A fully automatic board removal machine

Abstract

This invention discloses a fully automatic PCB de-mounting and re-mounting machine, comprising a frame and mounted on the frame a bare PCB loading mechanism, a finished product output mechanism, a semi-finished product conveying track, a finished product conveying track, an A-side carrier unlocking and positioning mechanism, a B-side carrier unlocking and positioning mechanism, a semi-finished product flipping mechanism, a finished product flipping mechanism, a PCB de-mounting and re-mounting mechanism, a carrier collection mechanism, and a carrier transfer mechanism. By integrating multiple processes and equipment, this invention achieves a fully automated process from bare PCB loading, carrier unlocking, A-side / B-side board de-mounting and re-mounting, board flipping, empty carrier collection, to finished product output. This significantly reduces the time and labor costs associated with material transfer between equipment, thereby improving overall production efficiency.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing technology, specifically to a fully automatic board removal and installation machine. Background Technology

[0002] The electronics industry has developed rapidly in the 21st century, and the performance of PCB boards, a crucial component of its products, has continuously improved, leading to increasingly stringent requirements for PCB manufacturing processes. PCB board, or circuit board, is a relatively active sector within the contemporary electronic components industry.

[0003] With the development of technology and the popularization of automated production, the PCB manufacturing process has gradually become automated. In the PCB manufacturing process, the PCB needs to be placed in a spring carrier for single-sided or double-sided processing. This process involves steps such as unlocking the carrier, board placement, board removal, board flipping, and carrier collection.

[0004] However, in existing PCB manufacturing methods, each process requires separate equipment, increasing the number of steps and equipment. This not only leads to high production costs but also consumes a significant amount of manpower throughout the entire process. Furthermore, material transfer between equipment wastes considerable time, and each piece of equipment requires personnel for operation and monitoring, increasing labor intensity and limiting production efficiency.

[0005] The above shortcomings need to be improved. Summary of the Invention

[0006] In order to overcome the problems of high production costs, waste of time and production efficiency in the existing PCB board processing methods, which require each process to be carried out by separate equipment, the present invention provides a fully automatic board removal and installation machine.

[0007] The technical solution of this invention is as follows:

[0008] A fully automatic board removal and installation machine, comprising:

[0009] frame;

[0010] A blank board feeding mechanism, mounted on the frame, is used to supply blank PCB boards;

[0011] The finished product output mechanism is installed on the frame and is used to output the finished PCB board;

[0012] A semi-finished product conveying track is installed on the frame to receive empty or loaded A-side carriers containing PCB semi-finished products, transport the A-side carriers to the semi-finished product disassembly and assembly station, and output A-side carriers loaded with bare PCB boards.

[0013] The finished product conveying track is installed on the frame and is used to receive empty or loaded B-side carriers of finished PCB boards, and to transport the B-side carriers to the finished product disassembly and assembly station, as well as to output B-side carriers loaded with semi-finished PCBs.

[0014] A semi-finished product flipping mechanism is installed on the frame to transport the PCB board semi-finished product located at the semi-finished product disassembly station to the semi-finished product flipping station and flip it 180°.

[0015] A PCB removal and transplanting mechanism is installed on the frame and is used to implant the PCB blank supplied by the blank board loading mechanism into the A-side carrier located at the semi-finished product removal station, implant the PCB semi-finished product located at the semi-finished product flipping station into the B-side carrier located at the finished product removal station, and transport the PCB finished product located in the B-side carrier of the finished product removal station to the finished product output mechanism.

[0016] A vehicle collection mechanism, installed on the frame, is used to collect empty vehicles on side A and side B.

[0017] A carrier transfer mechanism, installed on the frame, is used to transport the A-side carrier located in the empty space of the semi-finished product dismantling station and the B-side carrier located in the empty space of the finished product dismantling station to the carrier collection mechanism.

[0018] The fully automated board removal and installation machine according to the above scheme also includes:

[0019] The finished product flipping mechanism is installed on the frame and is used to transport the finished PCB board located at the finished product disassembly station to the finished product flipping station as needed, and flip it 180°.

[0020] The PCB disassembly and transplantation mechanism is also used to transport the finished PCB board located at the finished product flipping station to the finished product output mechanism.

[0021] Furthermore, the PCB removal and transplanting mechanism includes:

[0022] The first PCB removal and transplanting robot is installed on the frame and is used to implant the PCB blank supplied by the blank board loading mechanism into the A-side carrier located at the semi-finished product removal station, and to transport the PCB finished product located at the finished product flipping station to the finished product output mechanism.

[0023] The second PCB removal and transplanting robot is mounted on the frame and symmetrically arranged with the first PCB removal and transplanting robot. It is used to implant the PCB semi-finished product located at the semi-finished product flipping station into the B-side carrier located at the finished product removal and transplanting station, and to transport the PCB finished product located in the B-side carrier at the finished product removal and transplanting station to the finished product output mechanism.

[0024] According to the above-described fully automatic board removal and placement machine, the bare board loading mechanism includes a first lifting module, and the lifting end of the first lifting module is provided with a first lifting platform for placing bare board boxes, and the bare board boxes are used to stack PCB bare boards.

[0025] According to the above-described fully automatic board removal and replanting machine, the bare board feeding mechanism is located below the output end of the finished product output mechanism;

[0026] The finished product output mechanism includes a cylinder drive mechanism, a primary moving plate, a secondary moving plate, a transmission belt, and a finished product output track. The cylinder drive mechanism is fixed on the frame, and its drive end is connected to one side of the primary moving plate. The bottom of the primary moving plate is slidably connected to the frame via a first linear slide rail, and the bottom of the secondary moving plate is slidably connected to the top of the primary moving plate via a second linear slide rail. The transmission belt is located on the other side of the primary moving plate, and its lower side is connected to the frame via a first connector. Its upper side is connected to the secondary moving plate via a second connector. The finished product output track is located on the secondary moving plate, and its output end is connected to a lower-level machine.

[0027] According to the fully automated board removal and installation machine of the above scheme, the carrier collection mechanism includes:

[0028] An A-side vehicle collection mechanism, mounted on the frame, is used to collect empty A-side vehicles;

[0029] The B-side vehicle collection mechanism is installed on the frame and arranged side by side with the A-side vehicle collection mechanism, and is used to collect empty B-side vehicles;

[0030] The vehicle transfer mechanism includes:

[0031] A-side carrier transfer mechanism, installed on the frame, is used to transport the A-side carrier located in the empty semi-finished product dismantling station to the A-side carrier collection mechanism;

[0032] The B-side carrier transfer mechanism is installed on the frame and symmetrically arranged with the A-side carrier transfer mechanism. It is used to transport the B-side carrier located in the empty space of the finished product dismantling station to the B-side carrier collection mechanism.

[0033] Furthermore, the A-side vehicle collection mechanism and the B-side vehicle collection mechanism have the same structure;

[0034] The A-side vehicle collection mechanism includes a second lifting module. The lifting end of the second lifting module is provided with a second lifting platform for stacking and storing A-side vehicles. Anti-tipping positioning panels are provided on the two adjacent sides of the second lifting platform, and the top of each of the two adjacent anti-tipping positioning panels is provided with a vehicle alignment component for aligning the position of the A-side vehicles.

[0035] Furthermore, the vehicle alignment assembly includes a linear drive module and a vehicle alignment plate. The linear drive module is fixed to the top of the corresponding anti-tipping positioning plate, and the drive end of the linear drive module is connected to the vehicle alignment plate. The linear drive module is used to drive the vehicle alignment plate to move along the direction of the adjacent anti-tipping positioning plate.

[0036] According to the above-described fully automatic board removal and installation machine, the semi-finished product flipping mechanism includes a first lifting mechanism and a flipping mechanism. The first lifting mechanism is fixed on the frame, and the flipping mechanism is connected to the lifting end of the first lifting mechanism. The flipping end of the flipping mechanism is provided with a flipping arm, and the flipping arm is provided with a vacuum suction cup for picking up the semi-finished PCB board.

[0037] The fully automated board removal and installation machine according to the above scheme also includes:

[0038] The A-side carrier unlocking and positioning mechanism is installed on the semi-finished product dismantling and planting station and is used to position and unlock the A-side carrier that is transported to the semi-finished product dismantling and planting station.

[0039] The B-side carrier unlocking and positioning mechanism is installed on the finished product dismantling station and is used to position and unlock the B-side carrier that is transported to the finished product dismantling station.

[0040] Furthermore, the unlocking and positioning mechanism of the A-side vehicle and the unlocking and positioning mechanism of the B-side vehicle have the same structure;

[0041] The A-side vehicle unlocking and positioning mechanism includes a second lifting mechanism fixed on the frame, a positioning base plate disposed at the lifting end of the second lifting mechanism, and four unlocking cylinders respectively disposed horizontally at the four corners of the bottom of the positioning base plate. The telescopic ends of the four unlocking cylinders are provided with pins for positioning and unlocking the A-side vehicle.

[0042] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0043] 1. By integrating multiple processes and equipment, a single machine achieves a fully automated process from raw board loading, carrier unlocking, A / B side board removal and installation, board flipping, empty carrier collection, to finished product output. This significantly reduces the time and labor costs of material transfer between equipment, thereby improving overall production efficiency. Due to the reduction in the number of individually operated equipment and personnel, the fully automatic board removal and installation machine helps reduce production costs, including equipment purchase costs, maintenance costs, and labor costs.

[0044] 2. By setting up semi-finished product conveying tracks and finished product conveying tracks, compatibility with both finished and semi-finished PCB products is achieved;

[0045] 3. By setting up a finished product flipping mechanism, it is possible to flexibly adjust according to customer needs, such as whether a flipping plate is required, to meet diverse production needs;

[0046] 4. To prevent damage to the PCB board during the flipping mechanism, the flipping mechanism is first lifted and then flipped to eliminate the angle between the PCB board and the track during flipping;

[0047] 5. To improve the accuracy of board removal and replanting, a carrier unlocking and positioning mechanism is used to precisely position and unlock the incoming carrier, and then the position of the PCB board picked up by the PCB removal and replanting mechanism is corrected by software through a camera component. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic diagram of the structure of a fully automatic board removal and installation machine according to an embodiment of the present invention;

[0050] Figure 2 This is a top view of a fully automatic board removal and installation machine according to an embodiment of the present invention;

[0051] Figure 3 This is a schematic diagram of the plate loading mechanism in one embodiment of the present invention;

[0052] Figure 4 This is a schematic diagram of the finished product output mechanism in one embodiment of the present invention;

[0053] Figure 5 This is a schematic diagram of the finished product output mechanism from another perspective in one embodiment of the present invention;

[0054] Figure 6 This is a schematic diagram of the structure of the vehicle collection mechanism on side A in one embodiment of the present invention;

[0055] Figure 7 This is a schematic diagram of the semi-finished product flipping mechanism in one embodiment of the present invention;

[0056] Figure 8 This is a schematic diagram of the structure of the vehicle unlocking and positioning mechanism on side A in one embodiment of the present invention.

[0057] In the diagram,

[0058] 1. Frame; 2. Plate loading mechanism; 21. First lifting module; 22. First lifting platform; 3. Finished product output mechanism; 4. Semi-finished product conveying track; 5. Finished product conveying track; 51. Cylinder drive mechanism; 52. First-stage moving plate; 53. Second-stage moving plate; 54. Transmission belt; 55. Finished product output track; 56. First linear slide rail; 57. Second linear slide rail; 58. First connector; 59. Second connector; 6. A-side carrier unlocking and positioning mechanism; 61. Second lifting mechanism; 62. Positioning base plate; 63. Unlocking cylinder; 64. Pin; 7. B-side carrier unlocking and positioning mechanism; 8. Semi-finished product flipping mechanism; 81. First lifting mechanism; 82. Flipping mechanism; 821. Flipping 822. Vacuum suction cup; 9. Finished product flipping mechanism; 10. PCB disassembly and transplanting mechanism; 101. First PCB disassembly and transplanting robot; 102. Second PCB disassembly and transplanting robot; 11. Carrier collection mechanism; 111. A-side carrier collection mechanism; 1111. Second lifting module; 1112. Second lifting platform; 1113. Anti-tipping positioning enclosure; 1114. Carrier straightening assembly; 11141. Linear drive module; 11142. Carrier straightening plate; 112. B-side carrier collection mechanism; 12. Carrier transplanting mechanism; 121. A-side carrier transplanting mechanism; 122. B-side carrier transplanting mechanism; 13. First lower vision positioning camera; 14. Second lower vision positioning camera. Detailed Implementation

[0059] To make the technical problems, technical solutions, and beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It is also stated that the embodiments described below are for illustrative purposes only and are not intended to limit the invention.

[0060] It should be noted that the terms "installation," "setting," "connection," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly defined. Indications of orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used in the application's product, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0061] Please see Figure 1 , Figure 2 The present invention provides a fully automatic board removal and replanting machine, including a frame 1 and a bare board loading mechanism 2, a finished product output mechanism 3, a semi-finished product conveying track 4, a finished product conveying track 5, an A-side carrier unlocking and positioning mechanism 6, a B-side carrier unlocking and positioning mechanism 7, a semi-finished product flipping mechanism 8, a finished product flipping mechanism 9, a PCB removal and replanting mechanism 10, a carrier collection mechanism 11, and a carrier transplanting mechanism 12.

[0062] Among them, the bare board feeding mechanism 2 is used to supply bare PCB boards.

[0063] The finished product output mechanism 3 is used to output the finished PCB board.

[0064] The semi-finished product conveying track 4 is used to receive empty or loaded A-side carriers containing PCB semi-finished products, and to transport the A-side carriers to the semi-finished product disassembly and assembly station, as well as to output A-side carriers loaded with bare PCB boards.

[0065] The finished product conveying track 5 is used to receive empty or loaded B-side carriers containing finished PCB boards, and to transport the B-side carriers to the finished product disassembly and assembly station, as well as to output B-side carriers loaded with semi-finished PCBs.

[0066] The A-side carrier unlocking and positioning mechanism 6 is used to position and unlock the A-side carrier that is transported to the semi-finished product dismantling station.

[0067] The B-side carrier unlocking and positioning mechanism 7 is used to position and unlock the B-side carrier transported to the finished product removal and placement station. Since both the A-side and B-side carriers are equipped with springs for locking the PCB board, in order for the PCB removal and placement mechanism 10 to smoothly place the PCB board into or remove it from the A-side and B-side carriers, the A-side carrier unlocking and positioning mechanism 6 and the B-side carrier unlocking and positioning mechanism 7 need to unlock the A-side and B-side carriers during the removal and placement process.

[0068] The semi-finished product flipping mechanism 8 is used to transport the PCB board semi-finished product located at the semi-finished product disassembly station to the semi-finished product flipping station and flip it 180°.

[0069] The finished product flipping mechanism 9 is used to transport the finished PCB board located at the finished product disassembly station to the finished product flipping station according to the requirements, and flip it 180°.

[0070] The PCB removal and transplanting mechanism 10 is used to implant the PCB blank supplied by the blank board loading mechanism 2 into the A-side carrier located at the semi-finished product removal station, implant the PCB semi-finished product located at the semi-finished product flipping station into the B-side carrier located at the finished product removal station, transport the PCB finished product located in the B-side carrier at the finished product removal station to the finished product output mechanism 3, and transport the PCB finished product located at the finished product flipping station to the finished product output mechanism 3.

[0071] The vehicle collection mechanism 11 is used to collect empty vehicles on side A and side B.

[0072] The carrier transfer mechanism 12 is used to transport the A-side carrier located in the empty semi-finished product dismantling station and the B-side carrier located in the empty finished product dismantling station to the carrier collection mechanism 11.

[0073] Working principle:

[0074] First, the semi-finished product conveying track 4 receives the empty A-side carrier from the host computer and transports the A-side carrier to the semi-finished product disassembly and implantation station; the A-side carrier unlocking and positioning mechanism 6 positions and unlocks the A-side carrier transported to the semi-finished product disassembly and implantation station; the PCB disassembly and implantation mechanism 10 uses the bare board feeding mechanism 2 to implant the bare PCB board into the A-side carrier located at the semi-finished product disassembly and implantation station; the semi-finished product conveying track 4 transports the A-side carrier loaded with the bare PCB board to the SMT mainline reflow oven for A-side processing to form a semi-finished PCB board.

[0075] Secondly, the semi-finished product conveying track 4 receives the A-side carrier loaded with PCB semi-finished products from the host computer and conveys the A-side carrier to the semi-finished product disassembly and assembly station; the A-side carrier unlocking and positioning mechanism 6 positions and unlocks the A-side carrier conveyed to the semi-finished product disassembly and assembly station; the semi-finished product flipping mechanism 8 conveys the PCB semi-finished products located at the semi-finished product disassembly and assembly station to the semi-finished product flipping station and flips them 180°; the finished product conveying track 5 receives the empty B-side carrier from the host computer and conveys the B-side carrier to the finished product disassembly and assembly station. Position; B-side carrier unlocking and positioning mechanism 7 positions and unlocks the B-side carrier transported to the finished product dismantling station; PCB dismantling and transplanting mechanism 10 implants the PCB board semi-finished product after being flipped at the semi-finished product flipping station into the B-side carrier at the finished product dismantling station; carrier transplanting mechanism 12 transports the empty A-side carrier at the semi-finished product dismantling station to the carrier collection mechanism 11 for temporary storage; finished product conveying track 5 transports the B-side carrier loaded with PCB semi-finished product to the SMT main line reflow oven for B-side processing to form the finished PCB board;

[0076] Then, the finished product conveying track 5 receives the B-side carrier loaded with the finished PCB board from the host computer and transports the B-side carrier to the finished product dismantling station; the B-side carrier unlocking and positioning mechanism 7 positions and unlocks the B-side carrier transported to the finished product dismantling station. At this time, if the customer does not have a board flipping requirement, the PCB disassembly and relocation mechanism 10 will transport the finished PCB board in the B-side carrier at the finished product disassembly station to the finished product output mechanism 3. The finished product output mechanism 3 will then transport the finished PCB board to the lower-level machine. The carrier transfer mechanism 12 will transport the empty B-side carrier at the finished product disassembly station to the carrier collection mechanism 11 for temporary storage. If the customer has a board flipping requirement, the finished product flipping mechanism 9 will transport the finished PCB board at the finished product disassembly station to the finished product flipping station and flip it 180°. The PCB disassembly and relocation mechanism 10 will then transport the flipped PCB board at the finished product flipping station to the finished product output mechanism 3. The finished product output mechanism 3 will then transport the flipped PCB board to the lower-level machine. The carrier transfer mechanism 12 will transport the empty B-side carrier at the finished product disassembly station to the carrier collection mechanism 11 for temporary storage.

[0077] The fully automatic PCB demounting and remounting machine of this invention integrates multiple processes and equipment, realizing a fully automated process from bare board loading, carrier unlocking, A / B side board demounting and remounting, board flipping, empty carrier collection, to finished product output in a single machine. This significantly reduces the time and labor costs of material transfer between equipment, thereby improving overall production efficiency. By reducing the number of individually operated equipment and personnel, the fully automatic PCB demounting and remounting machine helps reduce production costs, including equipment purchase costs, maintenance costs, and labor costs. By setting up semi-finished product conveying track 4 and finished product conveying track 5, it achieves compatibility with both finished and semi-finished PCB products. By setting up a finished product flipping mechanism 9, it can be flexibly adjusted according to customer needs, such as whether board flipping is required, to meet diverse production needs.

[0078] Please see Figure 1 , Figure 2 In one embodiment, the PCB removal and transplanting mechanism 10 includes a first PCB removal and transplanting robot 101 and a second PCB removal and transplanting robot 102. Both the first PCB removal and transplanting robot 101 and the second PCB removal and transplanting robot 102 are mounted on the frame 1, and the second PCB removal and transplanting robot 102 is symmetrically arranged with the first PCB removal and transplanting robot 101. The first PCB removal and transplanting robot 101 is used to implant the PCB blanks supplied by the blank board loading mechanism 2 into the A-side carrier located at the semi-finished product removal and transplanting station, and to transport the finished PCB board located at the finished product flipping station to the finished product output mechanism 3. The second PCB removal and transplanting robot 102 is used to implant the semi-finished PCB board located at the semi-finished product flipping station into the B-side carrier located at the finished product removal and transplanting station, and to transport the finished PCB board located in the B-side carrier at the finished product removal and transplanting station to the finished product output mechanism 3.

[0079] The aforementioned PCB removal and transplanting mechanism 10, through the coordinated operation of the first PCB removal and transplanting robot 101 and the second PCB removal and transplanting robot 102, can handle different processes simultaneously. For example, when the first PCB removal and transplanting robot 101 implants the bare PCB board into the A-side carrier, the second PCB removal and transplanting robot 102 can simultaneously remove the finished PCB board or implant the semi-finished PCB board from the B-side carrier. This parallel operation significantly improves the overall efficiency of the production line. In addition, the symmetrically arranged first PCB removal and transplanting robot 101 and second PCB removal and transplanting robot 102 can be responsible for different areas on the production line, making the workflow clearer and more orderly, and reducing interference and waiting time between robots.

[0080] It should be noted that since the first PCB removal and transplantation robot 101 and the second PCB removal and transplantation robot 102 are existing technologies, the present invention will not describe their specific structure and working principle in detail.

[0081] Please see Figure 2 In one embodiment, the frame 1 is further equipped with a first lower visual positioning camera 13 and a second lower visual positioning camera 14 for taking upward-facing pictures. The first lower visual positioning camera 13 is located below the movement path of the first PCB removal and transplanting robot 101, and the second lower visual positioning camera 14 is located below the movement path of the second PCB removal and transplanting robot 102. The first lower visual positioning camera 13 and the second lower visual positioning camera 14 can take pictures of the PCB boards picked up by the first PCB removal and transplanting robot 101 and the second PCB removal and transplanting robot 102 from below, thereby performing software correction on the position of the PCB boards picked up by the first PCB removal and transplanting robot 101 and the second PCB removal and transplanting robot 102 to improve the removal and transplanting accuracy.

[0082] Please see Figure 1 , Figure 2 In one embodiment, the vehicle collection mechanism 11 includes an A-side vehicle collection mechanism 111 and a B-side vehicle collection mechanism 112, both of which are mounted on the frame 1 and are arranged side-by-side with the A-side vehicle collection mechanism 111. The vehicle transfer mechanism 12 includes an A-side vehicle transfer mechanism 121 and a B-side vehicle transfer mechanism 122, both of which are mounted on the frame 1 and are arranged symmetrically with the A-side vehicle transfer mechanism 121. The A-side carrier collection mechanism 111 is used to collect empty A-side carriers; the B-side carrier collection mechanism 112 is used to collect empty B-side carriers; the A-side carrier transfer mechanism 121 is used to transport empty A-side carriers located at the semi-finished product dismantling station to the A-side carrier collection mechanism 111; and the B-side carrier transfer mechanism 122 is used to transport empty B-side carriers located at the finished product dismantling station to the B-side carrier collection mechanism 112.

[0083] The aforementioned vehicle collection mechanism 11, through the A-side vehicle collection mechanism 111 and the B-side vehicle collection mechanism 112, can separately collect vehicles on side A and side B, avoiding confusion and ensuring that each type of vehicle can be correctly managed and used. The vehicle collection mechanism 11, through the A-side vehicle collection mechanism 111 and the B-side vehicle collection mechanism 112, ensures that the transfer process of each type of vehicle can be precisely controlled separately, ensuring that each vehicle can be accurately and quickly transported to the designated location, and avoiding interference and waiting between different vehicles, thereby improving the efficiency of the transfer process and reducing errors caused by confusion.

[0084] It should be noted that since the A-side vehicle transfer mechanism 121 and the B-side vehicle transfer mechanism 122 are existing technologies, their specific structures and working principles will not be described in detail in this invention.

[0085] Please see Figure 3 In one embodiment, the PCB loading mechanism 2 includes a first lifting module 21. The lifting end of the first lifting module 21 is provided with a first lifting platform 22 for placing a PCB box, which is used to stack PCBs. The PCB loading mechanism 2 described above, in conjunction with the PCB box, can load a large number of PCBs at once, greatly improving the loading speed and eliminating the need for frequent loading.

[0086] Please see Figure 1 , Figure 2 , Figure 4 , Figure 5 In one embodiment, the blank plate feeding mechanism 2 is located below the output end of the finished product output mechanism 3; the finished product output mechanism 3 includes a cylinder drive mechanism 51, a primary moving plate 52, a secondary moving plate 53, a transmission belt 54, and a finished product output track 55. The cylinder drive mechanism 51 is fixed on the frame 1, and the drive end of the cylinder drive mechanism 51 is connected to one side of the primary moving plate 52. The bottom of the primary moving plate 52 is slidably connected to the frame 1 through a first linear slide rail 56. The bottom of the secondary moving plate 53 is slidably connected to the top of the primary moving plate 52 through a second linear slide rail 57. The transmission belt 54 is disposed on the other side of the primary moving plate 52. The lower side of the transmission belt 54 is connected to the frame 1 through a first connecting member 58, and the upper side of the transmission belt 54 is connected to the secondary moving plate 53 through a second connecting member 59. The finished product output track 55 is disposed on the secondary moving plate 53, and the output end of the finished product output track 55 is connected to the lower-level machine. The finished product output track 55 is used to transport finished PCB boards. The cylinder drive mechanism 51, through the transmission of the first-stage moving plate 52, the second-stage moving plate 53, and the transmission belt 54, can drive the finished product output track 55 to move back and forth in the driving direction. This allows the finished product output track 55 to smoothly receive the finished PCB boards transported by the first PCB removal and transplanting robot 101 or the second PCB removal and transplanting robot 102. The finished PCB boards can then be connected to the lower-level machine via the bare board loading mechanism 2 to output them to the lower-level machine. The finished product output mechanism 3, with the above-described structure, effectively utilizes space, reduces the equipment footprint, and makes the entire production line more compact and efficient.

[0087] Please see Figure 6In one embodiment, the A-side carrier collection mechanism 111 includes a second lifting module 1111. The lifting end of the second lifting module 1111 is provided with a second lifting platform 1112 for stacking and storing A-side carriers. Anti-tipping positioning plates 1113 are provided on the adjacent sides of the second lifting platform 1112. The A-side carrier collection mechanism 111, through the cooperation of the second lifting module 1111, the second lifting platform 1112, and the anti-tipping positioning plates 1113, can temporarily store a large number of A-side carriers at once, significantly improving the storage efficiency of the production line and reducing the time cost of frequent carrier changes and movements. The anti-tipping positioning plates 1113 effectively prevent the A-side carriers from tipping over and misaligning during stacking and storage, improving storage stability. Furthermore, the anti-tipping positioning plates 1113 not only provide protection but also, through their structural design, guide the A-side carriers to be neatly arranged, reducing operational errors and safety hazards caused by carrier disorder.

[0088] Furthermore, each of the two adjacent anti-tipping positioning panels 1113 is equipped with a vehicle alignment component 1114 for aligning the position of the A-side vehicle. The vehicle alignment component 1114 includes a linear drive module 11141 and a vehicle alignment plate 11142. The linear drive module 11141 is fixed to the top of the corresponding anti-tipping positioning panel 1113, and its drive end is connected to the vehicle alignment plate 11142. The linear drive module 11141 is used to drive the vehicle alignment plate 11142 to move along the adjacent anti-tipping positioning panel 1113. The aforementioned vehicle alignment component 1114 allows adjustment of the movement range and force of the vehicle alignment plate 11142 according to actual needs, ensuring that A-side vehicles of different sizes and weights can be properly aligned.

[0089] It should be noted that since the structure of the B-side vehicle collection mechanism 112 is the same as that of the A-side vehicle collection mechanism 111, the present invention will not elaborate on the specific structure and working principle of the B-side vehicle collection mechanism 112.

[0090] Please see Figure 7In one embodiment, the semi-finished product flipping mechanism 8 includes a first lifting mechanism 81 and a flipping mechanism 82. The first lifting mechanism 81 is fixed on the frame 1, and the flipping mechanism 82 is connected to the lifting end of the first lifting mechanism 81. The flipping end of the flipping mechanism 82 is provided with a flipping arm 821, and the flipping arm 821 is provided with a vacuum suction cup 822 for picking up the PCB board semi-finished product. In order to prevent damage to the PCB board semi-finished product during flipping, the semi-finished product flipping mechanism 8 first lifts the flipping mechanism 82 a certain distance through the first lifting mechanism 81, and then the flipping mechanism 82 drives the flipping arm 821 to flip, thereby picking up the PCB board semi-finished product through the vacuum suction cup 822. This eliminates the angle between the PCB board semi-finished product and the semi-finished product conveying track 4 during flipping, and avoids collision between the PCB board semi-finished product and the semi-finished product conveying track 4 during flipping.

[0091] It should be noted that since the finished product flipping mechanism 9 and the semi-finished product flipping mechanism 8 have the same structure, the present invention will not elaborate on the specific structure and working principle of the finished product flipping mechanism 9.

[0092] Please see Figure 8 In one embodiment, the A-side carrier unlocking and positioning mechanism 6 includes a second lifting mechanism 61 fixed on the frame 1, a positioning base plate 62 disposed at the lifting end of the second lifting mechanism 61, and four unlocking cylinders 63 respectively horizontally disposed at the four corners of the bottom of the positioning base plate 62. The telescopic ends of the four unlocking cylinders 63 are provided with pins 64 for positioning and unlocking the A-side carrier. When the A-side carrier is transported to the semi-finished product disassembly and implantation station, the second lifting mechanism 61 drives the positioning base plate 62 to rise. This rising action allows the positioning base plate 62 to lift the A-side carrier and accurately position the A-side carrier through the pins 64 disposed at the telescopic ends of the unlocking cylinders 63. Once the A-side carrier is stably positioned, the four unlocking cylinders 63 will start to work, driving their respective pins 64 to move outward. The outward movement of the four pins 64 can release the locking state of the spring members on the A-side carrier. In addition, the PCB disassembly and implantation mechanism 10 can smoothly place the PCB board into the A-side carrier or remove the PCB board from the A-side carrier. The aforementioned A-side vehicle unlocking and positioning mechanism 6, through its ingenious design and efficient operation, not only improves production efficiency but also ensures the accuracy and stability of operation.

[0093] It should be noted that since the B-side vehicle unlocking and positioning mechanism 7 and the A-side vehicle unlocking and positioning mechanism 6 have the same structure, the present invention will not elaborate on the specific structure and working principle of the B-side vehicle unlocking and positioning mechanism 7.

[0094] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0095] The present invention has been described above with reference to the accompanying drawings. Obviously, the implementation of the present invention is not limited to the above-described manner. Any improvements made using the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A fully automatic board removal and installation machine, characterized in that, include: frame; A blank board feeding mechanism, mounted on the frame, is used to supply blank PCB boards; A finished product output mechanism, mounted on the frame, is used to output finished PCB boards; A semi-finished product conveying track is installed on the frame to receive empty or loaded A-side carriers containing PCB semi-finished products, transport the A-side carriers to the semi-finished product disassembly and assembly station, and output A-side carriers loaded with bare PCB boards. The finished product conveying track is installed on the frame and is used to receive empty or loaded B-side carriers of finished PCB boards, and to transport the B-side carriers to the finished product disassembly and assembly station, as well as to output B-side carriers loaded with semi-finished PCBs. A semi-finished product flipping mechanism is installed on the frame to transport the PCB board semi-finished product located at the semi-finished product disassembly station to the semi-finished product flipping station and flip it 180°. A PCB removal and transplanting mechanism is installed on the frame and is used to implant the PCB blank supplied by the blank board loading mechanism into the A-side carrier located at the semi-finished product removal station, implant the PCB semi-finished product located at the semi-finished product flipping station into the B-side carrier located at the finished product removal station, and transport the PCB finished product located in the B-side carrier of the finished product removal station to the finished product output mechanism. A vehicle collection mechanism, installed on the frame, is used to collect empty vehicles on side A and side B. A carrier transfer mechanism, installed on the frame, is used to transport the A-side carrier located in the empty space of the semi-finished product dismantling station and the B-side carrier located in the empty space of the finished product dismantling station to the carrier collection mechanism. The finished product flipping mechanism is installed on the frame and is used to transport the finished PCB board located at the finished product disassembly station to the finished product flipping station as needed, and flip it 180°. The PCB disassembly and transplantation mechanism is also used to transport the finished PCB board located at the finished product flipping station to the finished product output mechanism; The blanking plate feeding mechanism is located below the output end of the finished product output mechanism; The finished product output mechanism includes a cylinder drive mechanism, a primary moving plate, a secondary moving plate, a transmission belt, and a finished product output track. The cylinder drive mechanism is fixed on the frame, and its drive end is connected to one side of the primary moving plate. The bottom of the primary moving plate is slidably connected to the frame via a first linear slide rail, and the bottom of the secondary moving plate is slidably connected to the top of the primary moving plate via a second linear slide rail. The transmission belt is located on the other side of the primary moving plate, and its lower side is connected to the frame via a first connector. Its upper side is connected to the secondary moving plate via a second connector. The finished product output track is located on the secondary moving plate, and its output end is connected to a lower-level machine. The semi-finished product flipping mechanism includes a first lifting mechanism and a flipping mechanism. The first lifting mechanism is fixed on the frame, and the flipping mechanism is connected to the lifting end of the first lifting mechanism. The flipping end of the flipping mechanism is provided with a flipping arm, and the flipping arm is provided with a vacuum suction cup for picking up the PCB board semi-finished product.

2. The fully automatic board removal and installation machine according to claim 1, characterized in that, The PCB removal and transplanting mechanism includes: The first PCB removal and transplanting robot is installed on the frame and is used to implant the PCB blank supplied by the blank board loading mechanism into the A-side carrier located at the semi-finished product removal station, and to transport the PCB finished product located at the finished product flipping station to the finished product output mechanism. The second PCB removal and transplanting robot is mounted on the frame and symmetrically arranged with the first PCB removal and transplanting robot. It is used to implant the PCB semi-finished product located at the semi-finished product flipping station into the B-side carrier located at the finished product removal and transplanting station, and to transport the PCB finished product located in the B-side carrier at the finished product removal and transplanting station to the finished product output mechanism.

3. The fully automatic board removal and installation machine according to claim 1, characterized in that, The light board loading mechanism includes a first lifting module, and the lifting end of the first lifting module is provided with a first lifting platform for placing the light board box, and the light board box is used to stack PCB light boards.

4. The fully automatic board removal and installation machine according to claim 1, characterized in that, The vehicle collection mechanism includes: An A-side vehicle collection mechanism, mounted on the frame, is used to collect empty A-side vehicles; The B-side vehicle collection mechanism is installed on the frame and arranged side by side with the A-side vehicle collection mechanism, and is used to collect empty B-side vehicles; The vehicle transfer mechanism includes: The A-side carrier transfer mechanism is installed on the frame and is used to transport the A-side carrier located in the empty semi-finished product dismantling station to the A-side carrier collection mechanism. The B-side carrier transfer mechanism is installed on the frame and symmetrically arranged with the A-side carrier transfer mechanism. It is used to transport the B-side carrier located in the empty space of the finished product dismantling station to the B-side carrier collection mechanism.

5. The fully automatic board removal and installation machine according to claim 4, characterized in that, The A-side vehicle collection mechanism and the B-side vehicle collection mechanism have the same structure; The A-side vehicle collection mechanism includes a second lifting module. The lifting end of the second lifting module is provided with a second lifting platform for stacking and storing A-side vehicles. Anti-tipping positioning panels are provided on the two adjacent sides of the second lifting platform, and the top of each of the two adjacent anti-tipping positioning panels is provided with a vehicle alignment component for aligning the position of the A-side vehicles.

6. The fully automatic board removal and installation machine according to claim 1, characterized in that, Also includes: The A-side carrier unlocking and positioning mechanism is installed on the semi-finished product dismantling and planting station and is used to position and unlock the A-side carrier that is transported to the semi-finished product dismantling and planting station. The B-side carrier unlocking and positioning mechanism is installed on the finished product dismantling station and is used to position and unlock the B-side carrier that is transported to the finished product dismantling station.

7. The fully automatic board removal and installation machine according to claim 6, characterized in that, The unlocking and positioning mechanism of the vehicle on side A and the unlocking and positioning mechanism of the vehicle on side B have the same structure; The A-side vehicle unlocking and positioning mechanism includes a second lifting mechanism fixed on the frame, a positioning base plate disposed at the lifting end of the second lifting mechanism, and four unlocking cylinders respectively disposed horizontally at the four corners of the bottom of the positioning base plate. The telescopic ends of the four unlocking cylinders are provided with pins for positioning and unlocking the A-side vehicle.

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