Repairing device for component

Abstract

The invention provides a component repairing device which comprises a glue removing assembly, a picking assembly, a heating assembly, a driving mechanism, a working table with a heating area and a loading table driven by the driving mechanism to move above the working table. The glue removing assembly comprises a glue removing mechanism used for removing glue and a first power mechanism used for driving the glue removing mechanism to move in the vertical direction. The picking assembly is mounted on the loading table and comprises a picking mechanism for picking the components and parts and a second power mechanism for driving the picking mechanism to move in the vertical direction; the heating assembly is installed on the loading table and comprises a heat source capable of generating hot air and a third power mechanism used for driving the heat source to move in the vertical direction, the heat source is provided with a hot air outlet, and the hot air outlet faces downwards. The repair efficiency of components can be greatly improved, and the structure is simple and compact.

Description

Technical Field

[0001] The present invention relates to the technical field of component repair, and in particular to a component repair device. Background Art

[0002] To improve the vibration resistance of components or mitigate thermal mismatches between ceramic substrates / silicon chips and printed circuit boards, components are typically reinforced with edge reinforcement adhesive. This adhesive not only increases the connection area between the component and the printed circuit board, improving the bond strength, but also protects the component solder joints by transferring and distributing some of the thermal and mechanical stresses. However, if a component reinforced with edge reinforcement adhesive fails and requires replacement, rework becomes difficult. Summary of the Invention

[0003] In order to solve the technical problems existing in the background technology, the present invention proposes a component repair device.

[0004] The present invention proposes a component rework device, comprising: a debonding assembly, a pickup assembly, a heating assembly, a drive mechanism, a workbench with a heating zone, and a loading platform driven by the drive mechanism to move above the workbench, wherein:

[0005] The glue removal assembly is installed on the loading platform, and the glue removal assembly includes a glue removal mechanism for removing glue and a first power mechanism for driving the glue removal mechanism to move in a vertical direction;

[0006] The picking assembly is installed on the loading platform, and the picking assembly includes a picking mechanism for picking up components and a second power mechanism for driving the picking mechanism to move in a vertical direction;

[0007] The heating assembly is installed on the loading platform. The heating assembly includes a heat source capable of generating hot air and a third power mechanism for driving the heat source to move in a vertical direction. The heat source has a hot air outlet, and the hot air outlet faces downward.

[0008] Preferably, a hot air hood with an opening facing downward is installed at the hot air outlet of the heat source, and the hot air hood includes an outer cover shell, an inner cover shell located inside the outer cover shell, and a cavity arranged between the outer cover shell and the inner cover shell, and the cavity is open at one end close to the opening of the hot air hood to form an air supply outlet; the hot air hood has two hot air channels with independent on-off control, one of which connects the hot air outlet with the inside of the inner cover shell, and the other connects the hot air outlet with the cavity.

[0009] Preferably, the inner wall and / or outer wall of the inner housing is provided with a heat insulation layer.

[0010] Preferably, the inner wall and / or the outer wall of the outer housing is provided with a heat insulation layer.

[0011] Preferably, the lower end of the outer cover shell has an air guide plate inclined toward the air outlet.

[0012] Preferably, the hot air channel connected to the inner cover shell is led out from the top of the inner cover shell and connected to the hot air outlet; the hot air channel connected to the hot air channel of the clamping cavity is led out from the outer wall of the cover shell and connected to the side wall of the hot air outlet to communicate with the hot air outlet.

[0013] Preferably, the heat source is a hot air blower.

[0014] Preferably, the loading platform is provided with a pad cleaning mechanism for cleaning the pad and a fourth driving mechanism for driving the pad cleaning mechanism to move in a vertical direction.

[0015] Preferably, the pad cleaning mechanism is a desoldering gun or a desoldering ribbon.

[0016] Preferably, the driving mechanism includes a first driving mechanism for driving the loading platform to move in the X-axis direction, a second driving mechanism for driving the loading platform to move in the Y-axis direction, and a third driving mechanism for driving the loading platform to move in the Z-axis direction.

[0017] Preferably, the glue removal mechanism includes a power component and a glue removal head driven by the power component to perform the glue removal operation, and the glue removal head is a scraper, a drill bit or a milling cutter.

[0018] Preferably, the picking mechanism adopts a robotic arm picking, or a vacuum suction cup picking, or a clamping claw picking, or an electromagnetic adsorption picking.

[0019] Preferably, it also includes a rubber recovery mechanism, which includes a material collection box, a vacuum generator connected to the material collection box to generate negative pressure inside the material collection box, a suction pipe connected to the material collection box and a suction port installed at the end of the suction pipe, and the suction port is installed on the rubber removal mechanism.

[0020] Preferably, the vacuum generator comprises a vacuum pump.

[0021] Preferably, the device further comprises a first temperature sensor and a second temperature sensor for monitoring temperature.

[0022] In the present invention, a workbench is used to place a workpiece (the workpiece here refers to a printed circuit board equipped with components), and a heating zone is set on the workbench to preheat the workpiece; a loading platform is set above the workbench, and the loading platform can move above the workbench under the drive of a driving mechanism, and a degumming component, a picking component and a heating component are installed on the loading platform; the heating component is used to transport hot air to the workpiece to soften the glue on the components; the degumming component is used to cut off the softened reinforcement glue; the picking component is used to remove the components from the printed circuit board after the reinforcement glue is cut off to realize the automatic separation of the components and the printed circuit board, and the degumming component, the picking component and the heating component are all integrated on the loading platform so that the three share a moving platform, which can simplify the structure and improve the compactness of the structure on the one hand, and reduce the cost on the other hand. Therefore, the present invention can greatly improve the rework efficiency, and the device structure is simple and compact. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic structural diagram of a component repair device proposed by the present invention;

[0024] Figure 2 This is a schematic structural diagram of the hot air hood in a component repair device proposed by the present invention;

[0025] Figure 3 This is a schematic diagram of the air supply direction of the hot air hood when the heating assembly in the component rework device proposed by the present invention heats the reinforcing glue;

[0026] Figure 4 The present invention provides a schematic diagram of the air flow direction of the hot air hood when the heating assembly in the component repair device heats the solder pad. DETAILED DESCRIPTION

[0027] Reference Figure 1 The present invention proposes a component rework device, which includes: a debonding component 1, a picking component 2, a heating component 3, a driving mechanism, a workbench 5 with a heating zone, and a loading platform 6 driven by the driving mechanism to move above the workbench 5.

[0028] The driving mechanism includes a first driving mechanism for driving the loading table 6 to move in the X-axis direction, a second driving mechanism for driving the loading table 6 to move in the Y-axis direction, and a third driving mechanism for driving the loading table 6 to move in the Z-axis direction. Specifically: the workbench 5 is located on both sides of its heating zone and is provided with Y guide rails arranged along the Y-axis direction and a support frame slidably assembled on the Y guide rails, the support frame is connected to the second driving mechanism to be driven by the second driving mechanism to move on the Y guide rails; the support frame is provided with X guide rails arranged along the X-axis direction and a slide slidably assembled on the X guide rails, the slide is connected to the first driving mechanism to be driven by the first driving mechanism to move on the X guide rails; the slide is provided with Z guide rails arranged along the Z-axis direction, the loading table 6 is slidably mounted on the Z guide rails, and the third driving mechanism is connected to the loading table 6 to drive the loading table 6 to move on the Z guide rails.

[0029] The adhesive removal assembly 1 is mounted on the loading platform 6 and includes an adhesive removal mechanism 11 for removing adhesive and a first power mechanism 12 for driving the adhesive removal mechanism 11 in a vertical direction. The adhesive removal mechanism 11 includes a power component and an adhesive removal head driven by the power component to perform the adhesive removal operation. The adhesive removal head is a scraper, drill bit, or milling cutter.

[0030] The picking component 2 is installed on the loading platform 6. The picking component 2 includes a picking mechanism 21 for picking up components and a second power mechanism 22 for driving the picking mechanism 21 to move in the vertical direction. The picking mechanism 21 adopts one of the following methods: gripper picking, robotic arm picking, vacuum suction cup picking, and electromagnetic adsorption picking. Specifically: gripper picking uses grippers to complete the grasping of the workpiece, such as finger cylinders; robotic arm picking uses robots to complete the grasping of the workpiece; vacuum suction cup picking uses vacuum suction cup adsorption to complete the grasping of the workpiece; electromagnetic adsorption picking uses magnetic adsorption to complete the grasping of the workpiece.

[0031] The heating component 3 is installed on the loading platform 6. The heating component 3 includes a heat source 31 capable of generating hot air and a third power mechanism 32 for driving the heat source 31 to move in a vertical direction. The heat source 31 has a hot air outlet, and the hot air outlet faces downward. Specifically, the heat source 31 is a hot air blower.

[0032] During operation, the workpiece is first placed in the heating zone of the workbench 5 to be preheated. The drive mechanism then drives the loading platform 6, allowing the heating assembly 3 to approach the component to be repaired. A third drive mechanism in the heating assembly 3 lowers the heat source 31 to a specified height, where it delivers hot air to the adhesive reinforcement surrounding the component, softening the reinforcement. The drive mechanism then cooperates with the loading platform 6 to move the adhesive removal assembly 1 forward to remove the adhesive reinforcement. Furthermore, the drive mechanism cooperates with the loading platform 6 to move the pickup mechanism 21 forward to remove the component from the printed circuit board, allowing a new component to be installed in its place.

[0033] Reference Figure 2 In a further embodiment, a downward-facing hot air hood 311 is installed at the hot air outlet of the heat source 31. The hot air hood 311 includes an outer housing 311a, an inner housing 311b located inside the outer housing 311a, and a cavity 311c disposed between the outer and inner housings 311a and 311b. The cavity 311c is open at one end near the opening of the hot air hood 311 to form an air outlet. The hot air hood 311 has two independently controlled hot air passages: one connecting the hot air outlet with the interior of the inner housing 311b, and the other connecting the hot air outlet with the cavity 311c.

[0034] Reference Figure 3-4 When heating the reinforcing glue on the outside of a component, the hot air hood 311 moves above the component and positions the component inside the inner cover 311b. At this point, the hot air passage connecting to the inner cover 311b is closed, while the hot air passage connecting to the clamping cavity 311c is opened. Hot air is then delivered from the air outlet of the clamping cavity 311c to heat the reinforcing glue on the outside of the component. When heating the solder at the bottom of the component, the hot air hood 311 covers the component and opens the hot air passage connecting to the inner cover 311b, while closing the hot air passage connecting to the clamping cavity 311c. Hot air is then delivered to the interior of the inner cover 311b, confining the heating zone to the location of the component. This improves heating efficiency while also preventing deformation of the printed circuit board due to repeated heating and preventing the reinforcing glue from exploding.

[0035] Specifically, the hot air channel connecting to the inner housing 311b extends from the top of the inner housing 311b and connects to the hot air outlet. The hot air channel connecting to the clamping chamber 311c extends from the outer wall of the housing and connects to the side wall of the hot air outlet to connect to the hot air outlet. Both hot air channels are equipped with control valves to control the opening and closing of the corresponding hot air channels.

[0036] In a further embodiment, the inner wall and / or outer wall of the inner shell 311b is provided with a heat insulating layer to prevent heat from being transferred to the inner side of the inner shell 311b when heating the reinforcing adhesive, and to prevent heat from being transferred to the outside of the inner shell 311b when heating components.

[0037] The lower end of the outer cover shell 311a has an air guide plate inclined toward the air outlet to guide the hot air to blow toward the reinforcing glue.

[0038] In order to further enhance the heat insulation effect, a heat insulation layer is also provided on the inner wall and / or outer wall of the outer cover shell 311 a in this embodiment.

[0039] In addition, this embodiment further provides a pad cleaning mechanism 7 for cleaning pads and a fourth drive mechanism 8 for driving the pad cleaning mechanism 7 to move in the vertical direction on the loading platform 6. During operation, after the reworked components are removed from the printed circuit board by the pickup mechanism 21, the drive mechanism drives the loading platform 6 to move so that the pad cleaning mechanism 7 enters the component removal area. The fourth drive mechanism 8 drives the pad cleaning mechanism 7 downward. The pad cleaning mechanism 7 is used to clean the component removal area so that new components can be re-soldered there.

[0040] Specifically: the pad cleaning mechanism 7 is a desoldering gun or a desoldering belt.

[0041] The present invention proposes a component rework device that also includes a glue recovery mechanism and first and second temperature sensors for temperature monitoring. The glue recovery mechanism includes a collection box, a vacuum generator connected to the collection box to generate negative pressure inside the collection box, a suction pipe connected to the collection box, and a suction port 4 mounted at the end of the suction pipe. The vacuum generator includes a vacuum pump, and the suction port 4 is mounted on the glue removal mechanism 11. During operation, the first temperature sensor monitors the temperature of the reinforcement glue around a specified component. When the reinforcement glue temperature reaches a preset value, the glue removal assembly 1 moves to remove the reinforcement glue around the component and vacuum-absorbs the removed reinforcement glue into the collection box. The second temperature sensor monitors the temperature of the solder pad between the component and the printed circuit board. When the solder pad temperature reaches a preset value, the pickup mechanism 21 moves to remove the component from the printed circuit board. After the component is removed, the solder pad cleaning mechanism 7 moves to clean the solder from the printed circuit board and solder a new component in its place.

[0042] In this embodiment, a heating element is installed in the heating zone of the workbench 5. Specifically, the heating element is a heating wire installed inside the workbench 5. The heating zone has a placement area for placing and limiting the position of the printed circuit board; or the heating zone is equipped with a clamping device for fixing the printed circuit board. The clamping device includes opposing clamping blocks and a driving component for driving the clamping blocks toward each other.

[0043] As can be seen from the above, in the present invention, the workbench 5 is used to place the workpiece. The workpiece here refers to the printed circuit board equipped with components. A heating zone is set on the workbench 5 for preheating the workpiece; a loading platform 6 is set above the workbench 5, and the loading platform 6 can move above the workbench 5 under the drive of the driving mechanism, and a degumming component 1, a picking component 2 and a heating component 3 are installed on the loading platform 6; the heating component 3 is used to transport hot air to the workpiece above the workpiece to soften the glue on the components; the degumming component 1 is used to cut off the softened reinforcement glue; the picking component 2 is used to remove the components from the printed circuit board after the reinforcement glue is cut off, thereby realizing the separation of the components from the printed circuit board, and the degumming component 1, the picking component 2 and the heating component 3 are all integrated on the loading platform 6 so that the three share a moving platform. This can simplify the structure and improve the compactness of the structure on the one hand, and reduce costs on the other hand.

[0044] The present invention provides a component repair method, comprising the following steps:

[0045] S1. Place the printed circuit board with components in the heating zone of the workbench 5 for preheating;

[0046] S2. The driving mechanism drives the loading platform 6 to move, so as to drive the heating assembly 3 to enter above the designated component, and heat the heating zone and the heating assembly 3 simultaneously to soften the reinforcing glue around the designated component;

[0047] S3, the driving mechanism drives the loading platform 6 to move, so as to drive the adhesive removal assembly 1 to enter above the component in S2, and the adhesive removal assembly 1 removes the reinforcing adhesive around the component;

[0048] S4, the driving mechanism drives the loading platform 6 to move, so as to drive the heating assembly 3 to enter above the component described in S3; the heating zone and the heating assembly 3 are heated simultaneously to melt the solder below the component;

[0049] S5 , the driving mechanism drives the loading platform 6 to move, so as to drive the picking assembly 2 to enter above the components in S4 , and the picking assembly 2 removes the components from the printed circuit board.

[0050] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A component repair device, characterized in that: include: A glue removal component (1), a pickup component (2), a heating component (3), a driving mechanism, a workbench (5) with a heating zone, and a loading platform (6) driven by the driving mechanism to move above the workbench (5), wherein: The glue removal assembly (1) is installed on the loading platform (6), and the glue removal assembly (1) includes a glue removal mechanism (11) for removing glue and a first power mechanism (12) for driving the glue removal mechanism (11) to move in a vertical direction; The picking assembly (2) is installed on the loading platform (6), and the picking assembly (2) includes a picking mechanism (21) for picking up components and a second power mechanism (22) for driving the picking mechanism (21) to move in a vertical direction; The heating assembly (3) is installed on the loading platform (6). The heating assembly (3) includes a heat source (31) capable of generating hot air and a third power mechanism (32) for driving the heat source (31) to move in a vertical direction. The heat source (31) has a hot air outlet, and the hot air outlet faces downward.

2. The component repair device according to claim 1, characterized in that: A hot air hood (311) with a downward opening is installed at the hot air outlet of the heat source (31), and the hot air hood (311) includes an outer cover shell (311a), an inner cover shell (311b) located inside the outer cover shell (311a), and a clamping cavity (311c) arranged between the outer cover shell (311a) and the inner cover shell (311b), and the clamping cavity (311c) is open at one end close to the opening of the hot air hood (311) to form an air supply outlet; the hot air hood (311) has two hot air channels with independent on / off control, one of which connects the hot air outlet with the interior of the inner cover shell (311b), and the other connects the hot air outlet with the clamping cavity (311c).

3. The component repair device according to claim 2, characterized in that: The inner wall and / or outer wall of the inner cover shell (311b) is provided with a heat insulation layer; preferably, the inner wall and / or outer wall of the outer cover shell (311a) is provided with a heat insulation layer; preferably, the lower end of the outer cover shell (311a) has an air guide plate inclined toward the air outlet; preferably, the hot air channel connected to the inner cover shell (311b) is led out from the top end of the inner cover shell (311b) and docked with and connected to the hot air outlet; the hot air channel connected to the hot air channel of the clamping cavity (311c) is led out from the outer wall of the cover shell and connected to the side wall of the hot air outlet to be connected to the hot air outlet.

4. The component repair device according to claim 1, characterized in that: The heat source (31) is a hot air blower.

5. The component repair device according to claim 1, characterized in that: The loading platform (6) is provided with a pad cleaning mechanism (7) for cleaning the pad and a fourth driving mechanism (8) for driving the pad cleaning mechanism (7) to move in a vertical direction; preferably, the pad cleaning mechanism (7) is a desoldering gun or a desoldering belt.

6. The component repair device according to claim 1, characterized in that: The driving mechanism comprises a first driving mechanism for driving the loading platform (6) to move in the X-axis direction, a second driving mechanism for driving the loading platform (6) to move in the Y-axis direction, and a third driving mechanism for driving the loading platform (6) to move in the Z-axis direction.

7. The component repair device according to claim 1, characterized in that: The glue removing mechanism (11) comprises a power component and a glue removing head driven by the power component to perform the glue removing operation, wherein the glue removing head is a scraper, a drill bit or a milling cutter.

8. The component repair device according to claim 1, characterized in that: The picking mechanism (21) adopts a mechanical arm to pick up, or adopts a vacuum suction cup to pick up, or adopts a clamping claw to pick up, or adopts an electromagnetic adsorption to pick up.

9. The component repair device according to any one of claims 1 to 8, characterized in that: The invention also includes a rubber material recovery mechanism, which includes a material collection box, a vacuum generator connected to the material collection box to generate negative pressure inside the material collection box, a suction pipe connected to the material collection box and a suction port (4) installed at the end of the suction pipe, and the suction port (4) is installed on the rubber material removal mechanism (11); preferably, the vacuum generator includes a vacuum pump.

10. The component repair device according to any one of claims 1 to 8, characterized in that: Also included is a first temperature sensor and a second temperature sensor for monitoring temperature.

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