Wafer shearing force testing equipment

Abstract

The invention discloses wafer shearing force testing equipment, and relates to the technical field of microelectronic testing. A base is included; the pressing disc assembly is arranged on the base; the positioning disc is rotationally arranged on the top surface of the base; the multiple clamping block assemblies are evenly distributed in the circumferential direction of the outer circumferential wall of the positioning disc. The pressing disc assembly comprises a supporting column arranged on the base, a pressing air cylinder is arranged on the side wall of the supporting column, a top disc is arranged on a piston rod of the pressing air cylinder, and the position of the top disc corresponds to the position of the positioning disc up and down; the clamping block assembly comprises a sliding groove formed in the top face of the base, a supporting rod is arranged in the sliding groove in a sliding mode, a telescopic clamping rod is arranged on the supporting rod, a clamping block is arranged at the end, away from the supporting rod, of the telescopic clamping rod, the clamping block corresponds to the positioning disc in position, and a clamping groove is formed in the side wall, close to the positioning disc, of the clamping block. The wafer testing device has the advantages that the wafer testing device is suitable for testing wafers with various diameter sizes, the applicability is improved and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of microelectronics testing, and particularly relates to a wafer shear force testing device. Background Art

[0002] A wafer shear force testing machine is a dedicated dynamic testing instrument used in the fields of microelectronics packaging, PCBA electronic assembly manufacturing, and their failure analysis. Traditional wafer shear force testing machines are not convenient for placing and testing wafers of different diameters, reducing the diversity of testing. Summary of the Invention

[0003] Aiming at the above-mentioned technical deficiencies, the purpose of the present invention is to provide a wafer shear force testing device, which has the advantages of being applicable to the testing of wafers of various diameter sizes and improving the applicability.

[0004] To solve the above technical problems, the present invention adopts the following technical solutions: The present invention provides a wafer shear force testing device, including:

[0005] A base;

[0006] A pressing plate assembly, which is arranged on the base;

[0007] A positioning plate, which is rotatably arranged on the top surface of the base;

[0008] A clamping block assembly, there are multiple clamping block assemblies, and the multiple clamping block assemblies are circumferentially and evenly distributed along the outer peripheral wall of the positioning plate;

[0009] Among them, the pressing plate assembly includes a support column arranged on the base, a pressing cylinder is arranged on the side wall of the support column, a top plate is arranged on the piston rod of the pressing cylinder, and the position of the top plate corresponds to the position of the positioning plate up and down;

[0010] The clamping block assembly includes a chute arranged on the top surface of the base, a support rod is slidably arranged in the chute, a telescopic clamping rod is arranged on the support rod, a clamping block is arranged at the end of the telescopic clamping rod away from the support rod, the clamping block corresponds to the position of the positioning plate, and a clamping groove is arranged on the side wall of the clamping block close to the positioning plate.

[0011] Preferably, a circular ring pressing plate is arranged on the bottom surface of the top plate, a plurality of arc-shaped notch grooves one are circumferentially and evenly distributed on the outer peripheral wall of the top plate, a plurality of arc-shaped notch grooves two corresponding to the arc-shaped notch grooves one are circumferentially and evenly distributed on the outer peripheral wall of the circular ring pressing plate, and the circular ring pressing plate can make the position of the wafer placed on the positioning plate stable, thus being beneficial to improving the accuracy of the shear force test.

[0012] Preferably, the telescopic clamping rod includes:

[0013] A V-shaped rod, the V-shaped rod is rotatably connected to the side wall of the support rod through a threaded rod one with a nut;

[0014] Auxiliary adjusting rod 1;

[0015] Auxiliary adjusting rod 2, and auxiliary adjusting rod 1 and auxiliary adjusting rod 2 are respectively rotatably connected to both ends of the V-shaped opening of the V-shaped rod;

[0016] The clamping block is rotatably arranged at one end of the auxiliary adjusting rod 1 away from the V-shaped rod and one end of the auxiliary adjusting rod 2 away from the V-shaped rod. According to wafers of different diameters, the distance between the two clamping blocks is convenient for positioning the wafers.

[0017] Preferably, threaded rods 2 with nuts are penetrated through both ends of the V-shaped opening of the V-shaped rod, and the auxiliary adjusting rod 1 and the auxiliary adjusting rod 2 are respectively rotatably connected to the threaded rods 2 with nuts at corresponding positions, which is convenient for adjusting the distance between the two clamping blocks according to wafers of different diameters.

[0018] Preferably, the clamping groove is an arc-shaped structure, and arc-shaped upper cushion plates and arc-shaped lower cushion plates with matching shapes are respectively movably arranged on the top surface and the bottom surface in the clamping groove. According to wafers of different thicknesses, the arc-shaped upper cushion plates and the arc-shaped lower cushion plates can be selected before testing, so as to improve the positioning of the wafers before testing.

[0019] Preferably, an adjusting block assembly is further arranged on the side wall of the support column. The adjusting block assembly includes:

[0020] A lifting groove, and the adjusting block assembly is vertically arranged on the side wall of the support column;

[0021] A lifting cylinder, and the lifting cylinder is arranged at the bottom in the lifting groove;

[0022] An adjusting cylinder, and the adjusting cylinder is arranged on the piston rod of the lifting cylinder, and the axis line of the piston rod of the adjusting cylinder is parallel to the top surface of the positioning disk;

[0023] An adjusting block, and the adjusting block is arranged on the piston rod of the adjusting cylinder. The position of the adjusting block corresponds to the position of the positioning disk, and the side wall of the adjusting block close to the positioning disk is arc-shaped, which is convenient for adjusting the height position of the adjusting block by the lifting cylinder and realizing the position adjustment of the adjusting block according to different diameters of the wafers under the action of the adjusting cylinder.

[0024] Preferably, the top disk and the positioning disk are coaxial, and the diameter of the top disk is smaller than the diameter of the positioning disk, which is convenient for the top disk to press the wafer on the positioning disk for positioning.

[0025] Preferably, a rod seat is slidably arranged in the chute, a lifting cylinder is embedded in the rod seat, and the support rod is sleeved outside the piston rod of the lifting cylinder, which is convenient for the lifting cylinder to drive the support rod and the telescopic clamping rod to adjust the height in the vertical direction.

[0026] The beneficial effects of the present invention are as follows: 1. The present invention can clamp and fix the wafer through a plurality of telescopic clamping rods arranged. At the same time, according to the different diameters of the wafers, the position of the clamping block can be adjusted by adjusting the position of the V-shaped rod, or by using the auxiliary adjusting rod 1 or the auxiliary adjusting rod 2 alone, which is convenient for fixing the wafer and improves the applicability.

[0027] 2. The setting of the adjusting block assembly facilitates the adjustment of the height position of the adjusting block in the lifting groove through the lifting cylinder. At the same time, under the action of the adjusting cylinder, the adjusting block can be driven to expand and contract in the horizontal direction. Furthermore, according to the different diameters of the wafers, the position of the adjusting block can be adjusted, which is convenient for fixing the wafer and improves the applicability.

[0028] 3. The arc-shaped upper backing plate and the arc-shaped lower backing plate are movably arranged in the clamping groove. That is, when the thickness of the wafer is large, the arc-shaped upper backing plate and the arc-shaped lower backing plate can be removed; when the thickness of the wafer is small, the arc-shaped upper backing plate or / and the arc-shaped lower backing plate can be installed, thereby improving the positioning effect of the wafer before testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0030] Figure 1 It is a schematic structural diagram of a wafer shear force testing device provided by an embodiment of the present invention.

[0031] Figure 2 For Figure 1 The enlarged schematic diagram of the structure at A in

[0032] Figure 3 It is a schematic diagram of the position of the circular pressing plate of a wafer shear force testing device provided by an embodiment of the present invention.

[0033] Figure 4 It is a schematic diagram of the structures of the arc-shaped notch groove 1 and the arc-shaped notch groove 2 of a wafer shear force testing device provided by an embodiment of the present invention.

[0034] Figure 5 It is a schematic diagram of the structure of the clamping block assembly of a wafer shear force testing device provided by an embodiment of the present invention.

[0035] Figure 6 It is a schematic diagram of the positions of the arc-shaped upper backing plate and the arc-shaped lower backing plate of a wafer shear force testing device provided by an embodiment of the present invention.

[0036] Figure 7 Schematic diagram of the clamping groove structure after removing the arc-shaped upper backing plate and the arc-shaped lower backing plate of a wafer shear force testing device provided by an embodiment of the present invention.

[0037] Description of reference numerals: 1, base; 2, pressing disc assembly; 21, support column; 22, pressing cylinder; 23, top disc; 231, first arc-shaped notch groove; 232, second arc-shaped notch groove; 233, ring pressing disc; 3, positioning disc; 4, clamping block assembly; 41, sliding groove; 411, rod seat; 412, lifting cylinder; 42, support rod; 43, telescopic clamping rod; 431, V-shaped rod; 432, first threaded rod with nut; 433, first auxiliary adjusting rod; 434, second auxiliary adjusting rod; 435, second threaded rod with nut; 44, clamping block; 45, clamping groove; 451, arc-shaped upper backing plate; 452, arc-shaped lower backing plate; 5, adjusting block assembly; 51, lifting groove; 52, lifting cylinder; 53, adjusting cylinder; 54, adjusting block. Detailed implementation manners

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0039] Embodiment 1

[0040] As Figure 1 、 Figures 3 to 7As shown in the figure, the present invention provides a wafer shear force testing device, which includes a base 1; a pressing disc assembly 2 is arranged on the base 1; a positioning disc 3 is rotatably arranged on the top surface of the base 1; a plurality of clamping block assemblies 4 are provided, and the plurality of clamping block assemblies 4 are circumferentially and evenly distributed along the outer peripheral wall of the positioning disc 3; the pressing disc assembly 2 includes a support column 21 arranged on the base 1, a pressing cylinder 22 is arranged on the side wall of the support column 21, a top disc 23 is arranged on the piston rod of the pressing cylinder 22, and the position of the top disc 23 corresponds to the position of the positioning disc 3 up and down; the clamping block assembly 4 includes a sliding groove 41 arranged on the top surface of the base 1, a support rod 42 is slidably arranged in the sliding groove 41, a telescopic clamping rod 43 is arranged on the support rod 42, a clamping block 44 is arranged at one end of the telescopic clamping rod 43 away from the support rod 42, the clamping block 44 corresponds to the position of the positioning disc 3, and a clamping groove 45 is arranged on the side wall of the clamping block 44 close to the positioning disc 3; a circular ring pressing disc 233 is arranged on the bottom surface of the top disc 23, a plurality of arc-shaped notch grooves one 231 are circumferentially and evenly distributed on the outer peripheral wall of the top disc 23, a plurality of arc-shaped notch grooves two 232 corresponding to the arc-shaped notch grooves one 231 one by one are circumferentially and evenly distributed on the outer peripheral wall of the circular ring pressing disc 233, and the circular ring pressing disc 233 can make the position of the wafer placed on the positioning disc 3 stable, thereby being beneficial to improving the accuracy of the shear force test.

[0041] A test arm for testing a wafer is installed on the base 1 (an observation instrument can also be provided. Since both the test arm and the observation instrument are prior arts, they will not be elaborated here. They can be installed at appropriate positions on the base 1 according to the test requirements); before testing the wafer, first place the wafer on the positioning disk 3 (the position of the wafer can be rotated and adjusted on the positioning disk 3 according to the requirements of the test position); start the pressing cylinder 22 to push the top disk 23 towards the wafer, so that the ring chuck 233 on the bottom surface of the top disk 23 is in contact with the wafer, which is beneficial to preventing the wafer from shifting. At the same time, the arc-shaped notch groove 1 231 and the arc-shaped notch groove 2 232 are connected in communication, which is convenient for the test arm and the observation instrument to pass through the arc-shaped notch groove 1 231 and the arc-shaped notch groove 2 232 to act on the wafer during wafer testing, facilitating testing and observation; then, according to the different diameters of the wafers, by adjusting the positions of the clamping blocks 44 (i.e., the distance between the clamping blocks 44 in the two clamping block assemblies 4), the outer peripheral walls of the wafers are located in the clamping grooves 45 on the two clamping blocks 44, so that the wafers can be fixed; the clamping groove 45 is an arc-shaped structure, and arc-shaped upper pads 451 and arc-shaped lower pads 452 with matching shapes are respectively movably arranged on the top surface and the bottom surface in the clamping groove 45 (the arc-shaped upper pads 451 and the arc-shaped lower pads 452 can be connected to the top surface and the bottom surface in the clamping groove 45 through countersunk head bolts, which is convenient for disassembly and installation). Before testing wafers of different thicknesses, the arc-shaped upper pads 451 and the arc-shaped lower pads 452 can be selected for use, so as to improve the positioning of the wafers before testing (that is, when the thickness of the wafer is large, the arc-shaped upper pads 451 and the arc-shaped lower pads 452 can be removed; when the thickness of the wafer is small, the arc-shaped upper pads 451 or / and the arc-shaped lower pads 452 can be installed).

[0042] Embodiment 2

[0043] Based on Embodiment 1, as Figure 1 and Figure 5As shown, the telescopic clamping rod 43 includes a V-shaped rod 431. The V-shaped rod 431 is rotationally connected to the side wall of the support rod 42 through a threaded rod one 432 with a nut. The auxiliary adjusting rod one 433 and the auxiliary adjusting rod two 434 are respectively rotationally connected to both ends of the V-shaped opening of the V-shaped rod 431. The clamping block 44 is rotationally arranged at one end of the auxiliary adjusting rod one 433 away from the V-shaped rod 431 and one end of the auxiliary adjusting rod two 434 away from the V-shaped rod 431. Threaded rods two 435 with nuts are respectively arranged through both ends of the V-shaped opening of the V-shaped rod 431, and the auxiliary adjusting rod one 433 and the auxiliary adjusting rod two 434 are respectively rotationally connected to the threaded rods two 435 with nuts at corresponding positions. The top plate 23 and the positioning plate 3 are coaxial, and the diameter of the top plate 23 is smaller than that of the positioning plate 3. When the diameters of the wafers are different, the V-shaped rod 431 can be rotated around the threaded rod one 432 with a nut to adjust the positions of the V-shaped rod 431 and the clamping block 44 (or the auxiliary adjusting rod one 433 or the auxiliary adjusting rod two 434 can be used alone, that is, the threaded rod two 435 connected to the auxiliary adjusting rod two 434 or the threaded rod two 435 connected to the auxiliary adjusting rod one 433 is removed, and then the auxiliary adjusting rod one 433 or the auxiliary adjusting rod two 434 is rotated around the threaded rod two 435 with a nut to adjust the position of the clamping block 44), so that the outer peripheral walls of the wafers are all located in the clamping grooves 45 on the clamping block 44, thereby fixing the wafers.

[0044] A rod seat 411 is slidably arranged in the chute 41. A lifting cylinder 412 is embedded in the rod seat 411. The support rod 42 is sleeved outside the piston rod of the lifting cylinder 412, which is convenient for the lifting cylinder 412 to drive the support rod 42 and the telescopic clamping rod 43 to adjust the height in the vertical direction, so that the outer peripheral walls of wafers with different thicknesses can be located in the clamping grooves 45 on the clamping block 44 before testing, thereby improving the positioning effect of the wafers (a lead screw and nut assembly can be arranged in the chute 41, so that the rod seat 411 can be adjusted in position along the length direction of the chute 41 in the chute 41. The lead screw and nut assembly is a prior art, so it will not be described in detail here.

[0045] Embodiment III

[0046] On the basis of Embodiment I, as Figures 1 to 2As shown, an adjustment block assembly 5 is further provided on the side wall of the support column 21. The adjustment block assembly 5 includes a lifting groove 51 and is vertically arranged on the side wall of the support column 21. A lifting cylinder 52 is arranged at the bottom inside the lifting groove 51. An adjustment cylinder 53 is arranged on the piston rod of the lifting cylinder 52, and the axis line of the piston rod of the adjustment cylinder 53 is parallel to the top surface of the positioning disc 3. An adjustment block 54 is arranged on the piston rod of the adjustment cylinder 53. The position of the adjustment block 54 corresponds to the position of the positioning disc 3, and the side wall of the adjustment block 54 close to the positioning disc 3 is arc-shaped. It is convenient to adjust the height position of the adjustment block 54 in the lifting groove 51 through the lifting cylinder 52. Meanwhile, under the action of the adjustment cylinder 53, the adjustment block 54 can be driven to expand and contract in the horizontal direction. Furthermore, the position of the adjustment block 54 can be adjusted according to the different diameters of the wafers, which is convenient for fixing the wafers and improves the applicability.

[0047] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.

Claims

1. A wafer shear force testing device, characterized in that, Comprising: Base (1); Compression disc assembly (2), the compression disc assembly (2) is arranged on the base (1); Positioning disc (3), the positioning disc (3) is rotatably arranged on the top surface of the base (1); Clamping block assemblies (4), there are multiple clamping block assemblies (4), and the multiple clamping block assemblies (4) are circumferentially and evenly distributed along the outer peripheral wall of the positioning disc (3); Among them, the compression disc assembly (2) includes a support column (21) arranged on the base (1), a compression cylinder (22) is arranged on the side wall of the support column (21), a top disc (23) is arranged on the piston rod of the compression cylinder (22), and the position of the top disc (23) corresponds to the position of the positioning disc (3) up and down; The clamping block assembly (4) includes a chute (41) arranged on the top surface of the base (1), a support rod (42) is slidably arranged in the chute (41), a telescopic clamping rod (43) is arranged on the support rod (42), a clamping block (44) is arranged at one end of the telescopic clamping rod (43) away from the support rod (42), the clamping block (44) corresponds to the position of the positioning disc (3), and a clamping groove (45) is arranged on the side wall of the clamping block (44) close to the positioning disc (3).

2. The wafer shear force testing device according to claim 1, wherein, A circular ring pressing disc (233) is arranged on the bottom surface of the top disc (23), and a plurality of arc-shaped notch grooves one (231) are circumferentially and evenly distributed on the outer peripheral wall of the top disc (23), and a plurality of arc-shaped notch grooves two (232) corresponding to the arc-shaped notch grooves one (231) one by one are circumferentially and evenly distributed on the outer peripheral wall of the circular ring pressing disc (233).

3. The wafer shear force testing device according to claim 1, characterized in that, The telescopic clamping rod (43) includes: A V-shaped rod (431), the V-shaped rod (431) is rotatably connected to the side wall of the support rod (42) through a threaded rod one (432) with a nut; Auxiliary adjusting rod one (433); Auxiliary adjusting rod two (434), the auxiliary adjusting rod one (433) and the auxiliary adjusting rod two (434) are respectively rotatably connected to both ends of the V-shaped opening of the V-shaped rod (431); The clamping block (44) is rotatably arranged at one end of the auxiliary adjusting rod one (433) away from the V-shaped rod (431) and one end of the auxiliary adjusting rod two (434) away from the V-shaped rod (431).

4. The wafer shear force testing device according to claim 3, wherein Both ends of the V-shaped opening of the V-shaped rod (431) are penetrated with threaded rods two (435) with nuts, and the auxiliary adjusting rod one (433) and the auxiliary adjusting rod two (434) are respectively rotatably connected to the threaded rods two (435) at the corresponding positions.

5. The wafer shearing force testing device according to claim 1, wherein, The clamping groove (45) is an arc-shaped structure, and arc-shaped upper cushion plates (451) and arc-shaped lower cushion plates (452) with matching shapes are respectively movably arranged on the top surface and the bottom surface in the clamping groove (45).

6. The wafer shear force testing device according to claim 1, wherein, An adjusting block assembly (5) is further arranged on the side wall of the support column (21), and the adjusting block assembly (5) includes: A lifting groove (51), the adjusting block assembly (5) is vertically arranged on the side wall of the support column (21); A lifting cylinder (52), the lifting cylinder (52) is arranged at the bottom in the lifting groove (51); An adjusting cylinder (53), the adjusting cylinder (53) is arranged on the piston rod of the lifting cylinder (52), and the axis line of the piston rod of the adjusting cylinder (53) is parallel to the top surface of the positioning disc (3); The adjusting block (54) is arranged on the piston rod of the adjusting cylinder (53). The position of the adjusting block (54) corresponds to the position of the positioning disc (3), and the side wall of the adjusting block (54) close to the positioning disc (3) is arc-shaped.

7. The wafer shearing force testing device according to claim 2, wherein The top disc (23) is coaxial with the positioning disc (3), and the diameter of the top disc (23) is smaller than that of the positioning disc (3).

8. The wafer shear force testing device according to claim 3, characterized in that, A rod seat (411) is slidably arranged in the chute (41). A lifting cylinder (412) is embedded in the rod seat (411), and the support rod (42) is sleeved outside the piston rod of the lifting cylinder (412).

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