Grinding pad replacement device, grinding pad replacement method and grinding table equipment

Abstract

The invention discloses a grinding pad replacing device and method and grinding table equipment, and the grinding pad replacing device comprises a lower grinding table, an upper grinding table and a lower grinding table, the upper grinding table is arranged at the upper part of the lower grinding table to form a complete grinding table structure; the film supply device is arranged in the containing cavity and used for providing a to-be-attached grinding pad; the first moving device is used for controlling lifting and overturning of the upper grinding table so as to be far away from or close to the lower grinding table; when the first moving device controls the upper grinding table to turn over and the upper surface of the upper grinding table moves towards the lower grinding table by a preset position, the upper surface of the upper grinding table is attached to the to-be-attached grinding pad in the film supply device. The film supply device is arranged, a grinding pad is replaced for the upper grinding table for material storage, the first moving device is arranged to control the upper grinding table to move and turn over, film pasting work of the upper grinding table is achieved, automatic operation is achieved, the cost of manual operation can be greatly saved, and cost increase is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of grinding equipment, and more specifically, to a grinding pad replacement device, a grinding pad replacement method and a grinding table device. Background Art

[0002] The CMP (Chemical Mechanical Polishing, CMP for short) grinding table is a key component in the chemical mechanical polishing process. CMP is a global flattening process used in semiconductor manufacturing. It combines chemical etching and mechanical grinding to remove surface uneven materials and achieve atomic-level flatness.

[0003] The grinding table is driven by a high speed and torque motor. The grinding table includes a grinding disc and an integrated module and current sensor in the grinding table, providing endpoint monitoring function and real-time film thickness detection. The grinding table is usually used in conjunction with a grinding pad to maintain a certain rough state on the surface of the polishing pad to achieve an effective polishing effect.

[0004] The polishing pad is the most consumed consumable material in CMP. Its service life is generally 40-80 hours. The frequency of PM (Preventive Maintenance) is very high. At present, the replacement process relies solely on equipment techniques, which leads to large human errors. The uniformity of the position of each paste is poor, and the polishing pad is prone to be crooked and block the window of the polishing table.

[0005] The adhesion between the polishing pad and the polishing table is prone to produce tiny particles or tiny bubbles, resulting in bulging in some areas, affecting the uniformity of the wafer and further affecting the polishing process. Usually, the machine must be shut down to replace the polishing pad, affecting the machine's production capacity and the proportion of time it can operate normally during the planned production period.

[0006] In summary, how to avoid affecting the production capacity of the machine is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0007] In view of this, an object of the present invention is to provide a grinding pad replacement device, which can realize automatic replacement of the grinding pad on the grinding table, save manual operation, and ensure the accuracy of replacing the grinding pad.

[0008] Another object of the present invention is to provide a polishing table device including the above-mentioned polishing pad replacement device and a polishing pad replacement method applied to the polishing pad replacement device.

[0009] In order to achieve the above object, the present invention provides the following technical solutions:

[0010] A grinding pad replacement device, comprising:

[0011] A lower grinding table, wherein the lower grinding table has a receiving cavity;

[0012] An upper grinding table, arranged on the upper part of the lower grinding table to form a complete grinding table structure;

[0013] A film supply device, disposed in the accommodating cavity, for providing a polishing pad to be applied;

[0014] The first moving device is used to control the lifting and flipping of the upper grinding table to move away from or closer to the lower grinding table; when the first moving device controls the flipping of the upper grinding table and moves the upper surface toward the lower grinding table to a preset position, the upper surface of the upper grinding table fits with the grinding pad to be applied in the film supply device.

[0015] Preferably, it also includes a base fixed relatively to the lower grinding table, and the first moving device includes:

[0016] A first track is arranged on the base along a vertical direction;

[0017] A lifting component is movably arranged along the first track, and a flip component is arranged on the lifting component and can rotate relative to the first track;

[0018] The picking component is used to pick up and fix the upper grinding table, and is arranged on the flipping component. The rotation of the flipping component can drive the rotation of the picking component.

[0019] Preferably, the flipping component is provided with an image acquisition device for acquiring images of the upper grinding table and the picking component; the image acquisition device is connected to a controller, and the controller is connected to the first moving device; the image acquisition device includes one of a CCD image acquisition device and a position sensor.

[0020] Preferably, the picking component is provided with a film tearing component, and the film tearing component includes at least one film tearing clamping claw and a movable arm, the film tearing clamping claw is used to clamp the edge of the grinding pad to be replaced on the upper grinding table, and the film tearing clamping claw is arranged on the movable arm, and the movable arm can move along the surface of the upper grinding table to drive the clamping claw to tear off the grinding pad.

[0021] Preferably, it also includes a back film pulling device for removing the back film of the polishing pad to be applied in the film supply device;

[0022] The back film pulling device is arranged in the accommodating cavity and located at the side of the film supply device, and the back film pulling device includes:

[0023] A clamping component having a clamping claw or an adhesive portion fixed to the backing film;

[0024] A moving component capable of moving relative to the film supply device, wherein the clamping component is arranged on the moving component;

[0025] A position acquisition component, disposed on the moving component, for acquiring the spatial position of the clamping component and the backing film;

[0026] The pulling device control component is connected to the clamping component, the moving component and the position acquisition component, and can control the moving component to adjust the moving position according to the spatial position acquired by the position acquisition component.

[0027] Preferably, it further comprises a film pressing device, which is arranged in the accommodating cavity, and the film pressing device comprises:

[0028] A traverse member capable of moving along the upper surface of the upper grinding table;

[0029] The roller is a roller structure, which is arranged on the transverse moving part. When the transverse moving part moves, the roller contacts the upper surface of the upper grinding table to roll the grinding pad thereon;

[0030] A pressure component is arranged with the transverse moving component and connected to the roller, and is used for pushing the roller toward the upper grinding table so that the roller presses the grinding pad.

[0031] Preferably, a holding device for holding at least three stacked polishing pads is provided in the holding cavity, and the holding device comprises:

[0032] A support frame, used for directly placing the grinding pad;

[0033] The sliding device is arranged at the bottom of the support frame and is used to drive the support frame to move up and down or move in translation.

[0034] Preferably, the lower grinding table further comprises: a stator and a rotor, and the stator and the rotor are arranged at the lower part of the support frame.

[0035] A method for replacing a polishing pad, applied to any of the polishing pad replacement devices described above, comprising:

[0036] Controlling the first moving device to work so that the upper grinding table rises to move away from the lower grinding table;

[0037] Controlling the first moving device to work, so that the upper grinding table flips over and moves toward the lower grinding table to a preset position, and the upper surface of the upper grinding table contacts and fits with the grinding pad in the film supply device;

[0038] The first moving device is controlled to work so that the upper grinding table is turned over and moved to a position corresponding to the lower grinding table.

[0039] A grinding table device comprises any one of the grinding pad replacement devices described above.

[0040] The grinding pad replacement device provided by the present application provides a film supply device for accommodating the grinding pad in the lower grinding table to store materials for replacing the grinding pad on the upper grinding table. A first moving device is provided to control the movement and flipping of the upper grinding table 1, so that it can achieve film application by rising, flipping, and descending, and then rise, flip, and descend to achieve the reset of the upper grinding table. The realization of automated operation can greatly save the cost of manual operation and avoid the increase of cost.

[0041] The grinding table device with the grinding pad replacement device and the grinding method applied to the grinding pad replacement device provided in the present application can realize automated operation, which can greatly save the cost of manual operation and avoid the increase of cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0043] Figure 1 It is a schematic structural diagram of the upper and lower grinding tables in the grinding pad replacement device provided by the present invention;

[0044] Figure 2 A cross-sectional view of the polishing pad replacement device provided by the present invention;

[0045] Figure 3 This is a schematic diagram of the overall structure of the polishing pad replacement device provided by the present invention.

[0046] Figure 1-Figure 3 , the reference numerals include:

[0047] 1- upper grinding table, 11 is a viewing window;

[0048] 2-lower grinding table, 21-accommodating chamber;

[0049] 3-film supply device, 31-polishing pad;

[0050] 4- Base;

[0051] 5-first moving device, 51-first track, 52-lifting component, 53-turning component, 54-picking component;

[0052] 6- Image acquisition device;

[0053] 7-back film pulling device; 8-film pressing device; 9-bearing seat, 10-motor. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] The core of the present invention is to provide a grinding pad replacement device, which can realize automatic replacement of the grinding pad on the grinding table, save manual operation, and ensure the accuracy of replacing the grinding pad.

[0056] Another core of the present invention is to provide a grinding table device including the above-mentioned grinding pad replacement device and a grinding pad replacement method applied to the grinding pad replacement device.

[0057] Please refer to Figures 1 to 3 , a polishing pad replacement device, comprising:

[0058] A lower grinding table 2, wherein the lower grinding table 2 has a receiving cavity 21;

[0059] The upper grinding table 1 is arranged on the upper part of the lower grinding table 2 to form a complete grinding table structure;

[0060] A film supply device 3 is disposed in the accommodating cavity 21 and is used to provide a polishing pad 31 to be applied;

[0061] The first moving device 5 is used to control the lifting and flipping of the upper grinding table 1 to move away from or close to the lower grinding table 2; when the first moving device 5 controls the upper grinding table 1 to flip and moves the upper surface toward the lower grinding table 2 to a preset position, the upper surface of the upper grinding table 1 is in contact with the grinding pad 31 to be applied in the film supply device 3.

[0062] It should be noted that the whole formed by the combination of the upper grinding table 1 and the lower grinding table 2 is basically the same as the existing grinding table. The existing grinding table is an integral structure, provided with a table top, a bearing seat 9, a motor 10, etc. The lower grinding table 2 of the present application retains the basic structure of the original grinding table, including a bearing seat 9, a motor 10, etc., and an accommodating cavity 21 is provided in the middle of the lower grinding table, and the upper grinding table 1 is provided on the upper part thereof, which is the original table top structure.

[0063] What is different from the existing structure is that the above-mentioned accommodating chamber 21 structure is provided, and a film supply device 3 is provided in the accommodating chamber, and the film supply device 3 is provided with a plurality of polishing pads 31.

[0064] The above device is also provided with a first moving device 5, which is arranged outside the grinding table and is used to control the lifting, moving and flipping operations of the upper grinding table 1. Its purpose is to enable the upper grinding table 1 to be away from the lower grinding table 2 and flipped to form an inverted state, with its upper surface facing the lower grinding table 2, and to align with the grinding pad 31 by moving and sticking to the grinding pad 31 to form a fixation. Then, through the operation of lifting, flipping and descending, it is restored to the initial state, thereby restoring the overall shape of the grinding table.

[0065] The first moving device 5 needs to have an electronic control device that can be controlled by electric energy and signals to achieve controlled movement. It should be noted that the polishing pad 31 can be stacked in the accommodating cavity 21, and reference can be made to the material stacking method in the automated production line in the prior art.

[0066] The polishing pad replacement device provided in the present application provides a film supply device 3 for accommodating the polishing pad 31 in the lower polishing table 2, so as to store materials for replacing the polishing pad 31 for the upper polishing table 1. A first moving device is provided to control the movement and flipping of the upper polishing table 1, so that the upper polishing table 1 can be raised, flipped, and lowered to achieve film application, and then raised, flipped, and lowered to achieve the reset of the upper polishing table 1. The realization of automated operation can greatly save the cost of manual operation and avoid the increase of cost.

[0067] On the basis of the above embodiment, in order to realize the specific operation of the above first moving device 5, a specific solution is provided in this embodiment, wherein a base 4 fixed relatively to the lower grinding table 2 is also included, and the first moving device 5 includes:

[0068] A first track 51 is disposed on the base 4 along a vertical direction;

[0069] A lifting component 52 is movably arranged along the first track 51, and a flipping component 53 is arranged on the lifting component 52, which can rotate relative to the first track 51, so as to realize the flipping of the upper grinding table 1, and the flipping axis is parallel to the horizontal axis of the lower grinding table 2, so that the upper surface and the lower surface of the upper grinding table 1 can be exchanged;

[0070] The picking component 54 is used to pick up and fix the upper grinding table 1 and is disposed on the flip component 53 . The rotation of the flip component 53 can drive the picking component 54 to rotate.

[0071] Please note that, please refer to Figure 3 The first track 51 is a track along the lifting direction, and can specifically extend in the vertical direction. Optionally, it can also extend in the horizontal direction at the same time, which is not specifically limited in this embodiment.

[0072] The lifting component 52 is a device such as a slider, which can move along the first track 51. The lifting component 52 is an electric drive device, which can have a mechanical structure that slides with the first track 51 and also has an electric control structure.

[0073] Optionally, the lifting component may also be the main structure of a screw drive device, moving along the first track 51 .

[0074] The picking component 54 can be specifically a device such as a gripper, which is arranged on the lifting component 52 or the flipping component 53. On the basis of grabbing the upper grinding table 1, it can adjust different angles according to the working status of the lifting component 52 or the flipping component 53 to change the status of the upper grinding table 1.

[0075] In this embodiment, the first moving device 5 is specifically refined into a structure having a first track 51, a lifting component 52, a flipping component 53 and a picking component 54, so that the operation process and the relationship between the various structures can be clearly and detailedly reflected. The above automation structure can also use other structures in the prior art that can realize lifting, flipping and picking operations.

[0076] On the basis of the above embodiment, in order to realize the specific operation of the above flipping component to ensure the accuracy of the position, a specific solution is provided in this embodiment, wherein the flipping component is provided with an image acquisition device 6 for acquiring images of the upper grinding table 1 and the pickup component 54; the image acquisition device 6 is connected to a controller, and the controller is connected to the first moving device 5;

[0077] The image acquisition device 6 includes one of a CCD image acquisition device and a position sensor.

[0078] In this embodiment, the image acquisition device 6 is used to acquire images of the upper grinding table 1 and the picking component 54, which can further ensure the accuracy of the picking position and further ensure the accuracy of the control and film sticking operations.

[0079] On the basis of the above embodiment, considering that when replacing the grinding pad 31, the original grinding pad 31 needs to be removed, therefore, in the specific scheme provided in this embodiment, in order to realize the preparatory operation before the above-mentioned film sticking operation to ensure the accuracy of the position, a specific scheme is provided in this embodiment, wherein the picking component is provided with a film tearing component, and the film tearing component includes at least one film tearing clamping claw and a movable arm, and the film tearing clamping claw is used to clamp the edge of the grinding pad 31 to be replaced on the upper grinding table 1, and the film tearing clamping claw is arranged on the movable arm, and the movable arm can move along the surface of the upper grinding table 1 to drive the clamping claw to tear off the grinding pad 31.

[0080] The film-tearing component may be a mechanical integrated component consisting of a clamp and a movable arm. The film-tearing component is connected to the controller of the first moving device 5 to form an overall coordinated control.

[0081] On the basis of any of the above embodiments, considering that when the polishing pad 31 is replaced, the back film of the new polishing pad 31 needs to be removed, the specific solution provided in this embodiment also includes a back film pulling device 7 for removing the back film of the polishing pad 31 to be applied in the film supply device;

[0082] The back film pulling device is arranged in the accommodating cavity 21 and is located at the side of the film supply device 3. The back film pulling device 7 includes:

[0083] A clamping component having a clamping claw or an adhesive portion fixed to the backing film;

[0084] A moving component capable of moving relative to the film supply device 3, wherein the clamping component is arranged on the moving component;

[0085] A position acquisition component, disposed on the moving component, for acquiring the spatial position of the clamping component and the backing film;

[0086] The pulling device control component is connected to the clamping component, the moving component and the position acquisition component, and can control the moving component to adjust the moving position according to the spatial position acquired by the position acquisition component.

[0087] It should be noted that the backing film is the backing film of the new polishing pad 31 , which is usually also called a release film, etc. The backing film pulling device is disposed in the accommodating cavity 21 , preferably at a position close to the polishing pad 31 .

[0088] The clamping component is used to be directly fixed to the back film, and may be a clip, or a component with an adhesive effect, which is fixed to the back film by clamping or pasting, and the clamping component is driven to move by the moving component, thereby achieving tearing off the back film.

[0089] The position acquisition component can refer to the above-mentioned CCD image acquisition device, or devices such as position sensors to acquire the positions of the clamping component and the backing film.

[0090] The puller control component is similar to the aforementioned controller, and can control the operation of the moving component by obtaining position information, thereby ensuring the accuracy of film tearing.

[0091] On the basis of any of the above embodiments, considering that when the polishing pad 31 is replaced, the new polishing pad 31 needs to be fixed, de-bubbled, etc., the specific solution provided in this embodiment also includes: a film press 8, which is arranged in the accommodating cavity 21, and the film press 8 includes:

[0092] A traverse member capable of moving along the upper surface of the upper grinding table;

[0093] The roller is a roller structure, which is arranged on the transverse moving part. When the transverse moving part moves, the roller contacts the upper surface of the upper grinding table to roll the grinding pad thereon;

[0094] A pressure component is arranged with the transverse moving component and connected to the roller, and is used for pushing the roller toward the upper grinding table so that the roller presses the grinding pad.

[0095] It should be noted that the structure of the above-mentioned transverse moving component can refer to the moving component in the previous part, and its function is to drive the roller to move. The main function of the roller is to move on the surface of the grinding pad 31, so as to drive out the bubbles between the grinding pad and the upper grinding table 1.

[0096] The pressure component needs to apply pressure to the roller so that it can press against the polishing pad to successfully drive out the bubbles.

[0097] It should be noted that the above-mentioned roller may also be other structures, such as a roller shovel, or other operating structures for applying pressure on the surface of the membrane structure to achieve bubble removal.

[0098] The combination of the roller and the lateral moving part used in this embodiment can further process the polishing pad after the film is applied, so as to achieve a better application effect of the polishing pad 31 .

[0099] On the basis of any of the above embodiments, a holding device for holding at least three stacked polishing pads 31 is provided in the holding cavity, and the holding device includes:

[0100] A support frame, used to directly place the polishing pad 31;

[0101] The sliding device is arranged at the bottom of the support frame, and is used to drive the support frame to move up and down or translate. Based on any of the above embodiments, the lower grinding table further includes: a stator and a rotor, which are arranged at the bottom of the support frame. The purpose of the stator and the rotor is to drive the rotation of the upper grinding table 1. The stator and the rotor work together in the CMP device, and realize the support and rotation function of the upper grinding table through rotational movement and pressure.

[0102] In addition to the polishing pad replacement device disclosed in the above embodiments, the present invention also provides a polishing table device including the above polishing pad replacement device. For the structures of other parts of the polishing table device, please refer to the prior art and will not be described in detail herein.

[0103] In addition to the polishing pad replacement devices disclosed in the above embodiments, the present invention also provides a polishing pad replacement method, which is applied to any of the above polishing pad replacement devices, comprising:

[0104] Step 1, controlling the first moving device to work, so that the upper grinding table rises to be away from the lower grinding table;

[0105] Step 2, controlling the first moving device to work, so that the upper grinding table flips over and moves toward the lower grinding table to a preset position, and the upper surface of the upper grinding table contacts and fits with the grinding pad in the film supply device;

[0106] Step 3: Control the first moving device to work so that the upper grinding table is turned over and moved to a position corresponding to the lower grinding table to form a complete grinding table structure, thereby restoring the normal working state of the grinding table.

[0107] The steps of the above method are not limited to the specific objects provided therein, and can be extended according to the specific structure provided in the above-mentioned polishing pad replacement device. For example, before the upper surface of the upper polishing table contacts and fits with the polishing pad in the film supply device, it is necessary to remove the old polishing pad 31 and remove the back film of the new polishing pad 31.

[0108] For other structures and step settings, please refer to the prior art and will not be described in detail in this article.

[0109] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0110] The above is a detailed introduction to the grinding pad replacement device, method, and grinding table equipment provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, the present invention can also be improved and modified in a number of ways, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A polishing pad replacement device, characterized in that: include: A lower grinding table (2), wherein the lower grinding table (2) has a receiving cavity (21); An upper grinding table (1) is arranged on the upper part of the lower grinding table (2) to form a complete grinding table structure; A film supply device (3), arranged in the accommodating cavity (21), and used for providing a polishing pad (31) to be applied; The first moving device (5) is used to control the lifting and flipping of the upper grinding table (1) to move away from or closer to the lower grinding table (2); when the first moving device (5) controls the upper grinding table (1) to flip and moves the upper surface toward the lower grinding table (2) to a preset position, the upper surface of the upper grinding table (1) is in contact with the grinding pad (31) to be applied in the film supply device (3).

2. The polishing pad replacement device according to claim 1, characterized in that: It also includes a base (4) fixed relative to the lower grinding table (2), and the first moving device (5) includes: A first track (51) arranged on the base (4) along a vertical direction; a lifting component (52) movably arranged along the first track (51); a flip component (53) being arranged on the lifting component (52) and being capable of rotating relative to the first track (51); A picking component (54) is used to pick up and fix the upper grinding table (1), and is arranged on the flip component (53). The rotation of the flip component (53) can drive the picking component (54) to rotate.

3. The polishing pad replacement device according to claim 2, characterized in that: The flipping component is provided with an image acquisition device (6) for acquiring images of the upper grinding table (1) and the picking component (54); the image acquisition device (6) is connected to a controller, and the controller is connected to the first moving device (5); The image acquisition device (6) comprises one of a CCD image acquisition device and a position sensor.

4. The polishing pad replacement device according to claim 3, characterized in that: The picking component is provided with a film tearing component, and the film tearing component comprises at least one film tearing clamping claw and a movable arm, the film tearing clamping claw is used to clamp the edge of the grinding pad (31) to be replaced on the upper grinding table (1), and the film tearing clamping claw is arranged on the movable arm, and the movable arm can move along the surface of the upper grinding table (1) to drive the clamping claw to tear off the grinding pad (31).

5. The polishing pad replacement device according to claim 4, characterized in that: It also includes a back film pulling device (7) for removing the back film of the polishing pad (31) to be applied in the film supply device; The back film pulling device is arranged in the accommodating cavity (21) and is located on the side of the film supply device (3). The back film pulling device (7) comprises: A clamping component having a clamping claw or an adhesive portion fixed to the backing film; A moving component capable of moving relative to the film supply device (3), wherein the clamping component is arranged on the moving component; A position acquisition component, disposed on the moving component, for acquiring the spatial position of the clamping component and the backing film; The pulling device control component is connected to the clamping component, the moving component and the position acquisition component, and can control the moving component to adjust the moving position according to the spatial position acquired by the position acquisition component.

6. The polishing pad replacement device according to any one of claims 1 to 5, characterized in that: It also includes a film pressing device (8) disposed in the accommodating cavity (21), the film pressing device (8) comprising: A traverse member capable of moving along the upper surface of the upper grinding table; The roller is a roller structure, which is arranged on the transverse moving part. When the transverse moving part moves, the roller contacts the upper surface of the upper grinding table to roll the grinding pad thereon; A pressure component is arranged with the transverse moving component and connected to the roller, and is used for pushing the roller toward the upper grinding table so that the roller presses the grinding pad.

7. The polishing pad replacement device according to claim 6, characterized in that: A holding device for holding at least three stacked polishing pads (31) is provided in the holding cavity, and the holding device comprises: A support frame, used for directly placing the grinding pad (31); The sliding device is arranged at the bottom of the support frame and is used to drive the support frame to move up and down or move in translation.

8. The polishing pad replacement device according to claim 7, characterized in that: The lower grinding table further comprises: a stator and a rotor, and the stator and the rotor are arranged at the lower part of the support frame.

9. A method for replacing a polishing pad, characterized in that: The polishing pad replacement device according to any one of claims 1 to 8 comprises: Controlling the first moving device to work so that the upper grinding table rises to move away from the lower grinding table; Controlling the first moving device to work, so that the upper grinding table flips over and moves toward the lower grinding table to a preset position, and the upper surface of the upper grinding table contacts and fits with the grinding pad in the film supply device; The first moving device is controlled to work so that the upper grinding table is turned over and moved to a position corresponding to the lower grinding table.

10. A grinding table device, characterized in that: The invention comprises the polishing pad replacement device according to any one of claims 1 to 8.

Images