Cooling system for an electrical enclosure

Abstract

An electrical enclosure (1) comprising a bottom wall (2), a top wall (3) and a plurality of side walls (4, 5, 6, 7), the bottom wall (2), the top wall (3) and the plurality of side walls (4, 5, 6, 7) defining an internal volume (8) of the enclosure (1). The electrical enclosure (1) further comprises a heat exchange device (10) which in turn comprises a first heat exchange assembly (11) located in the interior volume (8), where the first heat exchange assembly (11) comprises a first heat sink (110) and a first duct (12) having an inlet opening (121) and an outlet opening (122). The first heat sink (110) is fitted in the inlet opening (121) of the first duct (12), the first heat sink (110) is attached to one of the side walls (4, 5, 6, 7) in the upper half of the internal volume (8) of the housing (1), and the first duct (12) points downward, the outlet opening (122) of which is located in the lower half of the internal volume (8) of the housing (1).

Description

Technical Field

[0001] The present invention relates to an electrical enclosure provided with an innovative cooling system. More specifically, the present invention relates to an electrical enclosure, such as a control cabinet or electrical switchgear (more specifically gas-insulated switchgear), provided with an improved cooling system that includes radiators and ducts suitably positioned within the enclosure. Background Art

[0002] It is well known that electrical equipment and devices - such as switchgear, transformers, busbars, and the like - are typically housed within enclosures to ensure safety and, in the case of gas-insulated systems, to provide the required insulation.

[0003] One of the main problems involved in the design of electrical enclosures is the need to dissipate the heat generated by the equipment housed within the enclosure during operation.

[0004] In practice, for electrical enclosures (such as general switchgear systems), proper thermal management is always a major challenge because, during operation, power losses generate waste heat that must be controlled to achieve the required rated current. In other words, the system is thermally limited, which means that the current rating is limited by the temperature limits along the current path.

[0005] This is particularly challenging for gas-insulated switchgear systems because the current path is located within a sealed enclosure. This results in very high gas temperatures within the compartments. Therefore, reducing the gas temperature has great potential for improving the thermal situation because it directly translates into a reduction in conductor temperature.

[0006] Many attempts and proposals have been made to improve the cooling of electrical enclosures, particularly gas-insulated switchgear systems, in order to keep the temperature of the equipment within the enclosure at or below a desired threshold temperature.

[0007] However, the proposed solutions generally include passive or active cooling solutions that are not always entirely satisfactory in terms of efficiency, structural simplicity and compactness, and industrial cost and reliability / lifetime. Summary of the Invention

[0008] The main object of the present invention is to provide an electrical enclosure, particularly a control cabinet or electrical switchgear, more specifically gas-insulated switchgear, which allows overcoming or at least alleviating the drawbacks of the prior art.

[0009] In this context, an object of the present invention is to provide an electrical enclosure, particularly gas-insulated switchgear, provided with an efficient system for reducing the temperature inside the enclosure.

[0010] Another object of the present invention is to provide an electrical enclosure, in particular a gas-insulated switchgear, in which an effective circulation and movement of the gas inside the enclosure is maintained.

[0011] Another object of the present invention is to provide an electrical enclosure, in particular a gas-insulated switchgear, which is provided with a cooling system that is substantially of a passive type.

[0012] Another object of the present invention is to provide an electrical enclosure, in particular a gas-insulated switchgear, which allows reducing the thermal resistance between the enclosure walls and the surrounding air.

[0013] Another object of the present invention is to provide an electrical enclosure, in particular a gas-insulated switchgear, which has a relatively simple structure, is easy to manufacture at an industrial level and at low cost, and is easy to maintain and at low cost.

[0014] According to the present invention, the above-mentioned objects and purposes, as well as other purposes that will become apparent from the following description and the drawings, are achieved by means of the electrical enclosures according to claim 1 and the related dependent claims attached hereto.

[0015] In other aspects, the present invention also specifically relates to a gas-insulated switchgear as described herein.

[0016] In a general definition of the present invention, the electrical enclosures of the present disclosure include a bottom wall, a top wall, and a plurality of side walls that define an internal volume of the enclosure, and also include innovative and improved heat exchange means. In particular, the electrical enclosures of the present invention are characterized in that the heat exchange means includes a first heat exchange assembly positioned in the internal volume. This heat exchange assembly includes a first radiator and a first duct having an inlet opening and an outlet opening, and the first radiator is fitted in the inlet opening of the first duct. Further, in the electrical enclosures of the present invention, the first radiator is attached to one of the side walls in the upper half of the internal volume of the enclosure, and the first duct points downward, and its outlet opening is located in the lower half of the internal volume of the enclosure.

[0017] Thus, as will be better described below, in the electrical enclosures of the present invention, the design of the first heat exchange assembly, combined with the proper positioning of its more relevant components (i.e., the first radiator and the first duct), allows for an effective air movement inside the enclosure, thus greatly improving the cooling of the electrical equipment and components housed inside the enclosure.

[0018] For the purposes of the present invention, the terms "upper half" and "lower half" are intended to represent the geometric upper half and lower half of the internal volume when the enclosure is in the operating position.

[0019] Accordingly, the novel heat exchange device of the present invention is an efficient cooling system applicable to gas-insulated switchgear systems and, generally speaking, to any sealed enclosure with power losses inside, as it helps to reduce the temperature of the gas inside the enclosure and drives the gas circulation inside the system. The gas inside the system can be air at atmospheric or pressurized conditions, or any other gas or gas mixture commonly used in these applications.

[0020] In the following detailed description, the present invention will be described with reference to gas-insulated switchgear, but generally speaking, the present invention can be applied to any gas or air-filled enclosure with power losses inside and where heat needs to be removed therefrom.

[0021] In practice, in the heat exchange device of the present invention, the first pipe and the first radiator are combined to function as a chimney. Different from the conventional applications of such radiator / chimney combinations (conventional applications can be used, for example, to cool hot spots where the temperature of the radiator is higher than the surrounding gas), in the enclosures of the present disclosure, the radiator is attached to the inside of the enclosure wall, so the temperature is lower than the surrounding gas temperature. Therefore, the gas entering the first radiator is cooled when it comes into contact with the radiator, its density increases, and thus it moves downward through the downward-directed first pipe.

[0022] In fact, it has been found that the design and proper positioning of the first heat exchange assembly (based on the combination of the radiator / downward-directed pipe) bring two advantages, namely, reducing the average gas temperature inside the enclosure and causing gas flow in the internal volume of the enclosure due to the chimney effect, thereby further improving the cooling of the electrical equipment and components housed inside the enclosure.

[0023] At the same time, the design of the heat exchange device is relatively simple, so from a manufacturing perspective, the electrical enclosures of the present invention are relatively easy to obtain. In practice, in the simplest and more general implementation of the heat exchange device, the radiator is attached to the top region of one of the side walls of the enclosure and is at least partially surrounded by a pipe pointing downward and generating the chimney effect.

[0024] In addition, it is worth noting that the heat exchange device used in the enclosures of the present invention is completely passive, that is, the air circulation effect is autonomously and automatically generated by the structure of the components of the heat exchange assembly without the need for dedicated power-consuming devices such as forced air ventilation systems or similar systems.

[0025] Generally speaking, the first radiator is usually made of a heat-conducting material, usually aluminum, while the first pipe is usually made of a material with low heat conductivity, usually plastic. However, other materials can also be used according to requirements and the prior art.

[0026] Additionally, a structure for guiding the air flow within the first duct (e.g., a baffle, a flux deflector, or a similar flow direction control device) may be attached to the inlet and / or outlet openings of the first duct.

[0027] In some embodiments of the electrical enclosure according to the present invention, the first heat sink may be conveniently attached to the top portion of one of the side walls, i.e., in the top region of the interior volume of the enclosure where the gas temperature is relatively high.

[0028] Furthermore, simultaneously, the first heat sink - and thus the inlet opening of the first duct - may be conveniently positioned at a certain distance from the top wall of the enclosure, i.e., not too close to the top wall so as not to impede the inflow of gas into the first heat sink and the first duct.

[0029] In an embodiment of the electrical enclosure of the present disclosure, the outlet opening of the first duct may be conveniently positioned in the bottom region of the interior volume of the enclosure, i.e., the region where the gas temperature in the interior volume of the enclosure is relatively low, so as to maximize the chimney effect.

[0030] Similarly, in this case, the outlet opening of the first duct may be conveniently positioned at a certain distance from the bottom wall of the enclosure, i.e., not too close to the bottom wall so as not to impede the outflow of gas from the first duct.

[0031] For the purposes of the present invention, the terms "top" and "bottom" refer to the enclosure or its components when the electrical enclosure is in the operating position.

[0032] According to a general embodiment of the present invention, the first heat exchange assembly may preferably include a first thermal interface plate made of a thermally conductive material, which is located between the first heat sink and the side wall to which the first heat sink is attached, so as to improve the thermal contact and heat exchange between the first heat sink and the side wall of the electrical enclosure.

[0033] In a typical embodiment of the electrical enclosure of the present disclosure, the first heat sink may conveniently include a plurality of fins made of a thermally conductive material. These fins are conveniently exposed to the gas flowing from the interior volume of the enclosure into the first duct and may be positioned, for example, on the thermal interface plate so as to project perpendicularly from the thermal interface plate, which in turn is attached to the side wall of the electrical enclosure. Other arrangements of the fins, such as parallel to the thermal interface plate, are also possible.

[0034] According to a general embodiment of the electrical enclosure of the present invention, the inlet opening of the first duct is closely mounted around at least a portion of the first heat sink. For example, in the above-mentioned fin structure of the first heat sink, the gap between the last fin and the first duct wall and the gap between the fin tips and the first duct wall may be, for example, at most approximately the fin pitch.

[0035] Generally, the size and characteristics of the first heat sink - such as the arrangement structure, spacing, and thickness of the fins - can be optimized as needed and for given operating conditions (temperature, gas type, etc.).

[0036] In some embodiments of the electrical enclosure according to the present invention, the heat exchange device may conveniently include a second heat exchange component that is located outside the electrical enclosure and exchanges heat with a first heat exchange component located inside the electrical enclosure.

[0037] Compared to embodiments that only include heat exchange components located inside the electrical enclosure, implementing the second heat exchange component outside the electrical enclosure reduces the thermal resistance between the enclosure wall and the surrounding air, thereby improving the overall cooling efficiency of the system.

[0038] In practice, in an exemplary embodiment of such an arrangement structure of the heat exchange device used in the electrical enclosure of the present invention, the second heat exchange component may conveniently include a second heat sink and a second duct having an inlet opening and an outlet opening.

[0039] In this case, the second heat sink may advantageously be attached to the outer surface of the side wall to which the corresponding first heat sink is attached. In particular, the second heat sink may conveniently be attached at a position that matches the position of the first heat sink, where the inlet opening of the second duct closely fits around at least a portion of the second heat sink. Then, the second duct points upward and its outlet opening may be conveniently positioned, for example, at a height above the top wall of the electrical enclosure.

[0040] In other words, in these embodiments, and as better described in the following detailed description, the second heat exchange component uses the chimney effect in a manner opposite to that of the first heat exchange component because the second heat sink is hotter than the surrounding ambient air. Thus, the ambient air entering the second heat sink through the inlet opening of the second duct is heated and has a lower density relative to the surrounding air at a lower temperature, so the air flow in the second duct is directed upward towards the outlet opening of the second duct.

[0041] Similar to the embodiments described previously regarding the structure of the first heat exchange component, the second heat exchange component may also conveniently include a second thermal interface plate that is located between the second heat sink and the side wall to which the second heat sink is attached. In this way, the thermal resistance in the system can be further reduced.

[0042] In addition, like the first heat sink, the second heat sink may also advantageously include a plurality of fins made of a thermally conductive material.

[0043] In some embodiments of the electrical enclosure of the present invention, one of the side walls of the enclosure may be provided with an opening. In this case, the first and second radiators may be located on opposite sides of a common substrate, which is attached to the relevant side wall around the opening. In this way, the first radiator projects through the opening in the side wall into the internal volume of the enclosure, while the second radiator remains outside. The common substrate is located on the side wall so as to close the opening in an airtight manner. By such an embodiment, the thermal contact between the two sides is further improved.

[0044] According to the present disclosure, in still further embodiments of the electrical enclosure, a heat pipe-based system may be used to further ensure a low thermal resistance between the two sides of the enclosure.

[0045] Specifically, in this case, the first and / or second heat exchange assemblies may include a plurality of heat pipes, which may be appropriately arranged according to requirements and the design of the first and second heat exchange assemblies. Exemplary embodiments of possible arrangements will be given in the following detailed description.

[0046] The shapes of the first and second pipes may be simple, such as straight rectangles, but generally they may also be more complex, depending on the operating requirements.

[0047] For example, in some embodiments of the electrical enclosure of the present disclosure, the first pipe of the first heat exchange assembly may be at least partially positioned at a distance from the side wall to which the first radiator is attached, so as to maximize the heat transfer area between the gas and the enclosure wall. In this case, the first pipe may be shaped in such a way that a gap is left between the first pipe and the side wall of the enclosure for a part of the height of the first pipe or for the entire height of the first pipe.

[0048] In still further embodiments of the electrical enclosure of the present disclosure, the outlet openings of the first and / or second pipes may have a narrower cross-section relative to the corresponding inlet openings. This solution is very useful in cases where the radiator and / or the pipes are relatively wide, to prevent the surrounding gas / air from flowing in through the outlet openings. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Further features and advantages of the present invention will become more apparent from the description of the preferred but non-exclusive embodiments of the present invention, shown by way of example in the drawings, in which:

[0050] - Figure 1 is a transparent perspective view of a first embodiment of an electrical enclosure according to the present invention;

[0051] - Figure 2 is Figure 1 a partial cross-sectional view of the first embodiment of the electrical enclosure shown in , showing details of the heat exchange assembly including the radiator used in this embodiment;

[0052] - Figure 3 is Figure 1 a transparent perspective view of a first embodiment of the electrical enclosure shown in

[0053] - Figure 4 a transparent perspective view of a second embodiment of the electrical enclosure according to the present invention;

[0054] - Figure 5 is Figure 4 a partial cross-sectional view of a second embodiment of the electrical enclosure shown in

[0055] - Figure 6 is Figure 4 a side view of a second embodiment of the electrical enclosure shown in

[0056] - Figure 7 is Figure 4 a side view of a second embodiment of the electrical enclosure shown in

[0057] - Figure 8 a transparent perspective view of a third embodiment of the electrical enclosure according to the present invention;

[0058] - Figure 9 is Figure 8 a partial cross-sectional view of a third embodiment of the electrical enclosure shown in

[0059] - Figure 10 a perspective view of first and second radiators used in a fourth embodiment of the electrical enclosure according to the present invention;

[0060] - Figure 11 a partial cross-sectional view of a fourth embodiment of the electrical enclosure according to the present invention, showing details of a heat exchange assembly including Figure 10 the radiator shown in

[0061] - Figure 12 a side view of a fifth embodiment of the electrical enclosure according to the present invention. DETAILED DESCRIPTION

[0062] Referring to the accompanying drawings, the present invention (as Figure 1 and 3 shown, in its more general definition) relates to an electrical enclosure 1 that includes a bottom wall 2, a top wall 3, and a plurality of side walls 4, 5, 6, 7 that define an internal volume 8 of the enclosure 1, in which a plurality of electrical devices and equipment (not shown) can be housed.

[0063] Typically, the geometry of the housing is square to allow for the combination of different units to form a switchboard. Additionally, for certain applications, such as in gas-insulated switchgear, various walls 2, 3, 4, 5, 6, 7 form an airtight housing in which a large number of various electrical components are housed in a normally pressurized atmosphere of an insulating gas or gas mixture.

[0064] The electrical housing 1 of the present invention further includes a heat exchange device 10, the purpose of which is to remove the heat generated (usually due to power losses) in the internal volume 8 of the housing 1, as described in the introductory part of the specification. One of the unique features of the housing 1 of the present invention is attributed to the characteristics of the heat exchange device 10, particularly the design and positioning.

[0065] Specifically, the heat exchange device 10 includes a first heat exchange assembly 11 located in the internal volume 8. As shown in the drawings, the first heat exchange assembly 11 includes a first radiator 110 and a first duct 12, the first duct 12 being provided with an inlet opening 121 and an outlet opening 122. In the illustrated embodiment, the first duct 12 can in practice be a channel made of plastic material, which is open towards the top 121 and the bottom 122 and is airtight on the sides.

[0066] The first radiator 110 is fitted in a tight manner in the inlet opening 121 of the first duct 12 and is attached to one of the side walls 4, 5, 6, 7 of the housing 1 (the rear wall 4 in the figure). In the embodiment shown in the figure, the first radiator 110 is attached to the rear wall 4 in the upper half of the internal volume 8 of the housing 1, and the first duct 12 points downwards such that its outlet opening 122 is located in the lower half of the internal volume 8 of the housing 1.

[0067] Thus, as previously described and with particular reference to Figure 3 , the gas circulation within the housing 1 is generated by the gas entering the first radiator 110 through the inlet opening 121 as indicated by the arrow 300 in Figure 3 . Since the gas cools when it comes into contact with the first radiator 110 (which is at a lower temperature), its density increases, and thus the gas moves downwards through the first duct 12 and is discharged from the duct 12 through the outlet opening 122, as indicated by the arrow 400.

[0068] In practice, the gas circulation within the housing 1 is generated by the cooling of the gas itself as it enters the first radiator 110, and as previously described, this gas circulation helps to further remove the heat of the electrical components and devices housed in the internal volume 8 of the housing 1.

[0069] Referring to the accompanying drawings, the first heat sink 110 is attached to the top portion of one of the side walls 4, 5, 6, 7 (e.g., the rear wall 4), but not too close to the top wall 3, i.e., maintaining a certain distance from the top wall 3 to avoid obstructing the inflow of gas through the inlet opening 121 into the first duct 12.

[0070] Similarly, the outlet opening 122 of the first duct 12 is located at the bottom portion of the internal volume 8 of the housing 1, not too close to the bottom wall 2 so as not to impede the free outflow of gas from the first duct 12 through the outlet opening 122.

[0071] Referring Figure 2 , in an exemplary embodiment of the present invention, the first heat exchange assembly 11 includes a first thermal interface plate 13 made of a thermally conductive material, and the first thermal interface plate 13 is located between the first heat sink 110 and the side walls 4, 5, 6, 7 (e.g., the rear wall 4 to which the first heat sink 110 is attached) to improve the thermal contact and heat exchange between the first heat sink 110 and the side wall 4 of the electrical housing 1.

[0072] Continuing to refer Figure 2 , in the illustrated embodiment, the first heat sink 110 includes a plurality of fins 14 made of a thermally conductive material (such as aluminum). As Figure 3 shown, the fins 14 are exposed to the gas flowing into the first duct 12 through the inlet opening 121 and are located on the thermal interface plate 13, and the thermal interface plate 13 is in turn attached to the side wall 4 of the electrical housing 1. In this way, the heat transfer from the relatively hot gas to the relatively cold external environment can be greatly enhanced. In Figure 2 the embodiment, the fins 14 project perpendicularly from the thermal interface plate 13. Depending on the needs and the design of the heat sink, the fins 14 can also be arranged in other ways, for example, parallel to the thermal interface plate 13.

[0073] Generally speaking, the inlet opening 121 of the first duct 12 closely fits around a part of the first heat sink 110. In practice, as Figure 2 shown, the distance between the wall of the first duct 12 and the side fins 14 and the tips of the fins 14 is minimized, and generally less than the pitch of the fins 14 located on the thermal interface plate 13.

[0074] Specifically referring Figures 4 to 7 , in the embodiment of the electrical housing 1 of the present invention, the heat exchange device 10 includes a second heat exchange assembly 21, and the second heat exchange assembly 21 is located outside the electrical housing 1 and exchanges heat with the first heat exchange assembly 11.

[0075] In particular, the second heat exchange component 21 includes a second radiator 210 and a second duct 22, and the second duct 22 is provided with an inlet opening 221 and an outlet opening 222. In practice, the second duct 22 may be a channel made of plastic material, which is open at both ends towards the inlet 221 and the outlet 222 and is airtight on the sides.

[0076] The second radiator 210 is attached to the outer surface of the side wall 4, 5, 6, 7 (for example, the rear wall 4 in the embodiment shown in the figure) to which the first radiator 110 is attached at a position matching the position of the first radiator 110 on the inner surface of, for example, the rear wall 4.

[0077] The inlet opening 221 of the second duct 22 fits tightly around at least a part of the second radiator 210. Then, the second duct 22 points upward and in the illustrated embodiment its outlet opening 222 is located above the housing 1, that is, at a height above the top wall 3 of the electrical housing 1.

[0078] As Figure 7 shown, in this embodiment, the second heat exchange component 21 utilizes the chimney effect in an opposite manner to the first heat exchange component 11 because the second radiator 210 is hotter than the surrounding ambient air. Therefore, the ambient air enters the second radiator 210 through the inlet opening 221 of the second duct 22, as shown by the arrow 500.

[0079] The air is heated in the second radiator 210 and has a lower density relative to the cooler surrounding air. Therefore, the air flow in the second duct 22 is directed upward towards the outlet opening 222 of the second duct 22 and flows out through the outlet opening 222, as shown by the arrow 600.

[0080] In practice, as Figure 7 clearly shown, the first radiator 110 and the second radiator 210 operate in opposite ways. The former is cooler than the surrounding air (inside the housing 1) and generates an air flow directed downward (as shown by the arrows 300 and 400), while the latter is hotter than the surrounding air (outside the housing 1) and generates an air flow directed upward (as shown by the arrows 500 and 600).

[0081] Referring Figure 5 , in yet another exemplary embodiment of the present invention, the second heat exchange component 21 includes a second thermal interface plate 131, and the second thermal interface plate 131 is located between the second radiator 210 and the side walls 4, 5, 6, 7 (for example, the rear wall 4 to which the second radiator 210 is attached).

[0082] In practice, as Figure 5 shown, the thermal interface plates 13 and 131 are located on both sides of, for example, the rear wall 4 of the housing, thus further reducing the thermal resistance in the system.

[0083] In this case, like the first radiator 110, the second radiator 210 also includes a plurality of fins 14 made of a thermally conductive material (such as aluminum). The fins 14 of the second radiator 210 are located on the thermal interface plate 131, and the thermal interface plate 131 exchanges heat with the first radiator 110 and receives heat therefrom. Then, the fins 14 of the second radiator 210 are exposed to the gas flowing into the second duct 22 through the inlet opening 221, thereby transferring heat to the relatively cooler external ambient air.

[0084] In Figure 5 the embodiment of, the fins 14 on both the first radiator 110 and the second radiator 210 project perpendicularly from their respective thermal interface plates 13 and 131. Other arrangements of the fins 14, for example, parallel to the thermal interface plates 13 and 131, are also possible, depending on the requirements and the design of the radiator.

[0085] Reference Figures 8 - 11 , in the embodiment of the electrical enclosure 1 of the present invention, one of the side walls 4, 5, 6, 7 of the enclosure 1 (for example, the rear wall 4) is provided with an opening. Specifically referring to Figure 9 , in such an embodiment, the first radiator 110 and the second radiator 210 are located on opposite sides of a common substrate 140, and the common substrate 140 is attached to the relevant side wall (such as the rear wall 4) around the opening.

[0086] Then, the first radiator 110 projects into the internal volume 8 of the enclosure 1 through the opening in the side wall (for example, the rear wall 4), while the second radiator 210 remains outside. The common substrate 140 is located on the side wall (for example, the rear wall 4) so as to close the opening in an airtight manner. As described above, through this embodiment, the thermal contact between the interior 8 and the exterior side of the enclosure 1 is further improved.

[0087] Reference Figure 9 , also in this case, the first radiator 110 and the second radiator 210 include a plurality of fins 14 made of a thermally conductive material (such as aluminum). The fins 14 of both the first radiator 110 and the second radiator 210 are located on opposite sides of the common substrate 140. In Figure 9 the embodiment of, the fins 14 on both the first radiator 110 and the second radiator 210 project perpendicularly from the common substrate 140.

[0088] The fins 14 of the first radiator 110 are exposed to the gas flowing into the first duct 12 through the inlet opening 121, and transfer heat to the fins 14 of the second radiator 210 through the common substrate 140. In turn, the fins 14 of the second radiator 210 are exposed to the ambient air flowing into the second duct 22 through the inlet opening 221, thereby transferring heat to the relatively cooler external ambient air.

[0089] Reference Figure 10 and 11 In a specific embodiment of the present invention, the first heat exchange component 11 and / or the second heat exchange component 21 includes a plurality of heat pipes 50. In the illustrated embodiment, both the first heat exchange component 11 and the second heat exchange component 21 are provided with heat pipes 50 to ensure low thermal resistance between the two sides.

[0090] Specifically, in this embodiment, the first heat sink 110 and the second heat sink 210 include a plurality of fins 141. The fins 141 are made of a heat-conducting material (such as aluminum) and are positioned parallel to a common substrate 140. Then, the heat pipes 50 are positioned transversely with respect to the plurality of fins 141 and pass through the first heat sink 110, the second heat sink 210, and the common substrate 140 interposed therebetween. Other arrangements of the fins 141 and the heat pipes 50 are also possible, depending on the requirements and design of the heat exchange device 10.

[0091] The first pipe 12 of the first heat exchange component 11 and the second pipe 22 of the second heat exchange component 21 may have different shapes and sizes according to the operating requirements. Moreover, their positioning with respect to the housing 1 may also vary according to the requirements and convenience.

[0092] For example, the first pipe 12 of the first heat exchange component 11 may be substantially positioned to be attached to a side wall. For example, the rear wall 4 to which the first heat sink 110 is attached, as Figure 1 , 3 shown in FIGS. 4 and 6 - 8.

[0093] Alternatively, as Figure 12 shown, in some embodiments of the present invention, the first pipe 12 is at least partially positioned at a certain distance from the side walls 4, 5, 6, 7 (for example, the rear wall 4 to which the first heat sink 110 is attached). In this way, the heat transfer area between the gas in the internal volume 8 of the housing 1 and the walls 4, 5, 6, 7 of the housing 1 can be maximized.

[0094] For example, as Figure 12 shown, the bottom portion of the first pipe 12 has a narrower cross-section relative to the top portion, so as to create a gap between its wall and the rear wall 4 of the housing 1 for the reasons described above.

[0095] In addition, in Figure 12 the embodiment, due to the difference in cross-sectional area between the top portion and the bottom portion of the first pipe 12, the outlet opening 122 of the first pipe 12 has a narrower cross-section relative to the corresponding inlet opening 121.

[0096] More generally, this solution is helpful in cases where the radiator and / or the pipes are relatively wide, so that it is necessary to reduce the cross-section of the pipe outlet opening to prevent the surrounding gas / air from flowing into the outlet opening.

[0097] As can be seen from the experiments conducted on the electrical enclosure as described above, the electrical enclosure of the present disclosure can combine the effective reduction of the gas temperature inside the enclosure with the generation of an air flow in the internal volume of the enclosure, which further improves the cooling of the electrical equipment and components housed inside the enclosure.

[0098] The system of the present invention is particularly effective in gas-insulated enclosures, so that gas-insulated switchgear is a specific target of the present invention.

[0099] From a manufacturing perspective, the electrical enclosure of the present disclosure is very easy to manufacture, thus having an advantage in terms of cost.

[0100] Therefore, it can be clearly seen from the above that the electrical enclosure of the present disclosure fully meets the intended objectives and purposes. The shape, material, and dimensions depending on the circumstances can be arbitrary as needed, and any changes in this regard should be considered as part of the present invention.

Claims

1. An electrical enclosure (1), comprising a bottom wall (2), a top wall (3) and a plurality of side walls (4, 5, 6, 7), wherein the bottom wall (2), the top wall (3) and the plurality of side walls (4, 5, 6, 7) define an internal volume (8) of the enclosure (1), and the electrical enclosure further comprises a heat exchange device (10), characterized in that: The heat exchange device (10) comprises a first heat exchange component (11) located in the internal volume (8), wherein the first heat exchange component (11) comprises a first radiator (110) and a first pipe (12) having an inlet opening (121) and an outlet opening (122), wherein the first radiator (110) is fitted in the inlet opening (121) of the first pipe (12), and wherein the first radiator (110) is attached to one of the side walls (4, 5, 6, 7) in the upper half of the internal volume (8) of the housing (1), and the first pipe (12) points downwards, and its outlet opening (122) is located in the lower half of the internal volume (8) of the housing (1).

2. The electrical enclosure (1) according to claim 1, wherein: The first heat sink (110) is attached to the top of one of the side walls (4, 5, 6, 7) at a certain distance from the top wall (3).

3. The electrical enclosure (1) according to claim 1 or 2, wherein: The outlet opening (122) of the first duct (12) is located at the bottom of the inner volume (8) of the housing (1) at a distance from the bottom wall (2).

4. Electrical enclosure (1) according to one or more of the preceding claims, wherein: The first heat exchange assembly (11) includes a first thermal interface plate (13) located between the first heat sink (110) and a side wall (4, 5, 6, 7) to which the first heat sink (110) is attached.

5. Electrical enclosure (1) according to one or more of the preceding claims, wherein: The first heat sink (110) comprises a plurality of fins (14, 141) made of a thermally conductive material.

6. Electrical enclosure (1) according to one or more of the preceding claims, wherein: The inlet opening (121) of the first duct (12) fits tightly around at least a portion of the first radiator (110).

7. Electrical housing (1) according to one or more of the preceding claims, characterized in that The heat exchange device (10) comprises a second heat exchange component (21), wherein the second heat exchange component (21) is located outside the electrical housing (1) and performs heat exchange with the first heat exchange component (11).

8. The electrical enclosure (1) according to claim 7, wherein: The second heat exchange assembly (21) comprises a second radiator (210) and a second pipe (22) having an inlet opening (221) and an outlet opening (222).

9. The electrical enclosure (1) according to claim 8, wherein: The second radiator (210) is attached to the outer surface of the side wall (4, 5, 6, 7) to which the first radiator (110) is attached at a position matching the position of the first radiator (110), and wherein the second pipe (22) is directed upward.

10. The electrical enclosure (1) according to claim 7 or 8, wherein: The second heat exchange assembly (21) comprises a second thermal interface plate (131) located between the second heat sink (210) and a side wall (4, 5, 6, 7) to which the second heat sink (210) is attached, and wherein the second heat sink (210) comprises a plurality of fins (14, 141) made of a thermally conductive material.

11. The electrical enclosure (1) according to one or more of claims 8-10, wherein: One of the side walls (4, 5, 6, 7) of the housing (1) is provided with an opening, wherein the first heat sink (110) and the second heat sink (210) are located on opposite sides of a common substrate (140), and wherein the common substrate (140) is attached to the relevant side wall (4, 5, 6, 7) around the opening and closes the opening in an airtight manner.

12. Electrical enclosure (1) according to one or more of the preceding claims, wherein: The first heat exchange component (11) and / or the second heat exchange component (21) comprises a plurality of heat pipes (50).

13. Electrical enclosure (1) according to one or more of the preceding claims, wherein: The first duct (12) is at least partially positioned at a distance from a side wall (4, 5, 6, 7) to which the first radiator (110) is attached.

14. Electrical enclosure (1) according to one or more of the preceding claims, wherein: The outlet opening (122, 222) of the first duct (12) and / or the second duct (22) has a narrower cross section than the corresponding inlet opening (121, 221).

15. Electrical enclosure (1) according to one or more of the preceding claims, characterized in that It is a gas insulated switchgear.

Images