Electroplating chamber for high mass transfer using jet arrays

Abstract

An exemplary electroplating system may include a container. The system may include a head configured to hold a substrate. The head may be positioned inside the container. The system may include an array of spouts disposed inside the container. The spout array may include a plate defining a plurality of apertures through a thickness of the plate. The system may include at least one fluid pump fluidly coupled with the inlet end of each of the plurality of bores.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of and priority to U.S. Patent Application No. 18 / 483,957, filed on October 10, 2023, entitled “ELECTROPLATING CHAMBERUSING JET ARRAY TO ENABLE HIGH MASS-TRANSFER,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present technology relates to methods, components and apparatus for semiconductor manufacturing. More particularly, the present technology relates to electroplating components and other semiconductor processing equipment. Background Art

[0004] Microelectronic devices (such as semiconductor devices) are manufactured on and / or in wafers or workpieces. A typical wafer plating process involves depositing a metal seed layer onto the surface of a wafer via vapor deposition. A photoresist may be deposited and patterned to expose the seed layer. The wafer is then moved to a container of an electroplating processor, where an electric current is conducted to the wafer through an electrolyte to deposit a blanket or pattern layer of metal or other conductive material on the seed layer. Examples of conductive materials include permalloy, gold, silver, copper, cobalt, tin, nickel, and alloys of these metals. Subsequent processing steps form components, contacts, and / or conductive lines on the wafer. Many aspects of the electroplating process may affect process consistency, such as irregularities in the electric field caused by pattern variations, mass transfer rates, deposition rates, and other process and component parameters. Even subtle differences in the substrate may affect the end-of-line finishing process.

[0005] Therefore, there is a need for improved systems and methods that can be used to produce high quality devices and structures. The present technology addresses these and other needs. Summary of the invention

[0006] An exemplary electroplating system may include a container. The system may include a head configured to hold a substrate. The head may be positioned within the interior of the container. The system may include a nozzle array disposed within the interior of the container. The nozzle array may include a plate that defines a plurality of holes through the thickness of the plate. The system may include at least one fluid pump that is fluidly coupled to an inlet end of each of the plurality of holes.

[0007] In some embodiments, the head is rotatable in the container. The center of rotation of the head may be offset from the center of the nozzle array. The head is rotatable in the container. One or both of the head and the nozzle array may be laterally translated in the container. The plate may include a plurality of tubes extending upward from the top surface of the plate toward the bottom surface of the head. Each of the plurality of tubes may be aligned with one of the plurality of holes and may partially define one of the plurality of holes. The plate may be a first plate. The plurality of holes may include a plurality of first holes and a plurality of second holes. The nozzle array may include a second plate coupled to the first plate on the bottom side of the first plate. The outlet end of each of the plurality of first holes and each of the plurality of second holes may extend through the top surface of the first plate. The inlet end of each of the plurality of first holes may extend through the bottom surface of the first plate. The inlet end of each of the plurality of second holes may extend through the bottom surface of the second plate. The plurality of first holes and the plurality of second holes may be arranged around the first plate in an alternating manner. The plurality of tubes may extend between the first plate and the second plate. Each of the plurality of tubes may be aligned with one of the plurality of second holes and may partially define one of the plurality of second holes. A plenum may be defined between the first plate and the second plate. The plenum may extend around the exterior of each of the plurality of tubes. At least one fluid pump may be fluidically coupled to the plurality of first holes via the plenum and may be fluidically coupled to the plurality of second holes via the bottom surface of the second plate. The diameter of each of the plurality of holes is no greater than 1 mm. The plate may define a plurality of discharge tubes. A majority of the plurality of holes have a pitch to diameter ratio of at least 8. The ratio of the gap between the plate and the substrate to the pitch of the plurality of holes is at least 1.

[0008] Some embodiments of the present technology may encompass an electroplating system that may include a container. The system may include a head configured to hold a substrate. The head may be positioned within the interior of the container. The system may include an array of nozzles disposed within the interior of the container. The array of nozzles may include a plate that defines a plurality of holes through the thickness of the plate. The system may include at least one fluid pump that is fluidically coupled to an inlet end of each of the plurality of holes. The system may include a power source configured to provide current to the interior of the container.

[0009] In certain embodiments, a plurality of holes may include a plurality of first holes forming a first fluid channel and a plurality of second holes forming a second fluid channel. At least one fluid pump may be operable to independently control the fluid flow to a plurality of first holes and a plurality of second holes. A power supply may be operable to deliver current to a plurality of first holes and a plurality of second holes. A power supply may be operable to independently control the amount of current delivered to a plurality of first holes and a plurality of second holes. The average pitch of a plurality of holes may be no greater than 12 mm. When the head is in the plating position, the outlet end of each of the plurality of holes may be within 25 mm of the bottom end of the head.

[0010] Some embodiments of the present technology may encompass methods of plating a substrate. The method may include immersing the substrate in a liquid electrolyte disposed in a container. The method may include spraying the substrate with a plurality of jets of the liquid electrolyte. The flow rate of each of the plurality of jets may be defined to be at least 0.02 gallons per minute. The method may include conducting an ionic current through the liquid electrolyte.

[0011] In some embodiments, a plurality of jets may be generated by flowing a volume of liquid electrolyte through a plurality of holes defined by a plate of a nozzle array. The plate may include a plurality of tubes extending upward from the top surface of the plate toward the substrate. Each of the plurality of tubes may be aligned with one of the plurality of holes and may partially define one of the plurality of holes. The plurality of holes may include a plurality of first holes forming a first fluid channel and a plurality of second holes forming a second fluid channel. Jetting the substrate may include jetting the substrate with a jet formed only through the plurality of first holes. Jetting the substrate may include stopping jetting the substrate with a jet formed through the plurality of first holes. Jetting the substrate may include jetting the substrate with a jet formed only through the plurality of second holes.

[0012] This technology can provide many benefits over conventional systems and techniques. For example, embodiments of the present technology can improve coplanarity on substrates. In particular, coplanarity can be improved on wafers including deep trenches. In addition, embodiments of the present invention can increase mass transfer rates, thereby increasing the allowable deposition rate of plating operations. These and other embodiments and their many advantages and features are described in more detail in conjunction with the following description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] A further understanding of the nature and advantages of the disclosed technology may be realized by reference to the remainder of the specification and the accompanying drawings.

[0014] Figure 1 An isometric view of an exemplary electroplating system according to some embodiments of the present technology is shown.

[0015] Figure 1A Shows Figure 1 A cross-sectional side view of the system.

[0016] Figure 2 A schematic top plan view of a nozzle array according to some embodiments of the present technology is shown.

[0017] Figure 2A Shows Figure 2 A cross-sectional side view of a nozzle array.

[0018] Figure 3 A schematic top plan view of a nozzle array according to some embodiments of the present technology is shown.

[0019] Figure 3A Shows Figure 3 A cross-sectional side view of a nozzle array.

[0020] Figure 4 A schematic top plan view of a nozzle array according to some embodiments of the present technology is shown.

[0021] Figure 4A Shows Figure 4 A cross-sectional side view of a nozzle array.

[0022] Figure 5 A schematic top plan view of a nozzle array according to some embodiments of the present technology is shown.

[0023] Figure 5A Shows Figure 5 A cross-sectional side view of a nozzle array.

[0024] Figure 6 Operations of an exemplary method of electroplating a substrate in accordance with some embodiments of the present technology are shown.

[0025] Several of the drawings are included as schematic diagrams. It should be understood that the drawings are for illustrative purposes and should not be considered to scale unless specifically noted to be to scale. Additionally, as schematic diagrams, the drawings are provided to aid understanding and may not include all aspects or information compared to realistic representations and may include exaggerated material for illustrative purposes.

[0026] In the accompanying drawings, similar components and / or features may have the same reference numeral. In addition, various components of the same type may be distinguished by appending a letter after the reference numeral that is used to distinguish the similar components. If only the first reference numeral is used in the specification, the description applies to any of the similar components having the same first reference numeral, regardless of the letter. DETAILED DESCRIPTION

[0027] In many or most electroplating applications, it is important that the metal coating or layer has a uniform thickness over the entire wafer or workpiece. Irregularities in the electric field due to pattern variations, mass transfer rates and / or other factors may cause non-uniformity. For example, when the substrate has regions with different groove depths and particularly regions with deep grooves, coplanarity problems may occur. Regions with different opening areas deteriorate coplanarity. If the mass transfer rate to the substrate is too low or inconsistent, coplanarity deteriorates in patterns with deep features. Conventional systems can attempt to improve such coplanarity problems by reducing the current applied to the electrolyte bath to gradually fill the deep grooves before increasing the current later. However, such operations may introduce additional complexity, time and / or cost into the electroplating operation and / or may cause other problems in the electroplating process. In addition, conventional plating systems use paddle-based electrolyte stirring devices to increase the strain rate on the wafer surface, which is related to the plating rate in the deep features. However, this paddle stirring is limited to producing strain rates in the range of 3,000 to 4,000 per second. This strain rate limits the plating rate in deep features and restricts the throughput of the plating system.

[0028] The present technology overcomes these challenges by replacing the stirring blade with an immersion nozzle array, which sprays multiple pressurized jets of electrolyte onto the wafer. This jet array can increase the strain rate by about an order of magnitude compared to conventional systems. For example, embodiments of the present technology can provide a strain rate between about 20,000 and 30,000 per second. The enhanced strain rate can improve the mass transfer rate to achieve a higher deposition rate. In addition, a higher strain rate can be more effective in filling deep grooves and / or other features, which can enable the plating process to be performed with a higher current level throughout the plating operation. Using a higher current level can further improve the efficiency and output of the plating system. Therefore, the present technology can improve plating efficiency (that is, deposition rate), and in some cases, improve the coplanarity of the substrate during the electroplating operation.

[0029] Although the remainder of the disclosure will routinely specify that a particular electroplating process utilizes the disclosed technology, it will be readily understood that the system and method are equally applicable to other plating chambers and systems, and processes that may occur in the systems. Therefore, the technology should not be considered limited to use with only these particular plating processes or systems. This disclosure will discuss one possible system that may include electroplated components according to embodiments of the technology, followed by descriptions of additional variations and adjustments to the system according to embodiments of the technology.

[0030] Figure 1 and Figure 1AAn exemplary system 100 for electroplating a substrate (such as a semiconductor substrate) according to an embodiment of the present technology is shown. A single system 100 can be used as a stand-alone unit. Alternatively, multiple systems 100 can be provided in an array within a housing, where substrates or workpieces are loaded to and unloaded from a processor by one or more robots. The system 100 may include a container 105, which can contain a liquid electrolyte solution for a plating operation. The system 100 may include a head 110, which is configured to hold a substrate to be plated. For example, the head 110 may include a contact ring that can hold the substrate against the head 110. The contact ring may include a plurality of contact fingers that can be in electrical contact with a conductive layer (such as a metal seed layer) on the substrate. The contact ring may optionally have a seal to seal the contact fingers from the electrolyte. The head 110 may include and / or be coupled to a rotor 115, which can rotate the substrate during processing. The rotation of the substrate can reduce the likelihood of one or more positions being exposed to a greater current density and / or electrolyte flow than other positions to facilitate consistent mass transfer rates. In some embodiments, the contact ring may be coupled to the rotor 115, which may enable the contact ring to rotate with the rotor 115. In some embodiments, the contact ring may include a seal and a backing plate, wherein the contact ring and the backing plate form a substrate holder.

[0031] The head 110 can be positioned inside the container 105. For example, the head 110 can be supported by a head lifter 120 coupled to the container 105. The head lifter 120 can lift and / or flip the head 110 to an open position to load and unload the substrate. The head lifter 120 can also lower the head 110 to a plating position, in which the head 110 can be inserted into the interior of the container 105 and engage with one or more components of the container 105 to process the substrate. As shown, the head lifter 120 pivots around an axis to move the head 110 between the open position and the plating position, but other moving mechanisms can be utilized in various embodiments. In the plating position, the bottom portion of the head 110 can be immersed in the electrolyte. For example, the electrolyte level can extend beyond the top surface of the substrate, for example, extending up to 25mm, up to 20mm, up to 15mm, up to 10mm, up to 5mm, up to 4mm, up to 3mm, up to 2mm, up to 1mm or less above the top surface of the substrate. In various embodiments, other depths are also possible.

[0032] The head 110 may be movable to position the substrate holder to a plating position in the vessel 105 where the seed layer may contact the electrolyte in the vessel 105. Electrical control and power cables (not shown) may be linked to the lift / rotate weir housing and to an internal head component leading from the system 100 to a facility connection, or to a connection within a multi-processor automation system. In some embodiments, a rinse assembly may be included and may have a layered drain ring that may be disposed above and / or around the vessel 105.

[0033] The system 100 may include an array of submerged nozzles 125 disposed inside the container 105. When the head 110 is in the plating position, the nozzle array 125 may be mounted in the container 105 at a position below the head 110. The nozzle array 125 may include a plate 130, which defines a plurality of holes 135 passing through the thickness of the plate 130. A volume of liquid electrolyte may pass through the hole 135 to produce a plurality of pressurized jets of liquid electrolyte, which impact on the substrate to increase the strain rate of the plated material on the substrate relative to conventional electrolyte stirring techniques (e.g., using stirring paddles), and subsequently increase the mass transfer rate. For example, the system 100 may include one or more fluid pumps 140, which may be fluidly coupled to the inlet end of each hole 135, and may deliver the liquid electrolyte to the hole 135 to generate a pressurized jet. The fluid pump 140 may be configured to deliver the liquid electrolyte at a flow rate sufficient to generate a pressurized jet. For example, fluid pump 140 can flow the liquid electrolyte at a rate of at least 10 gallons per minute, at least 15 gallons per minute, at least 20 gallons per minute, at least 25 gallons per minute, at least 30 gallons per minute, at least 35 gallons per minute, at least 40 gallons per minute, at least 45 gallons per minute, at least 50 gallons per minute, at least 55 gallons per minute, at least 60 gallons per minute, or more. Nozzle array 125 can be immersed in the electrolyte contained in container 105. Immersing nozzle array 125 in the electrolyte can ensure that the pressurized jets provide a constant current delivery path to the substrate and do not generate any bubbles that reach the substrate, which can cause defects to form on the substrate. In some embodiments, the nozzle array 125 and the head 110 can be positioned so that the outlet end of each hole 135 is within 25 mm of the bottom surface of the head 110, within 20 mm of the bottom surface, within 15 mm of the bottom surface, within 10 mm of the bottom surface, within 8 mm of the bottom surface, within 7 mm of the bottom surface, within 6 mm of the bottom surface, within 5 mm of the bottom surface, or less.

[0034] In some embodiments, there may be mass transfer consistency issues, particularly near the center of the substrate. More specifically, while the rotation of the head 110 and the substrate during plating can ensure that the pressurized jets hit different areas of the substrate, if the center-most jet is coaxial with the center of rotation of the head 110, the center-most jet will remain in the same position relative to the substrate, which may result in an increased mass transfer rate near the center of the substrate. Different techniques can be used to mitigate this effect by better averaging the mass transfer rate across the entire surface of the substrate. For example, in some embodiments, the center of rotation of the head 110 (e.g., the axis of rotation) can be offset from the center of the nozzle array 125. More specifically, the head 110 and the nozzle array 125 can be arranged relative to each other so that no single hole 135 / pressurized nozzle is aligned with the center of rotation of the head 110. Where the holes 135 are arranged in a grid-like pattern (e.g., rows and / or columns), the offset between the center of rotation of the head 110 and the nozzle array 125 can be along the X-axis (e.g., a row of holes 135), the Y-axis (e.g., a column of holes 135), and / or both the X-axis and the Y-axis (e.g., at an angle between the X-axis and the Y-axis). In some embodiments, the offset can be based on the pitch between adjacent holes. For example, the offset distance can be less than about 1x the pitch, less than or equal to 0.9x the pitch, less than or equal to 0.8x the pitch, less than or equal to 0.7x the pitch, less than or equal to 0.6x the pitch, less than or equal to 0.5x the pitch, less than or equal to 0.4x the pitch, less than or equal to 0.3x the pitch, or less.

[0035] In some embodiments, the head 110 and / or the nozzle array 125 can be laterally translated relative to another component, which can ensure that during the entire plating operation, the center-most hole 135 / pressurized jet will not remain in the same position relative to the center of the substrate. The head 110 and / or the nozzle array 125 can be laterally translated along the X-axis, the Y-axis and / or the X-axis and the Y-axis (for example, at an angle of 15°, 30°, 45°, 60°, 75°, etc.). In some embodiments, the offset can be based on the pitch between adjacent holes. For example, the offset distance can be less than about 1x of the pitch, less than or equal to 0.9x of the pitch, less than or equal to 0.8x of the pitch, less than or equal to 0.7x of the pitch, less than or equal to 0.6x of the pitch, less than or equal to 0.5x of the pitch, less than or equal to 0.4x of the pitch, less than or equal to 0.3x of the pitch or less.

[0036] In some embodiments, the arrangement of the holes 135 on the plate 130 can be designed to improve the uniformity of the mass transfer rate across the surface of the substrate. For example, in some embodiments, the holes 135 can be distributed over a majority of the plate 130 (e.g., at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, or more) with regular sizes and / or spacing / pitch, wherein the size and / or pitch between the holes 135 in the central region (e.g., inner 25%, inner 20%, inner 15%, inner 10%, inner 5%, or less) can be adjusted to address the mass transfer uniformity problem near the center of the substrate. For example, in the central region of the plate 130, the pitch can be reduced (e.g., the hole density can be reduced) and / or the cross-sectional area of ​​one or more holes 135 can be increased to help reduce the mass transfer rate in the central region, thereby improving the uniformity of the mass transfer rate across the surface of the substrate. For example, larger holes 135 can reduce the jet velocity and subsequently reduce the strain rate / mass transfer rate, while a smaller pitch can help provide better averageness of the mass transfer rate. In the region near the center of the substrate, the crossflow effect is less pronounced, which can allow a smaller hole pitch to be used in this region. It should be understood that any technique for improving mass transfer rate consistency can be used alone or in combination with other techniques to improve mass transfer rate consistency across the entire surface of the substrate.

[0037] The system 100 may include one or more power supplies 145 operable to deliver current to the nozzle array 125, which allows the electrolyte formed by the nozzle array 125 (e.g., via the holes 135) to deliver current to the substrate. For example, the system 100 may include an anode (not shown) below the plate 130 and / or the membrane. The current provided by the power supply 145 controls the flow of current from the anode to the cathode to plate the substrate. Since the holes 135 are used to conduct the current to the substrate, the holes 135 can be substantially uniformly distributed around the plate 130 to help ensure that the current density on the substrate is substantially constant (e.g., uniform to within 15%, within 10%, within 5%, within 3%, within 1%, or less). In some embodiments, a secondary cathode (e.g., a thief electrode) can be used to improve uniformity at the edge of the substrate.

[0038] Figure 2 and Figure 2AAn embodiment of a nozzle array 200 according to some embodiments of the present technology is shown. The nozzle array 200 can be used as a nozzle array in an electroplating system (such as the electroplating system 100) and any chamber or system that can benefit from the nozzle array 200. For example, the nozzle array 200 can be used as the nozzle array 125 and can be positioned inside a plating container below a substrate carrier head. The nozzle array 200 may include a plate 202, which is characterized by a first surface 204 (e.g., a top surface) and a second surface 206 (e.g., a bottom surface), and the second surface 206 may be opposite to the first surface 204. The plate 202 may define a plurality of holes 208 extending through the plate 202 and from the first surface 204 through the second surface 206. Each hole 208 may provide a fluid path through the plate 202, wherein a liquid electrolyte passes through the hole 208 to form a pressurized jet that can impact on a substrate located in the head of the electroplating system. In some embodiments, the hole 208 may have a substantially cylindrical cross-section. Although each hole 208 is shown here to extend substantially perpendicular to the first surface 204 and the second surface 206, it should be understood that other hole designs are also possible. For example, some or all of the holes 208 may be at an angle less than or greater than 90 degrees relative to the first surface 204 and / or the second surface 206. In some embodiments, non-vertical holes 208 may be used at some or more locations to adjust the impact angle of the resulting liquid electrolyte jet, which may enable the plate 202 to mitigate radial electrolyte flow problems. In some embodiments, each hole 208 may have a diameter (or other maximum lateral dimension) of not more than 1 mm, not more than 0.9 mm, not more than 0.8 mm, not more than 0.7 mm, not more than 0.6 mm, not more than 0.5 mm or less, but other hole sizes may be used in various embodiments. Smaller holes 208 may produce jets at higher speeds, thereby producing higher strain rates on the substrate.

[0039] In some embodiments, the conductance through each hole can be substantially equal. In other embodiments, one or more holes 208 can have different conductance values. All or substantially all of the holes 208 (e.g., at least 90%, at least 95%, at least 99%, all holes except one hole (e.g., the center-most hole), or all holes) can have equal or substantially equal (e.g., within 10%, within 5%, within 3%, within 1%, or less) conductance across the surface of the plate 202. In other embodiments, the holes 208 can be arranged to provide a variable conductance across the surface of the plate 202. For example, in some embodiments, the holes 208 can be distributed with regular sizes and / or spacing / pitch over a majority (e.g., at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, or more) of the plate 130, wherein the size and / or pitch between the holes 208 in a central region (e.g., inner 25%, inner 20%, inner 15%, inner 10%, inner 5%, or less) of the plate 202 is adjusted to address mass transfer consistency issues near the center of the substrate. For example, within the central region of the plate 202, the pitch can be increased (e.g., the hole density can be reduced) and / or the cross-sectional area of ​​one or more holes 208 can be reduced to help reduce the mass transfer rate in the central region, thereby improving the mass transfer rate consistency across the entire surface of the substrate. In some embodiments, within the central region of the plate 202, the pitch can be reduced (e.g., the hole density can be reduced) and / or the cross-sectional area of ​​one or more holes 208 can be increased to help reduce the mass transfer rate in the central region, thereby improving the mass transfer rate consistency across the entire surface of the substrate. For example, larger holes 208 can reduce the jet velocity and subsequently reduce the strain rate / mass transfer rate, while a smaller pitch can help provide better averageness of the mass transfer rate. In the region near the center of the substrate, the cross-flow effect is less pronounced, which can allow the use of a smaller hole pitch in this region.

[0040] Depending on the size of the plate 202 and the size of the holes 208, the plate 202 can define any number of holes 208 through the plate 202, such as greater than or about 100 holes, greater than or about 250 holes, greater than or about 500 holes, greater than or about 1,000 holes, greater than or about 2,000 holes, greater than or about 3,000 holes, greater than or about 4,000 holes, greater than or about 5,000 holes, greater than or about 6,000 holes, or more. As described above, the holes 208 can be included in a set of rings extending outward from the central axis of the plate 202, and can include any number of rings as previously described. The rings can be characterized by any number of shapes, including circular or elliptical, as well as any other geometric pattern such as rectangular, hexagonal, or any other geometric pattern that can include holes distributed in multiple rings radially outward. The holes can have uniform or staggered spacing (i.e., pitch) and can be spaced 3 mm to 15 mm or about 3 mm and 15 mm, 4 mm to 12 mm or about 4 mm and 12 mm, 5 mm to 10 mm or about 5 mm and 10 mm from center to center, although other pitches are possible in various embodiments.

[0041] As described above, the rings can be characterized by any geometric shape, and in some embodiments, the holes can be characterized by a scaling function of the holes with each ring. For example, in some embodiments, the first hole can extend through the center of the plate 202, such as along the central axis as shown. The holes of the first ring can extend around the central hole and can include any number of holes, such as between about 4 and about 10 holes, which can be equally spaced around the geometric shape extending through the center of each hole. The holes of any number of additional rings can extend radially outward from the first ring and can include holes whose number is a function of the number of holes in the first ring. For example, the number of holes in each successive ring can be characterized by the number of holes in each corresponding ring according to the equation XR, where X is the cardinality of the holes and R is the corresponding ring number. The cardinality of the holes can be the number of holes in the first ring, and in some embodiments can be some other number, as will be further described below, where the first ring has an increasing number of holes. For example, for an exemplary plate having 5 holes distributed around a first ring, and where 5 may be the cardinality of the holes, a second ring may be characterized by 10 holes (5×2), a third ring may be characterized by 15 holes (5×3), and a twentieth ring may be characterized by 100 holes (5×20). As previously described, this may continue for any number of rings of holes, such as up to, greater than, or about 50 rings.

[0042] In some embodiments, one or more holes 208 near the center of the plate 202 may be different from the other holes 208. For example, to avoid having one hole at the center of the plate 202 (which may result in higher mass transfer rates at or near the center of the substrate even if the substrate is rotated relative to the nozzle array 200), the center-most hole may be replaced with multiple smaller holes offset from the center of the plate 202. To help maintain consistent current density and strain rate across the surface of the substrate, the smaller holes may be sized to collectively deliver the same current rate and fluid flow rate as the single center hole 208. In some embodiments, the holes 208 may each include the same diameter, while in other embodiments, some or all of the holes 208 may have different diameters. For example, the diameter of the holes 208 near the center of the plate 202 may be a different size than the holes 208 away from the center of the plate 202, which may enable the conductance / flow rate to vary across the substrate to help average the strain rate across the surface of the substrate.

[0043] The liquid electrolyte may be delivered to the second surface 206 such that the liquid electrolyte is forced through the pores 208. Due to the small size of the pores 208, the liquid electrolyte passing through the pores 208 forms a pressurized jet extending from the first surface 204, which may be directed onto the surface of a substrate within a head, such as the head 110. The pressurized jet may increase the strain rate of the electrolyte on the substrate, and thus may increase the mass transfer rate of the plating operation.

[0044] In order to ensure that the plating rate is substantially consistent over the entire surface of the substrate, it may be desirable to maintain the current density on the substrate at a substantially consistent level over the entire surface of the substrate. In some embodiments, in order to ensure that the current density is consistent over the entire surface of the substrate, the positioning of the plate 202 relative to the head of the electroplating system and the positioning of the hole 208 on the plate 202 can be designed so that the ratio of the gap between the first surface 204 of the plate 202 and the bottom surface of the substrate and / or the head and the pitch between adjacent holes 208 on the plate 202 meets a specific threshold. For example, the ratio between the gap and the pitch can be at least about 1:1, at least about 1.1:1, at least about 1.25:1, at least about 1.5:1 or greater. This relationship can be maintained on all or most of the plates 202 and / or holes 208 (e.g., at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 97%, at least 99% or more).

[0045] In some embodiments, upon contacting the substrate, the pressurized jet of electrolyte can accumulate and scatter laterally outward from the substrate surface, thereby producing a cross-flow effect on at least a portion of the substrate surface, which can affect the consistency of mass transfer across the entire surface of the substrate because the cross-flow prevents the jet from impinging on the substrate surface in a consistent manner. To help reduce the cross-flow effect, the ratio between the pitch of the holes 208 on the plate 202 and the diameter of the holes 208 on the plate 202 can be at least 6:1, at least 6.5:1, at least 7:1, at least 7.5:1, at least 8:1, at least 8.5:1, at least 9:1, at least 9.5:1, at least 10:1, at least 11:1, at least 12:1, or greater. Such a ratio can ensure that there is sufficient space between adjacent jets to prevent any cross-flow from interfering with the impact of nearby jets. For example, the space between adjacent jets can provide a gap for the fluid flowing laterally outward to pass to the edge of the substrate without interfering with other jets. As will be described below at least in Figures 3 to 5 As discussed in , other techniques can be used to keep the current density substantially uniform across the surface of the substrate while reducing or minimizing cross-current effects.

[0046] Although the first surface 204 and the second surface 206 are shown to be planar, it should be understood that in some embodiments, one or both of the first surface 204 and the second surface 206 may be non-planar. For example, the first surface 204 may include one or more higher and lower regions, wherein the outlet ends of some of the holes 208 may be placed at different distances from the substrate. As just one example, the central portion of the first surface 204 may be higher (or closer to the substrate) than the outer portions of the first surface 204. Such adjustments can affect the strain rate and mass transfer across the surface of the substrate by increasing the strain rate in some regions and / or reducing the strain rate in other regions. In addition, the hole pitch can be varied across the plate 202 to control the strain rate and / or current uniformity across the surface of the substrate.

[0047] In some embodiments, each hole 208 can be designed to produce a turbulent jet of electrolyte. Turbulence can enhance mass transfer due to flow dynamics and due to enhanced turbulent diffusion. In some embodiments, the electrolyte flow in each hole 208 and the jet emitted from each hole 208 can be turbulent. In other embodiments, the jet can be turbulent even if the flow in the hole 208 has not yet fully reached fully developed turbulence. The flow in the hole 208 can be considered as a turbulent flow with a Reynolds number exceeding 2300. The Reynolds number depends on the tube speed and diameter and the fluid kinematic viscosity. For example, the Reynolds number can be equal to (Re=V*D / ν). The Re standard is for the fully developed state in the long hole 208, however, in some embodiments, the jet with a Reynolds number not exceeding 2300 emitted from the hole 208 can be turbulent. As described above, the hole length can be a factor in generating fully developed turbulence in the hole. As an example only, a hole 208 with a diameter of 1 mm can have a length of at least 16 mm or about 16 mm to produce fully developed turbulence. In the illustrated embodiment, the length of the holes 208 may be determined by the thickness of the plate 202. In such an embodiment, the transition to turbulent flow occurs above the entrance area of ​​each hole 208. It should be understood that other lengths are possible depending on the hole diameter and electrolyte viscosity.

[0048] Figure 3 and Figure 3A One embodiment of a nozzle array 300 according to some embodiments of the present technology is shown. The nozzle array 300 can be used as a nozzle array in an electroplating system (e.g., the electroplating system 100) and any chamber or system that can benefit from the nozzle array 300. For example, the nozzle array 300 can be used as the nozzle array 125 and can be positioned inside a plating container below a substrate carrier head. The nozzle array 300 can be similar to the nozzle array 200 and can include any features described with respect to the nozzle array 200. The nozzle array 300 can include a plate 302, which is characterized by a first surface 304 (e.g., a top surface) and a second surface 306 (e.g., a bottom surface), and the second surface 306 can be opposite to the first surface 304. The plate 302 can define a plurality of holes 308 that pass through the plate 302 and extend from the first surface 304 through the second surface 306. Each hole 308 may provide a fluid path through the plate 302, wherein liquid electrolyte passes through the hole 308 to form a pressurized jet that may impinge on a substrate located within a head of the electroplating system.

[0049] The plate 302 may include a plurality of tubes 310 extending upward from a first surface 304 (e.g., a top surface) of the plate 302. The tubes 310 may extend toward the bottom surface of the substrate and the head of the electroplating system. Each tube 310 may be aligned with a hole 308 and may partially define a hole 308. In some embodiments, the number of tubes 310 matches the number of holes 308 so that each hole 308 extends through a tube 310. This may position the outlet end of each hole 308 at a distance from the first surface 304 that matches the length or height of the tube 310, which may provide additional space (e.g., a groove formed between the tubes 310) to allow any cross flow to pass through without having a large impact on mass transfer rate consistency. The individual tubes 310 may have the same or different heights (e.g., the protruding distance from the first surface 304). For example, each tube 310 can have a height between 5mm to 20mm or about 5mm and 20mm, between 7.5mm to 15mm or about 7.5mm and 15mm, or between 10mm to 12mm or about 10mm and 12mm. Due to the presence of tube 310, the additional gap space produced between adjacent holes 308 can allow the use of a smaller hole pitch, and can not significantly affect the cross flow effect (for example, inconsistent mass transfer rate). For example, the pitch of hole 308 can be between 2mm to 12mm, between 3mm to 10mm, or between 5mm to 8mm from center to center, but other pitches are possible in various embodiments. Smaller pitch can make the gap between the outlet end of hole 208 and the substrate smaller (for example, based on the ratio of the gap disclosed above to the pitch). Smaller gap can also make the plating uniformity on the whole substrate better.

[0050] In order to ensure that the plating rate is substantially uniform across the entire surface of the substrate, it may be desirable to maintain the current density on the substrate at a substantially uniform level across the entire surface of the substrate. In some embodiments, to ensure that the current density is uniform across the entire surface of the substrate, the positioning of the plate 302 relative to the head of the electroplating system and the positioning of the holes 308 on the plate 302 may be designed so that the ratio of the gap between the outlet end of each hole 308 (e.g., the distal end of the tube 310) and the bottom surface of the substrate and / or the head to the pitch between adjacent holes 308 on the plate 302 meets a specific threshold. For example, the ratio between the gap and the pitch may be at least about 1:1, at least about 1.1:1, at least about 1.25:1, at least about 1.5:1, or greater. In some embodiments, the nozzle array 300 can be positioned so that the outlet end of each hole 308 is within 25 mm of the bottom surface of the substrate, within 20 mm of the substrate, within 15 mm of the substrate, within 10 mm of the substrate, within 8 mm of the substrate, within 7 mm of the substrate, within 6 mm of the substrate, within 5 mm of the substrate, or less. In some embodiments, the ratio of the gap to the diameter can also be at least 6: 1, at least 6.5: 1, at least 7: 1, at least 7.5: 1, at least 8: 1, at least 8.5: 1, at least 9: 1, at least 9.5: 1, at least 10: 1, at least 11: 1, at least 12: 1, or more. In order to improve the consistency across the substrate, it may be desirable to use a smaller gap, which can result in a smaller diameter of the hole (e.g., 1 mm or less). Smaller diameter holes can generate higher jet velocities, which can result in higher strain rates on the substrate surface. In some embodiments, high flow rates per hole (e.g., at least 0.01 gpm, at least 0.02 gpm, at least 0.03 gpm, at least 0.04 gpm, at least 0.05 gpm, or more) may be used. Longer tubes may make the flow within the holes / tubes turbulent, which may enhance the strain rate on the substrate. In some embodiments, plate 302 may be thinner than plate 202 while creating turbulent flow because tubes 310 may increase the length of each hole 308 to extend beyond the thickness of plate 302.

[0051] Figure 4 and Figure 4AOne embodiment of a nozzle array 400 according to some embodiments of the present technology is shown. The nozzle array 400 can be used as a nozzle array in an electroplating system (e.g., the electroplating system 100) and any chamber or system that can benefit from the nozzle array 400. For example, the nozzle array 400 can be used as the nozzle array 125 and can be positioned inside a plating container below a substrate carrier head. The nozzle array 400 can be similar to the nozzle array 200 and the nozzle array 300, and can include any features described with respect to the nozzle array 200 or the nozzle array 300. The nozzle array 400 can include a plate 402, which is characterized by a first surface 404 (e.g., a top surface) and a second surface 406 (e.g., a bottom surface), and the second surface 406 can be opposite to the first surface 404. The plate 402 can define a plurality of holes 408 that pass through the plate 402 and extend from the first surface 404 through the second surface 406. Each hole 408 may provide a fluid path through the plate 402, wherein liquid electrolyte passes through the hole 408 to form a pressurized jet that may impinge on a substrate located within a head of the electroplating system.

[0052] To help reduce cross-flow effects, the plate 402 may define a plurality of drain tubes 410 that pass through the thickness of the plate 402. In some embodiments, the bottom end of the drain tube 410 may extend beyond the second surface 406, for example, extending beyond the distance of the fluid supply source that pumps the electrolyte to the inlet end of the hole 408. This positioning can ensure that the electrolyte is not pumped upward through the drain tube 410. The drain tube 410 can be positioned around the plate 402 so that a portion of the liquid electrolyte can be discharged from the gap between the plate 402 and the substrate. For example, the drain tube 410 can collect and discharge the fluid circulating above the plate 402, rather than coupling with the fluid pump like the hole 408 and delivering the fluid jet to the substrate. This discharge can help reduce cross-flow effects that affect mass transfer consistency. The drain tube 410 can be positioned between some or all holes 408. In some embodiments, the drain tube 410 can be distributed over the entire surface of the plate 402, for example, between each ring or row of holes 408. In other embodiments, the drain tube 410 can be positioned at a specific radial position around the plate 402. As just one example, the drain holes 410 may be positioned at radial positions near the center of the plate 402 and / or within the middle region of the plate 402. For example, the drain holes 410 may be positioned within the inner 60%, inner 50%, inner 40%, inner 30%, inner 20%, inner 10%, inner 5%, or less of the plate 402, but in various embodiments, the drain holes 410 may be positioned at any radial position. The drain holes 410 may be positioned at regular angles and / or radial intervals around the plate 402. The drain holes 410 may have the same or different (e.g., smaller or larger) diameters as the holes 408. For example, in some embodiments, each drain hole 410 may have a larger diameter than each hole 408, which may allow fewer drain holes 410 to be used. In some embodiments, each drain hole 410 may have a diameter between or about 1 mm and 10 mm, between or about 2 mm and 8 mm, or between or about 4 mm and 6 mm.

[0053] Figure 5 and Figure 5AAn embodiment of a nozzle array 500 according to some embodiments of the present technology is shown. The nozzle array 500 can be used as a nozzle array in an electroplating system (e.g., electroplating system 100) and any chamber or system that can benefit from the nozzle array 500. For example, the nozzle array 500 can be used as the nozzle array 125 and can be positioned inside a plating container below a substrate carrier head. The nozzle array 500 can be similar to the nozzle array 200, the nozzle array 300, and the nozzle array 400, and can include any features described with respect to the nozzle array 200, the nozzle array 300, or the nozzle array 400. The nozzle array 500 can be a dual-channel array and can include a first plate 502, which can be characterized by a first surface 504 (e.g., a top surface) and a second surface 506 (e.g., a bottom surface), and the second surface 506 can be opposite to the first surface 504. The first plate 502 can be a top plate of the jet array 500 and can define a plurality of first holes 508 extending through the first plate 502 and from the first surface 504 through the second surface 506. Each first hole 508 can provide a fluid path through the first plate 502, wherein a liquid electrolyte passes through the first hole 508 to form a pressurized jet that can impinge on a substrate located within a head of the electroplating system.

[0054] The first plate 502 may define a plurality of second holes 510 through the first plate 502. The first holes 508 and the second holes 510 may form two different flow paths through the first plate 502. The second holes 510 may be positioned between some or all of the first holes 508. For example, the first holes 508 and the second holes 510 may be arranged in an alternating manner, wherein the second hole 510 is positioned within each gap between adjacent first holes 508 in one or two rows / rings of the first holes 508. In some embodiments, the first holes 508 and the second holes 510 may be arranged in the same row / ring, wherein the second hole 510 is located between each pair of adjacent first holes 508. In some such embodiments, the holes of adjacent rows / rings may be aligned such that along a given radial line, each row / ring includes only the first holes 508 or the second holes 510. In other such embodiments, the holes of adjacent rows / rings may be aligned such that along a given radial line, each row / ring alternates between the first holes 508 and the second holes 510. In some embodiments, the first holes 508 and the second holes 510 can be arranged in different alternating rows / rings, wherein the second holes 510 of a row / ring are located between the first holes 508 of each pair of adjacent rows / rings. In some such embodiments, the holes in each row can be aligned along the same radial line. In other such embodiments, the holes of adjacent rows / rings can be aligned so that the second hole 510 is arranged between four adjacent first holes 508 (e.g., two first holes 508 from a row / ring and two additional first holes 508 from adjacent rows / rings). It should be understood that the above arrangement is provided only as an example, and other arrangements are also possible. For example, the first hole 508 and the second hole 510 can be arranged in a non-alternating manner. In some embodiments, the arrangement of the first hole 508 and / or the second hole 510 can be substantially uniform and / or symmetrical, while in other embodiments, the arrangement of the first hole 508 and / or the second hole 510 can be uneven and / or asymmetrical.

[0055] In some embodiments, the number of first holes 508 can match or substantially match the number of second holes 510 (e.g., within 10%, within 5%, within 3%, within 1%, etc.). In other embodiments, the number of first holes 508 can be substantially different from the number of second holes 510 (e.g., more than 10%). The first holes 508 and the second holes 510 can have the same or different diameters. Similarly, the overall conductance and / or current conductance of the first holes 508 can be the same or substantially the same as the overall conductance and / or current conductance of the second holes 510 (e.g., within 10%, within 5%, within 3%, within 1%, etc.).

[0056] The nozzle array 500 may include a second plate 512, which may be characterized by a first surface 514 (e.g., a top surface) and a second surface 516 (e.g., a bottom surface), the second surface 516 may be opposite to the first surface 514. In some embodiments, a peripheral wall may couple the first plate 502 and the second plate 512. The second plate 512 may be a bottom plate of the nozzle array 500, and may define a portion of each second hole 510 passing through the second plate 512. The second plate 512 may be coupled to the first plate 502, such as coupled on the bottom side of the first plate 502. A plurality of tubes 518 may extend between the first plate 502 and the second plate 512. Each lumen 518 may be aligned with one second hole 510 and may partially define one second hole 51. The number of tubes 518 may match the number of second holes 510, such that each second hole 510 is defined by a corresponding lumen 518. In an embodiment having two plates, the inlet end of each first hole 508 can be formed through the second surface 506 of the first plate 502. The inlet end of each second hole 510 can be formed through the second surface 516 of the second plate 512. The outlet end of each first hole 508 and each second hole 510 can be formed through the first surface 504 of the first plate 502.

[0057] A plenum 520 may be defined between the first plate 502 and the second plate 512, for example forming a portion of the volume between the first plate 502 and the second plate 512, extending around the exterior of each lumen 518. The plenum 520 may form a portion of a flow path for pumping electrolyte through the first aperture 508. For example, Figure 5A As shown, the electrolyte can be introduced into the plenum 520, for example, through the lateral sides of the peripheral wall of the coupling plate and / or through a separate hole defined through the second plate 512. The electrolyte can fill the plenum 520 and be forced through the inlet of the first hole 508 to form a pressurized jet emitted from the outlet of the first hole 508. Similarly, the electrolyte can be introduced into the second surface 516 of the second plate 512 and forced through the inlet of the second hole 510 to form a pressurized jet emitted from the outlet of the second hole 510. The fluid pump (such as the fluid pump 140) of the electroplating system can independently control the flow of fluid to the first hole 508 and the second hole 510, so that the electrolyte can flow through one or two groups of holes at any given time. Similarly, the power supply (such as the power supply 145) can independently control the flow of current to the first hole 508 and the second hole 510, so that the same or different currents can flow through one or two groups of holes at any given time.

[0058] The use of the dual-channel nozzle array 500 can make the gap between the outlet of each hole and the substrate smaller, while also maintaining a small pitch between adjacent holes, which can improve the strain rate consistency and current density consistency on the entire surface of the substrate. For example, the electrolyte flow passing through the first hole 508 and the second hole 510 can be circulated so that the electrolyte only flows through a single group of holes at a given time. In an embodiment in which the first hole 508 and the second hole 510 are arranged around the first plate 502 in an alternating manner, this circulation can increase the effective pitch at a given moment, because only half of the holes on the first plate 502 convey the electrolyte jet at this moment. The increased pitch reduces the effect of the cross flow on the consistency of the strain rate. At a later time point, the other half of the holes on the first plate 502 can convey the electrolyte jet, which maintains a larger hole pitch. The circulation ensures that at some time points during the plating process, the holes at each radial position close to the substrate convey the electrolyte jet. Current can be provided to the substrate via an electrolyte (including a pressurized jet of an electrolyte).

[0059] By cyclically delivering electrolyte to different fluid channels (e.g., first holes 508 and second holes 510), nozzle array 500 can generally provide a hole pitch that can promote consistent strain rates across the substrate while being large enough to prevent and / or mitigate cross-flow effects. As just one example, first holes 508 and second holes 510 can be arranged around plate 502 in an alternating manner, such as a pitch of 5 mm (or some other small pitch) between adjacent first holes and second holes. This pitch value allows the use of a gap of approximately 5 mm. However, the pitch between two adjacent first holes 508 can be larger, such as 10 mm (or other first hole pitch). Similarly, the pitch between two adjacent second holes 510 can be larger, such as 10 mm (or other second hole pitch). Therefore, when only one set of holes (e.g., first holes 508) delivers electrolyte to the substrate, nozzle array 500 operates effectively with a larger 10 mm pitch. When the electrolyte circulates to be transported via another group of holes (e.g., the second hole 510), the nozzle array 500 operates effectively with a larger 10mm pitch. The larger 10mm flow pitch avoids the cross-flow effect that would be seen in the case of a smaller 5mm pitch. However, in general, the pitch is a smaller 5mm pitch, because both groups of holes have been used to transport electrolyte for a period of time (the time may be the same or different). Any number of such cycles may be used in various electroplating operations. In addition, due to the larger pitch at any given moment, the gap between the first plate 502 and the substrate / carrier head may be reduced while still maintaining the ratio of current density and strain rate that promotes uniformity on the entire surface of the wafer. For example, the gap between the first plate 502 and the substrate / carrier head may be less than 10mm, less than 9mm, less than 8mm, less than 7mm, less than 6mm, less than 5mm or less.

[0060] It should be understood that the jet arrays 200, 300, 400 and 500 are provided as examples only and that many variations are possible. In addition, various combinations of features from the example jet arrays (or other jet arrays) may be utilized in accordance with the present invention.

[0061] Figure 6 Exemplary operations in a method 600 for plating a substrate according to some embodiments of the present technology are shown. Method 600 can be performed using an electroplating system (such as electroplating system 100), which may include a nozzle array as described herein, such as nozzle array 200, nozzle array 300, nozzle array 400, or nozzle array 500. In some embodiments, method 600 may include operations before substrate plating. For example, before plating, one or more deposition and / or etching operations may be performed on the substrate and any planarization or other process operations may be performed. Method 600 may include multiple operations that can be automatically performed within the system to limit manual interaction and provide higher efficiency and precision than manual operation. Method 600 may be performed as part of a conventional plating process or in conjunction with a conventional plating process.

[0062] At operation 605, method 600 may include immersing the substrate in a liquid electrolyte disposed in a container. For example, the substrate may be fixed against a carrier head that moves downward relative to the container to immerse the substrate at least partially in the liquid electrolyte. At operation 610, the substrate may be sprayed with multiple jets of liquid electrolyte. For example, one or more fluid pumps may deliver a volume of liquid electrolyte to a nozzle array that is disposed in a container below the substrate and the carrier head. In some embodiments, the flow rate of the electrolyte delivered to the nozzle array may be constant, while in other embodiments, the flow rate may vary. For example, at different time points during the plating process, the flow rate may be pulsed between two or more different rates to help uniformly and / or otherwise control the strain rate on the substrate. The amount of time to maintain each flow rate may be the same or different, and in some embodiments, the flow rate may vary continuously throughout all or part of the plating process.

[0063] The nozzle array can be similar to the nozzle arrays described herein, such as nozzle array 200, nozzle array 300, nozzle array 400, and nozzle array 500. In some embodiments, such as when the nozzle array is a dual-channel nozzle array similar to nozzle array 500, ejecting the substrate can include ejecting the substrate with jets formed through a first subset of holes (e.g., first holes 508), ceasing to eject the substrate with jets formed through the first subset of holes, and ejecting the substrate with jets formed through a second subset of holes (e.g., second holes 510). As described above, such a process can make the effective pitch of the holes formed through the nozzle array large enough to mitigate any cross-flow effects that affect strain rate consistency, while still providing a sufficiently small hole pitch to effectively plate the entire surface of the substrate.

[0064] At operation 615, an ionic current may be conducted through the liquid electrolyte and / or the nozzle array. For example, one or more power supplies may apply an ionic current to the electrolyte, such as via one or more anodes or other electrodes. The ionic current may begin to plate the donor plating material onto one or more features formed on the surface of the substrate facing the nozzle array. The ionic current may be delivered to the substrate via holes formed in the plate (plates). The ionic current may be delivered before, during, and / or after the jet is ejected to the substrate.

[0065] In some embodiments, in order to contribute to the strain rate and mass transfer rate on the average substrate entire surface, the substrate and the nozzle array can rotate and / or translate laterally relative to each other. For example, the carrier head of the carrier substrate can rotate around the central axis and / or can translate back and forth laterally relative to the substrate. In some embodiments, instead of rotating and / or translating the carrier head, or in addition to rotating and / or translating the carrier head, the nozzle assembly can be rotated and / or translated laterally. The rotation and / or lateral movement of the substrate relative to the nozzle assembly can ensure that individual jets will not hit the substrate at a fixed position, which can achieve better plating uniformity. In some embodiments, the gap between the nozzle array and the substrate can be constant, and in other embodiments, the gap can be periodically changed during the plating process. For example, the carrier head and / or the nozzle array can be configured to translate vertically in the plating container, which can allow the gap between the nozzle array and the substrate to be adjusted before and / or during the plating operation. The time spent at each gap size can be the same or different, and in some embodiments, the gap can be continuously changed in all or part of the plating process.

[0066] In the foregoing description, for the purpose of explanation, many details have been set forth in order to provide an understanding of various embodiments of the present technology. However, it is apparent to one skilled in the art that certain embodiments may be practiced without some of these details or with additional details.

[0067] Several embodiments have been disclosed, and those skilled in the art will recognize that various modifications, alternative configurations, and equivalents may be used without departing from the spirit of the embodiments. In addition, in order to avoid unnecessarily obscuring the present technology, many well-known processes and elements are not described. Therefore, the above description should not be considered to limit the scope of the present technology.

[0068] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly or conventionally understood. As used herein, the article "a" refers to one or more than one (i.e., at least one) grammatical object of the article. For example, "an element" means an element or more than one element. When referring to measurable values ​​such as amount, duration, etc., "about" and / or "approximately" as used herein encompass changes from ±20% or ±10%, ±5% or +0.1% of a specified value, because such changes are suitable for the context of systems, devices, circuits, methods and other embodiments described herein. When referring to measurable values ​​such as amount, duration, physical properties (such as frequency), "substantially" as used herein also encompasses changes from ±20% or ±10%, ±5% or +0.1% of a specified value, because such changes are suitable for the context of systems, devices, circuits, methods and other embodiments described herein.

[0069] Where a numerical range is provided, it is understood that, unless the context clearly dictates otherwise, each intermediate value between the upper and lower limits of the range is also specifically disclosed, to the smallest fraction of the lower limit unit. Any narrower range between any described value or undescribed intermediate value in the range and any other described value or intermediate value in the range is contemplated. The upper and lower limits of these smaller ranges may be independently included in or excluded from the range, and each range in which any, no, or both limits are included in the smaller range is also included in the present technology, subject to any specifically excluded limits in the range. Where the range includes one or both of the limits, ranges excluding either or both of those included limits are also included.

[0070] As used herein and in the appended claims, the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a heater" includes a plurality of such heaters and reference to "a protrusion" includes reference to one or more protrusions and equivalents thereof known to those skilled in the art, and so forth.

[0071] In addition, when used in this specification and the appended claims, the words "comprises," "includes," "contains," "including," "has," and "comprising" are intended to specify the presence of stated features, integers, components, or operations, but they do not preclude the presence or addition of one or more other features, integers, components, operations, actions, or groups.

Claims

1. An electroplating system comprising: container; a head configured to hold a substrate, the head being positionable within the container; a spout array disposed within the interior of the container, the spout array comprising a plate defining a plurality of holes through a thickness of the plate; as well as At least one fluid pump is fluidly coupled to the inlet end of each of the plurality of apertures.

2. The electroplating system according to claim 1, wherein: The head is rotatable within the container; and The rotation center of the head is offset from the center of the nozzle array.

3. The electroplating system according to claim 1, wherein: The head is rotatable within the container; and One or both of the head and the spout array may be laterally translatable within the container.

4. The electroplating system according to claim 1, wherein: The plate includes a plurality of tubes extending upwardly from a top surface of the plate toward a bottom surface of the head; as well as Each of the plurality of tubes is aligned with and partially defines one of the plurality of apertures.

5. The electroplating system of claim 1, wherein: The panels include a first panel; The plurality of holes include a plurality of first holes and a plurality of second holes; The nozzle array includes a second plate coupled to the first plate on a bottom side of the first plate; an outlet end of each of the plurality of first holes and each of the plurality of second holes extending through a top surface of the first plate; an entrance end of each of the plurality of first holes extending through a bottom surface of the first plate; An inlet end of each of the plurality of second holes extends through the bottom surface of the second plate.

6. The electroplating system of claim 5, wherein: The plurality of first holes and the plurality of second holes are arranged in an alternating manner around the first plate.

7. The electroplating system of claim 5, wherein: a plurality of tubes extending between the first plate and the second plate; each of the plurality of tubes being aligned with and partially defining one of the plurality of second apertures; a plenum chamber defined between the first plate and the second plate; the plenum extending around an exterior of each of the plurality of tubes; as well as The at least one fluid pump is fluidly coupled to the plurality of first apertures via the plenum and is fluidly coupled to the plurality of second apertures via the bottom surface of the second plate.

8. The electroplating system of claim 1, wherein: The diameter of each of the plurality of holes is no greater than 1 mm.

9. The electroplating system of claim 1, wherein: The plate defines a plurality of discharge tubes.

10. The electroplating system of claim 1, wherein: A majority of the plurality of holes have a pitch ratio of at least 8; and A ratio of a gap between the plate and the substrate to a pitch of the plurality of holes is at least 1.

11. An electroplating system comprising: container; a head configured to hold a substrate, the head being positionable within the container; a spout array disposed within the interior of the container, the spout array comprising a plate defining a plurality of holes through a thickness of the plate; at least one fluid pump fluidly coupled to an inlet end of each of the plurality of apertures; as well as A power source is configured to provide electric current to the interior of the container.

12. The electroplating system of claim 11, wherein: The plurality of holes include a plurality of first holes forming a first fluid channel and a plurality of second holes forming a second fluid channel; the at least one fluid pump operable to independently control fluid flow to the plurality of first apertures and the plurality of second apertures; as well as The power source is operable to deliver current to the plurality of first apertures and the plurality of second apertures.

13. The electroplating system of claim 12, wherein: The power source is operable to independently control the amount of current delivered to the first plurality of apertures and the second plurality of apertures.

14. The electroplating system of claim 11, wherein: The average pitch of the plurality of holes is no greater than 12 mm.

15. The electroplating system of claim 14, wherein: When the head is in the plating position, the outlet end of each of the plurality of holes is within 25 mm of the bottom end of the head.

16. A method for plating a substrate, comprising: immersing the substrate in a liquid electrolyte disposed in a container; spraying the substrate with a plurality of jets of the liquid electrolyte, wherein each of the plurality of jets is defined to have a flow rate of at least 0.02 gallons per minute; and An ionic current is conducted through the liquid electrolyte.

17. The method of plating a substrate according to claim 16, wherein: The plurality of jets are generated by flowing a volume of the liquid electrolyte through a plurality of holes defined by a plate of a jet array.

18. The method of plating a substrate according to claim 17, wherein: The plate includes a plurality of tubes extending upward from a top surface of the plate toward the substrate; as well as Each of the plurality of tubes is aligned with and partially defines one of the plurality of apertures.

19. The method of plating a substrate according to claim 17, wherein: The plurality of holes include a plurality of first holes forming a first fluid channel and a plurality of second holes forming a second fluid channel.

20. The method of plating a substrate according to claim 19, wherein: Spraying the substrate includes: spraying the substrate with a jet formed only through the plurality of first holes; stopping spraying the substrate with jets formed through the plurality of first holes; and The substrate is sprayed with a jet formed only through the plurality of second holes.

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