Coil carrier and manufacturing method thereof

Abstract

The invention relates to a coil carrier and a manufacturing method thereof, and the coil carrier comprises a basic coil layer, a conduction layer which is stacked and combined on the basic coil layer, at least one layer-adding coil layer which is stacked and combined on the conduction layer, and an opening area which is communicated with the basic coil layer, the conduction layer and the layer-adding coil layer, the coil carrier plate with thick copper, fine line spacing and proper rigidity is manufactured by the aid of a layer-adding circuit process and the structural design of an insulating layer combining a photosensitive dielectric material with a thermosetting dielectric material. Therefore, the high current-carrying efficiency of the coil carrier plate is improved, and miniaturization and introduction of automatic assembly production are facilitated by means of the characteristics of better smoothness and rigidity, high interlayer alignment precision and the like of the overall structure of the coil carrier plate.

Description

Technical Field

[0001] The invention relates to a coil carrier, in particular to a coil carrier for optical device packaging and a manufacturing method thereof. Background Art

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multi-functionality, high performance and miniaturization. Traditional image sensor packages can be integrated by system manufacturers into external devices such as printed circuit boards (PCBs) for use in various electronic products such as digital cameras (DSCs), digital video cameras (DVs), optical mice, mobile phones, fingerprint readers, etc.

[0003] Currently, mobile optical camera products require higher image resolution, and human jitter often causes blurred images. Therefore, existing optical electronic products are equipped with optical image stabilization (OIS) devices, such as magnetic drive devices, to prevent hand jitter.

[0004] Figure 1A to Figure 1B It is a cross-sectional schematic diagram of a manufacturing method of a conventional magnetic drive device 1 .

[0005] like Figure 1A As shown, a support frame 10 having a first through hole 100, a flexible circuit board 11 having a second through hole 110 and a circuit layer 111, a flexible coil board 12 having a third through hole 120, a groove 121 and four sets of planar coils 122, and a Hall sensor 15 are provided.

[0006] like Figure 1B As shown, the flexible circuit board 11 and the flexible coil board 12 are bonded by the adhesive layer 13, and the flexible circuit board 11 and the support frame 10 are bonded by the adhesive layer 14, so that the first through hole 100, the second through hole 110 and the third through hole 130 are aligned with each other to form a through hole 18. The contact 123 of the flexible coil board 12 is electrically connected to the circuit layer 111 of the flexible circuit board 11 by the solder material 16. The Hall sensor 15 is accommodated in the groove 121 of the flexible coil board 12 and its electrode pad 150 is electrically connected to the flexible circuit board 11 by the solder material 17. The flexible circuit board 11 is a flexible plate material, and its left and right sides are bent downward to be connected to the side of the support frame 11.

[0007] However, in the existing magnetic drive device 1, the flexible coil plate 12 is made of flexible material, resulting in poor flatness of the overall structure, such as a concave-convex amplitude greater than 150 microns (um), and poor alignment accuracy between layers, such as an error greater than 100 microns, so a larger planar coil 122 is required, resulting in the difficulty of miniaturization of the flexible coil plate 12, such as difficulty in producing a plate area less than 5x5mm 2 Coil carrier board.

[0008] In addition, since the flexible coil plate 12 is made of flexible material, its structure is too soft, and it is easy to cause displacement during the assembly process of the electronic product, resulting in the flexible coil plate 12 being unable to be introduced into the automated production line of the magnetic drive device 1. Therefore, the magnetic drive device 1 needs to assemble the flexible coil plate 12 manually, making it difficult for the magnetic drive device 1 to be fully automated.

[0009] Therefore, how to overcome the above-mentioned various problems of the prior art has become a topic that needs to be overcome urgently in the current industry. Summary of the invention

[0010] In view of the problems of the prior art, the present invention provides a coil carrier, comprising: a basic coil layer, including a basic planar spiral coil of a metal material, and a first insulating layer covering the basic planar spiral coil; a conductive layer, which is stacked and combined on the basic coil layer, and includes a conductor of a metal material, and a second insulating layer covering the conductor; at least one build-up coil layer, which is stacked and combined on the conductive layer, and includes a build-up planar spiral coil of a metal material, and a third insulating layer covering the build-up planar spiral coil, and the upper surface and side surfaces of the build-up planar spiral coil are covered with at least one electroplated build-up layer of a metal material; and an opening area, which includes a through hole that penetrates the basic coil layer, the conductive layer and the build-up coil layer.

[0011] In the aforementioned coil carrier, the at least one build-up coil layer also includes multiple build-up coil layers stacked together, and at least one metal conductor is included between two adjacent build-up coil layers to connect the two build-up planar spiral coils correspondingly located on the upper and lower layers.

[0012] In the aforementioned coil carrier, the build-up coil layer corresponding to the uppermost layer further includes at least one external electrical connection pad made of a metal material.

[0013] In the aforementioned coil carrier, the lower surface of the first insulating layer is further combined with a lower insulating layer of insulating material.

[0014] In the aforementioned coil carrier, the first insulating layer includes a photosensitive dielectric material, and the second insulating layer and / or the third insulating layer includes a thermosetting dielectric material.

[0015] In the aforementioned coil carrier, the base planar spiral coil, the conductor, the build-up planar spiral coil and / or the electroplated build-up layer are made of copper or copper alloy.

[0016] In the aforementioned coil carrier, the electroplating growth layer and the growth-layer planar spiral coil may have the same or different compositions.

[0017] In the aforementioned coil carrier, the upper surface of the basic planar spiral coil protrudes, is flush with, or is recessed from the upper surface of the first insulating layer.

[0018] The present invention also provides a method for manufacturing a coil carrier, comprising: step one, providing a carrier having a metal surface; step two, forming a first insulating layer having a plurality of patterned openings on the carrier; step three, electroplating in the plurality of patterned openings to form a basic planar spiral coil; step four, forming a second insulating layer on the first insulating layer and the basic planar coil to cover the first insulating layer and the basic planar coil; step five, forming at least one opening on the upper surface of the second insulating layer to expose a portion of the upper surface of the basic planar spiral coil; step six, performing a surface metallization process to form a metallized surface on the upper surface of the second insulating layer and in the opening to serve as an electroplating electrode; step seven, electroplating on the metallized surface of the second insulating layer and the opening using a patterned exposure and development process to form a build-up planar spiral coil and a layer formed on the opening a conductive body for connecting the build-up planar spiral coil and the base planar spiral coil in the hole; a step eight, performing an etching process to remove the material of the metal layer on the second insulating layer that is not covered by the build-up planar spiral coil; a step nine, performing an electroplating process to form an electroplated proliferation layer on the exposed surface of the build-up planar spiral coil to increase the height, width and reduce the line spacing of the build-up planar spiral coil, wherein the number of executions of step nine can be selectively increased to form a multi-layer stacked electroplated proliferation layer; a step ten, forming a third insulating layer on the second insulating layer to cover the second insulating layer and the build-up planar spiral coil; a step eleven, removing the carrier board to expose the lower surface of the base planar coil and the lower surface of the first insulating layer; and a step twelve, forming a through hole that penetrates the first insulating layer, the second insulating layer and the third insulating layer to form an opening area.

[0019] In the aforementioned manufacturing method, before executing step eleven, step ten also includes executing the following steps: step ten-1, forming at least one opening on the third insulating layer to expose a portion of the upper surface of the build-up planar spiral coil; step ten-2, performing a surface metallization process to form a metallized surface on the upper surface of the third insulating layer and in the opening to serve as an electroplating electrode; step ten-3, electroplating on the metallized surface of the third insulating layer and the opening using a patterned exposure and development process to form another build-up planar spiral coil and a conductor connecting the other build-up planar spiral coil and the build-up planar spiral coil of the relatively lower layer; step ten-4, performing an etching process to remove the portions of the third insulating layer that are not covered by the other build-up planar spiral coil. The metal material of the metallized surface covered by the spiral coil is removed to expose the insulating surface of the third insulating layer; in step 10-5, an electroplating process is performed to form an electroplated proliferative layer on the exposed surface of the other build-up planar spiral coil to increase the height, width and reduce the line spacing of the other build-up planar spiral coil, wherein the number of executions of step 10-5 can be selectively increased to form a multi-layer stack of the other electroplated proliferative layer; in step 10-6, another third insulating layer is formed to cover the other build-up planar spiral coil formed by steps 10-3 to 10-5; and in step 10-7, the number of executions of steps 10-1 to 10-6 can be selectively increased to form a multi-layer stack of the other build-up planar spiral coil and the other third insulating layer.

[0020] In the above manufacturing method, when the uppermost build-up planar spiral coil is electroplated, at least one pair of external electrical connection pads are electroplated simultaneously, and the upper surfaces of the external electrical connection pads are exposed to the upper surface of the uppermost third insulating layer.

[0021] In the aforementioned manufacturing method, before executing the step 12, the method further includes forming a lower insulating layer to cover the lower surface of the first insulating layer.

[0022] In the aforementioned manufacturing method, the electroplating growth layer and the growth layer planar spiral coil have the same or different compositions.

[0023] In the aforementioned manufacturing method, the upper surface of the second insulating layer in step 4 is a metal surface or a non-metal surface.

[0024] In the aforementioned manufacturing method, the upper surface of the third insulating layer in step 10 is a metal surface or a non-metal surface.

[0025] As can be seen from the above, the coil carrier and the manufacturing method thereof of the present invention mainly use the layer-building circuit process to produce the first and second insulating layers and the spiral coil, so that the overall structure of the coil carrier has excellent flatness, and the alignment accuracy between each layer is extremely high, and it is easy to produce fine line width / fine line spacing. Therefore, compared with the existing flexible coil board, the present invention can obtain a miniaturized coil carrier with better flatness and higher alignment accuracy.

[0026] In addition, the present invention uses a thermosetting dielectric material as the second insulating layer to enhance the rigidity of the coil carrier, thereby avoiding the problem of misalignment during the assembly of electronic products. Therefore, compared to the existing flexible coil board, the coil carrier of the present invention can be introduced into the automated production line of electronic products (such as magnetic drive devices) due to its good structural rigidity, so as to achieve the purpose of automated assembly and production of electronic products (such as magnetic drive devices). BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1A to Figure 1B It is a cross-sectional schematic diagram of a conventional method for manufacturing a magnetic drive device.

[0028] FIG. 2A to FIG. 2I FIG. 1 is a cross-sectional schematic diagram of a first embodiment of a method for manufacturing a coil carrier of the present invention, wherein Figure 2F-1 for Figure 2F A cross-sectional schematic diagram of another method.

[0029] FIG. 3A to FIG. 3D It is a cross-sectional schematic diagram of a second embodiment of the method for manufacturing a coil carrier of the present invention.

[0030] Main component symbols

[0031] 1 Magnetic drive

[0032] 10 Support frame

[0033] 100 First through hole

[0034] 11 Flexible Circuit Board

[0035] 110 Second through hole

[0036] 111 Line Layer

[0037] 12 Flexible coil board

[0038] 120 Third through hole

[0039] 121 Groove

[0040] 122 Planar Coil

[0041] 123 contacts

[0042] 13,14 Adhesive layer

[0043] 15 Hall sensor

[0044] 150 Electrode pads

[0045] 16,17 Solder materials

[0046] 18. Piercing

[0047] 2 Coil carrier

[0048] 2a Basic coil layer

[0049] 2b Conductive layer

[0050] 2c, 3c increase coil layer

[0051] 21 First insulation layer

[0052] 21a Second upper surface

[0053] 21b Second lower surface

[0054] 210 Patterning multiple openings

[0055] 22 Basic Planar Spiral Coil

[0056] 22a First upper surface

[0057] 22b First lower surface

[0058] 23 Second insulation layer

[0059] 23a Third upper surface

[0060] 23b Third lower surface

[0061] 230 Opening

[0062] 24,34 metal layers

[0063] 24a,34a Metallized surface

[0064] 25,35 layer planar spiral coil

[0065] 25a Fourth upper surface

[0066] 25b Fourth lower surface

[0067] 250 Conductors

[0068] 250a First upper end surface

[0069] 250b First lower end surface

[0070] 251 External electrical connection pad

[0071] 26,36 Electroplating growth layer

[0072] 27,37 Third insulation layer

[0073] 27a Fifth upper surface

[0074] 27b Fifth lower surface

[0075] 270 Opening

[0076] 28 Opening area

[0077] 29 Lower insulation layer

[0078] 350 Conductors

[0079] 9 Loading plate

[0080] H1, H2 thickness. DETAILED DESCRIPTION

[0081] The following describes the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and technical effects of the present invention from the contents disclosed in this specification.

[0082] It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change in the proportion relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in the present invention without affecting the technical effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0083] FIG. 2A to FIG. 2I FIG. 2 is a cross-sectional view of a first embodiment of a method for manufacturing a coil carrier 2 of the present invention. In this embodiment, the coil carrier 2 is used as an optical image stabilization (OIS) carrier of an electronic product.

[0084] like Figure 2A As shown, a carrier plate 9 having a metal surface is provided to form a first insulating layer 21 having a plurality of patterned openings 210 on the metal surface of the carrier plate 9. Next, a metal basic planar spiral coil 22 is formed by electroplating in the patterned plurality of openings 210 to form a basic coil layer 2a.

[0085] In this embodiment, the carrier plate 9 is a detachable metal plate or a copper foil substrate, but there is no particular limitation. In this embodiment, a metal plate is used for illustration, and two sides of the metal plate have detachable copper-containing metal materials.

[0086] Furthermore, the first insulating layer 21 has a second upper surface 21a and a second lower surface 21b opposite to each other and covers the basic planar spiral coil 22. For example, the material forming the first insulating layer 21 is a photosensitive dielectric material, which includes ABF (Ajinomoto Build-up Film), photosensitive resin, polyimide (PI), bismaleimide triazine (BT), FR5 prepreg (PP), molding resin, or molded epoxy (EMC).

[0087] In addition, the basic planar spiral coil 22 has a first upper surface 22a and a first lower surface 22b opposite to each other, wherein the first upper surface 22a of the basic planar spiral coil 22 is exposed to the second upper surface 21a of the first insulating layer 21, and the first lower surface 22b of the basic planar spiral coil 22 is combined with the carrier board 9. For example, the basic planar spiral coil 22 is manufactured in the same manner as the circuit layer of the package substrate, and a patterned copper layer can be manufactured by electroplating, sputtering, physical vapor deposition (PVD), etc.

[0088] In addition, the thickness H2 of the basic planar spiral coil 22 may be less than, equal to, or greater than the thickness H1 of the first insulating layer 21. In one embodiment, the thickness H2 of the basic planar spiral coil 22 is less than the thickness H1 of the first insulating layer 21, so that the first upper surface 22a of the basic planar spiral coil 22 is lower than the opening of the patterned plurality of openings 210, and the first upper surface 22a of the basic planar spiral coil 22 is recessed into the second upper surface 21a of the first insulating layer 21. In other embodiments, the first upper surface 22a of the basic planar spiral coil 22 protrudes or is flush with the second upper surface 21a of the first insulating layer 21, but recessing is the best embodiment.

[0089] like Figure 2BAs shown, a second insulating layer 23 is laminated on the first insulating layer 21 and the basic planar coil 22, wherein the second insulating layer 23 covers the first upper surface 22a of the basic planar spiral coil 22, and the composition of the insulating material of the second insulating layer 23 is different from the composition of the insulating material of the first insulating layer 21, wherein the second insulating layer 23 has a third upper surface 23a and a third lower surface 23b opposite to each other. Next, at least one opening 230 is formed on the third upper surface 23a of the second insulating layer 23 to expose a portion of the first upper surface 22a of the basic planar spiral coil 22.

[0090] In this embodiment, the second insulating layer 23 may be an insulating material as a whole, or the second insulating layer 23 may be a substrate having a metal layer 24 on its surface. In one embodiment, the second insulating layer 23 is an insulating material having a metal layer 24 on its surface (such as Figure 2A As shown in FIG. 2 , the opening 230 extends from the metal layer 24 through the second insulating layer 23 to a portion of the first upper surface 22a of the basic planar spiral coil 22. For example, the second insulating layer 23 and the metal layer 24 are made of a resin coated copper (RCC).

[0091] Furthermore, the insulating material forming the second insulating layer 23 is different from the insulating material forming the first insulating layer 21. For example, the insulating material of the second insulating layer 23 is a thermosetting dielectric material.

[0092] In addition, the first upper surface 22a of the basic planar spiral coil 22 is recessed into the second upper surface 21a of the first insulating layer 21, so that the first insulating layer 21 and the second insulating layer 23 present a non-flat interface, such as a concave-convex interface, so that the second insulating layer 23 is laminated on the first insulating layer 21 in a non-flat manner.

[0093] In addition, the opening 230 can be made by laser or etching, but is not limited to the above.

[0094] like Figure 2C As shown, a surface metallization process is performed to form a continuous metallization surface 24 a on the surface of the metal layer 24 of the second insulating layer 23 and the surface of the opening 230 to serve as an electroplating electrode in a subsequent electroplating process.

[0095] like Figure 2D and Figure 2EAs shown, a build-up planar spiral coil 25 of metal material and a conductor 250 of metal material formed in the opening 230 to connect the build-up planar spiral coil 25 and the base planar spiral coil 22 are formed by electroplating by patterned exposure and development process, so that the second insulating layer 23 and the conductor 250 serve as a conductive layer 2b. Subsequently, an etching process is performed to remove the metallized surface 24a of the second insulating layer 23 that is not covered by the build-up planar spiral coil 25 and the material of the metal layer 24, wherein the build-up planar spiral coil 25 and the conductor 250 have the same composition.

[0096] In this embodiment, the build-up planar spiral coil 25 has a fourth upper surface 25a and a fourth lower surface 25b opposite to each other. For example, the build-up planar spiral coil 25 is manufactured in the same manner as the circuit layer of the package substrate, and can be manufactured by electroplating, sputtering, physical vapor deposition (PVD), etc., and a portion of the metallized surface 24a and the metal layer 24 is removed by etching.

[0097] In addition, the conductor 250 has a first upper end surface 250 a and a first lower end surface 250 b opposite to each other.

[0098] like Figure 2F As shown, an electroplating process is performed to form an electroplated growth layer 26 on the exposed surface of the build-up planar spiral coil 25, so as to increase the height and width of the build-up planar spiral coil 25 and reduce the line spacing. The number of times the electroplated growth layer 26 is performed can be selectively repeated to form a multi-layer stacked electroplated growth layer 26, such as Figure 2F-1 shown.

[0099] In this embodiment, when the topmost build-up planar spiral coil 25 is formed by electroplating, at least one pair of external electrical connection pads 251 are formed by electroplating simultaneously.

[0100] Furthermore, the electroplated proliferative layer 26 and the build-up planar spiral coil 25 may have the same or different compositions. For example, the electroplated proliferative layer 26 may be made of copper, so that the build-up planar spiral coil 25 and the electroplated proliferative layer 26 may be used as the coil body by designing that the electroplated proliferative layer 26 and the build-up planar spiral coil 25 are both copper layers, and thus the coil body may use the electroplated proliferative layer 26 to increase the copper thickness, thereby reducing the distance between the circuits of the coil body (i.e., effectively reducing the circuit spacing).

[0101] like Figure 2G As shown, a third insulating layer 27 is laminated on the second insulating layer 23 to cover the second insulating layer 23 and the build-up planar spiral coil 25 having the electroplated build-up layer 26 to form a build-up coil layer 2c.

[0102] In this embodiment, the third insulating layer 27 has a fifth upper surface 27a and a fifth lower surface 27b opposite to each other and covers the build-up planar spiral coil 25. For example, the upper surface of the external electrical connection pad 251 having the electroplated build-up layer 26 is exposed to the fifth upper surface 27a of the third insulating layer 27 of the uppermost layer.

[0103] In this embodiment, the third insulating layer 27 is made of a photosensitive or non-photosensitive dielectric material, a thermosetting dielectric material, or a solder resist ink.

[0104] like Figure 2H As shown, the carrier plate 9 is removed to expose the second lower surface 21b of the first insulating layer 21 and the first lower surface 22b of the basic planar spiral coil 22. Next, a lower insulating layer 29 is formed to cover the second lower surface 21b of the first insulating layer 21 and the first lower surface 22b of the basic planar spiral coil 22.

[0105] In this embodiment, the lower insulating layer 29 is made of a photosensitive or non-photosensitive dielectric material, a thermosetting dielectric material, or a solder resist ink.

[0106] like Fig.2I As shown, a through hole is formed through the first insulating layer 21 , the second insulating layer 23 and the third insulating layer 27 to form an opening area 28 , which can penetrate the lower insulating layer 29 as required.

[0107] FIG. 3A to FIG. 3D The cross-sectional view of the second embodiment of the method for manufacturing the coil carrier 3 of the present invention is shown in FIG. The difference between this embodiment and the first embodiment lies in the number of coils produced, and the other processes are substantially the same, so the same points will not be described in detail.

[0108] like Figure 3A As shown in Figure 2G In the process, at least one opening 270 is formed on the fifth upper surface 27 a of the third insulating layer 27 to expose a portion of the surface of the build-up planar spiral coil 25 having the electroplated build-up layer 26 .

[0109] In this embodiment, the third insulating layer 27 can be an insulating material as a whole, or the third insulating layer 27 can be a substrate (resin coated copper, RCC) with a metal layer 34 on the surface. Figure 2C In the manner shown, a surface metallization process is then performed to form a continuous metallized surface 34a on the metal layer 34 of the third insulating layer 27 and the surface of the opening to serve as an electroplating electrode for a subsequent electroplating process.

[0110] like Figure 3B As shown, another build-up planar spiral coil 35 and a conductor 350 connecting the another build-up planar spiral coil 35 and the build-up planar spiral coil 25 of the relatively lower layer are formed by electroplating the metallized surface 34a on the fifth upper surface 27a of the third insulating layer 27 through a patterned exposure and development process, and an etching process is performed to remove the metallized surface 34a and the material of the metal layer 34 on the third insulating layer 27 that are not covered by the another build-up planar spiral coil 35 to expose the insulating material.

[0111] Next, an electroplating process is performed to form another electroplated growth layer 36 on the exposed surface of the build-up planar spiral coil 35 to increase the height, width and reduce the line spacing of the build-up planar spiral coil 35. The above-mentioned execution times can be selectively repeated to form a multi-layer stack of the other electroplated growth layer.

[0112] like Figure 3C As shown, another third insulating layer 37 is formed on the third insulating layer 27 to cover the other build-up layer planar spiral coil 35. It should be understood that the number of times of making the other build-up layer coil layer 3c can be selectively repeated to form a multi-layer stack of the other build-up layer planar spiral coil 35 and the other third insulating layer 37. Afterwards, the carrier plate 9 is removed, and the lower insulating layer 29 is formed.

[0113] In this embodiment, the composition of the third insulating layer 37 relatively to the highest (outer) layer includes a photosensitive or non-photosensitive dielectric material, or a thermosetting dielectric material, or a solder resist ink, and when the top layer of the build-up planar spiral coil 35 is formed by electroplating, at least a pair of external electrical connection pads 351 are simultaneously formed by electroplating, so that the plated build-up layer 36 on the upper surface of the external electrical connection pads 351 is exposed to the top layer of the third insulating layer 37.

[0114] like Figure 3D As shown, a through hole is formed through the first insulating layer 21 , the second insulating layer 23 and the third insulating layer 27 , 37 to form an opening area 28 , which can penetrate the lower insulating layer 29 as required.

[0115] Therefore, the manufacturing method of the present invention mainly uses the layer-building circuit process to manufacture the first insulating layer 21 and the second insulating layer 23 and the basic planar spiral coil 22 and the layer-building planar spiral coil 25, so that the overall structure of the coil carrier 2 has excellent flatness, such as a concave-convex amplitude of less than 75 microns (um), and the alignment accuracy between each layer is extremely high, such as an error of less than 50 microns, and it is easy to produce fine line width / fine line spacing. Therefore, compared with the existing flexible coil board, the manufacturing method of the present invention can obtain a miniaturized coil carrier 2 with better flatness and higher alignment accuracy, such as a board area less than 5x5mm 2 .

[0116] Furthermore, a photosensitive dielectric material is used as the first insulating layer 21 to facilitate the production of a plurality of patterned openings 210 with a high aspect ratio, so as to allow the adhesion and formation of the electroplated metal. Therefore, the present invention can produce a basic planar spiral coil 22 with optimized features such as copper thickness and fine spacing, so as to effectively improve the high current carrying performance of the coil carrier 2.

[0117] In addition, through multiple copper electroplating processes, a horizontally-layered planar spiral coil 25 , 35 with electroplated growth layers 26 , 36 is formed to effectively increase the copper thickness and reduce the copper layer spacing, thereby effectively improving the high current carrying performance of the coil carrier 2 .

[0118] In addition, the manufacturing method of the present invention uses a thermosetting dielectric material as the second insulating layer 23 to enhance the rigidity of the coil carrier 2, thereby avoiding the problem of misalignment during the assembly of electronic products. Therefore, compared to the existing flexible coil board, the coil carrier 2 of the present invention has better structural rigidity and can be introduced into the automated production line of electronic products (such as magnetic drive devices) to achieve the purpose of automated assembly and production of electronic products (such as magnetic drive devices).

[0119] The present invention also provides a coil carrier 2, comprising: a basic coil layer 2a, a conductive layer 2b stacked and bonded on the basic coil layer 2a, at least one added layer coil layer 2c, 3c stacked and bonded on the conductive layer 2b, and an opening area 28 connecting the basic coil layer 2a, the conductive layer 2b and the added layer coil layer 2c, 3c.

[0120] The basic coil layer 2a includes a basic planar spiral coil 22 made of metal material having a first upper surface 22a and a first lower surface 22b relative to each other, and a first insulating layer 21 having a second upper surface 21a and a second lower surface 21b relative to each other and covering the basic planar spiral coil 22, wherein the first upper surface 22a of the basic planar spiral coil 22 is exposed to the second upper surface 21a of the first insulating layer 21, and the first lower surface 22b of the basic planar spiral coil 22 is exposed to the second lower surface 21b of the first insulating layer 21.

[0121] The conductive layer 2b includes a metal conductor 250 having a first upper end surface 250a and a first lower end surface 250b relative to each other, and a second insulating layer 23 having a third upper surface 23a and a third lower surface 23b relative to each other and covering the conductor 250, wherein the first upper end surface 250a of the conductor 250 is exposed to the third upper surface 23a of the second insulating layer 23, and the first lower end surface 250b of the conductor 250 is combined with the first upper surface 22a of the basic planar spiral coil 22, the composition of the second insulating layer 23 is different from that of the first insulating layer 21, and the third lower surface 23b of the second insulating layer 23 is stacked and combined with the second upper surface 21a of the first insulating layer 21, and the second insulating layer 23 covers the first upper surface 22a of the basic planar spiral coil 22.

[0122] The added layer coil layer 2c includes a metal added layer planar spiral coil 25 having a relative fourth upper surface 25a and a fourth lower surface 25b, and a third insulating layer 27 having a relative fifth upper surface 27a and a fifth lower surface 27b and covering the added layer planar spiral coil 25, wherein the fourth upper surface 25a and the side surfaces of the added layer planar spiral coil 25 are covered with at least one layer of electroplated added layer 26, 26a of metal material, and the fifth lower surface 27b of the third insulating layer 27 is stacked and combined with the third upper surface 23a of the second insulating layer 23.

[0123] The opening area 28 includes a through hole penetrating the basic coil layer 2a, the conductive layer 2b and the build-up coil layers 2c, 3c.

[0124] In one embodiment, the at least one build-up layer coil layer 3c is a multi-layer stacked build-up layer coil layer 3c, and the third insulating layer 37 of each build-up layer coil layer 3c corresponding to the lower layer also includes at least one conductor 350 having the same composition as the build-up layer planar spiral coil 25, so as to connect the fourth upper surface 25a of the build-up layer planar spiral coil 25 corresponding to the lower layer and the build-up layer planar spiral coil 35 corresponding to the upper layer.

[0125] In one embodiment, the build-up coil layer 3c corresponding to the top layer also includes at least one external electrical connection pad 351 having the same composition as the build-up planar spiral coil 35 and disposed in the third insulating layer 37, wherein the upper surface of the external electrical connection pad 351 is exposed to the third insulating layer 37 of the build-up coil layer 3c corresponding to the top layer.

[0126] In one embodiment, the second lower surface 21 b of the first insulating layer 21 is further combined with a lower insulating layer 29 .

[0127] In one embodiment, the first insulating layer 21 includes a photosensitive dielectric material, and the second insulating layer 23 and / or the third insulating layers 27 , 37 include a thermosetting dielectric material.

[0128] In one embodiment, the base planar spiral coil 21 , the conductor 250 , the build-up planar spiral coil 25 , 35 and / or the electroplated build-up layers 26 , 36 are made of copper or a copper alloy.

[0129] In one embodiment, the electroplated build-up layer 26 , 36 and the build-up planar spiral coil 25 , 35 may have the same or different compositions.

[0130] In one embodiment, the first upper surface 22 a of the base planar spiral coil 22 is protruding, flush, or recessed from the second upper surface 21 a of the first insulating layer 21 .

[0131] In summary, the coil carrier and the manufacturing method thereof of the present invention manufacture the first and second insulating layers and the spiral coil by means of a layer-building circuit process, so that the overall structure of the coil carrier has excellent flatness, and the alignment accuracy between the layers is extremely high, and it is easy to produce fine line width / fine line spacing. Therefore, the present invention can obtain a miniaturized coil carrier with better flatness and higher alignment accuracy.

[0132] Furthermore, a photosensitive dielectric material is used as the first insulating layer to facilitate the production of multiple patterned openings with a high aspect ratio, as well as the attachment and forming of electroplated metal. Therefore, the present invention can produce a basic planar spiral coil with optimized features such as copper thickness and fine spacing, thereby effectively improving the high current carrying performance of the coil carrier.

[0133] In addition, through multiple copper electroplating processes, a horizontally-shaped planar spiral coil with an electroplated growth layer is formed, which can effectively increase the copper thickness and reduce the copper layer spacing, thereby effectively improving the high current carrying performance of the coil carrier.

[0134] In addition, the present invention uses a thermosetting dielectric material as the second insulating layer to enhance the rigidity of the coil carrier, thereby avoiding the problem of misalignment during the assembly of electronic products. Therefore, the coil carrier of the present invention can be introduced into the automated production line of electronic products due to its better structural rigidity, so as to achieve the purpose of automated assembly and production of electronic products.

[0135] The above embodiments are used to illustrate the principles and technical effects of the present invention, but are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the concept and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. A coil carrier, comprising: A basic coil layer, comprising a metal basic planar spiral coil having a first upper surface and a first lower surface opposite to each other, and a first insulating layer having a second upper surface and a second lower surface opposite to each other and covering the basic planar spiral coil, wherein the first upper surface of the basic planar spiral coil is exposed to the second upper surface of the first insulating layer, and the first lower surface of the basic planar spiral coil is exposed to the second lower surface of the first insulating layer; A conducting layer, which is stacked and bonded on the basic coil layer, and includes a metal material conductor having a first upper end surface and a first lower end surface opposite to each other, and a second insulating layer having a third upper surface and a third lower surface opposite to each other and covering the conductor, wherein the first upper end surface of the conductor is exposed to the third upper surface of the second insulating layer, and the first lower end surface of the conductor is bonded to the first upper surface of the basic planar spiral coil, the composition of the second insulating layer is different from that of the first insulating layer, and the third lower surface of the second insulating layer is stacked and bonded to the second upper surface of the first insulating layer, and the second insulating layer covers the first upper surface of the basic planar spiral coil; At least one build-up coil layer, which is stacked and bonded on the conductive layer, and includes a metal build-up planar spiral coil having a fourth upper surface and a fourth lower surface opposite to each other, and a third insulating layer having a fifth upper surface and a fifth lower surface opposite to each other and covering the build-up planar spiral coil, wherein the fourth lower surface of the build-up planar spiral coil is bonded to the third upper surface of the second insulating layer, and the fourth upper surface and the side surfaces of the build-up planar spiral coil are covered with at least one layer of electroplated build-up layer of metal material, and the fifth lower surface of the third insulating layer is stacked and bonded to the third upper surface of the second insulating layer; and An opening area includes a through hole penetrating the basic coil layer, the conductive layer and the build-up coil layer.

2. The coil carrier according to claim 1, wherein: The at least one build-up coil layer is a multi-layer stacked build-up coil layer, and the third insulating layer of each build-up coil layer corresponding to the lower layer also includes at least one conductor with the same composition as the build-up planar spiral coil to connect the build-up planar spiral coil corresponding to the lower layer with the build-up planar spiral coil corresponding to the upper layer.

3. The coil carrier according to claim 1 or 2, wherein: The build-up coil layer corresponding to the top layer also includes at least one external electrical connection pad having the same composition as the build-up planar coil and arranged in the third insulating layer, wherein the upper surface of the external electrical connection pad is exposed to the fifth upper surface of the third insulating layer of the build-up coil layer corresponding to the top layer.

4. The coil carrier according to claim 1 or 2, wherein: The second lower surface of the first insulating layer is also combined with a lower insulating layer of insulating material.

5. The coil carrier according to claim 1, wherein: The first insulating layer includes a photosensitive dielectric material, and the second insulating layer and / or the third insulating layer includes a thermosetting dielectric material.

6. The coil carrier according to claim 1, wherein: The base planar spiral coil, the conductor, the build-up planar spiral coil and / or the electroplated build-up layer are made of copper or a copper alloy.

7. The coil carrier according to claim 1, wherein: The electroplating growth layer and the growth layer planar spiral coil have the same or different compositions.

8. The coil carrier according to claim 1, wherein: The first upper surface of the basic planar spiral coil protrudes, is flush with, or is recessed from the second upper surface of the first insulating layer.

9. A method for manufacturing a coil carrier, comprising: Step 1, providing a carrier plate having a metal surface; Step 2, forming a first insulating layer having a plurality of patterned openings on the carrier plate; Step 3, electroplating to form a basic planar spiral coil in the patterned plurality of openings, wherein the upper surface of the basic planar coil is exposed to the upper surface of the first insulating layer; Step 4, forming a second insulating layer on the first insulating layer and the basic planar coil, wherein the second insulating layer covers the upper surface of the basic planar spiral coil, and the composition of the insulating material of the second insulating layer is different from the composition of the insulating material of the first insulating layer; Step 5, forming at least one opening on the upper surface of the second insulating layer to expose a portion of the upper surface of the basic planar spiral coil; Step 6, performing a surface metallization process to form a metallized surface on the upper surface of the second insulating layer and in the opening; Step 7, electroplating a build-up planar spiral coil on the metallized surface of the second insulating layer and the opening by patterned exposure and development process, and a conductor formed in the opening to connect the build-up planar spiral coil and the base planar spiral coil, wherein the build-up planar spiral coil and the conductor have the same composition; Step eight, performing an etching process to remove the material of the metal layer on the second insulating layer that is not covered by the build-up planar spiral coil; Step nine, performing an electroplating process to form an electroplated growth layer on the exposed surface of the build-up planar spiral coil, so as to increase the height and width of the build-up planar spiral coil and reduce the line spacing, wherein the number of times of repeating step nine can be selectively increased to form a multi-layer stacked electroplated growth layer; Step 10, forming a third insulating layer on the second insulating layer to cover the second insulating layer and the build-up planar spiral coil; Step 11, removing the carrier plate to expose the lower surface of the base planar coil and the lower surface of the first insulating layer; and Step 12: forming a through hole penetrating the first insulating layer, the second insulating layer and the third insulating layer to form an opening area.

10. The method for manufacturing a coil carrier according to claim 9, wherein: Before executing step 11, step 10 also includes executing the following steps: Step 10-1, forming at least one opening on the third insulating layer to expose a portion of the upper surface of the build-up planar spiral coil; Step 10-2, performing a surface metallization process to form a metallized surface on the upper surface of the third insulating layer and in the opening; Step 10-3, forming another build-up planar spiral coil and a conductor connecting the another build-up planar spiral coil and the build-up planar spiral coil of the lower layer by electroplating on the metallized surface of the third insulating layer and the opening by patterned exposure and development process; Step 10-4, performing an etching process to remove the metal material of the metallized surface of the third insulating layer that is not covered by the other build-up planar spiral coil to expose the insulating surface of the third insulating layer; Step 10 / 5, performing an electroplating process to form an electroplated growth layer on the exposed surface of the other build-up planar spiral coil, so as to increase the height and width of the other build-up planar spiral coil and reduce the line spacing, wherein the number of times of repeating step 10 / 5 can be selectively increased to form a multi-layer stack of the other electroplated growth layer; Step 10 / 6, forming another third insulating layer to cover the another build-up planar spiral coil formed in Step 10 / 3 to Step 10 / 5; Step 10-7: selectively increase the number of times of repeating step 10-1 to step 10-6 to form a multi-layer stacked another build-up planar spiral coil and another third insulation layer.

11. The method for manufacturing a coil carrier according to claim 9 or 10, wherein: When the uppermost build-up planar spiral coil is formed by electroplating, at least one pair of external electrical connection pads are formed by electroplating simultaneously, and the upper surfaces of the external electrical connection pads are exposed to the upper surface of the uppermost third insulating layer.

12. The method for manufacturing a coil carrier according to claim 9, wherein: Before executing step 12, a lower insulating layer is formed to cover the lower surface of the first insulating layer.

13. The method for manufacturing a coil carrier according to claim 9 or 10, wherein: The electroplating growth layer and the growth layer planar spiral coil have the same or different compositions.

14. The method for manufacturing a coil carrier according to claim 9, wherein: The upper surface of the second insulating layer in step four is a metal surface or a non-metal surface.

15. The method for manufacturing a coil carrier according to claim 10, wherein: The upper surface of the third insulating layer in step 10 is a metal surface or a non-metal surface.

Images