Unmanned aerial vehicle modular design method based on three-dimensional circuit

Abstract

The invention relates to an unmanned aerial vehicle modular design method based on a three-dimensional circuit. The modular design method comprises the following steps: collecting product performance indexes of the unmanned aerial vehicle; analyzing and modifying the structure and the electrical interconnection system according to the product performance indexes, and constructing a three-dimensional printing model based on the product structure; constructing a functional conductive path on the surface of the three-dimensional printing model, and carrying out modular design on an interface in the functional conductive path to obtain a four-dimensional interconnection interface system; carrying out three-dimensional circuit design on the electrical circuit of each cabin section according to the functional conductive path; and designing a three-dimensional circuit manufacturing process according to the substrate material at the position of the three-dimensional circuit. By executing the modular design method, the modular design of the unmanned aerial vehicle and the three-dimensional circuit design of the electrical circuit can be realized, so that the design flexibility and upgrading capability are improved, the maintenance and repair are simplified, the light weight and miniaturization are promoted, the structural integration and stability are enhanced, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of unmanned aerial vehicle (UAV) design, and in particular to a modular design method for an UAV based on a three-dimensional circuit. Background Art

[0002] Drones are already widely used in areas such as power grid inspection, aerial photography, remote monitoring, and military operations. However, most drones are designed for a single purpose and lack a modular structure, leading to the following common problems:

[0003] The replacement of damaged or faulty parts is complex and requires more professional skills and time, making drone maintenance more difficult;

[0004] In the context of rapid technological development, in order to quickly adapt to the needs of new technologies, it is often necessary to quickly replace or upgrade specific modules. However, traditional drones may need to be completely replaced when upgrading their technology, which is costly and time-consuming, and the upgrade flexibility is limited.

[0005] The separate design of planar circuit and three-dimensional structure uses the "PCB + cable" electrical interconnection method, which is cumbersome and adds additional assembly steps and structural weight. Summary of the Invention

[0006] Based on this, it is necessary to provide a modular design method for drones based on three-dimensional circuits that can make drones modular, thereby reducing maintenance difficulty, improving technology upgrade flexibility, and simplifying assembly processes.

[0007] A modular design method for an unmanned aerial vehicle based on a stereo circuit, comprising:

[0008] Collect product performance indicators of existing drones;

[0009] Analyze and modify the structure and electrical interconnection system of the UAV based on the product performance indicators, and construct a 3D printing model based on the UAV product structure;

[0010] constructing a functional conductive path on the surface of the three-dimensional printed model, and modularly designing interfaces in the functional conductive path to obtain a four-dimensional interconnected interface system;

[0011] Conducting three-dimensional circuit design of the electrical circuits of each compartment according to the functional conductive paths;

[0012] The three-dimensional circuit manufacturing process is designed according to the substrate material where the three-dimensional circuit is located.

[0013] By following the steps in the above-mentioned 3D circuit-based modular design method for drones, modular design and 3D circuit design of the drone's electrical circuitry can be achieved. This modular design allows the drone's various functional components (such as sensors, power systems, and control units) to be independent modules, making them easily replaceable, upgradeable, and customizable. This accelerates drone product iteration and adapts to evolving technological demands and application scenarios. When a drone component is damaged or requires an upgrade, only the corresponding module needs to be replaced, without disassembling the entire system. This significantly reduces drone maintenance costs and time, thereby improving mission continuity. 3D circuit design integrates 3D circuits directly onto the drone's surface, reducing the volume and weight of traditional wiring and enabling drones to achieve a better payload ratio and longer flight range. This 3D circuit design helps optimize drone space utilization, reduces connectors and interfaces, and enhances the drone's overall stability and anti-interference capabilities. The standardized and simplified modular production and assembly processes not only improve drone production efficiency but also reduce manufacturing costs and structural complexity, facilitating large-scale production and customized services. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Schematic diagram of the flow of a modular design method for a drone based on a three-dimensional circuit in a preferred embodiment of the present invention;

[0015] Figure 2 for Figure 1 Schematic diagram of the flow of step S10 in the modular design method of a UAV based on a three-dimensional circuit;

[0016] Figure 3 for Figure 1 FIG. 1 is a flow chart of step S20 in the modular design method of a UAV based on a three-dimensional circuit. DETAILED DESCRIPTION

[0017] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0019] When describing positional relationships, unless otherwise specified, when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may also exist. It is also understood that when an element is referred to as being "between" two elements, it can be the only one between the two elements, or one or more intervening elements may also exist.

[0020] In the case of using “including,” “having,” and “comprising” described herein, another component may be added unless a clear limiting term such as “only,” “consisting of,” etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as having one number.

[0021] See also Figure 1 The modular design of the UAV electrical system based on the stereo circuit in the preferred embodiment of the present invention includes steps S10 to S50.

[0022] Step S10: collecting product performance indicators of existing drones.

[0023] Please also refer to Figure 2 Specifically, step S10 includes step S101 and step S102.

[0024] Step S11: Collect key performance indicators of traditional drones. These include drone material properties (e.g., environmental adaptability, temperature resistance, mechanical strength, etc.), drone size and weight, endurance and flight range, and core functional performance.

[0025] It should be noted that core functional performance refers to the functional performance required for the UAV to perform tasks, such as electronic countermeasures, communications, inspection / surveillance, exploration, mapping, etc.

[0026] Step S12: Determine the base material of the final product based on the usage requirements. The base material of the final product can be PC, PA12, PEEK, aluminum alloy (AlSi10Mg, AlMgScZr), etc., which can be used for 3D printing integrated molding.

[0027] Specifically, when the usage requirements are miniaturization, lightweight, and low cost, the base material of the final product can be PA12; when the usage requirements are high-speed cruising and multiple recycling, the base material of the final product can be aluminum alloy, etc.

[0028] Step S20: Analyze and modify the structure and electrical interconnection system of the drone according to product performance indicators, and construct a three-dimensional printing model based on the drone product structure.

[0029] Step S30 , constructing a functional conductive path on the surface of the three-dimensional printed model, and performing modular design on the interfaces in the functional conductive path to obtain a four-dimensional interconnected interface system.

[0030] Step S40 , performing three-dimensional circuit design on the electrical circuits of each compartment according to the functional conductive paths.

[0031] Step S50 , designing a manufacturing process for the three-dimensional circuit according to the substrate material where the three-dimensional circuit is located.

[0032] By executing steps S10 and S20, a product structure that meets the requirements of subsequent modular design and three-dimensional circuit design is obtained based on the existing drone product structure and electrical system, and a three-dimensional printed model for 3D printing is constructed based on the new product structure. By executing step S30, functional conductive paths are formed on the surface of the three-dimensional printed model, and a four-dimensional interconnect interface system is obtained within the conductive paths to achieve modular design of the drone. By executing step S40, a three-dimensional circuit design is performed on the functional conductive paths, and by executing step S50, a three-dimensional circuit integrated with the drone product structure is obtained in each compartment of the drone.

[0033] The modular design allows the different functional components of the drone (such as sensors, power systems, control units, etc.) to be used as independent modules, which are easy to replace, upgrade and customize, thereby accelerating the iteration speed of drone products and using ever-changing technical requirements and application scenarios; when a part of the drone is damaged or needs to be upgraded, only the corresponding module needs to be replaced without the need for overall disassembly, which greatly reduces the cost of drone maintenance and shortens maintenance time, thereby improving the continuity of drone missions.

[0034] The three-dimensional circuit design integrates the three-dimensional circuit directly into the surface of the drone structure, reducing the volume and weight of traditional wiring, which helps the drone achieve a better load ratio and longer endurance. The three-dimensional circuit design helps optimize the drone's space utilization, reduces connectors and interfaces, and enhances the drone's overall stability and anti-interference capabilities, especially its operating performance in harsh environments.

[0035] The standardization and simplification of modular production and assembly processes can not only improve the production efficiency of drones, but also reduce the manufacturing cost and structural complexity of drones, which is conducive to the large-scale production of drones and the development of customized services.

[0036] Therefore, the above-mentioned modular design method of drones based on three-dimensional circuits can realize the modularization and three-dimensional circuitization of drones, thereby reducing the difficulty of drone maintenance, improving the flexibility of drone technology upgrades, and simplifying the assembly process of drones.

[0037] Please also refer to Figure 3 In some embodiments, step S20 includes step S21 and step S22.

[0038] Step S21: Analyze and modify the product structure of the drone based on product performance indicators and meet the following requirements:

[0039] If the structure requires a through hole, the through hole should be designed with a taper;

[0040] If the electrical circuit crosses two adjacent structural surfaces, the corner between the two structural surfaces shall be rounded, and the angle between the perpendicular line of one structural surface and the other adjacent structural surface shall be greater than or equal to 30°;

[0041] It is prohibited to arrange ejectors in the electrical circuit area, or to arrange ejectors with an annular inclined surface on the head; specifically, the angle between the annular inclined surface and the end face of the ejector head is less than or equal to 30 degrees;

[0042] If the electrical circuit is arranged in the cavity window area, the window size is greater than 1.5 mm.

[0043] In this way, during the product structure design process, the through-hole of the via is tapered, which is conducive to the complete integration of the three-dimensional circuit and the via; when the three-dimensional circuit spans two adjacent structural surfaces, the corners between the two structural surfaces are rounded, and the angle between one structural surface and the perpendicular line of the other adjacent structural surface is made less than or equal to 30° to avoid the formation of sharp chamfers at the corners, so as to ensure that the three-dimensional circuit is integrated with the product structure at the corners; and the arrangement of ejector pins should be prohibited in the electrical circuit area. If it is really unavoidable, an annular inclined surface should be formed along the circumferential direction at the head of the arranged ejector pin to avoid the formation of sharp chamfers at the corners of the ejector pin head, thereby ensuring the effective connection between the three-dimensional circuit and the ejector pin; in the cavity window area, the window size is set to be greater than 1.5mm for electrical safety.

[0044] Step S22: Analyze and modify the UAV's electrical interconnection system based on product performance indicators to ensure that it meets the following requirements:

[0045] Key components and various functional modules are dispersed in independent compartments. Key components include but are not limited to power modules and control modules (such as main boards and control panels), while functional modules refer to the functions of the drone when performing missions, such as exploration, mapping, and meteorological data collection.

[0046] Determine the number and maximum current of the physical wires replaced by the three-dimensional circuit, and obtain the line width of the three-dimensional circuit according to the maximum current of the physical wires;

[0047] The center-to-center distance between two adjacent three-dimensional circuits is obtained according to the line width of the three-dimensional circuit. Specifically, the center-to-center distance between two adjacent three-dimensional circuits is three times the line width.

[0048] Key components and various functional modules are dispersed across independent compartments to achieve modular system design. The line width of the three-dimensional circuit is determined based on the maximum current of the electrical line to ensure the current-carrying capacity of the three-dimensional circuit. To ensure electrical safety between the three-dimensional circuits, the center-to-center spacing between adjacent three-dimensional circuits is designed according to the 3W principle of PCB board design, where W is the line width.

[0049] Furthermore, in some embodiments, if the structure requires a via hole, the via hole is tapered: when the depth of the via hole is less than 0.6 mm, the via hole is tapered by single-sided drafting; otherwise, the via hole is tapered by double-sided drafting.

[0050] In this way, according to the depth of the through hole, the through hole taper design is carried out by selecting the single-sided draft or double-sided draft method. While ensuring the structural strength of the product and the inclination of the hole wall, the size difference between the hole openings at both ends of the through hole is reduced, ensuring that both ends of the through hole can be fully integrated with the three-dimensional circuit under the premise of ensuring electrical safety.

[0051] Furthermore, in some embodiments, if the structure requires a via hole, when the via hole is tapered, the diameter of the via hole is greater than 0.2 mm, the draft angle of the via hole is greater than or equal to 60°, and the single-side slope is greater than or equal to 30°.

[0052] In this way, the aperture at the minimum position of the through hole is greater than 0.2mm, which facilitates the subsequent metallization treatment of the inner wall of the through hole; the draft angle of the through hole is set to be greater than or equal to 60°, and the single-side slope is greater than or equal to 30° to ensure that the inclination of the inner wall of the through hole is greater than or equal to 30°, thereby ensuring better integration between the three-dimensional circuit and the via hole.

[0053] Furthermore, in some embodiments, when the corner between two structural surfaces is rounded, the radius of the rounded corner is greater than or equal to 0.15 mm. Specifically, the radius of the rounded corner is greater than 0.3 mm. This ensures a smooth transition between the two structural surfaces, thereby achieving better integration of the three-dimensional circuit at the rounded corner.

[0054] Furthermore, in some embodiments, the step of designing the line width of the three-dimensional circuit according to the current of the current electrical circuit is: calculating the line width of the three-dimensional circuit according to the following formula:

[0055] I=k·W 0.44 ·T 0.725

[0056] Where I is the maximum current, W is the line width of the 3D circuit, T is the thickness of the copper layer in the 3D circuit, and k is the correction factor, k = 0.015 to 0.03. Specifically, k = 0.024. It should be noted that the copper layer is the conductive layer in the 3D circuit and is the main part used to conduct current in the 3D circuit.

[0057] In this way, after determining the maximum current I of the electrical circuit, the line width W of the three-dimensional circuit can be obtained according to the above formula.

[0058] In some embodiments, before the step of obtaining the line width of the three-dimensional circuit according to the maximum current of the physical wire, the method further includes the step of constructing a relationship comparison table between the maximum current and the line width of the three-dimensional circuit.

[0059] Specifically, staff can establish a set of comparison tables on maximum current and three-dimensional circuit line width based on past experience. More specifically, the relationship between maximum current and three-dimensional circuit line width is shown in the following table:

[0060]

[0061] The step of designing the line width of the three-dimensional circuit according to the maximum current of the current electrical circuit is: selecting the line width of the three-dimensional circuit in a relationship comparison table according to the maximum current of the current electrical circuit.

[0062] In this way, the staff only needs to make a selection based on the maximum current of the electrical circuit and the ambient temperature, and directly select from the above-mentioned relationship comparison table between the maximum current and the width of the three-dimensional circuit, which is convenient and quick.

[0063] Furthermore, in some embodiments, the three-dimensional circuit design of the electrical circuits of each compartment according to the functional conductive path must meet the following requirements:

[0064] When the substrate material where the electrical circuit is located is plastic, glass or metal, the line width of the three-dimensional circuit is greater than or equal to 0.15 mm, and the spacing between any two adjacent three-dimensional circuits is greater than or equal to 0.2 mm;

[0065] When the substrate material where the electrical circuit is located is ceramic, the line width of the three-dimensional circuit is greater than or equal to 0.05mm, the spacing between any two adjacent three-dimensional circuits is greater than or equal to 0.1mm, the distance between the three-dimensional circuit and the edge of the wall is greater than or equal to 0.5mm, and the turning position of the three-dimensional circuit is designed with rounded corners.

[0066] In this way, after designing the line width and line center spacing of the three-dimensional circuit in step S20, the substrate material where the electrical circuit is located is taken into consideration in step S30, so as to optimize the space utilization of the drone while obtaining a three-dimensional circuit with higher electrical safety and current carrying capacity that meets the use requirements.

[0067] In some embodiments, the following requirements must be met when designing a four-dimensional interconnection interface system: in terms of mechanical structure, a dovetail groove meshing structure and / or a self-locking snap-fit structure are adopted; in terms of electrical structure, contacts and / or metal springs are adopted for contactable conduction design, and the contact resistance during contact conduction is less than 8mΩ. Thus, in the four-dimensional interconnection interface system, all four-dimensional interconnection interfaces can all adopt a dovetail groove meshing structure or a self-locking snap-fit structure, or a portion of the four-dimensional interconnection interfaces can adopt a dovetail groove meshing structure and another portion of the four-dimensional interconnection interfaces can adopt a self-locking snap-fit structure. Similarly, in the four-dimensional interconnection interface system, all four-dimensional interconnection interfaces can all adopt contact point contact to achieve electrical conduction, or all adopt metal spring contact to achieve electrical conduction, or a portion adopt contact point contact and another portion adopt metal spring contact to achieve electrical conduction, or the same four-dimensional interconnection interface can simultaneously adopt contact point and metal spring contact to achieve electrical conduction.

[0068] Stereoscopic circuit technology, based on the functional conductive paths of three-dimensional structural surface components, has developed a four-dimensional interconnect interface system to achieve integrated connections for mechanical fixation and electrical conduction. Mechanically, a dovetail groove meshing structure and / or a self-locking snap-fit structure are used to ensure millimeter-level positioning accuracy (accurate to ±0.2mm) and anti-separation force (up to 50N) of the physical connection of each module. Electrically, contact is achieved through contacts or metal springs, and a gold-nickel composite plating layer can achieve a contact resistance of less than 8mΩ. This ensures reliable electrical conduction of each module while reducing the probability of local heating during electrical conduction.

[0069] Furthermore, in some embodiments, the design of the four-dimensional interconnect interface system must meet the following requirements: Regarding energy, an integrated Qi standard wireless charging coil is used. Thus, during the modular design of the drone, the integrated Qi standard wireless charging coil can be used as the energy transmission path in the four-dimensional interconnect interface, achieving an integrated connection for mechanical fixation, electrical conductivity, and energy transmission, thereby enabling a three-dimensional circuit to achieve 85% transmission efficiency with a 3mm spacing.

[0070] Furthermore, in some embodiments, the design of a four-dimensional interconnect interface system must meet the following requirements: Regarding signal processing, a three-dimensional circuit antenna design is employed. Thus, during the modular design of a drone, when a three-dimensional circuit is needed to replace a physical antenna, a three-dimensional circuit antenna can be used to achieve an integrated connection for mechanical fixation, electrical conductivity, and signal exchange. The three-dimensional circuit wire coil can bend or compress to adapt to varying curvatures of carrier surfaces, maintaining a low profile without compromising aerodynamic performance. Specifically, the three-dimensional circuit wire acts as a helical antenna, which has high gain and directional radiation characteristics, making it suitable for long-distance communication.

[0071] Of course, in other embodiments, if the product design does not require the use of a three-dimensional circuit to replace a physical antenna, solder joints may be provided on the three-dimensional circuit to directly solder physical wires to the three-dimensional circuit.

[0072] In some embodiments, step S50 includes:

[0073] When the substrate material where the three-dimensional circuit is located is conventional plastic, the three-dimensional circuit manufacturing process is selected from the LDS process or the LAP process;

[0074] When the substrate material where the three-dimensional circuit is located is a composite material or high-performance plastic, the three-dimensional circuit manufacturing process selects a three-dimensional circuit spraying manufacturing process.

[0075] Therefore, in the actual step S50, the substrate material of the 3D circuit location can be determined first, and then different manufacturing processes are selected according to the substrate material to process the 3D circuit to ensure that the 3D circuit obtained by processing has a higher degree of integration with the product structure.

[0076] The key to the LDS process is the addition of a laser-sensitive additive, such as copper-chromium oxide or copper-iron oxide, to the plastic particles. Under the action of the laser, the structure of the laser-sensitive additive is destroyed, and the copper ions are reduced to zero-valent copper, which then aggregates into metal particles. These metal particles adhere to the laser-ablated resin surface, forming metal cores. This provides autocatalysis during the subsequent electroless plating process. Through a displacement reaction, layers of copper, nickel, and gold are deposited on the surface of the structure, forming a three-dimensional circuit.

[0077] The LAP process uses a conventional plastic substrate to form a circuit pattern on its surface through laser engraving (laser roughening), and then uses chemical agents such as potassium permanganate to roughen the treated surface (chemical roughening). Finally, similar to the LDS process, a chemical plating process is used to form a circuit layer on the surface of the substrate to obtain a stable circuit with conductive function.

[0078] The 3D circuit spraying manufacturing process first adds a laser-sensitive additive to a specific spray paint and stirs it thoroughly to evenly disperse it in the paint. After the paint is applied to the substrate surface and solidified, a laser is used to carve the paint film layer, depositing the circuits on the paint surface to form a 3D circuit pattern. The paint adheres to the substrate surface to provide insulation. The specific ratio is:

[0079]

[0080] Subsequently, similar to the LDS and LAP processes, the laser-engraved samples are chemically plated to achieve a stable circuit with conductive function.

[0081] Practice has proved that the process of manufacturing three-dimensional circuits takes about 24 hours, including the subsequent installation and debugging of various components. The shortest preparation time of modular drones based on three-dimensional circuits can be less than 72 hours. Therefore, the above-mentioned modular design method of drones based on three-dimensional circuits can greatly improve the production efficiency of drones.

[0082] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A modular design method for a UAV based on a three-dimensional circuit, characterized in that: include: Collect product performance indicators of existing drones; Analyze and modify the structure and electrical interconnection system of the UAV based on the product performance indicators, and construct a 3D printing model based on the UAV product structure; constructing a functional conductive path on the surface of the three-dimensional printed model, and modularly designing interfaces in the functional conductive path to obtain a four-dimensional interconnected interface system; Conducting three-dimensional circuit design of the electrical circuits of each compartment according to the functional conductive paths; The three-dimensional circuit manufacturing process is designed according to the substrate material where the three-dimensional circuit is located.

2. The design method according to claim 1, characterized in that: The steps of analyzing and modifying the structure and electrical interconnection system of the UAV according to the product performance indicators and constructing a three-dimensional printing model based on the UAV product structure include: The product structure of the drone is analyzed and modified based on the product performance indicators, and the following requirements are met: if the structure requires a through-hole, the through-hole is designed to be tapered; if the electrical circuit spans two adjacent structural surfaces, the corner between the two structural surfaces is designed to be chamfered, and the angle between the perpendicular line of one structural surface and the other adjacent structural surface is greater than or equal to 30°; ejector pins are prohibited from being arranged in the electrical circuit area, or ejector pins with an annular inclined surface on the head are arranged; if the electrical circuit is arranged in the cavity window area, the window size is greater than 1.5mm; The electrical interconnection system of the UAV is analyzed and modified based on the product performance indicators, and meets the following requirements: key components and various functional modules are dispersed in each independent compartment; the number and maximum current of the physical wires replaced by the three-dimensional circuit are determined, and the line width of the three-dimensional circuit is obtained based on the maximum current of the physical wires; the center-to-center distance between two adjacent three-dimensional circuits is obtained based on the line width of the three-dimensional circuit.

3. The design method according to claim 2, characterized in that: If the structure requires a through hole, when designing the taper of the through hole: When the depth of the through hole is less than 0.6 mm, the through hole is tapered by single-sided drafting; Otherwise, the through hole is tapered by double-sided drafting.

4. The design method according to claim 2, characterized in that: If the structure requires a through hole, when designing the through hole with a taper: the diameter of the through hole is greater than 0.2 mm, the draft angle of the through hole is greater than or equal to 60°, and the single-side slope is greater than or equal to 30°; and / or When the corner between the two structural surfaces is rounded, the radius of the rounded corner is greater than or equal to 0.15 mm.

5. The design method according to claim 2, characterized in that: The steps for obtaining the line width of the three-dimensional circuit based on the maximum current of the physical conductor are as follows: the line width of the three-dimensional circuit is calculated according to the following formula: I=k·W 0.44 ·T 0.725 Wherein, I is the maximum current, W is the line width of the three-dimensional circuit, T is the thickness of the copper layer in the three-dimensional circuit, and the coefficient k is 0.015 to 0.

03.

6. The design method according to claim 2, characterized in that: Before the step of obtaining the line width of the three-dimensional circuit according to the maximum current of the physical conductor, the method further includes the steps of: constructing a comparison table of the maximum current and the line width of the three-dimensional circuit; The step of designing the line width of the three-dimensional circuit according to the maximum current of the current electrical circuit is: selecting the line width of the three-dimensional circuit in the comparison table according to the maximum current of the current electrical circuit.

7. The design method according to claim 2, characterized in that: The three-dimensional circuit design of the electrical circuits in each compartment based on the functional conductive paths must meet the following requirements: When the substrate material where the electrical circuit is located is plastic, glass or metal, the line width of the three-dimensional circuit is greater than or equal to 0.15 mm, and the spacing between any two adjacent three-dimensional circuits is greater than or equal to 0.2 mm; When the substrate material at the location of the electrical circuit is ceramic, the line width of the three-dimensional circuit is greater than or equal to 0.05 mm, the spacing between any two adjacent three-dimensional circuits is greater than or equal to 0.1 mm, the distance between the three-dimensional circuit and the edge of the wall is greater than or equal to 0.5 mm, and the turning position of the three-dimensional circuit is designed with rounded corners.

8. The design method according to claim 1, characterized in that: The following requirements must be met when designing the four-dimensional interconnection interface system: in terms of mechanical structure, a dovetail groove engagement structure and / or a self-locking snap-fit structure is adopted; in terms of electrical structure, contacts and / or metal springs are used for a contactable conduction design, and the contact resistance during contact conduction is less than 8mΩ.

9. The design method according to claim 8, characterized in that: The following requirements must be met when designing the four-dimensional interconnection interface system: in terms of energy, an integrated Qi standard wireless charging coil is used; and / or The following requirements must be met when designing the four-dimensional interconnection interface system: In terms of signal, a three-dimensional circuit antenna design is adopted.

10. The design method according to claim 1, characterized in that: The steps of designing a three-dimensional circuit manufacturing process according to the substrate material where the three-dimensional circuit is located include the following steps: When the substrate material of the three-dimensional circuit is conventional plastic, the three-dimensional circuit manufacturing process is LDS process or LAP process; When the substrate material where the three-dimensional circuit is located is a composite material or high-performance plastic, the three-dimensional circuit manufacturing process is a three-dimensional circuit spraying manufacturing process.

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