Sensing assembly, detector probe and manufacturing method thereof

Abstract

The embodiment of the invention provides an induction assembly, a detector probe and a manufacturing method of the detector probe. The induction assembly comprises a lead seat and an electronic element, the lead seat comprises a base and a lead; the lead is arranged on the base in a penetrating manner; the base comprises a first part and a convex part; the protruding part is arranged on the first part, and the protruding part protrudes relative to the first part; the electronic element is fixedly connected with the lead, the electronic element and the protruding part are located on the same side of the first part, and the projection of the electronic element on the first plane is located in an area surrounded by the protruding part; the first plane is the plane where the protruding part is located. The induction assembly can be used for packaging electronic components.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of detectors, in particular to an inductive assembly, a detector probe and a manufacturing method thereof. BACKGROUND

[0002] The detector probe is usually provided with at least one electronic component for detecting a target parameter. The electronic component can be a patch capacitor, a patch resistor or a patch inductor. In order to prevent impurities in the air from corroding the electronic component, the electronic component generally needs to be packaged. SUMMARY

[0003] Therefore, the present application provides an inductive assembly, a detector probe and a manufacturing method thereof, which can be used for packaging electronic components.

[0004] To achieve the above object, the present application provides the following technical scheme:

[0005] An inductive assembly comprises a lead seat and an electronic component; the lead seat comprises a base and a lead; the lead is arranged through the base; the base comprises a first part and a protruding part; the protruding part is arranged on the first part, and the protruding part protrudes relative to the first part; the electronic component is fixedly connected with the lead, and the electronic component and the protruding part are located on the same side of the first part; a projection of the electronic component on a first plane is located in an area surrounded by the protruding part; and the first plane is a plane where the protruding part is located.

[0006] The inductive assembly provided by the present application comprises a lead seat and an electronic component; the lead seat comprises a base and a lead; the base comprises a first part and a protruding part; the protruding part is arranged on the first part, and the protruding part protrudes relative to the first part; the electronic component is fixedly connected with the lead, and the electronic component and the protruding part are located on the same side of the first part; and a projection of the electronic component on a first plane is located in an area surrounded by the protruding part. The inductive assembly can be connected with a shell through the protruding part, so as to effectively package the electronic component.

[0007] Another embodiment of the present application further provides a detector probe comprising a shell and an inductive assembly; the shell comprises a first bottom part and a first side wall part; the inductive assembly comprises a lead seat and an electronic component; the lead seat comprises a base and a lead, the lead is arranged through the base, and the electronic component is fixedly connected with the lead; the base comprises a first part; the first part and / or the first bottom part is provided with a third part, the first part and the first bottom part are fixedly connected at least through the third part, and at least part of the first part and the electronic component are packaged in a first accommodating cavity surrounded by the first side wall part.

[0008] The probe head provided by the application comprises a shell and a sensing assembly; the shell comprises a first bottom surface part and a first sidewall part; the sensing assembly comprises a lead seat and electronic components; the lead seat comprises a base and a lead, and the base further comprises a first part; the first part and / or the first bottom surface part are provided with a third part, and the first part and the first bottom surface part are fixedly connected through the third part, so that at least part of the first part and the electronic components are encapsulated in a first accommodating cavity surrounded by the first sidewall part, thereby realizing encapsulation of the electronic components.

[0009] The application also provides a manufacturing method of a probe head, comprising the following steps:

[0010] The first bottom surface part of the shell is placed on the first part of the base of the lead seat of the sensing assembly, so that the electronic components of the sensing assembly are located in the first accommodating cavity surrounded by the first sidewall part of the shell, and the projection of the electronic components on a first plane is located in the area surrounded by the protruding part of the first part or the first bottom surface part; wherein the first plane is the plane where the protruding part is located.

[0011] The first part and the first bottom surface part are fixedly connected by heating at least the first bottom surface part, the first part and / or the protruding part.

[0012] The manufacturing method of the probe head provided by the application realizes encapsulation of the electronic components by placing the first bottom surface part of the shell on the first part of the lead seat, locating the electronic components in the first accommodating cavity of the shell, and locating the projection of the electronic components on a first plane in the area surrounded by the protruding part, and then heating the protruding part, the first bottom surface part and / or the first part to connect the first bottom surface part and the first part. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0014] Figure 1 The structural schematic diagram of the sensing assembly provided by an embodiment of the application;

[0015] Figure 2 The structural schematic diagram of the sensing assembly and the shell provided by an embodiment of the application;

[0016] Figure 3 The structural schematic diagram of the sensing assembly and the shell provided by another embodiment of the application;

[0017] Figure 4A flow chart of a manufacturing method of a detector probe according to an embodiment of the present application. DETAILED DESCRIPTION

[0018] In order to better understand the technical solutions of the present application, the embodiments of the present application are described in detail below with reference to the drawings. It should be clear that the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0019] The terms used in the embodiments of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application. The singular forms "a", "first", "second", "the", and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should be understood that the term "and / or" used herein is only a description of the associated relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship. In the following description, the appearance of terms such as "inner", "outer", "upper", "lower", "left", "right" and the like indicate the orientation or positional relationship only for the convenience of describing the embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0020] The present application provides an inductive assembly, such as Figures 1-3As shown, the induction assembly includes a lead seat 1 and an electronic component 2; the lead seat 1 includes a base 11 and leads 12; the leads 12 are arranged through the base 11; the base 11 includes a first part 111 and a protruding part 112; the protruding part 112 is arranged on the first part 111, and the protruding part 112 protrudes relative to the first part 111; and the electronic component 2 is fixedly connected with the leads 12, the electronic component 2 and the protruding part 112 are located on the same side of the first part 111, and the projection of the electronic component 2 on a first plane is located in the area surrounded by the protruding part 112; wherein the first plane is the plane where the protruding part 112 is located. The leads 12 can be flexible wires such as constantan wires, etc., or hard guide pins such as copper columns, silver columns, gold columns or other alloy conductive columns. The base 11 can be a hollow device made of copper, silver-plated or gold-plated metal materials, etc.; when the base 11 is made of metal materials, an insulating material such as ceramic, glass, plastic, insulating glue, etc. needs to be poured into the hollow base 11 to prevent short circuit between the leads 12 and the base 11, and specifically, the insulation between the leads 12 and the base 11 can be realized by using a glass sealing method. The electronic component 2 can be a chip capacitor, a chip resistor or a chip inductor, such as an NTC (negative temperature coefficient) resistor, a PCT (positive temperature coefficient) resistor, etc. The electronic component 2 can generate an electrical signal representing a measured gas parameter to detect a target parameter, and the measured gas can be refrigerant, etc. The protruding part 112 can be a soldering material such as copper, tin, gold or silver that can be used for soldering, which can connect the first part 111 with other components, for example, the other components can be a shell 4. The induction assembly in the embodiment can be used to realize the packaging of the electronic component 2. Specifically, the shell 4 can be placed on the first part 111, and the electronic component 2 is located in the accommodating cavity of the shell, and the projection of the electronic component 2 on the first plane is located in the area surrounded by the protruding part 112, and then the shell 4, the first part 111 and / or the protruding part 112 are heated, so that the electronic component 2 can be packaged in the shell 4. The heating method can be energy storage welding, resistance welding or laser welding, etc. Compared with the packaging of the electronic component 2 by using glue, the packaging method of the embodiment has better effect, and is not prone to poor packaging in harsh environments such as high temperature and high pressure.

[0021] Further, the cross section of the protruding part 112 can be a continuous closed curve shape, for example, the protruding part 112 can be annular, so that the protruding part 112 can be more uniformly distributed on the first part 111 after melting, avoiding uneven connection of each part when the protruding part 112 connects the shell 4 and the first part 111 as solder, thereby increasing the packaging effect of the electronic component 2. Alternatively, the protruding part 112 can also include a plurality of discontinuously distributed protruding structures. For example, the protruding part 112 is a region formed by point-like interval fitting.

[0022] Considering that the constantan wire is generally small, laser welding is suitable for small package patch devices; the welding between the lead wire 12 and the pad of the electronic component 2 is spot welding, and laser welding is also suitable. However, laser welding is relatively expensive; in order to reduce the welding cost, the inductive assembly further comprises a connecting piece 3; the electronic component 2 is fixed to the lead wire 12 at least through the connecting piece 3; the connecting piece 3 comprises a first welding flat portion 31 and a second welding flat portion 32; the electronic component 2 is fixedly connected with the second welding flat portion 32; the electronic component 2 and the second welding flat portion 32 can be linearly connected or surface-connected. The lead wire 12 is fixedly connected with the first welding flat portion 31; the lead wire 12 is cylindrical, and the connection between the lead wire 12 and the first welding flat portion 31 can be linear or surface connection. The connecting piece 3 can be a copper, silver-plated or gold-plated metal conductor material, such as a pin needle. It should be noted that when the connecting piece 3 is a pin needle, overflow of the electronic component 2 and the lead wire 12 should be avoided.

[0023] Alternatively, the electronic component 2 can also be directly fixed to the lead wire 12; specifically, the lead wire 12 can be flattened, and the electronic component 2 can be welded on the flattened lead wire 12.

[0024] In order to increase the strength of the inductive assembly, the base 11 is further provided with a second portion 113; the second portion 113 is arranged on the first portion 111, the second portion 113 and the first portion 111 are coaxially arranged, and the second portion 113 and the electronic component 2 are located on the same side of the first portion 111; the lead wire 12 is arranged through the second portion 113 and the first portion 111.

[0025] The application further provides a detector probe, such as Figures 1-3As shown, the detector probe includes a sensing assembly and a shell 4; the shell 4 includes a first bottom surface part 41 and a first sidewall part 42; the sensing assembly includes a lead frame 1 and an electronic element 2; the lead frame 1 includes a base 11 and leads 12; the electronic element 2 is fixedly connected with the leads 12, and the leads 12 are arranged through the base 11; the base 11 includes a first part 111; the first part 111 and / or the first bottom surface part 41 is provided with a third part; at least part of the first part 111 and the electronic element 2 are located in a first containing cavity surrounded by the first sidewall part 42, and the first part 111 is fixedly connected with the first bottom surface part 41 at least through the third part; the third part is made of metal. In the embodiment, the first bottom surface part 41 is connected with the first part 111 at least through the third part, so that the electronic element 2 is encapsulated in the first containing cavity surrounded by the first sidewall part 42, thereby realizing the encapsulation of the electronic element 2. The first bottom surface part 41 can be welded on the first part 111 by resistance welding or energy storage welding, so that the first bottom surface part 41 is connected with the first part 111 through the third part and other fluxes. It should be noted that the third part is a raised part 112 after melting and cooling, which can be arranged on the first part 111 or the first bottom surface part 41. The raised part 112 can be a continuous closed curve shape, and the raised part 112 can include a plurality of discontinuously distributed raised structures. For example, the raised part 112 is a region fitted by point-like intervals; or the raised part 112 can include a first raised structure and a second raised structure, the first raised structure is arranged on the first part 111, and the second raised structure is arranged on the first bottom surface part 41, and the first raised structure and the second raised structure correspond to each other.

[0026] The shell 4 is made of copper, tin powder, gold-plated or silver-plated metal materials. The overall shape of the shell 4 is set as a cylindrical shape, which can reduce the process difficulty and material consumption; and the connection between the first bottom surface part 41 and the first part 111 is a surface connection, which can not only reduce the overall height of the detector probe, but also avoid the collision between the first sensing assembly and the shell 4.

[0027] In one embodiment, the detector probe comprises two sensing components and two housings 4; and a through hole is arranged on the top surface of one of the housings 4; the through hole can connect the outside space with the inside space of the housing. The part of the sensing component and the housing can be defined as a detection gas chamber; and the part of the other sensing component and the housing can be defined as a contrast gas chamber. The detection gas chamber is provided with a through hole, and the outside gas can flow into the detection gas chamber through the through hole, and the electronic element 2 in the detection gas chamber can detect the concentration of the outside gas. The contrast gas chamber is in a sealed state, and a gas not containing the measured gas is injected into the contrast gas chamber, so as to generate a reference signal not containing the measured gas. The outside space can be an indoor space provided with a temperature adjusting system. For example, it can be a room provided with an air conditioning device. The electronic element of the sensing component can be an NTC resistor. When the detector probe works, the NTC resistor of the contrast gas chamber generates a reference electric signal, and the NTC resistor of the detection gas chamber generates a detection electric signal, and by comparing the reference electric signal and the detection electric signal, it can be judged whether the measured gas exists in the outside environment. The measured gas can be refrigerant. In addition, by arranging the contrast gas chamber, the measurement error caused by temperature and humidity can be compensated to a certain extent; and further temperature and humidity compensation can be performed to improve the detection precision. The third part is a solder for packaging the electronic element, and the third part is a metal material, so that after the sensing component is packaged, the possibility of interference of the organic impurities remaining in the accommodation cavity on the detection result is reduced, so as to ensure the accuracy of the reference electric signal generated by the NTC resistor in the contrast gas chamber.

[0028] The application also provides a manufacturing method of a detector probe, which can be used for manufacturing the detector probe in any of the above embodiments, and comprises the following steps:

[0029] The first bottom surface part 41 of the housing 4 is placed on the first part 111 of the base 11 of the lead seat 1 of the sensing component, so that the electronic element 2 of the sensing component is located in the first accommodation cavity surrounded by the first side wall part 42 of the housing 4, and the projection of the electronic element 2 on the first plane is located in the area surrounded by the protruding part 112 of the first bottom surface part 41 or the first part 111; wherein the first plane is the plane where the protruding part 112 is located.

[0030] At least the first bottom surface part 41, the first part 111 and / or the protruding part 112 are heated, so that the first part 111 and the first bottom surface part 41 are fixedly connected. The heating mode can be resistance welding, energy storage welding and the like.

[0031] Further, the detector manufacturing method further comprises the following steps:

[0032] The lead 12 is welded to the first welding plane part 31 of the connecting piece 3;

[0033] The electronic element 2 is welded to the second welding plane part 32 of the connecting piece 3.

[0034] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the specification. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples, without contradiction. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the specification, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0035] The above only describes the preferred embodiments of the specification and does not limit the specification. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the specification shall be included in the protection scope of the specification.

Claims

1. An inductive assembly, characterized by The application relates to a lead seat (1) and an electronic element (2); the lead seat (1) comprises a base (11) and a lead (12); the lead (12) is arranged through the base (11); the base (11) comprises a first part (111) and a protruding part (112); the protruding part (112) is arranged on the first part (111) and protrudes from the first part (111); the electronic element (2) is fixedly connected with the lead (12) and is located on the same side of the first part (111) as the protruding part (112); the projection of the electronic element (2) on a first plane is located in an area surrounded by the protruding part (112); wherein the first plane is a plane where the protruding part (112) is located.

2. The inductive assembly of claim 1, wherein, The material of the protruding part (112) is metal.

3. The inductive assembly of claim 1, wherein, The cross section of the protruding part (112) is a continuous closed curve shape; or the protruding part (112) comprises a plurality of discontinuously distributed protruding structures.

4. The inductive assembly of any of claims 1-3, wherein, The application further relates to a connecting piece (3); the electronic element (2) is fixedly connected with the lead (12) at least through the connecting piece (3); the connecting piece (3) comprises a first welding plane part (31) and a second welding plane part (32); the first welding plane part (31) is fixedly connected with the lead (12) and the second welding plane part (32) is fixedly connected with the electronic element (2).

5. The inductive assembly of claim 4, wherein, The connecting piece (3) is a pin needle; and / or the electronic element (2) is an NTC element.

6. The inductive assembly of claim 4, wherein, The base (11) further comprises a second part (113); the second part (113) is arranged on the first part (111) and is coaxially arranged with the first part (111); the second part (113) is located on the same side of the first part (111) as the electronic element (2); the lead (12) is arranged through the second part (113) and the first part (111).

7. A detector probe, characterized by The application relates to an outer shell (4) and an induction assembly; the outer shell (4) comprises a first bottom part (41) and a first side wall part (42); the induction assembly comprises a lead seat (1) and an electronic element (2); the lead seat (1) comprises a base (11) and a lead (12); the lead (12) is arranged through the base (11); the electronic element (2) is fixedly connected with the lead (12); the base (11) comprises a first part (111); the first part (111) and / or the first bottom part (41) are provided with a third part; the first part (111) and the first bottom part (41) are fixedly connected at least through the third part; at least part of the first part (111) and the electronic element (2) are encapsulated in a first containing cavity surrounded by the first side wall part (42).

8. The probe head of claim 7, wherein, The inductive assembly further comprises a connecting piece (3); the electronic component (2) is fixedly connected with the lead (12) through the connecting piece (3); the connecting piece (3) comprises a first welding flat portion (31) and a second welding flat portion (32); the first welding flat portion (31) is fixedly connected with the lead (12), and the second welding flat portion (32) is fixedly connected with the electronic component (2); The third portion is made of metal.

9. A method of manufacturing a detector probe, characterized by, The manufacturing method of the detector probe comprises the following steps: The first bottom portion (41) of the shell (4) is placed on the first portion (111) of the base (11) of the lead seat (1) of the inductive assembly, so that the electronic component (2) of the inductive assembly is located in the first containing cavity surrounded by the first side wall portion (42) of the shell (4), and the projection of the electronic component (2) on the first plane is located in the area surrounded by the protruding portion (112) of the first bottom portion (41) or the first portion (111); wherein the first plane is the plane where the protruding portion (112) is located; At least the first bottom portion (41), the first portion (111) and / or the protruding portion (112) are heated to fixedly connect the first portion (111) with the first bottom portion (41).

10. The method of manufacturing a probe head of claim 9, wherein, Further comprising the following steps: The lead (12) is welded to the first welding flat portion (31) of the connecting piece (3); The electronic component (2) is welded to the second welding flat portion (32) of the connecting piece (3); The at least heating of the first bottom portion (41), the first portion (111) and / or the protruding portion (112) comprises the following steps: The heating mode is resistance welding or stored-energy welding.

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