Stacked PCB and manufacturing method thereof
By employing a stacked structure of high-frequency multilayer boards, thermally conductive copper substrates, and FR-4 multilayer boards in the PCB, and utilizing designs such as bosses and heat dissipation holes, the problems of poor heat dissipation and high cost in existing technologies are solved, achieving efficient heat dissipation and low-cost PCB manufacturing.
Patent Information
- Application Number
- CN202511879396.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-12
- Publication Date
- 2026-02-13
AI Technical Summary
In existing technologies, multi-layer PCB structures suffer from poor heat dissipation, are difficult to manufacture, and are costly, failing to meet the ultra-high density and multi-functional requirements of modern electronic products.
It adopts a stacked structure of high-frequency multilayer board, thermally conductive copper substrate and FR-4 multilayer board, and heat transfer is achieved by setting bosses between pads, and heat dissipation holes and injection holes are set between boards to improve heat dissipation efficiency, while simplifying the manufacturing process.
It improves the heat dissipation efficiency of PCBs, reduces manufacturing costs, simplifies the process, and enhances the structural strength and signal transmission capabilities of PCBs.
Smart Images
Figure CN121531553A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of PCB manufacturing technology, and in particular to a stacked PCB and a method for manufacturing the same. Background Technology
[0002] With the rapid development of intelligent design and manufacturing of electronic products, single circuit board design has obvious limitations, with limited features and functions, and cannot well meet the ultra-high density and multiple functional requirements of modern electronic products.
[0003] To address the aforementioned issues, relevant technologies commonly employ a multi-layered board with multiple cutouts between the upper and lower multi-layered boards. While this three-layer structure can meet the ultra-high density requirements of modern electronic products, the use of multi-layered boards and cutouts in the middle layer, coupled with the poor thermal conductivity of air due to the multi-layered materials and the large cutouts, often results in poor heat dissipation. Furthermore, this structure requires the use of vapor chambers (VCS) to improve heat dissipation and reinforced metal components to increase PCB strength, leading to significant manufacturing difficulties and high costs. Therefore, certain technical problems still need to be solved in this field. Summary of the Invention
[0004] The purpose of this application is to at least partially solve one of the technical problems existing in the prior art.
[0005] Therefore, one objective of this application is to provide a stacked PCB and a method for manufacturing the same, which can improve heat dissipation efficiency while reducing manufacturing costs.
[0006] To achieve the above-mentioned technical objectives, the technical solution adopted in the embodiments of this application includes: a stacked PCB, comprising: a high-frequency multilayer board, a thermally conductive copper substrate, and an FR-4 multilayer board; the high-frequency multilayer board, the thermally conductive copper substrate, and the FR-4 multilayer board are stacked sequentially.
[0007] The thermally conductive copper substrate includes a first mounting surface and a second mounting surface; the first mounting surface and the second mounting surface are disposed opposite to each other; both the first mounting surface and the second mounting surface include a plurality of pads; the first mounting surface includes two or more mounting cavities; a boss is provided between any two adjacent pads; the mounting cavity is used to place a plurality of high-frequency multilayer boards with different functions; the pads of the first mounting surface are used to connect the thermally conductive copper substrate and the high-frequency multilayer board, and the pads of the second mounting surface are used to connect the thermally conductive copper substrate and the FR-4 multilayer board; the boss abuts against the high-frequency multilayer board and against the FR-4 multilayer board.
[0008] In addition, a stacked PCB according to the above embodiments of the present invention may also have the following additional technical features:
[0009] Furthermore, in this embodiment of the application, both the high-frequency multilayer board and the FR-4 multilayer board include at least one heat dissipation hole; the diameter of the heat dissipation hole is less than or equal to 0.5 mm.
[0010] Furthermore, in any embodiment of this application, any of the high-frequency multilayer boards includes a glue injection hole; the diameter of the glue injection hole is 1mm-2mm.
[0011] Furthermore, in this embodiment of the application, the mounting cavity includes an insulating and thermally conductive adhesive; the insulating and thermally conductive adhesive is injected into the mounting cavity from the injection hole.
[0012] Furthermore, in this embodiment of the application, both the high-frequency multilayer board and the FR-4 multilayer board are provided with a first edge; the first edge is provided around the periphery of all components of the high-frequency multilayer board; the first edge is provided around the periphery of all components of the FR-4 multilayer board.
[0013] Furthermore, in this embodiment of the application, the thermally conductive copper substrate includes a second edging; the second edging is disposed around the periphery of all pads on the thermally conductive copper substrate.
[0014] Furthermore, in this embodiment of the application, both the first edge banding and the second edge banding are metal edge bandings.
[0015] On the other hand, embodiments of this application also provide a PCB manufacturing method for manufacturing the stacked PCB described in any of the preceding claims, the method comprising:
[0016] S1. At the first welding temperature, the components are welded to the FR-4 multilayer board and the high-frequency multilayer board;
[0017] S2. Mount the FR-4 multilayer board on the second mounting surface of the thermally conductive copper substrate, such that the boss between any two adjacent pads on the second mounting surface abuts against the FR-4 multilayer board, and weld the FR-4 multilayer board and the thermally conductive copper substrate at the first welding temperature.
[0018] S3. The high-frequency multilayer board is mounted on the first mounting surface of the thermally conductive copper substrate, such that the boss between any two adjacent pads on the first mounting surface abuts against the high-frequency multilayer board, and the high-frequency multilayer board and the thermally conductive copper substrate are welded at a third welding temperature to obtain a stacked PCB; wherein, the first welding temperature is greater than the third welding temperature; and the third welding temperature is greater than the second welding temperature.
[0019] Furthermore, in this embodiment of the application, the method further includes:
[0020] S4. A first edge and a second edge are provided on all high-frequency multilayer boards and FR-4 multilayer boards; the first edge is provided around the periphery of all components on the high-frequency multilayer board; the second edge is provided around the periphery of all components on the FR-4 multilayer board.
[0021] Furthermore, the method also includes:
[0022] S5. Form injection holes on the high-frequency multilayer board and inject insulating and thermally conductive adhesive into the mounting cavity through the injection holes, so that the insulating and thermally conductive adhesive fills the mounting cavity.
[0023] The advantages and beneficial effects of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application:
[0024] This application improves the heat dissipation efficiency of the PCB by setting bosses between the pads of the thermally conductive copper substrate to abut against the high-frequency multilayer board and the FR-4 multilayer board. This can effectively protect the entire PCB from thermal failure. Moreover, this application only requires stacking and soldering the high-frequency multilayer board, the thermally conductive copper substrate, and the FR-4 multilayer board together, without the need for other complex processes, thus simplifying the manufacturing process and reducing manufacturing costs. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of a stacked PCB structure provided in one embodiment of this application;
[0027] Figure 2 This is a schematic diagram of the structure between the boss and the pad provided in one embodiment of this application;
[0028] Figure 3 This is a schematic diagram showing the positions of heat dissipation holes, glue injection holes, and edge banding on a high-frequency multilayer board according to an embodiment of this application.
[0029] Figure 4 This is a flowchart illustrating a PCB manufacturing method according to one embodiment of this application. Detailed Implementation
[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0031] See Figure 1 As shown, one embodiment of this application discloses a stacked PCB. The stacked PCB may include a high-frequency multilayer board 11, a thermally conductive copper substrate 12, and an FR-4 multilayer board 13. The high-frequency multilayer board 11, the thermally conductive copper substrate 12, and the FR-4 multilayer board 13 are stacked sequentially. Specifically, the thermally conductive copper substrate 12 may be disposed between the high-frequency multilayer board 11 and the FR-4 multilayer board 13, forming a sandwich structure.
[0032] The thermally conductive copper substrate 12 may include a first mounting surface 121 and a second mounting surface 122. The first mounting surface 121 may be disposed opposite to the second mounting surface 122. Specifically, the first mounting surface 121 may be the upward-facing surface of the thermally conductive copper substrate 12 placed on the welding equipment. The second mounting surface 122 may be the downward-facing surface of the thermally conductive copper substrate 12 placed on the welding equipment. It is understood that, due to different welding equipment or the use of manual welding, the first mounting surface 121 may also be the downward-facing surface of the thermally conductive copper substrate 12 placed on the welding equipment, and the second mounting surface 122 may be the upward-facing surface of the thermally conductive copper substrate 12 placed on the welding equipment.
[0033] Both the first mounting surface 121 and the second mounting surface 122 may include a plurality of pads 125. The specific number of pads 125 can be set according to the circuit requirements on the PCB and is not limited here. The first mounting surface 121 may include two or more mounting cavities 123; the mounting cavities 123 are used to place a plurality of high-frequency multilayer boards 11 with different functions. The mounting cavities 123 may be set with one or more depending on the function of the high-frequency multilayer boards 11. Specifically, the mounting cavities 123 may mount charging modules, core control modules, and radio frequency modules. The charging modules, control modules, and radio frequency modules are all high-frequency multilayer boards 11. At the same time, the charging modules, control modules, and radio frequency modules generally generate more heat than the peripheral communication modules or sensing modules. Placing the charging modules, control modules, and radio frequency modules in the mounting cavities 123 can dissipate their heat more quickly and reduce the risk of thermal failure. (Refer to...) Figure 2 A boss 124 is provided between any two adjacent pads 125. Figure 1(Not shown). The height and width of the boss 124 can be set as needed, and the thickness of the thermally conductive copper substrate 12 can also be set as needed. Specifically, since components will be mounted on one surface of the high-frequency multilayer board 11 and the opposing surface of the FR-4 multilayer board 13, the thickness of the thermally conductive copper substrate 12 can be set to be greater than or equal to the total height of the components with the largest height on the two surfaces. For example, if the maximum height of the components on surface A of the high-frequency multilayer board 11 is a mm, and the maximum height of the components on surface B of the FR-4 multilayer board 13 is b mm, where surface A and surface B are two opposing surfaces, then the thickness of the thermally conductive copper substrate 12 needs to be greater than or equal to (a+b) mm. In addition, to avoid short circuits between the boss 124 and the adjacent pad 125 due to contact during soldering, the minimum distance between the edge of the boss 124 and the edge of the pad 125 can be greater than a preset value. Specifically, this preset value can be 1 mm.
[0034] To further prevent short circuits between the boss 124 and the adjacent pad 125, an insulating layer can also be provided on the boss 124. The specific insulating layer on the PCB can be insulating solder mask. The pad 125 on the first mounting surface 121 is used to connect the thermally conductive copper substrate 12 to the high-frequency multilayer board 11, and the pad 125 on the second mounting surface 122 is used to connect the thermally conductive copper substrate 12 to the FR-4 multilayer board 13. The pads 125 on the first mounting surface 121 and the second mounting surface 122 enable electrical connections between the high-frequency multilayer board 11 and the FR-4 multilayer board 13, allowing normal signal transmission between them. The boss 124 can abut against the high-frequency multilayer board 11, and simultaneously, the boss 124 can also abut against the FR-4 multilayer board 13. This design can improve the heat conduction between the boss 124 and the high-frequency multilayer board 11 and the FR-4 multilayer board 13, so that the heat generated by the components on the high-frequency multilayer board 11 and the FR-4 multilayer board 13 can be quickly conducted to the thermally conductive copper substrate 12, thereby improving the heat dissipation efficiency of the high-frequency multilayer board 11 and the FR-4 multilayer board 13. This can effectively reduce the risk of thermal failure of the high-frequency multilayer board 11 and the FR-4 multilayer board 13 and improve the thermal stability of the product.
[0035] Furthermore, referring to Figure 3In some feasible embodiments of this application, both high-frequency multilayer boards and FR-4 multilayer boards can include at least one heat dissipation hole 126. Specifically, in some embodiments, each high-frequency multilayer board can include four heat dissipation holes 126. The heat dissipation holes 126 can be located in the empty spaces near the four corners of the high-frequency multilayer board, where there are no components or PCB traces on the high-frequency multilayer board. The heat dissipation holes 126 can improve the thermal conductivity of the PCB during component soldering on the high-frequency multilayer board, avoiding defects such as thermal failure of components during soldering. Similarly, the FR-4 multilayer board can also include at least one heat dissipation hole 126. Likewise, the heat dissipation holes 126 of the FR-4 multilayer board can improve the thermal conductivity of the PCB during component soldering on the high-frequency multilayer board, avoiding defects such as thermal failure of components during soldering. At the same time, the four heat dissipation holes 126 can reduce the risk of poor soldering caused by the expansion of enclosed gas pushing up the board when three boards are mounted in SMT.
[0036] Furthermore, in some feasible embodiments of this application, the diameter of the heat dissipation hole 126 can be less than or equal to 0.5 mm. In order to further improve the insulation performance and overall strength of the stacked PCB, the mounting cavity of the stacked PCB needs to be filled with insulating thermally conductive adhesive. Setting the diameter of the heat dissipation hole 126 to be less than or equal to 0.5 mm can prevent the insulating thermally conductive adhesive from overflowing to another mounting surface of the high-frequency multilayer board.
[0037] Furthermore, referring to Figure 3 In some feasible embodiments of this application, any high-frequency multilayer board may include a glue injection hole 127; the diameter of the glue injection hole 127 may be 1mm-2mm. Preferably, to adapt to the nozzle diameter of commonly used glue injection guns, this embodiment selects a glue injection hole with a diameter of 1.5mm. To further improve the insulation performance and overall strength of the stacked PCBs, the mounting cavity of the stacked PCBs needs to be filled with insulating and thermally conductive adhesive. The glue injection hole 127 with a diameter of 1mm-2mm can inject the insulating and thermally conductive adhesive into the cavity. At the same time, the glue injection hole 127 can also be set on any high-frequency multilayer board with more heat generation, thereby further improving the heat dissipation efficiency of the high-frequency multilayer board. It is understood that in some embodiments, when one of the high-frequency multilayer boards has a glue injection hole 127, the heat dissipation holes 126 of the high-frequency multilayer board can be set to 3.
[0038] Furthermore, in some feasible embodiments of this application, in order to further improve the insulation performance of the stacked PCB and the overall strength of the PCB, the mounting cavity 123 can be filled with insulating thermally conductive adhesive; the insulating thermally conductive adhesive can improve the insulation between any two or more devices located in the mounting cavity 123 on the high-frequency multilayer board, and can also improve the insulation between any two or more devices located in the mounting cavity 123 on the FR-4 multilayer board, and can also improve the insulation between the components of the FR-4 multilayer board and the high-frequency multilayer board. The insulating thermally conductive adhesive can be injected into the mounting cavity 123 through the injection hole, and since the diameter of the heat dissipation hole is less than or equal to 0.5mm, the insulating thermally conductive adhesive will not overflow the mounting cavity 123.
[0039] Furthermore, in some feasible embodiments of this application, reference is made to Figure 3 Both the high-frequency multilayer board and the FR-4 multilayer board are provided with a first perimeter 128. The first perimeter 128 surrounds the periphery of all components on the high-frequency multilayer board and the FR-4 multilayer board. It is understood that the width of the first perimeter 128 can be set according to specific needs. Specifically, taking a high-frequency multilayer board including a charging module, a control module, and an RF module as an example, the first perimeter 128 can simultaneously surround the periphery of all components in the charging module, control module, and RF module. The perimeter can reduce the impact of external interference signals on the charging module, control module, and RF module, improving the stability of signal transmission. In some embodiments, a shielding cover can also be added to the first perimeter 128, which can further reduce the impact of external interference signals on the charging module, control module, and RF module.
[0040] Furthermore, in some feasible embodiments of this application, the first edge 128 is a metal edge. It is understood that the metal edge can be prepared by a deposition process, thereby simplifying the process. It is understood that the specific metal can be iron, copper, or other depositable metals. Specifically, considering the anti-interference effect and process simplification, the metal edge is preferably a copper edge.
[0041] Furthermore, referring to Figure 1 In some feasible embodiments of this application, the thermally conductive copper substrate may include a second edge 129, which surrounds the periphery of all pads on the thermally conductive copper substrate. The second edge 129 is a metal edge. Specifically, the second edge 129 may also be a copper edge, which may surround the periphery of all pads on the thermally conductive copper substrate and may cover one or more edges of each high-frequency multilayer board, as well as the edge of the FR-4 multilayer board. The second edge 129 can reduce signal interference during signal transmission on the thermally conductive copper substrate, thereby improving the overall anti-interference capability of the stacked PCB.
[0042] In addition, refer to Figure 4 ,and Figure 1 Corresponding to the stacked PCB, the embodiments of this application also provide a PCB manufacturing method. This method can manufacture a stacked PCB as described above. The PCB manufacturing method may include at least steps S101-S103.
[0043] S101. At the first welding temperature, the components are welded to the FR-4 multilayer board and the high-frequency multilayer board.
[0044] S102. Mount the FR-4 multilayer board on the second mounting surface of the thermally conductive copper substrate, so that the boss between any two adjacent pads on the second mounting surface abuts against the FR-4 multilayer board, and weld the FR-4 multilayer board and the thermally conductive copper substrate at the third welding temperature.
[0045] S103. The high-frequency multilayer board is mounted on the first mounting surface of the thermally conductive copper substrate, so that the boss between any two adjacent pads on the first mounting surface abuts against the high-frequency multilayer board, and the high-frequency multilayer board and the thermally conductive copper substrate are welded at the second welding temperature to obtain a stacked PCB; wherein the first welding temperature is greater than the third welding temperature, and the third welding temperature is greater than the second welding temperature.
[0046] It is understandable that the first soldering temperature can be the temperature provided by the soldering equipment used to solder components to FR-4 multilayer boards and high-frequency multilayer boards. The second soldering temperature can be the soldering temperature for soldering high-frequency multilayer boards to thermally conductive copper substrates. The third soldering temperature can be the soldering temperature for soldering FR-4 multilayer boards to thermally conductive copper substrates. To ensure that the solder paste near the components soldered in the first soldering is not affected by temperature during the second soldering, the first soldering temperature can be higher than the third soldering temperature. To ensure that the solder paste near the components soldered in the second soldering is not affected by temperature during the third soldering, the third soldering temperature can be higher than the second soldering temperature.
[0047] Specifically, when soldering components onto FR-4 multilayer boards and high-frequency multilayer boards, either red glue or solder paste processes can be used. Both of these processes are commonly used SMT mounting processes. After obtaining the FR-4 multilayer boards and high-frequency multilayer boards with the corresponding components, the FR-4 multilayer boards can be mounted on any one of the mounting surfaces of the thermally conductive copper substrate. During mounting, the FR-4 multilayer boards need to be abutted against the bosses between any two adjacent pads on the second mounting surface. Then, the FR-4 multilayer boards are soldered to the thermally conductive copper substrate at the third soldering temperature. This allows the heat from the components on the FR-4 multilayer boards to be transferred to the thermally conductive copper substrate through the bosses and then dissipated into the surrounding environment. After soldering the FR-4 multilayer board to the thermally conductive copper substrate, in this embodiment, the high-frequency multilayer board can be mounted on another mounting surface of the thermally conductive copper substrate. During installation, the high-frequency multilayer board needs to be abutted against the boss between any two adjacent pads on the first mounting surface. Then, the high-frequency multilayer board and the thermally conductive copper substrate are soldered at the second soldering temperature. This allows the heat from the components on the high-frequency multilayer board to be transferred to the thermally conductive copper substrate through the boss, and then dissipated into the surrounding environment, ultimately resulting in a soldered stacked PCB.
[0048] In some embodiments, while soldering components to the FR-4 multilayer board and the high-frequency multilayer board at the first soldering temperature, the FR-4 multilayer board is simultaneously mounted on the second mounting surface of the thermally conductive copper substrate, such that the boss between any two adjacent pads on the second mounting surface abuts against the FR-4 multilayer board. In this case, one soldering step can be omitted, simplifying the process flow.
[0049] In other words, steps S101, S102 and S103 of the above method can be replaced with steps S111 and S112.
[0050] S111. Mount the FR-4 multilayer board on the second mounting surface of the thermally conductive copper substrate, such that the boss between any two adjacent pads on the second mounting surface abuts against the FR-4 multilayer board. At the first soldering temperature, solder the components to the FR-4 multilayer board and the high-frequency multilayer board, and solder the FR-4 multilayer board to the second mounting surface of the thermally conductive copper substrate.
[0051] S112. A high-frequency multilayer board is mounted on the first mounting surface of a thermally conductive copper substrate, such that the boss between any two adjacent pads on the first mounting surface abuts against the high-frequency multilayer board, and the high-frequency multilayer board and the thermally conductive copper substrate are welded at a second welding temperature to obtain a stacked PCB; wherein the first welding temperature is greater than the second welding temperature.
[0052] Furthermore, in some feasible embodiments of this application, in order to increase the anti-interference capability of the stacked PCB, the PCB manufacturing method may also include step S104.
[0053] S104. A first edge and a second edge are provided on all high-frequency multilayer boards and FR-4 multilayer boards; the first edge is provided around the periphery of all components on the high-frequency multilayer board; the second edge is provided around the periphery of all components on the FR-4 multilayer board.
[0054] Specifically, a first edge can be deposited on all high-frequency multilayer boards and FR-4 multilayer boards using deposition technology, and a second edge can be deposited on the FR-4 multilayer board. The first edge can be placed around the periphery of all components on the high-frequency multilayer board; the second edge can be placed around the periphery of all components on the FR-4 multilayer board.
[0055] Furthermore, in some feasible embodiments of this application, in order to increase the strength, corrosion resistance and insulation performance of the stacked PCB, the PCB manufacturing method may also include step S105.
[0056] S105. Form injection holes on the high-frequency multilayer board and inject insulating and thermally conductive adhesive into the mounting cavity through the injection holes so that the mounting cavity is filled with insulating and thermally conductive adhesive.
[0057] Specifically, in this embodiment, a glue injection hole can be formed on any high-frequency multilayer board, and insulating thermally conductive adhesive can be injected into the mounting cavity through the glue injection hole to fill the mounting cavity with insulating thermally conductive adhesive. This improves the heat dissipation capacity of the stack. Preferably, in this embodiment, a glue injection hole with a diameter of 1mm-2mm can be formed on the charging module with the largest heat generation in an area without components and circuits. Then, fluid insulating thermally conductive adhesive is injected into the mounting cavity through a glue gun, and then allowed to solidify to obtain the finished stacked PCB.
[0058] In summary, the proposed solution has the following advantages:
[0059] 1. The substrate between the high-frequency multilayer board and the FR-4 multilayer board is a multilayer copper substrate with high thermal conductivity, which can bring stronger heat dissipation, stronger structural strength, stronger shielding effect and lower ground resistance compared with ordinary multilayer boards.
[0060] 2. Compared with multi-stage multilayer boards, high-frequency multilayer boards have more optimized signal transmission capabilities and lower signal loss.
[0061] 3. The copper substrate uses multiple hollow cavities, which can be used to divide the product into multiple functional modules, avoiding mutual interference between modules and improving product stability.
[0062] 4. The heat dissipation holes are located at the four corners of the small cavity, which can effectively prevent the expansion of gas due to heat from affecting the placement of the chip, resulting in poor soldering or short circuits. At the same time, this embodiment is provided with adhesive guiding holes for injecting thermal grease or potting compound. The PCB after adhesive guiding can bring better heat dissipation or higher structural strength.
[0063] 5. The thermally conductive copper substrate, high-frequency multilayer board, and FR-4 multilayer board of the stacked PCB are all treated with a special metal edge-wrapping process, which makes the PCB have better thermal conductivity and signal shielding capabilities.
[0064] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0065] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0066] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0067] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0068] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.
Claims
1. A stacked PCB, characterized by, The application relates to a stacked PCB, and relates to a high-frequency multilayer board, a heat-conducting copper substrate and an FR-4 multilayer board. The high-frequency multilayer board, the heat-conducting copper substrate and the FR-4 multilayer board are sequentially stacked. The heat-conducting copper substrate comprises a first mounting surface and a second mounting surface; the first mounting surface and the second mounting surface are oppositely arranged; the first mounting surface and the second mounting surface each comprise a plurality of pads; the first mounting surface comprises two or more mounting cavities; a boss is arranged between any two adjacent pads; the mounting cavities are used for placing a plurality of high-frequency multilayer boards with different functions; the pads of the first mounting surface are used for connecting the heat-conducting copper substrate and the high-frequency multilayer board, and the pads of the second mounting surface are used for connecting the heat-conducting copper substrate and the FR-4 multilayer board; the boss abuts against the high-frequency multilayer board and the FR-4 multilayer board. The high-frequency multilayer board and the FR-4 multilayer board each comprise at least one heat dissipation hole; the diameter of the heat dissipation hole is less than or equal to 0.5 mm.
2. The stacked PCB of claim 1, wherein, Any one of the high-frequency multilayer boards comprises a glue injection hole; the diameter of the glue injection hole is 1 mm-2 mm.
3. The stacked PCB of claim 1, wherein, The mounting cavities comprise insulating heat-conducting glue; the insulating heat-conducting glue is injected into the mounting cavities from the glue injection hole.
4. The stacked PCB of claim 1, wherein, The high-frequency multilayer board and the FR-4 multilayer board are each provided with a first edge covering; the first edge covering is arranged around the periphery of all components of the high-frequency multilayer board; the first edge covering is arranged around the periphery of all components of the FR-4 multilayer board.
5. The stacked PCB of claim 1, wherein, The heat-conducting copper substrate comprises a second edge covering; the second edge covering is arranged around the periphery of all pads of the heat-conducting copper substrate.
6. The stacked PCB of claim 5, wherein, The first edge covering and the second edge covering are both metal edge coverings.
7. The stacked PCB of claim 6, wherein, A method for manufacturing the stacked PCB of any one of claims 1-7, the method comprising:
8. A method of manufacturing a PCB, characterized by, S1, welding components to the FR-4 multilayer board and the high-frequency multilayer board at a first welding temperature; S2, mounting the FR-4 multilayer board on the second mounting surface of the heat-conducting copper substrate so that the boss between any two adjacent pads on the second mounting surface abuts against the FR-4 multilayer board, and welding the FR-4 multilayer board and the heat-conducting copper substrate at a third welding temperature; S3, mounting the high-frequency multilayer board on the first mounting surface of the heat-conducting copper substrate so that the boss between any two adjacent pads on the first mounting surface abuts against the high-frequency multilayer board, and welding the high-frequency multilayer board and the heat-conducting copper substrate at a second welding temperature to obtain the stacked PCB; wherein the first welding temperature is greater than the third welding temperature; and the third welding temperature is greater than the second welding temperature. The method further comprises:
9. The method of claim 8, wherein, S4, arranging a first edge covering and a second edge covering on all high-frequency multilayer boards and FR-4 multilayer boards; the first edge covering is arranged around the periphery of all components of the high-frequency multilayer board; and the second edge covering is arranged around the periphery of all components of the FR-4 multilayer board. The method further comprises:
10. The method of claim 8, wherein, S5, forming a glue injection hole on the high-frequency multilayer board and pouring insulating and heat-conducting glue from the glue injection hole to the mounting cavity, so that the insulating and heat-conducting glue fills the mounting cavity.