Etching device of PCB (Printed Circuit Board)

Abstract

The invention relates to the technical field of PCB (printed circuit board) processing, and discloses a PCB etching device which comprises a frame plate, a shielding cover is fixed in the middle of the top of the frame plate, and an etching liquid box is mounted above the top of the shielding cover; the continuous board supply unit is installed on one side of the frame board and used for automatically guiding the multiple sets of PCBs to the position below the etching liquid box, and the top of the continuous board supply unit is provided with a material storage unit used for storing the multiple sets of PCBs; the side, away from the continuous board supply unit, of the frame board is provided with a discharging and drying unit for discharging the PCBs. According to the invention, when the continuous board supply unit moves forwards, the material rotating unit is driven to rotate, so that etching liquid washed on the PCBs can automatically fall down and be removed, and the material storage unit can automatically supply the PCBs and sequentially reciprocate, so that the etching efficiency of the PCBs is improved when the number of the PCBs is large, and the production efficiency of the PCBs is improved. And the PCB circuit board does not interfere with each other during etching.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB circuit board processing, and specifically to an etching device for a PCB circuit board. Background Art

[0002] A PCB circuit board is a printed circuit board, also known as a printed wiring board. It is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Since it is made by electronic printing technology, it is called a "printed" circuit board. During the processing of a PCB circuit board, the circuit diagram on the circuit board is often processed by etching.

[0003] During the etching process of a PCB board, a circuit protection film that is not corroded by acidic and alkaline etching solutions is covered on the outer surface of the PCB board. Then, the copper coating on the unprotected part is removed through the etching process, and then the protection film adhered to the outer surface of the PCB board is removed through the film stripping process, so as to obtain a PCB board that is the same as the circuit design. For example, a Chinese patent application with the publication number CN117355043A discloses an etching processing device for a PCB circuit board, including a printing etching tank, a circuit board conveying table, and a printed circuit board. A lifting and closing mechanism is arranged on the top of the printing etching tank, and an etching control mechanism is arranged on the top of the printing etching tank; when etching the printed circuit board, the complete etching time is obtained by the time when a detection copper coating sheet with the same copper coating thickness as the circuit boards in the same batch is completely etched, and an etching completed signal is sent to the electric lifting rod based on this, and the printed circuit board is lifted upward to not contact the etching solution, ending the etching process, so as to accurately control the etching time and improve the qualified rate of the PCB circuit board after etching; During the etching process of the circuit boards by the equipment in the above solution, a batch processing method is adopted, that is, multiple circuit boards are placed inside the etching tank at the same time, which is to improve production efficiency and processing speed. After these circuit boards are placed in the etching tank, a specific etching solution is used to etch them. However, since multiple circuit boards are overlapped and placed in the etching tank, the parts covered or overlapped by other circuit boards will not be able to contact the etching solution, so these parts of the circuit boards will not be etched. This phenomenon will have a negative impact on the overall etching processing quality of the circuit boards, because the circuit patterns of the overlapped parts cannot be correctly etched, which may cause the electrical performance of the circuit boards not to meet the design requirements, and further affect the performance and reliability of the final product. Summary of the Invention

[0004] The purpose of the present invention is to provide an etching device for a PCB circuit board to solve the problems raised in the above background art.

[0005] To achieve the above object, the present invention provides the following technical solution: An etching device for a PCB circuit board, including a frame plate, a shielding cover is fixed at the middle position on the top of the frame plate, and an etching solution tank is installed above the top of the shielding cover; further including: a continuous feeding unit installed on one side of the frame plate, the continuous feeding unit is used to automatically guide multiple groups of PCB circuit boards below the etching solution tank, a stock storage unit for storing multiple groups of PCB circuit boards is provided at the top of the continuous feeding unit, and a discharging and drying unit for discharging the PCB circuit boards is provided on the side of the frame plate away from the continuous feeding unit; a material transfer unit rotatably connected inside the shielding cover, the material transfer unit is used to adjust the direction of the etched PCB circuit boards; a spraying unit installed outside the etching solution tank, the spraying unit is used to automatically spray the etching solution to perform spraying and etching treatment on the PCB circuit boards.

[0006] Preferably, the continuous feeding unit includes a driving motor, a ball screw, a moving seat, a Z-shaped plate and a vacuum suction cup group. The driving motor is installed on the frame plate. The ball screw is fixedly connected to the output end of the ball screw through a coupling. Both sides of the ball screw are connected to the frame plate through bearing seats. The moving seat is threadedly connected to the ball screw through a ball nut. The vacuum suction cup group is fixedly connected to the top of the moving seat through the Z-shaped plate. The vacuum suction cup group is located below the stock storage unit. A first connecting frame is fixed to one side of the moving seat. A slider is fixed to the bottom of the first connecting frame. A guide rail adapted to the slider is fixed on the frame plate. A synchronization unit is fixed to the end of the first connecting frame away from the moving seat.

[0007] Preferably, the stock storage unit includes storage baffles, L-shaped plates and partition plates. Two storage baffles are symmetrically provided. The partition plates are evenly fixed inside the storage baffles. Both ends of the space enclosed by the two storage baffles are not closed. The top of the partition plates is used to place and store PCB circuit boards. L-shaped plates are fixed to both ends of the storage baffles. A sliding rod is slidably sleeved on the L-shaped plates. A lifting screw is threadedly connected to one of the L-shaped plates. The bottom end of the sliding rod is fixed with a support plate. The support plate is fixed to the frame plate. The lifting screw is rotatably connected to the support plate through a bearing. A first one-way gear is also sleeved at the bottom of the lifting screw.

[0008] Preferably, the synchronization unit includes a first rack, a second connecting frame, a second rack, a third connecting frame and a third rack. The first rack is fixedly connected to the second rack through the second connecting frame. The bottom ends of the first connecting frame and the third connecting frame are fixed. The third connecting frame is fixed to one side of the second rack. The third rack is fixed to the top of the third connecting frame.

[0009] Preferably, the material transfer unit includes a material transfer gear ring, a first transmission gear, a first transmission rod, a driving bevel gear, a driven bevel gear, a second one-way gear and a transmission gear ring. The material transfer gear ring is rotatably connected to the inner wall of the shielding cover through a slewing bearing, and there are two material transfer gear rings distributed coaxially. The two material transfer gear rings are fixedly connected by a fixing rod. Holding frames are fixed at both the upper and lower ends of the material transfer gear ring. The first transmission gear is meshed with the material transfer gear ring. The first transmission rod is fixedly sleeved with the first transmission gear. The first transmission rod is rotatably connected to the shielding cover through a bearing. One end of the first transmission rod extending outside the shielding cover is fixedly sleeved with the driven bevel gear. The driving bevel gear is meshed with the driven bevel gear. A rotating shaft is fixedly sleeved in the middle of the driven bevel gear. The second one-way gear is fixedly sleeved with the rotating shaft. The bottom of the rotating shaft is rotatably connected to the frame plate through a bearing. The transmission gear ring is rotatably connected to the frame plate. The second one-way gear is meshed with the transmission gear ring.

[0010] Preferably, the spraying unit includes a spraying pipe, a spray head, a connecting pipe, a liquid outlet pipe and a metering component. A plurality of spraying pipes are arranged in an array at the bottom of the etching solution tank. A plurality of spray heads are distributed at the bottom of each of the plurality of spraying pipes. One ends of the plurality of spraying pipes are connected through the connecting pipe. The connecting pipe is communicated with a liquid outlet pipe on the side away from the spraying pipe. The metering component is installed on the outer side of the etching solution tank.

[0011] Preferably, the metering component includes a sealing shell, a piston plate, a piston rod, a groove plate and a transmission member. The sealing shell is fixed on the outer wall of the etching solution tank. The piston plate is slidably connected in the sealing shell. The piston rod is fixed to one side of the piston plate. One end of the piston rod away from the piston plate slidably penetrates one end of the sealing shell and is fixedly connected to the middle of one side of the groove plate. The output end of the transmission member is slidably connected to the groove plate. The end of the sealing shell away from the groove plate is connected with a liquid inlet pipe through a one-way valve. One end of the liquid inlet pipe away from the sealing shell is communicated with the inside of the etching solution tank. The liquid outlet pipe is also connected to the sealing shell through a one-way valve.

[0012] Preferably, the transmission member includes a second transmission gear, a third one-way gear, a driving pulley, a driven pulley, a synchronous belt, and a second transmission rod. The middle shaft of the second transmission gear is installed on the sealing shell through a bearing seat. The third one-way gear is meshed and connected with the second transmission gear. The third one-way gear and the driving pulley are coaxially connected, and the middle shaft of the driving pulley is rotatably connected to the outer wall of the sealing shell through a bearing. The driven pulley and the driving pulley are connected by the synchronous belt for transmission. The driven pulley is fixedly sleeved with the second transmission rod. A rotating plate is fixed at one end of the second transmission rod away from the driven pulley. One end of the rotating plate away from the second transmission rod is slidably connected to the groove plate through a sliding pin. The middle part of the second transmission rod is rotatably connected with a limiting plate through a bearing, and one end of the limiting plate is fixedly connected to the sealing shell.

[0013] Preferably, the blanking and drying unit includes a blanking channel, a drum, a blower, and a storage bin. The upper end of the blanking channel is fixed on one side of the shielding cover and corresponds to the upper side of the material transfer unit. The drums are evenly distributed at the bottom of the blanking channel. The blower is installed on the upper side of the blanking channel and blows and dries the PCB boards passing through the blanking channel. A through groove is opened at a position near the bottom on the lower side of the blanking channel. The storage bin is arranged on the shelf board and corresponds to the position of the through groove.

[0014] Preferably, a reflux hopper is fixed at the bottom of the shelf board. The bottom of the reflux hopper is communicated with a liquid storage tank. A liquid suction pipe is connected between the liquid storage tank and the etching solution tank. One end of the liquid suction pipe extending into the liquid storage tank is connected with a booster submersible pump.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: By improving the existing etching device, when the continuous board feeding unit moves forward, it drives the material transfer unit to rotate, so that the two PCB boards on the material transfer unit can automatically exchange positions. The etched PCB boards can be placed downward, which is conducive to the automatic downward dropping and removal of the etching solution washed on the PCB boards. And the material storage unit can automatically supply the PCB boards. Repeating this process in turn improves the etching efficiency of the PCB boards when there are a large number of PCB boards, and the PCB boards will not interfere with each other during etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a schematic diagram of the structure of the continuous board feeding unit of the present invention; Figure 3 is a schematic diagram of the structure of the material storage unit of the present invention; Figure 4 Structural schematic diagram of the synchronization unit of the present invention; Figure 5 Structural schematic diagram of the material transfer unit of the present invention; Figure 6 Structural schematic diagram of the spraying unit of the present invention; Figure 7 Structural schematic diagram of the metering component of the present invention; Figure 8 Structural schematic diagram of the transmission part of the present invention; Figure 9 Structural schematic diagram of the blanking and drying unit of the present invention; Figure 10 Rear view of the present invention.

[0017] In the figure: 1, frame plate; 101, shielding cover; 102, etching solution tank; 103, reflux hopper; 104, liquid storage tank; 105, liquid suction pipe; 2, continuous plate supply unit; 201, drive motor; 202, ball screw; 203, moving seat; 204, Z-shaped plate; 205, vacuum suction cup group; 206, first connecting frame; 207, slider; 208, guide rail; 3, stock storage unit; 301, stock storage baffle; 302, L-shaped plate; 303, partition plate; 304, sliding rod; 305, lifting screw; 306, support plate; 307, first one-way gear; 4, blanking and drying unit; 401, blanking channel; 402, roller; 403, blower; 404, stock storage box; 5, material transfer unit; 501, material transfer gear ring; 502, first transmission gear; 503, first transmission rod; 504, driving bevel gear; 505, driven bevel gear; 506, second one-way gear; 507, transmission gear ring; 508, supporting frame; 509, rotating shaft; 6, spraying unit; 601, spraying pipe; 602, spray head; 603, connecting pipe; 604, liquid outlet pipe; 605, metering component; 6051, sealing shell; 6052, piston plate; 6053, piston rod; 6054, groove plate; 6055, transmission part; 60551, second transmission gear; 60552, third one-way gear; 60553, driving pulley; 60554, driven pulley; 60555, synchronous belt; 60556, second transmission rod; 60557, rotating plate; 60558, limiting plate; 6056, liquid inlet pipe; 7, synchronization unit; 701, first rack; 702, second connecting frame; 703, second rack; 704, third connecting frame; 705, third rack. Detailed implementation manners

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0019] Embodiment 1: Please refer to Figure 1 , an etching device for a PCB circuit board shown in the figure, including a frame plate 1. A shielding cover 101 is fixed at the middle position on the top of the frame plate 1, and an etching solution tank 102 is installed above the top of the shielding cover 101; It further includes: a continuous feeding unit 2 installed on one side of the frame plate 1, which is used to automatically guide multiple groups of PCB circuit boards below the etching solution tank 102. A stock storage unit 3 for storing multiple groups of PCB circuit boards is provided on the top of the continuous feeding unit 2. A blanking and drying unit 4 for discharging the PCB circuit boards is provided on the side of the frame plate 1 away from the continuous feeding unit 2. Through the continuous feeding unit 2, the batch of PCB circuit boards on the stock storage unit 3 can be fed into the shielding cover 101 one by one for etching. When the next PCB circuit board enters the shielding cover 101 for etching, the previous PCB circuit board will be automatically pushed into the blanking and drying unit 4 for drying and blanking; A material transfer unit 5 rotatably connected inside the shielding cover 101, which is used to adjust the direction of the etched PCB circuit board. When the continuous feeding unit 2 is moved out of the shielding cover 101, the material transfer unit 5 will be automatically triggered to work. This process occurs after the PCB circuit board is etched. The material transfer unit 5 will rotate the etched PCB circuit board 180 degrees so that the etched side faces downward, which is beneficial for the etching solution flushed on the PCB circuit board to automatically fall downward and be cleared. And when etching the next PCB circuit board, the etching solution will also flush the back of the previous PCB circuit board downward, which can indirectly etch the other side of the PCB circuit board; A spraying unit 6 installed outside the etching solution tank 102, which is used to automatically spray the etching solution to perform spray etching on the PCB circuit board. When the continuous feeding unit 2 is moved out of the shielding cover 101 by a certain distance, the spraying unit 6 will be automatically triggered to work. The spraying unit 6 will spray a large amount of etching solution on the upper surface of the PCB circuit board to perform all-round etching on it.

[0020] Furthermore, refer to Figure 2, the continuous board supply unit 2 includes a driving motor 201, a ball screw 202, a moving seat 203, a Z-shaped plate 204 and a vacuum suction cup group 205. The driving motor 201 is installed on the frame plate 1. The ball screw 202 is fixedly connected to the output end of the ball screw 202 through a coupling. Both sides of the ball screw 202 are connected to the frame plate 1 through bearing seats. The moving seat 203 is threadedly connected to the ball screw 202 through a ball nut. The vacuum suction cup group 205 is fixedly connected to the top of the moving seat 203 through the Z-shaped plate 204. The vacuum suction cup group 205 is located below the stock storage unit 3. A first connecting frame 206 is fixed to one side of the moving seat 203. A slider 207 is fixed to the bottom of the first connecting frame 206. A guide rail 208 adapted to the slider 207 is fixed on the frame plate 1. A synchronization unit 7 is fixed to the end of the first connecting frame 206 away from the moving seat 203.

[0021] Specifically, the driving motor 201 drives the ball screw 202 to rotate. The ball screw 202 drives the moving seat 203 to move. The moving seat 203 drives the vacuum suction cup group 205 to move. The vacuum suction cup group 205 sucks and fixes the PCB circuit board at the bottom of the stock storage unit 3, and then moves it to the transfer unit 5 on the top of the shielding cover 101 for automatic feeding. Finally, the vacuum suction cup is released, and the moving seat 203 moves back to the initial position to suck the next PCB circuit board.

[0022] Further, referring to Figure 3 , the stock storage unit 3 includes a storage baffle 301, an L-shaped plate 302 and a partition plate 303. There are two symmetrically arranged storage baffles 301. The partition plates 303 are evenly fixed inside the storage baffles 301. Both ends of the space enclosed by the two storage baffles 301 are not closed. The top of the partition plate 303 is used to place and store PCB circuit boards. L-shaped plates 302 are fixed to both ends of the storage baffle 301. A sliding rod 304 is slidably sleeved on the L-shaped plate 302. A lifting screw 305 is threadedly connected to one of the L-shaped plates 302. The bottom end of the sliding rod 304 is fixed with a support plate 306. The support plate 306 is fixed to the frame plate 1. The lifting screw 305 is rotatably connected to the support plate 306 through a bearing. A first one-way gear 307 is also sleeved on the bottom of the lifting screw 305.

[0023] Specifically, a large number of PCB circuit boards can be stored by using two storage baffles 301 and multiple partition plates 303. During the process of the moving seat 203 moving back to the initial position, it will drive the first one-way gear 307 to rotate. The first one-way gear 307 drives the lifting screw 305 to rotate, thereby driving the L-shaped plate 302 to move down a fixed distance, so that the PCB circuit board accurately falls on the vacuum suction cup group 205 for suction. When the moving seat 203 moves towards the shielding cover 101, however, since the first one-way gear 307 is a mechanical structure that only allows rotation in one direction and prevents rotation in the opposite direction, when the moving seat 203 moves in this direction, the first one-way gear 307 will only rotate by itself and will not drive the central shaft to rotate. Therefore, the power will not be transmitted to the lifting screw 305.

[0024] Further, referring to Figure 4 , the synchronization unit 7 includes a first rack 701, a second connecting frame 702, a second rack 703, a third connecting frame 704, and a third rack 705. The first rack 701 is fixedly connected to the second rack 703 through the second connecting frame 702. The first connecting frame 206 is fixed to the bottom end of the third connecting frame 704. The third connecting frame 704 is fixed to one side of the second rack 703. The third rack 705 is fixed to the top of the third connecting frame 704.

[0025] Specifically, when the moving seat 203 drives the first connecting frame 206 to move, it will drive the first rack 701, the second connecting frame 702, the second rack 703, the third connecting frame 704 and the third rack 705 to move together. At this time, the first rack 701 can automatically engage with or disengage from the first one-way gear 307. The second rack 703 will also automatically trigger the synchronization unit 7 to work, and the third rack 705 will also automatically trigger the spraying unit 6 to work. For example, during the feeding process of the PCB circuit board, the first rack 701 will first engage with the first one-way gear 307, but the first one-way gear 307 will not drive the lifting screw 305 to rotate. Then, the second rack 703 cooperates with the input end of the synchronization unit 7. At this time, it is similar to the principle of the first one-way gear 307, and the subsequent power of the synchronization unit 7 will not be transmitted. After that, the third rack 705 will cooperate with the input end of the spraying unit 6. At this time, it is also similar to the principle of the first one-way gear 307, and the subsequent power of the spraying unit 6 will not be transmitted. That is, during the process of feeding the PCB circuit board, the spraying unit 6, the synchronization unit 7 and the material transfer unit 5 do not work. When the moving seat 203 moves out, the third rack 705 will first trigger the spraying unit 6 to work, that is, first perform the spraying and etching treatment on the PCB circuit board. After the etching is completed, the third rack 705 disengages from the cooperation with the spraying unit 6, and the second rack 703 then cooperates with the synchronization unit 7 to drive the material transfer unit 5 to rotate, rotating the just-etched PCB circuit board 180 degrees. Then, the first rack 701 cooperates with the first one-way gear 307 to drive the storage unit 3 to move down a certain distance, so that the next PCB circuit board accurately falls on the vacuum suction cup group 205. In this way, the etching work of one PCB circuit board is completed.

[0026] Further, refer to Figure 5, the material transfer unit 5 includes a material transfer gear ring 501, a first transmission gear 502, a first transmission rod 503, a driving bevel gear 504, a driven bevel gear 505, a second one-way gear 506 and a transmission gear ring 507. The material transfer gear ring 501 is rotatably connected to the inner wall of the shielding cover 101 through a slewing bearing, and there are two material transfer gear rings 501 distributed coaxially. The two material transfer gear rings 501 are fixedly connected by a fixing rod. Holding frames 508 are fixed at both the upper and lower ends of the material transfer gear ring 501. The first transmission gear 502 is meshed with the material transfer gear ring 501. The first transmission rod 503 is fixedly sleeved with the first transmission gear 502. The first transmission rod 503 is rotatably connected to the shielding cover 101 through a bearing. One end of the first transmission rod 503 extending outside the shielding cover 101 is fixedly sleeved with the driven bevel gear 505. The driving bevel gear 504 is meshed with the driven bevel gear 505. A rotating shaft 509 is fixedly sleeved in the middle of the driven bevel gear 505. The second one-way gear 506 is fixedly sleeved with the rotating shaft 509. The bottom of the rotating shaft 509 is rotatably connected to the frame plate 1 through a bearing. The transmission gear ring 507 is rotatably connected to the frame plate 1. The second one-way gear 506 is meshed with the transmission gear ring 507.

[0027] Specifically, when the second rack 703 moves to be meshed with the transmission gear ring 507, the transmission gear ring 507 will be driven to rotate during the linear displacement movement of the second rack 703. The transmission gear ring 507 drives the second one-way gear 506 to rotate. The second one-way gear 506 drives the driving bevel gear 504 to rotate. The driving bevel gear 504 drives the driven bevel gear 505 to rotate. The driven bevel gear 505 drives the first transmission rod 503 to rotate. The first transmission rod 503 drives the first transmission gear 502 to rotate. The first transmission gear 502 drives the material transfer gear ring 501 to rotate, thereby driving the PCB circuit board placed in the holding frame 508 to exchange its upper and lower positions.

[0028] Further, referring to Figure 6 , the spraying unit 6 includes a spraying pipe 601, a nozzle 602, a connecting pipe 603, a liquid outlet pipe 604 and a metering component 605. A plurality of spraying pipes 601 are arrayed at the bottom of the etching solution tank 102. A plurality of nozzles 602 are distributed at the bottoms of the plurality of spraying pipes 601. One ends of the plurality of spraying pipes 601 are all connected through the connecting pipe 603. The connecting pipe 603 is communicated with a liquid outlet pipe 604 on the side far from the spraying pipe 601. The metering component 605 is installed outside the etching solution tank 102.

[0029] Specifically, when the third rack 705 moves from right to left, it will drive the quantitative component 605 to work, and input a sufficient amount of etching liquid from the connecting pipe 603 into the spray pipe 601, so that the etching liquid in the spray pipe 601 is sprayed out from the nozzle 602 in multiple directions, thereby evenly spraying and etching the upper side of the PCB circuit board.

[0030] For further information, see Figure 7 and Figure 8 The quantitative component 605 includes a sealing shell 6051, a piston plate 6052, a piston rod 6053, a groove plate 6054 and a transmission member 6055. The sealing shell 6051 is fixed to the outer wall of the etching liquid box 102, the piston plate 6052 is slidably connected in the sealing shell 6051, the piston rod 6053 is fixed to one side of the piston plate 6052, and the end of the piston rod 6053 away from the piston plate 6052 slides through the sealing shell. One end of the sealing shell 6051 is fixedly connected to the middle of one side of the slot plate 6054, the output end of the transmission member 6055 is slidably connected to the slot plate 6054, the end of the sealing shell 6051 away from the slot plate 6054 is connected to a liquid inlet pipe 6056 through a one-way valve, the end of the liquid inlet pipe 6056 away from the sealing shell 6051 is connected to the inside of the etching liquid tank 102, and the liquid outlet pipe 604 is also connected to the sealing shell 6051 through a one-way valve; The transmission member 6055 comprises a second transmission gear 60551, a third one-way gear 60552, a driving pulley 60553, a driven pulley 60554, a synchronous belt 60555 and a second transmission rod 60556. The intermediate shaft of the second transmission gear 60551 is installed on the sealed shell 6051 through a bearing seat. The third one-way gear 60552 is meshedly connected with the second transmission gear 60551. The third one-way gear 60552 and the driving pulley 60553 are coaxially connected. The intermediate shaft of the driving pulley 60553 is rotatably connected to the outer wall of the sealed shell 6051 through a bearing. The driven pulley 60554 and the driving pulley 60553 are connected through the synchronous belt 60555, and the driven pulley 60554 is fixedly sleeved with the second transmission rod 60556. A rotating plate 60557 is fixed to the end of the second transmission rod 60556 away from the driven pulley 60554, and the end of the rotating plate 60557 away from the second transmission rod 60556 is slidingly connected to the groove plate 6054 through a sliding pin. The middle part of the second transmission rod 60556 is rotatably connected to the limiting plate 60558 through a bearing, and one end of the limiting plate 60558 is fixedly connected to the sealing shell 6051.

[0031] Specifically, when the third rack 705 moves from right to left, it drives the second transmission gear 60551 to rotate. The second transmission gear 60551 drives the third one-way gear 60552 to rotate. The third one-way gear 60552 drives the driving pulley 60553 to rotate. The driving pulley 60553 drives the driven pulley 60554 to rotate through the synchronous belt 60555. The driven pulley 60554 drives the second transmission rod 60556 to rotate. The second transmission rod 60556 drives the rotating plate 60557 to rotate. The rotating plate 60557 drives the groove plate 6054 to perform reciprocating linear motion through the sliding pin, thereby driving the piston rod 6053 to reciprocate left and right, causing the piston plate 6052 to reciprocate within the sealing housing 6051. Thus, a fixed amount of etching solution can be pumped out and discharged each time, which is beneficial for the quantitative use of the etching solution and will not cause excessive waste.

[0032] In this solution, the process of batch etching of PCB circuit boards; First, the first PCB circuit board is sucked by the vacuum chuck group 205. The ball screw 202 drives the moving seat 203 to move from left to right and store it in the holding frame 508. During this process, the transfer unit 5, the synchronization unit 7, the spraying unit 6, and the storage unit 3 do not work. After that, the drive motor 201 drives the ball screw 202 to rotate in the reverse direction, driving the moving seat 203 to move from right to left. During this process, the third rack 705 will first drive the transmission member 6055 to work, causing the transmission member 6055 to drive the piston plate 6052 to reciprocate left and right multiple times, thereby uniformly spraying an appropriate amount of etching solution from the spray pipe 601 to perform spray etching treatment on the PCB circuit board in the holding frame 508. When the third rack 705 disengages from the second transmission gear 60551, no more etching solution is sprayed from the spray pipe 601, and the etching process ends. After that, the moving seat 203 continues to move from right to left. At this time, it moves to engage with the second rack 703 and the transmission gear ring 507, driving the synchronization unit 7 to work. The synchronization unit 7 outputs power to the transfer gear ring 501, driving the transfer gear ring 501 to rotate 180 degrees. Since there are two holding frames 508 fixed on the transfer gear ring 501, the PCB circuit board in the upper holding frame 508 will rotate to the bottommost through the rotation action. During this rotation process, the etching solution washed on the PCB circuit board will automatically fall downward and be cleared. After that, the moving seat 203 continues to move from right to left. At this time, the second rack 703 and the transmission gear ring 507 just disengage from meshing, while the first rack 701 and the first one-way gear 307 enter meshing, driving the lifting screw 305 to rotate. During the process of the first rack 701 and the first one-way gear 307 entering and disengaging from meshing, it just drives the L-shaped plate 302 to move down a fixed distance, so that the PCB board accurately lands on the vacuum chuck group 205 for suction. At this time, the feeding work of the first PCB board is completed; Finally, the moving seat 203 moves from left to right again, conveying the adsorbed second PCB board into the shielding cover 101, so that the second PCB board enters the second holding frame 508, and then the spraying, material transfer and feeding work are carried out according to the above process, so as to realize the etching work of the second PCB board. During the process of the third PCB board entering the holding frame 508, it will automatically push the first PCB board out of the holding frame 508 and into the blanking and drying unit 4 for drying and blanking treatment, and then work reciprocally according to the above process in turn, so as to etch a large number of PCB boards, improving the etching efficiency of the PCB boards when the number of PCB boards is large, and the PCB boards will not interfere with each other during etching.

[0033] Embodiment 2: Please refer to Figure 9 , this embodiment further illustrates Embodiment 1, and the difference lies in optimizing the process of blanking the PCB board.

[0034] Specifically, the blanking and drying unit 4 includes a blanking channel 401, a drum 402, a blower 403 and a storage box 404. The upper end of the blanking channel 401 is fixed on one side of the shielding cover 101 and corresponds to the upper side of the material transfer unit 5. The drums 402 are evenly distributed at the bottom of the blanking channel 401. The blower 403 is installed on the upper side of the blanking channel 401 and blows air to dry the PCB board passing through the blanking channel 401. A through groove is opened at a position near the bottom on the lower side of the blanking channel 401. The storage box 404 is arranged on the frame plate 1 and corresponds to the position of the through groove.

[0035] Specifically, when the PCB board is pushed out of the holding frame 508, it will enter the blanking channel 401. The PCB board slides down the outer wall of the drum 402 by gravity. During this process, the blower 403 will blow air to the PCB board, thereby accelerating the drying of the PCB board. Finally, the PCB board falls into the storage box 404 through the through groove for storage.

[0036] Embodiment 3: Please refer to Figure 1 and Figure 10, this embodiment further illustrates other embodiments. The difference lies in optimizing the etching solution flow path.

[0037] Specifically, an etching device for a PCB circuit board includes a frame plate 1. At the middle position on the top of the frame plate 1, a shielding cover 101 is fixed. Above the top of the shielding cover 101, an etching solution tank 102 is installed; at the bottom of the frame plate 1, a reflux hopper 103 is fixed. The bottom of the reflux hopper 103 is communicated with a liquid storage tank 104. A liquid extraction pipe 105 is connected between the liquid storage tank 104 and the etching solution tank 102. One end of the liquid extraction pipe 105 extending into the liquid storage tank 104 is connected with a booster submersible pump.

[0038] Specifically, the downwardly sprayed etching solution will fall into the reflux hopper 103 and flow back to the liquid storage tank 104 for preliminary storage. When a certain amount is stored, by starting the booster submersible pump, the etching solution in the liquid storage tank 104 will be pumped into the etching solution tank 102 again, further reducing the waste of the etching solution and facilitating the recycling of the etching solution.

[0039] It should be noted that a filter screen will be provided below the bottom of the reflux hopper 103 and inside the liquid storage tank 104 to filter the refluxed etching solution and prevent excessive impurities in the etched etching solution.

[0040] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0041] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An etching device for a PCB circuit board, comprising: A frame plate (1), at the middle position of the top of the frame plate (1), a shielding cover (101) is fixed, and above the top of the shielding cover (101), an etching solution tank (102) is installed; Characterized in that it further comprises: A continuous feeding unit (2) installed on one side of the frame plate (1), the continuous feeding unit (2) is used to automatically guide multiple groups of PCB circuit boards below the etching solution tank (102), at the top of the continuous feeding unit (2), there is a storage unit (3) for storing multiple groups of PCB circuit boards, and on the side of the frame plate (1) away from the continuous feeding unit (2), there is a blanking and drying unit (4) for discharging the PCB circuit boards; A material transfer unit (5) rotatably connected inside the shielding cover (101), the material transfer unit (5) is used to adjust the direction of the etched PCB circuit boards; A spraying unit (6) installed outside the etching solution tank (102), the spraying unit (6) is used to automatically spray the etching solution to perform spraying and etching treatment on the PCB circuit boards.

2. The etching device for a PCB circuit board according to claim 1, wherein: The continuous feeding unit (2) includes a driving motor (201), a ball screw (202), a moving seat (203), a Z-shaped plate (204) and a vacuum suction cup group (205), the driving motor (201) is installed on the frame plate (1), the ball screw (202) is fixedly connected to the output end of the ball screw (202) through a coupling, both sides of the ball screw (202) are connected to the frame plate (1) through bearing seats, the moving seat (203) is threadedly connected to the ball screw (202) through a ball nut, the vacuum suction cup group (205) is fixedly connected to the top of the moving seat (203) through the Z-shaped plate (204), the vacuum suction cup group (205) is located below the storage unit (3), on one side of the moving seat (203), a first connecting frame (206) is fixed, at the bottom of the first connecting frame (206), a slider (207) is fixed, and on the frame plate (1), a guide rail (208) adapted to the slider (207) is fixed, and at the end of the first connecting frame (206) away from the moving seat (203), a synchronization unit (7) is fixed.

3. An etching device for a PCB circuit board according to claim 2, characterized in that: The stock storage unit (3) includes a storage baffle (301), an L-shaped plate (302) and a partition plate (303). Two storage baffles (301) are symmetrically arranged. The partition plates (303) are evenly fixed inside the storage baffles (301). Both ends of the space enclosed by the two storage baffles (301) are not closed. The top of the partition plate (303) is used to place and store PCB circuit boards. L-shaped plates (302) are fixed at both ends of the storage baffle (301). A sliding rod (304) is slidably sleeved on the L-shaped plate (302). A lifting screw rod (305) is threadedly connected to one of the L-shaped plates (302). The bottom end of the sliding rod (304) is fixed with a support plate (306). The support plate (306) is fixed to the frame plate (1). The lifting screw rod (305) is rotatably connected to the support plate (306) through a bearing. A first one-way gear (307) is also sleeved at the bottom of the lifting screw rod (305).

4. An etching device for a PCB circuit board according to claim 2, characterized in that: The synchronization unit (7) includes a first rack (701), a second connecting frame (702), a second rack (703), a third connecting frame (704) and a third rack (705). The first rack (701) is fixedly connected to the second rack (703) through the second connecting frame (702). The bottom end of the first connecting frame (206) is fixed to the third connecting frame (704). The third connecting frame (704) is fixed to one side of the second rack (703). The third rack (705) is fixed to the top of the third connecting frame (704).

5. An etching device for a PCB circuit board according to claim 1, characterized in that: The material transfer unit (5) includes a material transfer gear ring (501), a first transmission gear (502), a first transmission rod (503), a driving bevel gear (504), a driven bevel gear (505), a second one-way gear (506) and a transmission gear ring (507). The material transfer gear ring (501) is rotatably connected to the inner wall of the shielding cover (101) through a slewing bearing, and there are two coaxially distributed material transfer gear rings (501). The two material transfer gear rings (501) are fixedly connected by a fixing rod. Holding frames (508) are fixed at both the upper and lower ends of the material transfer gear ring (501). The first transmission gear (502) is meshed with the material transfer gear ring (501). The first transmission rod (503) is fixedly sleeved with the first transmission gear (502). The first transmission rod (503) is rotatably connected to the shielding cover (101) through a bearing. One end of the first transmission rod (503) extending outside the shielding cover (101) is fixedly sleeved with the driven bevel gear (505). The driving bevel gear (504) is meshed with the driven bevel gear (505). A rotating shaft (509) is fixedly sleeved in the middle of the driven bevel gear (505). The second one-way gear (506) is fixedly sleeved with the rotating shaft (509). The bottom of the rotating shaft (509) is rotatably connected to the frame plate (1) through a bearing. The transmission gear ring (507) is rotatably connected to the frame plate (1). The second one-way gear (506) is meshed with the transmission gear ring (507).

6. The etching device for a PCB circuit board according to claim 1, characterized in that: The spraying unit (6) includes a spraying pipe (601), a spray head (602), a connecting pipe (603), a liquid outlet pipe (604) and a metering assembly (605). A plurality of spraying pipes (601) are arranged in an array at the bottom of the etching solution tank (102). A plurality of spray heads (602) are distributed at the bottom of the plurality of spraying pipes (601). One ends of the plurality of spraying pipes (601) are connected through the connecting pipe (603). The connecting pipe (603) is communicated with a liquid outlet pipe (604) on the side away from the spraying pipe (601). The metering assembly (605) is installed on the outside of the etching solution tank (102).

7. An etching device for a PCB circuit board according to claim 6, characterized in that: The quantitative component (605) comprises a sealing shell (6051), a piston plate (6052), a piston rod (6053), a groove plate (6054) and a transmission member (6055); the sealing shell (6051) is fixed on the outer wall of the etching liquid box (102); the piston plate (6052) is slidably connected in the sealing shell (6051); the piston rod (6053) is fixed to one side of the piston plate (6052); an end of the piston rod (6053) away from the piston plate (6052) slides through the sealing shell (6051); One end of the sealing shell (6051) is fixedly connected to the middle part of one side of the groove plate (6054), the output end of the transmission member (6055) is slidably connected to the groove plate (6054), one end of the sealing shell (6051) away from the groove plate (6054) is connected to a liquid inlet pipe (6056) via a one-way valve, one end of the liquid inlet pipe (6056) away from the sealing shell (6051) is connected to the inside of the etching liquid tank (102), and the liquid outlet pipe (604) is also connected to the sealing shell (6051) via a one-way valve.

8. An etching device for a PCB circuit board according to claim 7, characterized in that: The transmission member (6055) comprises a second transmission gear (60551), a third one-way gear (60552), a driving pulley (60553), a driven pulley (60554), a synchronous belt (60555) and a second transmission rod (60556); the intermediate shaft of the second transmission gear (60551) is mounted on the sealing shell (6051) via a bearing seat; the third one-way gear (60552) is meshedly connected with the second transmission gear (60551); the third one-way gear (60552) and the driving pulley (60553) are coaxially connected; the intermediate shaft of the driving pulley (60553) is rotatably connected to the outer wall of the sealing shell (6051) via a bearing; the driven pulley (60554) is rotatably connected to the outer wall of the sealing shell (6051) via a bearing; The driven pulley (60554) and the driving pulley (60553) are connected to each other through the synchronous belt (60555); the driven pulley (60554) is fixedly sleeved with the second transmission rod (60556); a rotating plate (60557) is fixed to one end of the second transmission rod (60556) away from the driven pulley (60554); one end of the rotating plate (60557) away from the second transmission rod (60556) is slidably connected to the groove plate (6054) through a sliding pin; the middle part of the second transmission rod (60556) is rotatably connected to a limiting plate (60558) through a bearing; one end of the limiting plate (60558) is fixedly connected to the sealing shell (6051).

9. An etching device for a PCB circuit board according to claim 1, characterized in that: The blanking and drying unit (4) includes a blanking channel (401), a drum (402), a blower (403) and a storage bin (404). The upper end of the blanking channel (401) is fixed to one side of the shielding cover (101) and corresponds to the upper side of the material transfer unit (5). The drums (402) are evenly distributed at the bottom of the blanking channel (401). The blower (403) is installed on the upper side of the blanking channel (401) and blows air to dry the PCB boards passing through the blanking channel (401). A through slot is opened at a position near the bottom on the lower side of the blanking channel (401). The storage bin (404) is arranged on the rack board (1) and corresponds to the position of the through slot.

10. The etching device for a PCB circuit board according to claim 1, characterized in that: A reflux hopper (103) is fixed to the bottom of the rack board (1). The bottom of the reflux hopper (103) is communicated with a liquid storage tank (104). A liquid suction pipe (105) is connected between the liquid storage tank (104) and the etching solution tank (102). One end of the liquid suction pipe (105) extending into the liquid storage tank (104) is connected with a booster submersible pump.

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