Welding system

Abstract

The invention discloses a welding system. The welding system is used for welding a pair of micro wires of an electronic device together. The welding system includes a solder paste dispensing unit. The soldering paste distribution unit comprises a carrier used for loading and fixing the electronic device; the soldering paste distributor is used for spraying soldering paste outwards; the visual device is used for identifying the positions of the pair of micro wires and the space between the pair of micro wires; the planning device is used for pre-planning a starting position, an ending position and a distribution path of soldering paste distribution according to the position and the space identified by the visual device; and the moving device is used for moving the soldering paste distributor at a preset speed according to the planned starting position, the planned ending position and the planned distribution path so as to distribute the soldering paste to preset parts of the pair of micro wires. According to the invention, the soldering paste distribution unit of the welding system can realize accurate distribution of the soldering paste, and the distribution quality of the soldering paste is improved, so that the welding quality of a pair of micro wires can be improved.

Description

Technical Field

[0001] The present invention relates to a welding system, in particular to a welding system for welding together a pair of micro wires on an electronic device. Background Art

[0002] In existing technology, microthermocouples have a pair of exposed parallel microwires whose ends need to be soldered together. To ensure a reliable electrical connection and product durability, the solder joints must exhibit uniform solder distribution across the wires, with no visible voids or residual flux, and their dimensions must be within specified tolerances. However, achieving these requirements is a significant challenge given the product's tiny size and lack of precise control. While the existing manual process is reliable, it requires a significant investment of skilled labor. Attempts to automate this process have been made, but have not achieved the desired results. Although vision algorithms have been implemented, their practicality is limited to inspection rather than guidance, and therefore do not significantly contribute to product quality. Summary of the Invention

[0003] The purpose of the present invention is to solve at least one aspect of the above-mentioned problems and defects in the prior art.

[0004] According to one aspect of the present invention, a soldering system is provided. The soldering system is used to solder a pair of micro-wires of an electronic device together. The soldering system includes a solder paste dispensing unit. The solder paste dispensing unit includes: a carrier for loading and securing the electronic device; a solder paste dispenser for ejecting solder paste; a visual device for identifying the position of the pair of micro-wires and the space between them; a planning device for pre-planning the start position, end position, and distribution path of the solder paste distribution based on the position and space identified by the visual device; and a moving device for moving the solder paste dispenser at a predetermined speed according to the planned start position, end position, and distribution path to dispense solder paste onto predetermined portions of the pair of micro-wires.

[0005] According to an exemplary embodiment of the present invention, the solder paste dispenser includes: a container for containing solder paste; a nozzle mounted on the container for spraying solder paste outward; and a controller for controlling the opening and closing of the nozzle and the solder paste spraying rate.

[0006] According to another exemplary embodiment of the present invention, the vision device includes: a first camera positioned above the pair of micro-wires and configured to capture images of the pair of micro-wires in a vertical direction perpendicular to the axial directions of the pair of micro-wires; and a second camera positioned in front of the distal ends of the pair of micro-wires and configured to capture images of the pair of micro-wires in a horizontal direction parallel to the axial directions of the pair of micro-wires. Before dispensing solder paste, the first and second cameras capture a set of first images, and the vision device identifies the positions of the pair of micro-wires and the space between them based on the captured set of first images.

[0007] According to another exemplary embodiment of the present invention, the pair of micro-wires extend along a first horizontal direction and are spaced apart from each other in a second horizontal direction perpendicular to the first horizontal direction; and the moving device is suitable for moving the solder paste dispenser along the first horizontal direction, the second horizontal direction and a vertical direction perpendicular to the horizontal direction.

[0008] According to another exemplary embodiment of the present invention, the moving device is a translation mechanism capable of moving along the first horizontal direction, the second horizontal direction and the vertical direction, and the solder paste dispenser is mounted on the moving mechanism so as to be able to move along the first horizontal direction, the second horizontal direction and the vertical direction together with the translation mechanism.

[0009] According to another exemplary embodiment of the present invention, the moving device is a multi-axis robot having multiple degrees of freedom, and the multi-axis robot is capable of gripping the solder paste dispenser and moving the solder paste dispenser along the first horizontal direction, the second horizontal direction, and the vertical direction.

[0010] According to another exemplary embodiment of the present invention, after dispensing solder paste, the solder paste dispenser is moved outside the fields of view of the first camera and the second camera, and the first camera and the second camera capture a set of second images. The solder paste dispensing unit further includes a solder paste dispensing quality detection device that determines whether the solder paste dispensing quality is acceptable based on the captured set of second images.

[0011] According to another exemplary embodiment of the present invention, the soldering system further includes a heating and melting unit. The heating and melting unit includes: a heating device for heating the solder paste dispensed onto the pair of micro-wires to melt the solder in the solder paste; a temperature detection device for detecting the temperature of the solder paste and the ambient temperature surrounding the solder paste; and a heating control device for controlling the heating temperature and heating time of the solder paste based on the solder paste temperature detected by the temperature detection device and the ambient temperature until the solder in the solder paste is completely melted.

[0012] According to another exemplary embodiment of the present invention, the heating and melting unit further includes a transport device configured to move a carrier carrying the electronic component into a heating zone of the heating device to heat the solder paste dispensed onto a pair of micro-wires of the electronic component. When the solder paste dispensed onto the pair of micro-wires is of acceptable quality, the heating control device controls the transport device to move the carrier into the heating zone of the heating device.

[0013] According to another exemplary embodiment of the present invention, the transport device is a translation device capable of moving in three different directions perpendicular to each other, and the carrier is mounted on the translation device so as to be capable of moving along the three different directions with the translation device.

[0014] According to another exemplary embodiment of the present invention, the transport device is a robotic arm with multiple degrees of freedom, and the robotic arm is capable of grasping the carrier and moving the carrier in three different directions perpendicular to each other.

[0015] According to another exemplary embodiment of the present invention, the temperature detection device includes an infrared camera, which is directed toward the solder paste on the pair of micro-wires to capture thermal images of the solder paste and its surroundings.

[0016] According to another exemplary embodiment of the present invention, the heating control device includes an artificial intelligence control network, and the artificial intelligence control network determines the heating temperature and heating time of the solder paste based on the thermal image captured by the infrared camera.

[0017] According to another exemplary embodiment of the present invention, the artificial intelligence control network is capable of determining whether the solder in the solder paste has been completely melted based on the thermal image captured by the infrared camera; when the artificial intelligence control network determines that the solder in the solder paste has been completely melted, the artificial intelligence control network controls the conveying device to move the carrier out of the heating device to stop heating the solder paste.

[0018] According to another exemplary embodiment of the present invention, the welding system further includes: a welding quality inspection unit for detecting whether the welding quality of the solidified welding points on the pair of micro-wires removed from the heating device is qualified.

[0019] According to another exemplary embodiment of the present invention, the welding quality inspection unit includes: the visual device and a welding quality judgment device. The visual device includes: a first camera located above the pair of micro-wires, configured to capture images of the solder joints on the pair of micro-wires in a vertical direction perpendicular to the axial direction of the pair of micro-wires; and a second camera located in front of the distal ends of the pair of micro-wires, configured to capture images of the solder joints on the pair of micro-wires in a horizontal direction parallel to the axial direction of the pair of micro-wires. The welding quality judgment device determines whether the solder joints are of acceptable quality based on the captured images of the solder joints.

[0020] According to another exemplary embodiment of the present invention, the welding quality judgment device includes an artificial intelligence inspection network, which extracts weld spot features from the captured weld spot image and compares the extracted weld spot features with pre-learned weld spot features; when the similarity between the extracted weld spot features and the learned weld spot features is greater than a predetermined value, the artificial intelligence inspection network judges that the welding quality of the weld spot is qualified.

[0021] In the aforementioned exemplary embodiments of the present invention, the solder paste dispensing unit of the soldering system can achieve precise dispensing of solder paste, improve solder paste dispensing quality, and thus improve the soldering quality of a pair of micro-wires of an electronic device.

[0022] Furthermore, in some of the aforementioned exemplary embodiments of the present invention, the heating and melting unit of the welding system can precisely control the heating temperature and heating time, thereby further improving the welding quality of a pair of micro-wires of an electronic device.

[0023] Furthermore, in some of the aforementioned exemplary embodiments of the present invention, the welding quality inspection unit of the welding system uses artificial intelligence to evaluate the quality of welds, thereby improving the reliability and consistency of weld quality inspection.

[0024] Other objects and advantages of the present invention will become apparent from the following description of the present invention with reference to the accompanying drawings, which will help to provide a comprehensive understanding of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram showing a solder paste dispensing unit of a soldering system according to an exemplary embodiment of the present invention;

[0026] Figure 2 A schematic diagram showing a heating and melting unit of a welding system according to an exemplary embodiment of the present invention;

[0027] Figure 3 A schematic diagram illustrating a welding quality inspection unit of a welding system according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0028] The technical solution of the present invention will be further described in detail below through examples and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention and should not be construed as limiting the present invention.

[0029] In addition, in the following detailed description, for ease of explanation, numerous specific details are set forth to provide a comprehensive understanding of the disclosed embodiments. However, it is apparent that one or more embodiments can be practiced without these specific details. In other cases, well-known structures and devices are shown in diagrammatic form to simplify the accompanying drawings.

[0030] According to an overall technical concept of the present invention, a soldering system is provided. The soldering system is used to solder a pair of micro-wires of an electronic device together. The soldering system includes a solder paste dispensing unit. The solder paste dispensing unit includes: a carrier for loading and fixing the electronic device; a solder paste dispenser for spraying solder paste outward; a visual device for identifying the position of the pair of micro-wires and the space between them; a planning device for pre-planning the starting position, ending position, and distribution path of the solder paste distribution based on the position and space identified by the visual device; and a moving device for moving the solder paste dispenser at a predetermined speed according to the planned starting position, ending position, and distribution path to distribute the solder paste to the predetermined position of the pair of micro-wires.

[0031] Figure 1 A schematic diagram showing a solder paste dispensing unit of a soldering system according to an exemplary embodiment of the present invention; Figure 2 A schematic diagram showing a heating and melting unit of a welding system according to an exemplary embodiment of the present invention; Figure 3 A schematic diagram illustrating a welding quality inspection unit of a welding system according to an exemplary embodiment of the present invention.

[0032] like Figures 1 to 3 As shown, in an exemplary embodiment of the present invention, a welding system is disclosed. The welding system is used to weld together a pair of micro-wires 1a of an electronic device 1. For example, the welding system can be used to weld together the ends of a pair of parallel micro-wires exposed outside of a thermocouple.

[0033] like Figures 1 to 3As shown, in the illustrated embodiment, the welding system includes a solder paste dispensing unit. The solder paste dispensing unit includes: a carrier 2, a solder paste dispenser 3, a visual device 4, a planning device 9 and a moving device (not shown). The carrier 2 is used to load and fix the electronic device 1. The solder paste dispenser 3 is used to spray solder paste 3a outward. The visual device 4 is used to identify the position of a pair of micro-wires 1a and the space between them. The planning device 9 pre-plans the starting position, ending position and distribution path of the solder paste distribution according to the position and space identified by the visual device 4. The moving device moves the solder paste dispenser 3 at a predetermined speed according to the planned starting position, ending position and distribution path to distribute the solder paste 3a to the predetermined position of the pair of micro-wires 1a, for example, to the ends of the pair of micro-wires 1a.

[0034] like Figures 1 to 3 As shown, in the illustrated embodiment, the solder paste dispenser 3 includes a container 30, a nozzle 31, and a controller. The container 30 is used to hold and supply solder paste 3a. The nozzle 31 is mounted on the container 30 and is used to eject the solder paste 3a. The controller (not shown) is used to control the opening and closing of the nozzle 31 and the solder paste ejection rate. Although not shown, the solder paste dispenser 3 also includes a monitoring device for monitoring the amount of solder paste in the container 3. When the monitoring device detects that the solder paste in the container 3 is running low, it will issue an alarm to prompt timely replenishment of the solder paste.

[0035] like Figures 1 to 3 As shown, in the illustrated embodiment, the visual device 4 includes: a first camera 41 and a second camera 42. The first camera 41 and the second camera 42 can be color cameras. The first camera 41 is located above the pair of microwires 1a and is used to capture images of the pair of microwires 1a in a vertical direction perpendicular to the axial direction of the pair of microwires 1a. The second camera 42 is located in front of the ends of the pair of microwires 1a and is used to capture images of the pair of microwires 1a in a horizontal direction parallel to the axial direction of the pair of microwires 1a. Before dispensing solder paste, the first camera 41 and the second camera 42 capture a set of first images, and the visual device 4 identifies the position of the pair of microwires 1a and the space between them based on the captured set of first images.

[0036] like Figures 1 to 3 As shown, in the illustrated embodiment, a pair of micro-wires 1a extend along a first horizontal direction Y and are spaced apart from each other in a second horizontal direction X perpendicular to the first horizontal direction Y. The moving device is adapted to move the solder paste dispenser 3 along the first horizontal direction Y, the second horizontal direction X, and a vertical direction Z perpendicular to the horizontal direction.

[0037] like Figures 1 to 3As shown, in an exemplary embodiment of the present invention, the moving device may be a translation mechanism (not shown) capable of moving along a first horizontal direction Y, a second horizontal direction X, and a vertical direction Z. The solder paste dispenser 3 is mounted on the moving mechanism so as to be able to move along the first horizontal direction Y, the second horizontal direction X, and the vertical direction Z together with the translation mechanism.

[0038] like Figures 1 to 3 As shown, in another exemplary embodiment of the present invention, the moving device can be a multi-axis robot (not shown) with multiple degrees of freedom, which can grasp the solder paste dispenser 3 and move the solder paste dispenser 3 along the first horizontal direction Y, the second horizontal direction X and the vertical direction Z.

[0039] like Figures 1 to 3 As shown, in the illustrated embodiment, after dispensing solder paste, the solder paste dispenser 3 is moved out of the field of view of the first camera 41 and the second camera 42, and the first camera 41 and the second camera 42 capture a set of second images. The solder paste dispensing unit also includes a solder paste dispensing quality detection device, which determines whether the solder paste dispensing quality is qualified based on the set of captured second images.

[0040] like Figures 1 to 3 As shown, in the illustrated embodiment, the soldering system further includes a heating and melting unit. This heating and melting unit comprises a heating device 5, a temperature detection device 6, and a heating control device 7. The heating device 5 is used to heat the solder paste 3a dispensed onto the pair of micro-wires 1a to melt the solder in the solder paste 3a. The temperature detection device 6 is used to detect the temperature of the solder paste 3a and the ambient temperature surrounding the solder paste 3a. The heating control device 7 controls the heating temperature and heating time of the solder paste 3a based on the solder paste temperature detected by the temperature detection device 6 and the ambient temperature until the solder in the solder paste 3a is completely melted.

[0041] like Figures 1 to 3 As shown, in the illustrated embodiment, the heating and melting unit further includes a transport device (not shown) for moving the carrier 2 loaded with the electronic device 1 into the heating zone of the heating device 5 to heat the solder paste 3a dispensed onto the pair of micro-wires 1a of the electronic device 1. When the dispensed quality of the solder paste 3a dispensed onto the pair of micro-wires 1a is satisfactory, the heating control device 7 controls the transport device to move the carrier 2 into the heating zone of the heating device 5.

[0042] like Figures 1 to 3 As shown, in an exemplary embodiment of the present invention, the transport device may be a translation device capable of moving in three different directions perpendicular to each other, and the carrier 2 is mounted on the translation device so as to be able to move along the three different directions with the translation device.

[0043] like Figures 1 to 3As shown, in another exemplary embodiment of the present invention, the transport device may be a robotic arm with multiple degrees of freedom, which can grasp the carrier 2 and move the carrier 2 along three different directions perpendicular to each other.

[0044] like Figures 1 to 3 As shown, in the illustrated embodiment, the temperature detection device 6 includes an infrared camera, which is directed toward the solder paste 3a on a pair of micro-wires 1a to capture thermal images of the solder paste 3a and its surroundings.

[0045] like Figures 1 to 3 As shown, in the illustrated embodiment, the heating control device 7 includes an artificial intelligence control network, which determines the heating temperature and heating time of the solder paste 3a based on the thermal image captured by the infrared camera.

[0046] like Figures 1 to 3 As shown, in the illustrated embodiment, the artificial intelligence control network can determine whether the solder in solder paste 3a has been completely melted based on the thermal image captured by the infrared camera. When the artificial intelligence control network determines that the solder in solder paste 3a has been completely melted, the artificial intelligence control network controls the handling device to remove carrier 2 from heating device 5 to stop heating solder paste 3a.

[0047] like Figures 1 to 3 As shown, in the illustrated embodiment, the welding system further includes a welding quality inspection unit for inspecting whether the welding quality of the solidified welding points 3a' on the pair of micro-wires 1a removed from the heating device 5 is acceptable.

[0048] like Figures 1 to 3 As shown, in the illustrated embodiment, the welding quality inspection unit includes: the aforementioned visual device 4 and a welding quality judgment device (not shown). The visual device 4 includes the aforementioned first camera 41 and the aforementioned second camera 42. The welding quality inspection unit and the solder paste dispensing unit share the first camera 41 and the second camera 42, which can reduce costs. In the illustrated embodiment, the first camera 41 is located above a pair of micro-wires 1a, and is used to capture images of the solder joints 3a' on the pair of micro-wires 1a along a vertical direction perpendicular to the axial direction of the pair of micro-wires 1a. The second camera 42 is located in front of the ends of the pair of micro-wires 1a, and is used to capture images of the solder joints 3a' on the pair of micro-wires 1a along a horizontal direction parallel to the axial direction of the pair of micro-wires 1a. The welding quality judgment device judges whether the welding quality of the solder joints 3a' is qualified based on the captured images of the solder joints 3a'.

[0049] like Figures 1 to 3In the illustrated embodiment, the welding quality determination device includes an artificial intelligence inspection network that extracts weld features from a captured image of weld 3a' and compares the extracted weld features with pre-learned weld features. When the similarity between the extracted weld features and the learned weld features exceeds a predetermined value, the artificial intelligence inspection network determines that the welding quality of weld 3a' is acceptable.

[0050] This article discloses a novel micro-parallel wire soldering process guided by artificial intelligence and vision. This automated soldering process utilizes multiple technologies to ensure application accuracy. Initially, a set of cameras guides a mobile device to accurately dispense solder paste between two wires. Subsequently, a handling device positions a carrier with exposed wires into the heating zone. Throughout the heating process, an AI-powered thermal imaging system provides real-time observation and determines the optimal heating temperature and duration. Upon completion, the cured solder joint undergoes a comprehensive inspection using an AI-enhanced camera to confirm its quality.

[0051] Those skilled in the art will understand that the embodiments described above are exemplary and can be improved by those skilled in the art. The structures described in various embodiments can be freely combined without causing any conflicts in structure or principle. These changes should fall within the scope of protection of the present invention.

[0052] Although the present invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to exemplify the preferred embodiments of the present invention and should not be construed as limiting the present invention.

[0053] Although some embodiments of the general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the claims and their equivalents.

[0054] It should be noted that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. In addition, any element reference in the claims should not be construed as limiting the scope of the invention.

Claims

1. A welding system for welding together a pair of micro-wires (1a) of an electronic device (1), characterized in that: The welding system comprises: Solder paste dispensing unit, comprising: A carrier (2) for loading and fixing the electronic device (1); A solder paste dispenser (3) for spraying solder paste (3a) outward; a visual device (4) for identifying the position of the pair of micro-wires (1a) and the space between them; A planning device (9) for pre-planning the start position, end position and distribution path of solder paste distribution according to the position and space identified by the visual device (4); and A moving device moves the solder paste dispenser (3) at a predetermined speed according to a planned starting position, an ending position and a dispensing path, so as to dispense the solder paste (3a) onto predetermined positions of the pair of micro-wires (1a).

2. The welding system according to claim 1, wherein: The solder paste dispenser (3) comprises: a container (30) for containing solder paste (3a); a nozzle (31) mounted on the container (30) for spraying solder paste (3a) outward; and A controller is used to control the opening and closing of the nozzle (31) and the solder paste spraying rate.

3. The welding system according to claim 1, wherein: The visual device (4) comprises: a first camera (41), located above the pair of micro-wires (1a), and configured to capture images of the pair of micro-wires (1a) along a vertical direction perpendicular to the axial directions of the pair of micro-wires (1a); and a second camera (42), located in front of the ends of the pair of micro-wires (1a), for capturing images of the pair of micro-wires (1a) along a first horizontal direction parallel to the axial directions of the pair of micro-wires (1a); Before dispensing solder paste, the first camera (41) and the second camera (42) capture a set of first images, and the visual device (4) identifies the positions of the pair of micro-wires (1a) and the space therebetween based on the captured set of first images.

4. The welding system according to claim 1, wherein: The pair of micro-wires (1a) extend along a first horizontal direction (Y) and are spaced apart and opposed to each other in a second horizontal direction (X) perpendicular to the first horizontal direction (Y); The moving device is suitable for moving the solder paste dispenser (3) along the first horizontal direction (Y), the second horizontal direction (X) and a vertical direction (Z) perpendicular to the horizontal direction.

5. The welding system according to claim 4, characterized in that: The moving device is a translation mechanism capable of moving along the first horizontal direction (Y), the second horizontal direction (X) and the vertical direction (Z), The solder paste dispenser (3) is mounted on the moving mechanism so as to be movable along the first horizontal direction (Y), the second horizontal direction (X) and the vertical direction (Z) along with the translation mechanism.

6. The welding system according to claim 4, characterized in that: The moving device is a multi-axis robot with multiple degrees of freedom, which can grasp the solder paste dispenser (3) and move the solder paste dispenser (3) along the first horizontal direction (Y), the second horizontal direction (X) and the vertical direction (Z).

7. The welding system according to claim 3, wherein: After dispensing the solder paste, the solder paste dispenser (3) is moved out of the field of view of the first camera (41) and the second camera (42), and the first camera (41) and the second camera (42) capture a set of second images; The solder paste dispensing unit further comprises: The solder paste dispensing quality detection device determines whether the solder paste dispensing quality is qualified based on a set of captured second images.

8. The welding system according to any one of claims 1 to 7, characterized in that: Also includes: Heating and melting unit, comprising: a heating device (5) for heating the solder paste (3a) dispensed onto the pair of micro-wires (1a) to melt the solder in the solder paste (3a); a temperature detection device (6) for detecting the temperature of the solder paste (3a) and the ambient temperature around the solder paste (3a); and A heating control device (7) controls the heating temperature and heating time of the solder paste (3a) according to the solder paste temperature and the ambient temperature detected by the temperature detection device (6) until the solder in the solder paste (3a) is completely melted.

9. The welding system according to claim 8, characterized in that: The heating and melting unit further comprises: a transport device for moving a carrier (2) loaded with the electronic device (1) into a heating zone of the heating device (5) to heat the solder paste (3a) distributed on a pair of micro-wires (1a) of the electronic device (1), When the dispensing quality of the solder paste (3a) dispensed onto the pair of micro-wires (1a) is qualified, the heating control device (7) controls the transport device to move the carrier (2) into the heating zone of the heating device (5).

10. The welding system according to claim 9, characterized in that: The transport device is a translation device capable of moving in three different directions perpendicular to each other, and the carrier (2) is mounted on the translation device so as to be able to move along the three different directions together with the translation device.

11. The welding system according to claim 9, wherein: The transport device is a robotic arm with multiple degrees of freedom, and the robotic arm is capable of grasping the carrier (2) and moving the carrier (2) in three different directions perpendicular to each other.

12. The welding system according to claim 9, wherein: The temperature detection device (6) comprises an infrared camera, which is directed toward the solder paste (3a) on the pair of micro-wires (1a) to capture thermal images of the solder paste (3a) and its surroundings.

13. The welding system according to claim 12, wherein: The heating control device (7) comprises an artificial intelligence control network, and the artificial intelligence control network determines the heating temperature and heating time of the solder paste (3a) based on the thermal image captured by the infrared camera.

14. The welding system according to claim 13, wherein: The artificial intelligence control network can determine whether the solder in the solder paste (3a) has been completely melted based on the thermal image captured by the infrared camera; When the artificial intelligence control network determines that the solder in the solder paste (3a) has been completely melted, the artificial intelligence control network controls the transport device to move the carrier (2) out of the heating device (5) to stop heating the solder paste (3a).

15. The welding system according to claim 14, wherein: Also includes: The welding quality inspection unit is used to detect whether the welding quality of the solidified welding points (3a') on a pair of micro-wires (1a) removed from the heating device (5) is qualified.

16. The welding system according to claim 15, wherein: The welding quality inspection unit includes: The visual device (4) comprises: a first camera (41), located above the pair of micro-wires (1a), for capturing images of solder joints (3a') on the pair of micro-wires (1a) along a vertical direction perpendicular to the axial directions of the pair of micro-wires (1a); and a second camera (42), located in front of the ends of the pair of micro-wires (1a), for capturing images of the solder joints (3a') on the pair of micro-wires (1a) along a first horizontal direction parallel to the axial direction of the pair of micro-wires (1a); and The welding quality judging device judges whether the welding quality of the welding point (3a') is qualified based on the image of the welding point (3a') taken.

17. The welding system according to claim 16, wherein: The welding quality judgment device includes an artificial intelligence inspection network, which extracts welding point features from a captured welding point (3a') image and compares the extracted welding point features with pre-learned welding point features; When the similarity between the extracted welding spot feature and the learned welding spot feature is greater than a predetermined value, the artificial intelligence inspection network determines that the welding quality of the welding spot (3a') is qualified.

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