Semiconductor laser bar sintering clamp with array structure

Abstract

The invention provides an array structure semiconductor laser bar sintering clamp which comprises a bottom plate, and the surface of the bottom plate is provided with a plurality of first grooves. The plurality of array units are respectively arranged on the first grooves; wherein each array unit comprises a first inclined plane and a second inclined plane, a clamping groove is formed in each first inclined plane, a second groove is formed in the bottom, in the first direction, of each clamping groove, and an anti-sticking sheet is arranged in each second groove; a first heat sink, a first soldering lug, a semiconductor laser bar, a second soldering lug and a second heat sink are sequentially arranged on the surface, in the first direction, of the anti-sticking sheet in parallel. The clamping groove is further provided with a pressing block, and the pressing block and the second heat sink are arranged in parallel in the first direction.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor laser packaging, and in particular to a semiconductor laser bar sintering fixture with an array structure. Background Art

[0002] In recent years, with the rapid development of material epitaxy technology and semiconductor preparation technology, the performance of semiconductor lasers has been greatly improved, and its application areas are also expanding. Compared with traditional solid lasers or fiber lasers, semiconductor lasers have the characteristics of small size, light weight, wide wavelength range, and easy modulation. They can be directly applied to measurement and sensing, laser radar, advanced manufacturing, medical health, lithography and printing, laser printing, security monitoring and many other fields, showing broad market prospects.

[0003] At present, the electro-optical conversion efficiency of semiconductor lasers under room temperature continuous conditions is between 40% and 70%, so a large amount of waste heat will be generated during operation. If the excess heat cannot be discharged in time, it will lead to a series of problems such as reduced efficiency, wavelength drift, and poor beam quality. In severe cases, it will also cause damage to the laser chip. Usually, the packaging of semiconductor laser bars adopts a two-step sintering process. First, the laser bar is packaged on the heat sink with hard solder to form a single bar unit, and then the bar unit is sintered with the module heat sink, electrode, etc. with low-temperature solder. The quality of the bar unit packaging determines the overall heat dissipation performance of the device.

[0004] When semiconductor laser bars are sintered in a vacuum furnace, a special sintering fixture is required. In the patent with announcement number CN207994336U "A High-power Bar Laser Sintering Fixture", the fixture is placed in the slot under a microscope, and then the slider driving mechanism drives the slider down until the pressing block contacts the heat sink, and the spring force is used to provide downward pressure to ensure uniform pressure, and then the entire fixture is placed in a vacuum reflow furnace for sintering. The disadvantage of this method is that the spring is prone to fatigue after repeated high and low temperature cycles, and its elastic force will change, which cannot ensure the consistency of the sintering process; at the same time, the fixture must be assembled under a microscope, and the packaging speed is slow.

[0005] The above information disclosed in this section is only for understanding the background of the inventive concept of the present invention and therefore the above information may contain information that does not constitute the prior art. Summary of the invention

[0006] In view of at least one aspect of the above technical problems, the present invention provides an array structure semiconductor laser bar sintering fixture, including: a base plate, a plurality of first grooves are provided on the surface of the base plate; an array unit, including a plurality of array units, which are respectively arranged on the first grooves; wherein each array unit includes a first inclined surface and a second inclined surface, a card slot is provided on the first inclined surface, a second groove is opened at the bottom of the card slot along the first direction, and an anti-sticking sheet is provided in the second groove; a first heat sink, a first welding sheet, a semiconductor laser bar, a second welding sheet and a second heat sink are arranged in parallel in sequence on the surface of the anti-sticking sheet along the first direction; and a pressing block is also provided on the card slot, and the pressing block and the second heat sink are arranged in parallel along the first direction.

[0007] In some exemplary embodiments of the present invention, the bottom plate is a flat plate structure, and the number of first grooves on the surface of the bottom plate and the spacing between the first grooves are related to the volume of the heating zone of the vacuum sintering furnace.

[0008] In some exemplary embodiments of the present invention, the area of ​​the bottom of each array unit is adapted to each first groove, so that each array unit is clamped on each first groove.

[0009] In some exemplary embodiments of the present invention, the first inclined surface and the second inclined surface are perpendicular to each other, and the angle between the first inclined surface and the second inclined surface and the bottom plate plane is 45 degrees; and the first direction is parallel to the first inclined surface.

[0010] In some exemplary embodiments of the present invention, the anti-sticking sheet is a rectangular structure, the area of ​​the bottom of the anti-sticking sheet is adapted to the second groove, so that the anti-sticking sheet can be clamped in the second groove; and the height of the anti-sticking sheet along the second direction is the same as the height of the second groove along the second direction, so that the anti-sticking sheet is flush with the clamping groove along the first direction.

[0011] In some exemplary embodiments of the present invention, a length of the second groove along the first direction is greater than a sum of lengths of the first heat sink, the first soldering pad, the semiconductor laser bar, the second soldering pad, and the second heat sink along the first direction.

[0012] In some exemplary embodiments of the present invention, the first heat sink, the first welding piece, the semiconductor laser bar, the second welding piece and the second heat sink are all rectangular structures, wherein the bottom surfaces of the first heat sink, the first welding piece, the semiconductor laser bar, the second welding piece and the second heat sink along the first direction are the same, and the length of the bottom surface along the third direction is less than the length of the card slot along the third direction.

[0013] In some exemplary embodiments of the present invention, the pressing block is a rectangular parallelepiped structure, the bottom surface of the pressing block along the first direction is the same as the bottom surface of the second heat sink along the first direction; and a circular hole is provided at one end of the pressing block away from the second heat sink along the first direction.

[0014] In some exemplary embodiments of the present invention, the light emitting surface of the semiconductor laser bar faces the second inclined surface.

[0015] In some exemplary embodiments of the present invention, the first direction, the second direction and the third direction are all perpendicular to each other.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The overall structure of a sintering fixture for a semiconductor laser bar with an array structure according to an embodiment of the present invention is schematically shown;

[0018] Figure 2 A schematic diagram of the bottom plate structure of a sintering fixture for semiconductor laser bars with an array structure according to an embodiment of the present invention is shown;

[0019] Figure 3 The structure diagram of an array unit of an array structure semiconductor laser bar sintering fixture according to an embodiment of the present invention is schematically shown. DETAILED DESCRIPTION

[0020] The specific embodiments of the present invention will be described in detail below. It should be noted that the embodiments described herein are only for illustration and are not intended to limit the present invention. In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is obvious to those of ordinary skill in the art that these specific details do not have to be adopted to implement the present invention. In other examples, in order to avoid confusing the present invention, known structures, materials or methods are not specifically described.

[0021] Throughout the specification, references to "one embodiment," "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "in one embodiment," "in an embodiment," "an example," or "an example" appearing in various places throughout the specification do not necessarily all refer to the same embodiment or example. In addition, particular features, structures, or characteristics may be combined in one or more embodiments or examples in any suitable combination and / or subcombination. In addition, it should be understood by those of ordinary skill in the art that the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "comprise", "include", etc. used herein indicate the existence of features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0023] All terms used herein, including technical and scientific terms, have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0024] An embodiment of the present invention provides a sintering fixture for semiconductor laser bars with an array structure. The sintering fixture has a simple structure, is easy to operate, and can be used for single or batch production. Sintering is performed under the protection of formic acid, which can prevent solder oxidation during high-temperature sintering. When performing batch sintering, the array unit is placed in a groove of a base plate, and the distance between each array unit is the same, thereby ensuring the consistency of sintering quality. In addition, by grooving the bottom of an inclined surface of the array unit and placing an anti-sticking sheet, the solder can be effectively prevented from sticking to the array unit after melting, thereby preventing damage to the laser bar cavity surface.

[0025] Combine the following Figures 1 to 3 An embodiment of a sintering fixture for semiconductor laser bars with an array structure according to an embodiment of the present invention is described in detail.

[0026] Figure 1 The overall structure of the array structure semiconductor laser bar sintering fixture according to an embodiment of the present invention is schematically shown. Figure 2 The bottom plate structure of the array structure semiconductor laser bar sintering fixture according to an embodiment of the present invention is schematically shown. Figure 3 The structure diagram of an array unit of an array structure semiconductor laser bar sintering fixture according to an embodiment of the present invention is schematically shown.

[0027] like Figures 1 to 3 As shown, the array structure semiconductor laser bar sintering fixture includes a base plate 1, and a plurality of first grooves 4 are provided on the surface of the base plate 1; an array unit 2 includes a plurality of array units 2, which are respectively arranged on the first grooves 4; wherein each array unit 2 includes a first inclined surface 12 and a second inclined surface 13, and a card slot 8 is provided on the first inclined surface 12, and a second groove 6 is opened at the bottom of the card slot 8 along the first direction X1, and an anti-sticking sheet 5 is provided in the second groove 6; a first heat sink 9, a first welding sheet 10, a semiconductor laser bar 11, a second welding sheet 14 and a second heat sink 15 are arranged in sequence on the surface of the anti-sticking sheet 5 along the first direction X1; and a pressing block 3 is also provided on the card slot 8, and the pressing block 3 and the second heat sink 15 are arranged in parallel along the first direction X1.

[0028] Specifically, if Figure 2 As shown, the bottom plate 1 is a flat plate structure, and a plurality of first grooves 4 are provided on the surface of the bottom plate 1. The number of the first grooves 4 and the spacing between the first grooves 4 are related to the volume of the heating zone of the vacuum sintering furnace, that is, the distribution and number of the first grooves 4 can be determined according to the temperature distribution of the vacuum sintering furnace. Generally, the number of the first grooves 4 can be 4 to 25, for example Figure 2 There are six first grooves 4 shown.

[0029] In the embodiment of the present invention, the bottom plate 1 is made of high temperature resistant metal materials such as stainless steel or aluminum-based or copper-based.

[0030] like Figure 1 As shown, an array unit 2 is provided on each first groove 4, and the area of ​​the bottom of each array unit 2 is adapted to each first groove 4, so that each array unit 2 is clamped on each first groove 4, so that each array unit 2 is fixed to the first groove 4. It should be noted that the distance between every two array units 2 is the same.

[0031] Through the embodiments of the present invention, the sintering fixture can be produced individually or in batches. When performing batch sintering, the array units are placed in the grooves of the base plate, and the distance between each array unit is the same, thereby ensuring the consistency of sintering quality.

[0032] In the embodiment of the present invention, the array unit 2 is made of high temperature resistant metal materials such as stainless steel, aluminum-based or copper-based.

[0033] Furthermore, each array unit 2 is a two-sided inclined structure, including a first inclined surface 12 and a second inclined surface 13, the first inclined surface 12 and the second inclined surface 13 are perpendicular to each other, and the angle between the first inclined surface 12 and the second inclined surface 13 and the plane of the base plate 1 is 45 degrees, wherein the first direction X1 is parallel to the first inclined surface 12.

[0034] like Figure 3 As shown, a card slot 8 is provided on the first inclined surface 12, and a second groove 6 is provided at the bottom of the card slot 8 along the first direction X1, and a release sheet 5 is provided in the second groove 6. The depth of the second groove 6 along the second direction X2 is generally 1 to 2 mm.

[0035] It should be noted that the card slot 8 may be provided on either the first inclined surface 12 or the second inclined surface 13, but not on the other inclined surface. In the embodiment of the present invention, the card slot 8 is provided on the first inclined surface 12 for illustration.

[0036] Further, such as Figure 3As shown, the release sheet 5 is a rectangular parallelepiped structure, and the area of ​​the bottom of the release sheet 5 is adapted to the second groove 6, so that the release sheet 5 is clamped in the second groove 6, so that the release sheet 5 and the second groove 6 are fixed together. The height of the release sheet 5 along the second direction X2 is the same as the height of the second groove 6 along the second direction X2, so that the release sheet 5 and the clamping groove 8 are flush along the first direction X1.

[0037] The anti-sticking sheet 5 can be provided to prevent the welding sheet from melting and adhering to the array unit when the semiconductor laser bar is sintered in a vacuum furnace, thereby damaging the cavity surface of the semiconductor laser bar.

[0038] In the embodiment of the present invention, the release sheet 5 is made of glass or ceramic.

[0039] like Figure 3 As shown, a first heat sink 9, a first soldering sheet 10, a semiconductor laser bar 11, a second soldering sheet 14 and a second heat sink 15 are sequentially arranged in parallel on the surface of the release sheet 5 along the first direction X1.

[0040] Furthermore, the length of the second groove 6 along the first direction X1 is greater than the sum of the lengths of the first heat sink 9 , the first soldering piece 10 , the semiconductor laser bar 11 , the second soldering piece 14 and the second heat sink 15 along the first direction X1 .

[0041] Among them, the first heat sink 9, the first welding piece 10, the semiconductor laser bar 11, the second welding piece 14 and the second heat sink 15 are all rectangular parallelepiped structures, wherein the bottom surfaces of the first heat sink 9, the first welding piece 10, the semiconductor laser bar 11, the second welding piece 14 and the second heat sink 15 along the first direction X1 are the same, and the length of the bottom surface along the third direction X3 is less than the length of the card slot 8 along the third direction X3. It should be noted that in the embodiment of the present invention, the first direction X1, the second direction X2 and the third direction X3 are all perpendicular to each other.

[0042] It can be understood that the first heat sink 9, the first welding piece 10, the semiconductor laser bar 11, the second welding piece 14 and the second heat sink 15 are placed close to the slot 8 on the first inclined surface 12, and self-alignment is achieved under the action of gravity. The light-emitting surface of the semiconductor laser bar 11 faces the second inclined surface 13, which can ensure the cleanliness of the light-emitting cavity surface.

[0043] In the embodiment of the present invention, the heat sink has good thermal conductivity and a thermal expansion coefficient that matches that of the laser chip, and is generally made of copper or tungsten copper.

[0044] In the embodiment of the present invention, the soldering sheet has good thermal conductivity and fatigue resistance, and is generally made of hard solder material such as gold-tin.

[0045] like Figure 3As shown, a pressing block 3 is also provided on the card slot 8, and the pressing block 3 and the second heat sink 15 are arranged in parallel along the first direction X1 to provide the pressure required for sintering. The pressing block 3 is a rectangular parallelepiped structure, and the material of the pressing block 3 is stainless steel or aluminum-based or copper-based high temperature resistant metal materials.

[0046] Furthermore, the bottom surface of the pressing block 3 along the first direction X1 is the same as the bottom surface of the second heat sink 15 along the first direction X1, and a circular hole 7 is provided at one end of the pressing block 3 away from the second heat sink 15 along the first direction X1 to facilitate clamping of the pressing block 3 through the circular hole 7, so that the mass of the pressing block can be adjusted according to the required pressure.

[0047] Based on the above description of the array structure semiconductor laser bar sintering fixture, the sintering process using the array structure semiconductor laser bar sintering fixture is described in detail below.

[0048] On each array unit 2, use tweezers to place the first heat sink 9, the first soldering pad 10, the semiconductor laser bar 11, the second soldering pad 14 and the second heat sink 15 in accordance with the Figure 3 The semiconductor laser bars 11 are placed in the order of the third direction X3 close to the card slot 8 on the first inclined surface 12, and are in contact with the anti-sticking sheet 5 under the action of their own gravity. It should be noted that the light emitting surface of the semiconductor laser bar 11 should be placed toward the second inclined surface 13 to prevent the light emitting cavity surface from being contaminated and affecting the device performance.

[0049] Then, the compact 3 is clamped through the circular hole 7 with tweezers, and the compact 3 and the second heat sink 15 are arranged in parallel on the slot 8 along the first direction X1 to provide the pressure required for sintering.

[0050] The array unit 2 after the above operation is placed in the first groove 4 of the base plate 1. Multiple array units 2 can be placed on the base plate 1, and multiple semiconductor laser bars 11 can be sintered at one time, thus forming an array structure semiconductor laser bar sintering fixture.

[0051] Finally, the assembled array structure semiconductor laser bar sintering fixture is placed in a sintering furnace for sintering.

[0052] Through the embodiments of the present invention, the array structure semiconductor laser bar sintering fixture has a simple structure and is easy to operate. It can be produced individually or in batches, thereby improving production efficiency. The use of a pressure block to apply pressure can avoid the thermal fatigue characteristics of spring pressure during repeated heating, thereby ensuring the consistency of sintering. By adding an anti-sticking sheet design, the welding sheet and the array unit can be effectively prevented from sticking, thereby improving the quality of sintering.

[0053] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0054] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents. It will be appreciated by those skilled in the art that the features described in the various embodiments of the present invention and / or the claims may be combined in various combinations and / or combinations, even if such combinations or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments of the present invention and / or the claims may be combined in various combinations and / or combinations without departing from the spirit and teachings of the present invention. All of these combinations and / or combinations fall within the scope of the present invention.

Claims

1. A sintering fixture for array structure semiconductor laser bars, characterized in that: include: A bottom plate (1), wherein a plurality of first grooves (4) are provided on a surface of the bottom plate (1); An array unit (2), comprising a plurality of array units, each of which is arranged on the first groove (4); Each of the array units (2) comprises a first inclined surface (12) and a second inclined surface (13); a card slot (8) is provided on the first inclined surface (12); a second groove (6) is provided at the bottom of the card slot (8) along the first direction; and a non-sticking sheet (5) is provided in the second groove (6); A first heat sink (9), a first welding sheet (10), a semiconductor laser bar (11), a second welding sheet (14) and a second heat sink (15) are sequentially arranged in parallel on the surface of the anti-adhesive sheet (5) along a first direction; and A pressing block (3) is also provided on the card slot (8), and the pressing block (3) and the second heat sink (15) are arranged in parallel along the first direction.

2. The array structure semiconductor laser bar sintering fixture according to claim 1, characterized in that: The bottom plate (1) is a flat plate structure, and the number of first grooves (4) on the surface of the bottom plate (1) and the spacing between the first grooves (4) are both related to the volume of the heating zone of the vacuum sintering furnace.

3. The array structure semiconductor laser bar sintering fixture according to claim 1 or 2, characterized in that: The area of ​​the bottom of each array unit (2) is adapted to each of the first grooves (4), so that each of the array units (2) is clamped on each of the first grooves (4).

4. The array structure semiconductor laser bar sintering fixture according to claim 3, characterized in that: The first inclined surface (12) and the second inclined surface (13) are perpendicular to each other, and the angle between the first inclined surface (12) and the second inclined surface (13) and the plane of the bottom plate (1) is 45 degrees; and The first direction is parallel to the first inclined surface (12).

5. The array structure semiconductor laser bar sintering fixture according to claim 1 or 4, characterized in that: The anti-adhesive sheet (5) is a rectangular parallelepiped structure, and the area of ​​the bottom of the anti-adhesive sheet (5) is adapted to the second groove (6), so that the anti-adhesive sheet (5) is stuck in the second groove (6); and The height of the anti-adhesive sheet (5) along the second direction is the same as the height of the second groove (6) along the second direction, so that the anti-adhesive sheet (5) is flush with the card slot (8) along the first direction.

6. The array structure semiconductor laser bar sintering fixture according to claim 5, characterized in that: The length of the second groove (6) along the first direction is greater than the sum of the lengths of the first heat sink (9), the first soldering plate (10), the semiconductor laser bar (11), the second soldering plate (14) and the second heat sink (15) along the first direction.

7. The array structure semiconductor laser bar sintering fixture according to claim 1 or 6, characterized in that: The first heat sink (9), the first welding sheet (10), the semiconductor laser bar (11), the second welding sheet (14) and the second heat sink (15) are all rectangular parallelepiped structures, wherein the bottom surfaces of the first heat sink (9), the first welding sheet (10), the semiconductor laser bar (11), the second welding sheet (14) and the second heat sink (15) along the first direction are all the same, and the length of the bottom surface along the third direction is less than the length of the card slot (8) along the third direction.

8. The array structure semiconductor laser bar sintering fixture according to claim 7, characterized in that: The pressing block (3) is a rectangular parallelepiped structure, and the bottom surface of the pressing block (3) along the first direction is the same as the bottom surface of the second heat sink (15) along the first direction; and A circular hole (7) is provided at one end of the pressing block (3) away from the second heat sink (15) along the first direction.

9. The array structure semiconductor laser bar sintering fixture according to claim 1 or 6, characterized in that: The light emitting surface of the semiconductor laser bar (11) faces the second inclined surface (13).

10. The array structure semiconductor laser bar sintering fixture according to claim 7, characterized in that: The first direction, the second direction and the third direction are all perpendicular to each other.

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