Stacking plate and computer equipment
Patent Information
- Application Number
- CN202380035251.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-19
- Publication Date
- 2025-07-18
AI Technical Summary
Existing motherboards need to use high-standard materials when transmitting high-speed signals, resulting in high cost and high-speed signal lines have high routing complexity, which increases design difficulty and transmission loss.
The stacking plate structure, including the motherboard and the external flexible circuit board, realizes the transmission of high -speed signals through the connector group and conductive rubber, reducing the main board's dependence on high -specification materials.
It effectively reduces the cost of the motherboard, simplifies the wiring complexity of high-speed signal lines, improves the flexibility of the motherboard design, and reduces the loss of high-speed signal transmission.
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Figure CN120345352A_ABST
Abstract
Description
Stacked boards and computer equipment Technical Field
[0001] The present application relates to the technical field of printed circuit boards, and in particular to a stacked board and a computer device. Background Art
[0002] The motherboard, also known as the main board, system board, or motherboard, is the core of a computer's hardware system and the largest printed circuit board within the computer chassis. Its primary function is to transmit various electronic signals. It houses the computer's electronic components, typically the input / output (I / O) control chip and a series of slots, such as the panel control switch slot, PCI Express graphics card slot, indicator light slot, expansion slots, and the DC power supply slot for the motherboard and add-in cards.
[0003] Among the electronic devices installed on the motherboard, some of them need to transmit high-speed signals between each other. To ensure the normal transmission of high-speed signals between the motherboards, the motherboards need to use high-specification printed circuit boards (PCBs). For example, in general, the entire PCB used in the motherboard will use low-loss (Low Loss) materials. However, using high-specification materials will result in high motherboard costs.
[0004] Summary of the Invention
[0005] In view of this, it is necessary to provide a stacking board that can reduce the cost of the mainboard while ensuring the transmission of high-speed signals of electronic devices connected between the mainboards.
[0006] A first aspect of an embodiment of the present application discloses a stacked board, the stacked board comprising: a main board and a flexible circuit board;
[0007] The motherboard is provided with a connector group and at least two slots. The connector group includes at least two electrical connectors. The slots and the electrical connectors are electrically connected via high-speed signal lines provided inside the motherboard. The slots are used to install electronic devices. The electronic devices transmit high-speed signals between the electrical connectors via the high-speed signal lines.
[0008] The flexible circuit board is electrically connected to the main board through a connector group. There is at least one electrical connector in the connector group that transmits high-speed signals to the flexible circuit board. The flexible circuit board is used to transmit the high-speed signal to the electrical connector in the connector group that is electrically connected to the electronic device for receiving the high-speed signal.
[0009] The stacking board of the embodiment of the present application includes a main board and a flexible circuit board externally connected to the main board. In the stacking board, the flexible circuit board is used to transmit high-speed signals for each electronic device installed in the main board. Since the flexible circuit board has good high-speed signal transmission performance, it can ensure the transmission of high-speed signals between the electronic devices connected between the main boards. Moreover, the main board does not need to use a PCB made of high-cost materials, which is convenient for reducing the cost of the main board.
[0010] In some embodiments, the stacked board further includes a conductive rubber, the flexible circuit board contacts one side of the conductive rubber, and the electrical connector contacts the other side of the conductive rubber, and the conductive rubber is used to electrically connect the flexible circuit board and the electrical connector for high-speed signal transmission.
[0011] The embodiment of the present application uses conductive rubber. Since conductive rubber is a soft conductive adhesive, it can not only ensure the normal electrical connection between the main board and the flexible circuit board, but also play a buffering and protective role for the main board and the flexible circuit board in the event of impact, falling, etc., so that the flexible circuit board can fit flatly to the main board and reduce the phenomenon of board bending.
[0012] In some embodiments, a first pad is provided in the flexible circuit board, and the flexible circuit board contacts one side of the conductive rubber through the first pad.
[0013] In some embodiments, the electrical connector includes at least one second pad.
[0014] In some embodiments, the electrical connector includes at least one solder ball.
[0015] In some embodiments, the main board and the flexible circuit board are stacked, and the flexible circuit board is installed with a fixing plate, which is installed on a side of the flexible circuit board facing away from the main board.
[0016] The embodiment of the present application can reduce the bending phenomenon of the flexible circuit board by installing a fixing plate on the flexible circuit board.
[0017] In some embodiments, the stacking plate includes fasteners, and the fixed plate, flexible circuit board and main board are all provided with drilled holes. The fasteners pass through the drilled holes provided in the fixed plate, flexible circuit board and main board to fasten the fixed plate, flexible circuit board and main board together.
[0018] The embodiment of the present application can accurately position the electrical connectors between the flexible circuit board and the mainboard through the fixing plate and the fasteners.
[0019] In some embodiments, the slot includes a central processing unit slot and a PCIE graphics card slot.
[0020] In some embodiments, the integrated circuit board of the mainboard adopts a medium-loss board.
[0021] The mainboard of the embodiment of the present application adopts medium-loss board material, which can reduce the manufacturing cost of the mainboard.
[0022] A second aspect of an embodiment of the present application discloses a computer device, which includes the stacking board described above. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] FIG1 is a schematic structural diagram of a stacked board including a signal transmission flow provided in one embodiment of the present application;
[0024] FIG2 is a schematic structural diagram of a stacked plate in which the electrical connector is a solder ball according to an embodiment of the present application;
[0025] FIG3 is a schematic diagram of a partially enlarged structure of FIG2 provided in one embodiment of the present application;
[0026] FIG4 is a schematic structural diagram of a stacked board in which the electrical connector is a pad according to an embodiment of the present application;
[0027] FIG5 is a schematic diagram of a partially enlarged structure of FIG4 provided in one embodiment of the present application.
[0028] Main Component Symbols Motherboard 10 Slot 11 PCIE graphics card slot 111 CPU slot 112 Connector assembly 12 Electrical connectors 121, 122 Solder balls 1211 Second solder pad 1212 Flexible circuit board 20 First solder pad 21 Electronic device 30 PCIE graphics card 31 CPU 32 Conductive rubber 40 Fixing plate 50 Fastener 60 DETAILED DESCRIPTION
[0029] The following specific embodiments illustrate the implementation of the present application. Those skilled in the art can understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this application are limited to this implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide an in-depth understanding of the present application, the following description will contain many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other unless there is a conflict.
[0030] Hereinafter, if used, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more. Directional terms such as "upper", "lower", "left", and "right" are defined relative to the orientation of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for description and clarification relative to each other, and may change accordingly according to changes in the orientation of the components placed in the drawings.
[0031] In this application, if used, unless otherwise specified or limited, the term "connected" should be understood in a broad sense. For example, "connected" can mean fixed connection, detachable connection, or integration; it can be directly connected or indirectly connected through an intermediary. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.
[0032] The motherboard houses the electronic devices that make up a computer. Its primary function is to transmit various electronic signals. If high-speed signals need to be transmitted between at least two electronic devices mounted on the motherboard, such as a PCIe graphics card and a CPU, a high-speed signal cable must be connected to the corresponding slots on the motherboard. This allows the signal to be transmitted from one electronic device to the other via the high-speed signal cable.
[0033] In the above situation, in order to enable the motherboard to smoothly transmit high-speed signals, the entire printed circuit board used in the motherboard generally uses low-loss materials. However, the use of low-loss materials will lead to high costs for the motherboard.
[0034] Moreover, connecting different electronic devices at both ends of the high-speed signal line will cause the routing length of the high-speed signal line set inside the motherboard to be longer. The electronic components set on the motherboard will also block the high-speed signal line, resulting in complex and curved routing of the high-speed signal line, making the design of the motherboard more difficult, and may also cause greater loss in high-speed signal transmission.
[0035] In view of the above, the present application proposes a stacking plate. To make the purpose, technical solution and advantages of the present application clearer, the stacking plate in the embodiment of the present application will be further described in detail below with reference to the accompanying drawings.
[0036] When the following embodiments are described in detail with reference to schematic diagrams, for ease of explanation, the diagrams showing local structures of the devices will not be partially enlarged according to general proportions, and the schematic diagrams are only examples and should not limit the scope of protection of this application.
[0037] FIG1 shows a schematic structural diagram of a stacked plate provided in an embodiment of the present application.
[0038] The stacked board includes a main board 10 and a flexible circuit board 20 externally connected to the main board 10 .
[0039] The motherboard 10 is provided with at least two slots 11, which can also be called motherboard interfaces. The slots 11 are used to install the electronic device 30 so that the electronic device 30 can be electrically connected to the motherboard 10. The two slots 11 can be a PCIE graphics card slot and a CPU slot, respectively, but are not limited thereto.
[0040] The mainboard 10 is further provided with a connector group 12 , which includes at least two electrical connectors, such as an electrical connector 121 and an electrical connector 122 .
[0041] The slot 11 and the electrical connector are electrically connected via a high-speed signal line provided inside the mainboard, so that the electronic device 30 installed in the slot can transmit high-speed signals between the electronic connector and the slot via the high-speed signal line.
[0042] For example, as shown in FIG. 2 , the PCIE graphics card slot 111 and the electrical connector 121 are electrically connected via a high-speed signal line, and the CPU slot 112 and the electrical connector 122 are electrically connected via a high-speed signal line.
[0043] The electrical connectors in the electrical connector group 12 can encapsulate the high-speed signal lines on the mainboard, and can transmit the high-speed signals on the high-speed signal lines of the mainboard 10 to the flexible circuit board 20, and transmit the high-speed signals in the flexible circuit board 20 to the mainboard 10.
[0044] The flexible circuit board 20 is electrically connected to the main board 10 through the connector group 12, wherein there is at least one electrical connector (such as electrical connector 121) in the connector group 12, which receives a high-speed signal from a slot 11 through a high-speed signal line and transmits the high-speed signal to the flexible circuit board 20. A high-speed signal line is also provided in the flexible circuit board 20. The high-speed signal line provided in the flexible circuit board 20 is used to transmit the high-speed signal received from the electrical connector (such as electrical connector 121) to the electrical connector (such as electrical connector 122) in the connector group 12 that is electrically connected to the electronic device for receiving the high-speed signal.
[0045] For example, assume that the electronic device used to receive the high-speed signal is called the target electronic device, the slot in which the target electronic device is installed is called the target slot, and the electrical connector connected to the target slot through the high-speed signal line is called the target electrical connector. The target electrical connector is the electrical connector in the connector group 12 that is electrically connected to the electronic device used to receive the high-speed signal.
[0046] The high-speed signal may be a signal whose data transmission rate is not less than a preset threshold value, and the preset threshold value may be set according to different application scenarios, signal transmission standards, and signal transmission protocols of the signal.
[0047] For example, the preset threshold is 32 Gbps. For another example, signals transmitted by USB3, PCIE-GEN5, etc. can be regarded as high-speed signals, but the present invention is not limited thereto.
[0048] In the above-mentioned stacked board, the transmission direction of the high-speed signal can be referred to as the arrow in Figure 1. The high-speed signal line can lead the high-speed signal from the main board 10 to the flexible circuit board 20. Therefore, when an electronic device installed on the main board 10 needs to send a high-speed signal to one or some electronic devices installed on the main board 10, there is no need to transmit the high-speed signal from one electronic device to another electronic device inside the main board 10. Instead, the high-speed signal is transmitted through the external flexible circuit board 20. This not only saves main board space, facilitates the arrangement of electronic components such as slots on the main board, and improves the flexibility of main board design, but also reduces the transmission loss of high-speed signals on the main board and simplifies the routing complexity of high-speed signal lines.
[0049] Furthermore, even without using a single expensive, high-specification PCB to manufacture the motherboard, the motherboard's high-speed signal transmission requirements can still be met, thereby reducing the manufacturing cost of a motherboard capable of transmitting high-speed signals. For example, the PCB used in the motherboard of the embodiment of the present application can be a medium-loss material, eliminating the need for a low-loss material.
[0050] Among them, the board grade of PCB board is divided according to the dielectric loss factor (DF).
[0051] Different substrate materials can be classified into standard loss, medium loss, low loss, very low loss, and ultra low loss according to the dielectric loss value of the substrate. The DF values corresponding to each type of board can be found in Table 1 below.
[0052] Table 1
[0053] It can be understood that the dielectric loss values corresponding to the above-mentioned types of plates are merely examples. As the plate loss standards change, the dielectric loss values corresponding to the various types of plates will also change, and the embodiments of the present application are not limited to this.
[0054] The smaller the dielectric loss value of the board, the higher the cost of the board. In the embodiment of the present application, the integrated circuit board of the mainboard uses a medium-loss board, which can transmit high-speed signals between at least two electronic devices installed on the mainboard. Compared with the integrated circuit board of the mainboard using a low-loss board, the cost of the mainboard can be reduced.
[0055] The slot 11 provided on the above-mentioned mainboard can be a hardware slot, a power supply slot, a chassis front slot, etc., but is not limited thereto.
[0056] Hardware slots may include: central processing unit (CPU) slot, memory slot, PCIE graphics card slot, M.2 slot, SATA slot, fan slot, etc.
[0057] The power supply slots include: CPU power supply, motherboard power supply, PCIE auxiliary power supply, etc.
[0058] Front slots of the chassis: power on / off button and hard disk indicator light, USB2.0 slot, USB3.0 slot, audio slot, etc.
[0059] Rear I / O slots: USB slot, video slot, network cable slot, audio slot, etc., but not limited to these.
[0060] The slot can be used to install electronic devices that match the slot model, such as the CPU slot can be used to install the CPU, the M.2 slot can be used to install the M.2 solid-state drive, the SATA slot can be used to install the SATA solid-state drive, the PCIE graphics card slot can be used to install the PCIE graphics card, etc.
[0061] The electronic devices installed in the at least two slots provided in the mainboard 10 need to transmit high-speed signals to each other.
[0062] For example, as shown in Figure 2, at least two slots of the motherboard 10 are a PCIE graphics card slot 111 and a CPU slot 112. The PCIE graphics card slot 111 is installed with a PCIE graphics card 31, and the CPU slot 112 is installed with a central processing unit 32. There is a need to transmit high-speed signals between the PCIE graphics card 31 and the central processing unit 32.
[0063] Each slot 11 on the mainboard 10 can be electrically connected to the electrical connector on the mainboard 10 one by one through a high-speed signal line.
[0064] For example, referring to Figure 2, the electrical connector 121 is electrically connected to the PCIE graphics card slot 111 through a high-speed signal line, so that the PCIE graphics card 31 can transmit the high-speed signal to the electrical connector 121 through the PCIE graphics card slot 111, or the electrical connector 121 transmits the high-speed signal to the PCIE graphics card slot 111 through the high-speed signal line, and then the PCIE graphics card slot 111 transmits the high-speed signal to the PCIE graphics card 31.
[0065] The electrical connector 122 is electrically connected to the CPU slot 112 through a high-speed signal line, so that the central processing unit 32 can transmit the high-speed signal to the electrical connector 122 through the CPU slot 112, or the electrical connector 122 transmits the high-speed signal to the CPU slot 112 through the high-speed signal line, and then the CPU slot 112 transmits the high-speed signal to the central processing unit 32.
[0066] That is, one end of the high-speed signal line is electrically connected to the slot, and the other end of the high-speed signal line is encapsulated in the electrical connector, so that on the surface of the mainboard, the high-speed signal line can form an electrical connection with the flexible circuit board 20 through the electrical connector, thereby enabling high-speed signals to be transmitted between the mainboard 10 and the flexible circuit board 20.
[0067] In some embodiments, each electrical connector in the connector group may be a cable connector.
[0068] However, there are relatively few cable connectors provided on the motherboard. Increasing the number of cable connectors will increase the cost of the motherboard.
[0069] In view of this, referring to FIG. 2 and FIG. 3 , in some embodiments, each electrical connector in the connector group may include at least one solder ball 1211 .
[0070] When high-speed signals of an electronic device need to be transmitted through multiple high-speed signal lines, each electrical connector in the mainboard may include multiple solder balls 1211 , and each solder ball 1211 is electrically connected to one high-speed signal line.
[0071] In some other embodiments, referring to FIG. 4 and FIG. 5 , the electrical connection member in the mainboard 10 may include at least one second pad 1212 (pad).
[0072] When high-speed signals of an electronic device need to be transmitted through multiple high-speed signal lines, each electrical connector in the mainboard may include multiple second solder pads 1212 , and each second solder pad 1212 is connected to a high-speed signal line.
[0073] Compared with the mainboard being connected to the flexible circuit board 20 through a cable connector, in the embodiment of the present application, a solder ball or a second solder pad can be set on the mainboard 10, and the mainboard 10 is electrically connected to the flexible circuit board through the solder ball or the second solder pad, which can reduce the cost of the mainboard.
[0074] In some embodiments, referring again to Figures 3 and 5, the stacked board further includes a conductive rubber 40. The flexible circuit board 20 contacts one side of the conductive rubber 40, and the electrical connector contacts the other side of the conductive rubber 40. The conductive rubber 40 is used to electrically connect the flexible circuit board 20 and the electrical connector, thereby electrically connecting the flexible circuit board 20 to the main board.
[0075] The conductive rubber 40 is a soft rubber, and conductive particles such as gold powder, silver powder, and copper powder may be doped into the soft rubber.
[0076] Since the conductive rubber 40 is a soft conductive rubber, the embodiment of the present application uses the conductive rubber 40 as the contact point between the mainboard 10 and the flexible circuit board 20, which not only ensures the normal electrical connection between the mainboard 10 and the flexible circuit board 20, but also provides a buffering protection for the mainboard 10 and the flexible circuit board 20 in the event of impact, falling, etc., so that the flexible circuit board 20 can fit flatly to the mainboard 10 and reduce the phenomenon of board bending.
[0077] Furthermore, in some embodiments, a plurality of first pads 21 are provided in the flexible circuit board 20 , and the flexible circuit board 20 is in contact with the conductive rubber through the first pads 21 .
[0078] In this embodiment, the first solder pad 21 is provided on the flexible circuit board 20 to facilitate electrical connection between the flexible circuit board and the main board.
[0079] Since the flexible circuit board 20 can transmit high-speed signals, a high-speed signal line is also provided inside the flexible circuit board 20. One end of the high-speed signal line provided inside the flexible circuit board 20 can be connected to the first solder pad 21, and the first solder pad 21 is electrically connected to the electrical connector 121. The other end of the high-speed signal line provided inside the flexible circuit board can be connected to another first solder pad 21, and the other first solder pad 21 is electrically connected to the electrical connector 122, so that high-speed signals can be transmitted inside the flexible circuit board 20.
[0080] The main board 10 and the flexible circuit board 20 are stacked, and the flexible circuit board 20 is installed with a fixing plate 50. The fixing plate 50 is installed on the side of the flexible circuit board 20 facing away from the main board 10. For example, the fixing plate 50 can be installed at the two opposite ends of the surface. In the stacked plate, the fixing plate 50 can be installed on the flexible circuit board 20 by a fixing device such as a clamp, or the fixing plate 50 can be installed on the flexible circuit board 20 by other means. The embodiment of the present application is not limited to this.
[0081] In this embodiment, by installing the fixing plate 50 on the flexible circuit board 20 , the bending phenomenon of the flexible circuit board can be reduced.
[0082] Furthermore, the stacked plate can also include a fastener 60, and drill holes are provided on the fixed plate 50, the flexible circuit board 20 and the main board 10. The fastener 60 passes through the fixed plate 50, the flexible circuit board 20 and the drill holes provided in the main board 10 to fasten the fixed plate 50, the flexible circuit board 20 and the main board 10 together.
[0083] In the embodiment of the present application, the fixing plate 50 and the fastener 60 can achieve precise positioning of the flexible circuit board 20 and the main board 10, so that the position of the first solder pad 21 is exactly opposite to the position of the electrical connector of the main board 10.
[0084] The mainboard 10 of the embodiment of the present application is externally connected to the flexible circuit board 20, and high-speed signals are transmitted through the flexible circuit board 20. This not only saves mainboard space, facilitates the arrangement of electronic components such as the slots 11 on the mainboard 10, and improves the flexibility of the position design of each electronic component on the mainboard, but also reduces the transmission loss of high-speed signals on the mainboard 10, simplifies the routing complexity of high-speed wiring, and also facilitates reducing the cost of the mainboard.
[0085] In addition, the stacking board of the embodiment of the present application uses conductive rubber 40 as the contact point between the main board 10 and the flexible circuit board 20, which not only ensures the normal electrical connection between the main board 10 and the flexible circuit board 20, but also plays a buffering and protective role for the main board 10 and the flexible circuit board 20 in the event of impact, falling, etc., so that the flexible circuit board 20 can fit flatly on the main board 10, reducing the board bending phenomenon.
[0086] In the embodiment of the present application, the flexible circuit board 20 contacts the conductive rubber 40 via the first solder pad, and the mainboard 10 contacts the conductive rubber 40 using solder balls or the second solder pad, thereby enabling electrical connection between the flexible circuit board 20 and the mainboard 10. Compared with electrically connecting the flexible circuit board 20 and the mainboard 10 via a cable connector, the manufacturing cost of the mainboard can be further reduced.
[0087] The present application also provides a computer device that can be integrated with the stacking board in the above embodiment.
[0088] The above description is only a specific implementation method of the present application, but the protection scope of the present application is not limited thereto. Any changes or replacements within the technical scope disclosed in the present application should be included in the protection scope of the present application.
Claims
1. A stacking plate, characterized in that: include: Mainboard and flexible circuit board; The mainboard is provided with a connector group and at least two slots, the connector group includes at least two electrical connectors, the slots and the electrical connectors are electrically connected via high-speed signal lines provided inside the mainboard, the slots are used to install electronic equipment, and the electronic equipment transmits high-speed signals to the electrical connectors via the high-speed signal lines; The flexible circuit board is electrically connected to the main board through the connector group. There is at least one electrical connector in the connector group that transmits the high-speed signal to the flexible circuit board. The flexible circuit board is used to transmit the high-speed signal to the electrical connector in the connector group that is electrically connected to the electronic device for receiving the high-speed signal.
2. The stacked plate according to claim 1, characterized in that The stacked board also includes a conductive rubber, the flexible circuit board contacts one side of the conductive rubber, the electrical connector contacts the other side of the conductive rubber, and the conductive rubber is used to electrically connect the flexible circuit board and the electrical connector for high-speed signal transmission.
3. The stacked plate according to claim 2, characterized in that A first pad is disposed in the flexible circuit board, and the flexible circuit board contacts one side of the conductive rubber through the first pad.
4. The stacked plate according to claim 1, wherein: The electrical connection member includes at least one second pad.
5. The stacked plate according to claim 1, wherein: The electrical connector includes at least one solder ball.
6. The stacked plate according to any one of claims 1 to 5, characterized in that The main board and the flexible circuit board are stacked and arranged, and the flexible circuit board is provided with a fixing plate, and the fixing plate is installed on a side of the flexible circuit board away from the main board.
7. The stacked plate according to claim 6, characterized in that The stacking plate includes fasteners, and the fixed plate, the flexible circuit board and the main board are all provided with drilled holes. The fasteners pass through the drilled holes provided in the fixed plate, the flexible circuit board and the main board to fasten and connect the fixed plate, the flexible circuit board and the main board.
8. The stacked plate according to claim 1, wherein: The slots include a central processing unit slot and a PCIE graphics card slot.
9. The stacked plate according to claim 1, wherein: The integrated circuit board of the mainboard adopts a medium-loss board.
10. A computer device, characterized in that: The computer device comprises a stack of boards as claimed in any one of claims 1 to 9.