Vapor chamber and processing method thereof

Abstract

The invention relates to the technical field of vapor chambers, in particular to a vapor chamber and a processing method thereof.The vapor chamber comprises a plate body internally provided with a first cavity, an opening communicated with the first cavity is formed in one surface of the plate body in the thickness direction, and the vapor chamber further comprises an impurity removing and guiding-out universal assembly; the impurity removing and guiding-out universal assembly comprises a connecting shaft and a sealing piece, the sealing piece is arranged at one end of the connecting shaft and abuts against the surface, provided with the open hole, of the plate body in a sealed mode, at least part of the connecting shaft penetrates through the open hole and stretches into the first cavity, and a guiding-out channel communicated with the first cavity is formed in the connecting shaft. According to the vapor chamber, the internal structure of the vapor chamber is optimized, and the impurity removal and lead-out universal assembly is adopted, so that a simpler, more convenient and more efficient processing flow is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of vapor chambers, and in particular to a vapor chamber and a processing method thereof. Background Art

[0002] In the prior art, the water injection structure usually requires punching out the water injection port feature on the heat spreader, and then using a tool or mechanical device to insert the copper tube into the water injection port, and applying UV glue to the connection between the copper tube and the water injection port to prevent the connection between the copper tube and the water injection port from loosening or leaking. Connect the injection equipment to the water injection port, and slowly inject the working liquid into the VC heat spreader. After the injection is completed, perform multiple impurity removal treatments. After the impurity removal treatment is completed, remove the excess part of the copper tube or heat spreader, and process or trim it.

[0003] However, the water injection port feature is punched out on the heat spreader, and then the copper tube is inserted into the water injection port. UV glue needs to be applied to the connection to cure. This series of steps is complicated and inefficient. Secondly, since the connection between the water injection port and the copper tube involves multiple components and links, the structure is relatively complex, which increases the risk of leakage. Once the connection becomes loose or not sealed tightly, the working liquid will leak, affecting the performance and life of the heat spreader. Finally, due to the cumbersome production steps and complex structure, precise tools and mechanical devices are required, which increases production costs. At the same time, the use and handling of UV glue also requires additional costs and time. Summary of the invention

[0004] In view of this, the present invention proposes a heat spreader and a processing method thereof, aiming to solve the above technical problems.

[0005] In one aspect, the present invention provides a vapor chamber, comprising a plate body having a first cavity disposed therein, an opening communicating with the first cavity disposed on a surface of the plate body in a thickness direction, and the vapor chamber further comprising: A general component for removing impurities and exporting them; the general component for removing impurities and exporting them comprises a connecting shaft and a sealing member, the sealing member is arranged at one end of the connecting shaft and is sealingly abutted against a surface of the plate body where the opening is arranged, at least a portion of the connecting shaft passes through the opening and extends into the first cavity, and a guide channel communicating with the first cavity is arranged in the connecting shaft.

[0006] In some embodiments of the present application, a sealing structure is provided on the connecting shaft to enable the sealing member to maintain sealing contact with a surface of the plate body.

[0007] In some embodiments of the present application, the sealing structure in place includes an end surface portion which is arranged at one end of the connecting shaft extending into the first cavity and can contact the cavity wall of the first cavity of the plate body.

[0008] In some embodiments of the present application, the sealing in place structure includes an annular limiting portion which is arranged at one end of the connecting shaft close to the plate body and can contact a surface of the plate body.

[0009] In some embodiments of the present application, a built-in groove is provided on an end surface of the annular limiting portion facing the plate body, at least a portion of the seal is disposed in the built-in groove, and the remaining portion of the seal protrudes from a notch of the built-in groove.

[0010] In some embodiments of the present application, one end of the connecting shaft extending into the first cavity is provided with a bypass opening that enables the outlet channel to communicate with the first cavity.

[0011] In some embodiments of the present application, the first cavity has a sealed flow channel chamber connected to the opening.

[0012] In some embodiments of the present application, the plate body includes an evaporation plate and a condensation plate, and the first cavity is formed inside after the edges of the evaporation plate and the condensation plate are fixed, the opening is provided on the condensation plate, and a sealing flow channel groove is provided on the inner surface of the condensation plate, and the sealing flow channel chamber is formed between the sealing flow channel groove and the evaporation plate when the edges of the evaporation plate and the condensation plate are fixed.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention optimizes the internal structure of the heat spreader and adopts a universal component for removing impurities and exporting, thereby realizing a simpler and more efficient processing flow. Specifically, the design of this component not only avoids the multiple tedious steps of stamping water injection port features, inserting copper tubes, and spot UV glue curing in the traditional process, but also realizes a more compact structural design by opening holes and matching the design of shafts and seals. At the same time, it eliminates the consumable copper tube and reduces production costs. In addition, the improved process flow is more concise and clear. Water is first injected and then a connecting shaft with a seal is used to press and form an intra-cavity seal. There is no need to perform the final tube cutting operation during the entire process, which further improves production efficiency.

[0014] Specifically, by designing a universal component for removing impurities, the impurities inside the heat spreader can be easily removed, thereby improving the reliability and service life of the heat spreader. The sealing abutment between the seal and the surface of the plate ensures the sealing inside the heat spreader and prevents leakage of the working medium. At the same time, the design of the sealed structure ensures a stable seal between the seal and the plate, improving the sealing performance of the heat spreader. In addition, by providing a bypass opening, the extraction channel and the first cavity can be smoothly connected, further ensuring the smooth extraction of impurities.

[0015] On the other hand, the present application also proposes a method for processing a vapor chamber, the method comprising the following steps: S1, fixing the plate body and injecting a set amount of water into the first cavity of the plate body through the opening; S2, placing the impurity removal and derivation universal component perpendicular to a surface of the plate in the thickness direction and making the sealing member of the impurity removal and derivation universal component seal and abut against a surface of the plate, and the connecting shaft of the impurity removal and derivation component communicates with the first cavity through the derivation channel; S3, performing multiple impurity removal treatments on the first cavity in succession while the sealing member in S2 is always in sealing contact with a surface of the plate body; S4, sealing the connection between the opening of the plate body and the first cavity in S3, and then removing the general component for removing impurities and exporting, so as to obtain a heat spreader.

[0016] In some embodiments of the present application, S3 includes the following steps: S30, connecting the air pump to the outlet channel and pumping air out of the first cavity in S2 to perform a first impurity removal process; S31, heating the plate in S30, so that the excess water vapor and non-condensable gas in the first cavity are discharged from the conducting channel.

[0017] It can be understood that the processing method of a vapor chamber provided in this embodiment has the same beneficial effects as the vapor chamber described above, and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings: Figure 1 A top view of a vapor chamber provided in an embodiment of the present invention; Figure 2 A bottom view of a vapor chamber provided in an embodiment of the present invention; Figure 3 The embodiment of the present invention provides Figure 2 Sectional view in the AA direction; Figure 4 The embodiment of the present invention provides Figure 3 The lower part of the structure diagram; Figure 5 An exploded view of the three-dimensional structure of a vapor chamber provided in an embodiment of the present invention; Figure 6 A schematic diagram of the three-dimensional structure of a connecting shaft provided in an embodiment of the present invention; Figure 7 The embodiment of the present invention provides Figure 6 sectional view of .

[0019] In the figure: 1. plate body; 11. evaporation plate; 12. condensation plate; 121. opening; 122. sealing flow channel groove; 13. first cavity; 14. sealing flow channel chamber; 2. connecting shaft; 21. outlet channel; 221. end face portion; 222. annular limiting portion; 23. built-in groove; 24. bypass opening; 3. sealing member. DETAILED DESCRIPTION

[0020] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features described in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0021] See also Figure 1-5 The present embodiment provides a vapor chamber, comprising a plate body 1 having a first cavity 13 disposed therein, an opening 121 communicating with the first cavity 13 disposed on one surface of the plate body 1 in the thickness direction, and the vapor chamber further comprising: A general component for removing impurities and exporting the impurities; the general component for removing impurities and exporting the impurities includes a connecting shaft 2 and a sealing member 3, the sealing member 3 is arranged at one end of the connecting shaft 2 and is sealingly abutted against a surface of the plate body 1 provided with an opening 121, at least a portion of the connecting shaft 2 passes through the opening 121 and extends into the first cavity 13, and a guide channel 21 connected to the first cavity 13 is provided in the connecting shaft 2.

[0022] It is understandable that in this embodiment, by setting the first cavity 13 inside the plate body 1 and setting the opening 121 connected to the first cavity 13 on the side surface of the plate body 1, the stamping water injection port feature can be avoided, the heat spreader structure can be simplified, and the production efficiency can be improved. Except for the introduction of the universal derivation component, through the coordinated use of the connecting shaft 2 and the seal 3, the seal 3 is sealed and abutted against the surface of the opening 121 of the plate body 1, ensuring the isolation of the inside of the first cavity 13 from the external environment, enhancing the sealing performance of the heat spreader, and avoiding problems such as coolant leakage. At least part of the connecting shaft 2 passes through the opening 121 and extends into the first cavity 13, so that the coolant or working medium inside the heat spreader can be replaced or maintained through the derivation channel 21, thereby improving the service life and reliability of the heat spreader.

[0023] In a specific embodiment of the present application, a sealing structure is provided on the connecting shaft 2 to enable the sealing member 3 to maintain sealing contact with a surface of the plate body 1 .

[0024] It can be understood that the sealing structure in this embodiment can ensure that the sealing member 3 forms an effective sealing contact with the surface of the plate body 1, thereby preventing liquid or gas leakage and improving the sealing performance and reliability of the vapor chamber. In addition, the sealing structure can also help maintain the sealing member 3 in the correct position and reduce the risk of sealing failure caused by vibration or displacement.

[0025] See also Figure 5-7 In a specific embodiment of the present application, the sealing structure includes an end surface portion 221 which is arranged at one end of the connecting shaft 2 extending into the first cavity 13 and can contact the cavity wall of the first cavity 13 of the plate body 1.

[0026] It can be understood that the sealing structure in this embodiment includes an end face portion 221 at one end of the connecting shaft 2 extending into the first cavity 13, and the end face portion 221 is in contact with the cavity wall of the first cavity 13. When the end face portion 221 is not in contact with the cavity wall of the first cavity 13, it indicates that the connecting shaft 2 is not set in place. The sealing structure in place ensures that the connecting shaft 2 is correctly set in the first cavity 13, thereby avoiding possible installation errors.

[0027] In a specific embodiment of the present application, the sealing structure includes an annular limiting portion 222 which is arranged at one end of the connecting shaft 2 close to the plate body 1 and can contact a surface of the plate body 1 .

[0028] It is understandable that the sealing structure in this embodiment includes an annular stopper 222 provided at one end of the connecting shaft 2 close to the plate body 1. The function of the annular stopper 222 is to limit the axial movement of the connecting shaft 2 and provide an additional sealing effect. The annular stopper 222 can ensure that the connecting shaft 2 and the plate body 1 maintain an appropriate contact pressure, thereby achieving a good sealing effect, and can also prevent the connecting shaft 2 from excessive displacement when subjected to external force, thereby ensuring the stability and accuracy of the connection.

[0029] In a specific embodiment of the present application, a built-in groove 23 is provided on one end surface of the annular limiting portion 222 facing the plate body 1, at least a portion of the seal 3 is arranged in the built-in groove 23, and the remaining portion of the seal 3 protrudes from the notch of the built-in groove 23.

[0030] Specifically, the single-sided cross-sectional diameter of the seal 3 in this embodiment is greater than the depth of the built-in groove 23, so that when the seal 3 is arranged in the built-in groove 23, the remaining part of the seal 3 can protrude from the notch of the built-in groove 23. When the connecting shaft 2 drives the annular limiting portion 222 to be pressed downward, pressure is applied to the seal 3, and then the seal 3 forms an intra-cavity seal for the first cavity 13.

[0031] Specifically, the sealing member 3 in this embodiment may be a sealing ring or a sealing gasket.

[0032] It can be understood that in this embodiment, the built-in groove 23 of the annular limiting portion 222 is provided with a seal 3, and part of the seal 3 protrudes from the notch of the built-in groove 23. The inner diameter of the seal 3 is greater than the depth of the built-in groove 23, so that the seal 3 partially protrudes outside the groove when installed. When the connecting shaft 2 drives the annular limiting portion 222 to press down, pressure is applied to the seal 3, so that the seal 3 forms an intra-cavity seal on the first cavity 13, thereby effectively preventing liquid or gas leakage and ensuring the sealing performance of the device.

[0033] In a specific embodiment of the present application, one end of the connecting shaft 2 extending into the first cavity 13 is provided with a bypass opening 24 that enables the outlet channel 21 to communicate with the first cavity 13 .

[0034] In a specific embodiment of the present application, one end of the connecting shaft 2 extending into the first cavity 13 does not contact the cavity wall of the first cavity 13 , and thus the connecting shaft 2 can be connected to the first cavity 13 through the outlet channel 21 .

[0035] Specifically, in this embodiment, the connection with the first cavity 13 is achieved through the outlet channel 21 and / or the bypass opening 24, and then the liquid injection or impurity removal treatment inside the heat spreader can be completed by connecting a water injection device or an air pump to the other end of the connecting shaft 2, thereby omitting the steps of punching the water injection port feature of the heat spreader, inserting the copper tube, dispensing glue and curing, and cutting the tube after all operations are completed.

[0036] It is understandable that in this embodiment, by providing the outlet channel 21 and the bypass opening 24, the first cavity 13 has a channel connected to the outside through the connecting shaft 2, thereby simplifying the liquid injection or impurity removal process inside the heat spreader, thereby avoiding the complicated steps of stamping the water injection port features, inserting the copper tube, dispensing and curing, and cutting the tube. Through the outlet channel 21 and / or the bypass opening 24 of the connecting shaft 2, it can be conveniently connected to a water injection device or an air pump, so as to achieve liquid filling or impurity removal inside the heat spreader, thereby improving the convenience and efficiency of operation.

[0037] See also Figure 2-5 In a specific embodiment of the present application, the first cavity 13 has a sealing flow channel chamber 14 connected to the opening 121.

[0038] In a specific embodiment of the present application, the plate body 1 includes an evaporation plate 11 and a condensation plate 12, and a first cavity 13 is formed inside the evaporation plate 11 and the condensation plate 12 after the edges are fixed, an opening is provided on the condensation plate 12, and a sealing flow channel groove 122 is provided on the inner surface of the condensation plate 12, and a sealing flow channel chamber 14 is formed between the sealing flow channel groove 122 and the evaporation plate 11 when the edges of the evaporation plate 11 and the condensation plate 12 are fixed.

[0039] Specifically, in this embodiment, a dot-shaped or strip-shaped protrusion is disposed on a side of the condensation plate 12 opposite to the evaporation plate 11 .

[0040] It can be understood that in this embodiment, the plate body 1 includes an evaporation plate 11 and a condensation plate 12, and the first cavity 13 is formed by edge sealing and fixing. The opening is set on the condensation plate 12, and the inner surface is provided with a sealing flow channel groove 122. When the edges of the evaporation plate 11 and the condensation plate 12 are fixed, a sealing flow channel chamber 14 is formed between the sealing flow channel groove 122 and the evaporation plate 11. After the liquid injection and impurity removal treatment are completed, the sealing flow channel chamber 14 is sealed, and then the impurity removal and diversion universal components can be removed. This structure can simplify the manufacturing process because the formation of the sealing flow channel chamber 14 is achieved by fixing the edge of the plate body 1, and no additional complex components or steps are required.

[0041] On the other hand, this embodiment also provides a method for processing a vapor chamber, the method comprising the following steps: S1, fixing the plate body and injecting a set amount of water into the first cavity of the plate body through the opening; S2, placing the impurity removal and derivation universal component perpendicular to a surface of the plate in the thickness direction and making the sealing member of the impurity removal and derivation universal component seal and abut against a surface of the plate, and the connecting shaft of the impurity removal and derivation universal component is connected with the first cavity through the derivation channel; S3, while the sealing member of S2 is always in sealing contact with a surface of the plate body, the first cavity is subjected to continuous multiple impurity removal treatments; S4, sealing the opening of the plate body in S3 and the connection point between the first cavity, and then removing the general component for removing impurities and exporting, so as to obtain the heat spreader.

[0042] Among them, S3 includes the following steps: S30, connecting the air pump to the outlet channel and pumping air out of the first cavity in S2 to perform the first impurity removal process; S31, heating the plate in S30, so that the excess water vapor and non-condensable gas in the first cavity are discharged from the conduction channel.

[0043] Specifically, in this embodiment, when the plate body is fixed and a set amount of water is injected into the first cavity of the plate body through the opening, water can be injected first and then the evaporation plate and the condensation plate are sealed and connected to form the plate body, or the evaporation plate and the condensation plate are sealed and connected to form the plate body and then water is injected into the first cavity inside, and finally the plate body is treated to remove impurities.

[0044] It can be understood that the processing method of the vapor chamber in this embodiment has the same beneficial effects as the vapor chamber described above, and will not be described in detail here.

[0045] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems or computer program products. Therefore, the present application may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0046] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0047] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0048] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents. Any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A heat spreader, comprising a plate body with a first cavity disposed therein, and an opening communicating with the first cavity disposed on a surface in a thickness direction of the plate body, characterized in that: The heat sink also includes: A general component for removing impurities and exporting them; the general component for removing impurities and exporting them comprises a connecting shaft and a sealing member, the sealing member is arranged at one end of the connecting shaft and is sealingly abutted against a surface of the plate body where the opening is arranged, at least a portion of the connecting shaft passes through the opening and extends into the first cavity, and a guide channel communicating with the first cavity is arranged in the connecting shaft.

2. A vapor chamber according to claim 1, characterized in that: The connecting shaft is provided with a sealing structure for keeping the sealing member in sealing contact with a surface of the plate body.

3. A vapor chamber according to claim 2, characterized in that: The sealing structure in place includes an end surface portion which is arranged at one end of the connecting shaft extending into the first cavity and can contact the cavity wall of the first cavity of the plate body.

4. A vapor chamber according to claim 2, characterized in that: The sealing structure comprises an annular limiting portion which is arranged at one end of the connecting shaft close to the plate body and can contact a surface of the plate body.

5. A vapor chamber according to claim 4, characterized in that: An end surface of the annular limiting portion facing the plate body is provided with a built-in groove, at least a portion of the sealing member is arranged in the built-in groove, and the remaining portion of the sealing member protrudes from the notch of the built-in groove.

6. A vapor chamber according to claim 2 or 3 or 4 or 5, characterized in that: One end of the connecting shaft extending into the first cavity is provided with a bypass opening that enables the outlet passage to communicate with the first cavity.

7. The vapor chamber according to claim 1, characterized in that: The first cavity has a sealing flow channel chamber communicated with the opening.

8. A vapor chamber according to claim 7, characterized in that: The plate body includes an evaporation plate and a condensation plate, and the first cavity is formed inside the evaporation plate and the condensation plate after their edges are fixed, the opening is provided on the condensation plate, and a sealing flow channel groove is provided on the inner surface of the condensation plate, and the sealing flow channel chamber is formed between the sealing flow channel groove and the evaporation plate when the edges of the evaporation plate and the condensation plate are fixed.

9. A method for processing a vapor chamber as claimed in any one of claims 1 to 8, characterized in that: The processing method comprises the following steps: S1, fixing the plate body and injecting a set amount of water into the first cavity of the plate body through the opening; S2, placing the impurity removal and derivation universal component perpendicular to a surface of the plate in the thickness direction and making the sealing member of the impurity removal and derivation universal component seal and abut against a surface of the plate, and the connecting shaft of the impurity removal and derivation universal component communicates with the first cavity through the derivation channel; S3, performing multiple impurity removal treatments on the first cavity in succession while the sealing member in S2 is always in sealing contact with a surface of the plate body; S4, sealing the connection between the opening of the plate body and the first cavity in S3, and then removing the general component for removing impurities and exporting, so as to obtain a heat spreader.

10. The method for processing a vapor chamber according to claim 9, characterized in that: The S3 comprises the following steps: S30, connecting the air pump to the outlet channel and pumping air out of the first cavity in S2 to perform a first impurity removal process; S31, heating the plate in S30, so that the excess water vapor and non-condensable gas in the first cavity are discharged from the conducting channel.

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