A method for manufacturing a circuit board of a three-dimensional circuit for a single-axis joint module of a machine

Abstract

A kind of circuit board manufacturing method of machine single-axis joint module with three-dimensional circuit, manufacture the first core plate with resin plug through hole and circuit pattern in uncovering area, and second core plate, stack and press to form press plate;Second through hole is drilled to the non-uncovering area of press plate and is electroplated, forms second through hole, surface circuit pattern is made, forms pattern plate;Second solder resist pattern is made, uncovering processing is carried out, the resin of resin plug through hole is drilled, forms first molding through hole, surface treatment is formed, second pattern plate;Rigid-flexible combination layer is made and is welded with second pattern plate, forms circuit board;Through uncovering processing, the three-dimensional circuit of rigid plate is formed, the solid hole of three-dimensional circuit is formed, the three-dimensional circuit structure of high reliability, high strength, high hardness;And rigid-flexible combination layer one end and second pattern plate are mutually welded, the other end is contacted in mode, realize effective straight state electric connection, bending state is separated from the dynamic deformation of state.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing, and in particular to a method for manufacturing a circuit board with three-dimensional circuitry for a single-axis joint module of a machine. Background Technology

[0002] In fields such as industrial robotic arms, industrial robots, or consumer electronics, single-axis articulated mechanical structures are used. These structures are designed with a single-axis rotation to meet the basic motion and operational needs of the equipment.

[0003] When a single-axis joint needs to achieve differentiated functions in the extended and bent states, such as achieving a dynamic switching effect of interconnected circuits when extended and separated circuits when bent, a corresponding circuit connection and control scheme is required. A common approach is to use a fully rigid-flexible joint plate and a dedicated control module to achieve the above-mentioned state switching function.

[0004] However, this solution requires high precision in the machining matching of the rigid-flexible plate and the control module. Furthermore, the rigid-flexible plate maintains a single connection form throughout the bending process, and its function switching depends on the coordinated operation of the control module. This not only increases the complexity of the machining process but also significantly increases the design and manufacturing cost of the overall control unit.

[0005] Furthermore, a multi-plate combination contact connection solution has gradually emerged in the industry: by using two independent flexible circuit boards in combination, the structural characteristics of the boards are utilized to achieve contact conduction in the straight state and separation disconnection in the bent state.

[0006] However, this approach relies solely on direct contact between the pads on the surface of the flexible circuit board to achieve electrical connection. Due to the deformation of the flexible board itself, fluctuations in contact pressure, and environmental factors, the stability of the electrical connection is extremely poor. It is difficult to maintain high reliability during repeated interconnection and separation processes, and it cannot meet the stringent requirements of high-precision equipment for circuit connections.

[0007] Based on the above background and problems, there is a need to provide a novel method for fabricating a circuit board with a three-dimensional circuit for a single-axis joint module of a machine. Summary of the Invention

[0008] This invention aims to solve the comprehensive problems of poor processing accuracy of circuit boards for three-dimensional circuits in machine single-axis joint modules in the prior art, and provides a method for manufacturing a circuit board for a three-dimensional circuit in a machine single-axis joint module. The circuit board is processed according to design data, which includes a covered area and a non-covered area. The manufacturing method includes the following steps:

[0009] S10: A first core board including a first through hole and a circuit pattern is fabricated according to the design data. The first through hole is located in the uncovering area. The first through hole is filled with resin to form a resin-filled through hole. A second core board is fabricated, stacked with the first core board, and pressed together to form a pressed plate. A release film is attached to the side of the second core board facing the first core board corresponding to the uncovering area. A first solder resist pattern is fabricated on the side of the first core board facing the second core board corresponding to the uncovering area, and the first solder resist pattern does not cover the resin-filled through hole.

[0010] S20: Drill a second through hole in the non-covered area of ​​the press plate, then electroplate the whole plate, the second through hole forms a second through hole, then make the surface circuit pattern, and the whole plate forms a patterned plate.

[0011] S30: A second solder mask pattern is made on the surface of the second core board of the graphic board, then the cover area is removed and processed, then the resin plug through hole is drilled and processed to remove the resin and form a first molded through hole, then the whole board is surface treated and the first molded through hole is formed into an electroplating hole. After molding, the whole board is formed into a second graphic board.

[0012] S40: Fabricate a rigid-flexible bonding layer according to the design data. The rigid-flexible bonding layer includes a rigid region and a flexible region. The surface of the flexible region is formed with an electroplated pattern, and the rigid region is formed with a third via. Solder the third via to the electroplated via, and the electroplated pattern contacts the second via, thereby forming the circuit board.

[0013] Furthermore, the diameter of the first through hole is smaller on one side than the diameter of the first formed through hole.

[0014] Furthermore, the second core board is a single-sided board or a multi-layer board, or the first core board is a single-sided board or a multi-layer board.

[0015] Furthermore, the circuit pattern extends through the uncovered area and the non-covered area, and the first solder mask pattern covers the circuit pattern in the uncovered area.

[0016] Furthermore, the circuit pattern is formed on the surface of the first core board corresponding to the second through hole position, thus forming an auxiliary circuit pattern.

[0017] Furthermore, the size of the auxiliary circuit pattern is smaller on one side than the uncovered area.

[0018] Furthermore, the second through hole is either an electroplated solid hole or a resin-plugged solid hole; the electroplated solid hole is processed simultaneously during the electroplating of the entire board; the resin-plugged solid hole is processed by resin plugging after the electroplating of the entire board.

[0019] Furthermore, the surface treatment is electroplating with gold.

[0020] Furthermore, the peeling process involves removing the first core board from the peeling area.

[0021] Furthermore, the rigid-flexible bonding layer is parallel to the second patterned plate, and the electroplated pattern in the flexible region contacts the surface of the second through hole to achieve electrical connection; or, the flexible region is bent, the rigid-flexible bonding layer forms an angle with the second patterned plate, and the electroplated pattern separates from the surface of the second through hole to disconnect the electrical connection.

[0022] The main beneficial effects of this technical solution include the following:

[0023] (1) By adopting the cover-up processing method of rigid-flex plate, a three-dimensional circuit of rigid plate is made and a solid hole of three-dimensional circuit is formed, which effectively forms a three-dimensional circuit structure with high reliability, high strength and high hardness; and the rigid-flex plate is welded to the three-dimensional circuit board at one end and the other end is in contact, which realizes effective electrical connection in the straight state and separation in the bending state. Compared with the existing technology, it has good structural characteristics, does not require additional connection modules, and achieves conduction or disconnection switching only through mechanical deformation, avoiding the problems of traditional connection methods that require complex structures.

[0024] (2) Flexible application scenarios and strong integration compatibility. This implementation method can flexibly form a single plate structure with one end fixed and the other end dynamically separated. It can adapt to the basic dynamic connection requirements of single-axis joints without complex auxiliary components. At the same time, it has good module compatibility and can be deeply matched with the drive module, sensing module, buffer component, etc. of single-axis joints to form an integrated solution. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0026] Figure 1 This is a process flow diagram of an embodiment of the present invention;

[0027] Figure 2 This is a cross-sectional schematic diagram of the first stacked structure according to an embodiment of the present invention;

[0028] Figure 3 This is a cross-sectional schematic diagram of the second stacked structure according to an embodiment of the present invention;

[0029] Figure 4 This is a cross-sectional schematic diagram of the third stacked structure according to an embodiment of the present invention;

[0030] Figure 5 This is a cross-sectional schematic diagram of the pressing plate according to an embodiment of the present invention;

[0031] Figure 6 This is a cross-sectional schematic diagram of the graphic plate according to an embodiment of the present invention;

[0032] Figure 7 This is a cross-sectional schematic diagram of the second graphic plate according to an embodiment of the present invention;

[0033] Figure 8 This is a cross-sectional schematic diagram of the electroplating plate according to an embodiment of the present invention;

[0034] Figure 9 This is a cross-sectional schematic diagram of the molding plate according to an embodiment of the present invention;

[0035] Figure 10 This is a cross-sectional schematic diagram of the circuit board according to an embodiment of the present invention;

[0036] Figure 11 This is a schematic diagram of the working state of the circuit board according to an embodiment of the present invention.

[0037] Explanation of icon numbers:

[0038] 100. Molding line; 200. Invalid area; 300. Uncovered area; 400. Uncovered area; 500. Components; 10A. First stacked structure; 110. Resin plug through-hole; 120. Release film; 130. First solder resist pattern; 140. Circuit pattern; 150. Auxiliary circuit pattern; 1010A. First core board; 1020A. Second core board; 10B. Second stacked structure; 10C. Third stacked structure; 20. Pressing plate; 30. Pattern board; 3 010, Second via; 3020, Surface pattern; 40, Second pattern board; 4010, Second solder mask pattern; 4020, First formed via; 50, Electroplating board; 5010, Electroplating surface; 5020, Electroplating hole; 60, Formed board; 70, Flexible-rigid bonding layer; 7010, Rigid area; 7020, Flexible area; 7030, Electroplating pattern; 7040, Third via; 80, Circuit board; 810, Parallel conductive state; 820, Bending and separating state.

[0039] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0041] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0042] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0044] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0045] Please see Figure 1 , Figure 1 This is a process flow diagram of an embodiment of the present invention.

[0046] This embodiment provides a method for manufacturing a circuit board 80 for a three-dimensional circuit of a single-axis joint module of a machine. The circuit board 80 is processed according to design data, which includes a forming line 100. The area within the forming line 100 is the effective area, and other areas are the ineffective areas 200. The effective area includes a covered area 300 and a non-covered area 400. The manufacturing method includes the following steps.

[0047] Please see Figure 2 , Figure 3 , Figure 4 and Figure 5 , Figure 2 This is a cross-sectional schematic diagram of the first stacked structure according to an embodiment of the present invention; Figure 3This is a cross-sectional schematic diagram of the second stacked structure according to an embodiment of the present invention; Figure 4 This is a cross-sectional schematic diagram of the third stacked structure according to an embodiment of the present invention; Figure 5 A cross-sectional schematic diagram of the pressing plate according to an embodiment of the present invention.

[0048] Step S10:

[0049] According to the design data, a first core board 1010A is manufactured, including a first through hole and a circuit pattern 140. The first through hole is located in the cover area 300. The first through hole is filled with resin to form a resin-filled through hole 110. A second core board 1020A is then manufactured and stacked with the first core board 1010A to form a first stacked structure 10A. The two core boards are then pressed together to form a press plate 20. A release film 120 is attached to the side of the second core board 1020A facing the first core board 1010A corresponding to the cover area 300. A first solder resist pattern 130 is manufactured on the side of the first core board 1010A facing the second core board 1020A corresponding to the cover area 300. The first solder resist pattern 130 does not cover the resin-filled through hole 110.

[0050] By completely filling the first through hole, a flat and continuous plate structure is formed on the surface of the first core board 1010A, providing a stable processing foundation for subsequent stacking and pressing processes. On the one hand, the filled resin can effectively eliminate the air gap inside the first through hole, avoiding processing defects such as board bursting and blistering caused by air expansion due to high temperature and high pressure during the pressing process, thus ensuring the structural integrity of the pressed plate 20. On the other hand, the resin filling can enhance the support strength of the hole wall of the first through hole, preventing the hole wall from deforming or collapsing due to uneven stress during stacking and pressing, thus ensuring the dimensional accuracy of subsequent processes.

[0051] It is worth noting that since the resin in the resin plug through hole 110 needs to be removed by drilling in the subsequent process, and the first molded through hole 4020 needs to be further processed, the resin plugging in this step does not need to pursue a high-precision filling effect. It only needs to meet the basic requirements of no air leakage, no bubbling, and stable board structure during the pressing process. Try to avoid the plugging being too full, which would require grinding after baking. This avoids problems such as excessive stretching and shrinkage of the board caused by grinding, which simplifies the processing technology and reduces process costs.

[0052] It is worth noting that the process design of first fabricating the solder resist layer and then laminating and peeling it off in this embodiment has significant technical implications. The release film 120 serves as an interlayer release agent during the lamination process and forms a release effect during peeling. After the peeling process is completed, the surface of the second core board 1020A is exposed, while the first solder resist pattern 130, as a key protective structure, needs to be fully exposed and function after peeling. If the peeling process is performed first and then the solder resist layer is fabricated, the surface of the second core board 1020A after peeling will have a three-dimensional circuit structure with staggered circuit heights. The formation of irregular interfaces will prevent uniform coverage during screen printing or spraying of solder resist ink, and the ink is prone to accumulation or omission at the gaps between lines. At the same time, the three-dimensional lines will affect the exposure, causing inaccurate exposure of the first solder resist pattern 130, and failing to form a solder resist layer that meets the requirements. Therefore, the first solder resist pattern 130 is pre-made on the corresponding surface of the first core board 1010A before stacking and laminating. This can ensure the processing quality of the solder resist layer and avoid damage to the solder resist layer in subsequent processing, thus ensuring the insulation performance and reliability of the product after peeling.

[0053] Optionally, the second core board 1020A is a single-sided board or a multi-layer board, or the first core board 1010A is a single-sided board or a multi-layer board, to adapt to the circuit interconnection density requirements of different visual perception modules.

[0054] Optionally, the circuit pattern 140 extends through the uncovered area 300 and the uncovered area 400, and the first solder mask pattern 130 covers the circuit pattern 140 of the uncovered area 300.

[0055] Please see Figure 3 For the second stacked structure 10B, if there is also a circuit connection on the opposite side of the stack in the design data, then the circuit pattern 140 is selected to run through the uncovered area 300 and the non-covered area 400 to ensure the integrity of the circuit interconnection. It is worth noting that the circuit pattern 140 and the circuit on the surface of the second core board 1020A cannot be in contact with each other. Otherwise, the metallic properties of the copper surface will cause the interlayer to fail to form an effective bond, and problems such as interlayer peeling, bubbles, and insufficient bonding force will easily occur after lamination. Furthermore, local short circuits may be caused by copper layer contact, which will seriously affect the reliability of the product.

[0056] Optionally, a circuit pattern 140 is formed on the surface of the first core board 1010A corresponding to the second through hole position, forming an auxiliary circuit pattern 150.

[0057] Please see Figure 4 In the third stacked structure 10C, when the design board thickness is greater than 0.5mm, in order to make the electroplating of the through holes of the subsequent three-dimensional circuit better, the inner wall of the hole is easier to be plated with copper, and the copper plating uniformity is better, an auxiliary circuit pattern 150 can be made simultaneously on the surface of the first core board 1010A corresponding to the second through hole position, which effectively improves the hole electroplating effect during subsequent electroplating.

[0058] Optionally, the size of the auxiliary circuit pattern 150 is smaller than the non-covered area 400 on one side and greater than or equal to the size of the second through hole. On the one hand, this ensures that the auxiliary circuit pattern 150 can fully play its core role in optimizing the distribution of electroplating current and ensure the conductivity reliability of the second through hole 3010. On the other hand, by limiting the auxiliary circuit pattern 150 to not exceed the boundary of the non-covered area 400, it is prevented from intruding into the uncovered area 300, ensuring that the subsequent uncovering process is not interfered with, and achieving synergistic compatibility between electroplating optimization and uncovering process.

[0059] Please see Figure 6 , Figure 6 A cross-sectional schematic diagram of the graphic plate according to an embodiment of the present invention.

[0060] Step S20:

[0061] A second through hole is drilled in the non-covered area 400 of the press plate 20. Then the whole plate is electroplated, and the second through hole forms a second through hole 3010. Then the surface circuit pattern 3020 is made, and the whole plate forms a patterned plate 30.

[0062] Optionally, the second through hole 3010 can be an electroplated solid hole or a resin-plugged solid hole; the electroplated solid hole is processed simultaneously during the whole board electroplating; the resin-plugged solid hole is processed by resin plugging after the whole board electroplating.

[0063] Solid holes enhance the rigidity of the hole itself, providing a stable support base for the surrounding three-dimensional circuitry. This effectively reduces the deformation of the circuitry under complex application scenarios such as vibration, temperature cycling, and repeated bending, ensuring the structural stability and electrical performance consistency of the visual perception module during long-term use.

[0064] Please see Figure 7 , Figure 7 A cross-sectional schematic diagram of the second graphic plate according to an embodiment of the present invention.

[0065] Step S30:

[0066] A second solder resist pattern 4010 is made on the surface of the second core board 1020A of the pattern board 30. Then, the cover area 300 is removed and processed. Next, the resin plug through hole 110 is drilled to remove the resin and form the first molded through hole 4020. Then, the entire board is surface treated and the first molded through hole 4020 is formed into an electroplating hole 5020. After molding, the entire board forms the second pattern board 40.

[0067] The process of first filling the holes with resin and then drilling and forming them in this embodiment is fundamentally different from the traditional process. The traditional process first presses and peels off the cover to expose the first core board 1010A in the peeling area 300 and makes the first forming through hole 4020. During electroplating, problems such as high electroplating processing difficulty and damage to the surface solder resist are easily generated.

[0068] In this embodiment, the resin plug through hole 110 has already undergone electroplating treatment on the hole wall before the cover is removed. Drilling only requires removing the resin to form a through channel, without the need for subsequent additional electroplating. This simplifies the process steps and ensures the uniformity and stability of the hole wall coating of the first formed through hole 4020, thus guaranteeing the reliability of the conduction.

[0069] Optionally, the diameter of the first through hole is smaller on one side than the diameter of the first formed through hole 4020.

[0070] By reserving sufficient machining allowance, not only can resin residue be thoroughly removed during the entire drilling process, but also the copper layer on the hole wall can be slightly drilled to remove any oxide film or machining impurities that may be generated on the surface of the copper layer, thus ensuring the stability of the conductivity of the hole wall of the first formed through hole 4020.

[0071] Please see Figure 8 , Figure 8 A cross-sectional schematic diagram of the electroplating plate according to an embodiment of the present invention.

[0072] Optionally, the surface treatment is electroplating gold processing, the surface of the second through hole 3010 is formed into an electroplated surface 5010, the first formed through hole 4020 is formed into an electroplated hole 5020, and the whole board is formed into an electroplated plate 50. The surface treatment of electroplating gold has good reliability, wear resistance and conductivity, providing a reliable board body foundation for the subsequent process of switching between conduction and separation through bending.

[0073] Furthermore, the capping process involves removing the first core board 1010A from the capping area 300.

[0074] Please see Figure 9 , Figure 10 and Figure 11 , Figure 9 A cross-sectional schematic diagram of the molding plate according to an embodiment of the present invention; Figure 10 A cross-sectional schematic diagram of the circuit board according to an embodiment of the present invention; Figure 10 A schematic diagram of the working state of the circuit board according to an embodiment of the present invention.

[0075] Step S40:

[0076] Next, a rigid-flexible bonding layer 70 is fabricated according to the design data. The rigid-flexible bonding layer 70 includes a rigid region 7010 and a flexible region 7020. An electroplated pattern 7030 is fabricated on the surface of the flexible region 7020, and a third via 7040 is fabricated on the rigid region 7010. The third via 7040 is soldered to the electroplated via 5020, and the electroplated pattern 7030 is in contact with the second via 3010, forming a circuit board 80.

[0077] The rigid-flexible bonding layer 70 is parallel to the second patterned plate 40, and the electroplated pattern 7030 of the flexible region 7020 contacts the surface of the second through hole 3010 to achieve electrical connection; or, the flexible region 7020 is bent, the rigid-flexible bonding layer 70 and the second patterned plate 40 form an angle, the electroplated pattern 7030 separates from the surface of the second through hole 3010, and the electrical connection is broken.

[0078] The electroplated metal plate 50 is formed into a molded plate 60; then, one end of the rigid-flexible bonding layer 70 is fixed or welded to the molded plate 60 to the component 500. The working process of this embodiment is as follows:

[0079] (1) Parallel conductive state 810: When the rigid-flex bonding layer 70 and the molding plate 60 are arranged to be parallel to each other, the flexible area 7020 of the rigid-flex bonding layer 70 is in a naturally straightened state. At this time, the electroplated pattern 7030 pre-made on the surface of the flexible area 7020 will form an electroplated surface 5010 with the surface of the second through hole 3010 on the molding plate 60, forming a close contact.

[0080] (2) Bending and separating state 820: When it is necessary to disconnect the electrical connection, a directional bending force is applied to the flexible area 7020 of the rigid-flexible bonding layer 70, so that the rigid-flexible bonding layer 70 rotates relative to the forming plate 60 and forms a certain angle, the electroplated pattern 7030 separates from the electroplated surface 5010, and the electrical connection path between the two is broken.

[0081] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made using the description and drawings of the present invention under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a circuit board for a single-axis joint module of a machine with a three-dimensional circuit, wherein the circuit board is processed according to design data, the design data including a covered area and a non-covered area, characterized in that, The manufacturing method includes the following steps: S10: According to the design data, a first core board including a first through hole and a circuit pattern is manufactured. The first through hole is located in the uncovered area. The first through hole is filled with resin to form a resin-filled through hole. A second core board is manufactured, stacked with the first core board and pressed together to form a pressed plate. In this case, a release film is attached to the side of the second core board facing the first core board corresponding to the opening area; The side of the first core board facing the second core board has a first solder resist pattern corresponding to the uncovering area, and the first solder resist pattern does not cover the resin plug through hole; S20: Drill a second through hole in the non-covered area of ​​the pressed plate, then electroplate the whole plate, the second through hole forms a second through hole, then make the surface circuit pattern, and the whole plate forms a patterned plate. S30: A second solder mask pattern is made on the surface of the second core board of the graphic board, then the cover area is removed and processed, then the resin plug through hole is drilled and processed to remove the resin and form a first molded through hole, then the whole board is surface treated and the first molded through hole is formed into an electroplating hole. After molding, the whole board is formed into a second graphic board. S40: Fabricate a rigid-flexible bonding layer according to the design data. The rigid-flexible bonding layer includes a rigid region and a flexible region. The surface of the flexible region is fabricated with an electroplated pattern, and the rigid region is fabricated with a third through-hole. The third through hole is soldered to the corresponding electroplated hole, and the electroplated pattern is in contact with the second through hole to form the circuit board. The rigid-flexible bonding layer is parallel to the second patterned plate, and the electroplated pattern in the flexible region contacts the surface of the second through hole to achieve electrical connection. The flexible area is bent, the rigid-flexible bonding layer forms an angle with the second patterned plate, the electroplated pattern separates from the surface of the second through hole, and the electrical connection is broken.

2. The method for manufacturing a circuit board for a three-dimensional circuitry of a single-axis joint module of a machine as described in claim 1, characterized in that, The diameter of the first through hole is smaller on one side than the diameter of the first formed through hole.

3. The method for manufacturing a circuit board for a three-dimensional circuitry of a single-axis joint module of a machine as described in claim 1, characterized in that, The second core board is a single-sided or multi-layer board, or the first core board is a single-sided or multi-layer board.

4. The method for manufacturing a circuit board for a three-dimensional circuitry of a single-axis joint module of a machine as described in claim 1, characterized in that, The circuit pattern extends through the uncovered area and the uncovered area, and the first solder mask pattern covers the circuit pattern in the uncovered area.

5. The method for manufacturing a circuit board for a three-dimensional circuitry of a single-axis joint module of a machine as described in claim 1, characterized in that, The circuit pattern is formed on the surface of the first core board corresponding to the second through hole position, thus forming an auxiliary circuit pattern.

6. The method for manufacturing a circuit board for a three-dimensional circuitry of a single-axis joint module of a machine as described in claim 5, characterized in that, The size of the auxiliary circuit pattern is smaller on one side than the uncovered area.

7. The method for manufacturing a circuit board for a three-dimensional circuitry of a single-axis joint module of a machine as described in claim 1, characterized in that, The second through hole is either an electroplated solid hole or a resin-plugged solid hole; the electroplated solid hole is processed simultaneously during the electroplating of the entire board; the resin-plugged solid hole is processed by resin plugging after the electroplating of the entire board.

8. The method for manufacturing a circuit board for a three-dimensional circuitry of a single-axis joint module of a machine as described in claim 1, characterized in that, The surface treatment is electroplating with gold.

9. The method for manufacturing a circuit board for a three-dimensional circuitry of a single-axis joint module of a machine as described in claim 1, characterized in that, The peeling process involves removing the second core board from the peeling area.

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