Quartz gyroscope damping structure and gyroscope sensing element

Abstract

The invention provides a quartz gyroscope damping structure and a gyroscope sensing element. The quartz gyroscope vibration reduction structure is used for a gyroscope sensing element comprising a shell and a chip, is made of quartz and comprises an outer frame, an inner frame and a vibration reduction part, and the outer frame is used for limiting the appearance of the quartz gyroscope vibration reduction structure; the boss is located at the central position of an area limited by the outer frame; the coupling beam is located between the outer frame and the boss and connects the outer frame with the boss, when the quartz gyroscope vibration reduction structure is applied to the gyroscope sensing element, the outer frame is fixedly connected with the shell, the boss is fixedly connected with the chip, and therefore the coupling beam conducts stress isolation between the shell and the chip. According to the invention, the low-frequency vibration of the gyroscope sensing element can be inhibited, the influence of an external mechanical environment on the gyroscope sensing element is reduced, and the volume of the gyroscope sensing element is not increased while the structure is increased.

Description

Technical Field

[0001] The invention relates to the technical field of quartz gyroscope vibration reduction, and in particular to a quartz gyroscope vibration reduction structure and a gyroscope sensitive element. Background Art

[0002] Quartz gyroscopes are often used in the field of inertial navigation and control due to their small size, low cost and high precision. However, the working mechanical environment of quartz gyroscopes is usually harsh, such as large vibration acceleration and long excitation time. Therefore, the vibration reduction performance of the quartz gyroscope must be improved to protect the device from strong impact and vibration. At present, a common method is to install a rubber shock absorber outside the device by glue filling, and use the material properties of rubber to improve the damping of the device, thereby achieving a vibration isolation effect. In addition, a vibration reduction bracket can be installed outside the sensitive element to reduce the contact area between the sensitive element and the carrier, thereby reducing the stress transmitted to the sensitive element from the outside.

[0003] However, the vibration-damping bracket and the vibration absorber can only isolate high-frequency vibrations with higher amplitudes, but cannot suppress low-frequency slight vibrations. In addition, the vibration-damping bracket and the vibration absorber are large in size, which is contrary to the requirements of miniaturized quartz gyroscopes. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a quartz gyro vibration reduction structure and a gyro sensitive element, which can suppress the low-frequency vibration of the gyro sensitive element, reduce the influence of the external mechanical environment on the gyro sensitive element, and can increase the structure without increasing the volume of the gyro sensitive element.

[0005] Specifically, the present invention is achieved through the following technical solutions: In a first aspect, the present invention provides a quartz gyroscope vibration reduction structure for a gyroscope sensitive element, wherein the gyroscope sensitive element comprises a shell and a chip, the quartz gyroscope vibration reduction structure is made of quartz, and comprises: an outer frame for defining the outer shape of the quartz gyroscope vibration reduction structure; a boss located at the center of an area defined by the outer frame; and a coupling beam located between the outer frame and the boss and connecting the outer frame to the boss, wherein, when the quartz gyroscope vibration reduction structure is applied to the gyroscope sensitive element, the outer frame is fixedly connected to the shell and the boss is fixedly connected to the chip, so that the coupling beam performs stress isolation between the shell and the chip.

[0006] Furthermore, the quartz gyro vibration reduction structure is bilaterally symmetrical and vertically symmetrical.

[0007] Furthermore, there are hollow areas between the multiple coupling beams.

[0008] Furthermore, when the quartz gyro vibration reduction structure is applied to the gyro sensitive element, the center of mass of the quartz gyro vibration reduction structure coincides with the center of mass of the chip.

[0009] Furthermore, the size of the outer frame is determined according to the use space, and the shape of the outer frame is a regular polygon or a circle.

[0010] Further, the area of ​​the boss is larger than the area of ​​the bonding region of the chip, wherein the bonding region is a region on the chip used to bond the chip to the boss.

[0011] Furthermore, the shape of the boss is determined according to the shape of the bonding area of ​​the chip, and the height of the boss is determined according to the use space.

[0012] Furthermore, the quartz gyroscope vibration reduction structure is obtained by wet etching.

[0013] Furthermore, the outer frame is fixedly connected to the shell and the boss is fixedly connected to the chip, including: bonding the outer frame and the boss to the shell and the chip respectively by adhesive.

[0014] In a second aspect, the present invention provides a gyro sensitive element, wherein the gyro sensitive element comprises the quartz gyro vibration reduction structure according to the first aspect.

[0015] The present invention provides a quartz gyro vibration reduction structure and a gyro sensitive element. The quartz gyro vibration reduction structure comprises an outer frame, a boss and a coupling beam connecting the outer frame and the boss. The outer frame and the boss are respectively bonded to a shell and a chip of the gyro sensitive element, so that the coupling beam can perform stress isolation between the shell and the chip of the gyro sensitive element, thereby suppressing the low-frequency vibration of the gyro sensitive element, reducing the influence of the external mechanical environment on the gyro sensitive element, and increasing the structure without increasing the volume of the gyro sensitive element.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1is a schematic diagram of a first embodiment of a quartz gyro vibration reduction structure according to an embodiment of the present invention; Figure 2 is a schematic diagram of a second embodiment of a quartz gyro vibration reduction structure according to an embodiment of the present invention; Figure 3 is a schematic diagram of a third embodiment of a quartz gyro vibration reduction structure according to an embodiment of the present invention; Figure 4 FIG. 4 is a schematic diagram of a fourth embodiment of a quartz gyro vibration reduction structure according to an embodiment of the present invention.

[0019] List of reference numerals: 10, outer frame; 20, boss; 30, coupling beam. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Figures 1 to 4 Schematic diagrams of the first to fourth embodiments of the quartz gyro vibration reduction structure according to the embodiment of the present invention. The quartz gyro vibration reduction structure according to the embodiment of the present invention is mainly applied to a gyro sensitive element, which is a key component in a gyroscope for detecting and measuring angular velocity or angular displacement, and its packaging part may include a housing and a chip.

[0022] The material of the quartz gyro vibration reduction structure according to the embodiment of the present invention is quartz material. Quartz as a vibration reduction material has the advantages of high stability, high temperature resistance, corrosion resistance, good thermal stability, high pressure resistance and good mechanical properties. Figure 1 As shown, the quartz gyro vibration reduction structure according to an embodiment of the present invention may include: an outer frame 10, a boss 20 and a coupling beam 30. The outer frame 10 is used to define the shape of the quartz gyro vibration reduction structure, the boss 20 is located at the center of the area defined by the outer frame 10, and the coupling beam 30 is located between the outer frame 10 and the boss 20 and connects the outer frame 10 with the boss 20, preferably, the two are rigidly connected. When the quartz gyro vibration reduction structure is applied to a gyro sensitive element, the outer frame 10 is fixedly connected to the housing of the gyro sensitive element and the boss 20 is fixedly connected to the chip of the gyro sensitive element, so that the coupling beam 30 performs stress isolation between the housing and the chip. Preferably, the outer frame 10 and the boss 20 can be bonded to the housing and the chip respectively by adhesive, so that the outer frame 10 is fixedly connected to the housing of the gyro sensitive element and the boss 20 is fixedly connected to the chip of the gyro sensitive element.

[0023] There are hollow areas between the multiple coupling beams 30, and the number, width and size of the hollow areas of the coupling beams 30 will affect the vibration isolation effect (stress isolation effect) of the structure, and can be adjusted according to different requirements. For example, the parameters of the multiple coupling beams 30 can be determined according to different vibration reduction requirements, because the width, number and size of the hollow areas of the coupling beams will affect the vibration reduction effect. The larger the hollow area and the thinner the beam, the greater the damping of the corresponding vibration reduction structure, the smaller the stiffness, and the better the vibration reduction effect.

[0024] In addition, the size of the outer frame 10 can be determined according to the use space, and the shape of the outer frame 10 is a regular polygon or a circle. Figure 1 The first embodiment of the quartz gyro vibration reduction structure shown is in the shape of a square. Figure 2 The second embodiment of the quartz gyro vibration reduction structure shown in the figure is in the shape of a regular hexagon. Figure 3 The third embodiment of the quartz gyro vibration reduction structure shown in the figure is in the shape of a square and a cross, and Figure 4 The shape of the fourth embodiment of the quartz gyro vibration reduction structure is a rhombus.

[0025] The chip is provided with a bonding area for bonding the chip to the boss 20. Preferably, the area of ​​the boss 20 is larger than the area of ​​the bonding area. In addition, the shape of the boss 20 can be adjusted according to the shape of the bonding area of ​​different chips, and the height of the boss 20 can be adjusted according to the actual use space.

[0026] Preferably, the quartz gyroscope vibration reduction structure according to the embodiment of the present invention is bilaterally symmetrical and vertically symmetrical, thereby producing the same stress isolation effect in all directions, thereby improving the stability of the quartz gyroscope vibration reduction structure.

[0027] In addition, the quartz gyro vibration reduction structure according to the embodiment of the present invention can be obtained by wet etching to ensure that the structure is symmetrical in both left and right directions and in both top and bottom directions. When the quartz gyro vibration reduction structure is applied to a gyro sensitive element, the quartz gyro vibration reduction structure is assembled so that the center of mass of the quartz gyro vibration reduction structure coincides with the center of mass of the gyro sensitive element chip. Moreover, the size of the quartz gyro vibration reduction structure can be flexibly adjusted according to different usage requirements, and has strong practicality.

[0028] In addition, the quartz gyroscope vibration reduction structure is an all-quartz structure, and its processing technology is compatible with the quartz tuning fork process, and the materials and thermal expansion coefficients are consistent, thereby reducing production costs.

[0029] On the other hand, the present invention also provides a gyro sensitive element equipped with a quartz gyro vibration reduction structure according to an embodiment of the present invention. By installing the quartz gyro vibration reduction structure, the influence of the external complex mechanical environment on the quartz gyro sensitive structure can be reduced, the stress transmission efficiency can be reduced, and the vibration resistance of the gyro sensitive element can be improved, thereby improving the reliability of the quartz gyro.

[0030] In summary, the present invention provides a quartz gyro vibration reduction structure and a gyro sensitive element. The quartz gyro vibration reduction structure has an outer frame, a boss, and a coupling beam connecting the outer frame and the boss, and the outer frame and the boss are respectively bonded to the outer shell and the chip of the gyro sensitive element, so that the coupling beam can perform stress isolation between the outer shell and the chip of the gyro sensitive element, thereby suppressing the low-frequency vibration of the gyro sensitive element, reducing the influence of the external mechanical environment on the gyro sensitive element, and increasing the structure without increasing the volume of the gyro sensitive element.

[0031] In addition, in the present invention, the description with reference to the terms "embodiment", "present embodiment", "another embodiment", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A quartz gyro vibration reduction structure, used for a gyro sensitive element, the gyro sensitive element comprising a housing and a chip, characterized in that: The quartz gyro vibration reduction structure is made of quartz and includes: An outer frame, used to define the outer shape of the quartz gyro vibration reduction structure; a boss located at a center of an area defined by the outer frame; and A plurality of coupling beams are located between the outer frame and the boss and connect the outer frame and the boss, Wherein, when the quartz gyro vibration reduction structure is applied to the gyro sensitive element, the outer frame is fixedly connected to the shell and the boss is fixedly connected to the chip, so that the coupling beam performs stress isolation between the shell and the chip.

2. The quartz gyro vibration reduction structure according to claim 1, characterized in that: The quartz gyro vibration reduction structure is symmetrical left-right and top-bottom.

3. The quartz gyro vibration reduction structure according to any one of claim 2, characterized in that: There is a hollow area between the multiple coupling beams.

4. The quartz gyro vibration reduction structure according to claim 1, characterized in that: When the quartz gyro vibration reduction structure is applied to the gyro sensitive element, the center of mass of the quartz gyro vibration reduction structure coincides with the center of mass of the chip.

5. The quartz gyro vibration reduction structure according to claim 1, characterized in that: The size of the outer frame is determined according to the use space, and the shape of the outer frame is a regular polygon or a circle.

6. The quartz gyro vibration reduction structure according to claim 1, characterized in that: The area of ​​the boss is larger than the area of ​​the bonding region of the chip, wherein the bonding region is a region on the chip used to bond the chip to the boss.

7. The quartz gyro vibration reduction structure according to claim 6, characterized in that: The shape of the boss is determined according to the shape of the bonding area of ​​the chip, and the height of the boss is determined according to the use space.

8. The quartz gyro vibration reduction structure according to claim 1, characterized in that: The quartz gyroscope vibration reduction structure is obtained by wet etching.

9. The quartz gyro vibration reduction structure according to claim 1, characterized in that: The outer frame is fixedly connected to the shell and the boss is fixedly connected to the chip, which comprises: bonding the outer frame and the boss to the shell and the chip respectively by adhesive.

10. A gyroscopic sensitive element, characterized in that: The gyro sensitive element is equipped with a quartz gyro vibration reduction structure according to any one of claims 1 to 9.

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