Circuit board and preparation method, device and equipment thereof

Abstract

The invention discloses a circuit board and a preparation method, device and equipment thereof. The preparation method of the circuit board comprises the steps that theoretical design parameters of the circuit board and position coordinates of actual design parameters of a circuit mother board in the same measurement coordinate system are acquired; the actual design parameters at least comprise the actual position of the electrical structure and actual main mark parameters, and the actual main mark parameters are located outside the area where the daughter board is located; according to the position coordinates of the theoretical design parameters and the actual design parameters, determining the position coordinates of the electrical structure estimation position corresponding to the theoretical position of the electrical structure in each daughter board; determining the position coordinates of the calibration positions of the electrical structures according to the position coordinates of the estimated positions of the electrical structures and the actual positions of the electrical structures; and according to the electrical structure calibration position, preparing a conductive structure at at least a part of the electrical structure calibration position, and mounting a component at the part of the electrical structure calibration position where the conductive structure is formed, so as to form the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a circuit board and a preparation method, device and equipment thereof. Background Art

[0002] In the field of printed circuit board processing, the circuit board will cause expansion and deformation due to environmental influences. When part of the circuit board is expanded and deformed, it will affect the working state of the entire circuit board.

[0003] Prior to printing or mounting a motherboard, prior art techniques involve selecting alignment points in an area of ​​the motherboard, outside the area where the daughterboards are located. Once these alignment points are aligned with alignment marks in the printer or placement machine, the daughterboards in the circuit template are printed and placed according to theoretical data. However, this process uses only the alignment points on the motherboard for alignment. If the daughterboards exhibit misalignment or distortion during splicing or connection, printing or placement errors can occur, resulting in the scrapping of some daughterboards and a reduction in production yield. Summary of the Invention

[0004] The present invention provides a circuit board and a method, device and equipment for preparing the same, so as to improve the preparation yield of the circuit board and reduce the cost.

[0005] In a first aspect, the present invention provides a method for preparing a circuit board, comprising:

[0006] Obtaining position coordinates of theoretical design parameters of the circuit board and actual design parameters of the circuit motherboard in the same measurement coordinate system; the circuit motherboard includes at least two daughter boards; the theoretical design parameters include at least a theoretical position of the electrical structure and theoretical main marking parameters; the actual design parameters include at least an actual position of the electrical structure and actual main marking parameters; the actual main marking parameters are located outside the area where the daughter boards are located;

[0007] Determining the position coordinates of the estimated position of the electrical structure corresponding to the theoretical position of the electrical structure in each of the sub-boards according to the position coordinates of the theoretical design parameters and the actual design parameters;

[0008] Determining the position coordinates of the calibrated positions of the electrical structures according to the position coordinates of the estimated positions of the electrical structures and the actual positions of the electrical structures;

[0009] According to the electrical structure calibration positions, conductive structures are prepared at at least part of the electrical structure calibration positions, and components are mounted at the part of the electrical structure calibration positions where the conductive structures are formed, so as to form the circuit board.

[0010] Optionally, determining the position coordinates of the estimated position of the electrical structure corresponding to the theoretical position of the electrical structure in each of the sub-boards according to the position coordinates of the theoretical design parameters and the actual design parameters includes:

[0011] According to the position coordinates of the theoretical design parameters and the actual design parameters, determining the first adjustment parameters of the circuit board based on the segmentation method and the least squares method; the first adjustment parameters include a first adjustment distance and a first adjustment angle;

[0012] The position coordinates of the estimated position of the electrical structure are determined according to the first adjustment parameter and the theoretical design parameter.

[0013] Optionally, determining the first adjustment parameter of the circuit board based on the position coordinates of the theoretical design parameter and the actual design parameter by using a segmentation method and a least squares method includes:

[0014] Determining the theoretical center point of the theoretical circuit board corresponding to the theoretical design parameters by calculating the position coordinates of the theoretical design parameters based on a segmentation method;

[0015] Determining the actual center point of the circuit board by calculation based on a segmentation method according to the position coordinates of the actual design parameters;

[0016] Calculating the distance between the theoretical center point and the actual center point, and determining the distance as the first adjustment distance;

[0017] Determining the position coordinates of the theoretical adjustment parameters according to the first adjustment distance and the theoretical design parameters;

[0018] The first adjustment angle is determined based on a least squares method according to the position coordinates of the theoretical adjustment parameter and the actual design parameter.

[0019] Optionally, determining the position coordinates of the calibrated position of the electrical structure according to the estimated position of each electrical structure and the position coordinates of the actual position of each electrical structure includes:

[0020] The sub-board currently to be calibrated is used as the sub-board to be calibrated; the sub-board to be calibrated includes a plurality of the electrical structures;

[0021] Determining sub-adjustment parameters of the sub-board to be calibrated based on a segmentation method and a least squares method according to the position coordinates of the actual positions of each electrical structure in the sub-board to be calibrated and the position coordinates of the estimated positions of each electrical structure corresponding to the sub-board to be calibrated; the sub-adjustment parameters include a sub-adjustment distance and a sub-adjustment angle;

[0022] determining the position coordinates of the calibrated position of the electrical structure according to the estimated position of the electrical structure and the sub-adjustment parameter;

[0023] The next sub-board to be calibrated is taken as the sub-board to be calibrated, and the steps of determining the position coordinates of the actual positions of the electrical structures in the sub-board to be calibrated and the position coordinates of the calibration positions of the electrical structures corresponding to the sub-board to be calibrated are returned to, and the steps of determining the sub-adjustment parameters of the sub-board to be calibrated to the position coordinates of the calibration positions of the electrical structures are determined based on the segmentation method and the least squares method, until the position coordinates of the calibration positions of the electrical structures of each sub-board are measured.

[0024] Optionally, determining the sub-adjustment parameters of the sub-board to be calibrated based on a segmentation method and a least squares method according to the position coordinates of the actual positions of the electrical structures in the sub-board to be calibrated and the position coordinates of the estimated positions of the electrical structures corresponding to the sub-board to be calibrated includes:

[0025] Determining the position coordinates of the actual sub-center point of the sub-board to be calibrated by calculation based on a segmentation method according to the position coordinates of the actual positions of each of the electrical structures in the sub-board to be calibrated;

[0026] Determining the position coordinates of the estimated sub-center point based on the segmentation method according to the position coordinates of the estimated positions of the electrical structures corresponding to the sub-board to be calibrated;

[0027] Calculating a distance between the estimated sub-center point and the actual sub-center point, and determining the distance as the sub-adjustment distance;

[0028] Determining the position coordinates of the electrical structure adjustment position based on the sub-adjustment distance and the estimated position of the electrical structure;

[0029] The sub-adjustment angle is determined based on the least square method according to the position coordinates of the actual position of each electrical structure in the sub-board to be calibrated and the position coordinates of the adjusted position of each electrical structure corresponding to the sub-board to be calibrated.

[0030] Optionally, determining the position coordinates of the calibrated position of the electrical structure according to the position coordinates of the estimated position of the electrical structure and the sub-adjustment parameter includes:

[0031] Along a first direction from the estimated sub-center point to the actual sub-center point, the position coordinates of the estimated position of the electrical structure after being moved along the first direction by the sub-adjustment distance are used as the intermediate calibration position;

[0032] The position of the line connecting the intermediate calibration position and the actual sub-center point after rotating the sub-adjustment angle with the actual sub-center point as the center of the circle is used as the position coordinate of the electrical structure calibration position.

[0033] Optionally, preparing a conductive structure at at least part of the electrical structure marked positions according to the electrical structure marked positions includes:

[0034] A tin dispensing machine or a tin spraying machine is used to apply tin paste on at least part of the calibrated positions of the electrical structure.

[0035] In a second aspect, the present invention provides a circuit board manufacturing device, comprising:

[0036] a parameter acquisition module, configured to acquire position coordinates of theoretical design parameters and actual design parameters of the circuit board in the same measurement coordinate system; the circuit board includes at least two sub-boards; the theoretical design parameters include at least a theoretical position of the electrical structure; the actual design parameters include at least an actual position of the electrical structure and actual main marking parameters, and the actual main marking parameters are located outside the area where the sub-boards are located;

[0037] an estimated position determination module, configured to determine the position coordinates of the estimated position of the electrical structure corresponding to the theoretical position of the electrical structure in each of the sub-boards according to the position coordinates of each of the theoretical design parameters and the actual design parameters;

[0038] a calibration position determination module, configured to determine the position coordinates of the calibration position of the electrical structure according to the estimated position of each electrical structure and the position coordinates of the actual position of each electrical structure;

[0039] The printed patch module is used to prepare a conductive structure at at least part of the electrical structure calibration positions according to the electrical structure calibration positions, and to mount components at part of the electrical structure calibration positions.

[0040] In a third aspect, the present invention provides an electronic device, comprising:

[0041] at least one processor; and

[0042] a memory communicatively connected to the at least one processor; wherein,

[0043] The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for preparing a circuit board described in the first aspect.

[0044] In a fourth aspect, the present invention provides a circuit board, which is manufactured using the method for manufacturing a circuit board described in the first aspect.

[0045] The technical solution provided by the present invention obtains the position coordinates of the theoretical design parameters of the circuit board and the actual design parameters of the circuit motherboard in the same measurement coordinate system, and determines the overall deviation of the circuit motherboard from the theoretical circuit board corresponding to the theoretical design parameters based on the position coordinates of the theoretical design parameters and the actual design parameters. Then, based on the overall deviation, the position coordinates of the estimated electrical structure position corresponding to the theoretical electrical structure position in each daughterboard are determined. Then, based on the position coordinates of each electrical structure estimated position and the actual electrical structure position, the local deviation between the estimated electrical structure position and the actual electrical structure position in a single daughterboard is determined. Then, based on the local deviation, the electrical structure calibration position in each daughterboard is determined, thereby improving the accuracy and reliability of determining the electrical structure calibration position. Finally, based on the electrical structure calibration position, conductive structures are prepared at at least part of the electrical structure calibration position, and components are mounted at the part of the electrical structure calibration position where the conductive structure is formed. This can improve the position reliability and accuracy of the conductive structure and component mounting, thereby improving the production yield of the circuit board and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A flowchart of a method for preparing a circuit board provided in an embodiment of the present invention;

[0047] Figure 2 A schematic structural diagram of a circuit motherboard provided by an embodiment of the present invention;

[0048] Figure 3 A flowchart of another method for preparing a circuit board provided by an embodiment of the present invention;

[0049] Figure 4 A flowchart of another method for preparing a circuit board provided in an embodiment of the present invention;

[0050] Figure 5 A schematic structural diagram of a circuit board manufacturing device provided by an embodiment of the present invention;

[0051] Figure 6 A schematic structural diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0052] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0053] An embodiment of the present invention provides a method for preparing a circuit board. The method is used to prepare the circuit board provided by the embodiment of the present invention. Figure 1A flowchart of a method for preparing a circuit board provided in an embodiment of the present invention is provided. Figure 2 A schematic diagram of the structure of a circuit motherboard provided by an embodiment of the present invention. Figure 1 As shown, the method for preparing the circuit board includes:

[0054] S101: Obtain position coordinates of theoretical design parameters of a circuit board and actual design parameters of a circuit motherboard in the same measurement coordinate system.

[0055] Among them, reference Figure 2 The circuit motherboard 01 includes at least two daughter boards 02; the theoretical design parameters include at least the theoretical position of the electrical structure, and the actual design parameters include at least the actual position of the electrical structure and the actual main marking parameters, and the actual main marking parameters are located outside the area where the daughter boards are located. The electrical structure 03 includes structures such as pads 032 or marking points 031 that can calibrate the position of the daughter board 02. The theoretical position of the electrical structure represents the theoretical position of the electrical structure in the circuit board, and the actual position of the electrical structure represents the actual position of the electrical structure in the circuit motherboard 01. The main marking parameters may include structures that characterize the position of the circuit motherboard. For example, the main marking parameters include the marking point 011 of the circuit motherboard 01. The theoretical design parameters include theoretical main marking parameters corresponding to the actual main marking parameters, and the theoretical design parameters can be obtained from the circuit board layout setting device. For example, the theoretical design parameters of the circuit board can be obtained through Computer Aided Design (CAD) equipment and Electronic Design Automation (EDA) software. The circuit board includes a spliced ​​circuit board or a multi-board circuit board, which can be set according to actual needs.

[0056] The solution of the prior art only aligns the actual main marking parameters with the theoretical main marking parameters, and then prints and mounts the circuit motherboard according to the theoretical design parameters, ignoring the errors caused by variations such as offset or torsion of each sub-board 02 in the circuit motherboard 01 relative to the circuit motherboard 01. For example, sub-boards 021 and 024 rotate, sub-board 022 is locally deformed, sub-board 023 is deformed to be wider at the top and narrower at the bottom, and sub-board 025 is twisted, resulting in some sub-board printing errors or mounting errors in the finally prepared circuit board, thereby reducing the preparation yield of the circuit board.

[0057] Specifically, the present invention uses precision measuring instruments to measure the actual position of each electrical structure and the position coordinates of each actual primary marking parameter on the circuit motherboard 01, thereby improving the accuracy of the measured parameters. Precision measuring instruments have high measurement accuracy. Compared to the measurement equipment built into a placement machine or printer, the data measured by precision measuring instruments is more reliable. This improves the accuracy of the calibrated position of the electrical structure determined based on the parameters obtained by the precision measuring instrument, thereby improving the accuracy of subsequent printing or placement, and increasing the yield rate of circuit board production.

[0058] It is understood that to further improve the measurement accuracy of the actual position of the electrical structure and the position coordinates of the actual primary marking parameters, the average value of multiple measurements of the same parameter using a precision measuring instrument can be used as the position coordinate of the parameter in the measurement coordinate system. Furthermore, it should be noted that after the circuit motherboard is placed on the operating platform of the placement machine or conductive material preparation machine, the position of the circuit motherboard is fixed to avoid problems such as placement errors caused by the position of the circuit motherboard.

[0059] S102 : Determine the position coordinates of the estimated position of the electrical structure corresponding to the theoretical position of the electrical structure in each sub-board according to the position coordinates of the theoretical design parameters and the actual design parameters.

[0060] Specifically, the theoretical center coordinates of the theoretical circuit board corresponding to the theoretical design parameters can be determined based on the position coordinates of each parameter in the theoretical design parameters in the measurement coordinate system. The actual center coordinates of the circuit board in the measurement coordinate system can be determined based on the position coordinates of each parameter in the actual design parameters in the measurement coordinate system. Then, based on the spacing and deflection angle between the theoretical and actual center coordinates, the position coordinates of the theoretical position of the electrical structure in the theoretical design parameters are adjusted by the spacing and deflection angle to serve as the position coordinates of the estimated electrical structure position.

[0061] S103 , determining the position coordinates of the calibrated positions of the electrical structures according to the position coordinates of the estimated positions of the electrical structures and the actual positions of the electrical structures.

[0062] Specifically, the estimated electrical structure position is determined based on theoretical and actual design parameters, i.e., the overall structural position of the circuit motherboard is estimated. However, when some sub-boards within the circuit motherboard exhibit excessive offset angles or significant expansion or contraction, the estimated electrical structure position may still deviate from the actual position. In this case, the estimated center coordinates of each sub-board can be determined based on the estimated electrical structure positions within each sub-board. The actual center coordinates of each sub-board can then be determined based on the actual electrical structure positions within each sub-board. The spacing and deflection angle between the estimated center coordinates and the actual center coordinates are calculated, and the coordinates of the estimated electrical structure position shifted by the spacing and deflection angle are used as the electrical calibration position. In this manner, after a rough adjustment of the overall parameters based on the parameters within the circuit motherboard, further fine-tuning is performed on a sub-board basis, based on the actual and estimated electrical structure positions within each sub-board. This allows the electrical structure calibration position to shift accordingly with the deformation of the sub-board, thereby improving the accuracy and reliability of the electrical structure calibration position determination within each sub-board. Improve the accuracy of subsequent patch or printing, thereby improving the quality of circuit boards

[0063] S104 , preparing conductive structures at at least a portion of the electrical structure calibration positions according to the electrical structure calibration positions, and mounting components at the portion of the electrical structure calibration positions where the conductive structures are formed, to form a circuit board.

[0064] Among them, the conductive structure includes solder paste, and the components include chips, resistors or capacitors, etc., which can be set according to actual needs and are not specifically limited here.

[0065] Specifically, the electrical structure calibration position determined by the above steps has high reliability. Then, according to the setting requirements of the circuit board, conductive structures such as solder paste are set at at least part of the electrical structure calibration position, so that the subsequent placement machine can fix the components to be mounted in contact with the conductive structure, thereby improving the mounting stability of the components and the circuit motherboard, improving the preparation yield of the circuit board, and reducing costs.

[0066] Optionally, according to the electrical structure calibration position, a conductive structure is prepared at at least part of the electrical structure calibration position, including applying solder paste at at least part of the electrical structure calibration position using a tinning machine or a tin spraying machine.

[0067] Among them, tin dispensing machines and tin spraying machines are used for dispensing or spraying tin paste / solder on electronic components. Tin dispensing machines or tin spraying machines have the characteristics of high precision and automation.

[0068] It's important to note that existing technology involves preparing a stencil based on theoretical design parameters. Using the stencil and a printer, the conductive structures are placed at the theoretical locations of the electrical structures on the motherboard. This direct printing of the conductive structures using the stencil ignores the deformation of the daughterboard, resulting in inaccurate printed positions. Furthermore, the stencil itself exhibits deviations during the manufacturing process, leading to significant deviations in the placement of the conductive structures, impacting the PCB production yield.

[0069] Specifically, the calculated electrical structure calibration position can be transmitted to a tinning machine or a tin spraying machine, so that the tinning machine or the tin spraying machine tins or sprays tin at the electrical structure calibration position where the conductive structure needs to be set, thereby improving the setting accuracy of the conductive structure.

[0070] It is understandable that the electrical structure calibration position can also be transmitted to the placement machine, so that the placement machine can accurately place components at some electrical structure calibration positions, increase the contact area between the components and the conductive structure, avoid the problem of components falling off during subsequent use due to the small contact area between the components and the conductive structure, and increase the service life of the circuit board.

[0071] The technical solution provided by the present invention obtains the position coordinates of the theoretical design parameters of the circuit board and the actual design parameters of the circuit motherboard in the same measurement coordinate system, and determines the overall deviation of the circuit motherboard from the theoretical circuit board corresponding to the theoretical design parameters based on the position coordinates of the theoretical design parameters and the actual design parameters. Then, based on the overall deviation, the position coordinates of the estimated electrical structure position corresponding to the theoretical electrical structure position in each daughterboard are determined. Then, based on the position coordinates of each electrical structure estimated position and the actual electrical structure position, the local deviation between the estimated electrical structure position and the actual electrical structure position in a single daughterboard is determined. Then, based on the local deviation, the electrical structure calibration position in each daughterboard is determined, thereby improving the accuracy and reliability of determining the electrical structure calibration position. Finally, based on the electrical structure calibration position, conductive structures are prepared at at least part of the electrical structure calibration position, and components are mounted at the part of the electrical structure calibration position where the conductive structure is formed. This can improve the position reliability and accuracy of the conductive structure and component mounting, thereby improving the production yield of the circuit board and reducing costs.

[0072] Optionally, based on the above embodiment, the embodiment of the present invention describes the situation of determining the position coordinates of the estimated position of the electrical structure corresponding to the theoretical position of the electrical structure in each sub-board based on the position coordinates of the theoretical design parameters and the actual design parameters. Figure 3 A flow chart of another method for preparing a circuit board provided in an embodiment of the present invention is shown in FIG. Figure 3 As shown, the method for preparing the circuit board includes:

[0073] S201: Obtain position coordinates of theoretical design parameters of a circuit board and actual design parameters of a circuit motherboard in the same measurement coordinate system.

[0074] Among them, the circuit motherboard includes at least two daughter boards; the theoretical design parameters include at least the theoretical position of the electrical structure and the theoretical main marking parameters, and the actual design parameters include at least the actual position of the electrical structure and the actual main marking parameters, and the actual main marking parameters are located outside the area where the daughter boards are located.

[0075] S202 : Determine first adjustment parameters of the circuit board based on a segmentation method and a least squares method according to the position coordinates of the theoretical design parameters and the actual design parameters.

[0076] The first adjustment parameter includes a first adjustment distance and a first adjustment angle. The first adjustment distance can be a vector, that is, including a direction and a value. The measurement coordinate system includes an X-axis and a Y-axis, and the first adjustment distance includes an X-direction first adjustment distance in the X-axis direction and / or a Y-direction first adjustment distance in the Y-axis direction.

[0077] Specifically, the theoretical position of each electrical structure can be connected to the theoretical main marking parameter, and the position coordinates of the theoretical center point of the theoretical circuit board corresponding to the theoretical design parameter can be determined based on a segmentation method. Furthermore, the actual position of each electrical structure can be connected to the actual main marking parameter, and the position coordinates of the actual center point of the circuit board can be determined based on a segmentation method. The distance between the theoretical center point and the actual center point is used as a first adjustment distance. Based on the first adjustment distance, the position coordinates of the theoretical design parameter after being shifted by the first adjustment distance are used as the position coordinates of the theoretical adjustment parameter. The theoretical adjustment parameter represents the position after the theoretical design parameter is adjusted, and the position coordinates of the theoretical center point after being adjusted based on the first adjustment distance coincide with the position coordinates of the actual center point. Then, in the triangle formed by the electrical structure adjustment position, the actual electrical structure position, and the actual center point, the angle between the line connecting the electrical structure adjustment position and the actual center point and the line connecting the electrical structure actual position and the actual center point is used as a first rotation angle. The first rotation angle of each electrical structure theoretical position can be determined based on the above principles. Then, based on the least square method, a first adjustment angle is determined according to each first rotation angle to minimize the comprehensive deviation between the estimated position of each electrical structure and the actual position of each electrical structure.

[0078] It should be noted that the direction of the rotation angle can be marked according to actual needs. For example, if the direction in which the electrical structure adjustment position points to the actual position of the electrical structure is counterclockwise, the first rotation angle is a positive value. If the direction in which the electrical structure adjustment position points to the actual position of the electrical structure is clockwise, the first rotation angle is a negative value. It can be set according to actual needs and is not specifically limited here.

[0079] Optionally, the first adjustment parameters of the circuit board are determined based on the segmentation method and the least squares method according to the position coordinates of the theoretical design parameters and the actual design parameters, including: determining the theoretical center point of the theoretical circuit board corresponding to the theoretical design parameters based on the segmentation method according to the position coordinates of the theoretical design parameters; determining the actual center point of the circuit board based on the segmentation method according to the position coordinates of the actual design parameters; calculating the distance between the theoretical center point and the actual center point, and determining the distance as the first adjustment distance; determining the position coordinates of the theoretical adjustment parameters based on the first adjustment distance and the theoretical design parameters; and determining the first adjustment angle based on the least squares method according to the position coordinates of the theoretical adjustment parameters and the actual design parameters.

[0080] Among them, the theoretical adjustment parameters include the theoretical adjustment position of the electrical structure and the theoretical adjustment main mark parameters.

[0081] Specifically, the theoretical positions of each electrical structure and the theoretical main marking parameters can be connected, and the theoretical circuit board can be divided into multiple first geometric figures using the theoretical positions of each electrical structure and the theoretical main marking parameters. The geometric center of each first geometric figure can be determined based on the coordinates of the theoretical marking points that constitute the first geometric figures. Then, the geometric centers can be connected, and the theoretical circuit board can be divided into multiple second geometric figures using the geometric centers. The geometric center of each second geometric figure can be determined based on the coordinates of the geometric centers that constitute the second geometric figures. The above process is continued until only one geometric figure is formed after connecting the geometric centers. The geometric center of this geometric figure is then used as the theoretical center point of the theoretical circuit board.

[0082] It should be noted that the above description is only based on the example of determining the theoretical center point of the theoretical circuit board corresponding to the theoretical design parameters. The principle of determining the actual center point of the circuit motherboard is similar to the calculation principle of the theoretical center point. You can refer to the above description and will not repeat it here.

[0083] Specifically, the difference between the ordinate of the actual center point and the ordinate of the theoretical center point can be calculated, and the difference can be used as the Y-axis adjustment distance. The difference between the abscissa of the actual center point and the abscissa of the theoretical center point can be calculated, and the difference can be used as the X-axis adjustment distance.

[0084] The theoretical design parameter is moved in the X direction by the X-direction adjustment distance, and in the Y direction by the Y-direction adjustment distance, so that the position coordinates of the theoretical adjustment parameter are close to the position coordinates of the actual design parameter. Then, in the triangle formed by the electrical structure adjustment position, the actual position of the electrical structure, and the actual center point, the angle between the line connecting the electrical structure adjustment position and the actual center point and the line connecting the actual position of the electrical structure and the actual center point is used as the first rotation angle. The first rotation angle of each electrical structure theoretical position can be determined with reference to the above principle. Then, based on the least squares method, the first adjustment angle that minimizes the comprehensive deviation between the estimated position of each electrical structure and the actual position of each electrical structure is determined according to each first rotation angle.

[0085] S203 : Determine the position coordinates of the estimated position of the electrical structure according to the first adjustment parameter and the theoretical design parameter.

[0086] Specifically, according to the first adjustment distance in the first adjustment parameter, the theoretical design parameter is moved by the first adjustment distance to obtain the theoretical adjustment parameter, and then according to the first adjustment angle in the first adjustment parameter, the theoretical adjustment parameter is rotated by the first adjustment angle to determine the position coordinates of the estimated position of the electrical structure.

[0087] For example, if the first adjustment distance is +1mm in the X direction and -1mm in the Y direction, i.e., (+1mm, -1mm), the position coordinates of each position in the theoretical design parameter are summed with (+1mm, -1mm) in the X and Y directions as the position coordinates of the theoretical adjustment parameter. The first rotation angle is +2°, and the position coordinates of the electrical structure adjustment position in the theoretical adjustment parameter, rotated 2° counterclockwise about the theoretical adjustment center point, are used as the position coordinates of the electrical structure estimated position.

[0088] S204 : Determine the position coordinates of the calibrated positions of the electrical structures according to the position coordinates of the estimated positions of the electrical structures and the actual positions of the electrical structures.

[0089] S205 , preparing conductive structures at at least a portion of the electrical structure calibration positions according to the electrical structure calibration positions, and mounting components at the portion of the electrical structure calibration positions where the conductive structures are formed, to form a circuit board.

[0090] The technical solution of the present invention calculates and determines the first adjustment parameters of the circuit board according to the position coordinates of the theoretical design parameters and the actual design parameters through the segmentation method and the least squares method, so that after the theoretical design parameters are moved and rotated according to the first adjustment parameters, the estimated position of the electrical structure determined has a smaller deviation from the actual position of the electrical structure, thereby improving the accuracy of the subsequent determination of the electrical structure calibration position based on the estimated position of the electrical structure.

[0091] Optionally, based on the above embodiment, the embodiment of the present invention describes a case where the position coordinates of the calibrated position of the electrical structure are determined according to the position coordinates of the estimated position of each electrical structure and the actual position of each electrical structure. Figure 4 A flow chart of another method for preparing a circuit board provided in an embodiment of the present invention is shown in FIG. Figure 4 As shown, the method for preparing the circuit board includes:

[0092] S301: Obtain position coordinates of theoretical design parameters of a circuit board and actual design parameters of a circuit motherboard in the same measurement coordinate system.

[0093] Among them, the circuit motherboard includes at least two daughter boards; the theoretical design parameters include at least the theoretical position of the electrical structure and the theoretical main marking parameters, and the actual design parameters include at least the actual position of the electrical structure and the actual main marking parameters, and the actual main marking parameters are located outside the area where the daughter boards are located.

[0094] S302 : Determine the position coordinates of the estimated position of the electrical structure corresponding to the theoretical position of the electrical structure in each sub-board according to the position coordinates of the theoretical design parameters and the actual design parameters.

[0095] S303: The sub-board currently to be calibrated is used as the sub-board to be calibrated.

[0096] The sub-board to be calibrated includes multiple electrical structures.

[0097] Specifically, since the circuit board includes multiple sub-boards, the electrical structure calibration position of each sub-board can be determined in sequence to improve the placement accuracy of components in each sub-board, thereby improving the production yield of the circuit board.

[0098] S304: Determine the sub-adjustment parameters of the sub-board to be calibrated based on the segmentation method and the least squares method according to the position coordinates of the actual positions of the electrical structures in the sub-board to be calibrated and the position coordinates of the estimated positions of the electrical structures corresponding to the sub-board to be calibrated.

[0099] The sub-adjustment parameters include a sub-adjustment distance and a sub-adjustment angle. The sub-adjustment distance can be a vector, i.e., it includes a direction and a value. The measurement coordinate system includes an X-axis and a Y-axis. The sub-adjustment distance can include an X-direction sub-adjustment distance in the X-axis direction and / or a Y-direction sub-adjustment distance in the Y-axis direction, or the direction of the self-adjustment distance can form a certain angle with the X-axis or Y-axis.

[0100] Specifically, the estimated positions of each electrical structure located in the same sub-board to be calibrated can be connected, and the position coordinates of the estimated sub-center point of the sub-board to be calibrated can be determined based on a segmentation method. Furthermore, the actual positions of each electrical structure located in the same sub-board to be calibrated can be connected, and the position coordinates of the actual sub-center point of the calibrated sub-board can be determined based on a segmentation method. The distance between the estimated sub-center point and the actual sub-center point is used as a sub-adjustment distance. Based on the sub-adjustment distance, the position coordinates of each electrical structure in the sub-board to be calibrated are shifted by the sub-adjustment distance to serve as the position coordinates of the adjusted electrical structure position. The adjusted electrical structure position represents the position after the estimated electrical structure position is adjusted, and the position coordinates of the estimated sub-center point, adjusted based on the sub-adjustment distance, coincide with the position coordinates of the actual sub-center point. Then, in the triangle formed by the adjusted electrical structure position, the actual electrical structure position, and the actual sub-center point, the angle between the line connecting the adjusted electrical structure position and the actual sub-center point and the line connecting the actual electrical structure position and the actual sub-center point is used as the second rotation angle. The second rotation angle of each estimated electrical structure position can be determined based on the above-described principles. Then, based on the least square method, a sub-adjustment angle that minimizes the comprehensive deviation between the estimated position of each electrical structure and the actual position of each electrical structure is determined according to each second rotation angle.

[0101] It should be noted that the direction of the sub-adjustment angle can be marked according to actual needs. For example, if the direction in which the electrical structure adjustment position points to the actual position of the electrical structure is counterclockwise, the second rotation angle is a positive value. If the direction in which the electrical structure adjustment position points to the actual position of the electrical structure is clockwise, the second rotation angle is a negative value. It can be set according to actual needs and is not specifically limited here.

[0102] Optionally, the sub-adjustment parameters of the sub-board to be calibrated are determined based on the segmentation method and the least squares method according to the position coordinates of the actual positions of each electrical structure in the sub-board to be calibrated and the position coordinates of the estimated positions of each electrical structure corresponding to the sub-board to be calibrated, including determining the position coordinates of the actual sub-center point of the sub-board to be calibrated based on the segmentation method according to the position coordinates of the actual positions of each electrical structure in the sub-board to be calibrated; determining the position coordinates of the estimated sub-center point based on the segmentation method according to the position coordinates of the estimated positions of each electrical structure corresponding to the sub-board to be calibrated; calculating the distance between the estimated sub-center point and the actual sub-center point, and determining the distance as the sub-adjustment distance; determining the position coordinates of the electrical structure adjustment position according to the sub-adjustment distance and the estimated position of the electrical structure; and determining the sub-adjustment angle based on the least squares method according to the position coordinates of the actual positions of each electrical structure in the sub-board to be calibrated and the position coordinates of the electrical structure adjustment position corresponding to the sub-board to be calibrated.

[0103] Specifically, the estimated positions of the electrical structures on the same sub-board to be calibrated can be connected, and the sub-board to be calibrated can be divided into multiple first sub-geometric figures based on the estimated positions of the electrical structures. The geometric center of each first sub-geometric figure is determined based on the position coordinates of the estimated positions of the electrical structures that constitute the first sub-geometric figures. The sub-geometric centers of each first sub-geometric figure are then connected, and the theoretical circuit board is divided into multiple second sub-geometric figures based on the coordinates of the sub-geometric centers that constitute the second sub-geometric figures. The sub-geometric center of each second sub-geometric figure is determined based on the coordinates of the sub-geometric centers that constitute the second sub-geometric figures. The above process is continued until only one sub-geometric figure is formed after connecting the sub-geometric centers. The sub-geometric center of this sub-geometric figure is then used as the estimated sub-center point of the calibrated sub-board.

[0104] It should be noted that the above description is only based on the example of determining the estimated sub-center point of the sub-board to be calibrated corresponding to the estimated position of the electrical structure. The principle of determining the actual sub-center point of the sub-board to be calibrated is similar to the calculation principle of the estimated sub-center point. You can refer to the above description and will not repeat it here.

[0105] Specifically, the difference between the ordinate of the actual sub-center point and the ordinate of the estimated sub-center point can be calculated, and the difference can be used as the Y-direction sub-adjustment distance in the Y-axis direction. The difference between the abscissa of the actual sub-center point and the abscissa of the estimated sub-center point can be calculated, and the difference can be used as the X-direction sub-adjustment distance in the X-axis direction.

[0106] The estimated position of each electrical structure in the same calibration stator board is moved in the X direction by the X-direction sub-adjustment distance and in the Y direction by the Y-direction sub-adjustment distance, so that the position coordinates of the adjusted electrical structure adjustment position are close to the position coordinates of the actual design parameters. Then, in the triangle formed by the electrical structure adjustment position, the actual electrical structure position, and the actual sub-center point, the angle between the line connecting the electrical structure adjustment position and the actual sub-center point and the line connecting the actual electrical structure position and the actual sub-center point is used as the second rotation angle. The second rotation angle of each electrical structure estimated position can be determined with reference to the above principle. Then, based on the least squares method, the sub-adjustment angle that minimizes the comprehensive deviation between each electrical structure adjustment position and the actual electrical structure position is determined based on each second rotation angle.

[0107] S305 : Determine the position coordinates of the electrical structure calibration position according to the estimated position of the electrical structure and the sub-adjustment parameters.

[0108] Specifically, according to the sub-adjustment distance in the sub-adjustment parameter, the estimated position of each electrical structure in the sub-board to be calibrated is moved by the sub-adjustment distance to obtain the electrical structure adjustment position, and then according to the sub-adjustment angle in the sub-adjustment parameter, the electrical structure adjustment position is rotated by the sub-adjustment angle with the actual sub-center of the sub-board to be calibrated as the center of the circle to determine the position coordinates of the electrical structure calibration position.

[0109] For example, if the sub-adjustment distances for the same sub-board to be calibrated are +0.1mm in the X direction and -0.1mm in the Y direction, i.e. (+0.1mm, -0.1mm), then the coordinates of the estimated positions of the electrical structures of the sub-board to be calibrated are summed with (+0.1mm, -0.1mm) to obtain the coordinates of the adjusted positions of the electrical structures. If the sub-rotation angle is +0.5°, the coordinates of the adjusted positions of the electrical structures, rotated 0.5° counterclockwise around the actual sub-center point, are used as the coordinates of the calibrated positions of the electrical structures.

[0110] Optionally, the position coordinates of the calibrated position of the electrical structure are determined based on the position coordinates and sub-adjustment parameters of the estimated position of the electrical structure, including: moving the estimated position of the electrical structure by a sub-adjustment distance along the first direction from the estimated sub-center point to the actual sub-center point as the intermediate calibration position; and rotating the line connecting the intermediate calibration position and the actual sub-center point by a sub-adjustment angle with the actual sub-center point as the center of the circle as the position coordinates of the calibrated position of the electrical structure.

[0111] The sub-adjustment distance may be the distance between the estimated sub-center point and the actual sub-center point.

[0112] Specifically, the estimated position of each electrical structure in the sub-board to be calibrated can be moved by a sub-adjustment distance in a first direction from the estimated sub-center point to the actual sub-center point to obtain an intermediate calibration position. In this case, the intermediate calibration position is only adjusted in terms of orientation. The line connecting the intermediate calibration position and the actual sub-center point is then rotated by a sub-adjustment angle about the actual sub-center point to determine the position coordinates of the electrical structure calibration position. This allows for further correction of the intermediate calibration position based on the offset angle, bringing the electrical structure calibration position closer to the actual electrical structure position. This improves the accuracy and reliability of the subsequent formation of conductive structures and components at the electrical structure calibration position, improves the precision and reliability of circuit board fabrication, and reduces scrap rates and costs.

[0113] It should be noted that the electrical structure adjustment position and the intermediate calibration position mentioned above are the same concept, that is, for the same sub-board to be calibrated, the electrical structure adjustment position and the intermediate calibration position have the same position coordinates.

[0114] S306 , taking the next sub-board to be calibrated as the sub-board to be calibrated, and returning to S304 , until the position coordinates of the calibration positions of the electrical structures of each sub-board are measured.

[0115] Specifically, the circuit board includes multiple sub-boards. After the electrical structure calibration position of one of the sub-boards is determined, the next sub-board can be used as the sub-board to be calibrated, and then the position coordinates of each electrical structure calibration position in each sub-board can be determined with reference to the above principle. Then, when the conductive structure and mounted components are subsequently prepared according to the electrical structure calibration position of each sub-board, the single-board error of the sub-board can be taken into account to improve the preparation reliability of each sub-board.

[0116] S307 , preparing conductive structures at at least a portion of the electrical structure calibration positions according to the electrical structure calibration positions, and mounting components at the portion of the electrical structure calibration positions where the conductive structures are formed, to form a circuit board.

[0117] The technical solution of the present invention uses the current sub-board to be calibrated as the sub-board to be calibrated, and calculates the sub-adjustment parameters of the sub-board to be calibrated based on the position coordinates of the actual positions of each electrical structure in the sub-board to be calibrated and the position coordinates of the estimated positions of each electrical structure corresponding to the sub-board to be calibrated using the segmentation method and the least squares method. Then, based on the estimated electrical structure positions and the sub-adjustment parameters, the position coordinates of the electrical structure calibration positions are determined, taking into account variations such as offset of individual sub-boards, thereby improving the accuracy and reliability of the calibration positions of each electrical structure in a single sub-board. The next sub-board to be calibrated is then used as the sub-board to be calibrated, and the above process is repeated until the position coordinates of the calibration positions of each electrical structure of each sub-board are measured. This improves the accuracy and reliability of the calibration positions of the electrical structures in each sub-board in the circuit motherboard, and further, after the conductive structures and components are prepared based on the calibration positions of the electrical structures, a circuit board with a high production yield is formed, thereby reducing scrap rate and cost.

[0118] The embodiment of the present invention further provides a device for preparing a circuit board. Figure 5 A schematic structural diagram of a circuit board manufacturing device provided by an embodiment of the present invention is shown in FIG. Figure 5 As shown, the circuit board preparation device includes:

[0119] The parameter acquisition module 10 is configured to obtain the position coordinates of the theoretical design parameters of the circuit board and the actual design parameters of the circuit motherboard in the same measurement coordinate system; the circuit motherboard includes at least two daughter boards; the theoretical design parameters include at least the theoretical position of the electrical structure and the theoretical main marking parameters; the actual design parameters include at least the actual position of the electrical structure and the actual main marking parameters; the actual main marking parameters are located outside the area where the daughter boards are located;

[0120] An estimated position determination module 20 is used to determine the position coordinates of the estimated position of the electrical structure corresponding to the theoretical position of the electrical structure in each sub-board according to the position coordinates of each theoretical design parameter and the actual design parameter;

[0121] a calibration position determination module 30 for determining the position coordinates of the calibration positions of the electrical structures based on the estimated positions of the electrical structures and the position coordinates of the actual positions of the electrical structures;

[0122] The printed patch module 40 is used to prepare a conductive structure at at least part of the electrical structure calibration position according to the electrical structure calibration position, and to mount components at part of the electrical structure calibration position to form a circuit board.

[0123] The circuit board manufacturing device provided in an embodiment of the present invention can execute the circuit board manufacturing method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method. The similarities can be referred to the above description.

[0124] Figure 6 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention is shown in FIG. Figure 6 As shown, electronic devices are intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. Electronic devices can also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are intended to be examples only and are not intended to limit the implementation of the inventions described and / or claimed herein.

[0125] like Figure 6 As shown, the electronic device 50 includes at least one processor 51 and a memory connected to the at least one processor 51, such as a read-only memory (ROM) 52, a random access memory (RAM) 53, etc., wherein the memory stores a computer program that can be executed by the at least one processor, and the processor 51 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 52 or the computer program loaded from the storage unit 58 to the random access memory (RAM) 53. Various programs and data required for the operation of the electronic device 50 can also be stored in the RAM 53. The processor 51, ROM 52 and RAM 53 are connected to each other via a bus 54. An input / output (I / O) interface 55 is also connected to the bus 54.

[0126] Multiple components in the electronic device are connected to the I / O interface 55, including an input unit 56, such as a keyboard, a mouse, etc.; an output unit 57, such as various types of displays, speakers, etc.; a storage unit 58, such as a magnetic disk, an optical disk, etc.; and a communication unit 59, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 59 allows the electronic device to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0127] The processor 51 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of the processor 51 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors that run machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The processor 51 executes the various methods and processes described above, such as the method for preparing a circuit board.

[0128] In some embodiments, the method for preparing a circuit board can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 58. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device via the ROM 52 and / or the communication unit 59. When the computer program is loaded into the RAM 53 and executed by the processor 51, one or more steps of the method for preparing a circuit board described above can be performed. Alternatively, in other embodiments, the processor 51 can be configured to execute the method for preparing a circuit board by any other appropriate means (for example, by means of firmware).

[0129] Various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0130] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0131] Based on the same inventive concept, an embodiment of the present invention further provides a circuit board, which is manufactured by the circuit board manufacturing method of the above embodiment of the present invention and has the same beneficial effects as the manufacturing method. The similarities can be referred to the above description and will not be repeated here.

[0132] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations, and substitutions are possible for those skilled in the art without departing from the scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for preparing a circuit board, characterized in that: include: Obtaining the position coordinates of the theoretical design parameters of the circuit board and the actual design parameters of the circuit motherboard in the same measurement coordinate system; The circuit motherboard includes at least two daughter boards; The theoretical design parameters include at least the theoretical position of the electrical structure and theoretical main marking parameters, and the actual design parameters include at least the actual position of the electrical structure and actual main marking parameters, and the actual main marking parameters are located outside the area where the daughter board is located; Determining the position coordinates of the estimated position of the electrical structure corresponding to the theoretical position of the electrical structure in each of the sub-boards according to the position coordinates of the theoretical design parameters and the actual design parameters; Determining the position coordinates of the calibrated positions of the electrical structures according to the position coordinates of the estimated positions of the electrical structures and the actual positions of the electrical structures; According to the electrical structure calibration positions, conductive structures are prepared at at least part of the electrical structure calibration positions, and components are mounted at the part of the electrical structure calibration positions where the conductive structures are formed, so as to form the circuit board.

2. The preparation method according to claim 1, characterized in that Determining the position coordinates of the estimated position of the electrical structure corresponding to the theoretical position of the electrical structure in each of the sub-boards according to the position coordinates of the theoretical design parameters and the actual design parameters includes: According to the position coordinates of the theoretical design parameters and the actual design parameters, determining the first adjustment parameters of the circuit board based on the segmentation method and the least squares method; the first adjustment parameters include a first adjustment distance and a first adjustment angle; The position coordinates of the estimated position of the electrical structure are determined according to the first adjustment parameter and the theoretical design parameter.

3. The preparation method according to claim 2, characterized in that Determining the first adjustment parameter of the circuit board by calculation based on the segmentation method and the least squares method according to the position coordinates of the theoretical design parameter and the actual design parameter includes: Determining the theoretical center point of the theoretical circuit board corresponding to the theoretical design parameters by calculating the position coordinates of the theoretical design parameters based on a segmentation method; Determining the actual center point of the circuit board by calculation based on a segmentation method according to the position coordinates of the actual design parameters; Calculating the distance between the theoretical center point and the actual center point, and determining the distance as the first adjustment distance; Determining the position coordinates of the theoretical adjustment parameters according to the first adjustment distance and the theoretical design parameters; The first adjustment angle is determined based on a least squares method according to the position coordinates of the theoretical adjustment parameter and the actual design parameter.

4. The preparation method according to claim 1, characterized in that Determining the position coordinates of the calibrated positions of the electrical structures according to the estimated positions of the electrical structures and the position coordinates of the actual positions of the electrical structures includes: The sub-board currently to be calibrated is used as the sub-board to be calibrated; the sub-board to be calibrated includes a plurality of the electrical structures; Determining sub-adjustment parameters of the sub-board to be calibrated based on a segmentation method and a least squares method according to the position coordinates of the actual positions of each electrical structure in the sub-board to be calibrated and the position coordinates of the estimated positions of each electrical structure corresponding to the sub-board to be calibrated; the sub-adjustment parameters include a sub-adjustment distance and a sub-adjustment angle; determining the position coordinates of the calibrated position of the electrical structure according to the estimated position of the electrical structure and the sub-adjustment parameter; The next sub-board to be calibrated is taken as the sub-board to be calibrated, and the steps of determining the position coordinates of the actual positions of the electrical structures in the sub-board to be calibrated and the position coordinates of the calibration positions of the electrical structures corresponding to the sub-board to be calibrated are returned to, and the steps of determining the sub-adjustment parameters of the sub-board to be calibrated to the position coordinates of the calibration positions of the electrical structures are determined based on the segmentation method and the least squares method, until the position coordinates of the calibration positions of the electrical structures of each sub-board are measured.

5. The preparation method according to claim 4, characterized in that According to the position coordinates of the actual positions of each electrical structure in the sub-board to be calibrated and the position coordinates of the estimated positions of each electrical structure corresponding to the sub-board to be calibrated, sub-adjustment parameters of the sub-board to be calibrated are calculated and determined based on a segmentation method and a least squares method, including: Determining the position coordinates of the actual sub-center point of the sub-board to be calibrated by calculation based on a segmentation method according to the position coordinates of the actual positions of each of the electrical structures in the sub-board to be calibrated; Determining the position coordinates of the estimated sub-center point based on the segmentation method according to the position coordinates of the estimated positions of the electrical structures corresponding to the sub-board to be calibrated; Calculating a distance between the estimated sub-center point and the actual sub-center point, and determining the distance as the sub-adjustment distance; Determining the position coordinates of the electrical structure adjustment position based on the sub-adjustment distance and the estimated position of the electrical structure; The sub-adjustment angle is determined based on the least square method according to the position coordinates of the actual position of each electrical structure in the sub-board to be calibrated and the position coordinates of the adjusted position of each electrical structure corresponding to the sub-board to be calibrated.

6. The preparation method according to claim 5, characterized in that Determining the position coordinates of the calibrated position of the electrical structure according to the position coordinates of the estimated position of the electrical structure and the sub-adjustment parameter includes: Along a first direction from the estimated sub-center point to the actual sub-center point, the position coordinates of the estimated position of the electrical structure after being moved along the first direction by the sub-adjustment distance are used as the intermediate calibration position; The position of the line connecting the intermediate calibration position and the actual sub-center point after rotating the sub-adjustment angle with the actual sub-center point as the center of the circle is used as the position coordinate of the electrical structure calibration position.

7. The preparation method according to claim 1, characterized in that According to the electrical structure calibration position, preparing a conductive structure at at least part of the electrical structure calibration position, comprising: A tin dispensing machine or a tin spraying machine is used to apply tin paste on at least part of the calibrated positions of the electrical structure.

8. A circuit board manufacturing device, characterized in that: include: A parameter acquisition module, used to obtain the position coordinates of the theoretical design parameters and the actual design parameters of the circuit board in the same measurement coordinate system; The circuit board includes at least two sub-boards; The theoretical design parameters include at least the theoretical position of the electrical structure, and the actual design parameters include at least the actual position of the electrical structure and actual main marking parameters, wherein the actual main marking parameters are located outside the area where the daughter board is located; an estimated position determination module, configured to determine the position coordinates of the estimated position of the electrical structure corresponding to the theoretical position of the electrical structure in each of the sub-boards according to the position coordinates of each of the theoretical design parameters and the actual design parameters; a calibration position determination module, configured to determine the position coordinates of the calibration position of the electrical structure according to the estimated position of each electrical structure and the position coordinates of the actual position of each electrical structure; The printed patch module is used to prepare a conductive structure at at least part of the electrical structure calibration positions according to the electrical structure calibration positions, and to mount components at part of the electrical structure calibration positions.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor. The computer program is executed by the at least one processor so that the at least one processor can execute the method for preparing a circuit board according to any one of claims 1 to 7.

10. A circuit board, characterized in that: The circuit board is prepared by the method for preparing the circuit board according to any one of claims 1 to 7.

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