A heat dissipation structure for vertical plug-in IGBT

Abstract

The present invention discloses a heat dissipation structure for a vertical plug-in IGBT, which relates to the field of new energy electric drive technology. It includes a housing, on which an IGBT is vertically plugged; a heat-conducting seat, which is fixed on the housing, located between the IGBTs, the top of which is connected to a heat sink via a temperature difference spring, and a water channel is provided in the housing via a water circulation mechanism; heat dissipation fins, which are fixed on the top of the heat sink, and a cleaning assembly is provided between the heat dissipation fins for automatically cleaning the heat dissipation fins; a pressing plate, one end of which is fixed on the heat-conducting seat, and the other end of which is in contact with the outside of the IGBT. This heat dissipation structure for a vertical plug-in IGBT has efficient heat conduction and can automatically clean the heat dissipation fins.

Description

Technical Field

[0001] The present invention relates to the field of new energy electric drive technology, and in particular to a heat dissipation structure for a vertical plug-in IGBT. Background Art

[0002] In new energy electric drive systems, IGBTs are the most critical power devices. Their operating stability is crucial for evaluating the performance of electric drive systems. Effective heat dissipation of IGBTs can significantly improve system efficiency. IGBT heat dissipation is typically achieved by applying a thick layer of thermal grease and then mounting the device on a heat sink. The heat sink can be integrated with the housing or have fins, and heat dissipation can be aided by water cooling, air cooling, or heat pipes, with variations depending on the design structure.

[0003] The existing IGBT heat dissipation structure is easily loosened due to mechanical vibration during long-term use, resulting in loose contact and affecting the thermal conductivity. At the same time, long-term use will cause internal dust to accumulate on the heat dissipation fins, making it inconvenient to automatically clean them, which is also an important factor affecting the heat dissipation effect. Summary of the Invention

[0004] The purpose of the present invention is to provide a heat dissipation structure for a vertical plug-in IGBT to solve the problems raised by the above-mentioned background technology. The technical solution of the present invention addresses the technical problem that the existing technical solution is too simple and provides a solution that is significantly different from the existing technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a heat dissipation structure for a vertical plug-in IGBT, comprising a housing, wherein the IGBT is vertically plugged into the housing;

[0006] It also includes a heat-conducting seat, which is fixed on the housing and located between the IGBTs. The top of the heat-conducting seat is connected to a heat sink via a temperature difference spring. A water channel is provided in the housing via a water circulation mechanism.

[0007] Radiating fins, the radiating fins are fixed to the top of the heat sink, and a cleaning assembly is provided between the radiating fins for automatically cleaning the radiating fins;

[0008] A pressing piece, one end of which is fixed on the heat-conducting seat, and the other end of which is in contact with the outside of the IGBT.

[0009] Preferably, the heat-conducting seat and the heat-dissipating seat are both made of ceramic material, and thermal grease is coated between the heat-conducting seat and the casing.

[0010] Preferably, a telescopic heat-conducting column is connected between the heat-conducting seat and the heat-dissipating seat, the telescopic heat-conducting column is made of ceramic material, and the telescopic heat-conducting column is evenly distributed between the heat-conducting seat and the heat-dissipating seat.

[0011] Preferably, the temperature difference springs are distributed at four corners between the heat conducting seat and the heat dissipating seat, and the heat conducting seat and the heat dissipating seat are parallel to each other.

[0012] Preferably, the heat dissipation fins are symmetrically distributed on both sides of the heat dissipation base, the heat dissipation fins are tilted, and the heat dissipation fins are in contact with the IGBT.

[0013] Preferably, the cleaning assembly includes a scraper and a vertical rod, the scraper is arranged between two adjacent heat dissipation fins, the vertical rod is fixed to the bottom of the scraper, and the vertical rod passes through the heat dissipation seat and is fixed on the heat conduction seat.

[0014] Preferably, the side surface of the scraper is designed to be an arched structure, and the scraper is made of heat-conducting material.

[0015] Preferably, the pressing plates are symmetrically arranged on the heat-conducting seat, the pressing plates are made of elastic metal material, and the pressing plates are designed in a hook-shaped structure.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] In the present invention, after the IGBT is inserted into the housing, the elastic force of the pressing plate presses the IGBT tightly, so that the IGBT can be closely attached to the thermal seat, which facilitates efficient heat dissipation of the IGBT through the thermal seat, heat dissipation, and heat dissipation fins in conjunction with the water channel. At the same time, the pressing force of the pressing plate can also prevent vibration and loosening during long-term use, thereby providing long-term heat dissipation for the IGBT. Furthermore, the two sets of heat dissipation fins are arranged at an angle, which facilitates the diversion of heat in an inclined direction. The inclined direction is consistent with the direction of water flow, which helps to improve the heat dissipation effect and prevents the heat of the two sets of heat dissipation fins from being concentrated in the middle.

[0018] In the present invention, a temperature difference spring piece is arranged between the thermal conductive seat and the heat dissipation seat, so that when the temperature is high, the temperature difference spring piece is affected by the temperature difference to push the heat dissipation seat upward, on the one hand, the space between the thermal conductive seat and the heat dissipation seat is increased, and the air circulation is improved. On the other hand, the heat dissipation seat drives the heat dissipation fins to move upward, and the dust on the inner wall of the heat dissipation fin can be scraped off by the scraper, reducing the influence of dust on heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the top view of the structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the heat dissipation fin distribution structure of the present invention;

[0021] Figure 3 This is a schematic diagram of the side installation structure of the heat dissipation fin of the present invention;

[0022] Figure 4 This is a schematic diagram of the side structure of the scraper blade of the present invention;

[0023] Figure 5 This is a schematic diagram of the temperature difference spring distribution structure of the present invention.

[0024] In the figure: 1. Housing; 2. IGBT; 3. Thermal conductor; 4. Temperature difference spring; 5. Heat sink; 6. Water channel; 7. Heat sink fin; 81. Scraper; 82. Vertical pole; 9. Pressing piece; 10. Telescopic thermal column. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figure 1-Figure 5 , the present invention provides a technical solution: a heat dissipation structure for a vertical plug-in IGBT;

[0027] Embodiment 1: comprising a housing 1, on which an IGBT 2 is vertically plugged; further comprising a thermal base 3, fixed to the housing 1, located between the IGBTs 2, the top of the thermal base 3 being connected to a heat sink 5 via a temperature differential spring 4, a water channel 6 being provided within the housing 1 via a water circulation mechanism; heat sink fins 7 being symmetrically distributed on both sides of the heat sink 5, the heat sink fins 7 being arranged at an angle, and the heat sink fins 7 being in close contact with the IGBTs 2;

[0028] The pressing piece 9 is symmetrically arranged on the heat conducting seat 3. The pressing piece 9 is made of elastic metal material and has a hook-shaped structure. The heat dissipation fin 7 is fixed to the top of the heat dissipation seat 5. One end of the pressing piece 9 is fixed to the heat conducting seat 3, and the other end of the pressing piece 9 contacts the outside of the IGBT 2. The heat conducting seat 3 and the heat dissipation seat 5 are both made of ceramic material. Thermal grease is applied between the heat conducting seat 3 and the housing 1.

[0029] Insert IGBT2 vertically into the housing 1 and press IGBT2 with the pressing piece 9 so that IGBT2 is close to the thermal base 3, the heat sink 5 and the heat sink fin 7. The heat dissipation of IGBT2 is carried out through the thermal base 3, the heat sink 5 and the heat sink fin 7 in conjunction with the water channel 6.

[0030] Example 2: Based on Example 1, please refer to Figure 1-Figure 5 A telescopic heat-conducting column 10 is connected between the heat-conducting seat 3 and the heat-dissipating seat 5. The telescopic heat-conducting column 10 is made of ceramic material and is evenly distributed between the heat-conducting seat 3 and the heat-dissipating seat 5. The temperature difference springs 4 are distributed at the four corners between the heat-conducting seat 3 and the heat-dissipating seat 5. The heat-conducting seat 3 and the heat-dissipating seat 5 are parallel to each other.

[0031] A cleaning assembly is provided between the heat dissipation fins 7 for automatically cleaning the heat dissipation fins 7. The cleaning assembly includes a scraper 81 and a vertical rod 82. The scraper 81 is provided between two adjacent heat dissipation fins 7. The vertical rod 82 is fixed to the bottom of the scraper 81. The vertical rod 82 passes through the heat dissipation seat 5 and is fixed to the heat conduction seat 3. The side of the scraper 81 is designed with an arched structure and is made of heat-conducting material.

[0032] When the heat is high, the temperature difference spring 4 is deformed by the heat, lifting the heat sink 5, thereby increasing the space between the heat sink 5 and the thermal conductive base 3, thereby increasing air circulation. At the same time, the heat sink 5 drives the heat sink fins 7 to move upward. Under the fixing action of the vertical rod 82, the scraper 81 maintains its original position and scrapes the inner wall of the heat sink fin 7 to scrape off the dust on it.

[0033] Working principle: First, insert the IGBT2 vertically into the casing 1, and press the IGBT2 through the pressing piece 9, so that the IGBT2 is close to the thermal conductive seat 3, the heat sink 5 and the heat sink fins 7. The IGBT2 is cooled by the thermal conductive seat 3, the heat sink 5 and the heat sink fins 7 in cooperation with the water channel 6. When the heat is high, the temperature difference spring 4 is deformed by the heat, and the heat sink 5 is lifted up, so that the space between the heat sink 5 and the thermal conductive seat 3 is increased, thereby increasing air circulation. At the same time, the heat sink 5 drives the heat sink fins 7 to move upward. Under the fixing action of the vertical rod 82, the scraper 81 maintains its original position and scrapes the inner wall of the heat sink fin 7 to scrape off the dust on it, reducing the impact of dust on heat dissipation.

[0034] Any content not described in detail in this specification is prior art known to those skilled in the art. In the description of the present invention, unless otherwise specified, "plurality" means two or more. Terms such as "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," and "tail" indicate positions or relationships based on those shown in the accompanying drawings and are intended solely for ease of description and simplification. They do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation and are therefore not to be construed as limiting the present invention. Furthermore, terms such as "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, unless otherwise specified or limited, the terms "connected" and "connected" are to be understood broadly, meaning, for example, fixedly connected, detachably connected, or integrally connected; mechanically connected, electrically connected; directly connected, or indirectly connected through an intermediary. Those skilled in the art will understand the specific meanings of these terms in the present invention on a case-by-case basis.

[0035] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation structure for a vertically plugged IGBT, comprising a housing (1), wherein an IGBT (2) is vertically plugged into the housing (1); Its characteristics are: It also includes a heat-conducting seat (3), the heat-conducting seat (3) is fixed on the housing (1), the heat-conducting seat (3) is located between the IGBTs (2), the top of the heat-conducting seat (3) is connected to a heat sink (5) via a temperature difference spring (4), and a water channel (6) is provided in the housing (1) via a water circulation mechanism; Radiating fins (7), the radiating fins (7) being fixed to the top of the heat sink (5), and a cleaning assembly being provided between the radiating fins (7) for automatically cleaning the radiating fins (7); A pressing plate (9), one end of the pressing plate (9) is fixed on the heat conducting seat (3), and the other end of the pressing plate (9) contacts the outside of the IGBT (2). The heat dissipation fins (7) are symmetrically distributed on both sides of the heat dissipation seat (5). The heat dissipation fins (7) are tilted and fit the IGBT (2). The cleaning component includes a scraper (81) and a vertical rod (82). The scraper (81) is set between two adjacent heat dissipation fins (7). The vertical rod (82) is fixed at the bottom of the scraper (81). The vertical rod (82) passes through the heat dissipation seat (5) and is fixed on the heat conducting seat (3). The side of the scraper (81) is designed in an arched structure. The scraper (81) is made of heat conductive material. The temperature difference spring (4) is affected by the temperature difference to push the heat dissipation seat (5) upward, and the heat dissipation seat (5) drives the heat dissipation fins (7) upward. The dust on the inner wall of the heat dissipation fin (7) is scraped off by the scraper (81).

2. The heat dissipation structure for a vertical plug-in IGBT according to claim 1, characterized in that: The heat-conducting seat (3) and the heat-dissipating seat (5) are both made of ceramic material, and thermal grease is applied between the heat-conducting seat (3) and the housing (1).

3. The heat dissipation structure for a vertical plug-in IGBT according to claim 2, characterized in that: A telescopic heat-conducting column (10) is connected between the heat-conducting seat (3) and the heat-dissipating seat (5). The telescopic heat-conducting column (10) is made of ceramic material and is evenly distributed between the heat-conducting seat (3) and the heat-dissipating seat (5).

4. The heat dissipation structure for a vertical plug-in IGBT according to claim 3, characterized in that: The temperature difference springs (4) are distributed at four corners between the heat conducting seat (3) and the heat dissipating seat (5), and the heat conducting seat (3) and the heat dissipating seat (5) are parallel to each other.

5. The heat dissipation structure for a vertical plug-in IGBT according to claim 4, characterized in that: The pressing piece (9) is symmetrically arranged on the heat conducting seat (3), the pressing piece (9) is made of elastic metal material, and the pressing piece (9) is designed in a hook-shaped structure.

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