High-thermal-conductivity dual liquid cooling radiator
By constructing a dual heat dissipation path in the liquid cooler and enhancing the welding between the fins and the outer shell, the problems of insufficient heat dissipation efficiency and insufficient fin strength of liquid coolers in medium and high power density scenarios are solved, achieving efficient heat dissipation and improved strength.
Patent Information
- Application Number
- CN202511359255.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-23
- Publication Date
- 2025-11-18
AI Technical Summary
Existing liquid cooling radiators are inefficient in heat dissipation under medium to high power density scenarios, making it difficult to meet the high heat demand of equipment, and they also have insufficient fin strength.
By using adjacent fins spaced apart and bending edges overlapping or fitting to cover the openings, a dual heat dissipation path for liquid cooling and heating is constructed. The fins are directly welded to the metal shell of the liquid cooling system to form a dual heat dissipation path, thereby enhancing heat conduction efficiency and fin strength.
It significantly improves heat dissipation efficiency, reduces the heat load of a single liquid cooling path, meets the heat dissipation requirements of medium-to-high power density equipment, and improves the strength of the fins.
Smart Images
Figure CN120980862A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of heat sinks, in particular to a high-thermal-conductivity double-liquid-cooling heat sink. BACKGROUND
[0002] The heat sink is a core heat dissipation component in a liquid cooling system. The structure design of the heat sink is based on a high-thermal-conductivity metal substrate, usually copper or aluminum alloy, which needs to be directly attached to a heat-generating element such as a CPU or GPU. A large number of dense metal heat dissipation fins are processed on the surface of the substrate through welding, one-piece extrusion molding, or micro-channel etching process. Regular cooling liquid flow channels are formed between adjacent fins, and the core heat exchange unit of the substrate-fins-flow channel is formed.
[0003] In the heat dissipation process, heat transfer follows a fixed path: first, the heat is transferred from the heat-generating element to the metal substrate through heat conduction, and then the heat is uniformly conducted from the substrate to the dense heat dissipation fins. At this time, the circulating pump drives the cooling liquid to flow through the flow channels between the fins, and the heat is transferred from the fins to the cooling liquid through convective heat exchange. Finally, the heat is discharged outside the device by the cooling liquid circulation system. The heat export mainly depends on the convective circulation of the cooling liquid, and the fins only act as an intermediate medium for heat conduction. There is no effective thermal connection between the fins and the metal shell of the device. This single dependence on the cooling liquid circulation for heat dissipation path can meet the heat dissipation demand in low-power devices. However, in medium and high-power density scenarios, it is difficult to match the high heat demand of the device due to the high thermal load and insufficient heat dissipation efficiency. SUMMARY
[0004] In view of the defects of the prior art, the present application provides a high-thermal-conductivity double-liquid-cooling heat sink. Through the cooperation of the double paths, the thermal load of the single liquid cooling path can be greatly reduced, and the overall heat dissipation efficiency can be significantly improved to meet the heat dissipation demand of medium and high-power density devices.
[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present application is as follows:
[0006] A high-thermal-conductivity double-liquid-cooling heat sink includes a heat dissipation substrate and a plurality of fins arranged on the heat dissipation substrate. Adjacent fins are arranged with a spacing, one or more fins are bent towards the spacing side, and the bent edge overlaps or covers the top opening of the spacing.
[0007] Preferably, the top of each fin is bent towards the spacing opening of the adjacent fin, and the bent edge directly overlaps the opening position of the corresponding spacing.
[0008] Preferably, the bent edge is bent in the same direction.
[0009] Preferably, the top of part of the fins is higher than the top of the other fins, and the bent edge is arranged on the fin with the higher top.
[0010] The beneficial effects of this invention are as follows: adjacent fins are spaced apart to form liquid cooling channels, one or more fins are bent toward the spacer side, and the top opening of the spacer is covered by the bent edge overlapping or fitting. When used with a liquid cooling system, by thermally welding the bent edge of the radiator fins to the metal shell in the liquid cooling system, a dual heat dissipation path for liquid cooling heating conduction can be constructed. Through the synergy of the dual paths, the heat load of a single liquid cooling path can be greatly reduced, the overall heat dissipation efficiency can be significantly improved, and the heat dissipation requirements of medium and high power density equipment can be met. Attached Figure Description
[0011] Figure 1 : This is a schematic diagram of the structure of Embodiment 1 of the present invention;
[0012] Figure 2 : This is a schematic diagram of the structure of Embodiment 2 of the present invention;
[0013] Figure 3 This is a second embodiment of the present invention. Figure 2 Enlarged structural diagram of section A;
[0014] Explanation of the symbols in the attached diagram: 10-heat dissipation substrate, 11-fins, 12-liquid cooling channel, 13-bent edge. Detailed Implementation
[0015] To more clearly illustrate the structural features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:
[0016] Example 1: As Figure 1 As shown, a high thermal conductivity dual liquid-cooled radiator includes a heat dissipation base plate 10 and a plurality of fins 11 disposed on the heat dissipation base plate 10. Adjacent fins 11 are spaced apart to form liquid cooling channels 12. The top of each fin 11 is bent toward the gap opening of the adjacent fin 11, and its bent edge 13 is bent in the same direction, directly overlapping and covering the top opening of the gap to form a top seal. In use, it is used with a liquid cooling system. By directly heat-conductingly welding the bent edge 13 of the radiator's fins 11 to the metal shell of the liquid cooling system, compared to... Bolted connections, snap-fit connections, and other methods result in a larger contact area, no assembly gaps, and lower contact thermal resistance, effectively enhancing heat conduction efficiency. The sealing structure of the overlapping bent edge 13 can effectively prevent solder from flowing into the gaps of the fins 11 during welding and blocking the liquid cooling channel 12, thus creating a dual heat dissipation path for liquid cooling and heating conduction. Liquid cooling quickly removes concentrated heat, while heat conduction assists in the diffusion of heat to the outer shell. Through the synergy of the dual paths, the heat load of a single liquid cooling path can be significantly reduced, and the overall heat dissipation efficiency can be significantly improved to meet the heat dissipation requirements of medium and high power density equipment.
[0017] At the same time, after the fins 11 are welded to the metal shell, the heat sink takes on an I-shape, which effectively strengthens the fins 11 and solves the problem that the fins 11 are becoming thinner and thinner as heat sink products become more refined, resulting in weaker and weaker fins 11.
[0018] Example 2: Figures 2-3 The diagram illustrates a high thermal conductivity dual liquid-cooled heat sink, comprising a heat sink base plate 10 and a plurality of fins 11 disposed on the heat sink base plate 10. Adjacent fins 11 are spaced apart to form liquid cooling channels 12. The tops of some of the fins 11 extend beyond the tops of other fins 11. The tops of these extended fins 11 are bent towards the openings between adjacent fins 11, with their bent edges 13 bent in the same direction, directly overlapping and covering the top openings of the gaps to form a top seal. In use, it is integrated with a liquid cooling system. The bent edges 13 of the heat sink fins 11 are aligned with the liquid cooling system's liquid cooling channels. The outer shell is directly welded for heat conduction. Compared with bolted or snap-fit connections, this method has a larger contact area, no assembly gaps, and lower contact thermal resistance, effectively enhancing heat conduction efficiency. The sealing structure of the overlapping bent edge 13 can effectively prevent solder from flowing into the gaps of the fins 11 during welding and blocking the liquid cooling channel 12. This creates a dual heat dissipation path for liquid cooling and heating conduction. The liquid cooling quickly removes concentrated heat, while the heat conduction assists in the diffusion of heat to the outer shell. Through the synergy of the dual paths, the heat load of a single liquid cooling path can be significantly reduced, and the overall heat dissipation efficiency can be significantly improved to meet the heat dissipation requirements of medium and high power density equipment.
[0019] At the same time, after the fins 11 are welded to the metal shell, the heat sink takes on an I-shape, which effectively strengthens the fins 11 and solves the problem that the fins 11 are becoming thinner and thinner as heat sink products become more refined, resulting in weaker and weaker fins 11.
[0020] It should be noted that in the above embodiments one and two, the bent edge 13 can also be formed by bending a single fin 11 on the edge of the heat dissipation substrate 10, and the bent edge 13 overlaps or fits to cover all the top openings of the intervals.
[0021] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc., made to the above embodiments based on the technical solutions of the present invention shall still fall within the scope of the technical solutions of the present invention.
Claims
1. A high thermal conductivity dual liquid-cooled heat sink, comprising a heat sink substrate and a plurality of fins disposed on the heat sink substrate, with adjacent fins spaced apart, characterized in that: One or more fins bend toward the spacer side and overlap or fit over the top opening of the spacer by bending the edges.
2. The high thermal conductivity dual liquid-cooled heat sink according to claim 1, characterized in that: The top of each fin is bent toward the opening between adjacent fins, with the bent edge directly overlapping the opening of the corresponding interval.
3. The high thermal conductivity dual liquid-cooled heat sink according to claim 2, characterized in that: The bent edges are bent in the same direction.
4. The high thermal conductivity dual liquid-cooled heat sink according to claim 1, characterized in that: Among a number of fins, the top of some fins is higher than the top of other fins, and a bent edge is set on the fin with the higher top.