Substrate holding apparatus and substrate processing apparatus

Abstract

The invention provides a substrate holding apparatus and a substrate processing apparatus. The light emitting section (610) emits light having a plurality of peak wavelengths different from each other. The chuck member (220) is movable between a first position (P1) and a second position (P2). The chuck member (220) holds the substrate (W) by moving from the first position (P1) to a third position (P3) between the first position (P1) and the second position (P2). The substrate holding unit (200) has a detection sensor (250) that detects information relating to the position of the chuck member (220). The light emission unit (610) emits light having a peak wavelength corresponding to the detection result of the detection sensor (250). The light receiving unit (620) transmits, to the control unit (102), a signal corresponding to the wavelength of the light received from the light emission unit (610). The control unit (102) determines the position of the chuck member (220) on the basis of the signal.

Description

Technical Field

[0001] The invention relates to a substrate holding device and a substrate processing device. Background Art

[0002] In the past, there is a known substrate processing device, which includes a substrate holding portion for holding a substrate and rotating the substrate, and a rotation drive portion for rotating the substrate holding portion (for example, see JP2016-25186A). JP2016-25186A describes a substrate processing device, which includes a rotating chamber, a plurality of chucks arranged in the rotating chamber and holding the substrate, an opening and closing mechanism for moving the plurality of chucks between a holding position for holding the substrate and a handover position for enabling substrate handover, and a fixed chamber. In addition, in the substrate processing device, a light projecting portion for irradiating light onto a movable part that moves with the movement of the plurality of chucks, and a light receiving portion for receiving light reflected on the movable part are provided in the fixed chamber. The light projecting portion irradiates light onto the movable part in the rotating chamber via the translucent part of the fixed chamber and the translucent part of the rotating chamber. The light receiving portion receives light reflected by the movable part and incident on the fixed chamber via the translucent part of the rotating chamber and the translucent part of the fixed chamber.

[0003] Then, the height position of the moving member is determined based on the amount of light received by the light receiving portion. In addition, the chuck is identified as being located at the handover position, the holding position, or the retracted position based on the height position of the moving member.

[0004] However, in substrate processing apparatuses such as those described in JP2016-25186A, condensed water droplets or substrate processing liquid may adhere to the surfaces of the translucent components of the fixed chamber and / or the translucent components of the rotating chamber. In this case, the amount of light received by the light-receiving unit decreases. Consequently, the accuracy of detecting the height position of the movable component decreases, and thus the accuracy of detecting the position of the chuck.

[0005] The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a substrate holding device and a substrate processing apparatus capable of suppressing a decrease in the detection accuracy of the position of a contact holding portion. Summary of the Invention

[0006] According to a first aspect of the present invention, a substrate holding device includes a substrate holding portion, a rotation drive portion, a holding drive portion, a light emitting portion, a light receiving portion, and a control portion. The substrate holding portion holds a substrate and rotates the substrate. The rotation drive portion rotates the substrate holding portion. At least a portion of the holding drive portion is disposed on the substrate holding portion. The light emitting portion emits light having multiple, mutually different peak wavelengths. The light receiving portion receives light from the light emitting portion. The substrate holding portion includes a rotating base and a contact holding portion. The rotating base is opposed to the substrate and has an internal space. The contact holding portion is disposed on the rotating base and holds the substrate by contacting the substrate. The contact holding portion is movable between a first position and a second position. The contact holding portion holds the substrate by moving from the first position to a third position between the first and second positions. The holding drive portion moves the contact holding portion between the first and second positions. The substrate holding portion includes a detection sensor that detects information related to the position of the contact holding portion. The light emitting portion is disposed on the substrate holding portion. The light emitting portion emits light having a peak wavelength corresponding to the detection result of the detection sensor. The light receiving portion is disposed separately from the substrate holding portion and transmits a signal corresponding to the wavelength of the light received from the light emitting portion to the control portion. The control portion determines the position of the contact holding portion based on the signal.

[0007] In one embodiment, the substrate holding device 150 includes a power supply unit for supplying power to the substrate holding portion. The power supply unit includes a power receiving unit disposed on the substrate holding portion and supplying power to the light emitting unit and the detection sensor; and a power transmitting unit disposed separately from the substrate holding portion and supplying power to the power receiving unit in a non-contact manner.

[0008] In one embodiment, the rotation drive unit stops the rotation of the substrate holding unit at a position where the power receiving unit and the power transmitting unit are opposite each other. When the power receiving unit and the power transmitting unit are opposite each other, the detection sensor detects information related to the position of the contact holding unit.

[0009] In one embodiment, the power receiving unit is positioned opposite the power transmitting unit when the light emitting unit and the light receiving unit are positioned opposite each other. The rotation drive unit stops the rotation of the substrate holding unit when the light emitting unit and the light receiving unit are positioned opposite each other. The light emitting unit emits light toward the light receiving unit when the light emitting unit and the light receiving unit are positioned opposite each other.

[0010] In one embodiment, the substrate holding unit includes a power storage unit electrically connected to the light emitting unit and the detection sensor, wherein the power storage unit supplies power to the light emitting unit and the detection sensor when power is not supplied from the power receiving unit to the light emitting unit and the detection sensor.

[0011] In one embodiment, the holding drive unit includes a lifting member disposed in the internal space and configured to rotate the contact holding member by moving in a vertical direction. The contact holding member is moved between the first position and the second position by moving the lifting member in the vertical direction and rotating the contact holding member. The detection sensor detects the vertical position of the lifting member.

[0012] According to a second aspect of the present invention, a substrate processing apparatus includes the above-mentioned substrate holding device and a nozzle configured to eject a processing liquid toward the substrate held by the substrate holding portion.

[0013] According to the present invention, it is possible to provide a substrate holding device and a substrate processing apparatus capable of suppressing a decrease in the detection accuracy of the position of the contact holding portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a side cross-sectional view schematically showing the interior of a substrate processing apparatus including the substrate holding device according to the present embodiment.

[0015] Figure 2 It is a side cross-sectional view schematically showing the structure of the substrate holding portion and its surroundings of the substrate holding device according to the present embodiment.

[0016] Figure 3 It is an enlarged plan view showing the chuck member and the substrate of the substrate holding portion.

[0017] Figure 4 It is a perspective view schematically showing a holding drive unit and a chuck member.

[0018] Figure 5 This is an enlarged perspective view schematically showing the structure of the chuck component and its surroundings.

[0019] Figure 6 It is a block diagram of a substrate processing apparatus.

[0020] Figure 7 It is a side cross-sectional view schematically showing the structure of the periphery of a substrate holding portion of a substrate holding device according to a modified example. DETAILED DESCRIPTION

[0021] Embodiments of the substrate holding device and substrate processing apparatus of the present invention are described below with reference to the accompanying drawings. It should be noted that, in the drawings, identical or corresponding parts are denoted by the same reference numerals and descriptions thereof are omitted. It should be noted that, in this specification, the Z-axis may be referred to for ease of understanding of the invention. Typically, the Z-axis is parallel to the vertical direction.

[0022] First, refer to Figure 1 A substrate processing apparatus 100 including a substrate holding device 150 according to this embodiment will be described. Figure 1 It is a side cross-sectional view schematically showing the interior of a substrate processing apparatus 100 including a substrate holding device 150 according to this embodiment.

[0023] like Figure 1 As shown, the substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface treatment, property imparting, process film formation, removal of at least a portion of a film, and cleaning.

[0024] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W is substantially disk-shaped. In this specification, the substrate processing apparatus 100 processes the substrates W one by one.

[0025] The substrate processing apparatus 100 includes a chamber 110, a substrate holding unit 200, a rotation driving unit 300, a holding driving unit 500, and a processing liquid supply unit 130. The chamber 110 accommodates at least a portion of the substrate holding unit 200, the rotation driving unit 300, the holding driving unit 500, and the processing liquid supply unit 130.

[0026] The chamber 110 is substantially box-shaped and has an internal space. The chamber 110 accommodates substrates W. In this specification, the substrate processing apparatus 100 is a single-wafer type that processes substrates W one by one, and the substrates W are accommodated in the chamber 110 one by one.

[0027] The substrate holding portion 200 holds the substrate W. The substrate holding portion 200 holds the substrate W horizontally, with the upper surface (front surface) Wa of the substrate W facing upward and the lower surface (back surface) Wb of the substrate W facing vertically downward. Furthermore, the substrate holding portion 200 rotates the substrate W while holding the substrate W. The upper surface Wa of the substrate W may also be flattened. Alternatively, a device surface or a columnar stack with grooves may be provided on the upper surface Wa of the substrate W. The detailed structure of the substrate holding portion 200 will be described later.

[0028] The rotation drive unit 300 rotates the substrate holding unit 200. The rotation drive unit 300 includes a shaft 310, an electric motor 320, and a housing 330.

[0029] The shaft 310 is, for example, a hollow shaft and extends in the vertical direction along the rotation axis AX1. The substrate holding portion 200 is coupled to the upper end portion of the shaft 310.

[0030] The electric motor 320 imparts rotational force to the shaft 310. The electric motor 320 rotates the shaft 310 in the rotational direction, thereby rotating the substrate W and the substrate holder 200 about the rotation axis AX1. A housing 330 surrounds the shaft 310 and the electric motor 320. Specifically, the housing 330 includes an upper wall 331 facing the substrate holder 200 and a side wall 332 extending downward from the periphery of the upper wall 331. An opening is formed in the center of the upper wall 331 for inserting the shaft 310. The side wall 332 has a generally cylindrical shape, surrounding the sides of the shaft 310 and the electric motor 320.

[0031] The processing liquid supply unit 130 supplies the processing liquid to the substrate W. Specifically, the processing liquid supply unit 130 supplies the processing liquid to the upper surface Wa of the substrate W held by the substrate holding unit 200 .

[0032] The processing liquid may also be an etching liquid for etching the substrate W. Examples of the etching liquid include nitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), and phosphoric acid (H3PO4). The type of etching liquid is not particularly limited and may be acidic or alkaline, for example.

[0033] Alternatively, the treatment liquid may be a rinse liquid. Examples of the rinse liquid include deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, diluted hydrochloric acid water, and reduced water (hydrogen water).

[0034] Alternatively, the treatment liquid can be an organic solvent. Typically, organic solvents are more volatile than the rinse liquid. Examples of organic solvents include isopropyl alcohol (IPA), methanol, ethanol, acetone, hydrofluoroether (HFE), propylene glycol ethyl ether (PGEE), and propylene glycol monomethyl ether acetate (PGMEA).

[0035] At least a portion of the holding drive unit 500 is disposed on the substrate holding unit 200. The holding drive unit 500 moves (rotates) a chuck member 220, which will be described later, of the substrate holding unit 200. The detailed structure of the holding drive unit 500 will be described later.

[0036] The processing liquid supply unit 130 includes a pipe 132 and a nozzle 136. The pipe 132 is used to circulate the processing liquid from the supply source. The nozzle 136 is connected to the downstream end of the pipe 132. It should be noted that the processing liquid supply unit 130 may also include, for example, a valve for opening and closing the flow path in the pipe 132 and / or a pump (not shown) for delivering the processing liquid from the supply source. The processing liquid circulates in the nozzle 136, so that the nozzle 136 sprays the processing liquid onto the upper surface Wa of the substrate W. It should be noted that the processing liquid supply unit 130 may also have a plurality of nozzles 136 for respectively spraying a plurality of processing liquids.

[0037] Furthermore, the nozzle 136 is configured to be movable relative to the substrate W. Specifically, the substrate processing apparatus 100 includes a moving mechanism (not shown) that moves the nozzle 136 in the horizontal direction and / or the vertical direction relative to the substrate W. For example, the moving mechanism includes a ball screw mechanism and an electric motor that provides driving force to the ball screw mechanism.

[0038] The substrate processing apparatus 100 further includes a cup portion 180. The cup portion 180 recovers processing liquid splashed from the substrate W. The cup portion 180 is movable. For example, while the processing liquid supply portion 130 is supplying processing liquid to the substrate W, the cup portion 180 is vertically raised to the side of the substrate W. In this case, the cup portion 180 recovers processing liquid splashed from the substrate W due to the rotation of the substrate W. Furthermore, when the processing liquid supply portion 130 ends its supply of processing liquid to the substrate W, the cup portion 180 is lowered vertically downward from the side of the substrate W.

[0039] The substrate processing apparatus 100 includes a power supply unit 400. The power supply unit 400 supplies power to the substrate holding unit 200. Specifically, the power supply unit 400 includes a power transmitting unit 410 and a power receiving unit 420. The power transmitting unit 410 is disposed below the substrate holding unit 200. In this embodiment, the power transmitting unit 410 is disposed in the rotation drive unit 300. On the other hand, the power receiving unit 420 is disposed in the substrate holding unit 200. The power transmitting unit 410 and the power receiving unit 420 are disposed separately from each other. The power transmitting unit 410 supplies power to the power receiving unit 420 in a non-contact manner. The detailed structure of the power supply unit 400 will be described later.

[0040] The substrate processing apparatus 100 includes a light emitting unit 610 and a light receiving unit 620. The light emitting unit 610 emits light having a plurality of different peak wavelengths. The light emitting unit 610 is disposed in the substrate holding unit 200. In the present embodiment, the light emitting unit 610 is disposed in an internal space S of the substrate holding unit 200, which will be described later. The light receiving unit 620 is disposed separately from the substrate holding unit 200. The light receiving unit 620 is disposed outside the rotation base 210 of the substrate holding unit 200, which will be described later. In the present embodiment, the light receiving unit 620 is disposed within the rotation drive unit 300.

[0041] The light emitting portion 610 includes a plurality of light emitting elements that emit light having different peak wavelengths. The light emitting elements are, for example, LEDs (light emitting diodes). The number of light emitting elements may be two or more. In this embodiment, the number of light emitting elements is three. For example, the light emitting portion 610 includes a red light emitting element that emits red light, a green light emitting element that emits green light, and a blue light emitting element that emits blue light.

[0042] The light receiving unit 620 receives light from the light emitting unit 610. The light receiving unit 620 transmits a signal corresponding to the wavelength of the received light to the control device 101 described later. Specifically, the light receiving unit 620 includes a plurality of light receiving elements that detect light having different wavelengths. The light receiving element includes, for example, a photodiode. The photodiode includes, for example, a color filter. The number of light receiving elements can be, for example, two or more. In this embodiment, the number of light receiving elements is three. For example, the light receiving unit 620 includes a red light receiving element that detects red light, a green light receiving element that detects green light, and a blue light receiving element that detects blue light.

[0043] The substrate processing apparatus 100 includes a control device 101. The control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 includes a processor. The control unit 102 may include, for example, a central processing unit (CPU). Alternatively, the control unit 102 may include a general-purpose arithmetic unit. It should be noted that the control unit 102 is an example of a "control unit" in the present invention.

[0044] Storage unit 104 includes a primary storage device and an auxiliary storage device. The primary storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. Storage unit 104 may also include removable media. Control unit 102 executes the computer program stored in storage unit 104 to perform substrate processing operations.

[0045] The storage unit 104 stores data. The data includes process data. The process data includes information indicating a plurality of processes. The plurality of processes respectively define the processing content and processing steps of the substrate W.

[0046] In this embodiment, the substrate holding unit 200 , the rotation drive unit 300 , the power supply unit 400 , the holding drive unit 500 , the light emitting unit 610 , the light receiving unit 620 , and the control device 101 constitute a substrate holding device 150 .

[0047] Next, refer to Figure 2 and Figure 3 The substrate holding portion 200 will be further described. Figure 2 It is a side cross-sectional view schematically showing the structure of the substrate holding portion 200 and its surroundings of the substrate holding device 150 according to the present embodiment.

[0048] like Figure 2 As shown, the substrate holding portion 200 includes a rotating base 210 and a chuck component 220. It should be noted that the chuck component 220 is an example of the "contact holding portion" of the present invention. The rotating base 210 has, for example, a hollow, roughly disc-shaped, hollow, roughly cylindrical, or hollow, annular shape. The rotating base 210 is opposite to the substrate W. The rotating base 210 has a diameter slightly larger than that of the substrate W. Specifically, the rotating base 210 has an upper wall 211, an inner wall 212, an outer wall 213, and a bottom wall 214.

[0049] The upper wall 211 has a generally circular plate that is opposed to the lower surface Wb of the substrate W. A circular opening is formed in the center of the upper wall 211. The inner wall 212 has a generally cylindrical shape and extends downward from the inner peripheral edge of the upper wall 211. The outer wall 213 has a generally cylindrical shape and extends downward from the outer peripheral edge of the upper wall 211. In this embodiment, for example, the upper wall 211, the inner wall 212, and the outer wall 213 are formed from a single component. The bottom wall 214 has a generally circular plate that covers the lower portion of the upper wall 211. A circular opening is formed in the center of the bottom wall 214. The bottom wall 214 connects the inner wall 212 and the outer wall 213. Furthermore, an internal space S is formed by the upper wall 211, the inner wall 212, the outer wall 213, and the bottom wall 214. In this embodiment, the internal space S is a closed space. For example, a sealing member (not shown) is disposed between the bottom wall 214 and the inner wall 212 , and a sealing member (not shown) is disposed between the bottom wall 214 and the outer wall 213 .

[0050] The chuck member 220 is mounted on the spin base 210. Typically, the spin base 210 is provided with a plurality (here, six) of chuck members 220. The lower portion of the chuck member 220 is housed in the interior space S, and the upper portion of the chuck member 220 protrudes outside the interior space S. The chuck member 220 is disposed around the substrate W and abuts against the outer periphery of the substrate W to hold the substrate W horizontally.

[0051] Specifically, the chuck assembly 220 includes a rotational axis 221 extending in the vertical direction and a chuck portion 222 fixed to the upper end of the rotational axis 221. The chuck assembly 220 rotates about a rotational axis AX2 extending in the vertical direction. The rotational axis AX2 is the central axis of the rotational axis 221. The chuck portion 222 extends in the radial direction of the rotational axis 221. The chuck portion 222 includes a support portion 222a that supports the lower surface Wb of the substrate W and a pressing portion 222b that presses the upper surface Wa of the substrate W. The support portion 222a and the pressing portion 222b are formed so that the distance between them increases as they approach the radially outer side of the rotational axis 221.

[0052] Figure 3 FIG is an enlarged top view showing the chuck member 220 of the substrate holding portion 200 and the substrate W. Figure 3 As shown in FIG, the chuck member 220 can move (rotate) between the first position P1 and the second position P2. In addition, the chuck member 220 contacts and holds (grips) the substrate W by moving from the first position P1 to the third position P3. The third position P3 is a position between the first position P1 and the second position P2. It should be noted that in order to simplify the drawings, Figure 3 In FIG. 2 , the chuck member 220 moved to the first position P1 and the second position P2 is drawn with a two-dot chain line.

[0053] Specifically, the first position P1 is a position where the chuck member 220 does not hold (grip) the substrate W. In this embodiment, the first position P1 is, for example, a position where a transport mechanism (not shown) and the chuck member 220 transfer the substrate W. It should be noted that the first position P1 may also be a position where the chuck member 220 and the substrate W are separated. The chuck member 220 may also support the substrate W in the first position P1.

[0054] The second position P2 is a position on the opposite side of the first position P1 relative to the third position P3. In addition, the second position P2 is a position where the chuck member 220 cannot hold (hold) the substrate W or transfer the substrate W. It should be noted that when the substrate W is arranged at the transfer position ( Figure 3 ), the chuck member 220 cannot move to the second position P2.

[0055] The third position P3 is a position where the chuck member 220 comes into contact with the outer peripheral edge of the substrate W and holds (grips) the substrate W.

[0056] Next, refer to Figure 4 and Figure 5 The holding drive unit 500 will be further described. Figure 4 It is a perspective view schematically showing the holding drive unit 500 and the chuck member 220 . Figure 52 is an enlarged perspective view schematically showing the structure of the chuck component 220 and its surroundings. Figure 4 In order to simplify the drawings, the cam plate 551 and the protrusion 223 described later are omitted.

[0057] like Figure 2 and Figure 4 As shown, the holding drive unit 500 includes a first lifting plate 510, a second lifting plate 520, a force applying member 530, and a lifting device 540. It should be noted that the first lifting plate 510 is an example of a "lifting member" in the present invention. The first lifting plate 510 and the force applying member 530 are arranged in the internal space S of the rotating base 210. The first lifting plate 510 is arranged in a lifting and lowering state by a guide mechanism (not shown). In addition, an annular driven magnet 511 is provided on the lower surface of the first lifting plate 510.

[0058] A plurality of biasing members 530 are arranged between the upper wall 211 and the first elevating plate 510. The biasing members 530 bias the first elevating plate 510 downward.

[0059] The second lifting plate 520 and the lifting device 540 are arranged in the housing 330 of the rotation drive unit 300. The second lifting plate 520 is arranged directly below the first lifting plate 510. The second lifting plate 520 is arranged to be movable upward and downward by a guide mechanism (not shown).

[0060] An annular driving magnet 521 is provided on the upper surface of the second lifting plate 520. The driving magnet 521 is arranged to repel the driven magnet 511. Specifically, the driving magnet 521 and the driven magnet 511 are arranged so that their opposing surfaces have the same polarity.

[0061] The lifting device 540 moves the second lifting plate 520 in the vertical direction. The lifting device 540 includes, for example, an air cylinder or a motor. In this embodiment, the second lifting plate 520 is connected to, for example, a piston rod of an air cylinder.

[0062] When the lifting device 540 is driven to raise the second lifting plate 520, the first lifting plate 510 is also raised due to the mutually repelling action of the driving magnet 521 and the driven magnet 511. On the other hand, when the lifting device 540 is driven to lower the second lifting plate 520, the first lifting plate 510 is also lowered due to its own weight and the action of the biasing member 530.

[0063] It should be noted that the driven magnet 511 and the driving magnet 521 do not need to be annular. For example, a plurality of magnets may be provided on each of the first lifting plate 510 and the second lifting plate 520 so as to enable the lifting operation of the first lifting plate 510.

[0064] like Figure 5 As shown, the drive unit 500 (see Figure 1 ) has a cam 550. A plurality of cams 550 (here, six) are provided corresponding to the chuck members 220. The cams 550 are arranged in the internal space S of the rotation base 210. The cams 550 are provided on the first lifting plate 510 so as to protrude radially outward from the outer peripheral edge of the first lifting plate 510.

[0065] The cam 550 has a plate-shaped cam plate 551 and a connecting portion 552. The connecting portion 552 connects the cam plate 551 to the first lifting plate 510. The cam plate 551 has a guide hole 551a extending in an oblique downward direction. Here, the chuck component 220 has a protrusion 223 protruding radially outward from the rotating shaft 221. The protrusion 223 is, for example, an axis having a cylindrical or polygonal shape. The front end of the protrusion 223 of the chuck component 220 engages with the guide hole 551a. Therefore, when the first lifting plate 510 is raised or lowered, the protrusion 223 moves along the guide hole 551a extending in an oblique downward direction, and the chuck component 220 rotates around the rotation axis AX2. Therefore, the rotation angle position of the chuck component 220 is determined by the height position of the first lifting plate 510.

[0066] Specifically, when the first lifting plate 510 is located at the uppermost position within the movable range in the vertical direction, the protrusion 223 is located at the lowermost portion of the guide hole 551a of the cam plate 551. At this time, the chuck member 220 is located at the first position P1 (see FIG. Figure 3 In this state, the substrate W can be transferred between a transfer mechanism such as a transfer arm (not shown) and the chuck member 220. Hereinafter, the height position of the substrate W when the transfer mechanism and the chuck member 220 transfer the substrate W is sometimes referred to as the transfer height.

[0067] When the first lifting plate 510 is lowered from the uppermost position of the movable range while the transport mechanism (not shown) positions the substrate W at the delivery height, the protrusion 223 moves obliquely upward from the lowermost portion of the guide hole 551a of the cam plate 551, and the chuck member 220 moves (rotates) clockwise when viewed from above. Furthermore, the chuck member 220 contacts the outer periphery of the substrate W and holds (grips) the substrate W. At this point, the chuck member 220 is located at the third position P3 (see FIG. Figure 3 ). In addition, at this time, the movement (rotation) of the chuck member 220 stops, and the protrusion 223 is located in the middle of the guide hole 551a (see Figure 5 position) stops, and the descending of the first lifting plate 510 stops.

[0068] Furthermore, when the transport mechanism (not shown) does not position the substrate W at the handover height, and the first lifting plate 510 descends from the uppermost position within its movable range, the protrusion 223 moves obliquely upward from the lowermost portion of the guide hole 551a of the cam plate 551, and the chuck member 220 moves (rotates) clockwise when viewed from above. At this time, since the chuck member 220 does not contact the outer periphery of the substrate W, the protrusion 223 reaches the uppermost portion of the guide hole 551a of the cam plate 551. At this time, the chuck member 220 reaches the second position P2 (see FIG. 2 ). Figure 3 ). In addition, at this time, the movement (rotation) of the chuck member 220 stops, and the descent of the first lifting plate 510 stops.

[0069] Continue to refer to Figure 2 , further illustrating the substrate holding portion 200. Figure 2 As shown, the substrate holding portion 200 includes a detection sensor 250. The detection sensor 250 is disposed in the internal space S. The detection sensor 250 is a sensor for detecting the position of the chuck member 220. The detection sensor 250 detects information related to the position of the chuck member 220. In this embodiment, the information related to the position of the chuck member 220 includes, for example, the height position (vertical position) of the first lifting plate 510.

[0070] Specifically, the detection sensor 250 is arranged at a position directly below the first lifting plate 510. The detection sensor 250 is a distance measuring sensor that measures the distance to the first lifting plate 510. The detection sensor 250 has, for example, a light-emitting element that emits light and a light-receiving element that receives reflected light. It should be noted that the detection sensor 250 can also be a distance measuring sensor that is arranged at a position directly above the first lifting plate 510. The detection sensor 250 sends the detection result to the control device 240 described later. By measuring the distance to the first lifting plate 510 by the detection sensor 250, the height position of the first lifting plate 510 can be calculated. Therefore, since the rotational angle position of the chuck component 220 can be calculated, it is possible to calculate whether the chuck component 220 is located at the first position P1, the second position P2, and the third position P3.

[0071] The light emitting portion 610 is disposed, for example, above the bottom wall 214 of the substrate holding portion 200. A window 214a is formed in the bottom wall 214 below the light emitting portion 610. The window 214a is translucent to the light emitted from the light emitting portion 610.

[0072] The light receiving unit 620 is disposed, for example, below the upper wall 331 of the rotation drive unit 300. A window 331a is formed above the light receiving unit 620 in the upper wall 331. The window 331a is translucent to the light emitted from the light emitting unit 610.

[0073] The substrate holder 200 also includes a control device 240 for controlling the various components of the substrate holder 200. In this embodiment, the control device 240 is housed within the internal space S of the rotating base 210. In this embodiment, the power receiving portion 420 is configured to be smaller than the radius of the rotating base 210 when viewed from above. Therefore, it is easy to secure space for the control device 240 within the internal space S of the rotating base 210. According to the configuration of this embodiment, even in a configuration without wiring connecting the exterior and interior of the rotating base 210, the various components of the substrate holder 200 can be easily controlled and driven by the control device 240. The control device 240 controls the various components of the substrate holder 200. In this embodiment, the control device 240 controls the light emitting portion 610. The control device 240 is configured using, for example, a microcomputer. Details of the control device 240 will be described later.

[0074] Next, refer to Figure 2 The power supply unit 400 is further described. Figure 2 As shown, the power transmission unit 410 is disposed in the rotation drive unit 300. The power transmission unit 410 includes a power transmission coil wound around a predetermined central axis (not shown).

[0075] Specifically, the power transmission unit 410 is disposed within the rotation drive unit 300. In this embodiment, the power transmission unit 410 is disposed below the upper wall 331 of the rotation drive unit 300. The power transmission unit 410 is disposed substantially horizontally and substantially parallel to the upper wall 331. It should be noted that at least the portion of the upper wall 331 above the power transmission unit 410 is formed of, for example, resin.

[0076] The center of the power transmission unit 410 is disposed at a predetermined position at a predetermined distance from the rotation axis AX1 of the substrate holding unit 200. One power transmission unit 410 is provided around the rotation axis AX1.

[0077] The power receiving unit 420 is electrically connected to the light emitting unit 610, the control device 240, and the detection sensor 250, and supplies power to the light emitting unit 610, the control device 240, and the detection sensor 250. The power receiving unit 420 is disposed on the substrate holding unit 200. The power receiving unit 420 includes a power receiving coil wound around a predetermined central axis (not shown).

[0078] Specifically, the power receiving unit 420 is disposed in the interior space S of the rotating base 210. In this embodiment, the power receiving unit 420 is disposed above the bottom wall 214 of the substrate holding unit 200. The power receiving unit 420 is disposed substantially horizontally and substantially parallel to the bottom wall 214. It should be noted that at least the portion of the bottom wall 214 below the power receiving unit 420 is formed of, for example, resin.

[0079] Furthermore, the center of the power receiving unit 420 is positioned at a predetermined distance from the rotation axis AX1 of the substrate holder 200. The power receiving unit 420 is located about the rotation axis AX1. The distance from the center of the power receiving unit 420 to the rotation axis AX1 is equal to the distance from the center of the power transmitting unit 410 to the rotation axis AX1. Therefore, when the substrate holder 200 rotates, the power receiving unit 420 and the power transmitting unit 410 may or may not be vertically opposed.

[0080] When the substrate holder 200 is positioned at the reference angular position in the rotational direction, the power receiving unit 420 and the power transmitting unit 410 are vertically opposed, and the central axis (not shown) of the power receiving unit 420 is substantially aligned with the central axis (not shown) of the power transmitting unit 410. Furthermore, when the substrate holder 200 is positioned at the reference angular position in the rotational direction, the light emitting unit 610 and the light receiving unit 620 are vertically opposed. In this embodiment, when the light emitting unit 610 and the light receiving unit 620 are vertically opposed, the power receiving unit 420 and the power transmitting unit 410 are also vertically opposed.

[0081] Next, refer to Figure 6 The substrate processing apparatus 100 will be further described. Figure 6 2 is a block diagram of the substrate processing apparatus 100 .

[0082] like Figure 6 As shown, the control unit 102 controls the rotation drive unit 300, the processing liquid supply unit 130, the cup unit 180, the power supply unit 400, and the holding drive unit 500. Specifically, the control unit 102 controls the rotation drive unit 300, the processing liquid supply unit 130, the cup unit 180, the power supply unit 400, and the holding drive unit 500 by sending control signals to the rotation drive unit 300, the processing liquid supply unit 130, the cup unit 180, the power supply unit 400, and the holding drive unit 500.

[0083] The control unit 102 controls the start of rotation of the substrate holder 200, changes in rotation speed, and stopping of rotation of the substrate holder 200 by controlling the rotation drive unit 300. For example, the control unit 102 can control the electric motor 320 of the rotation drive unit 300 to stop the substrate holder 200 at a reference angle position. In other words, the rotation drive unit 300 stops the rotation of the substrate holder 200 when the light emitting unit 610 and the light receiving unit 620 are facing each other. It should be noted that the method for stopping the substrate holder 200 at the reference angle position is not particularly limited. For example, a sensor may be provided to detect whether the substrate holder 200 is at the reference angle position, and based on the detection result of the sensor, the control unit 102 stops the substrate holder 200 at the reference angle position. Alternatively, for example, the control unit 102 may stop the substrate holder 200 at the reference angle position based on the output of the power supply unit 400.

[0084] The control unit 102 controls the processing liquid supply unit 130 to cause the nozzle 136 to discharge the processing liquid toward the substrate W or to stop the discharge of the processing liquid.

[0085] The control unit 102 controls the cup unit 180 to move the cup unit 180 relative to the substrate W. Specifically, while the processing liquid supply unit 130 is supplying processing liquid to the substrate W, the control unit 102 causes the cup unit 180 to rise vertically upward to the side of the substrate W. Furthermore, when the processing liquid supply unit 130 ends supplying processing liquid to the substrate W, the control unit 102 causes the cup unit 180 to fall vertically downward from the side of the substrate W.

[0086] The control unit 102 controls the holding drive unit 500 to raise and lower the second lifting plate 520, thereby rotating the chuck member 220. Specifically, the control unit 102 controls the lifting device 540 to lower the second lifting plate 520, thereby holding (gripping) the substrate W by the chuck member 220. Furthermore, the control unit 102 controls the lifting device 540 to raise the second lifting plate 520, thereby releasing the chuck member 220 from holding (gripping) the substrate W.

[0087] The control unit 102 controls the power supply unit 400 to supply power to the substrate holding unit 200. Specifically, the control unit 102 controls the power supply unit 400 to supply power from the power transmission unit 410 to the power reception unit 420 in a contactless manner.

[0088] In this embodiment, when the substrate holding unit 200 is stopped from rotating, the control unit 102 controls the power supply unit 400 to supply power from the power transmitting unit 410 to the power receiving unit 420. Specifically, when the substrate holding unit 200 is stopped at the reference angle position, the control unit 102 controls the power supply unit 400 to supply power from the power transmitting unit 410 to the power receiving unit 420. Therefore, when the power transmitting unit 410 and the power receiving unit 420 are facing each other and power is supplied from the power transmitting unit 410 to the power receiving unit 420, the detection sensor 250 can detect information related to the position of the chuck member 220. It should be noted that in this embodiment, when the substrate holding unit 200 is rotating, power is not supplied from the power transmitting unit 410 to the power receiving unit 420.

[0089] The control device 240 of the substrate holding unit 200 includes a control unit 242 and a storage unit 244. The control unit 242 includes a processor. The control unit 242 includes, for example, a central processing unit (CPU). Alternatively, the control unit 242 may include a general-purpose computing unit.

[0090] Storage unit 244 includes a primary storage device and an auxiliary storage device. The primary storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. Storage unit 244 may also include removable media. Control unit 242 executes the computer program stored in storage unit 244 and controls light emitting unit 610.

[0091] When power is supplied from the power receiving unit 420 to the control unit 242, the detection sensor 250, and the light emitting unit 610, the control unit 242 controls the detection sensor 250 to detect the height position of the first lifting plate 510. The control unit 242 receives the detection result from the detection sensor 250. Furthermore, the control unit 242 controls the light emitting unit 610 to emit light having a peak wavelength corresponding to the detection result from the detection sensor 250.

[0092] Specifically, the control unit 242 calculates the height position of the first elevating plate 510 based on the detection result of the detection sensor 250. Furthermore, the control unit 242 determines the position of the chuck member 220 based on the height position of the first elevating plate 510. In other words, the control unit 242 determines whether the chuck member 220 is located at the first position P1, the second position P2, or the third position P3.

[0093] Then, with the light emitting portion 610 and the light receiving portion 620 facing each other, the control unit 242 controls the light emitting portion 610 to emit light toward the light receiving portion 620. Furthermore, the control unit 242 controls the light emitting portion 610 to emit light having a peak wavelength corresponding to the position of the chuck member 220. In this embodiment, for example, the first position P1 corresponds to red light, the second position P2 corresponds to green light, and the third position P3 corresponds to blue light. Therefore, when the control unit 242 determines that the chuck member 220 is at the first position P1, the light emitting portion 610 is controlled to emit red light. When the control unit 242 determines that the chuck member 220 is at the second position P2, the light emitting portion 610 is controlled to emit green light. When the control unit 242 determines that the chuck member 220 is at the third position P3, the light emitting portion 610 is controlled to emit blue light.

[0094] The control unit 102 determines the position of the chuck member 220 based on the signal from the light receiving unit 620. Specifically, when the light emitting unit 610 emits light, the light receiving unit 620 receives the light from the light emitting unit 610 and transmits a signal corresponding to the wavelength of the received light to the control unit 102. The control unit 102 then receives the signal from the light receiving unit 620 and, based on the received signal, determines whether the chuck member 220 is located at the first position P1, the second position P2, or the third position P3.

[0095] In this embodiment, as described above, the light emitting unit 610 emits light having a peak wavelength corresponding to the detection result of the detection sensor 250, and the light receiving unit 620 transmits a signal corresponding to the wavelength of the light received from the light emitting unit 610 to the control unit 102. Furthermore, the control unit 102 determines the position of the chuck member 220 based on the signal from the light receiving unit 620. Therefore, even if the amount of light received by the light receiving unit 620 decreases due to condensed water droplets and / or processing liquid adhering to the surface of the window 214a and / or the surface of the window 331a, the light receiving unit 620 still transmits a signal corresponding to the wavelength of the received light to the control unit 102, thereby suppressing a decrease in the detection accuracy of the position of the chuck member 220 caused by the control unit 102.

[0096] Furthermore, as described above, the power supply unit 400 includes the power receiving unit 420 disposed on the substrate holding unit 200, and the power transmitting unit 410 disposed separately from the substrate holding unit 200 and supplying power to the power receiving unit 420 in a non-contact manner. Therefore, power can be easily supplied to the substrate holding unit 200. Furthermore, since power is supplied to the power receiving unit 420 in a non-contact manner, unlike when using contact-type components such as springs, the generation of dust associated with wear of contact-type components can be suppressed.

[0097] Furthermore, the power receiving unit 420 is housed within the internal space S of the spin base 210. Therefore, unlike, for example, a case where the power receiving unit 420 is located outside the spin base 210, there is no need to provide a through-hole in the spin base 210 for wiring that passes from the power receiving unit 420 to the detection sensor 250 and the light emitting unit 610. This prevents ambient air from entering the spin base 210. Consequently, it prevents the ambient air from adversely affecting components within the spin base 210, such as the detection sensor 250, the light emitting unit 610, and / or the power receiving unit 420. This embodiment is particularly effective in substrate processing apparatuses 100 that use processing fluids such as etching solutions.

[0098] Furthermore, as described above, the rotation drive unit 300 stops the rotation of the substrate holding unit 200 when the power receiving unit 420 and the power transmitting unit 410 are opposed to each other. Then, with the power receiving unit 420 and the power transmitting unit 410 opposed to each other, the detection sensor 250 detects information related to the position of the chuck member 220. Therefore, while the detection sensor 250 detects information related to the position of the chuck member 220, power can be easily supplied from the power transmitting unit 410 via the power receiving unit 420 to the detection sensor 250.

[0099] Furthermore, as described above, the rotation drive unit 300 stops the rotation of the substrate holding unit 200 at a position where the power receiving unit 420 and the power transmitting unit 410 are opposed to each other. Then, with the light emitting unit 610 and the light receiving unit 620 opposed to each other, the light emitting unit 610 emits light toward the light receiving unit 620. Therefore, while the light emitting unit 610 emits light toward the light receiving unit 620, power can be easily supplied from the power transmitting unit 410 via the power receiving unit 420 to the light emitting unit 610.

[0100] Furthermore, as described above, the holding drive unit 500 includes the first elevating plate 510 disposed in the internal space S and configured to rotate the chuck member 220 by moving in the vertical direction, and the detection sensor 250 detects the vertical position of the first elevating plate 510. Therefore, the position of the chuck member 220 can be easily determined by detecting the vertical position of the first elevating plate 510 by the detection sensor 250.

[0101] (Variation)

[0102] Next, refer to Figure 7 A substrate holding device 150 according to a modified example of the present invention will be described. Figure 7 1 is a side cross-sectional view schematically showing the structure of the substrate holding portion 200 and its surroundings of a modified example of the substrate holding device 150. In this modified example, unlike the above-described embodiment, an example in which the substrate holding portion 200 includes an electricity storage portion 700 will be described.

[0103] like Figure 7 As shown, the substrate holding portion 200 includes a power storage unit 700 for storing electricity. The power storage unit 700 is a battery. The type of the power storage unit 700 is not particularly limited, and for example, it is a lithium-ion battery. It should be noted that the power storage unit 700 may also be a primary battery.

[0104] The power storage unit 700 is housed in the internal space S of the substrate holding unit 200. The power storage unit 700 is connected to the detection sensor 250 and the light emitting unit 610 via the wiring 710. In other words, the power storage unit 700 is electrically connected to the detection sensor 250 and the light emitting unit 610. Figure 7 In order to simplify the drawing, the wiring 710 connecting the power storage unit 700 and the detection sensor 250 is omitted.

[0105] In this modification, power storage unit 700 is connected to control unit 242 via wiring (not shown). Power storage unit 700 is controlled by control unit 242.

[0106] Furthermore, in this modified example, when the power storage unit 700 does not supply power from the power receiving unit 420 to the detection sensor 250 and the light emitting unit 610, power is supplied to the detection sensor 250 and the light emitting unit 610. Specifically, when power is not supplied from the power receiving unit 420 to the detection sensor 250 and the light emitting unit 610 due to, for example, a power outage, the control unit 242 controls the power storage unit 700 to supply power from the power storage unit 700 to the detection sensor 250 and the light emitting unit 610. Therefore, even if, for example, a power outage occurs during the raising and lowering of the first lifting plate 510, the position of the chuck member 220 can be easily detected.

[0107] It should be noted that when power is not supplied to the detection sensor 250 and the light emitting unit 610, the method by which the control unit 242 determines whether the cause of the failure is a power outage or the like or the rotation of the substrate holder 200 is not particularly limited. For example, a power supply unit 400 capable of transmitting and receiving signals between the power transmitter 410 and the power receiver 420 may be used. Furthermore, when the substrate holder 200 is rotated, a rotation signal indicating the rotation of the substrate holder 200 may be transmitted from the power transmitter 410 to the power receiver 420, and the control unit 242 may determine whether the substrate holder 200 has stopped based on the rotation signal. Alternatively, an acceleration sensor may be provided on the substrate holder 200, and the control unit 242 may determine whether the substrate holder 200 has stopped based on the detection results of the acceleration sensor. Alternatively, a detection sensor may be provided to detect the rotational angular position of the substrate holder 200, and the control unit 242 may determine whether the substrate holder 200 has stopped based on the detection results of the detection sensor.

[0108] In this modification, power storage unit 700 is connected to power receiving unit 420 via wiring 710. Control unit 242 controls power receiving unit 420 to supply excess power from power receiving unit 420 to power storage unit 700. This prevents the remaining power (level) of power storage unit 700 from becoming zero.

[0109] The other configurations and other effects of the modified example are the same as those of the above-described embodiment.

[0110] The embodiments and modifications of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the above-mentioned embodiments and modifications, and can be implemented in various ways without departing from the gist thereof. In addition, various inventions can be formed by appropriately combining the multiple components disclosed in the above-mentioned embodiments and modifications. For example, several components can be deleted from all the components shown in the embodiments and modifications. In addition, the components of different embodiments and modifications can also be appropriately combined. For ease of understanding, the accompanying drawings mainly schematically illustrate the various components. For ease of drawing, there are cases where the thickness, length, number, spacing, etc. of the various components shown in the drawings are different from the actual ones. In addition, the materials, shapes, sizes, etc. of the various components shown in the above-mentioned embodiments and modifications are examples and are not particularly limited. Various changes can be made within the scope of the effects of the present invention.

[0111] For example, in the above embodiment, as an example of the light emitting portion 610 emitting light having multiple, different peak wavelengths corresponding to the positions of the chuck member 220, the light emitting portion 610 has a red light emitting element, a green light emitting element, and a blue light emitting element corresponding to the first position P1, the second position P2, and the third position P3 of the chuck member 220, respectively. However, the present invention is not limited to this. In other words, the light emitting portion 610 has an example of having the same number of light emitting elements as the number of positions of the chuck member 220 (here, three). However, the present invention is not limited to this. For example, the number of light emitting elements in the light emitting portion 610 may be less than the number of positions of the chuck member 220. Specifically, for example, the light emitting portion 610 may have a red light emitting element and a green light emitting element, so that the first state of emitting only red light, the second state of emitting only green light, and the third state of emitting both red and green light correspond to the three positions of the chuck member 220, respectively.

[0112] In the above embodiment, the light emitting unit 610 is described as emitting three types of light (red light, green light, and blue light) having different peak wavelengths. However, the present invention is not limited thereto. For example, the light emitting unit 610 may emit two types of light, or four or more types of light, having different peak wavelengths.

[0113] In the above embodiment, the detection sensor 250 is described as a distance measuring sensor that measures the distance to the first lifting plate 510. However, the present invention is not limited to this. For example, the detection sensor 250 may be a magnetic sensor or a light-shielding sensor that includes a light-emitting element and a light-receiving element and detects light shielding.

[0114] In addition, in the above embodiment, an example in which the information related to the position of the chuck component 220 includes the height position of the first lifting plate 510 is described. In other words, an example in which the detection sensor 250 detects the height position of the first lifting plate 510 is described. However, the present invention is not limited to this. For example, the information related to the position of the chuck component 220 may also include the rotation angle of the chuck component 220. In other words, the detection sensor 250 may also be a sensor that detects the rotation angle of the chuck component 220. In addition, the information related to the position of the chuck component 220 may also be other information.

[0115] In addition, for example, in the above embodiment, an example in which the chuck member 220 moves between the first position and the second position by rotating is described, but the present invention is not limited to this. For example, a mechanism that converts rotational motion into linear motion may be provided to cause the chuck member to move linearly between the first position and the second position. In addition, for example, the holding drive unit may include a linear motor, and the chuck member may move between the first position and the second position by linear motion.

[0116] Furthermore, for example, in the above embodiment, the center of the power transmitting unit 410 and the center of the power receiving unit 420 are arranged at a predetermined distance from the rotation axis AX1 of the substrate holder 200, but the present invention is not limited to this arrangement. For example, the center of the power transmitting unit 410 and the center of the power receiving unit 420 may also be substantially aligned with the rotation axis AX1 of the substrate holder 200. In other words, the power transmitting unit 410 may include a power transmitting coil wound around the rotation axis AX1, and the power receiving unit 420 may include a power receiving coil wound around the rotation axis AX1. With this configuration, the power transmitting unit 410 and the power receiving unit 420 always face each other, regardless of whether the substrate holder 200 is rotating. Therefore, power can be supplied from the power transmitting unit 410 to the power receiving unit 420 even while the substrate holder 200 is rotating.

[0117] Furthermore, for example, in the above embodiment, an example in which the detection sensor 250 is disposed in the internal space S of the spin base 210 has been described. However, the detection sensor 250 may be disposed outside the spin base 210 .

[0118] The present invention is suitable for use in a substrate holding device and a substrate processing device.

[0119] This application claims priority based on Japanese Patent Application No. 2024-018439 filed on February 9, 2024, the entire contents of which are incorporated into this specification by reference.

Claims

1. A substrate holding device, characterized in that: include: a substrate holding portion that holds a substrate and rotates the substrate; a rotation drive unit that rotates the substrate holding unit; a holding drive portion, at least a portion of which is disposed on the substrate holding portion; a light emitting portion that emits light having a plurality of peak wavelengths different from each other; a light receiving portion that receives light from the light emitting portion; and Control Department, The substrate holding portion comprises: a rotating base, which is opposite to the substrate and has an inner space; and a contact holding portion, which is disposed on the rotation base and holds the substrate by contacting the substrate; The contact holding portion is movable between a first position and a second position. The contact holding portion holds the substrate by moving from the first position to a third position between the first position and the second position. The holding drive unit moves the contact holding unit between the first position and the second position. The substrate holding portion includes a detection sensor for detecting information related to the position of the contact holding portion. The light emitting portion is disposed on the substrate holding portion and emits light having a peak wavelength corresponding to the detection result of the detection sensor. The light receiving unit is disposed separately from the substrate holding unit and transmits a signal corresponding to the wavelength of the light received from the light emitting unit to the control unit. The control unit determines the position of the contact holding portion based on the signal.

2. The substrate holding device according to claim 1, wherein A power supply unit for supplying power to the substrate holding unit is provided, The power supply unit has: a power receiving unit disposed on the substrate holding unit and supplying power to the light emitting unit and the detection sensor; as well as The power transmitting section is disposed separately from the substrate holding section and supplies power to the power receiving section in a non-contact manner.

3. The substrate holding device according to claim 2, wherein: The rotation drive unit stops the rotation of the substrate holding unit at a position where the power receiving unit and the power transmitting unit are opposed to each other. The detection sensor detects information related to the position of the contact holding portion in a state in which the power receiving portion and the power transmitting portion are opposed to each other.

4. The substrate holding device according to claim 2 or 3, characterized in that: In a state where the light emitting unit and the light receiving unit are facing each other, the power receiving unit and the power transmitting unit are facing each other, The rotation drive unit stops the rotation of the substrate holding unit in a state where the light emitting unit and the light receiving unit are facing each other. The light emitting section emits light toward the light receiving section in a state where the light emitting section and the light receiving section are opposed to each other.

5. The substrate holding device according to claim 2 or 3, characterized in that: The substrate holding portion includes an electricity storage portion electrically connected to the light emitting portion and the detection sensor. When power is not supplied from the power receiving unit to the light emitting unit and the detection sensor, the power storage unit supplies power to the light emitting unit and the detection sensor.

6. The substrate holding device according to any one of claims 1 to 3, characterized in that: The holding drive unit includes a lifting member disposed in the internal space and configured to rotate the contact holding unit by moving in the vertical direction. The contact holding portion is moved between the first position and the second position by moving the lifting member in the vertical direction and rotating the contact holding portion. The detection sensor detects the vertical position of the lifting member.

7. A substrate processing device, characterized in that: include: The substrate holding device according to claim 1; as well as A nozzle ejects a processing liquid toward the substrate held by the substrate holding portion.

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