, and the mirror-symmetrical distribution surface of the concave-convex parts is a vertical plane.

[0014] Preferably, in order to reduce the wear of the silicon wafer, the floating sleeve is rigid, and the upper pressure sleeve further includes a sponge sleeve fixedly sleeved outside the floating sleeve 711 .

[0015] Preferably, in order to further promote the full contact reaction between the reaction liquid and the silicon wafer, a pressing frame is further included, and the driving unit is drivingly connected to the pressing frame to squeeze the texturing liquid absorbed by the sponge cover.

[0016] Preferably, in order to further promote the flow of the reaction liquid, the pressure frame includes a pressure frame abutting against the top of the sponge sleeve and a pressure frame vertically arranged and fixedly connected to the pressure frame, the driving unit includes a driving motor, the output end of the driving motor is coaxially connected to a driving shaft passing through the inner side of the pressure frame, and the circumferential outer edge of the driving shaft is provided with an eccentric protrusion located on the inner side of the pressure frame.

[0017] To summarize, compared with the prior art, the texturing device for preparing back-contact batteries of the present invention drives the carrying transmission disk to rotate through the driving component, thereby reducing the contact surface and realizing the transmission of silicon wafers, while changing the contact position between the silicon wafer and the carrying transmission disk, thereby reducing the imprint on the back of the silicon wafer. In addition, while the driving component is running, it also drives the spoiler to rotate to promote the flow of the reaction liquid and the contact reaction with the silicon wafer, thereby improving the texturing quality on the basis of reducing the driving source, simplifying the structure and reducing energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of the first embodiment; Figure 2 yes Figure 1 A top view of Figure 3 yes Figure 1 A partial structural diagram of Figure 4 yes Figure 3 Explosion diagram of Figure 5 yes Figure 4 A magnified view of part A; Figure 6 yes Figure 3 A partial structural diagram of Figure 7 is a schematic structural diagram of a second embodiment; Figure 8 yes Figure 7 A top view of Fig. 9 yes Figure 7 A partial structural diagram of Fig.10 yes Fig. 9 A front view of Fig.11 yes Fig. 9 Explosion diagram of Fig.12 yes Fig.11 A magnified view of part B; Fig.13 yes Fig. 9 A schematic cross-sectional structure diagram of ; Fig.14 This is a schematic diagram of the structure of the third embodiment in which the velvet making tank is omitted; Fig.15 is a schematic diagram of the connection structure between the upper pressing shaft and the upper pressing sleeve of the third embodiment; Fig.16 yes Fig.15 Explosion diagram of Fig.17 is a schematic structural diagram of the fourth embodiment in which the texturing tank is omitted; Fig.18 yes Fig.17 The structural diagram of the load-bearing transmission component is omitted; Fig.19 yes Fig.18 A top view of Fig. 20 yes Fig.18 Enlarged view of part C; Fig.21 yes Fig.18 Explosion diagram of Fig. 22 yes Fig.21 A magnified view of the D portion; In the figure: 1. Velvet groove; 11. Partition; 111. Strip hole; 12. Drain pipe; 13. Drain valve; 2. Load-bearing transmission component; 21. Load-bearing transmission disk; 3. Silicon wafer; 4. Driving unit; 41. Driving motor; 42. Driving shaft; 421. Eccentric protrusion; 43. Active disk; 431. Active convex piece; 44. Driven ring; 441. Driven convex piece; 45. Bushing; 5. Transmission unit; 51. Transmission shaft; 52. Transmission disk; 53. Connecting rod; 6. Spoiler component; 61. Spoiler unit; 611. Spoiler; 6111. Spoiler flow hole; 612. Fixed tube; 613. Connecting rod; 7. Upper pressure component; 71. Upper pressure sleeve; 711. Floating sleeve; 712. Sponge sleeve; 72. Adjusting unit; 721. Lifting unit; 7211. Lifting motor; 7212. Screw; 7213. Screw sleeve; 722. Limiting frame; 723. Guide rod; 73. Upper pressure shaft; 731. Limiting convex ring; 732. Rolling sleeve; 74. Concave and convex part; 75. Bracket; 751. Guide sleeve; 76. Distance sensor; 8. Pressing frame; 81. Pressure frame; 811. Sliding frame; 82. Pressure frame; 821. Guide arm; 8211. Guide hole; 83. Pressure plate; 831. Water-permeable hole. DETAILED DESCRIPTION

[0019] The specific implementation of the present invention is further described below in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0020] First embodiment

[0021] like Figure 1-Figure 6 As shown, the texturing device for preparing a back contact battery according to the first embodiment of the present invention comprises: A texturing tank 1, wherein the notch of the texturing tank 1 faces upward; The load-carrying transmission component 2 includes load-carrying transmission units distributed along the length direction of the texturing tank 1, and the load-carrying transmission unit includes a load-carrying transmission disk 21 whose axis extends in parallel with the width direction of the texturing tank 1 and rotates around its own axis in the texturing tank 1, and the load-carrying transmission disks 21 of two adjacent load-carrying transmission units cooperate with each other to horizontally support the silicon wafer 3, and the line between the centers of the load-carrying transmission disks 21 forms an angle with the length direction of the texturing tank 1; The drive assembly includes a drive unit 4 and a transmission unit 5. The transmission unit 5 includes a transmission shaft 51. The transmission shaft 51 is fixedly connected to the load-bearing transmission disk 21 coaxially. The end of the transmission shaft 51 is connected to a transmission disk 52 coaxially. Adjacent transmission disks 52 are connected to each other through a connecting rod 53. The drive unit 4 is connected to one of the transmission disks 52 through a transmission connection. The spoiler assembly 6 includes a spoiler unit 61 connected to the transmission shaft 51 in a one-to-one correspondence. The spoiler unit 61 includes a spoiler plate 611 fixedly connected to the transmission shaft 51. The spoiler plate 611 is located on the inner side of the cylindrical surface where the circumferential outer edge of the carrying transmission disk 21 is located.

[0022] The texturing tank 1 of this embodiment is in the shape of a rectangular parallelepiped as a whole, with both ends closed and the top open. The bottom of the texturing tank 1 is fixedly connected with a drain pipe 12, and the drain pipe 12 is connected with a drain valve 13 to facilitate the discharge of the reaction liquid. When the device is used, the reaction liquid is loaded into the texturing tank 1 so that the reaction liquid is over the top of the carrying transmission disk 21, and the silicon wafer 3 to be texturized is placed flat at one end of the texturing tank 1, and supported by the carrying transmission disk 21 in the carrying transmission component 2, and then the driving unit 4 is operated to drive the transmission shaft 51 in the transmission unit 5 to rotate, so that the carrying transmission disk 21 fixedly connected to the coaxial center line of the transmission shaft 51 rotates at the same speed, driving the silicon wafer 3 to move along the length direction of the texturing tank 1. During the movement, it contacts with the reaction liquid, so that the reaction texturing is performed on both sides of the silicon wafer 3. When the silicon wafer 3 moves to the other end of the texturing tank 1, the silicon wafer 3 after texturing is taken out by a manipulator, a suction cup and other devices.

[0023] During the movement of the silicon wafer 3 in the texturing tank 1, the silicon wafer 3 contacts the bottom surface of the silicon wafer 3 through the carrying and transmission disk 21, and while carrying the silicon wafer 3, the silicon wafer 3 is driven to move through its own rotation. Since there is an angle between the connecting line between the centers of the carrying and transmission disks 21 in adjacent carrying and transmission units and the length direction of the texturing tank 1, when the silicon wafer 3 contacts different carrying and transmission disks 21, the contact position of the bottom surface of the silicon wafer 3 is different, thereby avoiding the bottom surface of the silicon wafer 3 being easily marked due to the fixed contact position during the long texturing process. That is, by changing the contact position of the silicon wafer 3 with different carrying and transmission disks 21, the mark on the silicon wafer 3 is reduced, which facilitates the contact of different positions with the reaction liquid and improves the texturing quality.

[0024] Moreover, during the texturing process, after the driving unit 4 drives the transmission shaft 51 to rotate, the spoiler 611 fixed on the transmission shaft 51 is also rotated. During the rotation of the spoiler 611 with the axis of the transmission shaft 51 as the center line, the reaction liquid is driven to flow, and the reaction substances in the reaction liquid are promoted to be evenly distributed in the solvent, so that the reaction liquid is evenly distributed, the reaction liquid replacement cycle is extended, and the reaction liquid replacement frequency is reduced, thereby reducing the cost. In addition, since the spoiler 611 is located on the inner side of the cylindrical surface where the circumferential outer edge of the carrying transmission disk 21 is located, the spoiler 611 is prevented from contacting the silicon wafer 3 during rotation, thereby affecting the transmission and movement of the silicon wafer 3. In addition, when the spoiler 611 rotates upward, the generated water flow also acts on the bottom surface of the silicon wafer 3, driving away the bubbles attached to the bottom surface of the silicon wafer 3 during texturing, so that the reaction liquid can fully contact the bottom surface of the silicon wafer 3, thereby improving the texturing quality.

[0025] like Figure 2 As shown, in this embodiment, the spoilers 611 are arranged in a rectangular array in the texturing tank 1, and the number of spoilers 611 is consistent with the number of transmission shafts 51. In the spoiler unit 61, four spoilers 611 are arranged at intervals along the axial direction of the transmission shaft 51. The specific structure of the spoilers 611 can be referred to Figure 5 Specifically, a fixed tube 612 is provided on the outer fixed sleeve of the transmission shaft 51, and both sides of the fixed tube 612 are fixedly connected to the spoiler 611 through two connecting rods 613. The spoiler 611 is also provided with a rectangular array of spoiler flow holes 6111 extending along its thickness direction to reduce the power consumption when driving the spoiler 611 to rotate, and the spoiler flow holes 6111 are further used to store the uniform flow distribution of the reactants in the reaction liquid.

[0026] Since the sources for controlling the rotation of the carrying transmission plate 21 and the spoiler 611 are both derived from the transmission shaft 51 controlled by the driving unit 4, that is, the sources for controlling the movement of the silicon wafer 3 and promoting the flow of the reaction liquid are both derived from the driving unit 4, the number of driving sources can be reduced, and the structure of the driving device part can be simplified, thereby reducing costs. When the reaction liquid flows, it is mainly achieved by the rotation of the spoiler 611 in the upper part of the texturing tank 1, reducing the height difference of the flow path of the reaction liquid, thereby reducing power consumption.

[0027] Furthermore, in order to improve the efficiency of texturing, in the present embodiment, at least two (three in the present embodiment, of course, according to the width dimension of the texturing groove 1, the number of the carrying and transmission components 2 can also be other multiple) bearing and transmission components 2 are provided, and the bearing and transmission components 2 are distributed along the width direction of the texturing groove 1. A partition 11 is also fixed in the texturing groove 1. The length direction of the partition 11 is consistent with the length direction of the texturing groove 1. The partition 11 is distributed at intervals along the width direction of the texturing groove 1, and each bearing and transmission component 2 is sequentially arranged between two adjacent partitions 11.

[0028] Specifically, Figure 3-Figure 6 As shown, four partitions 11 are provided, and the two ends of the partitions 11 are fixedly connected to the two ends of the texturing tank 1, the top of the partition 11 is higher than the top of the carrying transmission plate 21, and the bottom of the partition 11 is provided with a rotating through hole for the transmission shaft 51 to pass through in a sealed manner. The partitions 11 and the carrying transmission components 2 are distributed in sequence at intervals, and adjacent partitions 11 can be combined to form a limiting channel to avoid excessive displacement of the silicon wafer 3 in the width direction of the texturing tank 1 during transmission. The silicon wafer 3 moves between the two partitions 11 along the length direction of the texturing tank 1 to achieve a limiting effect.

[0029] In order to drive each carrying transmission plate 21 to rotate at the same speed, Figure 1-Figure 4As shown, the driving unit 4 of this embodiment includes a driving motor 41, a sleeve 45, a driving shaft 42, two active disks 43 and two driven rings 44, wherein the driving motor 41 and the sleeve 45 are respectively fixed above the two sides of the texturing groove 1, the axial direction of the driving shaft 42 is consistent with the width direction of the texturing groove 1, one end of the driving shaft 42 is fixedly connected to the output end of the driving motor 41 coaxially, and the other end is rotatably arranged in the sleeve 45 with the axis of the driving shaft 42 as the center line, the driving shaft 42 is fixedly passed through the two active disks 43 coaxially, and the circumferential outer edge of the active disk 43 is distributed with a main The active protrusion 431 and the driven ring 44 are fixedly mounted on one of the transmission disks 52, and the driven ring 44 has driven protrusions 441 distributed in a circular array on the circumferential outer edge. The driven ring 44 is located directly below the active disk 43, and the rotation path of the active protrusion 431 intersects with the rotation path of the driven protrusion 441, and the three active protrusions 431 rotated to the bottom and the three driven protrusions 441 rotated to the top are distributed in sequence; in the transmission unit 5, the transmission disk 52 rotates around its own axis on the side of the partition 11 facing away from the load-bearing transmission component 2, and adjacent transmission disks 52 are hinged by connecting rods 53.

[0030] After adopting the above structure, the driving motor 41 is started, driving the driving shaft 42 to stably rotate around its own axis under the support of the sleeve 45, so that while the active disk 43 rotates, the active protrusion 431 on the circumferential outer edge of the active disk 43 rotates, acting on the driven protrusion 441 on the lower driven ring 44, pushing the driven protrusion 441 to rotate, so that while the driven ring 44 rotates around its own axis, the transmission disk 52 fixed on the inner side of the driven ring 44 rotates, and the transmission disk 52 acts on the adjacent transmission disk 52 through the connecting rod 53, so that each transmission disk 52 rotates at the same speed, thereby driving each transmission shaft 51 to rotate, so that the load-bearing transmission disk 21 and the spoiler 611 fixed on the transmission shaft 51 rotate at the same speed, driving the silicon wafer 3 to move in the texturing tank 1, while promoting the flow of the reaction liquid, so as to promote the contact reaction between the reaction liquid and the silicon wafer 3, and improve the texturing quality.

[0031] Second embodiment

[0032] like Figure 7-Figure 13 As shown, the texturing device for preparing back-contact batteries according to the second embodiment of the present invention is based on the first embodiment, but differs in that it further includes an upper pressing component 7 arranged directly above the carrying and transmitting component 2, and the upper pressing component 7 includes an upper pressing sleeve 71 rotating around its own axis on the texturing groove 1, and a transmission gap is arranged between the horizontal plane where the bottom of the upper pressing sleeve 71 is located and the horizontal plane where the top of the carrying and transmitting disk 21 is located.

[0033] By setting up the upper pressure component 7 and utilizing the transmission gap formed between the horizontal plane where the bottom of the upper pressure sleeve 71 of the upper pressure component 7 is located and the horizontal plane where the top of the carrying transmission disk 21 is located, it is prevented that during the transmission process, the silicon wafer 3 is prevented from moving upward and leaving the carrying transmission disk 21 due to the buoyancy and water flow force, thereby affecting the stable transmission. That is, the height position of the silicon wafer 3 is limited by the upper pressure sleeve 71, so that the bottom surface of the silicon wafer 3 is always in contact with the top of the carrying transmission disk 21, so as to ensure that after the carrying transmission disk 21 rotates, it can drive the silicon wafer 3 to move smoothly.

[0034] In order to ensure that the upper pressure sleeve 71 can generate sufficient buoyancy, the upper pressure sleeve 71 is a hollow structure. Fig.13 shown.

[0035] A further improvement is that the upper pressing assembly 7 further comprises an adjusting unit 72 , and the adjusting unit 72 is used to adjust the height of the upper pressing sleeve 71 so that the width of the transmission gap is consistent with the thickness of the silicon wafer 3 .

[0036] After adopting the above-mentioned improvement, by setting the adjustment unit 72, the height position of the upper pressure sleeve 71 can be adjusted, and the transmission gap between the upper pressure sleeve 71 and the carrying transmission plate 21 can be changed to match the thickness of the silicon wafer 3, thereby avoiding the transmission gap being too narrow, resulting in excessive pressure that easily causes the silicon wafer 3 to rupture and damage, and avoiding the transmission gap being too wide, resulting in insufficient pressure between the carrying transmission plate 21 and the silicon wafer 3 to ensure stable transmission of the silicon wafer 3.

[0037] In order to achieve flexible adjustment of the transmission gap, in this embodiment, the upper pressure sleeve 71 includes a hollow floating sleeve 711, an upper pressure shaft 73 is passed through the inner side of the upper pressure sleeve 71, and the adjustment unit 72 includes a lifting unit 721. The output end of the lifting unit 721 is connected to a limiting frame 722, and the limiting frame 722 abuts against the upper side of the upper pressure shaft 73.

[0038] After adopting the above structure, the buoyancy of the floating sleeve 711 itself is used to generate a tendency for the upper pressure shaft 73 to move upward, and the limiting frame 722 is driven to move up and down through the lifting unit 721 to adjust the height of the limiting frame 722. Since the limiting frame 722 is in contact with the top of the upper pressure shaft 73, the height position of the upper pressure shaft 73 can be controlled, thereby changing the height position of the floating sleeve 711.

[0039] In this embodiment, the upper pressing assembly 7 further includes two inverted U-shaped brackets 75 distributed along the length direction of the texturing tank 1, and the two ends of the brackets 75 are fixed above the texturing tank 1; the lifting unit 721 is arranged on one of the brackets 75, and the other bracket 75 is provided with a distance sensor 76 downward and toward the limit frame 722. In this way, the distance sensor 76 detects the distance between it and the limit frame 722, and the lifting unit 721 drives the limit frame 722 to move up and down, thereby controlling the height position of the upper pressing sleeve 71 and the upper pressing shaft 73.

[0040] To be more specific, the limit frame 722 is a horizontal rectangular frame, and guide rods 723 extending upward in the vertical direction are arranged at the four corners of the limit frame 722. Guide sleeves 751 extending in the vertical direction are arranged on both sides of the top of the bracket 75, and the guide rods 723 and the guide sleeves 751 are slidably matched; the lifting unit 721 includes a lifting motor 7211, a screw rod 7212 and a screw sleeve 7213. The lifting motor 7211 is fixed to the top of the bracket 75 and is arranged downward, and the output end is fixedly connected with the screw rod 7212 coaxially, and the screw sleeve 7213 is threadedly matched with the screw rod 7212 and fixed to the top of the limit frame 722; The partition 11 is provided with a strip hole 111 extending in the vertical direction. The strip hole 111 is a through hole. A rolling sleeve 732 that fits the vertical inner wall thereof is rolled on the inner side of the strip hole 111. The upper pressure shaft 73 is passed through the inside of the rolling sleeve 732 and is rotatably connected with the rolling sleeve 732. The upper pressure shaft 73 is also provided with a limiting convex ring 731 distributed along its axial direction. The limiting convex ring 731 and the floating sleeve 711 are distributed in sequence at intervals. The upper pressure shaft 73 is sealed and passed through the inner side of the floating sleeve 711, so that the floating sleeve 711 can rotate on the upper pressure shaft 73 around its own axis and the range of movement is limited between the two limiting convex rings 731 at its two ends.

[0041] After adopting the above structure, when adjusting the height position of the upper pressure sleeve 71, the lifting motor 7211 is started, driving the screw 7212 to rotate around its own axis while acting on the screw sleeve 7213, and guiding the limit frame 722 to move smoothly in the vertical direction through the slidingly matched guide rod 723 and guide sleeve 751, thereby changing the height position of the upper pressure shaft 73 and the upper pressure sleeve 71, and rolling the rolling sleeve 732 rotatably connected to the upper pressure shaft 73 on the inner side of the strip hole 111, thereby reducing the friction force on the upper pressure shaft 73 and the floating sleeve 711 when moving, and ensuring that the axis of the upper pressure shaft 73 can move smoothly in the vertical direction.

[0042] A further improvement is that the circumferential outer edge of the upper pressing sleeve 71 is provided with concave and convex parts 74 distributed or extending along a spiral track, and the spiral track is coaxial with the upper pressing sleeve 71 .

[0043] Specifically, the circumferential outer edge of the upper pressure sleeve 71 is further provided with concave-convex parts 74 distributed along a spiral track, and the concave-convex parts 74 are hemispherical.

[0044] After adopting the above structure, during the movement of the silicon wafer 3, the concave-convex part 74 contacts the top surface of the silicon wafer 3, so that there is a gap between the circumferential outer edge of the upper pressure sleeve 71 and the top surface of the silicon wafer 3, which facilitates the reaction liquid to flow and contact with the top surface of the silicon wafer 3 to react and make texture. Since the concave-convex part 74 is hemispherical, the contact area is reduced. In addition, the concave-convex part 74 is distributed on the upper pressure sleeve 71 along a spiral trajectory, which can ensure that as the upper pressure sleeve 71 rotates, the contact between the top surface of the silicon wafer 3 and the concave-convex part 74 changes, thereby reducing the mark formed on the top surface of the silicon wafer 3 during the texture, and ensuring the texture quality. It should be noted that the concave-convex part 74 can be a depression or a groove, so that when the upper pressure sleeve 71 contacts the top surface of the silicon wafer 3, the reaction liquid can enter the depression or groove and contact and react with the top surface of the silicon wafer 3, and as the silicon wafer 3 moves, the contact reaction position changes, ensuring the uniformity of the texture of the top surface of the silicon wafer 3 and improving the texture quality.

[0045] Third embodiment

[0046] like Figure 14-16 As shown, the texturing device for preparing back-contact batteries according to the third embodiment of the present invention is based on the second embodiment, with the difference that the concave-convex parts 74 extend along a spiral trajectory, the concave-convex parts 74 are arranged in pairs along the axial direction of the upper pressing sleeve 71 and are distributed in a mirror-symmetrical manner, and the mirror-symmetrical distribution surface of the concave-convex parts 74 is a vertical plane.

[0047] After the concave-convex part 74 extends along the spiral trajectory, a spiral strip structure is formed, which ensures that the concave-convex part 74 can always act on the top surface of the silicon wafer 3, press down the silicon wafer 3, and ensure the stable transmission of the silicon wafer 3. After the spiral strip-shaped concave-convex part 74 rotates with the upper pressure sleeve 71, it can change the contact position with the top surface of the silicon wafer 3, so as to avoid a certain position on the top surface of the silicon wafer 3 being in contact with the concave-convex part 74 for a long time and insufficient contact with the reaction liquid, thereby producing an imprint. In this way, the texturing quality of the top surface of the silicon wafer 3 is guaranteed. In addition, since the concave-convex part 74 is symmetrically arranged, during the rotation process, the spiral strip-shaped and symmetrically distributed concave-convex parts 74 can offset each other's force on the silicon wafer 3 in the width direction of the texturing groove 1, ensure that the silicon wafer 3 moves along the length direction of the texturing groove 1, reduce the contact friction between the edge of the silicon wafer 3 and the partition 11, and further improve the transmission texturing quality.

[0048] A further improvement is that the floating sleeve 711 is rigid, and the upper pressure sleeve 71 further includes a sponge sleeve 712 fixedly sleeved outside the floating sleeve 711 .

[0049] Specifically, the floating sleeve 711 is preferably made of corrosion-resistant and lightweight plastic, such as polypropylene (PP), polycarbonate (PC) or polyester (PET). The above materials are not only light in weight and can generate sufficient buoyancy when immersed in the reaction liquid, but also corrosion-resistant, have a certain structural strength, and are not easy to deform; the sponge sleeve 712 is fixedly sleeved outside the floating sleeve 711, and the concave-convex part 74 is arranged on the circumferential outer edge of the sponge sleeve 712.

[0050] After adopting the above structure, the floating sleeve 711 can be used to roughly shape the sponge sleeve 712, and the concave and convex parts 74 on the outer periphery of the sponge sleeve 712 are in contact with the top surface of the silicon wafer 3. Since the sponge sleeve 712 is made of elastic and soft material, it can prevent the silicon wafer 3 from being worn due to rigid contact. In addition, the sponge sleeve 712 can automatically adapt through its own extrusion deformation, adjust the width of the transmission gap, and reduce the precision requirements of the lifting unit 721 on the height control of the limit frame 722.

[0051] Specifically, the floating sleeve 711 is a hollow structure, the sealing sleeve is arranged on the upper pressure shaft 73 and the two ends are respectively sealed with two limiting convex rings 731 to ensure that the floating sleeve 711 can rotate stably in a fixed position; the sponge sleeves 712 are distributed at both ends of the floating sleeve 711 in mirror symmetry, and the spiral trajectories of the concave and convex parts 74 on the two sponge sleeves 712 extend in opposite directions.

[0052] Fourth embodiment

[0053] like Figure 17-Figure 22 As shown, the texturing device for preparing back-contact batteries according to the fourth embodiment of the present invention is based on the third embodiment, but differs in that it further includes a press frame 8 , and the driving unit 4 is transmission-connected to the press frame 8 to squeeze the texturing liquid absorbed by the sponge cover 712 .

[0054] After adopting the above design, after the sponge cover 712 contacts the top surface of the silicon wafer 3, it absorbs the reaction liquid in the silicon wafer 3 and the texturing tank 1. The pressing frame 8 is controlled to move by the driving unit 4. While squeezing the texturing liquid absorbed by the sponge cover 712, the squeezed texturing liquid returns to the texturing tank 1, which can also promote the flow of the texturing liquid in the texturing tank 1, thereby ensuring the uniform distribution of the texturing liquid, contacting and reacting with the silicon wafer 3, and improving the texturing quality.

[0055] In order to achieve the compression of the sponge cover 712, in this embodiment, the pressing frame 8 includes a pressure frame 81 abutting against the top of the sponge cover 712 and a pressure frame 82 vertically arranged and fixedly connected to the pressure frame 81, and the driving unit 4 includes a driving motor 41, and the output end of the driving motor 41 is coaxially connected to a driving shaft 42 passing through the inner side of the pressure frame 82, and the circumferential outer edge of the driving shaft 42 is provided with an eccentric protrusion 421 located on the inner side of the pressure frame 82.

[0056] Specifically, in the pressure frame 8, the pressure frame 81 is a horizontal grid, and the four corners of the pressure frame 81 are integrally connected with guide arms 821, and the end of the guide arm 821 away from the pressure frame 81 is provided with a guide hole 8211, and the circumferential inner wall of the guide hole 8211 is sealed with the circumferential outer edge of the guide rod 723, so that the guide arm 821 and the guide rod 723 are slidably matched, thereby ensuring that the pressure frame 81 can slide stably along the vertical direction; the pressure frame 82 is a U-shaped frame fixed below the pressure frame 81 and vertically arranged, and the two ends of the pressure frame 82 are fixed below the pressure frame 81. The pressure frame 82 is located in the middle of the pressure frame 81, and three pressure frames are provided, which are evenly spaced along the width direction of the pressure frame 81, and the three pressure frames 82 correspond one by one to the three load-bearing transmission components 2. A rectangular array of pressure plates 83 are fixed below the pressure frame 81 , and the pressure plates 83 are correspondingly arranged just above the upper pressure sleeve 71 . The drive shaft 42 passes through the inner wall of the pressure frame 82 and is fixedly connected with three eccentric protrusions 421 corresponding to the three pressure frames 82 .

[0057] After adopting the above structure, during the operation of the driving unit 4, the driving shaft 42 drives the eccentric protrusion 421 to rotate. After the eccentric protrusion 421 rotates to the bottom of the driving shaft 42, it abuts against the bottom inner wall of the pressure frame 82, drives the pressure frame 82 to move downward, so that the pressure frame 81 moves downward, and the pressure plate 83 moves downward to squeeze the reaction liquid absorbed by the sponge cover 712; and when the eccentric protrusion 421 rotates to the top of the driving shaft 42, the eccentric protrusion 421 abuts against the bottom surface of the pressure frame 81, lifts the pressure frame 81, and drives the pressure plate 83 to move upward, reducing the pressure of the pressure plate 83 on the sponge cover 712, so that the sponge cover 712 returns to a fluffy state. The guide arm 821 and the guide rod 723 that slide together ensure that the pressure frame 81 and the pressure plate 83 can move back and forth smoothly along the vertical direction.

[0058] A further improvement is that the cross-sections of the top and bottom surfaces of the pressure plate 83 are arc-shaped with the same center, and the center of the circle is located directly below the pressure plate 83. The outer diameter of the bottom surface of the pressure plate 83 is slightly larger than the outer diameter of the sponge cover 712. The pressure plate 83 is located directly above the sponge cover 712. The pressure plate 83 is also densely covered with water-permeable holes 831 extending along the thickness direction of the pressure plate 83.

[0059] After adopting the above structure, during the operation of the driving unit 4, the pressure frame 81 and the pressure plate 83 are driven to move back and forth in the vertical direction, so that the bottom surface of the pressure plate 83 can squeeze the sponge cover 712 and the concave-convex parts 74 on the sponge cover 712, and part of the reaction liquid squeezed out from the sponge cover 712 can flow upward to the top surface of the sponge cover 712 through the water permeable hole 831. When the pressure plate 83 moves upward and breaks away from the liquid surface of the reaction liquid in the texturing tank 1, the reaction liquid remaining on the top surface of the pressure plate 83 can drip downward along the curved surface to generate water flow, which contacts the top surface of the silicon wafer 3 and promotes the flow of the reaction liquid, so as to achieve sufficient contact reaction between the silicon wafer 3 and the reaction liquid and improve the texturing quality.

[0060] In order to further ensure the stable movement of the pressure frame 81 in the vertical direction, in this embodiment, the strip hole 111 extends upward to the top of the partition 11 to form a groove, and a sliding frame 811 is also integrally connected to the pressure frame 81. The side wall of the sliding frame 811 enters the strip hole 111 of the groove formed by the two middle partitions 11, and the sliding frame 811 slides with the two middle partitions 11.

[0061] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A texturing device for preparing a back contact battery, characterized in that: include: A texturing groove (1), wherein the notch of the texturing groove (1) faces upward; A load-carrying transmission component (2), the load-carrying transmission component (2) comprising load-carrying transmission units distributed along the length direction of the texturing groove (1), the load-carrying transmission unit comprising a load-carrying transmission disk (21) whose axis extends in parallel with the width direction of the texturing groove (1) and rotates around its own axis in the texturing groove (1), the load-carrying transmission disks (21) of two adjacent load-carrying transmission units cooperate with each other to horizontally support the silicon wafer (3), and a line connecting the centers of the load-carrying transmission disks (21) forms an angle with the length direction of the texturing groove (1); A drive assembly, the drive assembly comprising a drive unit (4) and a transmission unit (5), the transmission unit (5) comprising a transmission shaft (51), the transmission shaft (51) being fixedly connected coaxially to the load-bearing transmission disk (21), the end of the transmission shaft (51) being connected coaxially to the transmission disk (52), adjacent transmission disks (52) being connected in transmission via a connecting rod (53), and the drive unit (4) being connected in transmission to one of the transmission disks (52); A spoiler assembly (6), the spoiler assembly (6) comprising a spoiler unit (61) connected to the transmission shaft (51) in a one-to-one correspondence, the spoiler unit (61) comprising a spoiler plate (611) fixedly connected to the transmission shaft (51), the spoiler plate (611) being located on the inner side of a cylindrical surface where the circumferential outer edge of the load-bearing transmission plate (21) is located.

2. The texturing device for preparing a back contact battery according to claim 1, characterized in that: It also includes an upper pressure component (7) arranged directly above the carrying and transmission component (2), and the upper pressure component (7) includes an upper pressure sleeve (71) that rotates around its own axis on the texturing groove (1), and a transmission gap is provided between the horizontal plane where the bottom of the upper pressure sleeve (71) is located and the horizontal plane where the top of the carrying and transmission plate (21) is located.

3. The texturing device for preparing a back contact battery according to claim 2, characterized in that: The upper pressure assembly (7) further comprises an adjustment unit (72), wherein the adjustment unit (72) is used to adjust the height of the upper pressure sleeve (71) so that the width of the transmission gap is consistent with the thickness of the silicon wafer (3).

4. The texturing device for preparing a back contact battery according to claim 3, characterized in that: The upper pressure sleeve (71) comprises a hollow floating sleeve (711), an upper pressure shaft (73) is inserted into the inner side of the upper pressure sleeve (71), the adjustment unit (72) comprises a lifting unit (721), an output end of the lifting unit (721) is connected to a limiting frame (722), and the limiting frame (722) abuts against the upper side of the upper pressure shaft (73).

5. The texturing device for preparing a back contact battery according to claim 1, characterized in that: At least two of the load-bearing transmission components (2) are arranged and distributed along the width direction of the texturing groove (1). A partition (11) is also fixed in the texturing groove (1). The length direction of the partition (11) is consistent with the length direction of the texturing groove (1). The partitions (11) are distributed at intervals along the width direction of the texturing groove (1), and each load-bearing transmission component (2) is arranged in sequence between two adjacent partitions (11).

6. The texturing device for preparing a back contact battery according to claim 2, characterized in that: The circumferential outer edge of the upper pressing sleeve (71) is provided with concave and convex parts (74) distributed or extending along a spiral track, and the spiral track is coaxial with the upper pressing sleeve (71).

7. The texturing device for preparing a back contact battery according to claim 6, characterized in that: The concave-convex parts (74) extend along a spiral track, the concave-convex parts (74) are arranged in pairs along the axial direction of the upper pressure sleeve (71) and are distributed in a mirror-symmetrical manner, and the mirror-symmetrical distribution surface of the concave-convex parts (74) is a vertical plane.

8. The texturing device for preparing a back contact battery according to claim 4, characterized in that: The floating sleeve (711) is rigid, and the upper pressure sleeve (71) further includes a sponge sleeve (712) fixedly sleeved outside the floating sleeve (711).

9. The texturing device for preparing a back contact battery according to claim 8, characterized in that: It also includes a pressing frame (8), and the driving unit (4) is drivingly connected to the pressing frame (8) to squeeze the texturing liquid absorbed by the sponge cover (712).

10. The texturing device for preparing a back contact battery according to claim 9, characterized in that: The pressure frame (8) comprises a pressure frame (81) abutting against the top of the sponge sleeve (712) and a pressure frame (82) vertically arranged and fixedly connected to the pressure frame (81), and the driving unit (4) comprises a driving motor (41), the output end of the driving motor (41) is coaxially connected to a driving shaft (42) passing through the inner side of the pressure frame (82), and the circumferential outer edge of the driving shaft (42) is provided with an eccentric protrusion (421) located on the inner side of the pressure frame (82).

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