Test device and test method of array substrate

Abstract

The invention discloses a test device and a test method of an array substrate. The array substrate comprises a plurality of sub-pixels and a lighting circuit, each sub-pixel comprises a pixel electrode and a thin film transistor, and the lighting circuit comprises a first input end used for transmitting signals to the control end of the thin film transistor and a second input end used for transmitting signals to the first end of the thin film transistor. The second end of the thin film transistor is electrically connected with the pixel electrode; the testing device comprises a control module and a connection module. The connection module is used for being electrically connected with a first input end and a second input end of the lighting circuit and a pixel electrode corresponding to a thin film transistor to be tested; and the control module is used for outputting corresponding test voltage to the pixel electrode corresponding to the thin film transistor to be tested and the first input end and the second input end of the lighting circuit through the connecting module, and detecting the current of the pixel electrode corresponding to the thin film transistor to be tested. According to the invention, the test accuracy of the array substrate can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of array substrate testing, and in particular to a testing device and a testing method for an array substrate. Background Art

[0002] Liquid crystal displays (LCDs) have important applications in the display technology field, and performance requirements for these devices are increasingly stringent. After the array substrate in an LCD device is fabricated, the pixel switches (thin-film transistors) of the sub-pixels within the array substrate need to be tested to obtain their IV (current-voltage) curves.

[0003] The performance of pixel switches cannot be detected by optical means. In the related art, pixel switches identical to those in the display area of the array substrate are manufactured in the blank area of the array substrate, and the performance of the pixel switches in the display area is judged by detecting the pixel switches in the blank area.

[0004] However, since the process equipment of the array substrate cannot make the pixel switches in the blank area and the display area completely uniform, there are differences in the electrical performance of the pixel switches in the blank area and the display area, resulting in low test accuracy. Summary of the Invention

[0005] The present invention provides a testing device and a testing method for an array substrate, so as to improve the accuracy of array substrate testing.

[0006] According to one aspect of the present invention, a testing device for an array substrate is provided. The array substrate includes a plurality of sub-pixels and a lighting circuit. Each sub-pixel includes a pixel electrode and a thin film transistor. The lighting circuit includes a first input terminal for transmitting a signal to a control terminal of the thin film transistor and a second input terminal for transmitting a signal to the first terminal of the thin film transistor. The second terminal of the thin film transistor is electrically connected to the pixel electrode.

[0007] The test device includes a control module and a connection module; the connection module is used to electrically connect to the first input terminal, the second input terminal of the lighting circuit and the pixel electrode corresponding to the thin film transistor to be tested;

[0008] The control module is used to output the corresponding test voltage to the pixel electrode corresponding to the thin film transistor to be tested, the first input end and the second input end of the lighting circuit through the connection module, and detect the current of the pixel electrode corresponding to the thin film transistor to be tested.

[0009] Optionally, the lighting circuit further includes a first control terminal and a second control terminal, the first control terminal being used to input a control signal for controlling the conduction state between the first input terminal and the control terminal of the thin film transistor; the second control terminal being used to input a control signal for controlling the conduction state between the second input terminal and the first terminal of the thin film transistor;

[0010] The connection module is further configured to be electrically connected to the first control terminal and the second control terminal; and the control module is further configured to output corresponding control signals to the first control terminal and the second control terminal through the connection module.

[0011] Optionally, the connection module includes: a driving probe module and at least one measuring probe;

[0012] The measuring probe is electrically connected to the control module, and the measuring probe is used to be electrically connected to the pixel electrode;

[0013] The driving probe module includes a plurality of fixedly connected driving probes, the driving probes are electrically connected to the control module, and the plurality of driving probes are used to be electrically connected to the first input end, the second input end, the first control end, and the second control end respectively.

[0014] Optionally, the connection module further includes:

[0015] A movable track, a first gantry mechanism, a second gantry mechanism and a rotatable carrier;

[0016] The rotatable carrier is used to carry the array substrate; the first gantry mechanism and the second gantry mechanism are slidably connected to the movable track;

[0017] A first lifting unit is slidably connected to the first gantry mechanism, and the driving probe module is connected to the first lifting unit; a second lifting unit is slidably connected to the second gantry mechanism, and the measuring probe is connected to the second lifting unit.

[0018] Optionally, the first lifting unit includes: a first lifting motor, a first fixed bracket, a first obtuse-angle rotating bracket, a first pressure adjustment spring structure, and a first downward pressure height adjustment structure;

[0019] The first fixed bracket includes a first crossbeam and a first support beam; the first lifting motor is fixedly connected to the first crossbeam; one end of the first support beam is fixedly connected to the first crossbeam, and the other end of the first support beam is rotatably connected to the first rotation axis of the first obtuse-angle rotating bracket; the first arm of the first obtuse-angle rotating bracket is fixedly connected to the driving probe module, the second arm of the first obtuse-angle rotating bracket is fixedly connected to the first contact electrode, and the first downward pressure height adjustment structure is fixedly connected to the second contact electrode; the first contact electrode and the second contact electrode are both connected to the control module, and the first contact electrode contacts the second contact electrode after the driving probe module contacts the array substrate; the control module is used to output a corresponding test voltage to the driving probe module after the first contact electrode contacts the second contact electrode;

[0020] The first pressure adjustment spring structure is used to adjust the distance between the first support arm and the first beam; the first downward pressure height adjustment structure is used to adjust the distance between the first contact electrode and the second contact electrode.

[0021] Optionally, the second lifting unit includes: a second lifting motor, a second fixed bracket, a second obtuse-angle rotating bracket, a second pressure adjustment spring structure, and a second downward pressure height adjustment structure;

[0022] The second fixed bracket includes a second crossbeam and a second support beam; the second lifting motor is fixedly connected to the second crossbeam; one end of the second support beam is fixedly connected to the second crossbeam, and the other end of the second support beam is rotatably connected to the second rotation axis of the second obtuse-angle rotating bracket; the third arm of the second obtuse-angle rotating bracket is fixedly connected to the measuring probe, the fourth arm of the second obtuse-angle rotating bracket is fixedly connected to the third contact electrode, and the second downward pressure height adjustment structure is fixedly connected to the fourth contact electrode; the third contact electrode and the fourth contact electrode are both connected to the control module, and the third contact electrode contacts the fourth contact electrode after the driving probe module contacts the array substrate; the control module is used to output a corresponding test voltage to the measuring probe after the third contact electrode contacts the fourth contact electrode;

[0023] The second pressure adjustment spring structure is used to adjust the distance between the third support arm and the second crossbeam; the second downward pressure height adjustment structure is used to adjust the distance between the third contact electrode and the fourth contact electrode.

[0024] Optionally, the testing device further includes a signal switching module;

[0025] The control module includes a first output terminal for connecting to the first input terminal, a second output terminal for connecting to the second input terminal, and a third output terminal for connecting to the first control terminal and the second control terminal; the signal switching switch module includes: a first switch group, a second switch group and a third switch group, each of the switch groups includes a plurality of switches corresponding to the plurality of driving probes;

[0026] The first ends of the multiple switches in the first switch group are electrically connected to the first output end of the control module, and the second ends of the multiple switches are electrically connected to the multiple driving probes in a one-to-one correspondence;

[0027] The first ends of the multiple switches in the second switch group are electrically connected to the second output end of the control module, and the second ends of the multiple switches are electrically connected to the multiple driving probes in a one-to-one correspondence;

[0028] The first ends of the multiple switches in the third switch group are electrically connected to the third output end of the control module, and the second ends of the multiple switches are electrically connected to the multiple driving probes in a one-to-one correspondence.

[0029] Optionally, the top of the measuring probe is a spherical structure; and / or,

[0030] The top of the driving probe is a spherical structure.

[0031] Optionally, the connection module further includes an L-shaped limit block, and the L-shaped limit block is arranged at a top corner of the rotatable platform.

[0032] According to another aspect of the present invention, a method for testing an array substrate is provided, which is performed by the array substrate testing device described above. The method includes:

[0033] Electrically connecting the connection module to the first input terminal, the second input terminal of the lighting circuit and the pixel electrodes corresponding to the thin film transistor to be tested;

[0034] The control module outputs a corresponding test voltage to the pixel electrode corresponding to the thin film transistor to be tested, the first input terminal and the second input terminal of the lighting circuit through the connection module, and detects the current of the pixel electrode corresponding to the thin film transistor to be tested.

[0035] The technical solution of the embodiment of the present invention adopts a test device for an array substrate, which includes a control module and a connection module; the connection module is used to electrically connect to the first input terminal, the second input terminal of the lighting circuit, and the pixel electrode corresponding to the thin film transistor to be tested; the control module is used to output the corresponding test voltage to the pixel electrode corresponding to the thin film transistor to be tested, the first input terminal and the second input terminal of the lighting circuit through the connection module, and detect the current of the pixel electrode corresponding to the thin film transistor to be tested. The test device can directly test the thin film transistors in the display area of the array substrate without making the test thin film transistors in the blank area of the array substrate, thereby greatly improving the test accuracy. In addition, the area of the pixel electrode and the pad in the connection area is large, and the thin film transistor is tested by transmitting signals to the pixel electrode and the corresponding pad in the connection area. The difficulty of electrically connecting the connection module to the array substrate is relatively low, and the requirements for the accuracy and size of the connection module are also relatively low, which has a low cost.

[0036] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0038] Figure 1 A schematic structural diagram of an array substrate provided by an embodiment of the present invention;

[0039] Figure 2 A schematic structural diagram of a testing device for an array substrate provided by an embodiment of the present invention;

[0040] Figure 3 A schematic diagram of a test device for an array substrate provided by an embodiment of the present invention connected to an array substrate;

[0041] Figure 4 A test timing diagram of a test device for an array substrate provided in an embodiment of the present invention;

[0042] Figure 5 A schematic structural diagram of another array substrate testing device provided by an embodiment of the present invention;

[0043] Figure 6 A top view of a connection module provided in an embodiment of the present invention;

[0044] Figure 7 Another top view of a connection module provided by an embodiment of the present invention;

[0045] Figure 8 A top view of a rotatable stage provided in an embodiment of the present invention;

[0046] Figure 9 A cross-sectional view of a rotatable carrier provided in an embodiment of the present invention;

[0047] Figure 10 A schematic structural diagram of a first lifting unit provided in an embodiment of the present invention;

[0048] Figure 11 A schematic structural diagram of a second lifting unit provided in an embodiment of the present invention;

[0049] Figure 12 A schematic diagram of the circuit structure of another array substrate testing device provided by an embodiment of the present invention;

[0050] Figure 13 The present invention provides a flow chart of a method for testing an array substrate. DETAILED DESCRIPTION

[0051] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0052] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0053] Figure 1 A schematic structural diagram of an array substrate provided by an embodiment of the present invention is shown. Figure 2 A schematic structural diagram of a testing device for an array substrate provided by an embodiment of the present invention is shown. Figure 3 A schematic diagram of a test device for an array substrate provided by an embodiment of the present invention connected to an array substrate, with reference to FIG. Figures 1 to 3 The array substrate includes a plurality of sub-pixels SP and a lighting circuit 13. Each sub-pixel SP includes a pixel electrode 11 and a thin film transistor 12. The lighting circuit 13 includes a first input terminal 141 for transmitting a signal to a control terminal of the thin film transistor 12, and a second input terminal 142 for transmitting a signal to a first terminal of the thin film transistor 12. The second terminal of the thin film transistor 12 is electrically connected to the pixel electrode 11.

[0054] Specifically, the array substrate can be an array substrate corresponding to a liquid crystal display panel. The display panel can be formed by combining the array substrate with a liquid crystal box and a backlight module. The array substrate has a display area AA and a non-display area that at least partially surrounds the display area AA. The display area AA is provided with a plurality of data lines (DL1-DLn) and a plurality of scan lines (GL1-GLk). The intersection of the data lines and the scan lines defines an area corresponding to the sub-pixel SP. Each sub-pixel SP includes a thin film transistor 12 and a pixel electrode 11. The control end of the thin film transistor 12 is electrically connected to the scan line, and the first end of the thin film transistor 12 is electrically connected to the data line. When the scan line corresponding to the sub-pixel SP is scanned by a scan signal, the thin film transistor 12 is turned on, and the voltage on the data line can be written to the pixel electrode 11. The pixel electrode 11 and the common electrode (not shown) generate an electric field, causing the liquid crystal molecules to rotate, thereby generating grayscale light corresponding to the voltage on the data line.

[0055] The array substrate is also provided with a lighting circuit 13, which is used to test whether the array substrate can work normally. Figure 1 As shown, the lighting circuit 13 includes a connection area 14, and a plurality of pads are provided in the connection area 14. The pads are used to receive signals from an external lighting test device, and then perform a lighting test on the array substrate. The specific structure and specific working principle of the lighting test circuit are well known to those skilled in the art and will not be repeated here. In order to facilitate the explanation of the working principle of the test device of the array substrate, the present embodiment illustrates a brief structure of the lighting circuit 13. The lighting circuit 13 may specifically include a pad for transmitting a signal to the data line (i.e., the second input terminal described herein), wherein the specific number of pads included in the second input terminal 142 is not limited. For example, in some embodiments, all data lines are connected to one pad, and the second input terminal 142 includes one pad. In other embodiments, the data lines corresponding to the same color sub-pixel are connected to the same pad, and the data lines corresponding to different color sub-pixels are connected to different pads; e.g. Figure 1As shown, the data lines corresponding to the red sub-pixels are connected to the same pad, the data lines corresponding to the green sub-pixels are connected to the same pad, and the data lines corresponding to the blue sub-pixels are connected to the same pad. The second input terminal 142 includes three pads. Of course, in other embodiments, the second input terminal 142 may also include other numbers of pads. When a signal is input to the second input terminal 142, the first terminals of all thin-film transistors 12 can receive the signal.

[0056] The connection area 14 also includes a first input terminal 141 for transmitting signals to the scan line, and thus to the control terminal of the thin film transistor 12. The first input terminal 141 may also include multiple pads. For example, the first input terminal 141 is electrically connected to the scan line through the gate drive circuit 15. The first input terminal 141 includes pads for controlling the output signal of the gate drive circuit 15. For example, the first input terminal 141 includes pads corresponding to the clock signal required by the gate drive circuit 15 and pads corresponding to the power signal required by the gate drive circuit 15. By controlling the signal level of the first input terminal 141, the signal level on the scan line can be controlled.

[0057] like Figure 2 As shown, the test device includes a control module 21 and a connection module 22; the connection module 22 is used to electrically connect to the first input terminal 141, the second input terminal 142 of the lighting circuit 13 and the pixel electrode 11 corresponding to the thin film transistor to be tested; the control module 21 is used to output the corresponding test voltage to the pixel electrode 11 corresponding to the thin film transistor to be tested, the first input terminal 141 and the second input terminal 142 of the lighting circuit 13 through the connection module 22, and detect the current of the pixel electrode 11 corresponding to the thin film transistor to be tested.

[0058] Specifically, if Figure 3 As shown, when a thin film transistor 12 of the array substrate needs to be tested to obtain the IV curve of the thin film transistor 12, the connection module 22 can be electrically connected to the corresponding first input terminal 141, the second input terminal 142 and the pixel electrode 11. At this time, the first input terminal 141, the second input terminal 142 and the pixel electrode 11 can receive the test voltage transmitted by the control module 21. Subsequently, the control module 21 transmits the corresponding test voltage to the second input terminal 142 and the pixel electrode 11 corresponding to the thin film transistor to be tested. Figure 4 As shown, Figure 4A test timing diagram of a test device for an array substrate provided in an embodiment of the present invention. During the test process, the control module 21 transmits a first test voltage V142 to the second input terminal 142 and a second test voltage V11 to the pixel electrode 11. Both the first test voltage V142 and the second test voltage V11 are direct current. The first test voltage V142 can be 0V, applied to the first terminal (i.e., the source) of the thin-film transistor 12; the second test voltage V11 can be 10V, applied to the second terminal (i.e., the drain) of the thin-film transistor 12. The control module 21 also transmits an alternating current (AC) third test voltage V141 to the first input terminal 141. The third test voltage V141 can vary in steps of 1V / s within a range of -25V to 25V. During the test process, the control module 21 detects the current in the pixel electrode 11, i.e., the source-drain current Ids of the thin-film transistor, thereby obtaining electrical parameters of the thin-film transistor to be tested. These electrical parameters may include the turn-on voltage, turn-on current, turn-off current, and electron mobility of the thin-film transistor 12.

[0059] In summary, the array substrate testing device of this embodiment can directly test the thin-film transistors 12 in the display area AA of the array substrate, eliminating the need to fabricate test thin-film transistors 12 in a blank area of the array substrate. This greatly improves test accuracy. Furthermore, the pixel electrode 11 is typically located at the very top of the array substrate, requiring no other film structures, and has a relatively large area relative to the scan and data lines. The pads in the connection area 14 also have a sufficiently large area relative to the scan and data lines. Therefore, the connection module 22 of this embodiment is relatively easy to electrically connect to the array substrate, and the requirements for the connection module's precision and size are also relatively low, resulting in lower costs.

[0060] The technical solution of this embodiment adopts a test device for an array substrate, which includes a control module and a connection module; the connection module is used to electrically connect to the first input terminal, the second input terminal of the lighting circuit, and the pixel electrode corresponding to the thin film transistor to be tested; the control module is used to output the corresponding test voltage to the pixel electrode corresponding to the thin film transistor to be tested, the first input terminal and the second input terminal of the lighting circuit through the connection module, and detect the current of the pixel electrode corresponding to the thin film transistor to be tested. The test device can directly test the thin film transistors in the display area of the array substrate without making the test thin film transistors in the blank area of the array substrate, thereby greatly improving the test accuracy. In addition, the area of the pixel electrode and the pad in the connection area is large, and the thin film transistor is tested by transmitting signals to the pixel electrode and the corresponding pad in the connection area. The difficulty of electrically connecting the connection module to the array substrate is relatively low, and the requirements for the accuracy and size of the connection module are also relatively low, which has a low cost.

[0061] It should be noted that the testing device can be used to monitor the array section of a display panel, that is, after the array substrate is manufactured. For example, it can perform random inspections on thin-film transistors in any area. It can also be used to perform electrical analysis on display panels, display modules, or lighting problems discovered by the client, facilitating subsequent improvement.

[0062] Alternatively, as Figure 1 and Figure 3 As shown, the lighting circuit 13 also includes a first control terminal 143 and a second control terminal 144. The first control terminal 143 is used to input a control signal for controlling the conduction state between the first input terminal 141 and the control terminal of the thin film transistor 12; the second control terminal 144 is used to input a control signal for controlling the conduction state between the second input terminal 142 and the first terminal of the thin film transistor 12.

[0063] Specifically, in some embodiments, the first input terminal 141 is not directly electrically connected to the gate drive circuit 15, but is electrically connected to the gate drive circuit 15 through a corresponding control switch. Similarly, the second input terminal 142 is not directly electrically connected to the data line, but is electrically connected to the data line through a corresponding control switch. Therefore, when the thin film transistor 12 needs to be tested, each control switch needs to be turned on. It should be noted that the number of pads in the first control terminal 143 and the number of pads in the second control terminal are not limited, and whether different control switches correspond to different pads is not limited. Figure 1 and Figure 3 The quantitative relationship between the first control terminal 143, the second control terminal 144 and the corresponding control switches is only for illustration and does not constitute a limitation to the present invention.

[0064] In some embodiments, the lighting test circuit can be used to control the conduction of each control switch, that is, the lighting test circuit and the test device can be used to complete the test of the thin film transistor.

[0065] In other embodiments, such as Figure 1 and Figure 3 As shown, the connection module 22 is further used to be electrically connected to the first control terminal 143 and the second control terminal 144 ; the control module 21 is further used to output corresponding control signals to the first control terminal 143 and the second control terminal 144 through the connection module 22 .

[0066] Specifically, in this embodiment, the testing device can independently complete the test of the thin film transistor 12 in the array substrate with the control switch. Figure 3 and Figure 4As shown, when testing the thin film transistor 12, the connection module 22 is electrically connected to the first control terminal 143 and the second control terminal 144, so that the control module 21 is electrically connected to the first control terminal 143 and the second control terminal 144. Furthermore, by applying a first control voltage V143 to the first control terminal 143 and a second control voltage V144 to the second control terminal 144, the corresponding control switch is turned on. Both the first control voltage V143 and the second control voltage V144 can be 20V.

[0067] Optionally, continue to refer to Figure 2 and Figure 3 The connection module 22 includes a driving probe module 221 and at least one measuring probe 222. The measuring probe 222 is electrically connected to the control module 21 and is used to electrically connect to the pixel electrode 11. The driving probe module 221 includes a plurality of fixedly connected driving probes. The driving probes are electrically connected to the control module 21 and are used to electrically connect to the first input terminal 141, the second input terminal 142, the first control terminal 143, and the second control terminal 144, respectively.

[0068] Specifically, in this embodiment, the connection module 22 is electrically connected to the array substrate through a probe, that is, the electrical connection can be achieved by contacting the probe with the corresponding position of the array substrate. The measuring probe 222 is independent of the driving probe module 221, that is, the measuring probe 222 can move independently, so that the thin film transistor 12 at any position in the array substrate can be tested. The multiple driving probes in the driving probe module 221 are fixedly connected. It can be understood that the driving probes that transmit the same signal can be electrically connected, while the driving probes that transmit different signals are insulated. The multiple driving probes in the driving probe module 221 move together when moving. The distance between the driving probes can be the same as the distance between the pads in the connection area 14 on the array substrate. In this embodiment, the number of driving probes in the driving probe module 221 is the same as the number of pads that need to be connected, that is, each driving probe is connected to one pad. The pads in the connection area 14 are relatively concentrated, and the relative positions of the pads on the same batch of array substrates are the same. Therefore, by fixing multiple drive probes, when testing the array substrate, the drive probe module 221 and the multiple pads can be aligned as a whole, eliminating the need for multiple alignments, thereby greatly improving testing efficiency. Each measurement probe 222 can test a corresponding pixel electrode 11.

[0069] Of course, it can be understood that in some other embodiments, the multiple driving probes can also move independently.

[0070] Optionally, Figure 5 A schematic structural diagram of another array substrate testing device provided by an embodiment of the present invention is shown. Figure 6A top view of a connection module provided in an embodiment of the present invention, referring to Figure 5 and Figure 6 The connection module 22 further includes: a movable rail 227, a first gantry mechanism 224, a second gantry mechanism 225 and a rotatable platform 223; the rotatable platform 223 is used to support the array substrate 31; the first gantry mechanism 224 and the second gantry mechanism 225 are slidably connected to the movable rail 227; the first gantry mechanism 224 is connected to a first lifting unit 41, and the driving probe module 221 is connected to the first lifting unit 41; the second gantry mechanism 225 is slidably connected to a second lifting unit 42, and the measuring probe 222 is connected to the second lifting unit 42.

[0071] Specifically, the movable track 227 extends along the second direction Y. That is, the first gantry mechanism 224 and the second gantry mechanism 225 can slide along the second direction Y. For different array substrates, the position of the display area AA may be different, and the position of the connection area 14 may also be different. In this embodiment, by providing the movable track 227 and the gantry mechanism, the gantry mechanism can be moved in the second direction Y so that the corresponding probe can be aligned with the pad or pixel electrode 11 in the second direction Y.

[0072] In addition, a first lifting unit 41 is slidably connected to the first gantry mechanism 224, one end of the first lifting unit 41 is slidably connected to the first gantry mechanism 224, and the other end is connected to the drive probe module 221. The first lifting unit 41 can slide on the first gantry mechanism 224 along the first direction X. The first direction X intersects with the second direction Y; further, the first direction X is perpendicular to the second direction Y. For different array substrates, the position of the display area AA may be different, and the position of the connection area 14 may also be different. In this embodiment, by setting the first lifting unit 41 to slide along the first direction X on the first gantry mechanism 224, the corresponding drive probe can be aligned with the pad in the connection area 14 in the first direction X.

[0073] Similarly, a second lifting unit 42 is slidably connected to the second gantry mechanism 225. One end of the second lifting unit 42 is slidably connected to the second gantry mechanism 224, and the other end is connected to the measurement probe 222. The second lifting unit 42 can slide on the second gantry mechanism 225 along the first direction X. For different array substrates, the position of the display area AA may vary, and the position of the connection area 14 may also vary. In this embodiment, by arranging the second lifting unit 42 to slide along the first direction X on the second gantry mechanism 225, the corresponding measurement probe 222 can be aligned with the pixel electrode 11 in the display area AA in the first direction X.

[0074] In addition, the first lifting unit 41 can lift the driving probe module 221. During the movement of the first gantry mechanism 224 and the sliding of the first lifting unit 41 along the first direction X, the first lifting unit 41 pulls up the driving probe module 221 to prevent the driving probe module 221 from contacting the array substrate 31 and scratching the array substrate 31. After the driving probe module 221 is aligned with the pads in the connection area 14 in the first direction X and the second direction Y, the first lifting unit 41 controls the driving probe module 221 to descend so as to align with the pads in the connection area 14. Similarly, the second lifting unit 42 can lift the measuring probe 222. During the movement of the second gantry mechanism 225 and the sliding of the second lifting unit 42 along the first direction X, the second lifting unit 42 pulls up the measuring probe 222 to prevent the measuring probe 222 from contacting the array substrate 31 and scratching the array substrate 31. After the measuring probe 222 is aligned with the pixel electrode of the thin film transistor to be tested in the first direction X and the second direction Y, the second lifting unit 42 controls the measuring probe 222 to descend so as to be aligned with the pixel electrode 11 .

[0075] The rotatable carrier 223 can rotate within a range of at least 270 degrees. After the array substrate 31 is placed on the rotatable carrier 223, the arrangement direction of the pads in the connection area 14 may be different from the arrangement direction of the multiple driving probes in the driving probe module 221; and the positions of the display area and the connection area of different array substrates may also be different. Figure 6 As shown, the arrangement direction of the pads in the connection area 14 is the second direction Y, and the arrangement direction of the multiple driving probes in the driving probe module 221 is the first direction X. At this time, the rotatable stage 223 can be rotated to make the arrangement direction of the pads in the connection area 14 consistent with the arrangement direction of the driving probes. The final result is as follows Figure 7 As shown, Figure 7 Another top view of a connection module provided by an embodiment of the present invention, Figure 7 for Figure 6 In addition, when the rotatable carrier 223 rotates, the connection area 14 needs to be rotated to the side of the display area AA close to the first gantry mechanism 224. By providing a rotatable carrier, different array substrates can be compatible.

[0076] Optionally, Figure 8 A top view of a rotatable stage provided in an embodiment of the present invention, Figure 9 A cross-sectional view of a rotatable carrier provided in an embodiment of the present invention, with reference to Figure 8 and Figure 9The connection module 22 also includes an L-shaped stopper 228, which is positioned at a corner of the rotatable platform 223. The L-shaped stopper 228 has a certain protrusion relative to the rotatable platform 223, which can provide a stop when the array substrate 31 is small, thereby facilitating the alignment of the measurement probe 222 with the array substrate 31. The provision of the L-shaped stopper 228 can accommodate testing of array substrates 31 of different sizes, further improving the compatibility of the test device.

[0077] In addition, it should be noted that when a plurality of measuring probes 222 are included, each measuring probe 222 may correspond to one second gantry mechanism 225 and one second lifting unit 42 .

[0078] Optionally, Figure 10 A schematic structural diagram of a first lifting unit provided in an embodiment of the present invention, referring to Figure 10 The first lifting unit 41 includes a first lifting motor 411, a first fixed bracket 412, a first obtuse-angle rotating bracket 413, a first pressure spring structure 414, and a first downward pressure height adjustment structure 415. The first fixed bracket 412 includes a first crossbeam 4121 and a first support beam 4122. The first lifting motor 411 is fixedly connected to the first crossbeam 4121 and is also slidably connected to the first gantry mechanism 224. One end of the first support beam 4122 is fixedly connected to the first crossbeam 4121, and the other end of the first support beam 4122 is rotationally connected to the first rotation axis 4131 of the first obtuse-angle rotating bracket 413; the first arm 4132 of the first obtuse-angle rotating bracket 413 is fixedly connected to the driving probe module 221, the second arm 4133 of the first obtuse-angle rotating bracket 413 is fixedly connected to the first contact electrode 416, and the first downward pressure height adjustment structure 415 is fixedly connected to the second contact electrode 417; the first contact electrode 416 and the second contact electrode 417 are both electrically connected to the control module 21; the first contact electrode 416 contacts the second contact electrode 417 after the driving probe module 221 contacts the array substrate; the control module 21 is used to output the corresponding test voltage to the driving probe module 221 after the first contact electrode 416 and the second contact electrode 417 contact. The first pressure adjustment spring structure 414 is used to adjust the distance between the first support arm 4132 and the first crossbeam 4121 ; the first downward pressure height adjustment structure 415 is used to adjust the distance between the first contact electrode 416 and the second contact electrode 417 .

[0079] Specifically, after the drive probe module 221 aligns with the pads of the connection region 14 in the first direction X and the second direction Y, the first lifting motor 411 can be controlled to descend, thereby lowering the first support beam 4122, the first crossbeam 4121, and the first obtuse-angle rotating bracket 413, thereby lowering the drive probe module 221. After the drive probe module 221 contacts the array substrate, it is subjected to pressure, causing resistance during its descent. The first obtuse-angle rotating bracket 4132 also rotates due to the resistance, causing the first contact electrode 416 to contact the second contact electrode 417. Subsequently, the control module 21 detects contact between the first contact electrode 416 and the second contact electrode 417, thereby determining that the drive probe module 221 is in contact with the array substrate. At this point, a test voltage is output to the drive probe module 221, initiating testing of the thin-film transistors 12 in the array substrate. It is understood that the control module 21 can also control the first lifting unit 41 to stop lifting at this point.

[0080] The first push-down height adjustment structure 415 can be used to fine-tune the distance between the drive probe module 221 and the array substrate. For example, the second contact electrode 417 can be controlled to move toward the first contact electrode 416, so that the distance between the first contact electrode 416 and the second contact electrode 417 changes, which in turn changes the sensitivity of the control module 21 in detecting whether the first contact electrode 416 and the second contact electrode 417 are in contact, that is, the sensitivity of the height of the drive probe module 221 decreases. In other words, the first push-down height adjustment structure 415 can be used to adjust the detection sensitivity. After the first contact electrode 416 and the second contact electrode 417 are in contact, the push-down height of the drive probe module 221 can be further adjusted by the first push-down height adjustment structure 415. That is, the second contact electrode 417 can be further moved toward the side of the first contact electrode 416, so that the first obtuse-angle rotating bracket 413 rotates clockwise, and the contact degree between the drive probe module 221 and the array substrate is greater. Of course, the second contact electrode 417 may also be moved toward a side away from the first contact electrode 416 , so that the first obtuse-angle rotating bracket 413 rotates counterclockwise, thereby reducing the contact degree between the driving probe module 221 and the array substrate.

[0081] In addition, the contact pressure between the driving probe module 221 and the array substrate can be controlled by the first pressure spring structure 414. The first pressure spring structure 414 may include a first pressure spring 4141 and a first tensioning structure 4142. The first tensioning structure 4142 may adjust the tension of the first pressure spring 4141, thereby adjusting the distance between the first crossbeam 4142 and the first support arm 4132, thereby varying the contact pressure between the driving probe module 221 and the array substrate.

[0082] Optionally, Figure 11 A schematic diagram of the structure of a second lifting unit provided in an embodiment of the present invention, referring to Figure 10 The second lifting unit 42 includes a second lifting motor 421, a second fixed bracket 422, a second obtuse-angle rotating bracket 423, a second pressure spring structure 424, and a second downward pressure height adjustment structure 425. The second fixed bracket 422 includes a second crossbeam 4221 and a second support beam 4222. The second lifting motor 421 is fixedly connected to the second crossbeam 4221 and is also slidably connected to the second gantry mechanism 225. One end of the second support beam 4222 is fixedly connected to the second crossbeam 4221, and the other end of the second support beam 4222 is rotatably connected to the second rotation axis 4231 of the second obtuse-angle rotating bracket 423; the third arm 4232 of the second obtuse-angle rotating bracket 423 is fixedly connected to the measuring probe 222, the fourth arm 4233 of the second obtuse-angle rotating bracket 423 is fixedly connected to the third contact electrode 426, and the second downward-pressing height adjustment structure 425 is fixedly connected to the fourth contact electrode 427; the third contact electrode 426 and the fourth contact electrode 427 are both electrically connected to the control module; the third contact electrode 426 contacts the fourth contact electrode 427 after the measuring probe 222 contacts the array substrate; the control module is used to output a corresponding test voltage to the measuring probe 222 after the third contact electrode 426 and the fourth contact electrode 427 contact. The second pressure adjustment spring structure 424 is used to adjust the distance between the third arm 4232 of the second fixing bracket and the second crossbeam 4221 ; the second downward pressure adjustment structure 425 is used to adjust the distance between the third contact electrode 426 and the fourth contact electrode 427 .

[0083] Specifically, after the measurement probe 222 is aligned with the pixel electrode in the first direction X and the second direction Y, the second lifting motor 421 can be controlled to descend, thereby lowering the second support beam 4222, the second crossbeam 4221, and the second obtuse-angle rotating bracket 423, and thus the measurement probe 222. After the measurement probe 222 contacts the array substrate, it is subjected to pressure, causing resistance during its descent. The second obtuse-angle rotating bracket 4232 also rotates due to the resistance, causing the third contact electrode 426 to contact the fourth contact electrode 427. Subsequently, the control module 21 detects contact between the third contact electrode 426 and the fourth contact electrode 427, thereby determining that the measurement probe 222 has contacted the array substrate. At this point, the test voltage is output to the measurement probe 222, and testing of the thin-film transistors in the array substrate begins. Of course, it is understood that the control module can also control the second lifting unit to stop lifting at this time.

[0084] The second push-down height adjustment structure 425 can be used to fine-tune the distance between the measuring probe 222 and the array substrate. For example, by controlling the fourth contact electrode 427 to move toward the third contact electrode 426, the distance between the third and fourth contact electrodes 426, 427 can be changed. This, in turn, changes the sensitivity of the control module's detection of contact between the third and fourth contact electrodes 426, 427, thereby changing the sensitivity of the measuring probe 222's descending height. In other words, the second push-down height adjustment structure 425 can be used to adjust the detection sensitivity. After the third and fourth contact electrodes 426, 427 are in contact, the second push-down height adjustment structure 425 can be used to further adjust the push-down height of the measuring probe 222. Specifically, the fourth contact electrode 427 can be further moved toward the third contact electrode 426, causing the second obtuse-angle rotating bracket 423 to rotate clockwise, thereby increasing the contact between the measuring probe 222 and the array substrate. Of course, the fourth contact electrode 427 may also be moved toward a side away from the third contact electrode 426 , so that the second obtuse-angle rotating bracket 423 rotates counterclockwise, and the contact degree between the measuring probe 222 and the array substrate becomes smaller.

[0085] In addition, the contact pressure between the measurement probe 222 and the array substrate can be controlled by the second pressure spring structure 424. The second pressure spring structure 424 may include a second pressure spring 4241 and a second tension structure 4242. The second tension structure 4242 may adjust the tension of the second pressure spring 4241, thereby adjusting the distance between the second crossbeam 4242 and the second arm 4232 of the second fixing bracket, thereby varying the contact pressure between the measurement probe 222 and the array substrate.

[0086] Optionally, continue to refer to Figure 10 and Figure 11 The tip of the measuring probe 222 is spherical, meaning the end of the measuring probe 222 that contacts the pixel electrode is spherical. Because the pixel electrode has a high resistivity, the tip of the measuring probe 222 can be spherical to increase the contact area while avoiding puncturing the pixel electrode.

[0087] Optionally, in some other embodiments, the top of the driving probe may also be a spherical structure; and the spherical structure may be conductive rubber.

[0088] In the above embodiment, the control module 21 can automatically control the movement of each unit within the connection module 22 and signal transmission, etc. For example, the coordinates of the thin film transistor to be tested and the coordinates of the connection area can be input. The control module 21 can automatically control the movement of the gantry mechanism, lifting unit, etc. to complete the automatic test.

[0089] Optionally, Figure 12A circuit diagram of another array substrate testing device provided by an embodiment of the present invention is provided. Figure 5 and Figure 12 . The testing device also includes a signal switching switch module 226. The control module 21 includes a first output terminal for connecting to the first input terminal, a second output terminal for connecting to the second input terminal, and a third output terminal for connecting to the first control terminal and the second control terminal. The first output terminal is used to output the third test voltage V141, the second output terminal is used to output the first test voltage V142, and the third output terminal is used to output the first control voltage V143 and the second control voltage V144. The signal switching switch module 226 includes: a first switch group 2261, a second switch group 2262 and a third switch group 2263, each switch group includes a plurality of switches 2264 corresponding one-to-one to a plurality of drive probes. The first ends of the plurality of switches in the first switch group 2261 are electrically connected to the first output terminal of the control module, and the second ends of the plurality of switches are electrically connected one-to-one to the plurality of drive probes. The first ends of multiple switches in the second switch group 2262 are electrically connected to the second output end of the control module, and the second ends of the multiple switches are electrically connected to the multiple drive probes one-to-one; the first ends of multiple switches in the third switch group 2263 are electrically connected to the third output end of the control module, and the second ends of the multiple switches are electrically connected to the multiple drive probes one-to-one.

[0090] Specifically, the arrangement of different functional judgments of the connection areas in different array substrates may be different. After multiple drive probes are fixedly connected, if the signal transmitted by the drive probe cannot be changed, the compatibility of the test device will be poor. In this embodiment, a signal switching switch module 226 is provided to change the type of signal transmitted on each drive probe. For example, if the first drive probe needs to transmit the first control signal, it is only necessary to turn on the switch between the first drive probe and the third output terminal of the control module, and turn off the switch between the first drive probe and the other output terminals of the control module. For example, in this embodiment, Figure 1 Take the pad arrangement shown in as an example. Figure 1 There are 8 pads in total, so each switch group includes 8 switches. From left to right, the first pad and the second pad need to be connected to the first control signal V143, then Figure 12 From top to bottom, the switches between the first and second drive probes and the third output terminal of the control module are turned on. The third and fourth pads need to be connected to the third test voltage V141, so the switches between the third and fourth drive probes and the first output terminal of the control module are turned on. The fifth pad needs to be connected to the second control voltage V144, so the switch between the fourth drive probe and the third output terminal of the control module is turned on. The sixth to eighth pads need to be connected to the first test voltage, so the switches between the sixth to eighth drive probes and the second output terminal of the control module are turned on.

[0091] Optionally, the switch 2264 may be a relay, which may be controlled to be turned on or off by a control module.

[0092] Optionally, the measuring probe 222 may also be electrically connected to the control module via a signal switching control switch module 226 .

[0093] Optionally, the control module 21 may be an instrument for measuring an IV curve of a thin film transistor.

[0094] Optionally, the control module 21 and the connection module may be electrically connected via a low-impedance wire.

[0095] Based on the same inventive concept, the present invention also provides a method for testing an array substrate, such as Figure 13 As shown, Figure 13 This is a flow chart of a method for testing an array substrate provided in an embodiment of the present invention. The method for testing an array substrate is performed by a testing device for an array substrate provided in any embodiment of the present invention. The method for testing an array substrate includes:

[0096] Step S301, electrically connecting the connection module to the first input terminal and the second input terminal of the lighting circuit, that is, the pixel electrodes corresponding to the thin film transistor to be tested;

[0097] In step S302 , the control module outputs a corresponding test voltage to the pixel electrode corresponding to the thin film transistor to be tested, the first input terminal and the second input terminal of the lighting circuit through the connection module, and detects the current of the pixel electrode corresponding to the thin film transistor to be tested.

[0098] Specifically, the control module can automatically control the connection module to be electrically connected to the array substrate. For specific operation methods, reference can be made to the description of the test device for the array substrate of the present invention, which will not be repeated here.

[0099] The array substrate testing method of this embodiment allows direct testing of thin-film transistors in the display area of the array substrate, eliminating the need to fabricate test thin-film transistors in blank areas of the array substrate. This significantly improves test accuracy. Furthermore, the pixel electrodes and pads in the connection area are relatively large, allowing thin-film transistor testing by transmitting signals to the corresponding pads in the pixel electrodes and connection areas. This reduces the difficulty of electrically connecting the connection module to the array substrate, and also reduces the requirements for the connection module's precision and size, resulting in lower costs.

[0100] It should be noted that if the array substrate has a common electrode, the common electrode can be grounded during testing. Furthermore, if the common electrode is located on the side of the pixel electrode closest to the display surface, that is, the pixel electrode is not the outermost layer of the array substrate and is not exposed, a laser can be used to remove the common electrode above the pixel electrode of the thin-film transistor to be tested. The laser can then penetrate the insulating layer, injecting and spreading a film-forming repair material (such as tungsten or silver) to create the contact surface required by the measurement probe.

[0101] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0102] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A testing device for an array substrate, characterized in that: The array substrate includes a plurality of sub-pixels and a lighting circuit, each of the sub-pixels includes a pixel electrode and a thin film transistor, the lighting circuit includes a first input terminal for transmitting a signal to a control terminal of the thin film transistor and a second input terminal for transmitting a signal to the first terminal of the thin film transistor, and the second terminal of the thin film transistor is electrically connected to the pixel electrode; The test device includes a control module and a connection module; the connection module is used to electrically connect to the first input terminal, the second input terminal of the lighting circuit and the pixel electrode corresponding to the thin film transistor to be tested; The control module is used to output the corresponding test voltage to the pixel electrode corresponding to the thin film transistor to be tested, the first input end and the second input end of the lighting circuit through the connection module, and detect the current of the pixel electrode corresponding to the thin film transistor to be tested.

2. The array substrate testing device according to claim 1, wherein: The lighting circuit further includes a first control terminal and a second control terminal, wherein the first control terminal is used to input a control signal for controlling the conduction state between the first input terminal and the control terminal of the thin film transistor; and the second control terminal is used to input a control signal for controlling the conduction state between the second input terminal and the first terminal of the thin film transistor. The connection module is further configured to be electrically connected to the first control terminal and the second control terminal; and the control module is further configured to output corresponding control signals to the first control terminal and the second control terminal through the connection module.

3. The array substrate testing device according to claim 2, wherein: The connection module includes: a driving probe module and at least one measuring probe; The measuring probe is electrically connected to the control module, and the measuring probe is used to be electrically connected to the pixel electrode; The driving probe module includes a plurality of fixedly connected driving probes, the driving probes are electrically connected to the control module, and the plurality of driving probes are used to be electrically connected to the first input end, the second input end, the first control end, and the second control end respectively.

4. The array substrate testing device according to claim 3, wherein: The connection module also includes: A movable track, a first gantry mechanism, a second gantry mechanism and a rotatable carrier; The rotatable carrier is used to carry the array substrate; the first gantry mechanism and the second gantry mechanism are slidably connected to the movable track; A first lifting unit is slidably connected to the first gantry mechanism, and the driving probe module is connected to the first lifting unit; a second lifting unit is slidably connected to the second gantry mechanism, and the measuring probe is connected to the second lifting unit.

5. The array substrate testing device according to claim 4, wherein: The first lifting unit includes: a first lifting motor, a first fixed bracket, a first obtuse-angle rotating bracket, a first pressure adjustment spring structure, and a first downward pressure height adjustment structure; The first fixed bracket includes a first crossbeam and a first support beam; the first lifting motor is fixedly connected to the first crossbeam; one end of the first support beam is fixedly connected to the first crossbeam, and the other end of the first support beam is rotatably connected to the first rotation axis of the first obtuse-angle rotating bracket; the first arm of the first obtuse-angle rotating bracket is fixedly connected to the driving probe module, the second arm of the first obtuse-angle rotating bracket is fixedly connected to the first contact electrode, and the first downward pressure height adjustment structure is fixedly connected to the second contact electrode; the first contact electrode and the second contact electrode are both connected to the control module, and the first contact electrode contacts the second contact electrode after the driving probe module contacts the array substrate; the control module is used to output a corresponding test voltage to the driving probe module after the first contact electrode contacts the second contact electrode; The first pressure adjustment spring structure is used to adjust the distance between the first support arm and the first beam; the first downward pressure height adjustment structure is used to adjust the distance between the first contact electrode and the second contact electrode.

6. The array substrate testing device according to claim 4, wherein: The second lifting unit includes: a second lifting motor, a second fixed bracket, a second obtuse-angle rotating bracket, a second pressure adjustment spring structure and a second downward pressure height adjustment structure; The second fixed bracket includes a second crossbeam and a second support beam; the second lifting motor is fixedly connected to the second crossbeam; one end of the second support beam is fixedly connected to the second crossbeam, and the other end of the second support beam is rotatably connected to the second rotation axis of the second obtuse-angle rotating bracket; the third arm of the second obtuse-angle rotating bracket is fixedly connected to the measuring probe, the fourth arm of the second obtuse-angle rotating bracket is fixedly connected to the third contact electrode, and the second downward pressure height adjustment structure is fixedly connected to the fourth contact electrode; the third contact electrode and the fourth contact electrode are both connected to the control module, and the third contact electrode contacts the fourth contact electrode after the driving probe module contacts the array substrate; the control module is used to output a corresponding test voltage to the measuring probe after the third contact electrode contacts the fourth contact electrode; The second pressure adjustment spring structure is used to adjust the distance between the third support arm and the second crossbeam; the second downward pressure height adjustment structure is used to adjust the distance between the third contact electrode and the fourth contact electrode.

7. The array substrate testing device according to claim 3, wherein: The testing device also includes a signal switching module; The control module includes a first output terminal for connecting to the first input terminal, a second output terminal for connecting to the second input terminal, and a third output terminal for connecting to the first control terminal and the second control terminal; the signal switching switch module includes: a first switch group, a second switch group and a third switch group, each of the switch groups includes a plurality of switches corresponding to the plurality of driving probes; The first ends of the multiple switches in the first switch group are electrically connected to the first output end of the control module, and the second ends of the multiple switches are electrically connected to the multiple driving probes in a one-to-one correspondence; The first ends of the multiple switches in the second switch group are electrically connected to the second output end of the control module, and the second ends of the multiple switches are electrically connected to the multiple driving probes in a one-to-one correspondence; The first ends of the multiple switches in the third switch group are electrically connected to the third output end of the control module, and the second ends of the multiple switches are electrically connected to the multiple driving probes in a one-to-one correspondence.

8. The array substrate testing device according to claim 3, wherein: The top of the measuring probe is a spherical structure; and / or, The top of the driving probe is a spherical structure.

9. The array substrate testing device according to claim 4, wherein: The connection module further includes an L-shaped limit block, and the L-shaped limit block is arranged at a top corner of the rotatable platform.

10. A method for testing an array substrate, performed by the array substrate testing device according to any one of claims 1 to 9, characterized in that: The test method includes: Electrically connecting the connection module to the first input terminal, the second input terminal of the lighting circuit and the pixel electrodes corresponding to the thin film transistor to be tested; The control module outputs a corresponding test voltage to the pixel electrode corresponding to the thin film transistor to be tested, the first input terminal and the second input terminal of the lighting circuit through the connection module, and detects the current of the pixel electrode corresponding to the thin film transistor to be tested.

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