Temperature sensor module and electronic device using the same

Abstract

The present invention is provided with: a temperature sensor (320) that outputs a detection signal corresponding to the temperature; a mounting part (370) on which the temperature sensor (320) is mounted; and a sealing member (340) that seals the temperature sensor (320) and the mounting part (370), the sealing member (340) having a heat conduction member (371) that is disposed on the sealing member (350) so that a portion thereof is exposed from the sealing member (350), is thermally connected to the temperature sensor (320), and is made of a material having a higher thermal conductivity than the sealing member (340), and the heat conduction member (371) is used in a state in which the heat conduction member (371) is in contact with the portion to be measured.

Description

[0001] Cross-reference to related applications

[0002] This application is based on Japanese Patent Application No. 2022-135105 filed on August 26, 2022, Japanese Patent Application No. 2023-129552 filed on August 8, 2023, and Japanese Patent Application No. 2023-135642 filed on August 23, 2023, and their recorded contents are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a temperature sensor module and an electronic device using the temperature sensor module. Background Art

[0004] Conventionally, a temperature sensor module having a temperature sensor has been proposed (for example, see Non-Patent Document 1). Specifically, the temperature sensor module is configured such that the temperature sensor is disposed on a substrate, and the substrate and the temperature sensor are sealed by a sealing member made of resin.

[0005] Prior art literature

[0006] Non-patent literature

[0007] Non-patent document 1: Jun Sakata, Card-type temperature sensor, Toyota Technical Disclosure Collection, February 28, 2022, Issue No. 33549 Summary of the invention

[0008] However, the inventors of the present invention have studied the configuration of a semiconductor module in which a heat generating element is arranged on a substrate and sealed with a sealing member, and the temperature sensor module is configured in the cooling device to form an electronic device. Specifically, the cooling device is configured to have a flow path for a cooling medium such as cooling water to pass through so that the semiconductor module can be cooled. In addition, the semiconductor module and the temperature sensor module are configured in a manner that abuts the cooling device. In addition, the temperature sensor configured in the temperature sensor module outputs a detection signal corresponding to the temperature of the cooling medium.

[0009] However, in such an electronic device, according to the study of the present inventors, it has been confirmed that the detection accuracy of the temperature sensor may be reduced depending on the configuration of the temperature sensor module.

[0010] An object of the present disclosure is to provide a temperature sensor module capable of suppressing a decrease in detection accuracy of a temperature sensor and an electronic device using the temperature sensor module.

[0011] According to one aspect of the present disclosure, a temperature sensor module comprises: a temperature sensor that outputs a detection signal corresponding to a temperature; a mounting portion that mounts the temperature sensor; and a sealing component that seals the temperature sensor and the mounting portion. The temperature sensor module has a heat-conducting component that is arranged on the sealing component in a manner such that a portion of the heat-conducting component is exposed from the sealing component, is thermally connected to the temperature sensor, and is composed of a material with a higher thermal conductivity than the sealing component. The heat-conducting component is used in a state of abutting against a measurement object portion.

[0012] Thus, the temperature sensor module is used by being arranged so that the heat-conductive member contacts the measurement target portion. Therefore, the temperature of the measurement target portion is easily transmitted to the temperature sensor via the heat-conductive member, and the detection accuracy can be improved.

[0013] According to another aspect of the present disclosure, an electronic device comprises: a semiconductor module having a heating element that generates heat by flowing an electric current; a cooling device having a flow path through which a cooling medium for cooling the semiconductor module flows; and the above-mentioned temperature sensor module, the cooling device comprising: an inlet pipe for the cooling medium to flow in; an outlet pipe for the cooling medium to flow out; and a connecting pipe connecting the inlet pipe and the outlet pipe, the semiconductor module is configured in a state of abutting the connecting pipe, and the temperature sensor module is configured in a state of abutting the heat conductive component against the connecting pipe.

[0014] Thus, the temperature sensor module is arranged so that the heat-conducting member contacts the connecting pipe. Therefore, the temperature of the cooling medium is easily transmitted to the temperature sensor via the heat-conducting member, and the detection accuracy can be improved.

[0015] In addition, the reference numerals in parentheses attached to each component etc. show an example of the correspondence relationship between the component etc. and the specific component etc. described in the embodiment described later. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a circuit diagram of the electronic device in the first embodiment.

[0017] Figure 2 It is a front view of the electronic device in the first embodiment.

[0018] Figure 3 is from Figure 2 A top view of the temperature sensor module viewed in the direction of arrow III.

[0019] Figure 4 It is omitted Figure 3 Schematic diagram of the sealing components in FIG.

[0020] Figure 5 This is a diagram showing the relationship between the temperature of cooling water and the temperature detected by the temperature sensor.

[0021] Figure 6 Schematic diagram of a temperature sensor module according to a second embodiment.

[0022] Figure 7 FIG. 1 is a schematic diagram of a temperature sensor module according to a third embodiment.

[0023] Figure 8 It is a top view of a temperature sensor module according to a fourth embodiment.

[0024] Fig. 9 It is a top view of a temperature sensor module according to a fourth embodiment.

[0025] Fig.10 It is a top view of a temperature sensor module according to a fourth embodiment.

[0026] Fig.11 It is along Fig.10 Cross-sectional view along line XI-XI.

[0027] Fig.12 It is a front view of the electronic device in the fourth embodiment.

[0028] Fig.13 It is a front view of the electronic device in the fifth embodiment.

[0029] Fig.14 It is a cross-sectional view of a temperature sensor module according to a sixth embodiment.

[0030] Fig.15 It is a front view of an electronic device in another embodiment.

[0031] Fig.16 It is a front view of an electronic device in another embodiment. DETAILED DESCRIPTION

[0032] Hereinafter, embodiments of the present disclosure will be described based on the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals for description.

[0033] (First Embodiment)

[0034] The electronic device of the first embodiment will be described with reference to the drawings. In addition, the following description will be given by taking a power conversion device as an example of the electronic device. In addition, such an electronic device is preferably mounted on a vehicle for use, for example.

[0035] First, the circuit structure of the electronic device in this embodiment is described. Figure 1 As shown, the electronic device of this embodiment is configured to drive a three-phase motor as a load 1, and includes a power supply 10, a boost circuit 20, an inverter circuit 40, a control unit 50, and the like.

[0036] The power source 10 is constituted by a battery or the like mounted on the vehicle, and supplies a DC voltage.

[0037] The boost circuit 20 is configured to include a first capacitor 21, a first discharge resistor 22, a first discharge switch element 23, a first boost switch element 24, a second boost switch element 25, etc. The boost circuit 20 is configured to include a coil 26, a first diode element 27, a second diode element 28, a second capacitor 29, a second discharge resistor 30, a second discharge switch element 31, etc.

[0038] The first capacitor 21 smoothes the voltage supplied from the power source 10 , and is disposed between the high potential side and the low potential side of the power source 10 .

[0039] In the present embodiment, the first discharge resistor 22 is formed by connecting a plurality of chip resistors 221 in series in parallel. The first discharge resistor 22 is connected in parallel with the first capacitor 21 to form a circuit for discharging the charge of the first capacitor 21. The first discharge switch element 23 is composed of a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) and the like, and is configured between the first discharge resistor 22 and the low potential side of the power supply 10 in order to increase the discharge speed of the charge of the first capacitor 21. In addition, the first discharge switch element 23 is connected to the control unit 50, and is controlled to be turned on and off by the control unit 50.

[0040] The first boost switch element 24 and the second boost switch element 25 are composed of MOSFET and the like and are connected in series. The high potential side of the power supply 10 is connected to the midpoint between the first boost switch element 24 and the second boost switch element 25 via the coil 26, and the low potential side of the second boost switch element 25 is connected to the low potential side of the power supply 10. In addition, in the present embodiment, the first boost switch element 24 and the second boost switch element 25 are respectively connected in parallel with a first diode element 27 and a second diode element 28 for reflux. And, by controlling the on / off of the first boost switch element 24 and the second boost switch element 25 by the control unit 50 described later, the voltage supplied from the power supply 10 is boosted.

[0041] The second capacitor 29 is connected in parallel to the first boosting switching element 24 and the second boosting switching element 25 to smooth the boosted voltage.

[0042] The second discharge resistor 30 is similar to the first discharge resistor 22, and is formed by connecting a plurality of chip resistors 301 in series and in parallel. The second discharge resistor 30 is connected in parallel with the second capacitor 29 to form a circuit for discharging the charge of the second capacitor 29. The second discharge switch element 31 is composed of a MOSFET or the like, and is arranged between the second discharge resistor 30 and the low potential side of the power supply 10 in order to increase the discharge speed of the charge of the second capacitor 29. In addition, the second discharge switch element 31 is connected to the control unit 50, and is controlled by the control unit 50 to be turned on and off.

[0043] In the present embodiment, the inverter circuit 40 is a three-phase inverter circuit in which upper and lower arms 41 to 46 connected in series are connected in parallel for three phases. Then, the inverter circuit 40 sequentially switches and applies the midpoint potentials of the upper arms 41, 43, 45 and the lower arms 42, 44, 46 to the U phase, V phase, and W phase of the three-phase AC motor that is the load 1.

[0044] Specifically, the upper and lower arms 41 to 46 are configured to have switching elements 41a to 46a such as IGBT (Insulated Gate Bipolar Transistor), MOSFET, and diode elements 41b to 46b for return. In addition, the three-phase inverter circuit 40 is connected to the control unit 50, and the three-phase AC current with different cycles is supplied to the load 1 by controlling the on and off of the switching elements 41a to 46a in the upper and lower arms 41 to 46 of each phase. In addition, each switching element 41a to 46a is connected in parallel with each diode element 41b to 46b. In addition, in the present embodiment, each switching element 41a to 46a is equivalent to a heating element that generates heat by passing a specified current.

[0045] The control unit 50 is composed of a vehicle ECU (short for Electronic Control Unit) and the like, and is configured to include various storage units such as a CPU, ROM, RAM, and non-volatile RAM, which are not shown in the figure. In addition, the control unit 50 implements various control operations by having the CPU read out programs from various storage units and execute them. In addition, various data (for example, initial values, lookup tables, mappings, etc.) used when executing programs are pre-stored in various storage units such as ROM. CPU is the abbreviation of Central Processing Unit, ROM is the abbreviation of Read Only Memory, and RAM is the abbreviation of Random Access Memory. In addition, various storage media such as ROM are non-transitional physical storage media.

[0046] Specifically, the control unit 50 is connected to the boost circuit 20 and the inverter circuit 40, and controls the on and off of each switching element 23, 24, 25, 31, 41a to 46a. In addition, the control unit 50 receives a detection signal corresponding to the cooling medium from the temperature sensor 320, which will be described later. Then, the control unit 50 determines the abnormality of the cooling device 200 based on the detection signal.

[0047] Next, the structure of the electronic device of this embodiment is described. Figure 2 As shown, the electronic device includes a semiconductor module 100 for constituting an inverter circuit 40, a cooling device 200 for cooling the semiconductor module 100, and a temperature sensor module 300 for detecting the temperature of a cooling medium flowing in the cooling device 200. Figure 1 Although the circuit structure related to the temperature sensor module 300 is omitted, the temperature sensor module 300 is also connected to the control unit 50. In addition, the electronic device is configured to have a circuit structure connected to the control unit 50. Figure 2 The first capacitor 21, the first discharge resistor 22, the first discharge switch element 23, the first boost switch element 24, the second boost switch element 25, etc. are arranged at different positions. Figure 2 The coil 26 at different positions, the first diode element 27, the second diode element 28, the second capacitor 29, the second discharge resistor 30, the second discharge switch element 31, etc.

[0048] In the present embodiment, the semiconductor module 100 is configured by modularizing the upper arms 41, 43, 45 of each layer and the lower arms 42, 44, 45 of each layer in the inverter circuit 40. In addition, in the present embodiment, three semiconductor modules 100 are provided to configure the inverter circuit 40 having the U phase, the V phase, and the W phase.

[0049] The cooling device 200 allows a cooling medium such as cooling water to flow inside, and includes an inlet pipe 201 and an outlet pipe 202 that form a circular flow path, and a connecting pipe 210 that is connected to the inlet pipe 201 and the outflow pipe 202 to form a roughly rectangular flow path. Specifically, the inlet pipe 201 and the outflow pipe 202 are arranged in a manner extending in the same direction. The connecting pipe 210 is formed into a roughly rectangular shape when viewed from above with one direction as the length direction. Furthermore, a plurality of connecting pipes 210 are arranged along the extension direction of the inlet pipe 201 and the outflow pipe 202 in a state where the inlet pipe 201 and the outflow pipe 202 are inserted at both ends in the length direction. The connecting pipes 210 of the present embodiment include four in a manner of forming three spaces along the arrangement direction of the connecting pipes 210 (hereinafter, also referred to as the arrangement direction). In addition, the connecting pipe 210 located on the outermost side in the arrangement direction (i.e., in the arrangement direction) is provided. Figure 2The connecting pipe 210 (the connecting pipe 210 at the bottom of the paper) is in a partially closed state on the side opposite to the side having the inflow pipe 201 and the outflow pipe 202.

[0050] Furthermore, in the cooling device 200 thus configured, a cooling medium such as cooling water flows in from the inlet pipe 201 and flows out from the outlet pipe 202 via the connecting pipe 210, thereby cooling each part installed in contact with the cooling device 200. In addition, although detailed description is omitted for the cooling device 200 of this embodiment, the cooling medium discharged from the outlet pipe 202 flows into the inlet pipe 201 via the radiator or the like. That is, the cooling device 200 circulates the cooling medium. In addition, in Figure 2 , the arrangement direction is the up-down direction of the paper.

[0051] The semiconductor modules 100 are arranged between the connecting pipes 210 adjacent to each other in the arrangement direction so as to abut against the connecting pipes 210 . Thus, each semiconductor module 100 is cooled by the cooling device 200 .

[0052] The temperature sensor module 300 is disposed so as to abut against the connection pipe 210 located at the outermost side in the arrangement direction. Figure 2 The temperature sensor module 300 is arranged in a manner that it abuts against the connection tube 210 that is closest to the bottom of the paper, and is arranged in a state where it is pressed toward the connection tube 210 by an elastic member 400 such as a spring. In addition, by pressing the temperature sensor module 300 toward the connection tube 210 by the elastic member 400, it is also possible to suppress the formation of a gap between the semiconductor module 100 and the connection tube 210.

[0053] Below, refer to Figure 3 and Figure 4 The structure of the temperature sensor module 300 of this embodiment will be described. The temperature sensor module 300 includes a printed circuit board 310, a temperature sensor 320, a terminal portion 330, a sealing member 340, and the like. Figure 4 Indicated by dotted line Figure 3 In the sealing component 340, a portion disposed within the sealing component 340 is indicated by a solid line.

[0054] The printed circuit board 310 has a surface 310a on which a wiring pattern 311 is formed. The temperature sensor 320 is composed of a thermistor or the like and is arranged so as to be connected to the wiring pattern 311 formed on the surface 310a of the printed circuit board 310. In addition, the temperature sensor 320 of the present embodiment is arranged so as to face the inlet pipe 201 when mounted on the cooling device 200.

[0055] The terminal portion 330 is in the shape of a rod, is disposed around the printed circuit board, and has one end portion electrically connected to the wiring pattern 311 via a bonding wire 350 .

[0056] The sealing member 340 is made of epoxy resin or the like having low thermal conductivity, is disposed so that the other end side of the terminal portion 330 is exposed, and integrally seals the printed circuit board 310 and the temperature sensor 320 .

[0057] The temperature sensor module 300 of this embodiment includes a positioning portion 360 used when arranging the temperature sensor module 300. Two positioning portions 360 of this embodiment are provided so as to sandwich the terminal portion 330, and are integrated with the terminal portion 330 and the like by the sealing member 340.

[0058] Moreover, as described above, such a temperature sensor module 300 is arranged to abut against the connecting pipe 210 located at the outermost side along the arrangement direction. In this case, the temperature sensor module 300 is arranged so that the temperature sensor 320 is located on the side of the inflow pipe 201 rather than the center between the inflow pipe 201 and the outflow pipe 202. In other words, when the temperature sensor module 300 is arranged to abut against the connecting pipe 210, the temperature sensor 320 is arranged on the printed substrate 310 in such a manner as to be located on the side of the inflow pipe 201 rather than the center between the inflow pipe 201 and the outflow pipe 202. In the present embodiment, the temperature sensor 320 is arranged at a position opposite to the inflow pipe 201 in the printed substrate 310. In other words, the temperature sensor 320 is arranged at a position overlapping with the inflow pipe 201 in the normal direction relative to the surface direction of the printed substrate 310.

[0059] The above is the configuration of the electronic device in this embodiment. Moreover, such an electronic device supplies a three-phase AC current to the load 1 while allowing the cooling medium to flow through the cooling device 200 to cool the semiconductor module 100. In addition, the temperature sensor module 300 outputs a detection signal corresponding to the temperature of the cooling medium from the temperature sensor 320 to the control unit 50. Then, the control unit 50 determines the abnormality of the cooling device 200 based on the detection signal.

[0060] In this case, the temperature sensor 320 is arranged to be located at a position closer to the inflow pipe 201 than the center between the inflow pipe 201 and the outflow pipe 202. Therefore, it is easy to detect the temperature of the cooling medium before being affected by the temperature of the semiconductor module 100 having a heating element, and the detection accuracy related to the cooling medium can be improved. In addition, in this embodiment, since the temperature sensor 320 is arranged to be opposite to the inflow pipe 201, the detection accuracy can be further improved.

[0061] Here, through the research of the present inventors, the relationship between time and temperature when the temperature sensor 320 is arranged in a manner opposite to the inlet pipe 201 is obtained. Figure 5In addition, in the electronic device in which the semiconductor module 100 is arranged in the cooling device 200 as described above, the current situation is that the detection result of the temperature change of the cooling medium is required to be as shown in FIG. Figure 5 It is thus included between the upper limit required value and the lower limit required value. Moreover, it is confirmed that by configuring the temperature sensor 320 to face the inflow pipe 201 as in this embodiment, it is possible to fully cope with the current requirements. In addition, Figure 5 The simulation results are shown when cooling water as a cooling medium circulates in the cooling device 200 .

[0062] In the present embodiment described above, the temperature sensor module 300 is arranged so that the temperature sensor 320 is located on the side of the inflow pipe 201. Therefore, the temperature of the cooling medium before being affected by the temperature of the semiconductor module 100 can be easily detected, and the detection accuracy can be improved.

[0063] (1) In the present embodiment, the temperature sensor 320 is disposed so as to face the inlet pipe 201. Therefore, it is easier to detect the temperature of the cooling medium before being affected by the temperature of the semiconductor module 100, and the detection accuracy can be further improved.

[0064] (Second Embodiment)

[0065] The second embodiment will be described. In this embodiment, a temperature sensor 320 is added to the first embodiment. The rest is the same as the first embodiment, so the description is omitted here.

[0066] First, as described above, conventionally, a temperature sensor module has been proposed in which a temperature sensor is disposed on a substrate and the substrate and the temperature sensor are sealed by a sealing member made of resin (for example, refer to Non-Patent Document 1).

[0067] However, the inventors of the present invention have studied the configuration of a semiconductor module in which a heat generating element is arranged on a substrate and sealed with a sealing member, and the temperature sensor module is configured in the cooling device to form an electronic device. Specifically, the cooling device is configured to have a flow path for a cooling medium such as cooling water to pass through so that the semiconductor module can be cooled. In addition, the semiconductor module and the temperature sensor module are configured in a manner that abuts the cooling device. In addition, the temperature sensor configured in the temperature sensor module outputs a detection signal corresponding to the temperature of the cooling medium.

[0068] In addition, the inventors have studied the possibility of detecting abnormality of the temperature sensor provided in the temperature sensor module in such an electronic device. In this case, for example, a temperature sensor is also installed in the semiconductor module, and the temperature of the cooling medium is estimated by the temperature sensor of the semiconductor module and compared with the result detected by the temperature sensor of the temperature sensor module. However, in this configuration, the configuration of estimating the temperature of the cooling medium by the temperature sensor of the semiconductor module tends to become complicated.

[0069] Therefore, an object of the present embodiment is to provide an electronic device capable of detecting an abnormality of a temperature sensor by a simple method.

[0070] like Figure 6 As shown, the temperature sensor module 300 of this embodiment is provided with two temperature sensors 320. In this embodiment, one of the two temperature sensors is set as a first temperature sensor 320a, and the other of the two temperature sensors is set as a second temperature sensor 320b.

[0071] Furthermore, the first temperature sensor 320a is arranged so as to be located on the side of the inflow pipe 201, and the second temperature sensor 320b is arranged so as to be located on the side of the outflow pipe 202. More specifically, in this embodiment, the first temperature sensor 320a is arranged at a position opposite to the inflow pipe 201 in the printed substrate 310, and the second temperature sensor 320b is arranged at a position opposite to the outflow pipe 202 in the printed substrate 310. Therefore, the first temperature sensor 320a outputs the temperature of the cooling medium before being affected by the heat of the semiconductor module 100 as a first detection signal, and the second temperature sensor 320b outputs the temperature of the cooling medium after being affected by the heat of the semiconductor module 100 as a second detection signal.

[0072] The control unit 50 performs abnormality determination of the first temperature sensor 320a and the second temperature sensor 320b based on the first detection signal input from the first temperature sensor 320a and the second detection signal input from the second temperature sensor 320b. In the present embodiment, the difference between the first detection signal detected by the first temperature sensor 320a in the case of normal operation and the second detection signal detected by the second temperature sensor 320b in the case of normal operation is derived in advance through experiments and stored in the storage unit. Then, the control unit 50 uses the value obtained by adding a predetermined range to the difference derived in advance as a threshold range, and if the difference between the first detection signal and the second detection signal is within the threshold range, it is determined that the first temperature sensor 320a and the second temperature sensor 320b are normal. In addition, if the difference between the first detection signal and the second detection signal is outside the threshold range, the control unit 50 determines that at least one of the first temperature sensor 320a and the second temperature sensor 320b is in an abnormal state such as a fault.

[0073] According to the present embodiment described above, since the first temperature sensor 320 a is arranged to face the inflow pipe 201 , the same effects as those of the first embodiment can be obtained.

[0074] (1) In the present embodiment, the first temperature sensor 320a and the second temperature sensor 320b are arranged in the temperature sensor module 300. Furthermore, the control unit 50 makes an abnormality determination of the first temperature sensor 320a and the second temperature sensor 320b based on the first detection signal from the first temperature sensor 320a and the second detection signal from the second temperature sensor 320b. Therefore, compared with the case where a temperature sensor is arranged in the semiconductor module 100, the temperature of the cooling medium is estimated based on the detection result of the temperature sensor, and the estimated result is compared with the result detected by the temperature sensor of the temperature sensor module 300, the configuration can be simplified.

[0075] (Variation of the Second Embodiment)

[0076] A modified example of the second embodiment described above will be described. In the second embodiment described above, the first temperature sensor 320a and the second temperature sensor 320b may also be respectively provided at a portion of the surface 310a of the printed circuit board 310 that is opposite to the inflow pipe 201. Thus, the first temperature sensor 320a and the second temperature sensor 320b both detect the temperature before being affected by the heat of the semiconductor module 100. Therefore, the control unit 50 only needs to set the possible error to a predetermined threshold range, and the configuration can be further simplified. In addition, the temperature sensor 320 may also be provided with more than three.

[0077] (Summary of Second Embodiment)

[0078] The second embodiment is configured as described above. The configuration of the second embodiment is also useful when the temperature sensor 320 is disposed closer to the outflow pipe 202 than the center between the inflow pipe 201 and the outflow pipe 202. Therefore, the second embodiment can be summarized as follows.

[0079] (Viewpoint 1)

[0080] An electronic device comprising:

[0081] A semiconductor module (100) having a heating element (41a-46a) that generates heat when current flows therethrough;

[0082] A cooling device (200) having a flow path through which a cooling medium for cooling the semiconductor module flows;

[0083] a temperature sensor module (300) having temperature sensors (320a, 320b) for detecting the temperature of the cooling medium; and

[0084] The control unit (50) performs a predetermined process.

[0085] The cooling device comprises: an inflow pipe (201) for the cooling medium to flow in; an outflow pipe (202) for the cooling medium to flow out; and a connecting pipe (210) for connecting the inflow pipe and the outflow pipe.

[0086] The semiconductor module is arranged in a state of abutting against the connection pipe.

[0087] The temperature sensor module is arranged in a state of contact with the connection pipe.

[0088] The temperature sensor module is equipped with a plurality of temperature sensors.

[0089] The control unit compares detection results detected by the plurality of temperature sensors to determine abnormality of the temperature sensors.

[0090] (Viewpoint 2)

[0091] According to the electronic device according to aspect 1, the plurality of temperature sensors are arranged at positions closer to the inflow pipe than the center between the inflow pipe and the outflow pipe.

[0092] (Third Embodiment)

[0093] The third embodiment is described below. Compared with the first embodiment, the arrangement locations of the first discharge resistor 22, the first discharge switch element 23, the second discharge resistor 30, and the second discharge switch element 31 are changed in this embodiment. The rest is the same as the first embodiment, so the description is omitted here.

[0094] First, as described above, conventionally, a temperature sensor module has been proposed in which a temperature sensor is disposed on a substrate and the substrate and the temperature sensor are sealed by a sealing member made of resin (for example, refer to Non-Patent Document 1).

[0095] However, the inventors of the present invention have studied the configuration of a semiconductor module in which a heating element is arranged on a substrate and sealed with a sealing component, and the configuration of the above-mentioned temperature sensor module in the cooling device to form an electronic device. Specifically, the cooling device is configured to have a flow path for a cooling medium such as cooling water to pass through so that the semiconductor module can be cooled. In addition, the semiconductor module and the temperature sensor module are configured in a manner abutting the cooling device. In addition, the temperature sensor configured in the temperature sensor module outputs a detection signal corresponding to the temperature of the cooling medium. In addition, in the case of constituting such an electronic device, a capacitor for smoothing the voltage of the power supply, a discharge resistor for discharging the charge of the capacitor, etc. are provided.

[0096] In this case, a general chip resistor is used as the discharge resistor. However, the chip resistor has temperature characteristics, and although the structure depends on the material constituting the chip resistor, the characteristics are sharply reduced when the temperature reaches a predetermined temperature or above. Therefore, when configuring the discharge resistor near the semiconductor module, it is necessary to select a structure whose characteristics will not be reduced even if heated by the semiconductor module, and the selectivity of the discharge resistor may be reduced.

[0097] Therefore, an object of the present embodiment is to provide an electronic device capable of improving the selectivity of a discharge resistor.

[0098] like Figure 7 As shown, in the temperature sensor module 300 of this embodiment, the first discharge resistor 22, the first discharge switch element 23, the second discharge resistor 30, and the second discharge switch element 31 are arranged on one surface 310a of the printed circuit board 310. Figure 7 , the first discharge resistor 22 is shown to be composed of three chip resistors 221, and the second discharge resistor 30 is shown to be composed of five chip resistors 301. However, the first discharge resistor 22 and the second discharge resistor 30 are actually arranged in the same manner. Figure 1 The circuit configuration is configured in a manner corresponding to the Figure 7 , as the first discharge switch element 23 and the second discharge switch element 31, a state where MOSFET is chip-based is shown, and the gate is represented by G, the source is represented by S, and the drain is represented by D. In addition, in this embodiment, the first discharge resistor 22, the first discharge switch element 23, the second discharge resistor 30, and the second discharge switch element 31 are equivalent to electronic components.

[0099] The temperature sensor module 300 is configured in a state of abutting the cooling device 200 as described above. Therefore, compared with the case where the first discharge resistor 22, the first discharge switch element 23, the second discharge resistor 30, and the second discharge switch element 31 are configured in a state different from the state of abutting the cooling device 200, it is possible to suppress the temperature of each part from increasing. Therefore, in particular, it is possible to achieve an improvement in the selectivity of the chip resistors constituting the first discharge resistor 22 and the second discharge resistor 30. In addition, the first discharge resistor 22, the first discharge switch element 23, the second discharge resistor 30, and the second discharge switch element 31 are configured in a state different from the state of abutting the cooling device 200. In other words, these components are configured outside the temperature sensor module 300 and are not abutted against the cooling device 200.

[0100] According to the present embodiment described above, since the first temperature sensor 320 a is arranged to face the inflow pipe 201 , the same effects as those of the first embodiment can be obtained.

[0101] (1) In the present embodiment, the first discharge resistor 22 and the second discharge resistor 30 are arranged on one side 310a of the printed substrate 310. Therefore, compared with the case where the first discharge resistor 22, the first discharge switching element 23, the second discharge resistor 30, and the second discharge switching element 31 are arranged in a state different from the state of abutting against the cooling device 200, it is possible to suppress the temperature of each part from increasing. Therefore, in particular, it is possible to achieve an improvement in the selectivity of the chip resistors constituting the first discharge resistor 22 and the second discharge resistor 30. In addition, since the first discharge resistor 22 and the second discharge resistor 30 are arranged on one side 310a of the printed substrate 310, there is no need for mounting components for arranging them, and the number of components can be reduced.

[0102] (Variation of the Third Embodiment)

[0103] A modified example of the third embodiment described above is described. In the third embodiment described above, an example in which the first discharge resistor 22, the first discharge switch element 23, the second discharge resistor 30, and the second discharge switch element 31 are arranged on one side 310a of the printed substrate 310 is described. However, it is not necessary to arrange all of the first discharge resistor 22, the first discharge switch element 23, the second discharge resistor 30, and the second discharge switch element 31 on one side 310a of the printed substrate 310, but a part of them. In addition, other electronic components may be arranged on one side 310a of the printed substrate 310. For example, in the gazette of Japanese Patent No. 6955951, an abnormality detection circuit for detecting abnormality of the discharge resistor is proposed. Moreover, the electronic device of this embodiment may also be provided with an abnormality detection circuit for detecting abnormality of each discharge resistor 22, 30, and the abnormality detection circuit may be arranged on one side 310a of the printed substrate 310. Thus, the abnormality detection circuit is also cooled by the cooling device, so that the temperature of the abnormality detection circuit can be suppressed from increasing. In addition, in this configuration, the abnormality detection circuit is also equivalent to an electronic component.

[0104] (Summary of the Third Embodiment)

[0105] The third embodiment is configured as described above. The configuration of the third embodiment is also useful when the temperature sensor 320 is disposed closer to the outflow pipe 202 than the center between the inflow pipe 201 and the outflow pipe 202. Therefore, the third embodiment can be summarized as follows.

[0106] (Viewpoint 1)

[0107] An electronic device comprising:

[0108] A semiconductor module (100) having a heating element (41a-46a) that generates heat when current flows therethrough;

[0109] A cooling device (200) having a flow path through which a cooling medium for cooling the semiconductor module flows;

[0110] A temperature sensor module (300) having a temperature sensor (320) for detecting the temperature of the cooling medium; and

[0111] The electronic components (22, 23, 30, 31) are subjected to prescribed processing,

[0112] The temperature sensor module is arranged in a state of contact with the connection pipe.

[0113] The electronic component is arranged in the temperature sensor module together with the temperature sensor.

[0114] (Viewpoint 2)

[0115] An electronic device comprises: a capacitor (21, 29) arranged between the heating element and the power supply (10); and a discharge resistor (22, 30) as an electronic component for discharging the charge of the capacitor.

[0116] The discharge resistor is disposed in the temperature sensor module.

[0117] (Viewpoint 3)

[0118] The electronic device according to aspect 1 or aspect 2 comprises a discharge switching element (23, 31) as the electronic component arranged between the discharge resistor and a portion on the low potential side of the power supply,

[0119] The discharge switching element is arranged in the temperature sensor module.

[0120] (Fourth Embodiment)

[0121] A fourth embodiment will be described. In this embodiment, the configuration of the temperature sensor module 300 is changed compared to the first embodiment. The rest is the same as the first embodiment, and thus the description thereof will be omitted.

[0122] First, as described above, conventionally, a temperature sensor module has been proposed in which a temperature sensor is disposed on a substrate and the substrate and the temperature sensor are sealed by a sealing member made of resin (for example, refer to Non-Patent Document 1).

[0123] However, the inventors of the present invention have studied the configuration of a semiconductor module in which a heat generating element is arranged on a substrate and sealed with a sealing member, and the temperature sensor module is configured in the cooling device to form an electronic device. Specifically, the cooling device is configured to have a flow path for a cooling medium such as cooling water to pass through so that the semiconductor module can be cooled. In addition, the semiconductor module and the temperature sensor module are configured in a manner that abuts the cooling device. In addition, the temperature sensor configured in the temperature sensor module outputs a detection signal corresponding to the temperature of the cooling medium.

[0124] However, in such an electronic device, the present inventors have confirmed through research that the detection accuracy of the temperature sensor may be reduced depending on the configuration of the temperature sensor module.

[0125] Therefore, in the present embodiment, an object is to provide an electronic device capable of suppressing a decrease in the detection accuracy of a temperature sensor.

[0126] like Figure 8 to Figure 11As shown, the temperature sensor module 300 of this embodiment is composed of a mounting portion 370, a terminal portion 330, a positioning portion 360, a fixing portion 380, a temperature sensor 320, a first discharge resistor 22, a second discharge resistor 30, etc. Figure 8 It is a plan view seen from one surface 340 a side of a sealing member 340 described later. Fig. 9 This is a plan view viewed from the other surface 340 b side of the sealing member 340 described later. Fig.10 It is a plan view viewed from a surface 340 a side of a sealing member 340 described later, in which the sealing member 340 is indicated by a dotted line and a portion arranged in the sealing member 340 is indicated by a solid line.

[0127] The mounting portion 370 is made of a Cu plate, an Al plate, or the like having a higher thermal conductivity than the sealing member 340, and is configured to include a heat conducting member 371 having one surface 371a and another surface 371b opposite to the one surface 371a. In addition, the mounting portion 370 is configured to include an insulating film 372 disposed on one surface 371a of the heat conducting member 371, and a wiring pattern 373 disposed on the insulating film 372 and patterned into a predetermined shape.

[0128] Furthermore, the chip resistor 221 constituting the first discharge resistor 22 and the chip resistor 301 constituting the second discharge resistor 30 are arranged on the wiring pattern 373 via a bonding member 374 such as solder. In this embodiment, the first discharge resistor 22 is composed of three chip resistors 221, and the second discharge resistor 30 is composed of ten chip resistors 301. However, the first discharge resistor 22 and the second discharge resistor 30 are actually arranged in the same manner as Figure 1 In addition, in the present embodiment, an example is shown in which the first discharge switch element 23 and the second discharge switch element 31 are arranged at positions different from the wiring pattern 373 of the mounting portion 370. However, the first discharge switch element 23 and the second discharge switch element 31 may be arranged on the wiring pattern 373 together with the first discharge resistor 22 and the second discharge resistor 30. Furthermore, the first discharge resistor 22 and the second discharge resistor 30 may also be arranged at positions different from the wiring pattern 373 of the mounting portion 370.

[0129] In addition, a temperature sensor 320 is arranged on the wiring pattern 373 of the mounting portion 370 via a bonding member 321 such as solder. The temperature sensor 320 is thermally connected to the heat conducting member 371 in the mounting portion 370. In addition, a solder resist 375 is appropriately arranged on the wiring pattern 373. Fig.10 in, omit Fig.11 The solder resist 375 is shown.

[0130] The terminal portion 330, the positioning portion 360, and the fixing portion 380 are formed of a lead frame 390 and are integrated by a tie bar or the like before forming the sealing member 340. The terminal portion 330, the positioning portion 360, and the fixing portion 380 are separated by removing the tie bar after forming the sealing member 340.

[0131] The terminal portion 330 and the positioning portion 360 have the same functions as those of the first embodiment. One end side of the terminal portion 330 is electrically connected to the wiring pattern 373 via the bonding wire 350. The fixing portion 380 is a portion that fixes the mounting portion 370 to the lead frame 390, and is joined to the mounting portion 370 via a bonding member (not shown).

[0132] The sealing member 340 is a substantially rectangular parallelepiped having one surface 340a, another surface 340b, and a side surface 340c connecting the one surface 340a and the other surface 340b. In addition, the sealing member 340 is configured to seal the mounting portion 370, the temperature sensor 320, etc. integrally. Specifically, the sealing member 340 is configured such that the other end side of the terminal portion 330 and a part of the positioning portion 360 protrude from the side surface 340c, similarly to the first embodiment described above. In addition, the sealing member 340 is configured such that the other surface 371b of the heat conducting member 371 is exposed from the other surface 340b.

[0133] The above is the configuration of the temperature sensor module 300 in this embodiment.

[0134] And, if Fig.12 As shown, such a temperature sensor module 300 is arranged in a manner of abutting against the connecting pipe 210 located at the outermost side along the arrangement direction. Specifically, in the temperature sensor module 300, the second surface 340b side of the sealing member 340 is arranged toward the connecting pipe 210 side so that the heat conduction member 371 abuts against the connecting pipe 210. Therefore, for example, compared with the case where the one surface 340a side of the sealing member 340 is arranged toward the connecting pipe 210 side and the sealing member 340 is arranged in a manner of abutting against the connecting pipe 210, the temperature of the cooling medium is easily transmitted to the temperature sensor 320 via the heat conduction member 371. Therefore, it is possible to achieve an improvement in the detection accuracy of the temperature of the cooling medium. In addition, in the present embodiment, the connecting pipe 210 corresponds to the measurement object portion.

[0135] According to the present embodiment described above, the heat-conductive member 371 is arranged so as to abut against the connecting pipe 210. Therefore, the temperature of the cooling medium is easily transmitted to the temperature sensor 320 via the heat-conductive member 371, and the detection accuracy can be improved.

[0136] (Fifth Embodiment)

[0137] A fifth embodiment will be described. This embodiment changes the method of arranging the temperature sensor module 300 from the fourth embodiment. The rest is the same as the fourth embodiment, and thus description thereof will be omitted.

[0138] In this embodiment, if Fig.13 As shown, the cooling device 200 includes five connecting pipes 210 in a manner of forming four spaces. In addition, semiconductor modules 100 are respectively arranged in each space adjacent to each other in the arrangement direction, and a temperature sensor module 300 is arranged in the remaining space in the arrangement direction. That is, the temperature sensor module 300 is arranged to be sandwiched by the connecting pipe 210 that abuts against the semiconductor module 100 and the connecting pipe 210 that does not abut against the semiconductor module 100. Hereinafter, among the two connecting pipes 210 arranged in a manner of sandwiching the temperature sensor module 300, the connecting pipe 210 that abuts against the semiconductor module 100 is also referred to as a contact connecting pipe 210a, and the connecting pipe 210 that does not abut against the semiconductor module 100 is also referred to as a non-contact connecting pipe 210b.

[0139] The temperature sensor module 300 is arranged such that the second surface 371 b of the heat conductive member 371 abuts against the non-contact connection pipe 210 b and the first surface 340 a of the sealing member 340 abuts against the contact connection pipe 210 a .

[0140] According to the present embodiment described above, the temperature sensor module 300 is arranged so that the heat conductive member 371 is in contact with the connection pipe 210 . Therefore, the same effects as those of the fourth embodiment can be obtained.

[0141] (1) In the present embodiment, the heat conducting member 371 is disposed so as to abut against the non-contact connection pipe 210b. Therefore, it is easy to detect the temperature of the cooling medium which is not easily affected by the temperature of the semiconductor module 100, and the detection accuracy can be further improved.

[0142] (Sixth Embodiment)

[0143] The sixth embodiment will be described. In this embodiment, the configuration of the temperature sensor module 300 is changed compared to the fourth embodiment. The rest is the same as the fourth embodiment, and therefore the description thereof will be omitted.

[0144] In the temperature sensor module 300 of this embodiment, as shown in FIG. Fig.14As shown, the mounting portion 370 is also constituted by a part of the lead frame 390. In addition, the mounting portion 370 of the present embodiment also plays the function of a wiring portion and is appropriately divided. Moreover, in the lead frame 390, in the portion that becomes the mounting portion 370, a temperature sensor 320 is arranged via a bonding component 321, and a chip resistor 221 that constitutes the first discharge resistor 22 is arranged via a bonding component 374. In addition, in the present embodiment, a figure is shown in which the temperature sensor 320 is arranged on one side 390a of the lead frame 390 and the chip resistor 221 is arranged on the other side 390b of the lead frame 390. However, the surface on which the temperature sensor 320 and the chip resistor 221 are arranged can be appropriately changed. In addition, the chip resistor 301 that constitutes the second discharge resistor 30 is appropriately arranged on the side that is opposite to the lead frame 390. Fig.14 Different cross sections.

[0145] The heat conducting member 371 is disposed on the other surface 390b of the lead frame 390, which faces the temperature sensor 320, via a bonding member 376 such as an insulating sheet. The heat conducting member 371 of this embodiment is smaller in size in the planar direction than the heat conducting member 371 of the fourth embodiment.

[0146] The sealing member 340 is configured to integrally seal the lead frame 390 and the temperature sensor 320. Specifically, the sealing member 340 is formed so that a portion of the lead frame 390 that becomes the terminal portion 330 protrudes from the side surface 340c. The sealing member 340 is formed so that the other surface 371b of the heat conducting member 371 is exposed from the other surface 340b of the sealing member 340.

[0147] In addition, in this embodiment, in order to simplify the manufacturing process, the sealing component 340 is configured to have two primary molded components 341 and a secondary molded component 342. In detail, one primary molded component 341 is formed to seal the temperature sensor 320. In addition, one primary molded component 341 is formed to seal the chip resistor 221 constituting the first discharge resistor 22 and the chip resistor 301 constituting the second discharge resistor 30. Moreover, the secondary molded component 342 is formed to seal these primary molded components 341, the heat conductive component 371, etc.

[0148] Furthermore, when the temperature sensor module 300 of the present embodiment is arranged in the cooling device 200 as in the fourth embodiment, the heat-conducting member 371 is arranged in contact with the connecting pipe 210. In this case, the heat-conducting member 371 of the present embodiment is arranged at a position opposite to the temperature sensor 320, and the portion exposed from the other surface 340b of the sealing member 340 is reduced compared to the fourth embodiment. Therefore, the temperature sensor module 300 of the present embodiment is preferably arranged in a manner that the temperature sensor 320 is located on the inflow pipe 201 side, as in the first embodiment. More specifically, the temperature sensor module 300 is preferably arranged in a manner that the temperature sensor 320 is opposite to the inflow pipe 201. As a result, it is easy to detect the temperature of the cooling medium before being affected by the temperature of the semiconductor module 100, and the detection accuracy can be improved.

[0149] Furthermore, when the temperature sensor module 300 of the present embodiment is disposed in the cooling device 200 as in the fifth embodiment, the heat conductive member 371 is disposed in contact with the non-contact connection pipe 210 b .

[0150] Even when the temperature sensor module 300 is configured as in the present embodiment described above, by arranging the heat conductive member 371 so as to abut against the connection pipe 210 , the same effects as those of the fourth embodiment can be obtained.

[0151] (Summary of the fourth to sixth embodiments)

[0152] The fourth to sixth embodiments are configured as described above. In addition, the configurations of the fourth to sixth embodiments are also useful when the temperature sensor 320 is arranged closer to the outflow pipe 202 side than the center between the inflow pipe 201 and the outflow pipe 202. Therefore, if the fourth to sixth embodiments are summarized, it can be said that the temperature sensor module 300 or the electronic device has the following viewpoints.

[0153] (Viewpoint 1)

[0154] A temperature sensor module, comprising:

[0155] A temperature sensor (320) outputs a detection signal corresponding to the temperature;

[0156] a mounting portion (370) for mounting the temperature sensor; and

[0157] A sealing component (340) seals the temperature sensor and the mounting portion.

[0158] The temperature sensor module comprises a heat conducting component (371) which is arranged on the sealing component in a manner that a part of the heat conducting component is exposed from the sealing component, is thermally connected to the temperature sensor, and is made of a material having a higher thermal conductivity than the sealing component.

[0159] The thermally conductive member is used in a state of being in contact with the measurement target portion.

[0160] (Viewpoint 2)

[0161] The temperature sensor module according to aspect 1 is characterized in that:

[0162] The mounting portion includes the heat conductive member.

[0163] (Viewpoint 3)

[0164] An electronic device, characterized by comprising:

[0165] A semiconductor module (100) having a heating element (41a-46a) that generates heat when current flows therethrough;

[0166] A cooling device (200) having a flow path through which a cooling medium for cooling the semiconductor module flows; and

[0167] The temperature sensor module (300) according to claim 1 or 2,

[0168] The cooling device comprises: an inflow pipe (201) for the cooling medium to flow in; an outflow pipe (202) for the cooling medium to flow out; and a connecting pipe (210) for connecting the inflow pipe and the outflow pipe.

[0169] The semiconductor module is arranged in a state of abutting against the connection pipe.

[0170] The temperature sensor module is arranged in a state where the heat conductive member is in contact with the connection pipe.

[0171] (Viewpoint 4)

[0172] The electronic device according to aspect 3 is characterized in that:

[0173] The inflow pipe and the outflow pipe are extended with one direction as the length direction.

[0174] The connecting pipes are arranged in plurality along the length direction.

[0175] The temperature sensor module is arranged in a state where the sealing member abuts against a connecting pipe (210a) abutting against the semiconductor module, and the heat conducting member abuts against a connecting pipe (210b) different from the connecting pipe abutting against the semiconductor module.

[0176] (Other embodiments)

[0177] The present disclosure is described based on the implementation mode, but it should be understood that the present disclosure is not limited to the implementation mode and structure. The present disclosure also includes various modifications and modifications within the equivalent range. In addition, various combinations, methods, and other combinations and methods that only include one element, more than one or less than one of them also fall into the category and scope of thought of the present disclosure.

[0178] For example, in each of the above-described embodiments, the electronic device may be configured to include two or less semiconductor modules 100 , or may be configured to include four or more semiconductor modules 100 .

[0179] In addition, in the above-mentioned embodiments, an example in which one semiconductor module 100 is arranged between the connecting tubes 210 adjacent to each other in the arrangement direction is described. Fig.15 As shown, the electronic device may also be configured such that a plurality of semiconductor modules 100 are arranged between the connecting pipes 210 adjacent to each other in the arrangement direction. However, in the first to third embodiments, the temperature sensor module 300 is preferably arranged such that the temperature sensor 320 is opposite to the inlet pipe 201. In addition, in the fifth embodiment, as shown in FIG. Fig.16 As shown, the electronic device may also be configured such that a plurality of semiconductor modules 100 are arranged between the connecting tubes 210 adjacent to each other along the arrangement direction. Also, although not particularly shown, in the fourth and sixth embodiments, the electronic device may also be configured such that a plurality of semiconductor modules 100 are arranged between the connecting tubes 210 adjacent to each other along the arrangement direction. Fig.15 as well as Fig.16 , the temperature sensor module 300 is also shown to be enlarged along the surface direction of the semiconductor module 100 , but the size of the temperature sensor module 300 can be changed appropriately.

[0180] Furthermore, in each of the above-described embodiments, the semiconductor module 100 may not include the switching elements 41 a to 46 a constituting the three-phase inverter circuit 40 , but may be configured by arranging heating elements constituting other circuits.

[0181] Furthermore, in each of the above-described embodiments, the circuit configuration of the electronic device can be changed as appropriate.

[0182] For example, the second embodiment may be combined with the third to sixth embodiments, and two temperature sensors 320 may be provided, and the first discharge resistor 22 and the like may be disposed in the temperature sensor module 300 .

[0183] The control unit and method described in the present disclosure may also be implemented by a special-purpose computer, which is provided by a processor and a memory programmed to execute one or more functions embodied by a computer program. Alternatively, the control unit and method described in the present disclosure may also be implemented by a special-purpose computer provided by a processor composed of one or more special-purpose hardware logic circuits. Alternatively, the control unit and method described in the present disclosure may also be implemented by one or more special-purpose computers, which are composed of a combination of a processor and a memory programmed to execute one or more functions and a processor composed of one or more hardware logic circuits. In addition, the computer program may also be stored as an instruction executed by a computer in a computer-readable non-transient tangible recording medium.

Claims

1. A temperature sensor module, characterized in that: have: A temperature sensor (320) outputs a detection signal corresponding to the temperature; a mounting portion (370) for mounting the temperature sensor; and A sealing component (340) seals the temperature sensor and the mounting portion. The temperature sensor module comprises a heat conducting component (371) which is arranged on the sealing component in a manner that a part of the heat conducting component is exposed from the sealing component, is thermally connected to the temperature sensor, and is made of a material having a higher thermal conductivity than the sealing component. The thermally conductive member is used in a state of being in contact with the measurement target portion.

2. The temperature sensor module according to claim 1, characterized in that: The mounting portion includes the heat conductive member.

3. An electronic device, characterized in that: have: A semiconductor module (100) having a heating element (41a-46a) that generates heat when current flows therethrough; A cooling device (200) having a flow path through which a cooling medium for cooling the semiconductor module flows; as well as The temperature sensor module (300) according to claim 1 or 2, The cooling device comprises: an inflow pipe (201) for the cooling medium to flow in; an outflow pipe (202) for the cooling medium to flow out; and a connecting pipe (210) for connecting the inflow pipe and the outflow pipe. The semiconductor module is arranged in a state of abutting against the connection pipe. The temperature sensor module is arranged in a state where the heat conductive member is in contact with the connection pipe.

4. The electronic device according to claim 3, characterized in that: The inflow pipe and the outflow pipe are extended with one direction as the length direction. The connecting pipes are arranged in plurality along the length direction. The temperature sensor module is arranged in a state where the sealing member abuts against a connecting pipe (210a) abutting against the semiconductor module, and the heat conducting member abuts against a connecting pipe (210b) different from the connecting pipe abutting against the semiconductor module.

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