Method, device and equipment for separating ultralow-stress chip from basement membrane and medium

Abstract

The invention provides an ultra-low stress chip and base membrane separation method, device, equipment and medium, and relates to the technical field of chip transfer, and the method comprises the steps: S1, controlling a membrane adsorption mechanism to move below a chip, adsorbing the base membrane below the chip through the membrane adsorption mechanism, and supporting the base membrane around the chip; s2, a grabbing head is controlled to move to the position above the chip, and the chip is adsorbed; s3, the base membrane below the chip is adsorbed and moved downwards through a membrane adsorption mechanism, so that the chip is separated from the base membrane; and S4, after the chip is separated from the base membrane, controlling the grabbing head to adsorb and take away the chip. According to the invention, a vacuum reverse step-by-step adsorption mode is adopted to realize step-by-step separation of the chip and the base film, so that damage to the chip caused by an ejector pin jacking mode is avoided; and by supporting the base film around the chip, the stress on the peripheral chip can be greatly reduced, so that the defect rate of the chip is reduced, and the chip bonding method can be widely applied to the crystal grain bonding process of various ultrathin chips.

Description

Technical Field

[0001] The present invention relates to the field of chip transfer technology, and in particular to a method, device, equipment and medium for separating a chip from a base film with ultra-low stress. Background Art

[0002] In the semiconductor packaging manufacturing process, the chips are distributed in a grid pattern in the wafer, and the die pasting process is to take the die out of the wafer and then paste it onto the packaging carrier for subsequent other packaging processes.

[0003] In order to fix the chip in the wafer, a film is generally pasted on the back of the wafer and fixed to the frame. At the same time, the presence of this film will also bring certain challenges to the die pasting process. Under normal circumstances, in order to achieve the separation of the wafer from the base film, a pin is used on the bottom of the chip to lift the chip, and then the chip is taken away with a grabber. However, in the storage industry, with the increase in capacity demand, the chip size is getting larger and the thickness is getting thinner. It is very easy to crack the chip directly with a pin, which greatly affects the product yield.

[0004] In the prior art, a three-step or four-step lifting method is usually used to lift the chip step by step, or lift the chip and then lower it step by step, so as to complete the separation of the chip and the base film. However, although this method can greatly reduce the probability of damage to the lifted chip, during the lifting process, due to the large lifting range, the base film will be pulled upward, which will affect the surrounding chips and even cause the surrounding chips to crack. Summary of the invention

[0005] The embodiments of the present invention provide a method, device, equipment and medium for separating a chip from a base film with ultra-low stress, aiming to solve at least one technical problem in the above-mentioned background technology.

[0006] In a first aspect, an embodiment of the present invention provides a method for separating a chip from a base film with ultra-low stress, comprising:

[0007] S1, controlling the film suction mechanism to move to the bottom of the chip, and using the film suction mechanism to absorb the base film under the chip and support the base film around the chip;

[0008] S2, controls the grabbing head to move above the chip and adsorbs the chip;

[0009] S3, the base film under the chip is sucked and moved downward by the film suction mechanism, so that the chip is separated from the base film;

[0010] S4, after the chip is separated from the base film, the grabbing head is controlled to absorb and take away the chip.

[0011] A further technical solution is that the film suction mechanism comprises a base and a movable component, a sliding position is provided in the middle of the base, and the movable component is embedded in the sliding position and can slide in the sliding position.

[0012] A further technical solution is that the method of absorbing the base film under the chip and supporting the base film around the chip by the film absorption mechanism includes:

[0013] The base film under the chip is adsorbed by the movable component, and the base film around the chip is supported by the base.

[0014] A further technical solution is that the base film under the chip is sucked and moved downward by the film suction mechanism, including:

[0015] After the movable component absorbs the base film under the chip, the movable component is controlled to slide downward in the sliding position, driving the base film under the chip to move downward together.

[0016] A further technical solution is to keep the base support below the base film around the chip during the execution of step S3.

[0017] A further technical solution is that before the base film under the chip is adsorbed by the movable part, the method further comprises: controlling the movable part of the film adsorption mechanism to align with the chip;

[0018] Before controlling the grabbing head to move above the chip, the method further includes: controlling the grabbing head to align with the chip.

[0019] In the second aspect, an embodiment of the present invention further provides a chip grasping device, which includes a controller, a film suction mechanism and a grasping head, wherein the film suction mechanism and the grasping head are controlled by the controller; the film suction mechanism includes a base and a movable part, a sliding position is opened in the middle of the base, and the movable part is embedded in the sliding position and can slide in the sliding position; wherein the controller is used to execute the method for separating the ultra-low stress chip and the base film as described in the first aspect.

[0020] In a third aspect, an embodiment of the present invention further provides a device for separating an ultra-low stress chip from a base film, which includes a unit for executing the above method.

[0021] In a fourth aspect, an embodiment of the present invention further provides a computer device, which includes a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the above method when executing the computer program.

[0022] In a fifth aspect, an embodiment of the present invention further provides a computer-readable storage medium, wherein the storage medium stores a computer program, and the computer program can implement the above method when executed by a processor.

[0023] The embodiment of the present invention provides a method, device, equipment and medium for separating a chip from a base film with ultra-low stress. The method includes: S1, controlling the film suction mechanism to move to the bottom of the chip, adsorbing the base film under the chip and supporting the base film around the chip through the film suction mechanism; S2, controlling the grabbing head to move to the top of the chip and adsorbing the chip; S3, adsorbing the base film under the chip and moving it downward through the film suction mechanism, so that the chip is separated from the base film; S4, after the chip is separated from the base film, controlling the grabbing head to adsorb and take away the chip. The present invention adopts a vacuum reverse step-by-step adsorption method to achieve the step-by-step separation of the chip and the base film, avoiding the chip damage caused by the ejection pin method; and by supporting the base film around the chip, the stress on the surrounding chips can be greatly reduced, thereby reducing the defect rate of the chip, and can be widely used in the grain pasting process of various ultra-thin chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0025] Figure 1 A schematic flow chart of a method for separating a chip from a base film with ultra-low stress provided by an embodiment of the present invention;

[0026] Figure 2 A schematic diagram of the stepwise separation of a chip and a base during the execution of a method for separating a chip and a base film with ultra-low stress provided by an embodiment of the present invention;

[0027] Figure 3 A schematic block diagram of a computer device provided in an embodiment of the present invention.

[0028] Reference numerals

[0029] Grabbing head 10 , chip 20 , base 30 , movable part 40 , vacuum hole 50 . DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0032] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0033] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0034] As used in this specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0035] See also Figure 2 , an embodiment of the present invention proposes a chip grasping device. The chip grasping device is used to perform the method for separating a chip from a base film with ultra-low stress proposed in an embodiment of the present invention. The chip grasping device includes a controller, a film suction mechanism and a grasping head 10, and the film suction mechanism and the grasping head 10 are controlled by the controller. Specifically, the film suction mechanism and the grasping head 10 can be driven by a moving mechanism to achieve movement. The moving mechanism can be, for example, a device that can achieve multi-dimensional movement, such as a robotic arm, which is not specifically limited by the present invention. The controller controls the movement of the film suction mechanism and the grasping head 10 by controlling the moving mechanism. At the same time, a suction cup assembly is provided on the film suction mechanism and the grasping head 10 to achieve negative pressure adsorption. The suction cup assembly is controlled by the controller.

[0036] Further, the film suction mechanism includes a base 30 and a movable part 40, a sliding position is provided in the middle of the base 30, and the movable part 40 is embedded in the sliding position and can slide in the sliding position. The sliding position can be specifically a sliding hole or a sliding groove, which is not specifically limited in the present invention. The movable part 40 is embedded in the sliding position and can slide in the sliding position, for example, it can be driven to move by a driving part, and the driving part can be specifically a motor. The driving part is controlled by a controller.

[0037] Furthermore, the movable part 40 is provided with a vacuum hole 50 , and the vacuum hole 50 is used to be connected to a negative pressure device. The negative pressure device is used to provide negative pressure, so as to achieve adsorption of the chip 20 .

[0038] See also Figure 1 The embodiment of the present invention provides a method for separating an ultra-low stress chip from a base film, and the method for separating an ultra-low stress chip from a base film is applied to the above-mentioned chip grabbing device. Figure 1 As shown, the method includes the following steps: S1, controlling the film suction mechanism to move to the bottom of the chip, and using the film suction mechanism to absorb the base film under the chip and support the base film around the chip.

[0039] In the specific implementation, the film suction mechanism is first controlled to move to the bottom of the chip so that the film suction mechanism is just attached to the base film. Then, the base film under the chip is sucked by the film suction mechanism, and the base film around the chip is supported.

[0040] In one embodiment, the film suction mechanism includes a base and a movable part. A sliding position is provided in the middle of the base. The movable part is embedded in the sliding position and can slide in the sliding position. The sliding position can be specifically a sliding hole or a sliding groove, which is not specifically limited in the present invention. The movable part is embedded in the sliding position and can slide in the sliding position, for example, it can be driven to move by a driving part, and the driving part can be specifically a motor. The driving part is controlled by a controller.

[0041] Furthermore, the movable part is provided with a vacuum hole, and the vacuum hole is used to connect with a negative pressure device. The negative pressure device is used to provide negative pressure to achieve adsorption.

[0042] In one embodiment, the above step of "adsorbing the base film under the chip and supporting the base film around the chip by the film suction mechanism" includes: adsorbing the base film under the chip by the movable part, and supporting the base film around the chip by the base.

[0043] In a specific implementation, before the base film under the chip is adsorbed by the movable part, the movable part of the film adsorption mechanism is controlled to align with the chip. For example, the movable part can be accurately identified and aligned with the chip by an alignment device. The alignment device can be specifically a CCD camera, which is not specifically limited in the present invention.

[0044] After the movable part is aligned with the chip, the film suction mechanism is controlled to move to contact the base film, and then the negative pressure of the movable part is turned on so that the movable part absorbs the base film under the chip and is supported by the base below the base film around the chip.

[0045] S2, controls the grabbing head to move to the top of the chip, and controls the grabbing head to adsorb the chip.

[0046] In a specific implementation, before the gripping head is controlled to absorb the core, the gripping head is controlled to align with the chip. For example, the gripping head can be accurately identified and aligned with the chip by an alignment device. The alignment device can be specifically a CCD camera, which is not specifically limited in the present invention. The gripping head is controlled to move to contact with the base film, and then the negative pressure of the gripping head is turned on, so that the gripping head absorbs the chip.

[0047] S3, the base film under the chip is adsorbed and moved downward by the film suction mechanism, so that the chip is separated from the base film.

[0048] In a specific implementation, after the movable component absorbs the base film under the chip, the movable component is controlled to slide downward in the sliding position, driving the base film under the chip to move downward together. Specifically, the movable component is controlled to move at a preset speed to ensure that the movable component moves slowly downward, driving the chip and the base film to be gradually separated.

[0049] Furthermore, during the execution of step S3, the base support is kept below the base film around the chip, so that on the one hand the chip can be separated from the base film, and on the other hand the area around the chip can be reliably supported, greatly reducing the stress on the surrounding chips, thereby reducing the defect rate of the chip.

[0050] S4, after the chip is separated from the base film, the grabbing head is controlled to absorb and take away the chip.

[0051] In a specific implementation, after the chip is separated from the base film, the gripping head is controlled to absorb and remove the chip, and then the gripping head continues to complete the subsequent conventional chip pasting steps, which will not be described in detail in the embodiment of the present invention.

[0052] The technical solution of the embodiment of the present invention proposes a method for separating a chip from a base film with ultra-low stress, including: S1, controlling the film suction mechanism to move to the bottom of the chip, adsorbing the base film under the chip and supporting the base film around the chip through the film suction mechanism; S2, controlling the grabbing head to move to the top of the chip and adsorbing the chip; S3, adsorbing the base film under the chip and moving it downward through the film suction mechanism, so that the chip is separated from the base film; S4, after the chip is separated from the base film, controlling the grabbing head to adsorb and take away the chip. The present invention adopts a vacuum reverse step-by-step adsorption method to achieve the step-by-step separation of the chip and the base film, avoiding the chip damage caused by the ejection pin method; and by supporting the base film around the chip, it can greatly reduce the stress on the surrounding chips, thereby reducing the defect rate of the chip, and can be widely used in the grain pasting process of various ultra-thin chips.

[0053] Corresponding to the above method for separating ultra-low stress chips from base films, the present invention also provides an ultra-low stress chip and base film separation device. The ultra-low stress chip and base film separation device includes a unit for performing the above method for separating ultra-low stress chips from base films, and the ultra-low stress chip and base film separation device can be configured in a desktop computer, a tablet computer, a laptop computer, and other terminals. Specifically, the ultra-low stress chip and base film separation device includes:

[0054] A first adsorption unit is used to control the film adsorption mechanism to move to the bottom of the chip, adsorb the base film under the chip through the film adsorption mechanism and support the base film around the chip;

[0055] The second adsorption unit is used to control the grabbing head to move above the chip and adsorb the chip;

[0056] A separation unit, used for adsorbing the base film under the chip and moving it downward through a film suction mechanism, so that the chip is separated from the base film;

[0057] The grabbing unit is used to control the grabbing head to absorb and take away the chip after the chip is separated from the base film.

[0058] In one embodiment, the film suction mechanism includes a base and a movable component. A sliding position is opened in the middle of the base. The movable component is embedded in the sliding position and can slide in the sliding position.

[0059] In one embodiment, the method of adsorbing the base film under the chip and supporting the base film around the chip by the film suction mechanism includes:

[0060] The base film under the chip is adsorbed by the movable component, and the base film around the chip is supported by the base.

[0061] In one embodiment, the step of sucking the base film under the chip and moving it downward by means of a film suction mechanism includes:

[0062] After the movable component absorbs the base film under the chip, the movable component is controlled to slide downward in the sliding position, driving the base film under the chip to move downward together.

[0063] In one embodiment, during the step S3 , the base is maintained supported below the base film surrounding the chip.

[0064] In one embodiment, before the base film below the chip is adsorbed by the movable part, the method further comprises: controlling the movable part of the film adsorption mechanism to align with the chip;

[0065] Before controlling the grabbing head to move above the chip, the method further includes: controlling the grabbing head to align with the chip.

[0066] It should be noted that technicians in the relevant field can clearly understand that the specific implementation process of the above-mentioned ultra-low stress chip and base film separation device and each unit can refer to the corresponding description in the aforementioned method embodiment, and for the convenience and conciseness of the description, it will not be repeated here.

[0067] The above-mentioned ultra-low stress chip and base film separation device can be implemented in the form of a computer program, and the computer program can be used in a computer program such as Figure 3 Runs on the computer device shown.

[0068] See also Figure 3 , Figure 3 5 is a schematic block diagram of a computer device provided in an embodiment of the present application. The computer device 500 may be a terminal or a server, wherein the terminal may be an electronic device with communication functions such as a smart phone, a tablet computer, a laptop computer, a desktop computer, a personal digital assistant, and a wearable device. The server may be an independent server or a server cluster composed of multiple servers.

[0069] The computer device 500 includes a processor 502 , a memory, and a network interface 505 connected via a system bus 501 , wherein the memory may include a non-volatile storage medium 503 and an internal memory 504 .

[0070] The non-volatile storage medium 503 can store an operating system 5031 and a computer program 5032. When the computer program 5032 is executed, the processor 502 can execute a method for separating a chip from a base film with ultra-low stress.

[0071] The processor 502 is used to provide computing and control capabilities to support the operation of the entire computer device 500 .

[0072] The internal memory 504 provides an environment for the operation of the computer program 5032 in the non-volatile storage medium 503. When the computer program 5032 is executed by the processor 502, the processor 502 can execute a method for separating a chip from a base film with ultra-low stress.

[0073] The network interface 505 is used to communicate with other devices over the network. Those skilled in the art will appreciate that the above structure is only a block diagram of a portion of the structure related to the present application solution, and does not constitute a limitation on the computer device 500 to which the present application solution is applied. The specific computer device 500 may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0074] The processor 502 is used to run the computer program 5032 stored in the memory to implement the following steps:

[0075] S1, controlling the film suction mechanism to move to the bottom of the chip, and using the film suction mechanism to absorb the base film under the chip and support the base film around the chip;

[0076] S2, controls the grabbing head to move above the chip and adsorbs the chip;

[0077] S3, the base film under the chip is sucked and moved downward by the film suction mechanism, so that the chip is separated from the base film;

[0078] S4, after the chip is separated from the base film, the grabbing head is controlled to absorb and take away the chip.

[0079] In one embodiment, the film suction mechanism includes a base and a movable component. A sliding position is opened in the middle of the base. The movable component is embedded in the sliding position and can slide in the sliding position.

[0080] In one embodiment, the method of adsorbing the base film under the chip and supporting the base film around the chip by the film suction mechanism includes:

[0081] The base film under the chip is adsorbed by the movable component, and the base film around the chip is supported by the base.

[0082] In one embodiment, the step of sucking the base film under the chip and moving it downward by means of a film suction mechanism includes:

[0083] After the movable component absorbs the base film under the chip, the movable component is controlled to slide downward in the sliding position, driving the base film under the chip to move downward together.

[0084] In one embodiment, during the step S3 , the base is maintained supported below the base film surrounding the chip.

[0085] In one embodiment, before the base film below the chip is adsorbed by the movable part, the method further comprises: controlling the movable part of the film adsorption mechanism to align with the chip;

[0086] Before controlling the grabbing head to move above the chip, the method further includes: controlling the grabbing head to align with the chip.

[0087] It should be understood that in the embodiment of the present application, the processor 502 may be a central processing unit (CPU), and the processor 502 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0088] It is understood by those skilled in the art that all or part of the processes in the method for implementing the above embodiment can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a storage medium, which is a computer-readable storage medium. The computer program is executed by at least one processor in the computer system to implement the process steps of the embodiment of the above method.

[0089] Therefore, the present invention also provides a storage medium. The storage medium may be a computer-readable storage medium. The storage medium stores a computer program. When the computer program is executed by a processor, the processor executes the following steps:

[0090] S1, controlling the film suction mechanism to move to the bottom of the chip, and using the film suction mechanism to absorb the base film under the chip and support the base film around the chip;

[0091] S2, controls the grabbing head to move above the chip and adsorbs the chip;

[0092] S3, the base film under the chip is sucked and moved downward by the film suction mechanism, so that the chip is separated from the base film;

[0093] S4, after the chip is separated from the base film, the grabbing head is controlled to absorb and take away the chip.

[0094] In one embodiment, the film suction mechanism includes a base and a movable component. A sliding position is opened in the middle of the base. The movable component is embedded in the sliding position and can slide in the sliding position.

[0095] In one embodiment, the method of adsorbing the base film under the chip and supporting the base film around the chip by the film suction mechanism includes:

[0096] The base film under the chip is adsorbed by the movable component, and the base film around the chip is supported by the base.

[0097] In one embodiment, the step of sucking the base film under the chip and moving it downward by means of a film suction mechanism includes:

[0098] After the movable component absorbs the base film under the chip, the movable component is controlled to slide downward in the sliding position, driving the base film under the chip to move downward together.

[0099] In one embodiment, during the step S3 , the base is maintained supported below the base film surrounding the chip.

[0100] In one embodiment, before the base film below the chip is adsorbed by the movable part, the method further comprises: controlling the movable part of the film adsorption mechanism to align with the chip;

[0101] Before controlling the grabbing head to move above the chip, the method further includes: controlling the grabbing head to align with the chip.

[0102] The storage medium is a physical, non-transient storage medium, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a magnetic disk, or an optical disk, etc., which can store program codes. The computer-readable storage medium can be non-volatile or volatile.

[0103] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in terms of function in the above description. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0104] In the several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of each unit is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0105] The steps in the method of the embodiment of the present invention can be adjusted in order, combined and deleted according to actual needs. The units in the device of the embodiment of the present invention can be combined, divided and deleted according to actual needs. In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0106] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, terminal, or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention.

[0107] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0108] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

[0109] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A method for separating a chip from a base film with ultra-low stress, characterized in that: include: S1, controlling the film suction mechanism to move to the bottom of the chip, and using the film suction mechanism to absorb the base film under the chip and support the base film around the chip; S2, controls the grabbing head to move above the chip and adsorbs the chip; S3, the base film under the chip is sucked and moved downward by the film suction mechanism, so that the chip is separated from the base film; S4, after the chip is separated from the base film, the grabbing head is controlled to absorb and take away the chip.

2. The method for separating an ultra-low stress chip from a base film according to claim 1, characterized in that: The film suction mechanism comprises a base and a movable component. A sliding position is provided in the middle of the base. The movable component is embedded in the sliding position and can slide in the sliding position.

3. The method for separating an ultra-low stress chip from a base film according to claim 2, characterized in that: The method of adsorbing the base film under the chip and supporting the base film around the chip by the film adsorption mechanism comprises: The base film under the chip is adsorbed by the movable component, and the base film around the chip is supported by the base.

4. The method for separating an ultra-low stress chip from a base film according to claim 2, characterized in that: The method of sucking the base film under the chip and moving it downward by the film suction mechanism includes: After the movable component absorbs the base film under the chip, the movable component is controlled to slide downward in the sliding position, driving the base film under the chip to move downward together.

5. The method for separating an ultra-low stress chip from a base film according to claim 2, characterized in that: During step S3 , the base is kept supported below the base film around the chip.

6. The method for separating an ultra-low stress chip from a base film according to claim 4, characterized in that: Before the base film below the chip is adsorbed by the movable part, the method further comprises: controlling the movable part of the film adsorption mechanism to align with the chip; Before controlling the grabbing head to move above the chip, the method further includes: controlling the grabbing head to align with the chip.

7. A chip grabbing device, characterized in that: It includes a controller, a film suction mechanism and a grabbing head, wherein the film suction mechanism and the grabbing head are controlled by the controller; the film suction mechanism includes a base and a movable part, a sliding position is opened in the middle of the base, and the movable part is embedded in the sliding position and can slide in the sliding position; wherein the controller is used to execute the method for separating an ultra-low stress chip from a base film as described in any one of claims 1-6.

8. An ultra-low stress chip and base film separation device, characterized in that: The method comprises a unit for executing the method according to any one of claims 1 to 6.

9. A computer device, characterized in that: The computer device includes a memory and a processor, the memory stores a computer program, and the processor implements the method according to any one of claims 1 to 6 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 6 can be implemented.

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