A semiconductor silicon wafer planarization device

Abstract

This invention relates to the field of wafer washing equipment technology, specifically a semiconductor silicon wafer washing equipment. It includes a frame, a support plate slidably mounted on the frame, and a vacuum suction cup for adsorbing silicon wafers fixed on the support plate. A horizontal beam is positioned above the vacuum suction cup, and a horizontal longitudinal beam is rotatably mounted on the horizontal beam. Multiple nozzles are fixed to the bottom of the horizontal longitudinal beam. A drive mechanism for driving the support plate to move horizontally is mounted on the frame. The drive mechanism includes a cylinder fixed on the frame, and a piston rod is mounted at the output end of the cylinder. The piston rod is fixed to the support plate, and the cylinder drives the piston rod to extend and retract, thereby driving the support plate to move horizontally reciprocally. The piston rod and the horizontal beam are connected by a first linkage structure. This invention can be used for cleaning wafers of various sizes while ensuring that the central and edge areas of the wafer have the same rinsing force, avoiding the problem of incomplete cleaning due to insufficient rinsing force at the edges.

Description

Technical Field

[0001] This invention relates to the field of wafer washing equipment technology, specifically a semiconductor silicon wafer washing equipment. Background Technology

[0002] As integrated circuit (IC) manufacturing processes continue to evolve towards nanometer-level nodes, the surface cleanliness of silicon wafers has an increasingly significant impact on device performance and yield. Before critical processes such as photolithography, etching, and deposition, the silicon wafer surface must be thoroughly cleaned of impurities such as particulate contaminants, organic residues, metal ions, and oxide layers to avoid failures such as pattern defects, short circuits, or threshold voltage drift. Therefore, wafer cleaning technology has become one of the core aspects of semiconductor manufacturing.

[0003] Currently, the mainstream silicon wafer cleaning processes mainly employ wet cleaning technologies, including rotary spray cleaning, megasonic cleaning, and immersion tank cleaning. Rotary spray cleaning, when used with large-size wafers, can cause cleaning solution to accumulate at the wafer edges, while the central area may not be thoroughly cleaned due to insufficient liquid supply. Megasonic cleaning, with its high-frequency vibration energy, can cause micro-damage or collapse to fragile structures. Immersion tank cleaning consumes a large amount of liquid and carries the risk of cross-contamination. Therefore, existing wafer cleaning methods primarily employ rotary spray cleaning.

[0004] Although existing patents have proposed using multi-nozzle arrays to optimize spray coverage, the increase in nozzles will undoubtedly increase the amount of cleaning water used, resulting in resource waste, and still cannot fundamentally solve the problem of uniform cleaning of large-size wafers. Therefore, we provide a semiconductor silicon wafer flat cleaning device to solve the above-mentioned problems. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor silicon wafer flat washing apparatus to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A semiconductor silicon wafer washing apparatus includes a frame, a support plate slidably mounted on the frame, a vacuum suction cup for adsorbing silicon wafers fixed on the support plate, a horizontal beam above the vacuum suction cup, a horizontal longitudinal beam rotatably mounted on the horizontal beam, a plurality of nozzles fixed at the bottom of the horizontal longitudinal beam, and a drive mechanism for driving the support plate to move horizontally on the frame. The drive mechanism includes a cylinder fixed on the frame, a piston rod at the output end of the cylinder, the piston rod being fixed to the support plate, and the cylinder driving the piston rod to extend and retract to drive the support plate to move horizontally reciprocally.

[0008] The piston rod and the horizontal beam are connected by a first linkage structure. When the piston rod moves forward and backward, it drives the horizontal beam to move horizontally back and forth. The horizontal beam and the horizontal longitudinal beam are connected by a second linkage structure. When the horizontal beam moves horizontally back and forth, it drives the horizontal longitudinal beam to rotate clockwise and counterclockwise.

[0009] A semiconductor silicon wafer flat washing device as described above: a plurality of rotating rollers for supporting a support plate are fixed on the frame, the plurality of rotating rollers are equally spaced on the frame, and the support plate is placed on the rotating rollers and slides on the rotating rollers.

[0010] A semiconductor silicon wafer washing device as described above: a plurality of nozzles are equally spaced at the bottom of a horizontal longitudinal beam, and a water inlet pipe connected to an external water source is fixed on the horizontal longitudinal beam, the water inlet pipe being connected to the plurality of nozzles.

[0011] A semiconductor silicon wafer flat washing device as described above: The first linkage structure includes a rotating shaft rotatably mounted on a frame and a sleeve movably sleeved on a piston rod. The sleeve is rotatably mounted on the frame. The sleeve and the piston rod are connected by a first transmission mechanism. When the piston rod extends and retracts, it drives the sleeve to rotate clockwise and counterclockwise. The sleeve and the rotating shaft are connected by a second transmission mechanism. When the sleeve rotates, it drives the rotating shaft to rotate synchronously. The rotating shaft and a horizontal beam are connected by a third transmission mechanism. When the rotating shaft rotates, it drives the horizontal beam to move horizontally back and forth. A limit ring is fixed on the frame, and limit rods that are movably engaged inside the limit ring are fixed at both ends of the horizontal beam.

[0012] A semiconductor silicon wafer flat washing device as described above: the first transmission mechanism includes a track groove formed on the piston rod and a ball that is movably embedded and engaged in the inner wall of the sleeve. The ball is movably engaged in the track groove and can roll along the track where the track groove is located.

[0013] As described above, a semiconductor silicon wafer flat washing device includes a second transmission mechanism comprising a first sprocket fixed on a sleeve and a second sprocket fixed on a rotating shaft, wherein the first sprocket and the second sprocket are driven by a chain.

[0014] A semiconductor silicon wafer flat washing device as described above: the third transmission mechanism includes a turntable fixed on a rotating shaft, a swing arm hinged to the frame, a protruding rod fixed on the turntable, a through groove opened on the swing arm, the protruding rod being movably engaged inside the through groove, an incomplete gear fixed at one end of the swing arm, a toothed plate fixed on the limiting rod, and the incomplete gear meshing with the toothed plate.

[0015] A semiconductor silicon wafer washing device as described above: the second linkage structure includes a rotating rod rotatably mounted at the bottom of a horizontal beam, the rotating rod being fixed to a horizontal longitudinal beam, a rack being fixed on the frame, and a gear being fixed at the end of the rotating rod, the gear meshing with the rack.

[0016] A semiconductor silicon wafer washing apparatus as described above: a water tank fixed to the frame is provided on the frame and directly below the support plate.

[0017] Compared with the prior art, the beneficial effects of the present invention are: when in use, a support plate is slidably arranged on the frame, and a vacuum chuck is fixed on the support plate. The silicon wafer is placed on the vacuum chuck and the silicon wafer is vacuum adsorbed by the vacuum chuck. Vacuum adsorption can reduce the damage caused by mechanical clamping, especially for fixing thin and fragile silicon wafers. At the same time, it can be adapted to fixing wafers of more sizes.

[0018] A horizontal beam is provided above the vacuum suction cup, and a horizontal longitudinal beam is rotatably provided on the horizontal beam. Multiple nozzles are fixed at the bottom of the horizontal longitudinal beam. The driving mechanism includes a cylinder. The cylinder drives the piston rod to extend and retract to drive the support plate to move horizontally back and forth, thereby driving the silicon wafer fixed on the vacuum suction cup to move horizontally back and forth. At the same time, when the piston rod extends and retracts, it drives the horizontal beam to move horizontally back and forth. When the horizontal beam moves horizontally back and forth, it drives the horizontal longitudinal beam to rotate clockwise and counterclockwise. A nozzle for spraying water to clean the silicon wafer is provided at the bottom of the horizontal longitudinal beam. That is, the nozzle can move horizontally back and forth above the silicon wafer perpendicular to the direction of movement of the silicon wafer, and can also swing clockwise and counterclockwise.

[0019] Therefore, when cleaning silicon wafers using the nozzles of this invention, the nozzles can move horizontally back and forth and deflect back and forth, which, in conjunction with the horizontal back and forth movement of the silicon wafers, enables full-area cleaning of the silicon wafer surface, solving the cleaning pain point of large-size wafers. In addition, by setting a single row of nozzles to reciprocate and deflect, the dirt on the surface of the silicon wafer can be flushed to both sides. At the same time, since the nozzles can also move horizontally, they can move to the edges of both sides of the wafer, so that the nozzles can maintain the same flushing force when flushing the edges of the wafer. This ensures that the central area and the edge area have the same flushing force when cleaning the wafer, avoiding the problem of incomplete cleaning due to insufficient flushing force at the edges. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of a semiconductor silicon wafer flat washing device from a first-view perspective.

[0021] Figure 2 This is a schematic diagram of the overall structure of a semiconductor silicon wafer flat washing device from a second perspective.

[0022] Figure 3A semiconductor silicon wafer flat washing device Figure 1 A schematic diagram of a local structure.

[0023] Figure 4 A semiconductor silicon wafer flat washing device Figure 3 A schematic diagram of the decomposed part of the structure.

[0024] Figure 5 A semiconductor silicon wafer flat washing device Figure 3 A schematic diagram of the decomposed part of the structure.

[0025] Figure 6 A semiconductor silicon wafer flat washing device Figure 5 A schematic diagram of the decomposed part of the structure.

[0026] Figure 7 A semiconductor silicon wafer flat washing device Figure 6 A structural diagram from another perspective.

[0027] Figure 8 A semiconductor silicon wafer flat washing device Figure 7 A schematic diagram of the decomposed part of the structure.

[0028] Figure 9 A semiconductor silicon wafer flat washing device Figure 7 A schematic diagram of the decomposed part of the structure.

[0029] Figure 10 A semiconductor silicon wafer flat washing device Figure 9 A schematic diagram of the explosion structure.

[0030] In the diagram: 1. Frame; 2. Rotary roller; 3. Support plate; 4. Vacuum suction cup; 5. Horizontal crossbeam; 6. Horizontal longitudinal beam; 7. Nozzle; 8. Water inlet pipe; 9. Cylinder; 10. Piston rod; 11. Limiting ring; 12. Limiting rod; 13. Sleeve; 14. Rotating shaft; 15. First sprocket; 16. Second sprocket; 17. Chain; 18. Turntable; 19. Swing arm; 20. Protruding rod; 21. Through groove; 22. Incomplete gear; 23. Tooth plate; 24. Rack; 25. Rotating rod; 26. Gear; 27. Track groove; 28. Ball bearing; 29. ​​Water tank. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0032] Please see Figures 1-10As an embodiment of the present invention, a semiconductor silicon wafer flat washing device includes a frame 1, a support plate 3 slidably disposed on the frame 1, a vacuum suction cup 4 for adsorbing silicon wafers fixed on the support plate 3, a horizontal beam 5 disposed above the vacuum suction cup 4, a horizontal longitudinal beam 6 rotatably disposed on the horizontal beam 5, a plurality of nozzles 7 fixed at the bottom of the horizontal longitudinal beam 6, and a drive mechanism for driving the support plate 3 to move horizontally disposed on the frame 1. The drive mechanism includes a cylinder 9 fixed on the frame 1, a piston rod 10 disposed at the output end of the cylinder 9, the piston rod 10 being fixed to the support plate 3, and the cylinder 9 being used to drive the piston rod 10 to extend and retract to drive the support plate 3 to move horizontally reciprocally.

[0033] The piston rod 10 is connected to the horizontal beam 5 through a first linkage structure. When the piston rod 10 moves forward and backward, it drives the horizontal beam 5 to move horizontally back and forth. The horizontal beam 5 is connected to the horizontal longitudinal beam 6 through a second linkage structure. When the horizontal beam 5 moves horizontally back and forth, it drives the horizontal longitudinal beam 6 to rotate clockwise and counterclockwise.

[0034] In this embodiment, during use, the silicon wafer is placed on the vacuum suction cup 4 and fixed by vacuum adsorption using the vacuum suction cup 4. A horizontal beam 5 is provided above the vacuum suction cup 4, and a horizontal longitudinal beam 6 is rotatably provided on the horizontal beam 5. Multiple nozzles 7 are fixed at the bottom of the horizontal longitudinal beam 6. The driving mechanism includes a cylinder 9, which is electrically connected to an external power source through a wire. When the cylinder 9 is activated, it drives the piston rod 10 to extend and retract, thereby driving the support plate 3 to move horizontally back and forth, which in turn drives the silicon wafer fixed on the vacuum suction cup 4 to move horizontally back and forth. At the same time, when the piston rod 10 extends and retracts, it drives the horizontal beam 5 to move horizontally back and forth. When the horizontal beam 5 moves horizontally back and forth, it drives the horizontal longitudinal beam 6 to rotate clockwise and counterclockwise. The nozzles 7 at the bottom of the horizontal longitudinal beam 6 are used to spray water on the silicon wafer for cleaning. That is, the nozzles 7 can move horizontally back and forth above the silicon wafer in a direction perpendicular to the direction of movement of the silicon wafer, and can also swing clockwise and counterclockwise.

[0035] As a further embodiment of the present invention, a plurality of rotating rollers 2 for supporting the support plate 3 are fixed on the frame 1. The plurality of rotating rollers 2 are distributed at equal intervals on the frame 1, and the support plate 3 is placed on the rotating rollers 2 and slides on the rotating rollers 2.

[0036] In this embodiment, a plurality of rotating rollers 2 are fixed on the frame 1 to support the support plate 3. The rotating rollers 2 can be used to support the support plate 3, and the support plate 3 can slide on the rotating rollers 2.

[0037] As a further embodiment of the present invention, multiple nozzles 7 are evenly distributed at the bottom of a horizontal longitudinal beam 6, and a water inlet pipe 8 connected to an external water source is fixed on the horizontal longitudinal beam 6, with the water inlet pipe 8 communicating with the multiple nozzles 7.

[0038] In this embodiment, the water inlet pipe 8 is connected to an external water source, which can supply water to the nozzle 7 through the water inlet pipe 8 and spray it onto the silicon wafer through the nozzle 7 to clean the silicon wafer.

[0039] As a further embodiment of the present invention, the first linkage structure includes a rotating shaft 14 rotatably mounted on the frame 1 and a sleeve 13 movably sleeved on the piston rod 10. The sleeve 13 is rotatably mounted on the frame 1. The sleeve 13 and the piston rod 10 are connected by a first transmission mechanism. When the piston rod 10 moves in extension and retraction, it will drive the sleeve 13 to rotate clockwise and counterclockwise. The sleeve 13 and the rotating shaft 14 are connected by a second transmission mechanism. When the sleeve 13 rotates, it will drive the rotating shaft 14 to rotate synchronously. The rotating shaft 14 and the horizontal beam 5 are connected by a third transmission mechanism. When the rotating shaft 14 rotates, it will drive the horizontal beam 5 to move horizontally back and forth. A limit ring 11 is fixed on the frame 1. Limiting rods 12 that are movably engaged inside the limit ring 11 are fixed at both ends of the horizontal beam 5.

[0040] In this embodiment, cylinder 9 drives piston rod 10 to extend and retract. The piston rod 10 is connected to sleeve 13 via a first transmission mechanism. When piston rod 10 extends and retracts, it drives sleeve 13 to rotate clockwise and counterclockwise. The rotating shaft 14 is connected to sleeve 13 via a second transmission mechanism. When sleeve 13 rotates, it drives rotating shaft 14 to rotate synchronously. The horizontal beam 5 is connected to rotating shaft 14 via a third transmission mechanism. When rotating shaft 14 rotates, it drives horizontal beam 5 to move horizontally back and forth. Limiting rods 12 are fixed at both ends of horizontal beam 5 and are movably engaged inside limiting ring 11. The limiting rods 12 are engaged inside limiting ring 11 to limit the movement of horizontal beam 5.

[0041] As a further embodiment of the present invention, the first transmission mechanism includes a track groove 27 formed on the piston rod 10 and a ball bearing 28 movably embedded and engaged in the inner wall of the sleeve 13. The ball bearing 28 is movably engaged in the track groove 27 and can roll along the track where the track groove 27 is located.

[0042] In this embodiment, when the piston rod 10 moves telescopically, it is engaged with the track groove 27 by the ball bearing 28 and can roll along the track where the track groove 27 is located, which can drive the sleeve 13 to rotate.

[0043] As a further embodiment of the present invention, the second transmission mechanism includes a first sprocket 15 fixed on the sleeve 13 and a second sprocket 16 fixed on the rotating shaft 14, and the first sprocket 15 and the second sprocket 16 are driven by a chain 17.

[0044] In this embodiment, when the sleeve 13 rotates, it will drive the first sprocket 15 to rotate. The first sprocket 15 and the second sprocket 16 are driven by the chain 17. When the first sprocket 15 rotates, it drives the second sprocket 16 to rotate, thereby driving the rotating shaft 14 to rotate.

[0045] As a further embodiment of the present invention, the third transmission mechanism includes a turntable 18 fixed on a rotating shaft 14, a swing arm 19 hinged on a frame 1, a protruding rod 20 fixed on the turntable 18, a through groove 21 opened on the swing arm 19, the protruding rod 20 being movably engaged inside the through groove 21, an incomplete gear 22 fixed at one end of the swing arm 19, a toothed plate 23 fixed on the limiting rod 12, and the incomplete gear 22 meshing with the toothed plate 23.

[0046] In this embodiment, when the rotating shaft 14 rotates, it will drive the turntable 18 to rotate. When the turntable 18 rotates, it will drive the protruding rod 20 to slide in the through groove 21, thereby driving the swing arm 19 to swing back and forth, thereby driving the incomplete gear 22 to swing back and forth. Since the incomplete gear 22 meshes with the toothed plate 23, it drives the toothed plate 23 to move horizontally back and forth, thereby driving the horizontal beam 5 to move horizontally back and forth.

[0047] As a further embodiment of the present invention, the second linkage structure includes a rotating rod 25 rotatably mounted at the bottom of the horizontal beam 5, the rotating rod 25 being fixed to the horizontal longitudinal beam 6, a rack 24 being fixed on the frame 1, and a gear 26 being fixed at the end of the rotating rod 25, the gear 26 meshing with the rack 24.

[0048] In this embodiment, when the horizontal beam 5 moves horizontally back and forth, it will drive the rotating rod 25 to move horizontally back and forth, and at the same time drive the gear 26 to move horizontally back and forth. Since the gear 26 meshes with the rack 24, it will drive the gear 26 to rotate. When the gear 26 rotates, it will drive the rotating rod 25 to rotate, thereby driving the horizontal longitudinal beam 6 to rotate clockwise or counterclockwise back and forth.

[0049] As a further embodiment of the present invention, a water storage tank 29 fixed on the frame 1 is provided on the frame 1 and located directly below the support plate 3.

[0050] In this embodiment, a water storage tank 29 is provided to collect cleaning waste liquid when the nozzle 7 rinses the silicon wafer.

[0051] The working principle of this invention is as follows: In use, a silicon wafer is first placed on a vacuum chuck 4, which uses vacuum suction to fix the wafer. Vacuum suction reduces damage caused by mechanical clamping. A horizontal beam 5 is positioned above the vacuum chuck 4, and a horizontal longitudinal beam 6 is rotatably mounted on the horizontal beam 5. Multiple nozzles 7 are fixed to the bottom of the horizontal longitudinal beam 6. The driving mechanism includes a cylinder 9, which drives a piston rod 10 to extend and retract, thereby driving the support plate 3 to move horizontally back and forth, causing the silicon wafer fixed on the vacuum chuck 4 to move horizontally back and forth. Simultaneously, the extension and retraction of the piston rod 10 drives the horizontal beam 5 to move horizontally back and forth, which in turn drives the horizontal longitudinal beam 6 to rotate clockwise and counterclockwise. The bottom of the horizontal longitudinal beam 6 is equipped with a nozzle for spraying water onto the silicon wafer for cleaning. The nozzle 7 can move horizontally and reciprocally above the silicon wafer in a direction perpendicular to the wafer's movement, while also rotating clockwise and counterclockwise. Combined with the horizontal reciprocating movement of the silicon wafer, it enables full-area cleaning of the wafer surface. Because the silicon wafer can move during cleaning, it addresses the cleaning challenges of large wafers. Furthermore, by setting up a single row of nozzles 7 to reciprocate and oscillate, it can flush away dirt from the wafer surface to both sides. Simultaneously, because the nozzle 7 can move horizontally during reciprocating and oscillating, it can reach the edges of the wafer, maintaining the same flushing force even with a shorter distance. This ensures that the central and edge areas receive the same flushing force during wafer cleaning, preventing incomplete cleaning due to insufficient edge flushing.

[0052] The above embodiments are exemplary and not restrictive. Therefore, any technical solutions that can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention are included within the scope of the present invention.

Claims

1. A semiconductor silicon wafer planarization apparatus comprising a frame (1), characterized in that, The rack (1) is slidably provided with a supporting plate (3), the supporting plate (3) is fixed with a vacuum chuck (4) for adsorbing silicon wafers, the upper side of the vacuum chuck (4) is provided with a horizontal cross beam (5), the horizontal cross beam (5) is rotatably provided with a horizontal longitudinal beam (6), the bottom of the horizontal longitudinal beam (6) is fixed with a plurality of spray heads (7), the rack (1) is provided with a driving mechanism for driving the horizontal movement of the supporting plate (3), the driving mechanism comprises a gas cylinder (9) fixed on the rack (1), the output end of the gas cylinder (9) is provided with a piston rod (10), the piston rod (10) is fixed with the supporting plate (3), and the gas cylinder (9) is used for driving the piston rod (10) to stretch and retract so as to drive the horizontal reciprocating movement of the supporting plate (3). The piston rod (10) and the horizontal cross beam (5) are matched through a first linkage structure, the piston rod (10) is driven to move horizontally and reciprocally when the piston rod (10) stretches and retracts, the horizontal cross beam (5) and the horizontal longitudinal beam (6) are matched through a second linkage structure, and the horizontal longitudinal beam (6) is driven to rotate reciprocally when the horizontal cross beam (5) moves horizontally and reciprocally, the first linkage structure comprises a rotating shaft (14) rotatably arranged on the rack (1) and a sleeve (13) movably sleeved on the piston rod (10), the sleeve (13) is rotatably arranged on the rack (1), the sleeve (13) and the piston rod (10) are matched through a first transmission mechanism, the sleeve (13) is driven to rotate reciprocally when the piston rod (10) stretches and retracts, the sleeve (13) and the rotating shaft (14) are matched through a second transmission mechanism, the rotating shaft (14) is driven to rotate synchronously when the sleeve (13) rotates, the rotating shaft (14) and the horizontal cross beam (5) are matched through a third transmission mechanism, and the horizontal cross beam (5) is driven to move horizontally and reciprocally when the rotating shaft (14) rotates, the rack (1) is fixed with a limiting ring (11), and the two ends of the horizontal cross beam (5) are respectively fixed with limiting rods (12) movably clamped in the limiting ring (11).

2. A semiconductor silicon wafer planarization apparatus according to claim 1, wherein A plurality of rotating rollers (2) for supporting the supporting plate (3) are fixed on the rack (1), and the plurality of rotating rollers (2) are equidistantly distributed on the rack (1), the supporting plate (3) is placed on the rotating rollers (2) and slides on the rotating rollers (2).

3. A semiconductor silicon wafer planarization apparatus according to claim 1, wherein A plurality of the spray heads (7) are equidistantly distributed on the bottom of the horizontal longitudinal beam (6), the horizontal longitudinal beam (6) is fixed with a water inlet pipe (8) connected with an external water source, and the water inlet pipe (8) is communicated with the plurality of spray heads (7).

4. The apparatus according to claim 1, wherein The first transmission mechanism comprises a track groove (27) formed in the piston rod (10) and a plurality of rolling balls (28) movably embedded and clamped in the inner wall of the sleeve (13), the rolling balls (28) are movably clamped in the track groove (27) and can roll along the track of the track groove (27).

5. A semiconductor silicon wafer planarization apparatus according to claim 1, wherein The second transmission mechanism comprises a first chain wheel (15) fixed on the sleeve (13) and a second chain wheel (16) fixed on the rotating shaft (14), and the first chain wheel (15) and the second chain wheel (16) are in transmission cooperation through a chain (17).

6. A semiconductor silicon wafer planarization apparatus according to claim 1, wherein The third transmission mechanism comprises a rotating disc (18) fixed on the rotating shaft (14), the rack (1) is hingedly provided with a swing arm (19), the rotating disc (18) is fixed with a convex rod (20), the swing arm (19) is provided with a through slot (21), the convex rod (20) is movably clamped in the through slot (21), one end of the swing arm (19) is fixed with an incomplete gear (22), the limiting rod (12) is fixed with a toothed plate (23), and the incomplete gear (22) is in mesh with the toothed plate (23).

7. A semiconductor silicon wafer planarization apparatus as claimed in claim 1, wherein The second linkage structure comprises a rotating rod (25) rotatably installed at the bottom of the horizontal cross beam (5), the rotating rod (25) is fixed with the horizontal longitudinal beam (6), the rack (1) is fixed with a rack (24), the end of the rotating rod (25) is fixed with a gear (26), and the gear (26) is in mesh with the rack (24).

8. A semiconductor silicon wafer planarization apparatus according to claim 1, wherein The rack (1) is provided with a water storage tank (29) fixed on the rack (1) and located directly below the supporting plate (3).

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