A silicone rubber-containing probe tip cleaning sheet material

Abstract

The application relates to the technical field of probe cleaning sheets, in particular to a silicon-rubber-containing probe cleaning sheet material.A silicon-rubber-containing probe cleaning sheet material is characterized in that: a bottom film is arranged, a cleaning pad layer is arranged on the bottom film, and viscoelastic layers are arranged on the upper and lower bottom surfaces of the bottom film; the cleaning pad layer comprises a plurality of inverted-pyramid-shaped concave structures arranged in a matrix; and the Shore A hardness of the cleaning pad layer is 50-80.The silicon-rubber-containing probe cleaning sheet material can remove the attached residues and pollutants generated in the signal transmission process of the existing probe tip abutting against the die elements on the wafer, improve the cleaning efficiency, reduce the test accuracy and the fault rate, and can be used for a long time by regularly polishing and cleaning the probe, removing the attached residues and pollutants on the probe, and slightly grinding the probe, so that the stability and reliability of the test results are improved.

Description

Technical Field

[0001] This application relates to the field of probe cleaning pad technology, and more specifically, to a probe cleaning pad material containing silicone rubber. Background Technology

[0002] Semiconductor (integrated circuit) devices are manufactured by fabricating multiple devices on a semiconductor wafer using semiconductor processing techniques including photolithography, deposition, and sputtering. The aim is to create wafer-level, fully functional integrated circuit devices (ICs), which are individual IC devices isolated or diced from the semiconductor wafer into discrete and independent dies. Assembly techniques include attaching the dies to lead frames, wire bonding, or solder ball attachment to assemble the isolated IC devices, ultimately completing their encapsulation in a package or integrating them into an electronic device.

[0003] However, in actual wafer assembly practice, physical defects in the wafer itself and / or defects in wafer processing inevitably result in some dies being fully functional, some being non-functional, and some having lower performance or requiring repair. It is generally desirable to identify which dies on the wafer are fully functional before wafer isintegrated and assembled into consumer devices. A process known as wafer selection identifies non-functional, lower-performance, and repairable devices caused by certain physical defects in the wafer, defects in the IC circuit layers, and / or defects related to semiconductor processing technology. The product performance is determined by electrical testing. Once a device has been in place, certain process steps during handling and assembly inevitably result in dicing defects, handling defects, and assembly and packaging-related defects that can only be electrically identified to reclassify the device as fully functional, non-functional, or potentially "repairable." In a typical wafer testing process, probe cards are mounted onto a prober, and the probe contact elements (referred to as "probes") come into contact with bonding pads, solder balls, and / or gold bumps formed on the wafer die. Electrical connections enabling the transmission of power, ground, and test signals are achieved by applying controlled displacement of the probe tip against the bonding pads, solder balls, and / or gold bumps. Repeated scraping, deformation, and penetration of the probe tip against the bonding pads, solder balls, and / or gold bumps generate debris and contaminants. These debris and contaminants adhere to and accumulate on the probe contact surface, creating localized heat sources on the component surface, causing thermal damage, and affecting the results of the electrical performance testing process. The generated debris needs to be periodically removed from the contact components to prevent build-up. This build-up leads to increased contact resistance, continuity failures, and erroneous test indications, which in turn artificially lower yields and subsequently increased product costs. Summary of the Invention

[0004] To address the issues of low cleaning efficiency, low test accuracy, and high failure rate caused by the adhesion of debris and contaminants during signal transmission when the probe tip contacts the components on the die of the chip, this application provides a probe cleaning pad material containing silicone rubber. This material periodically polishes and cleans the probe, removing the debris and contaminants attached to the probe and lightly grinding the probe to enable it to be used for a long time, thereby improving the stability and reliability of test results.

[0005] In a first aspect, this application provides a silicone rubber-containing probe cleaning pad material, which adopts the following technical solution: a silicone rubber-containing probe cleaning pad material, characterized in that: it includes a base film, on which a cleaning pad layer is disposed, and on both the upper and lower surfaces of the base film, a viscoelastic layer is disposed; wherein, the cleaning pad layer includes several types of inverted pyramid-shaped recessed structures arranged in a matrix, and the Shore A hardness of the cleaning pad layer is 50-80.

[0006] Preferably, the viscoelastic layer is an acrylic pressure-sensitive adhesive; the base film is made of ABS material.

[0007] By adopting the above technical solution, viscoelastic layers are applied to the upper and lower surfaces of the bottom film, allowing the bottom surface of the bottom film to be coated with pressure-sensitive adhesive material. During use, the probe cleaning material can adhere to the needle cleaning platform, maintaining the stability of the cleaning process. The cleaning pad has multiple inverted pyramid-shaped recessed structures with specific geometric and dimensional characteristics. The inverted pyramid geometric and dimensional characteristics are selected to optimize the cleaning material, allowing the probe tip to enter the inverted pyramid-shaped recessed structure. The inclined grooves clean contaminants on the probe. The planar bottom of the grooves prevents excessive grinding of the probe, which could affect signal reception and transmission, as well as the long-term performance of the probe. The cleaning pad has a certain range of Shore hardness to effectively clean the contact area and surrounding support hardware, and to prevent deformation or damage to the inverted pyramid-shaped recessed structure. If the cleaning pad hardness is too low, the recessed structure will deform, failing to effectively remove residue from the probe, thus increasing the contact resistance during probe use and affecting the detection effect. If the cleaning pad hardness is too high, the probe will be over-cleaned and worn, reducing its lifespan.

[0008] The depth of the inverted pyramid-shaped recessed structure is 30-100μm, the thickness of the bottom of the structure is 150-200μm, and the width of the upper plane of the formed groove is 100-250μm.

[0009] The width ratio of the upper and lower grooves is (1.5-5):1.

[0010] The inverted pyramid-shaped recessed structure further restricts the probe's entry into the recessed structure, where the tip carrying debris and contaminants is scraped and ground away, preventing the probe from being exposed and avoiding damage caused by using a flat surface. The specific vertical width of the recess allows for a controlled inclination of the pyramid-shaped recess within a defined range, adapting to the probe's angle and ensuring it adheres closely to the recess for effective cleaning. The pyramid-shaped recessed structure has four inclined surfaces, improving probe cleaning efficiency, extending the cleaning plate's lifespan, and preventing damage to the probe from a single point of force during grinding. The bottom of the recessed structure has a certain thickness, providing cushioning with each downward pressure during probe cleaning, preventing probe wear and reducing scratches.

[0011] The cleaning pad layer comprises lignin-modified silicone rubber and abrasive microparticles.

[0012] The wear particles include one or more of silicon carbide, magnesium oxide, zirconium oxide, and diamond micropowder.

[0013] By utilizing lignin in the cleaning pad layer, a three-dimensional network biopolymer rich in aromatic rings, the thermal stability of the cleaning pad material is enhanced, thereby improving the hardness and toughness of the cleaning sheet material. Simultaneously, the structure includes various functional groups, exhibiting surface activity that effectively binds debris and contaminants. Furthermore, this application utilizes the hydroxyl groups in the lignin structure to form hydrogen bonds with the hydroxyl groups on the surface of silicon materials, thereby altering the properties of the silicone rubber. This not only imparts adhesive properties to the surface of the silicon material but also endows the silicone rubber with a certain degree of hardness and toughness, resulting in excellent wear resistance for the cleaning sheet material. Moreover, the abundant hydroxyl and other functional groups on the lignin surface of this application possess a certain ability to disperse inorganic powders, serving as a dispersant for abrasive particles, further enhancing the wear resistance of the cleaning sheet material and improving the overall mechanical properties of the material.

[0014] The preparation method of the lignin-modified silicone rubber is as follows: lignin sulfonate and calcium silicate are added to water and mixed and stirred for 20-60 min; hydrochloric acid is added to adjust the pH value to 5-6; the mixture is heated to 50-60℃ and stirred for 20-30 min to obtain lignin-modified calcium silicate; vinyl silicone rubber, lignin-modified calcium silicate, aluminum sulfate and hydroxyl silicone oil are mixed and stirred at 100-110℃ for 15-20 min to obtain lignin-modified silicone rubber.

[0015] The mass ratio of the lignin-modified calcium silicate to the vinyl silicone rubber is (1-1.3):1.

[0016] The mass ratio of the lignin-modified silicone rubber to the abrasive microparticles is 1:(0.8-1.2).

[0017] By employing lignin sulfonate, the abundant phenyl, carboxyl, and hydroxyl groups on its surface structure form ester groups and hydrogen bonds with the groups on the calcium silicate surface, resulting in better dispersion of calcium silicate powder in the system. This increases the abrasiveness of the silicone rubber. Furthermore, the three-dimensional structure of lignin itself increases the hardness, toughness, and thermal stability of the silicone rubber, significantly reducing the probability of increased contact resistance, continuous failures, and erroneous test indications caused by the residue generated during periodic cleaning of the probe. This reduces the wear rate of the probe as a consumable and lowers the cost of replacing probe cards. However, if the lignin-modified calcium silicate content is too low, the rubber will lack toughness, easily causing partial or complete deformation of the pyramid-like concave structure during pressure cleaning, affecting cleaning efficiency. Too many abrasive particles will result in poor dispersion and excessive surface abrasiveness, leading to over-cleaning of the probe under the same pressure, reducing its service life. Too few abrasive particles will result in poor cleaning effect, slower speed, and low efficiency, affecting the normal use of the probe.

[0018] In summary, this application has the following beneficial effects:

[0019] 1. By attaching viscoelastic layers to the top and bottom surfaces of the base film, the bottom surface of the base film is coated with pressure-sensitive adhesive material. During use, the probe cleaning material can adhere to the needle cleaning platform, maintaining the stability of the cleaning process. The cleaning pad has multiple inverted pyramid-shaped recessed structures with predetermined geometric and dimensional characteristics. The inverted pyramid geometric and dimensional characteristics are selected to optimize the cleaning material, allowing the probe tip to enter the inverted pyramid-shaped recessed structure. The inclined grooves clean contaminants on the probe. The planar bottom of the grooves prevents the probe from being over-ground, which could affect signal reception and transmission, as well as the long-term performance of the probe. The cleaning pad has a certain range of Shore hardness to effectively clean the contact area and surrounding probes, and to prevent deformation or damage to the inverted pyramid-shaped recessed structure. If the cleaning pad is too soft, the recessed structure will deform, failing to effectively clean and remove residues from the probe, thus increasing the contact resistance during probe use and affecting the detection effect. If the cleaning pad is too hard, the probe will be over-cleaned and worn, reducing its service life.

[0020] The composite resin-modified zinc-rich primer provides cathodic protection to steel by sacrificing zinc powder for rust prevention. The composite resin modification enhances chemical solvent resistance, corrosion resistance, and adhesion, resulting in a coating with excellent weather resistance and strong adhesion. The heat-insulating and anti-corrosion coating achieves high bonding strength between the composite resin emulsion and basalt flakes, forming a multi-layered, parallel, stacked barrier effect with excellent shielding performance. The flakes can form a staggered arrangement, making the penetration of corrosive media more circuitous, thus delaying the path and time of corrosion diffusion and intrusion into the metal surface, thereby improving the coating's anti-corrosion performance. Furthermore, the addition of nano-alumina dispersion significantly improves the film's density, anti-corrosion performance, and flame retardancy, enhances dispersibility and interfacial properties to prevent sedimentation, and ensures interfacial compatibility between the basalt flakes and the composite resin solution.

[0021] 2. By using lignin sulfonate, the abundant phenyl, carboxyl, and hydroxyl groups on its surface structure form ester groups and hydrogen bonds with the groups on the surface of calcium silicate, making the calcium silicate powder more dispersed in the system and increasing the abrasiveness of the silicone rubber. In addition, the three-dimensional structure of lignin itself increases the hardness, toughness, and thermal stability of the silicone rubber, which greatly avoids the probability of increased contact resistance, continuous failure, and erroneous test indications caused by the residue generated by periodically cleaning the probe. This reduces the wear rate of the probe as a consumable and reduces the cost of replacing probe cards. Attached Figure Description

[0022] Figure 1 This is a cross-sectional schematic diagram of a silicone rubber-containing probe cleaning sheet material according to Embodiment 1 of this application.

[0023] Figure 2 A partially enlarged schematic diagram of the cleaning probe for the cleaning pad in Embodiment 1 of this application.

[0024] Figure 3 This is a schematic diagram of the cleaning pad layer in Example 1.

[0025] Explanation of reference numerals in the attached diagram: 1. Base film; 2. Cleaning pad; 3. Viscoelastic layer; 4. Recessed structure; 5. Probe. Detailed Implementation

[0026] The present application will be further described in detail below with reference to the embodiments.

[0027] Some of the raw materials used in the preparation examples and embodiments: acrylic pressure-sensitive adhesive, model CF-74B; ABS, model HP-171; silicon carbide (30-60 mesh); lignin sulfonate purchased from Hubei Maidehao Biotechnology Co., Ltd.; calcium silicate, model number HY-W094349A; vinyl silicone rubber, model number MY GUM 110; alumina, model number ADS-50.

[0028] Unless otherwise specified, all raw materials used in the examples and comparative examples are commercially available products.

[0029] Preparation Example 1

[0030] Lignin-modified silicone rubber: Add 10g of lignin sulfonate and 60g of calcium silicate to 250g of water and stir for 60min. Add hydrochloric acid to adjust the pH to 5, heat to 50℃ and stir for 30min to obtain lignin-modified calcium silicate.

[0031] Take 80g of vinyl silicone rubber, 104g of lignin-modified calcium silicate, 8g of aluminum sulfate and 3g of hydroxyl silicone oil and mix them. Stir at 100℃ for 20min to obtain lignin-modified silicone rubber.

[0032] Preparation Example 2

[0033] Lignin-modified silicone rubber: Add 10g of lignin sulfonate and 60g of calcium silicate to 250g of water and stir for 60min. Add hydrochloric acid to adjust the pH to 5, heat to 50℃ and stir for 30min to obtain lignin-modified calcium silicate.

[0034] Mix 80g of vinyl silicone rubber, 88g of lignin-modified calcium silicate, 8g of aluminum sulfate and 3g of hydroxyl silicone oil, and stir at 100℃ for 20min to obtain lignin-modified silicone rubber.

[0035] Preparation Example 3

[0036] Lignin-modified silicone rubber: Add 10g of lignin sulfonate and 60g of calcium silicate to 250g of water and stir for 60min. Add hydrochloric acid to adjust the pH to 5, heat to 50℃ and stir for 30min to obtain lignin-modified calcium silicate.

[0037] Take 80g of vinyl silicone rubber, 72g of lignin-modified calcium silicate, 8g of aluminum sulfate and 3g of hydroxyl silicone oil, mix them and stir at 100℃ for 20min to obtain lignin-modified silicone rubber.

[0038] Preparation Example 4

[0039] Lignin-modified silicone rubber: Add 10g of lignin sulfonate and 60g of calcium silicate to 250g of water and stir for 60min. Add hydrochloric acid to adjust the pH to 5, heat to 50℃ and stir for 30min to obtain lignin-modified calcium silicate.

[0040] Take 80g of vinyl silicone rubber, 116g of lignin-modified calcium silicate, 8g of aluminum sulfate and 3g of hydroxyl silicone oil and mix them. Stir at 100℃ for 20min to obtain lignin-modified silicone rubber.

[0041] Preparation Example 5

[0042] Silicone rubber: Take 80g of vinyl silicone rubber, 116g of calcium silicate, 8g of aluminum sulfate and 3g of hydroxyl silicone oil and mix them. Stir at 100℃ for 20min to obtain silicone rubber.

[0043] Preparation Example 6

[0044] Lignin-modified silicone rubber: Add 10g of lignin sulfonate and 60g of alumina to 250g of water and stir for 60min. Add hydrochloric acid to adjust the pH to 5, heat to 50℃ and stir for 30min to obtain lignin-modified alumina.

[0045] Take 80g of vinyl silicone rubber, 104g of lignin-modified alumina, 8g of aluminum sulfate and 3g of hydroxyl silicone oil and mix them. Stir at 100℃ for 20min to obtain lignin-modified silicone rubber.

[0046] Example 1

[0047] Reference Figure 1 and Figure 3 A silicone rubber-containing probe cleaning pad material comprises the following components: a base film 1, a cleaning pad layer 2 disposed on the base film 1, and viscoelastic layers 3 disposed on both the upper and lower surfaces of the base film 1; wherein, the viscoelastic layer 3 is a 50 μm acrylic pressure-sensitive adhesive; the base film 1 is an ABS plastic material with a thickness of 100 μm, the cleaning pad layer 2 slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0048] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed. Then, chopped glass fibers were added and the mixture was kneaded until uniform and formed into sheets. The resulting rubber compound was hot-pressed at 10 MPa and 120°C using a mold with an inverted pyramid-shaped concave structure, as described above. Figure 2 A cleaning pad with an inverted pyramid-shaped concave structure was obtained. The Shore A hardness of the cleaning pad was 60. The depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper plane of the formed groove was 150 μm, and the width of the lower plane of the groove was 80 μm.

[0049] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0050] Example 2

[0051] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, a cleaning pad slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0052] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 60, the depth of the inverted pyramid-shaped concave structure was 80 μm, the thickness of the bottom of the structure was 180 μm, the width of the upper plane of the groove was 150 μm, and the width of the lower plane of the groove was 80 μm.

[0053] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0054] Example 3

[0055] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, a cleaning pad slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0056] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 60, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper plane of the groove was 150 μm, and the width of the lower plane of the groove was 20 μm.

[0057] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0058] Example 4

[0059] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, a cleaning pad slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0060] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 60, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper surface of the groove was 150 μm, and the width of the lower surface of the groove was 110 μm.

[0061] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0062] Example 5

[0063] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, a cleaning pad slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0064] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 60, the depth of the inverted pyramid-shaped concave structure was 20 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper plane of the groove was 150 μm, and the width of the lower plane of the groove was 80 μm.

[0065] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0066] Example 6

[0067] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, the cleaning pad slurry, 72 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0068] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 75, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper plane of the groove was 150 μm, and the width of the lower plane of the groove was 80 μm.

[0069] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0070] Example 7

[0071] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, the cleaning pad slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 2, and 1.2 kg of dicumyl peroxide;

[0072] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 2 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 60, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper surface of the groove was 150 μm, and the width of the lower surface of the groove was 80 μm.

[0073] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0074] Example 8

[0075] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, the cleaning pad slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 3, and 1.2 kg of dicumyl peroxide;

[0076] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 3 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 60, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper plane of the groove was 150 μm, and the width of the lower plane of the groove was 80 μm.

[0077] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0078] Example 9

[0079] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, the cleaning pad layer slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 4, and 1.2 kg of dicumyl peroxide;

[0080] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 4 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 60, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper plane of the groove was 150 μm, and the width of the lower plane of the groove was 80 μm.

[0081] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0082] Example 10

[0083] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm; the cleaning pad layer slurry; 52 kg of abrasive microparticles; 60 kg of lignin-modified silicone rubber prepared in Preparation Example 5; and 1.2 kg of dicumyl peroxide.

[0084] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 5 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 60, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper plane of the groove was 150 μm, and the width of the lower plane of the groove was 80 μm.

[0085] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0086] Example 11

[0087] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, a cleaning pad slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 6, and 1.2 kg of dicumyl peroxide;

[0088] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 6 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 60, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper plane of the formed groove was 150 μm, and the width of the lower plane of the groove was 80 μm.

[0089] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0090] Comparative Example 1

[0091] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, the cleaning pad layer slurry, 90 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0092] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 95, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper plane of the groove was 150 μm, and the width of the lower plane of the groove was 80 μm.

[0093] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0094] Comparative Example 2

[0095] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, a cleaning pad slurry, 42 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0096] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 50, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the bottom of the structure was 150 μm, the width of the upper plane of the groove was 150 μm, and the width of the lower plane of the groove was 80 μm.

[0097] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0098] Comparative Example 3

[0099] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, a cleaning pad slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0100] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad with an inverted pyramid-shaped concave structure. The Shore A hardness of the cleaning pad was 60, the depth of the inverted pyramid-shaped concave structure was 50 μm, the thickness of the cleaning pad slurry was 150 μm, and the width of the upper plane of the formed groove was 150 μm.

[0101] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0102] Comparative Example 4

[0103] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, a cleaning pad slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0104] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed. Then, short glass fibers were added and mixed evenly into sheets. The resulting rubber compound was hot-pressed at 10 MPa and 120°C through a mold with an inverted pyramid-shaped concave structure to obtain a cleaning pad. The Shore A hardness of the cleaning pad was 60 and the thickness of the cleaning pad was 150 μm.

[0105] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0106] Comparative Example 5

[0107] A silicone rubber-containing probe cleaning pad material comprises the following components: a base film, a cleaning pad layer disposed on the base film, and viscoelastic layers disposed on both the upper and lower surfaces of the base film; wherein the viscoelastic layer is a 50 μm acrylic pressure-sensitive adhesive; the base film is an ABS plastic material with a thickness of 100 μm, a cleaning pad slurry, 52 kg of abrasive microparticles, 60 kg of lignin-modified silicone rubber prepared in Preparation Example 1, and 1.2 kg of dicumyl peroxide;

[0108] (1) After stirring the abrasive particles and the lignin-modified silicone rubber prepared in Example 1 at 110°C for 10 min, dicumyl peroxide was added and mixed and stirred. Then, short glass fibers were added and mixed evenly into sheets. The obtained rubber compound was hot-pressed under a mold with a rectangular recessed structure at 10 MPa and 120°C to obtain a cleaning pad with a rectangular recessed structure. The Shore A hardness of the cleaning pad was 60, the depth of the rectangular recessed structure was 50 μm, the thickness of the bottom of the structure was 150 μm, and the width of the upper and lower planes of the formed groove was 150 μm.

[0109] (2) The slurry obtained in step (1) is coated on a bottom film with viscoelastic layers on both the upper and lower surfaces, and dried at 90°C to obtain a probe cleaning sheet material containing silicone rubber.

[0110] Performance testing

[0111] The performance of the silicone rubber probe cleaning pad material prepared in the examples and comparative examples was tested using the following method: the probe containing foreign matter and debris (failure rate exceeding 8% in 1000 signal transmission tests) was ground and cleaned, and the percentage reduction in probe length / probe diameter before and after grinding was tested.

[0112] Failure rate test: The failure rate of the above-ground probe in 1000 signal transmission tests;

[0113] At a temperature of 23℃ and a relative humidity of 60%, the initial surface resistivity R0 of the probe was measured using a surface resistivity meter. The probe was then ground using a probe cleaning pad containing silicone rubber. After 20,000 consecutive pressing cycles, the surface resistivity R1 of the probe was measured again, and the percentage decrease in surface resistivity between the two measurements was calculated.

[0114] Table 1 Performance Test Results

[0115]

[0116]

[0117] As shown in Table 1, the silicone rubber probe cleaning sheet material obtained in the above embodiments effectively cleans the probe tip from debris and contaminants generated during signal transmission by components on the die of the chip. This results in high cleaning efficiency, improved test accuracy, and reduced failure rate. Regular light grinding and cleaning of the probe removes the attached debris and contaminants, reduces resistivity, and enables long-term use, thereby improving the stability and reliability of test results.

[0118] Compared to Examples 1, 3-5, and Comparative Examples 3-5, when the probe tip carrying debris and contaminants enters the inverted pyramid-shaped recessed structure, the debris is removed through scraping and grinding, preventing the probe from being exposed and avoiding damage to the probe caused by using a flat surface. The groove width is proportional to the height of the recess, ensuring the inclination of the pyramid-shaped structure is within a certain range. The groove inclination angle adapts to the probe, allowing it to fit close to the groove and effectively clean it. The pyramid-shaped recessed structure has four inclined surfaces, improving probe cleaning efficiency and extending the service life of the cleaning pad. It also avoids damage to the probe due to single-force application during grinding. Furthermore, each press provides a buffer and a large contact area with the cleaning pad surface, effectively cleaning while preventing probe wear and reducing probe scratches.

[0119] Compared with Example 1 and Comparative Examples 1-2, the cleaning pad structure of this application has a certain range of Shore hardness so that the contact area and surrounding support hardware can be effectively cleaned, and the inverted pyramid-shaped concave structure can be prevented from deforming or being damaged. If the cleaning pad hardness is too low, the concave structure of the cleaning pad will deform and cannot effectively clean and remove the debris on the probe, thereby preventing the contact resistance of the probe from increasing during use and affecting the detection effect. If the cleaning pad hardness is too high, the length and diameter of the probe will be excessively cleaned and worn, reducing the service life of the probe.

[0120] Comparing Examples 1 and 7-11, lignin sulfonate, with its abundant phenyl, carboxyl, and hydroxyl groups on its surface, forms ester groups and hydrogen bonds with the groups on the calcium silicate surface, resulting in better dispersion of calcium silicate powder in the system. This increases the abrasiveness of the silicone rubber. The three-dimensional structure of lignin itself increases the hardness, toughness, and thermal stability of the silicone rubber, significantly reducing the probability of increased contact resistance, continuous failures, and erroneous test indications caused by the periodic cleaning of the probe to remove generated debris, thus reducing the wear rate of the probe as a consumable. However, if the lignin-modified calcium silicate content is too low, the rubber will lack toughness, easily causing partial or complete deformation of the pyramid-like concave structure during pressure cleaning, affecting the cleaning effect.

[0121] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made to the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A silicone rubber-containing probe pin cleaning sheet material, characterized by: The application relates to a cleaning pad, which comprises a bottom film (1), wherein a cleaning pad layer (2) is arranged on the bottom film (1), and viscoelastic layers (3) are arranged on the upper and lower bottom surfaces of the bottom film (1); wherein the cleaning pad layer (2) comprises a plurality of inverted-pyramid-shaped concave structures (4) arranged in a matrix, and the Shore A hardness of the cleaning pad layer (2) is 50-80; The cleaning pad layer (2) comprises lignin-modified silicon rubber and abrasive particles; The preparation method of the lignin-modified silicon rubber comprises the following steps: lignosulfonate and calcium silicate are added into water and mixed and stirred for 20-60 min, hydrochloric acid is added to adjust the pH value to 5-6, heating is performed to 50-60 DEG C and stirring is performed for 20-30 min to obtain lignin-modified calcium silicate; vinyl silicone rubber, lignin-modified calcium silicate, aluminum sulfate and hydroxyl silicone oil are mixed, and stirring is performed at 100-110 DEG C for 15-20 min to obtain lignin-modified silicon rubber. The mass ratio of the lignin-modified calcium silicate and the vinyl silicone rubber is (1-1.3):

1.

2. The silicone rubber-containing probe tip cleaning sheet material according to claim 1, characterized by: The depth of the inverted-pyramid-shaped concave structure (4) is 30-100 mu m, the thickness of the structure bottom is 150-200 mu m, and the width of the upper plane of the formed groove is 100-250 mu m.

3. The silicone rubber containing probe tip cleaning sheet material of claim 2, wherein: The width ratio of the upper and lower grooves is (1.5-5):

1.

4. The silicone rubber-containing probe tip cleaning sheet material according to claim 1, characterized by: The abrasive particles comprise one or more of silicon carbide, magnesium oxide, zirconium oxide and diamond micro powder.

5. The silicone rubber-containing probe tip cleaning sheet material according to claim 1, characterized by: The mass ratio of the lignin-modified silicon rubber and the abrasive particles is 1:(0.8-1.2).

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