Edge-emitting laser planar packaging structure and manufacturing method

Abstract

The invention discloses an edge-emitting laser planar packaging structure and a manufacturing method, and belongs to the technical field of laser packaging. According to the method, a transition electrode is arranged, and a heat sink and a chip are arranged on the transition electrode, so that an independent COS unit is formed, then the independent COS unit is mounted in a plastic package bracket, and the positive electrode and the negative electrode of the transition electrode are respectively attached to a positive electrode plate and a negative electrode plate in the plastic package bracket, so that planar packaging of the edge-emitting laser can be realized, and the edge-emitting laser can be manufactured. Therefore, the edge-emitting laser with the miniaturized plane package can better adapt to higher requirements of the market on the package size of the laser, and has a good heat dissipation effect, so that the stability of the power of the product is improved.

Description

Technical Field

[0001] The invention relates to the technical field of laser packaging, in particular to an edge-emitting laser planar packaging structure and a manufacturing method thereof. Background Art

[0002] Semiconductor lasers have the advantages of small size, light weight, long life, high operational reliability, low energy consumption, high electro-optical conversion efficiency, easy mass production and low price. They are widely used in optical communication, optical storage, optical pumping, optical indication and other fields. In recent years, with the advancement of technology and the improvement of people's living standards, the laser therapy market has developed rapidly. For example, applications such as laser hair growth caps require dozens or even hundreds of lasers to work together, which puts higher requirements on the packaging volume of lasers. Conventional semiconductor edge-emitting lasers are generally TO packages, which have large package dimensions and cannot meet the requirements. Summary of the invention

[0003] In response to the above problems, the present application provides an edge-emitting laser planar packaging structure and a manufacturing method, which can achieve miniaturized planar packaging of edge-emitting lasers, thereby better adapting to the market's higher requirements for laser packaging volume.

[0004] The technical solution adopted by the present invention to solve the technical problem is:

[0005] An edge-emitting laser planar packaging structure comprises a support body, wherein the support body is provided with a mounting groove;

[0006] A first mounting hole and a second mounting hole are arranged on the bottom surface of the mounting groove, a positive electrode sheet is arranged in the first mounting hole, and a negative electrode sheet is arranged in the second mounting hole;

[0007] A COS unit is arranged in the installation slot;

[0008] The COS unit includes a transition electrode, the transition electrode includes a transition positive electrode and a transition negative electrode, and an insulating sheet is arranged between the transition positive electrode and the transition negative electrode;

[0009] The transition positive electrode is bonded to the positive electrode sheet, and the transition negative electrode is bonded to the negative electrode sheet;

[0010] A heat sink is arranged on the transition positive electrode of the transition electrode, a chip is arranged on the heat sink, and a light emitting surface of the chip faces the opening side of the mounting groove;

[0011] The chip is connected to the transition negative electrode of the transition electrode through a gold wire;

[0012] The installation groove is filled with a transparent packaging material, and the COS unit is packaged in the installation groove.

[0013] Furthermore, the support body is made of plastic.

[0014] Furthermore, the transition positive electrode and the transition negative electrode are fixedly connected to the insulating sheet by gluing.

[0015] Furthermore, the transition positive electrode and the transition negative electrode are made of copper alloy or Kovar alloy.

[0016] Furthermore, the material of the insulating sheet is aluminum nitride or epoxy resin board.

[0017] Furthermore, the transition positive electrode is bonded and fixed to the positive electrode sheet via a conductive adhesive, and the transition negative electrode is bonded and fixed to the negative electrode sheet via a conductive adhesive.

[0018] Furthermore, the adhesive is conductive silver paste.

[0019] Furthermore, the packaging material is silica gel or epoxy glue.

[0020] A method for manufacturing an edge-emitting laser planar packaging structure comprises the following steps:

[0021] S1, preparation of transition electrode;

[0022] S2, placing the chip and the heat sink on the transition positive electrode of the transition electrode;

[0023] S3, connecting the chip and the transition negative electrode of the transition electrode through a gold wire to obtain a COS unit;

[0024] S4, preparing plastic-sealed stents;

[0025] The plastic package bracket comprises a substrate, a plurality of mounting grooves are arranged on the substrate, a first mounting hole and a second mounting hole are arranged in each mounting groove, a positive electrode sheet is arranged in the first mounting hole, and a negative electrode sheet is arranged in the second mounting hole;

[0026] S5, placing the COS unit in the tray with the light emitting surface of the chip facing upward;

[0027] S6, applying a conductive adhesive on the positive electrode sheet and the negative electrode sheet of the plastic-encapsulated support;

[0028] S7, placing the COS units one by one in the mounting grooves of the plastic package bracket and baking them;

[0029] S8, pouring transparent packaging material into each installation groove of the plastic packaging bracket;

[0030] S9, cutting the plastic package bracket.

[0031] Furthermore, in step S8, the height of the glue pouring is flush with the upper side surface of the plastic package support.

[0032] The beneficial effects of the present invention are:

[0033] The embodiment of the present application provides a planar packaging structure and manufacturing method of an edge-emitting laser. By setting a transition electrode, and setting a heat sink and a chip on the transition electrode, an independent COS unit is formed, and then the independent COS unit is mounted in a plastic package bracket, and the positive and negative electrodes of the transition electrode are respectively bonded to the positive electrode sheet and the negative electrode sheet in the plastic package bracket. Not only can the planar packaging of the edge-emitting laser be realized, and a miniaturized planar packaged edge-emitting laser is obtained, so as to better meet the market's higher requirements for the laser packaging volume, but also it has a good heat dissipation effect, so as to improve the stability of the product power. In addition, when mounting the COS unit, the manufacturing method of the planar packaging structure of an edge-emitting laser provided in the embodiment of the present application can be automatically assembled with the help of a die bonding device, which can effectively improve the packaging efficiency compared with the traditional packaging method. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of a three-dimensional structure of an edge-emitting laser planar packaging structure provided in an embodiment of the present application;

[0035] Figure 2 A top view of a planar packaging structure of an edge-emitting laser provided in an embodiment of the present application;

[0036] Figure 3 for Figure 2 AA section view in;

[0037] Figure 4 Schematic diagram of the three-dimensional structure of the transition electrode;

[0038] Figure 5 Schematic diagram of the three-dimensional structure of the COS unit;

[0039] Figure 6 It is a schematic diagram of the three-dimensional structure of the plastic-encapsulated bracket;

[0040] Figure 7 This is a schematic diagram of the structure of mounting the COS unit into the plastic package bracket;

[0041] Figure 8 A schematic diagram of the cutting line when cutting the plastic-encapsulated bracket.

[0042] In the figure: 1, plastic package bracket; 11, substrate; 12, support body; 13, mounting groove; 141, positive electrode sheet; 142, negative electrode sheet;

[0043] 2. COS unit; 21. transition electrode; 211. transition positive electrode; 212. transition negative electrode; 213. insulating sheet; 22. heat sink; 23. chip; 24. gold wire;

[0044] 3. Cutting line. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described in detail below in conjunction with the drawings in the embodiments of the present application, and the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by those skilled in the art without creative work on the basis of the embodiments of the present application shall belong to the protection scope of the present application.

[0046] For ease of understanding, the coordinate system is defined as Figure 1 As shown, the left-right direction is the horizontal direction, the front-back direction is the longitudinal direction, and the up-down direction is the vertical direction.

[0047] like Figure 1 , Figure 2 and Figure 3 As shown, a planar packaging structure of an edge-emitting laser includes a support body 12 made of insulating material, and a mounting groove 13 is arranged on the support body 12.

[0048] As a specific implementation, the support body 12 described in this embodiment is a rectangular box-type structure, including a bottom plate with a rectangular structure, and side panels extending to one side perpendicular to the bottom plate are respectively arranged on the four sides of the bottom plate, and the internal space enclosed by the bottom plate and the four side panels is the installation groove 13.

[0049] As a specific implementation, the support body 12 described in this embodiment is made of plastic.

[0050] The bottom surface of the mounting groove 13 (i.e., the bottom plate) is provided with a plurality of Figure 1 The coordinate system shown is a first mounting hole and a second mounting hole that penetrate the bottom of the mounting groove 13 in the vertical direction. A positive electrode sheet 141 is fixedly mounted in the first mounting hole, and a negative electrode sheet 142 is fixedly mounted in the second mounting hole. The inner side surfaces of the positive electrode sheet 141 and the negative electrode sheet 142 (the inner side is the side facing the mounting groove 13) are flush with the bottom surface of the mounting groove 13, and the outer side surfaces of the positive electrode sheet 141 and the negative electrode sheet 142 are flush with the bottom surface of the support body 12.

[0051] As a specific implementation manner, the first mounting hole and the second mounting hole described in this embodiment are both rectangular structures, and the long sides of the first mounting hole and the second mounting hole are along the left-right direction (according to Figure 1 The first mounting hole and the second mounting hole extend in the front-to-back direction (according to the coordinate system shown in FIG. Figure 1 Correspondingly, the positive electrode sheet 141 and the negative electrode sheet 142 are also rectangular structures.

[0052] A COS unit 2 is arranged in the installation groove.

[0053] The COS unit 2 includes a transition electrode 21, and the transition electrode 21 includes a transition positive electrode 211 and a transition negative electrode 212. An insulating sheet 213 made of insulating material is disposed between the transition positive electrode 211 and the transition negative electrode 212. The transition positive electrode 211, the transition negative electrode 212 and the insulating sheet 213 form a sandwich structure.

[0054] As a specific implementation, the transition positive electrode 211 and the transition negative electrode 212 in this embodiment are fixedly connected to the insulating sheet 213 by gluing. The transition positive electrode 211 and the transition negative electrode 212 are made of copper alloy or Kovar alloy, and the insulating sheet 213 is made of aluminum nitride or epoxy resin board.

[0055] The transition positive electrode 211 is bonded to the positive electrode sheet 141 , and the transition negative electrode 212 is bonded to the negative electrode sheet 142 .

[0056] As a specific implementation, the transition positive electrode 211 in this embodiment is bonded and fixed to the positive electrode sheet 141 by means of adhesive bonding, and the transition negative electrode 212 is bonded and fixed to the negative electrode sheet 142 by means of adhesive bonding, and the adhesive is conductive. Exemplarily, the adhesive is conductive silver paste.

[0057] A heat sink 22 is provided on the transition positive electrode 211 of the transition electrode 21, one side of the heat sink 22 is fixedly connected to the transition positive electrode 211 by welding, and a chip 23 is fixedly provided on the other side of the heat sink 22 by welding, and the light emitting surface of the chip 23 faces the opening side of the mounting groove 13. The negative electrode of the chip 23 is connected to the transition negative electrode 212 of the transition electrode 21 by a gold wire 24.

[0058] The installation groove 13 is filled with a transparent packaging material, and the side surface of the COS unit 2 closest to the opening side of the installation groove 13 is located inside the installation groove 13, and the COS unit 2 is entirely packaged in the installation groove.

[0059] By filling the installation groove 13 with a transparent packaging material, the internal structure can be protected while not affecting the laser emission.

[0060] As a specific implementation, the packaging material described in this embodiment is silica gel or epoxy glue.

[0061] Further, according to Figure 1 In the coordinate system shown, the projected area of ​​the positive electrode sheet 141 in the horizontal plane is larger than the contact area between the positive electrode sheet 141 and the transition positive electrode 211; the projected area of ​​the negative electrode sheet 142 in the horizontal plane is larger than the contact area between the negative electrode sheet 142 and the transition positive electrode 211. By increasing the cotton neps of the positive electrode sheet 141 and the negative electrode sheet 142, the heat dissipation area can be increased, thereby improving the heat dissipation effect and enhancing the stability of the product power.

[0062] A method for manufacturing an edge-emitting laser planar packaging structure comprises the following steps:

[0063] S1, prepare the transition electrode 21. The transition positive electrode 211 and the transition negative electrode 212 are fixedly connected to the insulating sheet 213 by gluing, so as to obtain Figure 4 The transition electrode 21 is shown.

[0064] S2 , bonding the chip 23 to the transition positive electrode 211 of the transition electrode 21 through the heat sink 22 .

[0065] As a specific implementation manner, both sides of the heat sink 22 in this embodiment are coated with gold-tin solder, and are fixedly connected to the transition positive electrode 211 and the chip 23 respectively by welding.

[0066] S3, connect the negative electrode of the chip 23 and the transition negative electrode 212 of the transition electrode 21 through the gold wire 24, and obtain the following Figure 5 COS unit 2 shown.

[0067] S4, preparing a plastic-sealed bracket 1.

[0068] like Figure 6As shown, the plastic package bracket 1 includes a substrate 11 made of insulating material, and a plurality of mounting grooves 13 for accommodating the COS unit 2 are arranged on the substrate 11, and each of the mounting grooves 13 is provided with a first mounting hole and a second mounting hole, and a positive electrode sheet 141 is arranged in the first mounting hole, and a negative electrode sheet 142 is arranged in the second mounting hole.

[0069] As a specific implementation, the multiple installation grooves 13 in this embodiment are arranged in a matrix.

[0070] S5, neatly arranging the COS units 2 obtained in step S3 in a tray, with the light emitting surface of the chip 23 facing upward.

[0071] S6, applying a conductive adhesive on each positive electrode sheet 141 and negative electrode sheet 142 of the plastic package support 1 by using a glue dispenser.

[0072] S7, such as Figure 7 As shown, the COS units 2 are placed one by one in the mounting grooves of the plastic package bracket 1 by a die bonding machine and baked to complete the interconnection between the COS units 2 and the plastic package bracket 1 .

[0073] S8, using a glue potting machine to pot the transparent packaging material into each installation groove 13 of the plastic packaging bracket 1.

[0074] As a specific implementation manner, in this embodiment, the height of the glue potting is preferably flush with the upper side surface of the plastic package bracket 1 .

[0075] S9, through the tendon cutting machine according to Figure 8 The plastic package bracket 1 is cut by the cutting line 3 shown in the figure, so as to obtain the following Figure 1 The laser monomer is shown.

[0076] Other embodiments obtained by those skilled in the art by combining, splitting, reorganizing, etc. the embodiments of the present application on the basis of the embodiments provided in the present application do not exceed the protection scope of the present application.

[0077] The above specific implementation methods have detailed the purpose, technical solutions and beneficial effects of the embodiments of the present application. The above are only specific implementation methods of the embodiments of the present application and are not used to limit the protection scope of the embodiments of the present application. That is, any modifications, equivalent substitutions, improvements, etc. made on the basis of the embodiments of the present application should be included in the protection scope of the embodiments of the present application.

Claims

1. An edge-emitting laser planar packaging structure, characterized in that: It comprises a support body (12), wherein the support body (12) is provided with a mounting groove (13); A first mounting hole and a second mounting hole are arranged on the bottom surface of the mounting groove (13); a positive electrode sheet (141) is arranged in the first mounting hole, and a negative electrode sheet (142) is arranged in the second mounting hole; A COS unit (2) is arranged in the installation groove; The COS unit (2) comprises a transition electrode (21), wherein the transition electrode (21) comprises a transition positive electrode (211) and a transition negative electrode (212), and an insulating sheet (213) is provided between the transition positive electrode (211) and the transition negative electrode (212); The transition positive electrode (211) is bonded to the positive electrode sheet (141), and the transition negative electrode (212) is bonded to the negative electrode sheet (142); A heat sink (22) is arranged on the transition positive electrode (211) of the transition electrode (21), a chip (23) is arranged on the heat sink (22), and a light emitting surface of the chip (23) faces the opening side of the mounting groove (13); The chip (23) is connected to the transition negative electrode (212) of the transition electrode (21) via a gold wire (24); The installation groove (13) is filled with a transparent packaging material, and the COS unit (2) is packaged in the installation groove.

2. The edge-emitting laser planar packaging structure according to claim 1, characterized in that: The support body (12) is made of plastic.

3. The edge-emitting laser planar packaging structure according to claim 1, characterized in that: The transition positive electrode (211) and the transition negative electrode (212) are respectively fixedly connected to the insulating sheet (213) by gluing.

4. The edge-emitting laser planar packaging structure according to claim 1, characterized in that: The transition positive electrode (211) and the transition negative electrode (212) are made of copper alloy or Kovar alloy.

5. The edge-emitting laser planar packaging structure according to claim 1, characterized in that: The material of the insulating sheet (213) is aluminum nitride or epoxy resin board.

6. The edge-emitting laser planar packaging structure according to claim 1, characterized in that: The transition positive electrode (211) is bonded and fixed to the positive electrode sheet (141) via a conductive adhesive, and the transition negative electrode (212) is bonded and fixed to the negative electrode sheet (142) via a conductive adhesive.

7. The edge-emitting laser planar packaging structure according to claim 6, characterized in that: The adhesive is conductive silver paste.

8. The edge-emitting laser planar packaging structure according to claim 1, characterized in that: The packaging material is silica gel or epoxy glue.

9. A method for manufacturing the edge-emitting laser planar packaging structure according to any one of claims 1 to 8, characterized in that: The following steps are included: S1, preparing a transition electrode (21); S2, placing the chip (23) and the heat sink (22) on the transition positive electrode (211) of the transition electrode (21); S3, connecting the chip (23) and the transition negative electrode (212) of the transition electrode (21) through a gold wire (24) to obtain a COS unit (2); S4, preparing a plastic-encapsulated stent (1); The plastic package bracket (1) comprises a substrate (11), a plurality of mounting grooves (13) are arranged on the substrate (11), a first mounting hole and a second mounting hole are arranged in each of the mounting grooves (13), a positive electrode sheet (141) is arranged in the first mounting hole, and a negative electrode sheet (142) is arranged in the second mounting hole; S5, placing the COS unit (2) in a tray with the light emitting surface of the chip (23) facing upward; S6, applying a conductive adhesive on the positive electrode sheet (141) and the negative electrode sheet (142) of the plastic package support (1); S7, placing the COS units (2) one by one in the mounting grooves of the plastic package bracket (1) and baking them; S8, pouring transparent packaging material into each installation groove (13) of the plastic packaging bracket (1); S9, cutting the plastic package support (1).

10. The method for manufacturing a planar package structure of an edge-emitting laser according to claim 9, characterized in that: In step S8, the height of the glue injection is flush with the upper side surface of the plastic package support (1).

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