Continuous wafer cutting device

Abstract

The invention discloses a wafer continuous cutting device which comprises a machine body, a rotating assembly is arranged at the top of the machine body, and the rotating assembly is used for bearing a wafer and driving the wafer to rotate; a water tank is arranged at the bottom end in the machine body, a filtering assembly is arranged at the top of the water tank, the water inlet end of the filtering assembly is connected with the top end of the machine body, and the filtering assembly is used for filtering backflow water and filtering out chippings in the water; a fence is arranged on the edge of the top of the machine body, a supporting frame is arranged above the fence, a washing assembly is arranged on one side of the machine body, the bottom of the washing assembly is connected with the water tank, and the top end of the washing assembly is slidably connected with the fence. A driving assembly is arranged on one side of the top of the supporting frame and connected with a bearing plate, a laser cutter is inserted into the end, facing the machine body, of the bearing plate, an air cylinder is installed on the upper surface of the bearing plate, and the output end of the air cylinder is connected with the laser cutter and used for driving the laser cutter to move.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, in particular to a wafer continuous cutting device. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits, which plays a vital role in the manufacture of electronic devices. With the rapid development of electronic technology, the requirements for wafer processing accuracy and efficiency are getting higher and higher. Traditional wafer cutting methods mainly use methods such as diamond saw blades or laser cutting.

[0003] For example, a Chinese patent with publication number CN118700355A discloses a wafer continuous cutting device, including a driving motor, a connecting assembly, a slag suction assembly, a cutting knife group and an adjusting assembly; the driving motor is used to drive the slag suction assembly and the cutting knife group; the connecting assembly is arranged at the driving end of the driving motor, and the connecting assembly is used to transmit power to the slag suction assembly and the cutting knife group; the slag suction assembly is arranged on both sides of the cutting knife group, and the slag suction assembly is used to collect the residue generated when the cutting knife group cuts the wafer body. Through the setting of the slag suction assembly, the piston in the slag suction assembly moves in the suction pipe, thereby generating a suction force to suck the slag generated by cutting the wafer body, and the slag is collected by the slag storage box to prevent the slag from accumulating in front and behind the cutting knife group, and to prevent the slag from being blown to other positions to affect the quality of the wafer body.

[0004] The above patent provides a wafer continuous cutting device, but this cutting method mainly cleans the debris generated during the cutting process by suctioning the slag. However, this existing cutting method will generate a lot of heat during the cutting process. If the heat generated is not eliminated during the cutting process, it is easy to cause part of the wafer to be damaged due to overheating, thereby affecting the yield after the cutting is completed. Summary of the invention

[0005] The purpose of the present invention is to provide a wafer continuous cutting device, which aims to improve the existing cutting method that generates a large amount of heat during the cutting process. If the heat generated is not eliminated during the cutting process, it is easy to cause part of the wafer to be damaged due to overheating, thereby affecting the yield after the cutting is completed.

[0006] The present invention is achieved in that: A wafer continuous cutting device comprises a body, a rotating assembly is provided on the top of the body, and the rotating assembly is used to support the wafer and drive the wafer to rotate; a water tank is provided at the bottom end of the body, a filter assembly is provided on the top of the water tank, the water inlet end of the filter assembly is connected to the top of the body, and the filter assembly is used to filter the returned water and filter out the debris in the water; a fence is provided on the top edge of the body, a support frame is provided above the fence, a flushing assembly is provided on one side of the body, the bottom of the flushing assembly is connected to the water tank, and the top of the flushing assembly is slidably connected to the fence; a driving assembly is provided on one side of the top of the support frame, and the driving assembly is connected to a supporting plate, a laser cutter is plugged into the end of the supporting plate facing the body, and a cylinder is installed on the upper surface of the supporting plate, and the output end of the cylinder is connected to the laser cutter to drive the position of the laser cutter to move.

[0007] Preferably, a control panel is provided on the front of the body, and supporting feet are provided at the corners of the bottom surface of the body; a water suction pipe is provided on the side of the body aligned with the bottom of the water tank, a throttle valve is provided on the water suction pipe, and a connecting slot is provided on one side of the body; a second bearing is provided in the middle of the top of the body, a first guide port is provided on the side of the enclosure, a second guide port is provided on the top of the support frame aligned with the first guide port, adapters are provided at both front and rear ends of the second guide port, and a first bearing is provided in the middle of the adapter; a reflux hole is provided at the top of the body near the edge, a reflux pipe is connected to the bottom of the reflux hole, a water inlet is provided on the top of the water tank, a sealing cover is provided at the water inlet, and a filter cartridge is connected to the top of the water tank, one end of the filter cartridge is open, and an adapter ring is provided at the open end of the filter cartridge.

[0008] Preferably, the rotating assembly includes a bearing tray and a rotating motor, a connecting shaft is provided at the bottom of the bearing tray, a transmission slot is provided at the bottom end of the connecting shaft, a plurality of mounting feet are provided at one end of the rotating motor that is attached to the body, a mounting hole is provided in the middle of the mounting foot, the output end of the rotating motor is plugged into the transmission slot, and a junction box is provided at the bottom of the rotating motor, a first wire is provided at the bottom of the junction box, and a first plug connector is provided at the end of the first wire.

[0009] Preferably, the filter assembly includes a guide tube and a filter element, the top end of the guide tube is provided with a connecting cap, and the connecting cap is connected to the bottom end of the return tube; the bottom end of the guide tube is provided with an end cover, the middle part of the end cover is provided with a mounting ring, the end of the filter element is provided with a connecting ring, the connecting ring and the mounting ring are threadedly connected, and the end cover and the adapter ring are threadedly connected.

[0010] Preferably, the flushing assembly includes a water pipe and a water pump, a water spray head is provided at the top of the water pipe, the water spray head is installed on the inner side of the first guide port, and limit rings are provided on the sides of the water spray head that are in contact with the inner and outer surfaces of the enclosure, a second wire is provided on the side of the water pump, a second plug connector is provided at the end of the second wire, and fixing plates are symmetrically provided on both sides of one end of the water pump that is in contact with the body, and a plurality of fixing holes are provided on the fixing plates; two external pipes are symmetrically provided at the output end of the water pump, and adapter caps are provided at the ends of the external pipes, and the two external pipes serve as the water suction end and the discharge end of the water pump respectively.

[0011] Preferably, the driving assembly includes a transmission screw and a driving motor, both ends of the transmission screw are provided with connecting shafts, the connecting shafts are interference connected with the first bearing, a driving slot is provided at one end of the transmission screw facing the driving motor, and the output end of the driving motor is connected to the driving slot; a plurality of connecting feet are provided at one end of the output end of the driving motor that is attached to the support frame, and the connecting feet are provided with connecting holes.

[0012] Preferably, a connecting block is provided at the bottom of the support plate, a threaded hole is provided on the connecting block, and the threaded hole is connected to the transmission screw; a guide hole is provided in the middle of the support plate, and a connecting rod is provided at the bottom end of the support plate, a ring is provided at the bottom of the connecting rod, and a tail plate is provided at the end of the upper surface of the support plate away from the machine body, and a through hole is provided in the middle of the tail plate.

[0013] Preferably, a camera and a laser cutting head are arranged side by side at the bottom end of the laser cutter, and a connecting plate is provided at the end of the laser cutter close to the body, a countersunk hole is provided in the middle of the connecting plate, and an insert plate is provided at the end of the laser cutter away from the body, and the insert plate is plugged into the inner side of the guide socket; an MCU control module is provided inside the laser cutter, and the MCU control module is connected to an image acquisition module, an image feature extraction module, a damage position determination module, a recording module and a route planning module; the image acquisition module is used to acquire images of the cut wafer, and the image feature extraction module is used to extract images of the cut wafer; the damage position determination module is used to analyze the features of the image to determine the location of the wafer damage; the recording module is used to record the location of the wafer breakage, and the route planning module is used to plan the cutting route according to the location of the wafer damage.

[0014] Preferably, a telescopic rod is provided at the output end of the cylinder, a limit plate is provided at the end of the telescopic rod, a first stud is provided in the middle of the limit plate, and a first pressure cap is provided at one end of the first stud passing through the countersunk hole; a second stud is provided at the other end of the cylinder, and a second pressure cap is provided at one end of the second stud passing through the through hole.

[0015] Preferably, it also includes an inspection cover, wherein an inspection port is provided on the back of the machine body, a pressing edge is provided on the edge of the inspection cover, bolt holes are provided at the corners of the pressing edge, bolts are connected to the machine body through the bolt holes, and a plurality of heat dissipation holes are evenly provided on the inspection cover.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention arranges a water tank and a filter device inside the machine body, and then uses a flushing component to pump water from the water tank to flush the wafer along the cutting path, so that the debris generated by cutting on the wafer can be flushed away. At the same time, the flushed debris will flow back into the filter element to be filtered out, and the clean water will return to the water tank to facilitate the recycling of the water in the water tank. The water jet sprayed by the flushing component can not only take away the heat generated during the laser cutting process, reduce the temperature of the cutting area, and reduce the thermal impact, but also use the impact force of water to remove the debris and dust generated by cutting, preventing them from scratching and contaminating the cutting surface. In addition, the water jet can also focus and enhance the laser beam to a certain extent, thereby improving the laser cutting accuracy and efficiency.

[0017] 2. The present invention installs a camera at the bottom of the laser cutter body, collects images of the wafer through the camera, and analyzes whether there is a damaged position on the wafer. If there is a damaged position on the wafer, the data will be transmitted to the control end, and the cutting laser will be controlled by the control end to skip the damaged position of the wafer.

[0018] 3. The present invention provides an inspection cover on the back of the machine body, which makes it convenient for workers to inspect the parts inside the machine body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the present invention as a whole at the rear end oblique top view; Figure 2 It is a schematic diagram of the structure of the present invention as a whole at the front oblique top view; Figure 3 It is a schematic diagram of the structure of the machine body of the present invention at the front oblique downward angle; Figure 4 It is a schematic structural diagram of the machine body of the present invention at an oblique downward angle at the rear end; Figure 5 It is a structural schematic diagram of the rotating assembly of the present invention; Figure 6 is a schematic structural diagram of the filter assembly of the present invention; Figure 7 It is a schematic diagram of the structure of the flushing assembly of the present invention; Figure 8 is a schematic diagram of the structure of the drive assembly of the present invention; Fig. 9 It is a structural schematic diagram of the support plate of the present invention; Fig.10 It is a schematic diagram of the structure of the laser cutter of the present invention; Fig.11 It is a block diagram of the internal structure of the laser cutter of the present invention; Fig.12 It is a structural schematic diagram of the cylinder of the present invention; Fig.13 It is a structural schematic diagram of the inspection cover of the present invention.

[0020] In the figure: 1, body; 11, control panel; 12, support foot; 13, water suction pipe; 131, throttle valve; 132, connecting slot; 14, enclosure; 141, first guide port; 142, support frame; 143, second guide port; 144, adapter; 145, first bearing; 15, second bearing; 16, reflux hole; 161, reflux pipe; 17, water tank; 171, water inlet; 172, cover; 173, filter cartridge; 174, Adapter ring; 18, inspection port; 2, rotating assembly; 21, bearing tray; 211, connecting shaft; 212, transmission slot; 22, rotating motor; 221, mounting foot; 222, mounting hole; 223, junction box; 224, first conductor; 225, first plug connector; 3, filter assembly; 31, flow guide tube; 311, end cover; 312, mounting ring; 313, connecting cap; 32, filter element; 321, connecting ring; 4, flushing assembly; 41 , water pipe; 411, sprinkler head; 412, limit ring; 42, water pump; 421, second wire; 422, second plug connector; 423, fixing plate; 424, fixing hole; 425, external pipe; 426, adapter cap; 5, drive assembly; 51, drive screw; 511, connecting shaft; 512, drive slot; 52, drive motor; 521, connecting foot; 522, connecting hole; 6, supporting plate; 61, connecting block; 62, threaded hole ; 63. Guide socket; 64. Connecting rod; 65. Ring; 66. Tail plate; 67. Perforation; 7. Laser cutter; 71. Laser cutting head; 72. Camera; 73. Connecting plate; 74. Countersunk hole; 75. Insert plate; 8. Cylinder; 81. Telescopic rod; 82. Limiting plate; 83. First stud; 84. First pressure cap; 85. Second stud; 86. Second pressure cap; 9. Inspection cover; 91. Heat dissipation hole; 92. Pressure edge; 93. Bolt hole. DETAILED DESCRIPTION

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] The following is a further description with reference to the accompanying drawings and specific embodiments: like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a wafer continuous cutting device includes a body 1, a rotating assembly 2 is provided on the top of the body 1, and the rotating assembly 2 is used to support the wafer and drive the wafer to rotate; a water tank 17 is provided at the bottom of the body 1, and the water tank 17 is used to store water, so as to facilitate flushing the wafer being cut. A filter assembly 3 is provided on the top of the water tank 17, and the water inlet end of the filter assembly 3 is connected to the top of the body 1. The filter assembly 3 is used to filter the backflow water and filter out the debris in the water; a fence 14 is provided on the top edge of the body 1, and the fence 14 prevents the water that flushes the wafer from flowing out of the body 1. A support frame 142 is provided above the fence 14, and a flushing assembly 4 is provided on one side of the body 1, and the bottom of the flushing assembly 4 is connected to the water tank 17, and the top of the flushing assembly 4 is slidably connected to the fence 14; it is convenient for the flushing assembly 4 to move on the fence 14 to flush the wafer. A driving assembly 5 is provided on one side of the top of the support frame 142, and the driving assembly 5 is connected to a supporting plate 6. A laser cutter 7 is plugged into one end of the supporting plate 6 facing the body 1, and the driving assembly 5 is convenient for driving the laser cutter 7 and the supporting plate 6 to move. A cylinder 8 is installed on the upper surface of the supporting plate 6, and the output end of the cylinder 8 is connected to the laser cutter 7, which is used to drive the position of the laser cutter 7 to move, so that the laser cutter 7 can cut the wafer.

[0023] like Figure 3 and Figure 4As shown, a control panel 11 is provided on the front of the body 1, and the control panel 11 is convenient for controlling the operation of the entire device. Support feet 12 are provided at the corners of the bottom surface of the body 1, and the support feet 12 are convenient for the stable placement of the body 1; a water suction pipe 13 is provided on the side of the body 1 aligned with the bottom of the water tank 17, and the water suction pipe 13 is convenient for use with the water suction end of the water pump 42. A throttle valve 131 is provided on the water suction pipe 13, and the throttle valve 131 is convenient for controlling the opening and closing of the water suction pipe 13. A connecting slot 132 is provided on one side of the body 1, and the connecting slot 132 is convenient for use with the flushing component 4, and convenient for the flushing component 4 to be connected to the body 1; a second bearing 15 is provided in the middle of the top of the body 1, and the second bearing 15 is convenient for cooperation with the rotating component 2, and convenient for the stable rotation of the rotating component 2. A first guide opening 141 is provided on the side of the enclosure 14, and the first guide opening 141 is convenient for guiding the top of the flushing assembly 4; a second guide opening 143 is provided at the top of the support frame 142 aligned with the first guide opening 141, and the second guide opening 143 is convenient for installing the driving assembly 5. Adapters 144 are provided at both the front and rear ends of the second guide opening 143, and a first bearing 145 is provided in the middle of the adapter 144; the adapter 144 and the first bearing 145 are convenient for rotationally connecting with the transmission screw 51. A reflux hole 16 is provided at the top of the body 1 near the edge, and a reflux pipe 161 is connected to the bottom of the reflux hole 16. The reflux hole 16 cooperates with the reflux pipe 161 to facilitate the flushing wastewater to flow smoothly into the filter assembly 3. A water inlet 171 is provided at the top of the water tank 17, and a cover 172 is provided at the water inlet 171. The water inlet 171 is convenient for ensuring the stability of the water inside the water tank 17. A filter cartridge 173 is connected to the top of the water tank 17, and one end of the filter cartridge 173 is open, so that the filter cartridge 173 is convenient for installing the filter assembly 3. An adapter ring 174 is provided at the open end of the filter cartridge 173, and the adapter ring 174 is convenient for being threadedly connected to the filter assembly 3.

[0024] like Figure 5 As shown, the rotating assembly 2 includes a tray 21 and a rotating motor 22, and the tray 21 is convenient for supporting the wafer. A connecting shaft 511211 is provided at the bottom of the tray 21, and the connecting shaft 511211 is convenient for the second bearing 15 of the tray 21 to rotate and connect. A transmission slot 212 is provided at the bottom of the connecting shaft 511211, and the transmission slot 212 is convenient for the output end of the rotating motor 22 to be connected with the connecting shaft 511211. A plurality of mounting feet 221 are provided at one end of the rotating motor 22 that fits the body 1, and a mounting hole 222 is provided in the middle of the mounting foot 221. The cooperation between the mounting foot 221 and the mounting hole 222 is convenient for fixing the position of the rotating motor 22. The output end of the rotating motor 22 is plugged into the transmission slot 212, and the rotating motor 22 is convenient for driving the tray 21 to rotate. A junction box 223 is provided at the bottom of the rotating motor 22 , a first wire 224 is provided at the bottom of the junction box 223 , and a first plug connector 225 is provided at the end of the first wire 224 . The junction box 223 cooperates with the first wire 224 and the first plug connector 225 to facilitate powering the rotating motor 22 .

[0025] like Figure 6 As shown, the filter assembly 3 includes a guide tube 31 and a filter element 32. A connecting cap 313 is provided at the top of the guide tube 31. The guide tube 31 cooperates with the connecting cap 313 to facilitate the connection between the guide tube and the return pipe 161. The connecting cap 313 is connected to the bottom end of the return pipe 161; the bottom end of the guide tube 31 is provided with an end cap 311, which is convenient for connecting with the filter cartridge 173. A mounting ring 312 is provided in the middle of the end cap 311, and a connecting ring 321 is provided at the end of the filter element 32. The connecting ring 321 and the mounting ring 312 are threadedly connected. This structure facilitates the disassembly and use of the filter element 32. The end cap 311 is threadedly connected to the adapter ring 174.

[0026] like Figure 7 As shown, the flushing assembly 4 includes a water pipe 41 and a water pump 42. The water pipe 41 is convenient for cooperating with the water pump 42 to lead water to the top of the machine body 1. A water spray head 411 is provided at the top of the water pipe 41. The water spray head 411 is installed on the inner side of the first guide port 141, and the side of the water spray head 411 is fitted on both sides of the inner and outer surfaces of the enclosure 14. The water spray head 411 is convenient for emitting a water jet, so as to achieve the purpose of cleaning the surface of the wafer. A second wire 421 is provided on the side of the water pump 42, and a second plug connector 422 is provided at the end of the second wire 421. The cooperation between the second wire 421 and the second plug connector 422 is convenient for connecting the water pump 42 and the machine body 1. A fixing plate 423 is symmetrically provided on both sides of one end of the water pump 42 that fits the machine body 1, and a plurality of fixing holes 424 are provided on the fixing plate 423; the cooperation between the fixing plate 423 and the fixing hole 424 is convenient for fixing the position of the water pump 42 by bolts. Two external pipes 425 are symmetrically provided at the output end of the water pump 42, and a conversion cap 426 is provided at the end of the external pipe 425. The two external pipes 425 serve as the water suction end and the discharge end of the water pump 42 respectively. This structure facilitates the water pump 42 to pump water from the water tank 17 and pump the water in the water tank 17 into the water pipe 41 and spray it out from the nozzle.

[0027] like Figure 8 As shown, the driving assembly 5 includes a driving screw 51 and a driving motor 52, and the driving motor 52 is used to drive the driving screw to rotate. Both ends of the driving screw 51 are provided with connecting shafts 511211, and the connecting shafts 511211 are interference-connected with the first bearing 145. This structure facilitates the rotation of the driving screw 51. A driving slot 512 is provided at one end of the driving screw 51 facing the driving motor 52, and the output end of the driving motor 52 is connected to the driving slot 512; it is convenient for the driving motor 52 to drive the driving screw 51 to rotate. A plurality of connecting feet 521 are provided at one end of the output end of the driving motor 52 that is attached to the support frame 142, and a connecting hole 522 is provided on the connecting foot 521. The cooperation between the connecting foot 521 and the connecting hole 522 is convenient for fixing the position of the driving motor 52 by bolts.

[0028] like Fig. 9As shown, a connecting block 61 is provided at the bottom of the support plate 6, and a threaded hole 62 is provided on the connecting block 61, and the threaded hole 62 is connected to the transmission screw 51; this structure is convenient for the support plate 6 to be stably used with the driving assembly 5. The connecting block 61 cooperates with the threaded hole 62, and a guide socket 63 is provided in the middle of the support plate 6, and the guide socket 63 is convenient for the support plate 6 to be connected with the laser cutter 7. A connecting rod 64 is provided at the bottom of the support plate 6, and a collar 65 is provided at the bottom of the connecting rod 64. The connecting rod 64 cooperates with the collar 65 to be conveniently connected to the water spray head 411. A tail plate 66 is provided at one end of the upper surface of the support plate 6 away from the body 1, and a through hole 67 is provided in the middle of the tail plate 66. The cooperation between the tail plate 66 and the through hole 67 is convenient for the support plate 6 to be connected with the cylinder 8.

[0029] like Fig.10 and Fig.11 As shown, a camera 72 and a laser cutting head 71 are arranged side by side at the bottom of the laser cutter 7. The camera 72 is convenient for collecting images, and the laser gas cutting head is convenient for cutting the filter element 32. A connecting plate 73 is provided at one end of the laser cutter 7 close to the body 1, and a countersunk hole 74 is provided in the middle of the connecting plate 73. The cooperation between the connecting plate 73 and the countersunk hole 74 is convenient for the laser cutter 7 to be connected to the cylinder 8. An insert plate 75 is provided at one end of the laser cutter 7 away from the body 1, and the insert plate 75 is plugged into the inner side of the guide socket 63; an MCU control module is provided inside the laser cutter 7, and the MCU control module is connected with an image acquisition module, an image feature extraction module, a damage position determination module, a recording module and a route planning module; the image acquisition module is used to collect images of the cut wafer, and the image feature extraction module is used to extract images of the cut wafer; the damage position determination module is used to analyze the characteristics of the image to determine the location of the wafer damage; the recording module is used to record the location of the wafer breakage, and the route planning module is used to plan the cutting route according to the location of the wafer damage.

[0030] like Fig.12 As shown, a telescopic rod 81 is provided at the output end of the cylinder 8, and the telescopic rod 81 is convenient for driving the laser cutter 7 to move left and right. A limit plate 82 is provided at the end of the telescopic rod 81, and a first stud 83 is provided in the middle of the limit plate 82. One end of the first stud 83 passing through the countersunk hole 74 is provided with a first pressure cap 84; the limit plate 82 cooperates with the first stud 83 and the first pressure cap 84 to facilitate the telescopic rod 81 to be stably connected to the laser cutter 7. A second stud 85 is provided at the other end of the cylinder 8, and one end of the second stud 85 passing through the through hole 67 is provided with a second pressure cap 86. The second stud 85 cooperates with the second pressure cap 86 to facilitate the cylinder 8 to be stably connected to the supporting plate 6.

[0031] Working principle: When in use, the wafer to be cut is placed on the support tray 21 according to the use requirements, and then the machine body 1 is operated so that the driving motor 52 drives the support plate 6 and the laser cutter 7 to move forward and backward through the transmission screw 51, and stops after moving a certain distance, and then the cylinder 8 drives the laser cutter 7 to move left and right, so that the laser cutter 7 cuts the wafer, and during the cutting process, the water pump 42 pumps out the water in the water tank 17 and sprays a water jet along the laser cutting route, and the high temperature generated by the laser cutting is treated by the water jet. The washed debris enters the guide tube 31 and the filter element 32 through the return pipe 161, and is filtered by the filter element 32, so that the debris is retained in the filter element 32, and the clean water flows back to the water tank 17, so that the water in the water tank 17 can be recycled; in the process of cutting, if the wafer is cut from one side to the other side, the driving motor 52 will drive the support plate 6 and the laser cutter 7 to continue to move forward a certain distance, and then the cylinder 8 will continue to drive the laser cutter 7 to cut the wafer. In the process of cutting, the camera 72 will take pictures of the wafer, and judge whether the wafer has abnormal parts by analyzing the pictures. If the wafer has abnormal parts, it is judged that the parts are damaged, and the position is skipped in the cutting route to avoid cutting the broken parts of the wafer. Compared with the prior art, the present application provides a water tank 17 and a filter device inside the machine body 1, and then uses the flushing component 4 to pump the water in the water tank 17 to flush the wafer along the cutting path, so that the debris generated by cutting on the wafer can be flushed away, and at the same time, the flushed debris will flow back into the filter element 32 to be filtered out, and the clean water will return to the water tank 17 to facilitate the recycling of the water in the water tank 17. The water jet sprayed by the flushing component 4 can not only take away the heat generated during the laser cutting process, reduce the temperature of the cutting area, and reduce the thermal impact, but also use the impact force of water to remove the debris and dust generated by cutting, preventing them from scratching and contaminating the cutting surface. In addition, the water jet can also play a certain focusing and enhancement role on the laser beam, improving the laser cutting accuracy and efficiency.

[0032] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, a wafer continuous cutting device includes a body 1, a rotating assembly 2 is provided on the top of the body 1, and the rotating assembly 2 is used to support the wafer and drive the wafer to rotate; a water tank 17 is provided at the bottom of the body 1, and the water tank 17 is used to store water, so as to facilitate flushing the wafer being cut. A filter assembly 3 is provided on the top of the water tank 17, and the water inlet end of the filter assembly 3 is connected to the top of the body 1. The filter assembly 3 is used to filter the backflow water and filter out the debris in the water; a fence 14 is provided on the top edge of the body 1, and the fence 14 prevents the water that flushes the wafer from flowing out of the body 1. A support frame 142 is provided above the fence 14, and a flushing assembly 4 is provided on one side of the body 1, and the bottom of the flushing assembly 4 is connected to the water tank 17, and the top of the flushing assembly 4 is slidably connected to the fence 14; it is convenient for the flushing assembly 4 to move on the fence 14 to flush the wafer. A driving assembly 5 is provided on one side of the top of the support frame 142, and the driving assembly 5 is connected to a supporting plate 6. A laser cutter 7 is plugged into one end of the supporting plate 6 facing the body 1, and the driving assembly 5 is convenient for driving the laser cutter 7 and the supporting plate 6 to move. A cylinder 8 is installed on the upper surface of the supporting plate 6, and the output end of the cylinder 8 is connected to the laser cutter 7, which is used to drive the position of the laser cutter 7 to move, so that the laser cutter 7 can cut the wafer.

[0033] like Figure 3 and Figure 4As shown, a control panel 11 is provided on the front of the body 1, and the control panel 11 is convenient for controlling the operation of the entire device. Support feet 12 are provided at the corners of the bottom surface of the body 1, and the support feet 12 are convenient for the stable placement of the body 1; a water suction pipe 13 is provided on the side of the body 1 aligned with the bottom of the water tank 17, and the water suction pipe 13 is convenient for use with the water suction end of the water pump 42. A throttle valve 131 is provided on the water suction pipe 13, and the throttle valve 131 is convenient for controlling the opening and closing of the water suction pipe 13. A connecting slot 132 is provided on one side of the body 1, and the connecting slot 132 is convenient for use with the flushing component 4, and convenient for the flushing component 4 to be connected to the body 1; a second bearing 15 is provided in the middle of the top of the body 1, and the second bearing 15 is convenient for cooperation with the rotating component 2, and convenient for the stable rotation of the rotating component 2. A first guide opening 141 is provided on the side of the enclosure 14, and the first guide opening 141 is convenient for guiding the top of the flushing assembly 4; a second guide opening 143 is provided at the top of the support frame 142 aligned with the first guide opening 141, and the second guide opening 143 is convenient for installing the driving assembly 5. Adapters 144 are provided at both the front and rear ends of the second guide opening 143, and a first bearing 145 is provided in the middle of the adapter 144; the adapter 144 and the first bearing 145 are convenient for rotationally connecting with the transmission screw 51. A reflux hole 16 is provided at the top of the body 1 near the edge, and a reflux pipe 161 is connected to the bottom of the reflux hole 16. The reflux hole 16 cooperates with the reflux pipe 161 to facilitate the flushing wastewater to flow smoothly into the filter assembly 3. A water inlet 171 is provided at the top of the water tank 17, and a cover 172 is provided at the water inlet 171. The water inlet 171 is convenient for ensuring the stability of the water inside the water tank 17. A filter cartridge 173 is connected to the top of the water tank 17, and one end of the filter cartridge 173 is open, so that the filter cartridge 173 is convenient for installing the filter assembly 3. An adapter ring 174 is provided at the open end of the filter cartridge 173, and the adapter ring 174 is convenient for being threadedly connected to the filter assembly 3.

[0034] like Figure 5 As shown, the rotating assembly 2 includes a tray 21 and a rotating motor 22, and the tray 21 is convenient for supporting the wafer. A connecting shaft 511211 is provided at the bottom of the tray 21, and the connecting shaft 511211 is convenient for the second bearing 15 of the tray 21 to rotate and connect. A transmission slot 212 is provided at the bottom of the connecting shaft 511211, and the transmission slot 212 is convenient for the output end of the rotating motor 22 to be connected with the connecting shaft 511211. A plurality of mounting feet 221 are provided at one end of the rotating motor 22 that fits the body 1, and a mounting hole 222 is provided in the middle of the mounting foot 221. The cooperation between the mounting foot 221 and the mounting hole 222 is convenient for fixing the position of the rotating motor 22. The output end of the rotating motor 22 is plugged into the transmission slot 212, and the rotating motor 22 is convenient for driving the tray 21 to rotate. A junction box 223 is provided at the bottom of the rotating motor 22 , a first wire 224 is provided at the bottom of the junction box 223 , and a first plug connector 225 is provided at the end of the first wire 224 . The junction box 223 cooperates with the first wire 224 and the first plug connector 225 to facilitate powering the rotating motor 22 .

[0035] like Figure 6 As shown, the filter assembly 3 includes a guide tube 31 and a filter element 32. A connecting cap 313 is provided at the top of the guide tube 31. The guide tube 31 cooperates with the connecting cap 313 to facilitate the connection between the guide tube and the return pipe 161. The connecting cap 313 is connected to the bottom end of the return pipe 161; the bottom end of the guide tube 31 is provided with an end cap 311, which is convenient for connecting with the filter cartridge 173. A mounting ring 312 is provided in the middle of the end cap 311, and a connecting ring 321 is provided at the end of the filter element 32. The connecting ring 321 and the mounting ring 312 are threadedly connected. This structure facilitates the disassembly and use of the filter element 32. The end cap 311 is threadedly connected to the adapter ring 174.

[0036] like Figure 7 As shown, the flushing assembly 4 includes a water pipe 41 and a water pump 42. The water pipe 41 is convenient for cooperating with the water pump 42 to lead water to the top of the machine body 1. A water spray head 411 is provided at the top of the water pipe 41. The water spray head 411 is installed on the inner side of the first guide port 141, and the side of the water spray head 411 is fitted on both sides of the inner and outer surfaces of the enclosure 14. The water spray head 411 is convenient for emitting a water jet, so as to achieve the purpose of cleaning the surface of the wafer. A second wire 421 is provided on the side of the water pump 42, and a second plug connector 422 is provided at the end of the second wire 421. The cooperation between the second wire 421 and the second plug connector 422 is convenient for connecting the water pump 42 and the machine body 1. A fixing plate 423 is symmetrically provided on both sides of one end of the water pump 42 that fits the machine body 1, and a plurality of fixing holes 424 are provided on the fixing plate 423; the cooperation between the fixing plate 423 and the fixing hole 424 is convenient for fixing the position of the water pump 42 by bolts. Two external pipes 425 are symmetrically provided at the output end of the water pump 42, and a conversion cap 426 is provided at the end of the external pipe 425. The two external pipes 425 serve as the water suction end and the discharge end of the water pump 42 respectively. This structure facilitates the water pump 42 to pump water from the water tank 17 and pump the water in the water tank 17 into the water pipe 41 and spray it out from the nozzle.

[0037] like Figure 8 As shown, the driving assembly 5 includes a driving screw 51 and a driving motor 52, and the driving motor 52 is used to drive the driving screw to rotate. Both ends of the driving screw 51 are provided with connecting shafts 511211, and the connecting shafts 511211 are interference-connected with the first bearing 145. This structure facilitates the rotation of the driving screw 51. A driving slot 512 is provided at one end of the driving screw 51 facing the driving motor 52, and the output end of the driving motor 52 is connected to the driving slot 512; it is convenient for the driving motor 52 to drive the driving screw 51 to rotate. A plurality of connecting feet 521 are provided at one end of the output end of the driving motor 52 that is attached to the support frame 142, and a connecting hole 522 is provided on the connecting foot 521. The cooperation between the connecting foot 521 and the connecting hole 522 is convenient for fixing the position of the driving motor 52 by bolts.

[0038] like Fig. 9As shown, a connecting block 61 is provided at the bottom of the support plate 6, and a threaded hole 62 is provided on the connecting block 61, and the threaded hole 62 is connected to the transmission screw 51; this structure is convenient for the support plate 6 to be stably used with the driving assembly 5. The connecting block 61 cooperates with the threaded hole 62, and a guide socket 63 is provided in the middle of the support plate 6, and the guide socket 63 is convenient for the support plate 6 to be connected with the laser cutter 7. A connecting rod 64 is provided at the bottom of the support plate 6, and a collar 65 is provided at the bottom of the connecting rod 64. The connecting rod 64 cooperates with the collar 65 to be conveniently connected to the water spray head 411. A tail plate 66 is provided at one end of the upper surface of the support plate 6 away from the body 1, and a through hole 67 is provided in the middle of the tail plate 66. The cooperation between the tail plate 66 and the through hole 67 is convenient for the support plate 6 to be connected with the cylinder 8.

[0039] like Fig.10 and Fig.11 As shown, a camera 72 and a laser cutting head 71 are arranged side by side at the bottom of the laser cutter 7. The camera 72 is convenient for collecting images, and the laser gas cutting head is convenient for cutting the filter element 32. A connecting plate 73 is provided at one end of the laser cutter 7 close to the body 1, and a countersunk hole 74 is provided in the middle of the connecting plate 73. The cooperation between the connecting plate 73 and the countersunk hole 74 is convenient for the laser cutter 7 to be connected to the cylinder 8. An insert plate 75 is provided at one end of the laser cutter 7 away from the body 1, and the insert plate 75 is plugged into the inner side of the guide socket 63; an MCU control module is provided inside the laser cutter 7, and the MCU control module is connected with an image acquisition module, an image feature extraction module, a damage position determination module, a recording module and a route planning module; the image acquisition module is used to collect images of the cut wafer, and the image feature extraction module is used to extract images of the cut wafer; the damage position determination module is used to analyze the characteristics of the image to determine the location of the wafer damage; the recording module is used to record the location of the wafer breakage, and the route planning module is used to plan the cutting route according to the location of the wafer damage.

[0040] like Fig.12 As shown, a telescopic rod 81 is provided at the output end of the cylinder 8, and the telescopic rod 81 is convenient for driving the laser cutter 7 to move left and right. A limit plate 82 is provided at the end of the telescopic rod 81, and a first stud 83 is provided in the middle of the limit plate 82. One end of the first stud 83 passing through the countersunk hole 74 is provided with a first pressure cap 84; the limit plate 82 cooperates with the first stud 83 and the first pressure cap 84 to facilitate the telescopic rod 81 to be stably connected to the laser cutter 7. A second stud 85 is provided at the other end of the cylinder 8, and one end of the second stud 85 passing through the through hole 67 is provided with a second pressure cap 86. The second stud 85 cooperates with the second pressure cap 86 to facilitate the cylinder 8 to be stably connected to the supporting plate 6.

[0041] like Figure 1 , Figure 4 and Fig.13As shown, it also includes an inspection cover 9, and an inspection port 18 is provided on the back of the machine body 1. The inspection port 18 is convenient for inspecting the inside of the machine body 1, and the inspection cover 9 is convenient for blocking the inspection port 18. A pressing edge 92 is provided on the edge of the inspection cover 9, and bolt holes 93 are provided at the corners of the pressing edge 92. The pressing edge 92 and the bolt holes 93 are convenient for fixing the inspection cover 9 by bolts. The bolts pass through the bolt holes 93 to connect with the machine body 1. A plurality of heat dissipation holes 91 are evenly provided on the inspection cover 9, and the heat dissipation holes 91 are convenient for the heat generated inside the machine body 1 to be smoothly dissipated.

[0042] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer continuous cutting device, comprising a body (1), characterized in that: A rotating assembly (2) is provided on the top of the machine body (1), and the rotating assembly (2) is used to support the wafer and drive the wafer to rotate; a water tank (17) is provided at the bottom of the machine body (1), and a filter assembly (3) is provided on the top of the water tank (17); the water inlet end of the filter assembly (3) is connected to the top of the machine body (1), and the filter assembly (3) is used to filter the returned water and filter out the debris in the water; a baffle (14) is provided on the top edge of the machine body (1), and a support frame (142) is provided above the baffle (14); and a side of the machine body (1) is provided with a support frame (142). A flushing assembly (4) is provided, the bottom of the flushing assembly (4) is connected to a water tank (17), and the top of the flushing assembly (4) is slidably connected to the enclosure (14); a driving assembly (5) is provided on one side of the top of the support frame (142), the driving assembly (5) is connected to a support plate (6), a laser cutter (7) is plugged into one end of the support plate (6) facing the machine body (1), and a cylinder (8) is installed on the upper surface of the support plate (6), the output end of the cylinder (8) is connected to the laser cutter (7) and is used to drive the laser cutter (7) to move its position.

2. The wafer continuous cutting device according to claim 1, characterized in that: The front of the machine body (1) is provided with a control panel (11), and the bottom corners of the machine body (1) are provided with supporting feet (12); a water suction pipe (13) is provided on the side of the machine body (1) at a position aligned with the bottom of the water tank (17), a throttle valve (131) is provided on the water suction pipe (13), and a connecting slot (132) is provided on one side of the machine body (1); a second bearing (15) is provided at the middle of the top of the machine body (1), a first guide opening (141) is provided on the side of the enclosure (14), a second guide opening (143) is provided at the top of the support frame (142) aligned with the first guide opening (141), and the second guide opening (143) is provided at the top of the support frame (142) aligned with the first guide opening (141), and the second guide opening (143) is provided at the bottom of the support frame (142) Both front and rear ends of the two guide ports (143) are provided with adapters (144), and a first bearing (145) is provided in the middle of the adapter (144); a reflux hole (16) is provided at a position near the edge of the top of the machine body (1), and a reflux pipe (161) is connected to the bottom of the reflux hole (16); a water inlet (171) is provided at the top of the water tank (17), and a sealing cover (172) is provided at the water inlet (171); a filter cartridge (173) is connected to the top of the water tank (17), and one end of the filter cartridge (173) is open, and an adapter ring (174) is provided at the open end of the filter cartridge (173).

3. The wafer continuous cutting device according to claim 1, characterized in that: The rotating assembly (2) comprises a tray (21) and a rotating motor (22); a connecting shaft (511) (211) is provided at the bottom of the tray (21); a transmission slot (212) is provided at the bottom of the connecting shaft (511) (211); a plurality of mounting feet (221) are provided at one end of the rotating motor (22) that is in contact with the machine body (1); a mounting hole (222) is provided in the middle of the mounting foot (221); an output end of the rotating motor (22) is plugged into the transmission slot (212); a junction box (223) is provided at the bottom of the rotating motor (22); a first wire (224) is provided at the bottom of the junction box (223); and a first plug connector (225) is provided at the end of the first wire (224).

4. The wafer continuous cutting device according to claim 2, characterized in that: The filter assembly (3) comprises a flow guide tube (31) and a filter element (32); a connection cap (313) is provided at the top end of the flow guide tube (31), and the connection cap (313) is connected to the bottom end of the return tube (161); an end cover (311) is provided at the bottom end of the flow guide tube (31), a mounting ring (312) is provided at the middle of the end cover (311), a connection ring (321) is provided at the end of the filter element (32), the connection ring (321) and the mounting ring (312) are threadedly connected, and the end cover (311) and the adapter ring (174) are threadedly connected.

5. The wafer continuous cutting device according to claim 2, characterized in that: The flushing assembly (4) comprises a water pipe (41) and a water pump (42); a water spray head (411) is provided at the top end of the water pipe (41); the water spray head (411) is mounted on the inner side of the first guide opening (141); and a position limiting ring (412) is provided at the side of the water spray head (411) abutting against the inner and outer surfaces of the enclosure (14); a second wire (421) is provided at the side of the water pump (42); a second plug connector (422) is provided at the end of the second wire (421); fixing plates (423) are symmetrically provided on both sides of one end of the water pump (42) abutting against the body (1); and a plurality of fixing holes (424) are provided on the fixing plates (423); and two external pipes (425) are symmetrically provided at the output end of the water pump (42); and a transfer cap (426) is provided at the end of the external pipe (425); and the two external pipes (425) serve as the water suction end and the water discharge end of the water pump (42), respectively.

6. The wafer continuous cutting device according to claim 2, characterized in that: The driving assembly (5) comprises a driving screw (51) and a driving motor (52); connecting shafts (511) (211) are provided at both ends of the driving screw (51); the connecting shafts (511) (211) are interference-connected with the first bearing (145); a driving slot (512) is provided at one end of the driving screw (51) facing the driving motor (52); the output end of the driving motor (52) is connected to the driving slot (512); and a plurality of connecting feet (521) are provided at one end of the output end of the driving motor (52) that is in contact with the support frame (142); and connecting holes (522) are provided on the connecting feet (521).

7. The wafer continuous cutting device according to claim 6, characterized in that: A connecting block (61) is provided at the bottom of the supporting plate (6), a threaded hole (62) is provided on the connecting block (61), and the threaded hole (62) is connected to the transmission screw (51); a guide plug hole (63) is provided in the middle of the supporting plate (6), and a connecting rod (64) is provided at the bottom end of the supporting plate (6), a collar (65) is provided at the bottom of the connecting rod (64), and a tail plate (66) is provided at one end of the upper surface of the supporting plate (6) away from the machine body (1), and a through hole (67) is provided in the middle of the tail plate (66).

8. The wafer continuous cutting device according to claim 7, characterized in that: A camera (72) and a laser cutting head (71) are arranged side by side at the bottom end of the laser cutter (7), and a connecting plate (73) is provided at one end of the laser cutter (7) close to the body (1), a countersunk hole (74) is provided in the middle of the connecting plate (73), and a plug plate (75) is provided at one end of the laser cutter (7) away from the body (1), and the plug plate (75) is plugged into the inner side of the guide plug hole (63); an MCU control module is provided inside the laser cutter (7), and the MCU control module is connected to an image acquisition module, an image feature extraction module, a damage position determination module, a recording module and a route planning module; the image acquisition module is used to acquire images of the cut wafer, and the image feature extraction module is used to extract images of the cut wafer; the damage position determination module is used to analyze the features of the image to determine the location of the wafer damage; the recording module is used to record the location of the wafer breakage, and the route planning module is used to plan the cutting route according to the location of the wafer damage.

9. The wafer continuous cutting device according to claim 8, characterized in that: The output end of the cylinder (8) is provided with a telescopic rod (81), the end of the telescopic rod (81) is provided with a limit plate (82), the middle of the limit plate (82) is provided with a first stud (83), one end of the first stud (83) passing through the countersunk hole (74) is provided with a first pressing cap (84); the other end of the cylinder (8) is provided with a second stud (85), one end of the second stud (85) passing through the through hole (67) is provided with a second pressing cap (86).

10. A wafer continuous cutting device according to any one of claims 1 to 9, characterized in that: It also comprises an inspection cover (9), the back of the machine body (1) is provided with an inspection opening (18), the edge of the inspection cover (9) is provided with a pressing edge (92), the corners of the pressing edge (92) are provided with bolt holes (93), bolts pass through the bolt holes (93) to connect with the machine body (1), and the inspection cover (9) is evenly provided with a plurality of heat dissipation holes (91).

Images