Integrated circuit board convenient to weld

Abstract

The invention relates to the technical field of circuit boards, and discloses a convenient-to-weld integrated circuit board, which comprises a circuit board main body, a first tin planting hole and a plug-in step hole are formed in the circuit board main body, a mounting hole is formed in the circuit board main body, a limiting bent hole is formed in the mounting hole, and a second tin planting hole and a plug-in step hole are formed in the circuit board main body. And a first welding mechanism is clamped in the mounting hole, a second welding mechanism is clamped on the outer surface of the first welding mechanism, and a heat dissipation mechanism is slidably connected in the first welding mechanism. The circuit board convenient to weld is provided with tin planting holes, soldering tin is accurately guided, tin planting and perforation element welding are assisted, and mounting stress is eliminated through four-corner limiting bent holes. The first welding mechanism and the second welding mechanism can be flexibly matched with different circuit boards, and the tin planting amount and position are accurately controlled. The heat dissipation mechanism works cooperatively to play a role in positioning, heat dissipation and supporting, local overheating is avoided, welding is assisted in an all-around mode, and the welding efficiency and the product stability are greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and specifically to an integrated circuit board that is convenient for soldering. Background Technique

[0002] In the wave of the booming development of the modern electronics industry, as the core component of electronic products, integrated circuit boards have continuously expanded their application fields, from daily consumer electronics to professional fields such as high-end industrial control, aerospace, etc., and are everywhere; however, with the continuous enhancement of the functions of electronic products and the increasing integration, more stringent requirements have been put forward for the soldering process of integrated circuit boards.

[0003] The patent application with the application number CN202322878491.7 discloses an integrated circuit board that is convenient for soldering, including a limiting frame. Inside the limiting frame, there is a circuit board main body. Heat dissipation fans are respectively penetrated and fixedly connected to the middle parts of the left and right sides of the limiting frame. Moving plates are arranged on the front and rear sides of the limiting frame. Moving components are fixedly connected to the front sides of the moving plates. Limiting components are arranged on the front sides of the moving components. The moving component includes a sliding rod, and the sliding rod is fixedly connected to the moving plate. A limiting ring is penetrated and slidably connected to the outer wall of the sliding rod, and the limiting ring is fixedly connected to the limiting frame.

[0004] However, this patent also has the following deficiencies. That is, during the soldering and installation processes of traditional integrated circuit boards, due to poor adaptability, lack of guidance, insufficient heat dissipation, and inaccurate positioning, the soldering quality is poor and components are easily damaged. In view of this situation, an integrated circuit board that is convenient for soldering is specifically proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide an integrated circuit board that is convenient for soldering to solve the problems raised in the above background technique.

[0006] To solve the above technical problems, the present invention provides the following technical solution: An integrated circuit board that is convenient for soldering, including a circuit board main body. Inside the circuit board main body, a solder paste planting hole one and a plug-in stepped hole are opened. An installation hole is opened inside the circuit board main body. A limiting bent hole is opened inside the installation hole. A soldering mechanism one is clamped inside the installation hole. A soldering mechanism two is clamped on the outer surface of the soldering mechanism one. A heat dissipation mechanism is slidably connected inside the soldering mechanism one. The soldering mechanism one includes: A bottom plate. Inside the bottom plate, a sliding through groove one and a sliding through groove two are clamped. A double-hole column is clamped inside the sliding through groove one. A fastening bolt is threadedly connected to the bottom of the double-hole column. A limiting nail is threadedly connected to the top of the double-hole column. The limiting nail is used to limit the circuit board main body.

[0007] According to the above technical solution, the double-hole column is clamped with the limiting bent hole, the bending angle at the top of the limiting bent hole is greater than the bending angle at the bottom, the diameter of the first soldering paste hole is the same as the outer diameter of the plug-in stepped hole, and the limiting bent hole is used to protect the circuit board body.

[0008] According to the above technical solution, the upper surface of the fastening bolt is in contact with the lower surface of the bottom plate, the lower surface of the limiting nail is in contact with the upper surface of the double-hole column, the lower surface of the double-hole column is flush with the lower surface of the bottom plate, the lower surface of the limiting nail is in contact with the upper surface of the circuit board body, and the fastening bolt is used to fix the double-hole column.

[0009] According to the above technical solution, the second soldering mechanism includes a first annular column, the first annular column is clamped with the limiting nail, the limiting nail is one with a second annular column clamped on its outer surface, the inside of the first annular column is threadedly connected with a first rotating handrail, the outer surface of the first rotating handrail is rotatably connected with a first clamping block, the inside of the second annular column is threadedly connected with a second rotating handrail, the outer surface of the second rotating handrail is rotatably connected with a second clamping block, the outer surface of the first clamping block is clamped with a soldering paste tray, a second soldering paste hole is provided inside the soldering paste tray, and the limiting nail is used to limit the first annular column and the second annular column.

[0010] According to the above technical solution, the lower surface of the first annular column is in contact with the upper surface of the second annular column, the outer surface of the second clamping block is clamped with the soldering paste tray, the upper surface of the soldering paste tray is flush with the upper surface of the first annular column, and the first rotating handrail and the second rotating handrail are used to adjust the position of the soldering paste tray.

[0011] According to the above technical solution, the lower surface of the second annular column is in contact with the upper surface of the circuit board body, the lower surface of the soldering paste tray is in contact with the upper surface of the circuit board body, the diameter of the second soldering paste hole is the same as that of the first soldering paste hole and the plug-in mounting hole, the distance between the second soldering paste hole and the first soldering paste hole and the plug-in mounting hole is the same, and the second soldering paste hole is used to apply soldering paste to the first soldering paste hole and the plug-in stepped hole.

[0012] According to the above technical solution, the heat dissipation mechanism includes a third clamping block, a first clamping groove and a second clamping groove are provided inside the bottom plate, the first clamping groove is clamped with the third clamping block, an arc-shaped plate is fixedly connected to the upper surface of the third clamping block, a support housing is fixedly connected to the upper surface of the arc-shaped plate, a heat dissipation device is fixedly connected to the lower surface of the support housing, heat dissipation fins are fixedly connected to the outer surface of the support housing, and the heat dissipation fins are used to dissipate heat from the circuit board body.

[0013] According to the above technical solution, the second card slot is snap-connected to the third card block. The lower surface of the arc-shaped plate is in contact with the upper surface of the bottom plate. The upper surface of the heat sink is in contact with the lower surface of the circuit board body. The heat dissipation device is composed of a motor and a fan blade, and the heat dissipation device is used to dissipate heat from the heat sink.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. For this kind of integrated circuit board that is convenient for soldering, by setting a circuit board structure with solder paste holes, it facilitates the soldering work of solder paste and perforated components. The solder paste holes accurately guide the flow of solder, ensuring firm and uniform soldering. Moreover, the four corners of the circuit board are specially designed with limiting bent holes. During installation, the limiting bent holes can accurately position the circuit board, making it stably in a horizontal position, thereby effectively avoiding stress caused by position deviation. The elimination of stress comprehensively guarantees the performance of the circuit board and improves its installation and soldering quality.

[0015] 2. For this kind of integrated circuit board that is convenient for soldering, by setting the soldering mechanism I, it has a highly flexible adjustment mechanism, can quickly adapt to circuit boards of different sizes and shapes, and when working with the circuit board with solder paste holes, the soldering mechanism I accurately positions, facilitating the soldering process of perforated components, ensuring that the circuit board will not bear additional stress during the entire soldering process, and greatly improving the soldering quality and the stability of the circuit board.

[0016] 3. For this kind of integrated circuit board that is convenient for soldering, by setting the soldering mechanism II, it can handle circuit boards of different sizes and shapes, and can accurately control the amount of solder paste and the solder paste position according to the differences in the sizes of electronic components, laying a solid foundation for subsequent soldering, and ensuring that various electronic components can be firmly soldered on the circuit board.

[0017] 4. For this kind of integrated circuit board that is convenient for soldering, by setting the heat dissipation mechanism, which operates in coordination with the soldering mechanisms I and II, during the soldering process of solder paste and perforated components, it plays a dual role of positioning heat dissipation and support, thereby avoiding local overheating of the circuit board, and ensuring the stability of the circuit board during soldering through its stable support structure, providing a solid foundation for the soldering work, and comprehensively assisting the circuit board that is convenient for soldering to improve the soldering quality and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the main structure of the present invention; Figure 2 It is a structural cross-sectional view of the circuit board; Figure 3 It is a structural cross-sectional view of the soldering mechanism I of the present invention; Figure 4 It is a partial structural schematic diagram of the soldering mechanism I of the present invention; Figure 5It is a structural sectional view of the second welding mechanism of the present invention; Figure 6 It is a partial structural schematic diagram of the second welding mechanism of the present invention; Figure 7 It is a structural schematic diagram of the heat dissipation mechanism of the present invention; Figure 8 It is a partial structural schematic diagram of the heat dissipation mechanism of the present invention.

[0019] In the figure: 1. Main circuit board; 2. First solder paste hole; 3. First welding mechanism; 301. Bottom plate; 302. First sliding through groove; 303. Second sliding through groove; 304. Double-hole column; 305. Tightening bolt; 306. Limit pin; 4. Plug-in stepped hole; 5. Mounting hole; 6. Second welding mechanism; 601. First annular column; 602. Second annular column; 603. First rotating handrail; 604. Second rotating handrail; 605. First clamping block; 606. Second clamping block; 607. Solder paste tray; 608. Second solder paste hole; 7. Heat dissipation mechanism; 701. First clamping groove; 702. Second clamping groove; 703. Third clamping block; 704. Arc-shaped plate; 705. Heat dissipation device; 706. Support housing; 707. Heat sink; 8. Limit bent hole. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0021] Examples of the described embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0022] In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection", "fixation" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] Embodiment 1: Refer to Figures 1-4 , the present invention provides a technical solution: an integrated circuit board convenient for welding, including a circuit board main body 1. A solder paste planting hole 1 and a plug-in stepped hole 4 are provided inside the circuit board main body 1. An installation hole 5 is provided inside the circuit board main body 1. A limiting bent hole 8 is provided inside the installation hole 5. A welding mechanism 1 is clamped inside the installation hole 5. A welding mechanism 2 6 is clamped on the outer surface of the welding mechanism 1. A heat dissipation mechanism 7 is slidably connected inside the welding mechanism 1. The welding mechanism 1 includes: A bottom plate 301. A sliding through groove 1 302 and a sliding through groove 2 303 are clamped inside the bottom plate 301. A double-hole column 304 is clamped inside the sliding through groove 1 302. A fastening bolt 305 is threadedly connected to the bottom of the double-hole column 304. A limiting nail 306 is threadedly connected to the top of the double-hole column 304. The limiting nail 306 is used to limit the circuit board main body 1.

[0024] The double-hole column 304 is clamped with the limiting bent hole 8. The bending angle at the top of the limiting bent hole 8 is greater than that at the bottom. The diameter of the solder paste planting hole 1 is the same as the outer diameter of the plug-in stepped hole 4. The limiting bent hole 8 is used to protect and fasten the circuit board main body 1. The upper surface of the fastening bolt 305 is in contact with the lower surface of the bottom plate 301. The lower surface of the limiting nail 306 is in contact with the upper surface of the double-hole column 304. The lower surface of the double-hole column 304 is flush with the lower surface of the bottom plate 301. The lower surface of the limiting nail 306 is in contact with the upper surface of the circuit board main body 1. The fastening bolt 305 is used to fix the double-hole column 304. The bending angle at the top of the limiting bent hole 8 is large, which is used to cooperate with the outer surface of the double-hole column 304 to realize the horizontal support of the circuit board main body 1. The bending angle at the bottom of the limiting bent hole 8 is small, which enables the double-hole column 304 to be stably clamped with it. After welding is completed, the circuit board main body 1 can be separated from the clamping with the double-hole column 304 with a small force, so that the circuit board main body 1 will not be stressed and squeezed during contact.

[0025] The working principle of this embodiment is as follows: When using this integrated circuit board that is convenient for welding, the double-hole column 304 slides inside the first sliding groove 302 and the second sliding groove 303 to adapt to the size of the circuit board main body 1. When the double-hole column 304 and the mounting hole 5 are on the same axis, insert the double-hole column 304 into the mounting hole 5 and engage it with the limiting bent hole 8. At this time, through the cooperation of the symmetrically arranged mounting holes 5, limiting bent holes 8 and double-hole columns 304, by rotating the fastening bolt 305, the position of the double-hole column 304 is fixed. By rotating the four groups of symmetrically arranged fastening bolts 305 in sequence multiple times, the circuit board main body 1 is kept horizontal, so that the circuit board main body 1 will not generate stress, protecting the circuit board main body 1. Thread the column limiting nail 306 on the upper surface of the double-hole column 304 and make the lower surface of the limiting nail 306 contact the upper surface of the circuit board main body 1. At this time, in cooperation with the limiting bent hole 8 and the double-hole column 304, the fixation of the circuit board main body 1 is realized. At this time, insert electronic components into the plug-in stepped hole 4 of the circuit board main body 1 and weld them. At this time, the outer diameter hole of the plug-in stepped hole 4 accommodates the solder for welding. After it contacts the outer diameter hole, the solder forms an arc surface to ensure that the solder will not flow out and ensure the welding quality. When tin is implanted into the first tin implantation hole 2, the solder will also form an arc surface to ensure the tin implantation quality of the first tin implantation hole 2, and implant and weld electronic components into the first tin implantation hole 2.

[0026] Embodiment 2: Please refer to Figures 5-8 , on the basis of Embodiment 1, the present invention provides a technical solution: The welding mechanism 2 6 includes a circular column 1 601, and the circular column 1 601 is engaged with the limiting nail 306. The limiting nail 306 has a circular column 2 602 clamped on its outer surface. A rotating handrail 1 603 is threadedly connected inside the circular column 1 601. A first clamping block 605 is rotatably connected to the outer surface of the rotating handrail 1 603. A rotating handrail 2 604 is threadedly connected inside the circular column 2 602. A second clamping block 606 is rotatably connected to the outer surface of the rotating handrail 2 604. A tin implantation plate 607 is clamped on the outer surface of the first clamping block 605. A second tin implantation hole 608 is opened inside the tin implantation plate 607. The limiting nail 306 is used to limit the circular column 1 601 and the circular column 2 602.

[0027] The lower surface of the first annular column 601 is in contact with the upper surface of the second annular column 602. The outer surface of the second clamping block 606 is clamped with the solder paste stencil 607. The upper surface of the solder paste stencil 607 is flush with the upper surface of the first annular column 601. The rotating handrail 603 and the rotating handrail 604 are used to adjust the position of the solder paste stencil 607. The lower surface of the second annular column 602 is in contact with the upper surface of the circuit board main body 1. The lower surface of the solder paste stencil 607 is in contact with the upper surface of the circuit board main body 1. The diameter of the second solder paste hole 608 is the same as that of the first solder paste hole 2 and the insertion mounting hole 5. The distance between the second solder paste hole 608, the first solder paste hole 2 and the insertion mounting hole 5 is the same. The second solder paste hole 608 is used to apply solder paste to the first solder paste hole 2 and the plug-in stepped hole 4. The length of the first annular column 601 is the same as the length of the first sliding through groove 302. The length of the second annular column 602 is the same as the length of the second sliding through groove 303. Thus, when the first soldering mechanism 3 adapts to circuit board main bodies 1 of different sizes, the second soldering mechanism 6 can make the same adaptation, ensuring the convenience of soldering the circuit board main body 1.

[0028] The heat dissipation mechanism 7 includes a third clamping block 703. The first clamping groove 701 and the second clamping groove 702 are provided inside the bottom plate 301. The first clamping groove 701 is clamped with the third clamping block 703. The upper surface of the third clamping block 703 is fixedly connected with an arc-shaped plate 704. The upper surface of the arc-shaped plate 704 is fixedly connected with a support housing 706. The lower surface of the support housing 706 is fixedly connected with a heat dissipation device 705. The outer surface of the support housing 706 is fixedly connected with heat dissipation fins 707. The heat dissipation fins 707 are used to dissipate heat from the circuit board main body 1.

[0029] The second clamping groove 702 is clamped with the third clamping block 703. The lower surface of the arc-shaped plate 704 is in contact with the upper surface of the bottom plate 301. The upper surface of the heat dissipation fins 707 is in contact with the lower surface of the circuit board main body 1. The heat dissipation device 705 is composed of a motor and a fan blade. The heat dissipation device 705 is used to dissipate heat from the heat dissipation fins 707. The heat dissipation device 705 drives the fan blade by the motor, thereby dissipating heat from the heat dissipation fins 707 through the support housing 706. When applying solder paste, the support housing 706 can assist in supporting the position of the solder paste application, ensuring that the circuit board main body 1 does not bear the stress of solder paste application and electronic component soldering, and ensuring the structural stability of the circuit board main body 1.

[0030] The working principle of this embodiment is as follows: When using this kind of integrated circuit board that is convenient for welding, the corresponding solder paste pads 607 are clamped on the upper surfaces of the first clamping block 605 and the second clamping block 606. Then, when tightening the thread of the positioning pin 306, the first annular column 601, the second annular column 602 and the positioning pin 306 are clamped, and the positions of the first annular column 601 and the second annular column 602 are adjusted so that the first annular column 601 and the second annular column 602 can be located on the upper surface of the circuit board main body 1 and do not affect the welding of the electronic components in the first solder paste hole 2 and the plug-in stepped hole 4. At this time, the first annular column 601 and the second annular column 602 are tightened by the positioning pin 306. At this time, the solder paste pad 607 contacts the upper surface of the circuit board main body 1. The position of the Y-axis of the horizontal plane of the solder paste pad 607 is adjusted by rotating the first handrail 603, and the position of the X-axis of the horizontal plane of the solder paste pad 607 is adjusted by rotating the second handrail 604 to make the axes of the second solder paste hole 608 and the first solder paste hole 2 coincide. The support housing 706 is pushed to move along the first card slot 701 and the second card slot 702 to make the position of the heat sink 707 coincide with the position of the solder paste pad 607. At this time, the heat sink 707 dissipates heat from the soldering position, and the heat dissipation device 705 dissipates heat from the heat sink 707 to ensure the heat dissipation performance of the heat sink 707. At this time, the first solder paste hole 2 is soldered with solder paste through the solder paste pad 607 and the second solder paste hole 608, and the electronic components are welded, and at the same time, heat dissipation is carried out through the heat sink 707.

[0031] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprises", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0032] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An integrated circuit board convenient for welding, comprising a circuit board body (1). A first solder planting hole (2) and a plug-in stepped hole (4) are formed inside the circuit board body (1). An installation hole (5) is formed inside the circuit board body (1). A limiting bent hole (8) is formed inside the installation hole (5). A first welding mechanism (3) is clamped inside the installation hole (5). A second welding mechanism (6) is clamped on the outer surface of the first welding mechanism (3). A heat dissipation mechanism (7) is slidably connected inside the first welding mechanism (3), characterized in that, The welding mechanism 1 (3) includes: A bottom plate (301). A first sliding through groove (302) and a second sliding through groove (303) are clamped inside the bottom plate (301). A double-hole column (304) is clamped inside the first sliding through groove (302). A fastening bolt (305) is threadedly connected to the bottom of the double-hole column (304). A limit pin (306) is threadedly connected to the top of the double-hole column (304). The limit pin (306) is used to limit the circuit board body (1).

2. The integrated circuit board convenient for welding according to claim 1, characterized in that: The double-hole column (304) is clamped with a limit bent hole (8). The bending angle at the top of the limit bent hole (8) is greater than that at the bottom. The diameter of the first solder planting hole (2) is the same as the outer diameter of the plug-in stepped hole (4). The limit bent hole (8) is used to protect the circuit board body (1).

3. An integrated circuit board convenient for welding according to claim 1, characterized in that: The upper surface of the fastening bolt (305) is in contact with the lower surface of the bottom plate (301). The lower surface of the limit pin (306) is in contact with the upper surface of the double-hole column (304). The lower surface of the double-hole column (304) is flush with the lower surface of the bottom plate (301). The lower surface of the limit pin (306) is in contact with the upper surface of the circuit board body (1). The fastening bolt (305) is used to fix the double-hole column (304).

4. An integrated circuit board convenient for soldering according to claim 1, wherein: The welding mechanism 2 (6) includes a first annular column (601). The first annular column (601) is clamped with the limit pin (306). The limit pin (306) has a second annular column (602) clamped on its outer surface. A rotating handle 1 (603) is threadedly connected inside the first annular column (601). A first clamping block (605) is rotatably connected to the outer surface of the rotating handle 1 (603). A rotating handle 2 (604) is threadedly connected inside the second annular column (602). A second clamping block (606) is rotatably connected to the outer surface of the rotating handle 2 (604). A solder planting plate (607) is clamped on the outer surface of the first clamping block (605). A second solder planting hole (608) is formed inside the solder planting plate (607). The limit pin (306) is used to limit the first annular column (601) and the second annular column (602).

5. An integrated circuit board facilitating welding according to claim 4, characterized in that: The lower surface of the first annular column (601) is in contact with the upper surface of the second annular column (602). The outer surface of the second clamping block (606) is clamped with the solder planting plate (607). The upper surface of the solder planting plate (607) is flush with the upper surface of the first annular column (601). The rotating handle 1 (603) and the rotating handle 2 (604) are used to adjust the position of the solder planting plate (607).

6. The integrated circuit board convenient for welding according to claim 5, wherein: The lower surface of the annular column two (602) is in contact with the upper surface of the circuit board body (1). The lower surface of the solder paste printing pad (607) is in contact with the upper surface of the circuit board body (1). The diameter of the second solder paste printing hole (608) is the same as that of the first solder paste printing hole (2) and the plug-in mounting hole (5). The distance between the second solder paste printing hole (608) and the first solder paste printing hole (2) and the plug-in mounting hole (5) is the same. The second solder paste printing hole (608) is used for printing solder paste on the first solder paste printing hole (2) and the plug-in stepped hole (4).

7. An integrated circuit board convenient for soldering according to claim 1, wherein: The heat dissipation mechanism (7) includes a third clamping block (703). A first clamping groove (701) and a second clamping groove (702) are provided inside the bottom plate (301). The first clamping groove (701) is clamped with the third clamping block (703). An arc-shaped plate (704) is fixedly connected to the upper surface of the third clamping block (703). A support shell (706) is fixedly connected to the upper surface of the arc-shaped plate (704). A heat dissipation device (705) is fixedly connected to the lower surface of the support shell (706). Heat dissipation fins (707) are fixedly connected to the outer surface of the support shell (706). The heat dissipation fins (707) are used for dissipating heat from the circuit board body (1).

8. An integrated circuit board convenient for welding according to claim 7, characterized in that: The second clamping groove (702) is clamped with the third clamping block (703). The lower surface of the arc-shaped plate (704) is in contact with the upper surface of the bottom plate (301). The upper surface of the heat dissipation fins (707) is in contact with the lower surface of the circuit board body (1). The heat dissipation device (705) is composed of a motor and a fan blade. The heat dissipation device (705) is used for dissipating heat from the heat dissipation fins (707).

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