Wiring board and component-mounted wiring board

Abstract

The present invention suppresses connection loss between an electronic component and an optoelectronic component, and suppresses a decrease in data speed due to the connection loss between the electronic component and the optoelectronic component. A wiring board (1) according to an embodiment includes, on a component mounting surface (1a), a first component mounting region (A1), an optoelectronic component mounting region (A0), and an optical wiring (31) optically connectable to an optoelectronic component (E0). A recess (20) is formed in a component mounting surface (1a) of a wiring board (1), and a first component mounting region (A1) is provided within the recess (20) and at least partially overlaps a photoelectric component mounting region (A0) in plan view.

Description

Technical Field

[0001] The present invention relates to a wiring substrate and a component-mounted wiring substrate. Background Art

[0002] Patent Document 1 discloses an optoelectronic module in which electronic components such as IC chips, optoelectronic components such as light-emitting elements and light-receiving elements, and optical wiring such as optical waveguides are mounted on the surface of a wiring substrate. The electronic components are electrically connected to the optoelectronic components, and the optoelectronic components are optically connected to the optical wiring. The electronic components are electrically connected to the optoelectronic components via a wiring pattern formed on the surface of the wiring substrate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2013-257381 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] In the optoelectronic module disclosed in Patent Document 1, the connection between the electronic component and the optoelectronic component is sometimes complicated due to the structure of the substrate and the wiring pattern configuration. Specifically, the connection between the electronic component or optoelectronic component and the wiring is performed via electrode terminals and solder. In this case, it is believed that the process conditions for connecting the electronic component or optoelectronic component to the wiring become complicated, alignment is not easy, and the connection is unstable. As a result, the electrical signal transmitted between the electronic component and the optoelectronic component is sometimes unstable. Therefore, it is believed that the connection loss between the electronic component and the optoelectronic component increases. In addition, it is believed that if the optical transmission capacity increases, it will cause a decrease in data speed due to the connection loss between the electronic component and the optoelectronic component.

[0008] Means for solving problems

[0009] The wiring substrate of the present invention includes, on its component mounting surface, a first component mounting area, an optoelectronic component mounting area, and optical wiring capable of optically connecting to the optoelectronic component. A recess is formed in the component mounting surface of the wiring substrate, the first component mounting area being disposed within the recess, and the first component mounting area at least partially overlapping the optoelectronic component mounting area when viewed from above.

[0010] The component-mounted wiring substrate of the present invention comprises: the aforementioned wiring substrate; and a first component housed in the recess and mounted in the first component mounting area. A first component conductive connecting member capable of connecting the optoelectronic component and the first component is formed on an electrode surface of the first component.

[0011] According to embodiments of the present invention, the connection structure between electronic and optoelectronic components is simplified. As a result, it is believed that the connection process conditions and alignment are also simplified, the connection distance between the electronic and optoelectronic components is shortened, and connection losses are suppressed. Furthermore, according to embodiments of the present invention, it is believed that the reduction in data speed caused by connection losses between the electronic and optoelectronic components can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a cross-sectional view showing an example of a wiring substrate according to an embodiment of the present invention.

[0013] Figure 2 This is a cross-sectional view showing an example of a component-mounted wiring substrate according to an embodiment of the present invention.

[0014] Figure 3 This is a cross-sectional view showing a modified example of the component mounting wiring substrate according to one embodiment of the present invention.

[0015] Figure 4A It is a cross-sectional view showing an example of a manufacturing process of the wiring substrate according to the embodiment.

[0016] Figure 4B It is a cross-sectional view showing an example of a manufacturing process of the wiring substrate according to the embodiment.

[0017] Figure 4C It is a cross-sectional view showing an example of a manufacturing process of the wiring substrate according to the embodiment.

[0018] Figure 4D It is a cross-sectional view showing an example of a manufacturing process of the wiring substrate according to the embodiment.

[0019] Figure 4E It is a cross-sectional view showing an example of a manufacturing process of the wiring substrate according to the embodiment.

[0020] Figure 4F It is a cross-sectional view showing an example of a manufacturing process of the wiring substrate according to the embodiment.

[0021] Figure 5A It is a cross-sectional view showing an example of a manufacturing process of the component-mounted wiring substrate according to the embodiment.

[0022] Figure 5B It is a cross-sectional view showing an example of a manufacturing process of the component-mounted wiring substrate according to the embodiment.

[0023] Figure 6A It is a cross-sectional view showing a modification of the manufacturing process of the component-mounted wiring substrate according to the embodiment.

[0024] Figure 6BIt is a cross-sectional view showing a modification of the manufacturing process of the component-mounted wiring substrate according to the embodiment.

[0025] Figure 6C It is a cross-sectional view showing a modification of the manufacturing process of the component-mounted wiring substrate according to the embodiment.

[0026] Figure 7A This is an enlarged cross-sectional view showing another example of the manufacturing process of the component-mounted wiring substrate according to the embodiment.

[0027] Figure 7B This is an enlarged cross-sectional view showing another example of the manufacturing process of the component-mounted wiring substrate according to the embodiment.

[0028] Figure 8A This is an enlarged cross-sectional view showing another modification of the manufacturing process of the component-mounted wiring substrate of the embodiment.

[0029] Figure 8B This is an enlarged cross-sectional view showing another modification of the manufacturing process of the component-mounted wiring substrate of the embodiment. DETAILED DESCRIPTION

[0030] A wiring board and a component-mounted wiring board according to an embodiment of the present invention will be described with reference to the drawings. Figure 1 A wiring board 1 is shown as an example of a wiring board according to one embodiment. Figure 2 A component mounting wiring substrate 10 is shown as an example of a component mounting wiring substrate according to one embodiment. It should be noted that the wiring substrate 1 and the component mounting wiring substrate 10 are merely examples of the wiring substrate and the component mounting wiring substrate according to this embodiment. The laminated structure of the wiring substrate and the component mounting wiring substrate according to the embodiment, as well as the number of conductor layers and the number of insulating layers are not limited to the above. Figure 1 The wiring substrate 1 and Figure 2 The laminated structure of component-mounted wiring substrate 10, and the number of conductor layers and the number of insulating layers included in wiring substrate 1 and component-mounted wiring substrate 10 are described. In the drawings referred to in the following description, certain portions may be enlarged to facilitate understanding of the disclosed embodiments, and the sizes and lengths of the various components may not be accurately proportional to each other.

[0031] like Figure 1 As shown, the wiring substrate 1 of the embodiment includes an electric wiring portion 2 and an optical wiring portion 3. The wiring substrate 1 has a first surface (component mounting surface) 1a as one of two surfaces (main surfaces) perpendicular to its thickness direction, and a second surface 1b as the other of the two surfaces (main surfaces) and the opposite surface of the first surface (component mounting surface) 1a. Figure 1In the example shown in FIG. 1 , first surface 1a of wiring substrate 1 constitutes one of the two surfaces (principal surfaces) of electrical wiring portion 2, and second surface 1b of wiring substrate 1 constitutes the other of the two surfaces (principal surfaces) of electrical wiring portion 2. An optical wiring mounting area AL is provided on component mounting surface 1a of wiring substrate 1. Optical wiring portion 3 is formed in optical wiring mounting area AL.

[0032] It should be noted that, in the description of the embodiment, the side of the wiring substrate 1 (or the electrical wiring portion 2) away from the central portion (the insulating layer 213 of the core substrate 21 described later) in the thickness direction is also referred to as the "upper side" or "above", or simply "up", and the side of the wiring substrate 1 (or the electrical wiring portion 2) close to the central portion (the insulating layer 213 of the core substrate 21) in the thickness direction is also referred to as the "lower side" or "below", or simply "lower". Furthermore, in each conductor layer and each insulating layer, the surface on the opposite side of the insulating layer 213 of the core substrate 21 is also referred to as the "upper surface", and the surface on the insulating layer 213 side of the core substrate 21 is also referred to as the "lower surface". The thickness direction of the wiring substrate 1 (refer to Figure 1 The +Z direction and -Z direction in FIG) are also simply referred to as the "Z direction".

[0033] like Figure 1 As shown, the wiring substrate 1 of the embodiment is configured to be able to mount a plurality of electronic components. Specifically, the wiring substrate 1 includes a mounting portion for mounting an optoelectronic component E0 (see Figure 2 ) of the optoelectronic component mounting area A0. In addition, the wiring substrate 1 includes a mounting area for the first component E1 (see Figure 2 ) of the first component mounting area A1. The components mounted on the wiring substrate 1 are not limited to two, and may be three or more. Thus, Figure 1 The wiring substrate 1 has a second component E2 (see Figure 2 ) is located in the second component mounting area A2. Figure 1 In the embodiment, the optoelectronic component mounting area A0, the first component mounting area A1, and the second component mounting area A2 are arranged in descending order from the optical wiring portion 3. It should be noted that the arrangement of the optoelectronic component mounting area A0, the first component mounting area A1, and the second component mounting area A2 is not limited to any arrangement as long as the optoelectronic component E0 and the first component E1, and the first component E1 and the second component E2 can be connected to each other. Figure 1 It should be noted that in Figure 1 Although an example of mounting one component is shown in FIG, two or more components may be mounted in each component mounting area.

[0034] The optoelectronic component mounting area A0 includes an optoelectronic component E0 and a conductive connector for mounting the optoelectronic component E0 on the wiring substrate 1, and other mounting components. As other mounting components, for example, a filling resin filled between the optoelectronic component E0 and the electric wiring portion 2, an adhesive material for fixing the optoelectronic component E0 to the wiring substrate 1, etc. In addition, in the wiring substrate 1 of the embodiment, the first component mounting area A1 includes a first component E1 and a conductive connector for mounting the first component E1 on the wiring substrate 1, and other mounting components. As other mounting components, for example, a filling resin filled between the first component E1 and the wiring substrate 1, an adhesive material for fixing the first component E1 to the wiring substrate 1. It should be noted that in Figure 1 In the example shown, the first component mounting area A1 coincides with the recessed area of ​​the substrate, which serves as recess 20. Furthermore, in the wiring substrate 1 of the embodiment, the second component mounting area A2 includes a second component E2, a conductive connector for mounting the second component E2 on the wiring substrate 1, and other mounting members. Examples of the other mounting members include a filling resin that fills the gap between the second component E2 and the wiring substrate 2, and an adhesive that secures the second component E2 to the wiring substrate 1.

[0035] like Figure 1 As shown, the wiring substrate 1 of the embodiment has a recess 20 on the component mounting surface 1a. The first component mounting area A1 is located within the range where the recess 20 is formed, and the first component E1 is arranged in the recess 20 when mounted on the wiring substrate 1. That is, in the wiring substrate 1 of the embodiment, the non-electrode surface of the first component E1 arranged in the first component mounting area A1 is arranged at a position lower than the component mounting surface 1a. The non-electrode surface of the first component E1 is the surface of the first component E1 on which the electrodes E11 and E12 are not provided, and is the opposite surface of the surface (electrode surface) on which the electrodes E11 and E12 are provided. On the other hand, in the wiring substrate 1 of the embodiment, the non-electrode surface of the optoelectronic component E0 arranged in the optoelectronic component mounting area A0 is provided on the component mounting surface 1a. The non-electrode surface of the optoelectronic component E0 is the surface of the optoelectronic component E0 on which the electrodes E01 and E02 are not provided, and is the opposite surface of the surface (electrode surface) on which the electrodes E01 and E02 are provided. Furthermore, in the wiring substrate 1 of the embodiment, the non-electrode surface of the second component E2, which is arranged in the second component mounting area A2, is provided on the component mounting surface 1a. The non-electrode surface of the second component E2 is the surface of the second component E2 on which the electrodes E21 and E22 are not provided, and is the opposite surface to the surface (electrode surface) on which the electrodes E21 and E22 are provided.

[0036] When viewed from above, the optoelectronic component mounting area A0 at least partially overlaps with the first component mounting area A1. That is, the first component mounting area A1 overlaps with a portion of the optoelectronic component mounting area A0. Furthermore, when viewed from above, the second component mounting area A2 at least partially overlaps with the first component mounting area A1. That is, the first component mounting area A1 overlaps with a portion of the second component mounting area A2. It should be noted that the first component mounting area A1 also overlaps with a portion of the optoelectronic component mounting area A0 and a portion of the second component mounting area A2. Here, "viewed from above" means observing the object with a line of sight along the thickness direction (Z direction) of the wiring substrate 1.

[0037] In the wiring substrate 1 of the present embodiment, the first component mounting area A1 is provided in the recess 20 formed in the component mounting surface 1a. The first component mounting area A1 within the range where the recess 20 is formed is provided on the component mounting surface 1a in such a manner as to at least partially overlap with the optoelectronic component mounting area A0. In other words, the optoelectronic component mounting area A0 is provided on the component mounting surface 1a in such a manner as to at least partially overlap with the first component mounting area A1 within the range where the recess 20 is formed. In the case where the optoelectronic component mounting area A0 is provided in such a manner as to at least partially overlap with the first component mounting area A1, when the optoelectronic component E0 (refer to Figure 2 ) and the first component E1 (refer to Figure 2 ) is mounted on the wiring substrate 1, the optoelectronic component E0 and the first component E1 are connected without the electrical wiring portion 2. This reduces the complexity of the structure, simplifies alignment, and sometimes facilitates connection. Directly connecting the optoelectronic component E0 to the first component E1 eliminates the need for the electrical wiring portion 2 connecting the optoelectronic component E0 and the first component E1, and accordingly, the length of the connection between the optoelectronic component E0 and the first component E1 is not increased. Since the length of the connection between the optoelectronic component E0 and the first component E1 is not increased, it is believed that the connection loss between the optoelectronic component E0 and the first component E1 is suppressed.

[0038] Similarly, in the wiring substrate 1 of this embodiment, the second component mounting area A2 is provided on the component mounting surface 1a so as to at least partially overlap with the first component mounting area A1 within the range where the recess 20 is formed. When the second component mounting area A2 is provided so as to at least partially overlap with the first component mounting area A1, the second component E2 (see Figure 2 ) and the first component E1 (refer to Figure 2) connection, thus simplifying the structure, facilitating alignment, and sometimes facilitating connection. Directly connecting the second component E2 to the first component E1 eliminates the need for the electrical wiring portion 2 connecting the second component E2 to the first component E1, and accordingly, the length of the connection between the second component E2 and the first component E1 is not increased. Since the length of the connection between the second component E2 and the first component E1 is not increased, it is believed that the connection loss between the second component E2 and the first component E1 is suppressed.

[0039] exist Figure 1 In the example, the optoelectronic component mounting area A0 and the second component mounting area A2 are arranged adjacent to each other on the component mounting surface 1a. It should be noted that "adjacent" means that multiple areas are formed to contact each other in a certain direction, or are formed to be close to each other at a predetermined distance without sandwiching other components or areas where other components are mounted. Figure 1 In the example of FIG, the first component mounting area A1 is formed adjacent to the optoelectronic component mounting area A0 and the second component mounting area A2 in the thickness direction (Z direction) of the electric wiring portion 2 .

[0040] like Figure 1 As shown, in the wiring substrate 1 of the embodiment, the electric wiring portion 2 is not particularly limited, but Figure 1 An example is a so-called build-up wiring substrate. Specifically, the electric wiring portion 2 comprises: a core substrate 21 having a first surface 21a and a second surface 21b opposite to each other in the thickness direction thereof; an insulating layer 221, a conductor layer 231, an insulating layer 222 and a conductor layer 232, which are sequentially stacked on the first surface 21a of the core substrate 21; and an insulating layer 223, a conductor layer 233, an insulating layer 224 and a conductor layer 234, which are sequentially stacked on the second surface 21b. Via conductors 25 are formed in each of the insulating layers 221 to 224, which connect the conductor layers sandwiched therebetween. It should be noted that the laminated structure of the electric wiring portion, and the number of conductor layers and insulating layers included in the electric wiring are not limited to. Figure 1 The laminated structure of the electric wiring portion 2 and the number of conductor layers 231 to 234 and insulating layers 221 to 224 included in the electric wiring portion 2 are shown in FIG. The electric wiring portion 2 may be a so-called double-sided wiring substrate composed of only the core substrate 21, for example.

[0041] exist Figure 1 In the example shown in FIG. 2 , core substrate 21 includes insulating layer 213 and conductive layers 212 formed on both surfaces of insulating layer 213. Through-hole conductors 211 are provided in insulating layer 213, penetrating insulating layer 213 and connecting conductive layers 212 on both sides. The interior of cylindrical through-hole conductor 211 is filled with a filler 214 formed of, for example, an insulating resin such as epoxy resin or a conductive resin containing metal particles.

[0042] exist Figure 1 In the example of the embodiment, the electrical wiring portion 2 further includes a solder resist 241 formed on the first surface 21a side of the core substrate 21 and a solder resist 242 formed on the second surface 21b side. One surface 1a of the electrical wiring portion 2 (the first surface of the wiring substrate 1) is mainly composed of the upper surface of the solder resist 241, and the other surface 1b of the electrical wiring portion 2 (the second surface of the wiring substrate 1) is mainly composed of the upper surface of the solder resist 242. In the wiring substrate 1 of the embodiment, one surface of the electrical wiring portion 2 constitutes the component mounting surface 1a of the wiring substrate 1. The solder resist 241 partially covers the insulating layer 222 and the conductor layer 232, respectively, and the solder resist 242 partially covers the insulating layer 224 and the conductor layer 234, respectively. The solder resist 241 has an opening 241a that exposes a portion of the conductor layer 232. Similarly, the solder resist 242 also has an opening 242a that exposes a portion of the conductor layer 234.

[0043] The insulating layers 221 to 224 and the insulating layer 213 can be formed using thermosetting insulating resins such as epoxy resin, bismaleimide triazine resin (BT resin) or phenolic resin, for example. The insulating layers 221 to 224 and the insulating layer 213 can also be formed using thermoplastic insulating resins such as fluororesin, liquid crystal polymer (LCP), polyvinyl fluoride (PTFE) resin, polyester (PE) resin and modified polyimide (MPI) resin. Although not shown, each insulating layer can include a core material (reinforcement material) formed of glass fiber, aromatic polyamide fiber, etc., and can also include an inorganic filler composed of microparticles such as silicon dioxide (SiO2), aluminum oxide or mullite. On the other hand, the solder resists 241 and 242 are formed of, for example, a photosensitive epoxy resin or polyimide resin.

[0044] The conductor layers 231 to 234, the conductor layer 212, the through-hole conductor 211, and the via-hole conductor 25 can be formed using any metal such as copper or nickel. Figure 1 Although simplified and depicted as a single layer, it may also be a multilayer structure including two or more film bodies. For example, the conductor layers 231 to 234 and the conductor layer 212 may also be a two-layer structure including an electroless plated film and an electrolytic plated film.

[0045] Each of the conductor layers 231 to 234 and the conductor layer 212 may include any conductor pattern. Figure 1In the example of FIG. 1 , the conductor layer 232 includes: a conductor pad 2321 for an optoelectronic component formed in the optoelectronic component mounting area A0 of the component mounting surface 1a; and a second conductor pad 2322 for a second component formed in the second component mounting area A2 of the component mounting surface 1a. The conductor pad 2321 for an optoelectronic component is formed on the electrode E02 of the optoelectronic component E0 connected to the wiring substrate 1 (the electrode E02 of the optoelectronic component E0 included in the optoelectronic component mounting area A0 that does not overlap with the first component mounting area A1, see FIG. 2 ). Figure 2 The second component conductor pad 2322 is formed at a position corresponding to the electrode E22 of the second component E2 connected to the wiring substrate 1 (the electrode E22 of the second component E2 included in the second component mounting area A2 that does not overlap with the first component mounting area A1, see Figure 2 ) corresponding position. In addition, Figure 1 In the example of FIG, the conductive layer 212 includes a first component conductive pad 2121 formed in the first component mounting area A1. The first component conductive pad 2121 is formed in a shape and size capable of mounting the first component E1 mounted on the wiring substrate 1.

[0046] exist Figure 1 In the example, the electric wiring portion 2 further includes a conductive connecting member 261 for a photoelectric component and a conductive connecting member 262 for a second component in the opening 241a of the solder resist 241. The conductive connecting member 261 for a photoelectric component is configured to connect the electrode E02 (see Figure 2 ) is connected to the electro-optical component conductor pad 2321. The second component conductive connecting member 262 is configured to connect the electrode E22 (see Figure 2 ) is connected to the conductor pad 2322 for the second component. The conductive connecting member 261 for the optoelectronic component and the conductive connecting member 262 for the second component are, for example, conductor posts, formed using any metal such as copper or nickel. As needed, a conductive connector is formed on the conductive connecting member 261 for the optoelectronic component and the conductive connecting member 262 for the second component using a solder such as a tin-based solder or a gold-based solder. It should be noted that the conductive connecting member 261 for the optoelectronic component and the conductive connecting member 262 for the second component may also be, for example, conductive bumps, formed using a solder such as a tin-based solder or a gold-based solder. If the conductive connecting member 261 for the optoelectronic component and the conductive connecting member 262 for the second component are used, it may be easier to mount the optoelectronic component E0 and the second component E2, and short circuits between the conductor pads 2321 for the optoelectronic component and short circuits between the conductor pads 2322 for the second component can be prevented.

[0047] like Figure 1 As shown, the optical wiring portion 3 is configured to be able to communicate with the optoelectronic component E0 (see Figure 2) optical connection. Figure 1 In the example shown in FIG. 1 , the optical wiring portion 3 is configured to be optically connected to the optoelectronic component E0 at one end in the light propagation direction (+X direction or -X direction, hereinafter also simply referred to as the "X direction"), and to be connected to the optical fiber F at the other end via the connector C. The optical wiring portion 3 can be mounted in the optical wiring mounting area AL on the component mounting surface 1a of the electrical wiring portion 2 using the supporting member 4.

[0048] like Figure 1 As shown, the optical wiring section 3 includes an optical wiring 31. The optical wiring section 3 may also include a support substrate 32 serving as a base for the formation of the optical wiring 31. When the optical wiring section 3 includes the support substrate 32, the resistance of the optical wiring section 3 to thermal contraction accompanying temperature changes may be improved. Figure 1 In the example shown, the support substrate 32 is arranged on the side of the optical wiring 31 opposite the component mounting surface 1a. It should be noted that the support substrate 32 can also be arranged on the component mounting surface 1a side of the optical wiring 31. Alternatively, the optical wiring portion 3 can be arranged on the wiring substrate 1 without using the support substrate 32. In this case, the optical wiring portion 3 can be formed on the wiring substrate 1, or a pre-formed optical wiring portion 3 can be mounted using an adhesive material.

[0049] exist Figure 1 In the example, the optical wiring 31 includes a core 311 capable of propagating optical signals and a cladding 312 surrounding the core 311. The cladding 312 is provided around the core 311 and sandwiches the core 311 in any direction perpendicular to the extending direction of the core 311, that is, the propagation direction (X direction) of the optical signal in the core 311. Figure 1 In the example, the cladding portion 312 includes: a first cladding 3121 constituting a portion on a side farther from the electric wiring portion 2 than the core portion 311 (a portion on the upper side than the core portion 311); and a second cladding 3122 constituting a portion on a side closer to the electric wiring portion 2 than the core portion 311 (a portion on the lower side than the core portion 311). The first cladding 3121 covers the upper surface of the core portion 311, and the second cladding 3122 covers the lower surface of the core portion 311. The first cladding 3121 and / or the second cladding 3122 may also cover the side surfaces of the core portion 311 (the surface facing the +Y direction and the surface facing the -Y direction (the opposite direction of the +Y direction, in Figure 1 (not shown)).

[0050] The core 311 and the cladding 312 are formed using a material having an appropriate refractive index. The core 311 and the cladding 312 can also be made of, for example, an organic raw material (organic matter), an inorganic raw material (inorganic matter), or a mixed raw material containing organic and inorganic components such as an inorganic polymer. Examples of inorganic raw materials include quartz glass and silicon, and examples of organic raw materials include acrylic resins such as polymethyl methacrylate (PMMA), polyimide resins, polyamide resins, polyether resins, and epoxy resins. The optical wiring portion 3 composed of organic matter is lightweight and easily has high toughness. In addition, the optical wiring portion 3 composed of inorganic matter has low optical loss and easily has high weather resistance.

[0051] The core 311 and the cladding 312 may be made of different materials or of the same system. It should be noted that the core 311 is made of a material having a higher refractive index than the material used for the cladding 312 so that light can be totally reflected at the interface between the core 311 and the cladding 312. The core 311 and the cladding 312 may be formed of materials having the same refractive index and then subjected to appropriate processing to make their refractive indices different.

[0052] The optical wiring 31 can be formed by any method. Figure 1 In the example, the optical wiring 31 is formed on one main surface of the supporting substrate 32. The supporting substrate 32 may be removed after the optical wiring 31 is formed. That is, the optical wiring portion 3 may be arranged on the wiring substrate 1 without including the supporting substrate 32. In addition, the optical wiring 31 and the supporting substrate 32 may be bonded to each other by curing the material of the cladding portion 312 in a semi-cured state on the supporting substrate 32. In addition, the optical wiring 31 may be formed independently of the supporting substrate 32, for example, by being fixed to the supporting substrate 32 using any adhesive (not shown). It should be noted that the optical wiring portion 3 may also be formed directly on the wiring substrate 1.

[0053] The support substrate 32 has, for example, a lower thermal expansion coefficient than that of the optical wiring 31. When the core 311 and the cladding 312 have different thermal expansion coefficients, the support substrate 32 has, for example, a lower thermal expansion coefficient than the average of the thermal expansion coefficients of the core 311 and the cladding 312. Preferably, the thermal expansion coefficient of the support substrate 32 is lower than the lower thermal expansion coefficient of the core 311 and the cladding 312. The support substrate 32 can be made of any material so as to have a lower thermal expansion coefficient than that of the optical wiring 31, preferably a higher rigidity than that of the optical wiring 31. For example, the support substrate 32 can have a higher flexural rigidity than that of the optical wiring 31. Examples of the material of the support substrate 32 include glasses such as soda-lime glass, borosilicate glass, and quartz glass; various ceramics such as aluminum oxide, silicon nitride, and silicon oxide; and semiconductors such as silicon and germanium.

[0054] The coefficient of thermal expansion of the optical wiring 31 is, for example, 10 ppm / °C to 100 ppm / °C. In contrast, the coefficient of thermal expansion of the supporting substrate 32 is, for example, 3 ppm / °C to 10 ppm / °C. The flexural rigidity of the supporting substrate 32 is, for example, 1.1 times or more of the flexural rigidity of the optical wiring 31 and is not more than 2 times the flexural rigidity of the electrical wiring portion 2. It is considered that the optical wiring 31 can be easily handled and maintained. In addition, it is considered that the optical wiring 31 can follow the warping of the electrical wiring portion 2 to a certain extent. The thickness of the supporting substrate 32 is not particularly limited, and is preferably set to, for example, 30 μm to 1000 μm.

[0055] like Figure 1 As shown in FIG. 1 , the support member 4 may be formed on the component mounting surface 1a of the wiring substrate 1 (the upper surface of the solder resist 241 of the electric wiring portion 2). Figure 1 In the example, the support member 4 is formed in the optical wiring mounting area AL on the component mounting surface 1a. It should be noted that the support member 4 may also be formed on the component mounting surface 1a so as to straddle the optoelectronic component mounting area A0 and the optical wiring mounting area AL.

[0056] The supporting member 4 is not particularly limited and may be, for example, a film, a coating, or the like. If a film is used, the surface of the supporting member 4 facing the electrical wiring portion 2 may also have adhesive properties to facilitate adhesion to the electrical wiring portion 2. Alternatively, if a film is used, the surface of the supporting member 4 facing the optical wiring portion 3 may also have adhesive properties to facilitate adhesion to the optical wiring portion 3.

[0057] The material constituting the supporting member 4 is not particularly limited, and may be a resin material, a metal material, an inorganic material, or a composite material of these materials. As the material constituting the supporting member 4, a resin material is preferably used. As the resin material constituting the supporting member 4, thermosetting resins, thermoplastic resins, UV curable resins, etc. can be exemplified. In addition, these resins can be used alone or in combination. As a combination of multiple resins, a combination of a thermosetting resin and a UV curable resin, a combination of a thermosetting resin and a thermoplastic resin, etc. can be exemplified. When the material constituting the supporting member 4 is a resin material, its glass transition temperature is preferably 50°C to 200°C. The thermal expansion coefficient of the supporting member 4 is, for example, 30ppm / °C to 200ppm / °C. The thickness of the supporting member 4 is not particularly limited, and is about 5μm to 200μm.

[0058] The support member 4 may contain particles such as inorganic particles, metal particles, and resin particles. The size of the particles contained in the support member 4 is not particularly limited, but may be, for example, between 0.1 μm and 20 μm. The inclusion of particles in the support member 4 may improve the rigidity and heat resistance of the support member 4.

[0059] The metal material constituting the support member 4 is not particularly limited, and examples thereof include copper, aluminum, nickel, titanium, beryllium, iron, platinum, and stainless steel. The support member 4 may be formed by coating a metal core material with a resin material, or may be formed by two or more layers, each comprising a layer of a metal material and a layer of a resin material having adhesion to the metal material. The use of a metal material imparts heat dissipation properties to the support member 4.

[0060] The inorganic material constituting the support member 4 is not particularly limited, and examples thereof include glass and semiconductor materials. The support member 4 may be formed by coating an inorganic material serving as a core material with a resin material, or may be formed by two or more layers, each comprising a layer of an inorganic material and a layer of a resin material having adhesive properties to the inorganic material. The use of an inorganic material imparts rigidity and resistance to thermal expansion to the support member 4.

[0061] like Figure 2As shown, in this embodiment, the wiring substrate 1 in the state where the first component E1 is mounted in the first component mounting area A1 is referred to as a component-mounted wiring substrate 10. It should be noted that the wiring substrate 1 in the state where the first component E1 is mounted in the first component mounting area A1 and the optoelectronic component E0 is mounted in the optoelectronic component mounting area A0 can also be referred to as a component-mounted wiring substrate 10, and the wiring substrate 1 in the state where the first component E1 is mounted in the first component mounting area A1, the second component E2 is mounted in the second component mounting area A2, and the optoelectronic component E0 is mounted in the optoelectronic component mounting area A0 can also be referred to as a component-mounted wiring substrate 10. That is, the wiring substrate 1 in the state where any component including the first component E1 is mounted in the specified mounting area can be referred to as a component-mounted wiring substrate 10. It should be noted that the upper surface of the first component E1 is preferably flush with the upper surface of the insulating layer 222 of the wiring substrate 1 (refer to Figure 2 ) or located above it.

[0062] It should be noted that the optoelectronic component E0, the first component E1, and the second component E2 are different components with different specifications and uses. Here, "different components" simply means that the optoelectronic component E0, the first component E1, and the second component E2 are independent components, and does not necessarily mean that they are different types of components. For example, the first component E1 and the second component E2 may be the same type of component or may have different functions.

[0063] Figure 2 The first component E1 shown is, for example, an electronic component that converts the form of electrical signals between an input signal to the first component E1 and an output signal from the first component E1. Specifically, it converts analog signals into digital signals and vice versa. If the optoelectronic component E0 is a light-receiving element, the first component E1 may be, for example, an A / D converter that converts the analog signal input from the optoelectronic component E0 into a digital signal and outputs the converted digital signal to the first component E1. If the optoelectronic component E0 is a light-emitting element, the first component E1 may be, for example, a D / A converter that converts the digital signal input from the second component E2 into an analog signal and outputs the converted analog signal to the optoelectronic component E0. The first component E1 may also be an amplifier that adjusts the current / voltage level of the input signal from the second component E2 and outputs it to the optoelectronic component E0, and / or adjusts the current / voltage level of the input signal from the optoelectronic component E0 and outputs it to the second component E2.

[0064] The output signal from the first component E1 to the optoelectronic component E0, or the input signal from the optoelectronic component E0 to the first component E1, may also be a digital signal. Furthermore, the input signal from the second component E2 to the first component E1, or the output signal from the first component E1 to the second component E2, may also be an analog signal. For example, the first component E1 may be embodied as a DC-AC converter, an AC-DC converter, an AC-AC converter, a DC-DC converter, a preamplifier, a postamplifier, or the like.

[0065] like Figure 2 As shown in FIG, the first component E1 is provided with electrodes E11 and E12. The first component E1 has first component conductive connecting members E11a and E12a provided on the electrodes E11 and E12. Figure 2 In the example shown in FIG. 1 , the first component E1 is mounted in the first component mounting area A1 within the recess 20 of the wiring substrate 1 by so-called face-up mounting. The first component conductive connecting member E11a is configured to connect the electrode E01 of the optoelectronic component E0 to the electrode E11. The first component conductive connecting portion E12a is configured to connect the electrode E21 of the second component E2 to the electrode E12. The first component conductive connecting members E11a and E12a can be formed by any of a conductive post, a conductive connector, and a conductive bump. The first component conductive connecting members E11a and E12a are conductive posts formed, for example, using any metal such as copper, nickel, gold, silver, or palladium.

[0066] The conductive connection body of the first component conductive connection member E11a, E12a can be formed using metals such as tin, copper, nickel, gold, and silver. The first component conductive connection member E11a, E12a is a conductive bump, which can be formed using, for example, a solder such as a tin-based solder or a gold-based solder. If the first component conductive connection member E11a, E12a is used, it becomes easy to mount the optoelectronic component E0 and the second component E2. In addition, the first component conductive connection member E11a, E12a sometimes prevents the electrodes E11, E12 of the first component E1 from short-circuiting with each other. It should be noted that the electrode surface of the first component E1 is Figure 2 In the example, the non-electrode surface of the first component E1 corresponds to the upper surface of the first component E1. Figure 2 In the example of , it corresponds to the lower surface of the first component E1.

[0067] It should be noted that if Figure 3As shown, the first component E1 can be connected to the photovoltaic component E0 and the second component E2 by metal bonding, in which the metal of the electrodes E11 and E12 of the first component E1 is directly bonded to the metal of the electrode E01 of the photovoltaic component E0 and the metal of the electrode E21 of the second component E2. Specifically, the metal of the electrodes E11 and E12 of the first component E1 is formed from a metal capable of metal bonding. When the first component E1 is bonded to the photovoltaic component E0 and the second component E2 by metal bonding, the metal of the electrodes E11 and E12 of the first component E1, as well as the metal of the electrode E01 of the photovoltaic component E0 and the metal of the electrode E21 of the second component E2, are metals capable of metal bonding, such as copper, gold, silver, palladium, or the like. For example, electrodes E11 and E12 of the first component E1 are formed of copper, while electrode E01 of the photovoltaic component E0 and electrode E21 of the second component E2 are also formed of copper. The electrodes E11 and E12 of the first component E1 are bonded to electrode E01 of the photovoltaic component E0 and electrode E21 of the second component E2 using a common metal bond (for example, copper-copper bonding). The electrodes E11 and E12 of the first component E1, electrode E01 of the photovoltaic component E0, and electrode E21 of the second component E2 can be formed of the same metal or different metals. Furthermore, the electrodes E11 and E12 of the first component E1, electrode E01 of the photovoltaic component E0, and electrode E21 of the second component E2 can have the same thickness or different thicknesses.

[0068] It should be noted that if Figure 2 As shown, the recess 20 provided in the first component mounting area A1 has a lower surface 20a of the recess 20 and an upper surface of the recess 20 at the same position as the component mounting surface 1a. The height H from the lower surface 20a to the upper surface is set to a height at which the first component E1 and the optoelectronic component E0 can be connected using the first component conductive connecting members E11a and E12a formed on the electrodes E11 and E12 of the first component E1. In addition, the height H is set to a height at which the first component E1 can be connected to the second component E2. Figure 1 In the wiring substrate 1 of the example shown in FIG, the lower surface 20a of the recess 20 is formed by the first surface 21a of the core substrate 21. It should be noted that the lower surface 20a of the recess 20 may be formed on the upper surface of the insulating layer 221, between the upper and lower surfaces of the insulating layer 221, between the upper and lower surfaces of the insulating layer 222, or at a position further dug downward from the first surface 21a of the core substrate 21.

[0069] For example, the top portion (Z-direction position) of the first component conductive connecting member E11a is adjusted to be approximately flush with the top portion (Z-direction position) of the optoelectronic component conductive connecting member 261. By making the top portions of the first component conductive connecting portion E11a and the optoelectronic component conductive connecting member 261 approximately flush with each other, the optoelectronic component E0 does not tilt when mounted on the wiring substrate 1. This facilitates and reliably connects the optoelectronic component E0 to the first component E1 and the wiring substrate 1. Furthermore, for example, the top portion (Z-direction position) of the first component conductive connecting portion E12a is adjusted to be approximately flush with the top portion (Z-direction position) of the second component conductive connecting member 262. By forming the uppermost parts of the conductive connecting portion E12a for the first component and the conductive connecting member 262 for the second component into approximately the same plane, the second component E2 will not tilt when the second component E2 is mounted on the wiring substrate 1. Therefore, it is considered that the connection between the second component E2 and the first component E1 and the connection between the second component E2 and the wiring substrate 1 becomes easy and can be reliably joined.

[0070] Figure 2 The optoelectronic component E0 shown is, for example, an electrical component including a light-receiving element and / or a light-emitting element having a photoelectric conversion function. For example, the optoelectronic component E0 can be embodied as a light-receiving element such as a photodiode, and a light-emitting element such as a light-emitting diode (LED), an organic light-emitting diode (OLED), a laser diode (LD), and a vertical-cavity surface-emitting laser (VCSEL).

[0071] like Figure 2 As shown in FIG, the optoelectronic component E0 is provided with electrodes E01, E02 and a light emitting and receiving portion E0L. Figure 2 In the example, the optoelectronic component E0 is mounted in the optoelectronic component mounting area A0 of the wiring substrate 1 by so-called face-down mounting (flip-chip mounting). If the optoelectronic component E0 is mounted in the optoelectronic component mounting area A0, the electrode E02 is connected to the optoelectronic component conductor pad 2321 of the electrical wiring portion 2 through the optoelectronic component conductive connecting member 261, and the electrode E01 is connected to the electrode E11 of the first component E1 through the first component conductive connecting member E11a formed on the electrode E11 of the first component E1. In addition, the light-emitting and receiving portion E0L is arranged at a position opposite to the core portion 311 of the optical wiring 31. It should be noted that the electrode surface of the optoelectronic component E0 is Figure 2 In the example, the non-electrode surface of the photovoltaic component E0 is equivalent to the lower surface of the photovoltaic component E0. Figure 2 In the example, it corresponds to the upper surface of the optoelectronic component E0.

[0072] Instead of forming a resin such as a filler resin, an optical resin can be formed between the optoelectronic component E0 and the optical wiring section 3. The optical resin can be a transparent resin, a resin with a modified refractive index, or both. The material of the optical resin is not particularly limited; examples include epoxy resin, silicone resin, and acrylic resin. Forming an optical resin between the optoelectronic component E0 and the optical wiring section 3 facilitates light transmission between the light-emitting and light-receiving portion E0L of the optoelectronic component E0 and the optical wiring section 3.

[0073] When the optoelectronic component E0 is a light-receiving element, an optical signal enters the core 311 of the optical wiring 31 from an external source such as an optical fiber F. The optical signal entering the core 311 of the optical wiring 31 then enters the light-receiving and light-emitting portion E0L, where it is converted into an electrical signal based on the optical signal entering the light-receiving and light-emitting portion E0L, functioning as a light-receiving portion. The electrical signal output from the electrode E01 is then input into the first component E1. When the optoelectronic component E0 is a light-emitting element, the optoelectronic component E0 converts the optical signal based on the electrical signal entering the electrode E01 from the first component E1, and then emits an optical signal from the light-receiving and light-emitting portion E0L, functioning as a light-emitting portion. The optical signal emitted from the light-receiving and light-emitting portion E0L enters the core 311 of the optical wiring 31. The optical signal propagating through the core 311 then enters the optical fiber F. For example, the electrical signal input to or output from the electrode E01 is an analog electrical signal, and the light emitted from or incident on the light-receiving and emitting portion E0L is an analog optical signal. It should be noted that the light emitted from or incident on the light-receiving and emitting portion E0L may also be a digital optical signal. Furthermore, the electrical signal input to or output from the electrode E01 may also be a digital electrical signal.

[0074] Figure 2 The second component E2 shown is, for example, an electronic component such as a semiconductor device that converts an electrical signal that causes the optoelectronic component E0 to emit light and / or processes the electrical signal converted by the optoelectronic component E0. If the optoelectronic component E0 is a light-emitting element, the second component E2 may be, for example, a computing device that performs a predetermined operation on a digital signal input to the second component E2 and outputs the resulting digital signal to the first component E1. If the optoelectronic component E0 is a light-receiving element, the second component E2 may be, for example, a computing device that performs a predetermined operation on a digital signal input from the first component E1 and outputs the resulting digital signal to the conductor layer 232 included in the wiring substrate 1. For example, the second component E2 may be embodied as a driver IC, a microcomputer, a programmable logic device (PLD), or the like.

[0075] like Figure 2 As shown in FIG. 1 , the second component E2 is provided with electrodes E21 and E22. Figure 2 In the example, the second component E2 is mounted in the second component mounting area A2 of the wiring substrate 1 by so-called face-down mounting (flip chip mounting). If the second component E2 is mounted in the second component mounting area A2, the electrode E22 is connected to the second component conductor pad 2322 of the electrical wiring portion 2 via the second component conductive connecting member 262, and the electrode E21 is connected to the electrode E12 of the first component E1 via the first component conductive connecting member E12a formed on the electrode E12 of the first component E1. It should be noted that the electrode surface of the second component E2 is Figure 2 In the example, the lower surface of the second part E2 corresponds to the non-electrode surface of the second part E2. Figure 2 In the example, it corresponds to the upper surface of the second component E2.

[0076] In the component-mounted wiring substrate 10 of this embodiment, the first component E1 is mounted face-up within the first component mounting area A1 within the recess 20 of the wiring substrate 1, allowing the optoelectronic component E0 to be connected to the first component E1. When the first component E1 is mounted face-up, the optoelectronic component E0 is mounted face-down with its electrodes E01 and E11 facing each other. This allows the optoelectronic component E0 to be directly connected to the first component E1 without intervening through the electrical wiring portion 2. Directly connecting the optoelectronic component E0 to the first component E1 reduces complexity and simplifies the connection structure between the optoelectronic component E0 and the first component E1. As a result, it is believed that the connection process conditions and alignment are also simplified, shortening the connection distance between the first component E1 and the optoelectronic component E0, thereby minimizing connection losses.

[0077] When the first component E1 includes the first component conductive connecting portion E11a on the electrode E11, the connection between the first component E1 and the optoelectronic component E0 included in the component-mounted wiring substrate 10 may be facilitated. Furthermore, the use of the first component conductive connecting portion E11a can minimize the connection length between the optoelectronic component E0 and the first component E1. When the connection length between the optoelectronic component E0 and the first component E1 is shortened, it is believed that the connection loss between the optoelectronic component E0 and the first component E1 is suppressed.

[0078] Similarly, when the first component E1 is mounted face-up, by mounting the second component E2 face-down so that the electrode E21 of the second component E2 and the electrode E12 of the first component E1 face each other, the second component E2 can be directly connected to the first component E1 without intervening the electrical wiring portion 2. When the second component E2 is directly connected to the first component E1, the connection structure between the second component E2 and the first component E1 becomes less complex and is simplified. As a result, it is believed that the connection process conditions and alignment are also simplified, the connection distance between the second component E2 and the first component E1 is shortened, and connection loss is suppressed.

[0079] When the first component E1 includes the first component conductive connecting portion E12a on the electrode E12, it is easier to connect the first component E1 and the second component E2 included in the component-mounting wiring substrate 10. Furthermore, the use of the first component conductive connecting portion E12a minimizes the connection length between the second component E2 and the first component E1. It is believed that shortening the connection length between the second component E2 and the first component E1 reduces connection loss between the second component E2 and the first component E1.

[0080] In one example, the first component conductive connecting portion E12a is a conductive post, and the optoelectronic component conductive connecting member 261 and the second component conductive connecting member 262 are conductive posts or solder bumps. Alternatively, the first component conductive connecting portion E12a is a solder bump, and the optoelectronic component conductive connecting member 261 and the second component conductive connecting member 262 are conductive posts or solder bumps. Alternatively, the first component conductive connecting portion E12a may be omitted, and the metal of the electrodes E11 and E12 of the first component E1 may be metallically bonded to the metal of the electrode E01 of the optoelectronic component E0 and the metal of the electrode E21 of the second component E2, with the optoelectronic component conductive connecting member 261 and the second component conductive connecting member 262 being conductive posts or solder bumps. The melting points of the first component conductive connecting portion E12a, the optoelectronic component conductive connecting member 261, and the second component conductive connecting member 262 may be substantially the same or may differ by 5° C. or more.

[0081] Next, as an example of a method for manufacturing the wiring substrate of this embodiment, by referring to Figures 4A to 4F A method for manufacturing a wiring substrate is described, Figure 1 The illustrated wiring board 1. It should be noted that, unless otherwise stated, each component of the wiring board 1 may be formed using any of the materials described above.

[0082] First, the electric wiring portion 2 is prepared. One example of a method for manufacturing the electric wiring portion 2 is Figures 4A to 4E As shown. Figures 4A to 4E In the example of , the electric wiring portion 2 is manufactured using a method for forming a build-up wiring substrate including a general core substrate.

[0083] First, if Figure 4A As shown, a plate-shaped insulator 213p and a double-sided copper-clad substrate 21p having copper foils 212p formed on both surfaces of the insulator 213p are prepared.

[0084] Then, if Figure 4B As shown, a core substrate 21 is formed using a double-sided copper-clad substrate 21p. Through holes are formed on the double-sided copper-clad substrate 21p, for example, by drilling or laser processing. Then, in the through holes of the double-sided copper-clad substrate 21p, metal coating is formed on the inner wall of the through holes by electroless plating and electrolytic plating to form a through-hole conductor 211. Next, an insulating resin such as epoxy resin is injected into the cavity of the through-hole conductor 211 and cured to form a filler 214. The filler 214 can also be formed in the cavity by plating or conductive paste. It should be noted that the filler 214 is preferably on the same surface as the copper foil 212p of the double-sided copper-clad substrate 21p. Next, metal coating is formed on the surface of the double-sided copper-clad substrate 21p having the filler 214 and the copper foil 212p by electroless plating and electrolytic plating, and a conductor layer 212 including a conductor pad 2121 for the first component is formed by patterning based on a subtractive method. Through these forming processes, the core substrate 21 is obtained.

[0085] Then, if Figure 4C As shown, an insulating layer 221 is formed on the first surface 21a of the core substrate 21, and an insulating layer 223 is formed on the second surface 21b of the core substrate 21. The insulating layer 221 and the insulating layer 223 are formed, for example, by laminating and thermocompressing an insulating resin such as a film of epoxy resin on the core substrate 21. Vias (non-through holes) for forming the via conductors 25 are formed in each insulating layer, for example, by irradiation with a laser such as carbon dioxide. Next, the via conductors 25 are formed in the via holes of the insulating layer 221, and a conductor layer 231 is formed on the upper surface of the insulating layer 221. The via conductors 25 are formed in the through holes of the insulating layer 223, and a conductor layer 233 is formed on the upper surface of the insulating layer 223. Each conductor layer and each via conductor are formed, for example, by a semi-additive method.

[0086] Next, insulating layer 222 is formed on the upper surfaces of insulating layer 221 and conductive layer 231 using the same method as for forming insulating layer 221. Insulating layer 224 is formed on the upper surfaces of insulating layer 223 and conductive layer 233 using the same method as for forming insulating layer 223. Next, conductive layer 232, including conductive pads 2321 for optoelectronic components and conductive pads 2322 for second components, is formed on the upper surface of insulating layer 222 using the same method as for forming conductive layer 231. Conductive layer 234 is formed on the upper surface of insulating layer 224 using the same method as for forming conductive layer 233. Next, solder resist 241 is formed on the upper surfaces of insulating layer 222 and conductive layer 232, and solder resist 242 is formed on the upper surfaces of insulating layer 224 and conductive layer 234. The solder resist is formed by applying, for example, an insulating resin such as epoxy resin or polyimide resin, or an adhesive film.

[0087] Then, if Figure 4D As shown, in Figure 4C A recess 20 is formed on one surface of the laminate shown. The formation of the recess 20 can also be divided into the formation of an outer area AR1 that defines the outer edge of the formation area AR of the recess 20 and the formation of an inner area AR2 surrounded by the outer area AR1. The outer area AR1 is formed by, for example, mechanically cutting along the outer frame of the outer area AR1 using a milling machine or the like to remove the solder resist 241, the insulating layer 222, and the insulating layer 221 up to the first surface 21a of the core substrate 21. It should be noted that the outer area AR1 can also be formed by irradiating a laser along the outer area AR1 to remove the solder resist 241, the insulating layer 222, and the insulating layer 221 up to the first surface 21a of the core substrate 21.

[0088] The inner region AR2 can also be formed after the outer region AR1 is formed. The inner region AR2 is formed, for example, by irradiating the inner region AR2 with a laser to remove the solder resist 241, the insulating layer 222, and the insulating layer 221 up to the first surface 21a of the core substrate 21. When irradiating with laser, the first component conductor pad 2121 reflects the laser, thereby sometimes forming the inner region AR2 without damaging the core substrate 21. It should be noted that the inner region AR2 can also be formed by applying external force to the solder resist 241, the insulating layer 222, and the insulating layer 221 on the first component conductor pad 2121, which are separated from the surrounding area, to cause them to peel off. In addition, the inner region AR2 can also be formed by mechanical cutting. When the outer region AR1 and / or the inner region AR2 are formed by laser irradiation, in order to suppress unnecessary absorption of the laser, it is sometimes preferable not to form the conductor layers 231 and 232 in the formation area AR of the recess 20.

[0089] Then, if Figure 4EAs shown, openings 241a are formed on the solder resists 241 and 242 on the conductor pads 2321 for the optoelectronic component and the conductor pads 2322 for the second component, for example, by photolithography. In addition, openings 242a are also formed on the solder resist 242. Next, conductive connecting members 261 for the optoelectronic component and conductive connecting members 262 for the second component are formed on the conductor pads 2321 for the optoelectronic component and the conductor pads 2322 for the second component exposed by the openings 241a by electroless plating. After these steps, the electric wiring portion 2 is obtained. It should be noted that it is also possible to provide openings on the solder resist, and then perform the process after forming a protective material for protecting the openings. Figure 4D After the recessed portion shown is formed, the protective material is peeled off.

[0090] Afterwards, if Figure 4F As shown, the optical wiring section 3 is prepared. First, a semiconductor substrate such as a glass plate, a ceramic plate, or silicon is prepared as a support substrate 32. Next, the first cladding layer 3121, the core portion 311, and the second cladding layer 3122 are sequentially stacked on the surface of the support substrate 32 to form the optical wiring 31. The first cladding layer 3121, the core portion 311, and the second cladding layer 3122 are formed by, for example, coating, film bonding, etc. After these steps, the optical wiring section 3 is obtained. It should be noted that the support substrate 32 can also be removed from the optical wiring section 3 after the optical wiring 31 is formed.

[0091] Next, a support member 4 is formed in the optical wiring mounting area AL on the first surface (component mounting surface) 1a of the electrical wiring portion 2. For example, a film-shaped support member 4 is placed on the component mounting surface 1a. The support member 4 can be formed from any plate-like member, such as a material containing epoxy resin and inorganic particles. Alternatively, the support member 4 can be bonded to the component mounting surface 1a.

[0092] Next, the optical wiring portion 3 is arranged on the supporting member 4. When arranged on the supporting member 4, the optical wiring portion 3 is turned upside down. That is, the optical wiring portion 3 is arranged on the supporting member 4 in a manner that the optical wiring 31 and the supporting member 4 are opposite to each other. It should be noted that the optical wiring portion 3 can also be arranged on the supporting member 4 in a manner that the supporting substrate 32 and the supporting member 4 are opposite to each other without being turned upside down. In addition, the optical wiring portion 3 can also be bonded to the supporting member 4. After the above steps, the optical wiring portion 3 is completed. Figure 1 The example of the wiring substrate 1. It should be noted that the optical wiring 31 may be formed directly on the wiring substrate without using a supporting substrate or a supporting member.

[0093] like Figure 1As shown, as needed, in order to connect the optical wiring section 3 and the optical fiber F, the connector C is configured so that the optical wiring section 3 is sandwiched between the upper shell C1 and the lower shell C2. For example, the upper shell C1 is mounted on the support substrate 32, and the lower shell C2 is mounted on the optical wiring 31. During the installation of the connector C to the optical wiring section 3, the upper shell C1 and the lower shell C2 are engaged. It should be noted that the connector C can be installed on the optical wiring section 3 before the optical wiring section 3 is formed on the component mounting surface 1a, or it can be installed as shown in FIG. Figure 2 As shown, after the components such as the optoelectronic component E0 , the first component E1 , and the second component E2 mounted on the wiring substrate 1 are mounted, they are attached to the optical wiring section 3 .

[0094] Next, as an example of a method for manufacturing a component mounting wiring substrate of this embodiment, by referring to Figure 5A and Figure 5B A method for manufacturing a component-mounted wiring substrate is described. Figure 2 The illustrated component-mounted wiring substrate 10. It should be noted that, unless otherwise stated, each component of the component-mounted wiring substrate 10 may be formed using any of the materials described above.

[0095] First, if Figure 5A As shown, the first component E1 is prepared. For example, the first component E1 is prepared with first component conductive connecting members E11a and E12a formed on electrodes E11 and E12, respectively. The first component conductive connecting members E11a and E12a are formed, for example, by electroless plating, solder, or other metal. Next, the first component E1 is mounted face-up in the first component mounting area A1 on the first component conductor pad 2121 within the recess 20 of the wiring substrate 1 using a conductive or non-conductive adhesive.

[0096] Afterwards, if Figure 5B As shown, optoelectronic component E0 can be mounted face-down in optoelectronic component mounting area A0 on component mounting surface 1a of wiring substrate 1. When optoelectronic component E0 is mounted in optoelectronic component mounting area A0, electrode E02 is connected to optoelectronic component conductor pad 2321 of electrical wiring portion 2 via optoelectronic component conductive connecting member 261. Furthermore, electrode E01 is connected to electrode E11 of first component E1 via first component conductive connecting member E11a formed on electrode E11 of first component E1. Furthermore, light emitting and receiving portion E0L of optoelectronic component E0 is positioned opposite core portion 311 of optical wiring 31, thereby optically connecting to core portion 311.

[0097] Furthermore, if Figure 5BAs shown, the second component E2 can be mounted face-down in the second component mounting area A2 on the component mounting surface 1a of the wiring substrate 1. If the second component E2 is mounted in the second component mounting area A2, the electrode E22 is connected to the second component conductor pad 2322 of the electrical wiring portion 2 via the second component conductive connecting member 262, and the electrode E21 is connected to the electrode E12 of the first component E1 via the first component conductive connecting member E12a formed on the electrode E12 of the first component E1. After the above steps, the wiring substrate 1 is completed. Figure 2 The component-mounted wiring substrate 10 is an example.

[0098] It should be noted that Figure 2 The component mounting wiring substrate 10 shown as an example may also be Figures 6A to 6C The manufacturing method shown is used to manufacture.

[0099] First, if Figure 6A As shown, the photovoltaic component E0 and the second component E2 are bonded together at predetermined locations on the release film RF. The release film RF is configured, for example, to have an adhesive surface, and the photovoltaic component E0 and the second component E2 are bonded together by the adhesive force, and the bonded photovoltaic component E0 and the second component E2 can be peeled off. Examples of the release film RF include resin films such as polyimide resins.

[0100] Then, if Figure 6B As shown, the first component E1 is mounted face-down on the photovoltaic component E0 and the second component E2 on the release film RF. When the first component E1 is mounted face-down, the electrode E11 of the first component E1 is connected to the electrode E01 of the photovoltaic component E0 via the first component conductive connecting member E11a formed on the electrode E11 of the first component E1, and the electrode E12 of the first component E1 is connected to the electrode E21 of the second component E2 via the first component conductive connecting member E12a formed on the electrode E12 of the first component E1. (Hereinafter, the photovoltaic component E0, the second component E2, and the first component E1, which are connected to each other on the release film RF to form a composite component, are also referred to as the "component assembly EA").

[0101] Then, if Figure 6CAs shown, the component assembly EA on the release film RF is mounted on the wiring substrate 1 in a state in which it is flipped upside down along with the release film RF. The optoelectronic component E0 and the second component E2 are mounted face-down on the wiring substrate 1 in the optoelectronic component mounting area A0 and the second component mounting area A2, respectively. Furthermore, the first component E1 is mounted face-up on the wiring substrate 1 in the first component mounting area A1 within the recess 20. At this point, the optoelectronic component E0 is optically connected to the core 311 of the optical wiring 31 by positioning the light-emitting and receiving portion E0L opposite the core 311. Furthermore, the electrode E02 is connected to the optoelectronic component conductor pad 2321 of the electrical wiring portion 2 via the optoelectronic component conductive connecting member 261 of the wiring substrate 1. Furthermore, the electrode E22 of the second component E2 is connected to the first component conductor pad 2322 of the electrical wiring portion 2 via the second component conductive connecting member 262 of the wiring substrate 1. After the component assembly EA is mounted on the wiring substrate 1, the peeling film RF is peeled off from the component assembly EA. Figure 2 The component-mounted wiring substrate 10 is an example.

[0102] The wiring substrates and component-mounted wiring substrates of the embodiments are not limited to the structures illustrated in the drawings and the structures, shapes, and materials illustrated in this specification. As described above, the wiring substrates of the embodiments may include any number of conductor layers and any number of insulating layers. The wiring patterns connecting the conductor pads of the mounted components may also be formed on any number of conductor layers, one or more. Figure 1 The electroconductive connecting member 261 for the optoelectronic component and the electroconductive connecting member 262 for the second component included in the wiring substrate 1 exemplified in the examples are not necessarily provided on the wiring substrate of the embodiment. Figure 1 The supporting member 4 included in the wiring substrate 1 and the supporting substrate 32 of the optical wiring section 3 exemplified in the above embodiments are not necessarily provided on the wiring substrate of the embodiment.

[0103] exist Figure 2 In the component mounting wiring substrate of the illustrated embodiment, in the optoelectronic component mounting area A0, the first component mounting area A1, and the second component mounting area A2, no filling resin such as an underfill material is formed between the optoelectronic component E0, the first component E1, and the second component E2 and the wiring substrate 1. Figure 2In the example shown, the filling resin may be formed only within the recess 20 where the first component E1 is mounted. Alternatively, an optical resin may be formed instead of the filling resin, or both. Furthermore, the optical resin may be formed between the opposing surfaces of the optoelectronic component E0 (specifically, the light emitting and receiving portion E0L of the optoelectronic component E0) and the optical wiring portion 3 (specifically, the core portion 311 of the optical wiring portion 3). Forming the optical resin between the optoelectronic component E0 and the optical wiring portion 3 facilitates light transmission between the light emitting and receiving portion E0L of the optoelectronic component E0 and the core portion 311 of the optical wiring portion 3.

[0104] like Figure 7A As shown, in the optoelectronic component mounting area A0, the first component mounting area A1, and the second component mounting area A2, a filling resin (underfill material) EN can be formed to fill between the optoelectronic component E0, the first component E1, and the second component E2 and the wiring substrate 1. Figure 7A In the example, the filling resin EN is formed to cover at least the lower surface of the optoelectronic component E0 and the second component E2 and the entire exposed surface of the first component E1. As the filling resin (bottom filling material) EN, resin materials such as epoxy resin and silicone resin can be exemplified. It should be noted that the filling resin (bottom filling material) EN can be formed of the same material or of a plurality of different materials. As an example, the filling resin formed in the recess 20 on which the first component E1 is mounted and the filling resin formed in a manner covering the lower surface of the optoelectronic component E0 and the second component E2 and the entire exposed surface of the first component E1 can be formed of different materials. In addition, between the opposing surfaces of the optoelectronic component E0 and the optical wiring portion 3, no resin may be formed, or an optical resin may be formed. The optical resin makes it easy to achieve light transmission between the light-emitting and light-receiving portion E0L of the optoelectronic component E0 and the core portion 311 of the optical wiring portion 3. It should be noted that when an optical resin is used as the filling resin (underfill material) EN, the filling resin (underfill material) EN can also be formed to fill the space between the optoelectronic component E0, the first component E1, the second component E2, and the wiring substrate 1, and further, can be formed between the opposing surfaces of the optical wiring portion 3 and the optoelectronic component E0. Examples of the optical resin include epoxy resins, silicone resins, acrylic resins, and the like.

[0105] like Figure 7BAs shown, the filling resin EN can be formed to cover the entire exposed surface of the optoelectronic component E0, the first component E1, the second component E2, and the wiring substrate 1. Examples of the filling resin EN include resin materials such as epoxy resins and silicone resins. Furthermore, in the optoelectronic component mounting area A0, the first component mounting area A1, and the second component mounting area A2, the filling resin EN can be formed to cover the entire exposed surface of the optoelectronic component E0, the first component E1, the second component E2, and the wiring substrate 1, except for the light-receiving and light-emitting portion E0L of the optoelectronic component E0, without covering it. It should be noted that the filling resin EN can be formed from the same material or from multiple different materials. For example, the filling resin formed in the recess 20 where the first component E1 is mounted and the filling resin formed to cover the lower surfaces of the optoelectronic component E0 and the second component E2 and the entire exposed surface of the first component E1 can be formed from different materials. Furthermore, resin may not be formed between the opposing surfaces of the optoelectronic component E0 and the optical wiring section 3, or an optical resin may be formed. The optical resin facilitates light transmission between the light-emitting and receiving portion E0L of the optoelectronic component E0 and the core portion 311 of the optical wiring section 3. It should be noted that when an optical resin is used as the filling resin EN, the filling resin EN can be formed to fill the gaps between the optoelectronic component E0, the first component E1, the second component E2, and the wiring substrate 1, and further, between the opposing surfaces of the optical wiring section 3 and the optoelectronic component E0. Examples of the optical resin include epoxy resins, silicone resins, and acrylic resins.

[0106] Likewise, if Figure 3 As shown, in the optoelectronic component mounting area A0, the first component mounting area A1 and the second component mounting area A2, the filling resin (underfill material) is not formed to fill the gaps between the optoelectronic component E0, the first component E1 and the second component E2 and the wiring substrate 1. Figure 3 In the example shown, the filling resin can be formed only within the recess 20 where the first component E1 is mounted. Alternatively, an optical resin can be formed between the opposing surfaces of the optoelectronic component E0 (specifically, the light emitting and receiving portion E0L of the optoelectronic component E0) and the optical wiring portion 3 (specifically, the core portion 311 of the optical wiring portion 3). Forming the optical resin between the optoelectronic component E0 and the optical wiring portion 3 facilitates light transmission between the light emitting and receiving portion E0L of the optoelectronic component E0 and the core portion 311 of the optical wiring portion 3.

[0107] like Figure 8A As shown, in the optoelectronic component mounting area A0, the first component mounting area A1, and the second component mounting area A2, a filling resin (underfill material) EN can be formed to fill between the optoelectronic component E0, the first component E1, and the second component E2 and the wiring substrate 1. Figure 8A In the example, the filling resin EN is formed to cover at least the lower surface of the optoelectronic component E0 and the second component E2 and the entire exposed surface of the first component E1. As the filling resin (bottom filling material) EN, resin materials such as epoxy resin and silicone resin can be exemplified. It should be noted that the filling resin (bottom filling material) EN can be formed of the same material or of a plurality of different materials. As an example, the filling resin formed in the recess 20 on which the first component E1 is mounted and the filling resin formed in a manner covering the lower surface of the optoelectronic component E0 and the second component E2 and the entire exposed surface of the first component E1 can be formed of different materials. In addition, between the opposing surfaces of the optoelectronic component E0 and the optical wiring portion 3, no resin may be formed, or an optical resin may be formed. The optical resin makes it easy to achieve light transmission between the light-emitting and light-receiving portion E0L of the optoelectronic component E0 and the core portion 311 of the optical wiring portion 3. It should be noted that when an optical resin is used as the filling resin (underfill material) EN, the filling resin (underfill material) EN can be formed to fill the gaps between the optoelectronic component E0, the first component E1, the second component E2, and the wiring substrate 1, and further, can be formed between the opposing surfaces of the optical wiring portion 3 and the optoelectronic component E0. Examples of the optical resin include epoxy resins, silicone resins, and acrylic resins.

[0108] like Figure 8BAs shown, the filling resin EN can also be formed to cover the entire exposed surface of the optoelectronic component E0, the first component E1, the second component E2, and the wiring substrate 1. Examples of the filling resin EN include resin materials such as epoxy resins and silicone resins. Furthermore, in the optoelectronic component mounting area A0, the first component mounting area A1, and the second component mounting area A2, the filling resin EN can also be formed to cover the entire exposed surface of the optoelectronic component E0, the first component E1, the second component E2, and the wiring substrate 1, except for the light-receiving and light-emitting portion E0L of the optoelectronic component E0, without covering it. It should be noted that the filling resin EN can be formed from the same material or from multiple different materials. For example, the filling resin formed in the recess 20 where the first component E1 is mounted and the filling resin formed to cover the lower surfaces of the optoelectronic component E0 and the second component E2, as well as the entire exposed surface of the first component E1, can also be formed from different materials. Furthermore, resin may not be formed between the opposing surfaces of the optoelectronic component E0 and the optical wiring section 3, or an optical resin may be formed. The optical resin facilitates light transmission between the light-emitting and receiving portion E0L of the optoelectronic component E0 and the core portion 311 of the optical wiring section 3. It should be noted that when an optical resin is used as the filling resin EN, the filling resin EN can be formed to fill the gaps between the optoelectronic component E0, the first component E1, the second component E2, and the wiring substrate 1, and further, between the opposing surfaces of the optical wiring section 3 and the optoelectronic component E0. Examples of the optical resin include epoxy resins, silicone resins, and acrylic resins.

[0109] Explanation of symbols

[0110] 1 Wiring substrate

[0111] 10-component wiring board

[0112] 1a Component mounting surface

[0113] 2Electrical wiring part

[0114] 20 recesses

[0115] 2121 Conductor pad for the first component

[0116] 221~224 insulation layer

[0117] 231~234 conductor layers

[0118] 2321 Conductor pads for optoelectronic components

[0119] 2322 Conductor pad for the second part

[0120] 261 Conductive connecting members for optoelectronic components

[0121] 262 Conductive connecting member for the second component

[0122] 3. Optical wiring department

[0123] 31 Optical Wiring

[0124] A0 optoelectronic component mounting area

[0125] A1 1st component mounting area

[0126] A2 Second component mounting area

[0127] E0 optoelectronic components

[0128] E1 Part 1

[0129] Conductive connecting member for the first part of E11a and E12a

[0130] E2 Part 2

[0131] EN filling resin

Claims

1. A wiring substrate comprising, on a component mounting surface, a first component mounting area, an optoelectronic component mounting area, and optical wiring capable of optically connecting to the optoelectronic component, wherein: A recess is formed on the component mounting surface of the wiring substrate. The first component mounting area is provided in the recessed portion. The first component mounting region at least partially overlaps with the optoelectronic component mounting region in a plan view.

2. The wiring substrate according to claim 1, wherein A conductive pad for an optoelectronic component is provided in the optoelectronic component mounting area of ​​the component mounting surface. A conductive connecting member for a photovoltaic component is formed on the conductive pad for a photovoltaic component, which is capable of connecting the photovoltaic component and the conductive pad for a photovoltaic component.

3. The wiring substrate according to claim 2, wherein The wiring substrate further includes a second component mounting area on the component mounting surface. The second component mounting area at least partially overlaps with the first component mounting area in a plan view.

4. The wiring substrate according to claim 3, wherein A second component conductor pad is provided in the second component mounting area of ​​the component mounting surface. A second component conductive connecting member capable of connecting the second component and the second component conductor pad is formed on the second component conductor pad.

5. The wiring substrate according to claim 1, wherein A support member is provided on the component mounting surface. The optical wiring is arranged on the supporting member. The wiring substrate according to claim 1 , wherein: A support substrate is formed on the side of the optical wiring opposite to the component mounting surface.

7. A component-mounted wiring substrate comprising: The wiring substrate according to claim 1; and a first component housed in the recess and mounted in the first component mounting area; in, A first component conductive connecting member capable of connecting the photovoltaic component and the first component is formed on the electrode surface of the first component.

8. A component-mounted wiring substrate comprising: The wiring substrate according to claim 1; and a first component housed in the recess and mounted in the first component mounting area; in, The electrode surface of the first member is formed with a metal capable of metal bonding the photovoltaic component and the first member.

9. The component mounting wiring substrate according to claim 7, wherein: The wiring substrate further includes a second component mounting area on the component mounting surface, wherein the second component mounting area at least partially overlaps with the first component mounting area in a plan view. The optoelectronic component mounting area is provided with an optoelectronic component. The second component is mounted in the second component mounting area.

10. The component mounting wiring substrate according to claim 9, wherein No filling resin is provided between the optoelectronic component, the first component, the second component, and the wiring substrate.

11. The component mounting wiring substrate according to claim 9, wherein A filling resin is provided to fill spaces between the optoelectronic component, the first component, the second component, and the wiring substrate.

12. The component mounting wiring substrate according to claim 11, wherein The filling resin is formed so as to cover the entire exposed surfaces of the photovoltaic component, the first component, and the second component.

13. The component mounting wiring substrate according to claim 9, wherein A second component conductor pad is provided in the second component mounting area of ​​the component mounting surface. A second component conductive connecting member for connecting the second component and the second component conductive pad is formed on the second component conductive pad.

14. The component mounting wiring substrate according to claim 8, wherein The wiring substrate further includes a second component mounting area on the component mounting surface. The second component mounting area at least partially overlaps with the first component mounting area in a plan view. The optoelectronic component mounting area is provided with an optoelectronic component. The second component is mounted in the second component mounting area.

15. The component mounting wiring substrate according to claim 14, wherein No filling resin is provided between the optoelectronic component, the first component, the second component, and the wiring substrate.

16. The component mounting wiring substrate according to claim 14, wherein A filling resin is provided to fill spaces between the optoelectronic component, the first component, the second component, and the wiring substrate.

17. The component mounting wiring substrate according to claim 16, wherein The filling resin is formed so as to cover the entire exposed surfaces of the photovoltaic component, the first component, and the second component.

18. The component mounting wiring substrate according to claim 14, wherein A second component conductor pad is provided in the second component mounting area of ​​the component mounting surface. A second component conductive connecting member for connecting the second component and the second component conductive pad is formed on the second component conductive pad.

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