Resin substrate for photovoltaic new energy and preparation method thereof

Abstract

The invention relates to the technical field of photovoltaic new energy materials, and particularly discloses a resin substrate for photovoltaic new energy and a preparation method of the resin substrate. A resin substrate for photovoltaic new energy comprises a glass mat layer and fiber cloth layers arranged on the two sides of the glass mat layer, and copper foil layers are arranged on the fiber cloth layers. The glass mat layer, the fiber cloth layer and the copper foil layer are bonded through composite resin, and the composite resin is prepared from the following raw materials in parts by weight: 70-80 parts of matrix resin, 5-8 parts of a curing agent, 1.8-3.3 parts of aniline black, 17-26 parts of inorganic filler and 0.5-1.2 parts of a dispersing agent. The aniline black can effectively absorb visible light, reduce the light transmittance and improve the brightness and backlight utilization rate of the LED light source; the inorganic filler has good heat-conducting property, so that the thermal deformation of the plate is reduced, and the flatness is kept through heat treatment in the subsequent process of mounting components on the LED substrate.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic new energy materials, and in particular to a resin substrate for photovoltaic new energy and a preparation method thereof. Background Art

[0002] With the continuous advancement of science and technology, research on semiconductor light-emitting materials has deepened. As a new type of green light source, light-emitting diodes (LEDs) have been widely developed and applied. Their high energy efficiency and luminous efficiency make them widely used in electrical indicators, LED displays, landscape lighting, interior decoration, and other fields. LED electronic products have a relatively simple structure, with light-emitting components directly mounted on electrodes on a PCB and then encapsulated with resin. As the substrate for mounting components, copper-clad laminates (CCLs) are a key component. Therefore, the rapid development of LEDs has also driven the development of functional CCLs. These are called functional CCLs because, in addition to providing the required insulation substrate, conductive copper foil, and signal transmission functions, CCLs for LEDs also require excellent light-shielding properties. However, traditional CCLs are mostly transparent amber in color and lack this light-shielding performance. Light from the LED light source can penetrate through the back of the laminate, creating a halo on the surface. This not only wastes energy and reduces brightness, but also significantly affects display quality. Furthermore, conventional CCLs undergo heat treatment during component mounting, which can cause thermal deformation and affect flatness. Therefore, there is an urgent need to develop a copper clad plate with high flatness and low light transmittance to meet the needs of LED substrates. Summary of the Invention

[0003] In order to obtain a copper-clad plate with high flatness and low light transmittance, the present application provides a resin substrate for photovoltaic new energy and a preparation method thereof.

[0004] In the first aspect, the present application provides a resin substrate for photovoltaic new energy, which adopts the following technical solution: A resin substrate for photovoltaic new energy comprises a glass mat layer and fiber cloth layers arranged on both sides of the glass mat layer, wherein a copper foil layer is arranged on the fiber cloth layer; the glass mat layer, the fiber cloth layer, and the copper foil layer are bonded together by a composite resin, wherein the raw materials of the composite resin include the following components in parts by weight: 70-80 parts of base resin, 5-8 parts of curing agent, 1.8-3.3 parts of aniline black, 17-26 parts of inorganic filler, and 0.5-1.2 parts of dispersant.

[0005] By adopting the above technical solution, aniline black can effectively absorb visible light, reduce light transmittance, and improve the brightness of LED light sources and backlight utilization rate; inorganic fillers have good thermal conductivity, thereby reducing the thermal deformation of the board material, and in the subsequent process of mounting components on the LED substrate, it undergoes heat treatment to maintain flatness.

[0006] In a specific embodiment, the method for preparing the inorganic filler comprises the following steps: First, γ-aminopropyltriethoxysilane, ethanol and water are stirred evenly to obtain a modified solution; Nano-alumina, hexagonal boron nitride and conductive carbon black are stirred and mixed uniformly to obtain a mixture. During the stirring process, a modifying liquid is slowly sprayed into the mixture. After the spraying is completed, the mixture is continued to be stirred and dried to obtain an inorganic filler.

[0007] By adopting the above technical solution, γ-aminopropyltriethoxysilane is used to modify nano-alumina, hexagonal boron nitride and conductive carbon black, thereby improving the dispersion performance of the obtained inorganic filler; nano-alumina reduces the thermal expansion coefficient and improves thermal conductivity, hexagonal boron nitride enhances the in-plane thermal conductivity and improves the insulation properties, aluminum oxide and boron nitride form a thermal conduction path, aluminum oxide establishes a basic thermal conduction network, and boron nitride fills the gaps to improve efficiency, thereby improving the thermal conductivity of the substrate; while providing thermal conductivity, conductive carbon black can also cooperate with aniline black to absorb light of different wavelengths, thereby further reducing the light transmittance of the substrate.

[0008] In a specific embodiment, the weight ratio of γ-aminopropyltriethoxysilane, ethanol and water in the modified liquid is 5:18:2; the weight ratio of the modified liquid to the mixed material is 1:(13-14).

[0009] By adopting the above technical solution, the ratio of γ-aminopropyltriethoxysilane, ethanol and water in the modified liquid, as well as the ratio of the modified liquid to the mixed material, are further limited, thereby improving the modification effect of the inorganic filler.

[0010] In a specific embodiment, the composite resin includes a mixture of an E-type epoxy resin and a glycidyl ester epoxy resin.

[0011] In a specific embodiment, the curing agent includes a mixture of an aromatic amine curing agent and a dicyandiamide curing agent.

[0012] By adopting the above technical solution, using a composite curing agent composed of an aromatic amine curing agent and a dicyandiamide curing agent, and then combining it with a composite resin composed of an E-type epoxy resin and a glycidyl ester epoxy resin, not only is the cost relatively low, but the heat resistance and weather resistance of the obtained substrate can also be further improved.

[0013] In a specific embodiment, the dispersant includes BYK-111 dispersant.

[0014] In a specific embodiment, the raw materials of the composite resin further include 0.3 to 0.5 parts by weight of 2-ethyl-4-methylimidazole.

[0015] By adopting the above technical solution, 2-ethyl-4-methylimidazole and dicyandiamide curing agent form catalytic synergy: imidazole promotes the decomposition of the curing agent, reduces the curing starting temperature, and thus improves the preparation efficiency of the product.

[0016] In a second aspect, the present application provides a method for preparing a resin substrate for photovoltaic new energy, which adopts the following technical solution: A method for preparing a resin substrate for photovoltaic new energy comprises the following steps: Preparation of substrate material: adding curing agent, aniline black, inorganic filler, dispersant and other raw materials to the base resin in sequence, stirring and dispersing, to obtain the substrate material; Composite: The glass mat layer and the fiber cloth layer are sequentially impregnated in the substrate material, and then semi-cured at 150-180°C for 6-8 hours to obtain a semi-cured glass mat layer and a semi-cured fiber cloth layer; the semi-cured glass mat layer and the semi-cured fiber cloth layer are then composited so that the semi-cured glass mat layer is located between the two semi-cured fiber cloth layers to obtain a prepreg, and finally a copper foil is composited on both sides of the prepreg to obtain a crude product; Pressing: The crude product is pressed at high temperature and cooled to obtain a resin substrate for photovoltaic new energy.

[0017] By adopting the above technical solution, a curing agent, aniline black, inorganic filler, dispersant and other raw materials are first added to the base resin in sequence, stirred and dispersed to obtain a substrate material, then the glass felt layer and the fiber cloth layer are immersed in the substrate material to apply glue, semi-cured, and finally compounded and pressed at high temperature to obtain a resin substrate for photovoltaic new energy.

[0018] In a specific embodiment, the crude product is pre-pressed at 1-5 MPa and 100-130°C for 20-30 minutes, then pressed at 5-10 MPa and 160-180°C for 60-90 minutes, and slowly cooled to below 50°C to obtain a resin substrate for photovoltaic new energy.

[0019] By adopting the above technical solution and performing segmented pressurization, the glue flow situation can be improved, thereby further improving the performance of the obtained substrate.

[0020] In summary, this application includes at least one of the following beneficial technical effects: 1. The aniline black in this application can effectively absorb visible light, reduce light transmittance, and improve the brightness of the LED light source and backlight utilization rate; the inorganic filler has good thermal conductivity, thereby reducing the thermal deformation of the board. During the subsequent LED substrate component mounting process, it undergoes heat treatment to maintain flatness; 2. In this application, γ-aminopropyltriethoxysilane is used to modify nano-alumina, hexagonal boron nitride, and conductive carbon black, thereby improving the dispersion properties of the resulting inorganic filler. Nano-alumina reduces the thermal expansion coefficient and increases thermal conductivity, while hexagonal boron nitride enhances in-plane thermal conductivity and improves insulation properties. Alumina and boron nitride form a thermal conduction path, while alumina establishes a basic thermal conduction network. Boron nitride fills gaps and improves efficiency, thereby improving the thermal conductivity of the substrate. While providing thermal conductivity, the conductive carbon black also combines with aniline black to absorb light of different wavelengths, further reducing the light transmittance of the substrate. 3. The method in this application first adds a curing agent, aniline black, an inorganic filler, a dispersant and other raw materials to the base resin in sequence, stirs and disperses them to obtain a substrate material, then immerses the glass felt layer and the fiber cloth layer in the substrate material to apply glue, semi-cures, and finally compounds and presses at high temperature to obtain a resin substrate for photovoltaic new energy. DETAILED DESCRIPTION

[0021] The present application is further described in detail below with reference to the embodiments.

[0022] All raw materials in the examples can be obtained commercially. The E-type epoxy resin is E51 epoxy resin; the glycidyl ester epoxy resin is diglycidyl terephthalate; the aromatic amine curing agent is DDS; the dicyandiamide curing agent is DICY; and the dispersant is BYK-111 dispersant.

[0023] Preparation Example Preparation Example 1 Preparation Example 1 provides a method for preparing an inorganic filler, comprising the following steps: First, γ-aminopropyltriethoxysilane, ethanol and water are stirred evenly to obtain a modified solution; wherein the weight ratio of γ-aminopropyltriethoxysilane, ethanol and water is 5:18:2; Nano-alumina, hexagonal boron nitride and conductive carbon black are stirred and mixed uniformly to obtain a mixture. During the stirring process, a modifying liquid is slowly sprayed into the mixture. After the spraying is completed, stirring is continued for 0.5 hours, and then drying is carried out at 100°C for 0.5 hours to obtain an inorganic filler; wherein the weight ratio of the modifying liquid to the mixture is 1:13; the hexagonal boron nitride and the conductive carbon black are both nano-grade.

[0024] Preparation Example 2 Preparation Example 2 provides a method for preparing an inorganic filler, comprising the following steps: First, γ-aminopropyltriethoxysilane, ethanol and water are stirred evenly to obtain a modified solution; wherein the weight ratio of γ-aminopropyltriethoxysilane, ethanol and water is 5:18:2; Nano-alumina, hexagonal boron nitride and conductive carbon black are stirred and mixed uniformly to obtain a mixture. During the stirring process, a modifying liquid is slowly sprayed into the mixture. After the spraying is completed, stirring is continued for 0.5 hours, and then drying is carried out at 100°C for 0.5 hours to obtain an inorganic filler; wherein the weight ratio of the modifying liquid to the mixture is 1:13.5; the hexagonal boron nitride and the conductive carbon black are both nano-grade.

[0025] Preparation Example 3 Preparation Example 3 provides a method for preparing an inorganic filler, comprising the following steps: First, γ-aminopropyltriethoxysilane, ethanol and water are stirred evenly to obtain a modified solution; wherein the weight ratio of γ-aminopropyltriethoxysilane, ethanol and water is 5:18:2; Nano-alumina, hexagonal boron nitride and conductive carbon black are stirred and mixed uniformly to obtain a mixture. During the stirring process, a modifying liquid is slowly sprayed into the mixture. After the spraying is completed, stirring is continued for 0.5 hours, and then drying is carried out at 100°C for 0.5 hours to obtain an inorganic filler; wherein the weight ratio of the modifying liquid to the mixture is 1:14; the hexagonal boron nitride and the conductive carbon black are both nano-grade. Example

[0026] Example 1 Example 1 provides a method for preparing a resin substrate for photovoltaic new energy, comprising the following steps: Preparation of substrate material: 5 kg of curing agent, 1.8 kg of aniline black, 17 kg of the inorganic filler prepared in Preparation Example 1, and 0.5 kg of dispersant were sequentially added to 70 kg of base resin, and the mixture was stirred and dispersed to obtain a substrate material; wherein the base resin was a mixture of an E-type epoxy resin and a glycidyl ester epoxy resin, and the weight ratio of the E-type epoxy resin to the glycidyl ester epoxy resin was 3.5:6.5; and the curing agent was a mixture of an aromatic amine curing agent and a dicyandiamide curing agent, and the weight ratio of the aromatic amine curing agent to the dicyandiamide curing agent was 12.5:6.5. Composite: The glass felt layer and the fiber cloth layer are sequentially impregnated in the substrate material, and then semi-cured at 150°C for 4 hours, and then semi-cured at 180°C for 2 hours to obtain a semi-cured glass felt layer and a semi-cured fiber cloth layer; the semi-cured glass felt layer and the semi-cured fiber cloth layer are then composited so that the semi-cured glass felt layer is located between the two semi-cured fiber cloth layers to obtain a semi-cured sheet, and finally a copper foil is composited on both sides of the semi-cured sheet to obtain a crude product; the glass felt layer has a gram weight of 75g / m 2 The glass felt layer is 762 glass fiber cloth; the thickness of the copper foil is 35μm; Pressing: The crude product is pre-pressed at 2.5 MPa and 100°C for 30 minutes, then pressed at 7.5 MPa and 160°C for 90 minutes, and then slowly cooled to below 50°C to obtain a resin substrate for photovoltaic new energy.

[0027] Example 2 The difference between Example 2 and Example 1 is that, in the preparation of the substrate material, 5 kg of curing agent, 1.8 kg of aniline black, 17 kg of the inorganic filler in Preparation Example 2, and 0.5 kg of dispersant are added in sequence to 70 kg of the base resin, and the mixture is stirred and dispersed to obtain the substrate material; wherein the base resin is a mixture of E-type epoxy resin and glycidyl ester epoxy resin, and the weight ratio of E-type epoxy resin to glycidyl ester epoxy resin is 3.5:6.5; the curing agent is a mixture of aromatic amine curing agent and dicyandiamide curing agent, and the weight ratio of aromatic amine curing agent to dicyandiamide curing agent is 12.5:6.5; the remaining steps are consistent with Example 1.

[0028] Example 3 The difference between Example 3 and Example 1 is that, in the preparation of the substrate material, 5 kg of curing agent, 1.8 kg of aniline black, 17 kg of the inorganic filler in Preparation Example 3, and 0.5 kg of dispersant are added in sequence to 70 kg of the base resin, and the mixture is stirred and dispersed to obtain the substrate material; wherein the base resin is a mixture of E-type epoxy resin and glycidyl ester epoxy resin, and the weight ratio of E-type epoxy resin to glycidyl ester epoxy resin is 3.5:6.5; the curing agent is a mixture of aromatic amine curing agent and dicyandiamide curing agent, and the weight ratio of aromatic amine curing agent to dicyandiamide curing agent is 12.5:6.5; the remaining steps are consistent with Example 1.

[0029] Example 4 The difference between Example 4 and Example 2 is that, in the preparation of the substrate material, 6.5 kg of curing agent, 2.5 kg of aniline black, 21.5 kg of the inorganic filler in Preparation Example 2, and 0.8 kg of dispersant are added in sequence to 75 kg of the base resin, and the mixture is stirred and dispersed to obtain the substrate material; wherein the base resin is a mixture of E-type epoxy resin and glycidyl ester epoxy resin, and the weight ratio of E-type epoxy resin to glycidyl ester epoxy resin is 3.5:6.5; the curing agent is a mixture of aromatic amine curing agent and dicyandiamide curing agent, and the weight ratio of aromatic amine curing agent to dicyandiamide curing agent is 12.5:6.5; the remaining steps are consistent with Example 2.

[0030] Example 5 The difference between Example 5 and Example 2 is that, in the preparation of the substrate material, 8 kg of curing agent, 3.3 kg of aniline black, 26 kg of the inorganic filler in Preparation Example 2, and 1.2 kg of dispersant are added in sequence to 80 kg of the base resin, and the mixture is stirred and dispersed to obtain the substrate material; wherein the base resin is a mixture of E-type epoxy resin and glycidyl ester epoxy resin, and the weight ratio of E-type epoxy resin to glycidyl ester epoxy resin is 3.5:6.5; the curing agent is a mixture of aromatic amine curing agent and dicyandiamide curing agent, and the weight ratio of aromatic amine curing agent to dicyandiamide curing agent is 12.5:6.5; the remaining steps are consistent with Example 2.

[0031] Example 6 The difference between Example 6 and Example 4 is that, in the preparation of the substrate material, 6.5 kg of curing agent, 2.5 kg of aniline black, 21.5 kg of the inorganic filler in Preparation Example 2, 0.8 kg of dispersant, and 0.4 kg of 2-ethyl-4-methylimidazole are added in sequence to 75 kg of the base resin, and the mixture is stirred and dispersed to obtain the substrate material; wherein the base resin is a mixture of E-type epoxy resin and glycidyl ester epoxy resin, and the weight ratio of E-type epoxy resin to glycidyl ester epoxy resin is 3.5:6.5; the curing agent is a mixture of aromatic amine curing agent and dicyandiamide curing agent, and the weight ratio of aromatic amine curing agent to dicyandiamide curing agent is 12.5:6.5; the remaining steps are consistent with Example 4.

[0032] Example 7 The difference between Example 7 and Example 6 is that the curing agent is an aromatic amine curing agent; the remaining steps are consistent with Example 6.

[0033] Example 8 The difference between Example 8 and Example 6 is that the curing agent is dicyandiamide curing agent; the remaining steps are consistent with Example 6.

[0034] Example 9 The difference between Example 9 and Example 6 is that, in pressing, the crude product is pre-pressed at 2.5 MPa and 120°C for 25 minutes, then pressed at 7.5 MPa and 170°C for 75 minutes, and slowly cooled to below 50°C to obtain a resin substrate for photovoltaic new energy; the remaining steps are consistent with Example 6.

[0035] Example 10 The difference between Example 10 and Example 6 is that, in pressing, the crude product is pre-pressed at 2.5 MPa and 130°C for 20 minutes, then pressed at 7.5 MPa and 180°C for 60 minutes, and slowly cooled to below 50°C to obtain a resin substrate for photovoltaic new energy; the remaining steps are consistent with Example 6.

[0036] Comparative Example Comparative Example 1 The difference between Comparative Example 1 and Example 1 is that, in preparation of the substrate material, 5 kg of curing agent and 0.5 kg of dispersant are added in sequence to 88.8 kg of base resin, and the mixture is stirred and dispersed to obtain a substrate material; wherein the base resin is a mixture of E-type epoxy resin and glycidyl ester epoxy resin, and the weight ratio of E-type epoxy resin to glycidyl ester epoxy resin is 3.5:6.5; the curing agent is a mixture of aromatic amine curing agent and dicyandiamide curing agent, and the weight ratio of aromatic amine curing agent to dicyandiamide curing agent is 12.5:6.5; the remaining steps are consistent with Example 1.

[0037] Performance testing Visible light transmittance: The samples in each embodiment and comparative example were tested in accordance with ASTM D1003 "Test Method for Haze and Light Transmittance of Transparent Plastics" at a wavelength of 400-700 nm. Before testing, the samples were equilibrated in a constant temperature and humidity environment at 23±2°C and 50±5% RH for 24 hours. The average value of three measurements was taken for a single-point test.

[0038] Warpage: Tested in accordance with IPC-TM-650 2.4.22.

[0039] Table 1 Performance test results of substrate sample Visible light transmittance (%) Warpage (%) Example 1 0.08 0.55 Example 2 0.06 0.50 Example 3 0.07 0.52 Example 4 0.05 0.48 Example 5 0.06 0.45 Example 6 0.03 0.40 Example 7 0.09 0.58 Example 8 0.10 0.60 Example 9 0.02 0.35 Example 10 0.03 0.38 Comparative Example 1 1.20 1.80 Combining Example 1 and Comparative Example 1, the light transmittance of the substrate in Example 1 is low, and the warpage is also low. It can be seen that when preparing the substrate material, aniline black and γ-aminopropyltriethoxysilane-modified inorganic fillers are added to the raw materials. Aniline black can effectively absorb visible light, reduce light transmittance, and improve the brightness of the LED light source and the backlight utilization rate; the inorganic filler has good thermal conductivity, thereby reducing the thermal deformation of the plate. In the subsequent process of mounting components on the LED substrate, it is heat treated to maintain flatness.

[0040] In combination with Examples 1-3, the light transmittance of the substrate in Example 2 is the lowest, and the warpage is also the lowest. It can be seen that when preparing the inorganic filler, the ratio of the modifying liquid to the mixed material in Preparation Example 2 is optimal, and thus the performance of the obtained substrate is the best.

[0041] Combining Example 2, Example 4 and Example 5, it can be seen that when preparing the substrate material, according to the ratio of the raw materials in Example 2, Example 4 and Example 5, the performance of the substrate finally obtained is better.

[0042] Combining Example 4 and Example 6, the light transmittance of the substrate in Example 6 is relatively low. This shows that when preparing the substrate material, adding 2-ethyl-4-methylimidazole to the raw materials can further reduce the light transmittance of the substrate.

[0043] In combination with Examples 6-8, it can be seen that when preparing the substrate material, the curing agent is preferably a mixture of an aromatic amine curing agent and a dicyandiamide curing agent, and the obtained substrate has a lower light transmittance and a lower warpage.

[0044] Combining Example 6, Example 9 and Example 10, it can be seen that when the crude product is pressed, the pressing conditions in Example 9 are the best, thereby obtaining the best performance of the substrate.

[0045] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but as long as they are within the scope of the claims of the present application, they are protected by the patent law.

Claims

1. A resin substrate for photovoltaic new energy, comprising a glass mat layer and fiber cloth layers disposed on both sides of the glass mat layer, wherein a copper foil layer is disposed on the fiber cloth layer; characterized in that: The glass felt layer, the fiber cloth layer, and the copper foil layer are bonded together by a composite resin, wherein the raw materials of the composite resin include the following components in parts by weight: 70-80 parts of a base resin, 5-8 parts of a curing agent, 1.8-3.3 parts of aniline black, 17-26 parts of an inorganic filler, and 0.5-1.2 parts of a dispersant.

2. The resin substrate for photovoltaic new energy according to claim 1, characterized in that: The preparation method of the inorganic filler comprises the following steps: First, γ-aminopropyltriethoxysilane, ethanol and water are stirred evenly to obtain a modified solution; Nano-alumina, hexagonal boron nitride and conductive carbon black are stirred and mixed uniformly to obtain a mixture. During the stirring process, a modifying liquid is slowly sprayed into the mixture. After the spraying is completed, the mixture is continued to be stirred and dried to obtain an inorganic filler.

3. The resin substrate for photovoltaic new energy according to claim 2, characterized in that: The weight ratio of γ-aminopropyltriethoxysilane, ethanol and water in the modified liquid is 5:18:2; the weight ratio of the modified liquid to the mixed material is 1:(13-14).

4. The resin substrate for photovoltaic new energy according to claim 1, characterized in that: The composite resin comprises a mixture of E-type epoxy resin and glycidyl ester epoxy resin.

5. The resin substrate for photovoltaic new energy according to claim 1, characterized in that: The curing agent comprises a mixture of an aromatic amine curing agent and a dicyandiamide curing agent.

6. The resin substrate for photovoltaic new energy according to claim 1, characterized in that: The dispersant includes BYK-111 dispersant.

7. The resin substrate for photovoltaic new energy according to claim 1, characterized in that: The raw materials of the composite resin further include 0.3 to 0.5 parts by weight of 2-ethyl-4-methylimidazole.

8. A method for preparing a resin substrate for photovoltaic new energy according to any one of claims 1 to 7, characterized in that: The following steps are involved: Preparation of substrate material: adding curing agent, aniline black, inorganic filler, dispersant and other raw materials to the base resin in sequence, stirring and dispersing, to obtain the substrate material; Composite: The glass mat layer and the fiber cloth layer are sequentially impregnated in the substrate material, and then semi-cured at 150-180°C for 6-8 hours to obtain a semi-cured glass mat layer and a semi-cured fiber cloth layer; the semi-cured glass mat layer and the semi-cured fiber cloth layer are then composited so that the semi-cured glass mat layer is located between the two semi-cured fiber cloth layers to obtain a prepreg, and finally a copper foil is composited on both sides of the prepreg to obtain a crude product; Pressing: The crude product is pressed at high temperature and cooled to obtain a resin substrate for photovoltaic new energy.

9. The method for preparing a resin substrate for photovoltaic new energy according to claim 8, characterized in that: The pressing step is: pre-pressing the crude product at 1-5 MPa and 100-130° C. for 20-30 minutes, then pressing at 5-10 MPa and 160-180° C. for 60-90 minutes, and slowly cooling to below 50° C. to obtain a resin substrate for photovoltaic new energy.