Water vapor generating mechanism, process chamber and semiconductor process equipment

Abstract

The invention discloses a water vapor generating mechanism, a process chamber and semiconductor process equipment, and belongs to the technical field of semiconductor processing. The process chamber comprises a cavity body and a cover body, the water vapor generating mechanism comprises a sealing flange, the sealing flange can be arranged in the cavity body in a sleeving manner, and the sealing flange can be connected with the cover body in a sealing manner so as to define a process chamber with the cavity body; the sealing flange is provided with an annular cooling channel, the sealing flange is further provided with a water inlet and an air outlet, and the cooling channel is communicated with a water source through the water inlet, so that water entering the cooling channel through the water inlet absorbs heat conducted to the sealing flange from the cavity to be converted into water vapor; the air outlet is formed in the top of the cooling channel so that water vapor generated in the cooling channel can be output into the process cavity through the air outlet. According to the water vapor generating mechanism, the problems that an existing process chamber needs to be externally connected with water vapor preparation equipment, the occupied space is relatively large, and the water vapor supply stability is relatively poor can be solved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor processing technology, specifically relating to a steam generating mechanism, a process chamber, and semiconductor process equipment. Background Technology

[0002] Photovoltaic diffusion furnaces are crucial equipment in the production of solar cells. Taking boron diffusion furnaces as an example, the process gases used in their operation typically include BCl3, O2, and N2, and the required process temperature is as high as 1050℃. Prolonged operation at high temperatures, coupled with BCl3 corrosion, significantly shortens the lifespan of the quartz chamber. To extend the lifespan of the quartz chamber, water vapor is usually introduced into the chamber during the process to lower the required process temperature, thereby reducing the operating temperature of the quartz chamber.

[0003] However, current photovoltaic diffusion furnaces such as boron diffusion furnaces usually require external steam preparation equipment. Since the design of such independent steam preparation equipment does not take into account its application scenario, the structure of the steam preparation equipment cannot be spatially adapted to the structure of the current photovoltaic diffusion furnace. On the one hand, this results in a relatively large installation space occupied by the steam preparation equipment. On the other hand, it requires a relatively long pipeline to connect with the photovoltaic diffusion furnace, which leads to severe steam heat dissipation and condensation, and relatively poor steam supply stability. Summary of the Invention

[0004] The purpose of this application is to provide a steam generating mechanism, a process chamber, and a semiconductor process equipment to solve the problems that current process chambers require external steam generation equipment, occupy relatively large spaces, and have relatively poor steam supply stability.

[0005] In a first aspect, this application discloses a steam generating mechanism applied to a process chamber. The process chamber includes a cavity and a cover. The steam generating mechanism includes a sealing flange, which can be sleeved on the cavity and can be sealed to the cover to form a process chamber with the cavity.

[0006] The sealing flange is provided with an annular cooling channel. The sealing flange is also provided with a water inlet and an air outlet. The cooling channel is connected to a water source through the water inlet so that the water entering the cooling channel through the water inlet absorbs the heat conducted by the cavity to the sealing flange and converts it into water vapor.

[0007] The air outlet is located at the top of the cooling channel to output the water vapor generated in the cooling channel to the process chamber.

[0008] Secondly, this application discloses a process chamber, which includes a cavity, a cover, a sealing ring, and the aforementioned steam generating mechanism. The sealing flange is sleeved outside the cavity, and the cover and the sealing flange are sealed together by the sealing ring. The cover, the sealing flange, and the cavity form a process chamber, and the vent of the sealing flange is connected to the process chamber.

[0009] Thirdly, embodiments of this application disclose a semiconductor process apparatus, which includes the aforementioned process chamber.

[0010] This application discloses a steam generating mechanism that can be applied to a process chamber. The sealing flange of the steam generating mechanism can be fitted onto the cavity of the process chamber, and the cover of the process chamber can be sealed at the opening of the cavity. Thus, the cover and the sealing flange are connected to each other, so that the cover and the cavity can form a reliable assembly relationship. At the same time, the sealing flange and the cover can form a sealed connection relationship by setting a sealing ring, thereby making the cavity, the sealing flange and the cover form a relatively sealed process chamber.

[0011] Furthermore, to prevent the high-temperature environment from adversely affecting the service life and sealing effect of the sealing ring, the sealing flange is also equipped with an annular cooling channel. Water is introduced into the cooling channel as a coolant to cool the sealing ring. In addition, the sealing flange is also equipped with an air outlet and a water inlet that are connected to the cooling channel, allowing water to be introduced into and replenished into the cooling channel through the water inlet. After being introduced into the cooling channel, the cooling water absorbs the heat conducted from the cavity to the sealing flange and converts it into water vapor.

[0012] Meanwhile, the air outlet is located at the top of the cooling channel, allowing the water vapor formed by the heat absorption of water in the cooling channel to be output outside the cooling channel. Correspondingly, by connecting the air outlet to the process chamber, the water vapor can be transported into the process chamber and participate in the corresponding process, reducing the process temperature of the process chamber and thus extending the service life of the entire process chamber. Of course, if the water vapor generated in the cooling channel is transported to the process chamber through the air outlet, causing a decrease in the water volume in the cooling channel, water can be replenished through the water inlet to ensure that the water volume in the cooling channel always meets the demand. This ensures the continued demand for water vapor in the process chamber and also guarantees a relatively good cooling effect on the sealing ring. Attached Figure Description

[0013] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0014] Figure 1 This is a schematic diagram of the structure of the process chamber disclosed in the embodiments of this application;

[0015] Figure 2 This is a schematic diagram illustrating the working process of a portion of the structure in the process chamber disclosed in the embodiments of this application;

[0016] Figure 3 This is a schematic diagram of a portion of the structure of the process chamber disclosed in the embodiments of this application;

[0017] Figure 4 This is a cross-sectional schematic diagram of a portion of the structure in the process chamber disclosed in an embodiment of this application.

[0018] Figure label:

[0019] 110-Cavity, 120-Cover, 131-First Flange, 132-Second Flange, 133-Cooling Channel, 140-Water Steam Supply Flange, 141-Preparation Chamber, 150-Sealing Ring, 160-Water Tank, 170-Gas Tank, 180-Connecting Joint

[0020] 210 - Water inlet pipe, 221 - First branch, 222 - Second branch, 230 - Condenser pipe, 240 - Air inlet pipe, 250 - Reducer pipe, 260 - Water supply pipe, 270 - Air supply pipe, 280 - Air delivery pipe

[0021] 311-First control valve, 312-Second control valve, 313-Third control valve, 314-Fourth control valve, 321-First check valve, 322-Second check valve, 323-Third check valve, 331-Pressure booster valve, 332-Pressure reducing valve, 340-Safety relief valve.

[0022] 410 - Level gauge, 420 - Pressure gauge, 430 - Steam filter, 440 - Flow controller. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0025] like Figures 1-4 As shown in the figure, this application discloses a steam generating mechanism that can be applied to a process chamber, which can be further applied to semiconductor process equipment such as a photovoltaic diffusion furnace. The process chamber includes a cavity 110 and a cover 120. Of course, the process chamber may also include other mechanisms and devices, such as a support device for carrying the workpiece to be processed, etc., which are not limited herein.

[0026] In the process chamber, the cavity 110 is the main structure of the process chamber, which is used to provide a space for the workpiece to be processed and the process space. The specific shape of the cavity 110 can be flexibly selected according to actual needs, and this document does not limit it. In a specific embodiment of this application, the cavity 110 can be a cylindrical structure, and one end of the cavity 110 is provided with a cavity opening so that the workpiece to be processed and the supporting device can be installed into the cavity 110 through the cavity opening.

[0027] Of course, in order to ensure that the process chamber can form a sealed process chamber, as mentioned above, the process chamber disclosed in the embodiments of this application includes a cover 120 and a steam generating mechanism. The steam generating mechanism includes a sealing flange. Optionally, in order to improve the sealing reliability of the process chamber, the process chamber may also include a sealing ring 150 and other devices.

[0028] In detail, a sealing flange can be fitted onto the cavity 110 to connect with the cover 120, preventing direct connection between the cavity 110 and the cover 120 and thus avoiding damage to the overall structure of the cavity 110. Correspondingly, the cover 120 is positioned to seal the opening of the cavity 110 and connects to the sealing flange, thereby enabling a reliable assembly relationship between the cover 120 and the cavity 110. Simultaneously, by sandwiching a sealing ring 150 between the sealing flange and the cover 120, the sealing ring 150 provides a sealing connection between the sealing flange and the cover 120, thereby forming a sealed assembly relationship between the cavity 110, the sealing flange, and the cover 120, and correspondingly forming a process cavity. That is, the sealing flange can be sealed to the cover 120 and together with the cavity 110, form a process cavity.

[0029] More specifically, the sealing flange can be embedded in the cavity 110, that is, a part of the sealing flange can be embedded inside the cavity 110, and the other part of the sealing flange can be sleeved on the outside of the cavity 110, wherein, for example Figure 4 As shown, in the radial direction of the cavity 110, the portion of the sealing flange embedded in the cavity 110 completely covers the sealing ring 150 to block radiant heat passing through the cavity 110, reduce the temperature at the sealing ring 150, and provide protection. In this case, by forming a fixed connection relationship between the sealing flange and the cavity 110, such as a threaded connection, a stable assembly relationship can be formed between the sealing flange and the cavity 110.

[0030] Of course, to ensure a stable sealing relationship between the sealing flange and the cavity 110, welding or other methods can be used to establish a fixed connection between the sealing flange and the cavity 110. In this case, the cavity 110 and the sealing flange can be connected to each other using bolts or other fasteners. By clamping the sealing ring 150 between the cavity 110 and the sealing flange, a sealed connection can be formed between the cavity 110, the sealing flange, and the cover 120, thus enclosing the process cavity. Furthermore, to prevent the sealing ring 150 from rolling during installation and operation, grooves can be provided on the side of the cover 120 facing the sealing flange and / or on the side of the sealing flange facing the cover 120, with a portion of the sealing ring 150 located within the groove, thus restricting the position of the sealing ring 150.

[0031] As described above, a sealing connection can be formed between the sealing flange and the cover 120 via a sealing ring 150. Typically, the sealing ring 150 is made of a material with good elasticity, such as rubber. However, since the temperature during the operation of the process chamber is usually relatively high, the temperature at the location between the cover 120 and the sealing flange where the sealing ring 150 is located is also relatively high. This has a significant negative impact on the service life and sealing effect of the sealing ring 150. Therefore, in the process chamber disclosed in this application embodiment, the sealing flange is also provided with an annular cooling channel 133. By filling the cooling channel 133 with cooling liquid, the sealing ring 150 can be cooled, thereby reducing its temperature and improving its service life and sealing effect.

[0032] Of course, the aforementioned method of cooling the sealing ring 150 using the cooling channel 133 is relatively common and is also reflected in current related process chambers. However, the current cooling channel 133 is usually directly connected to the coolant source, and the coolant is continuously replaced by flowing within the cooling channel 133. Although this cooling method has a relatively good cooling effect on the sealing ring 150, it requires continuous circulation of coolant, and the heat absorbed by the coolant is usually not utilized, resulting in heat waste. Furthermore, the continuous circulation of coolant also leads to a significant increase in process costs. Therefore, the current method of cooling the sealing ring 150 in process chambers suffers from energy waste and a significant increase in process costs.

[0033] The inventors of this application discovered the above-mentioned technical problems based on the current process chamber, and further discovered during the production process that the current process chamber is also incompatible with the external steam preparation equipment, resulting in the steam preparation equipment occupying a large amount of space, and the steam releases heat and condenses during transportation, causing the steam supply to be unstable. To address the aforementioned problems, the inventors, through creative work, proposed that the structure of the current sealing flange can be improved to utilize the energy of the cooling sealing ring 150 to generate steam, and the generated steam can be directly used in the process process within the process chamber. On the one hand, this can achieve waste heat reuse, improve energy utilization efficiency, conform to the concept of green environmental protection, and reduce process costs. On the other hand, since the sealing flange itself is connected to the cavity 110 and the cover 120, there is essentially no spatial gap between the three. Therefore, the steam generated by the sealing flange can be quickly introduced into the process chamber, thereby significantly shortening the steam transportation distance, preventing significant exothermic condensation during steam transportation, and improving the stability of steam supply. Furthermore, when adopting the technical solution disclosed in the embodiments of this application, since the steam generation equipment (i.e., the steam generating mechanism proposed in the embodiments of this application) is itself part of the original structure of the process chamber, the steam generation equipment basically does not require additional installation space and facilitates the relocation of the entire process chamber.

[0034] Therefore, in the steam generating mechanism disclosed in this application embodiment, its sealing flange is provided with an annular cooling channel 133. The cooling channel 133 can be filled with water as a coolant. Of course, the specific dimensions and cross-sectional shape of the cooling channel 133 can be flexibly selected according to actual needs, and this document does not limit this. At the same time, the sealing flange is also provided with an air outlet and a water inlet that are both connected to the cooling channel 133. The cooling channel 133 can be connected to a water source through the water inlet, so that cooling water can be transported into the cooling channel 133 through the water inlet. Correspondingly, the water entering the cooling channel 133 through the water inlet can absorb the heat conducted from the cavity 110 to the sealing flange, thereby converting it into steam.

[0035] Meanwhile, the air outlet is located at the top of the cooling channel 133, so that during the process, the water vapor generated by the water absorbed by the cooling channel 133 can flow to the top of the annular cooling channel 133 and be output through the air outlet. Therefore, in order to achieve the technical purpose of utilizing water vapor, by connecting the air outlet to the process chamber, the water vapor generated in the cooling channel 133 can be output through the air outlet to the process chamber and participate in the corresponding process, thereby reducing the process temperature to achieve normal process effect. The temperature of the cavity 110, cover 120 and sealing flange and other devices is also reduced accordingly, thereby improving the service life of the entire process chamber.

[0036] It should be noted that although the wet oxygen process with added water vapor can lower the process temperature, the reduction is limited, typically around 50°C. However, the process temperature for processing solar cells and other devices in the process chamber is usually around 1000°C. Therefore, the reduction in temperature of the cavity 110, cover 120, and sealing flange due to the introduction of water vapor during the process is also limited. Furthermore, since the boiling point of water at atmospheric pressure is 100°C, which is significantly different from the process temperature inside the process chamber, the reduction in process temperature has virtually no adverse effect on the process of preparing water vapor using the sealing flange.

[0037] Considering that water vapor entering the process chamber from the outlet will reduce the amount of water in the cooling channel 133, water can be added to the cooling channel 133 via the inlet. As mentioned above, the outlet is located at the top of the cooling channel 133. To prevent the presence of water vapor from hindering the water replenishment process, the inlet can usually not be located at the top of the cooling channel 133; for example, the inlet can be located on the side of the cooling channel 133. In a specific embodiment of this application, to prevent the water added to the cooling channel 133 from hindering the water vapor production process, the inlet can be located at the bottom of the cooling channel 133, so that relatively low-temperature water can be sent into the cooling channel 133 through the bottom.

[0038] This application discloses a steam generating mechanism that can be applied to a process chamber. The sealing flange of the steam generating mechanism can be sleeved on the cavity 110 of the process chamber, and the cover 120 of the process chamber can be sealed at the opening of the cavity 110. Thus, the cover 120 and the sealing flange are interconnected, so that the cover 120 and the cavity 110 can form a reliable assembly relationship. At the same time, the sealing flange and the cover 120 can form a sealed connection relationship by setting a sealing ring, thereby making the cavity 110, the sealing flange and the cover 120 form a relatively sealed process chamber.

[0039] Furthermore, to prevent the high-temperature environment from adversely affecting the service life and sealing effect of the sealing ring 150, an annular cooling channel 133 is provided on the sealing flange. Water is introduced into the cooling channel 133 as a coolant to cool the sealing ring 150. In addition, the sealing flange is also provided with an air outlet and a water inlet that are connected to the cooling channel 133, so that water can be introduced into the cooling channel 133 through the water inlet to replenish the cooling water. After being introduced into the cooling channel 133, the cooling water can absorb the heat conducted from the cavity 110 to the sealing flange and convert it into water vapor.

[0040] Meanwhile, the air outlet is located at the top of the cooling channel 133, allowing the water vapor formed by the water in the cooling channel 133 due to heat absorption to be output outside the cooling channel 133 through the air outlet. Correspondingly, by connecting the air outlet to the process chamber, the water vapor can be transported into the process chamber and participate in the corresponding process, reducing the process temperature of the process chamber and thus improving the service life of the entire process chamber. Of course, when the water vapor generated by the water in the cooling channel 133 is transported to the process chamber through the air outlet, causing a decrease in the water volume in the cooling channel 133, water can be replenished to the cooling channel 133 through the water inlet to ensure that the water volume in the cooling channel 133 always meets the demand. On the one hand, this ensures the subsequent demand for water vapor in the process chamber, and on the other hand, it also ensures that the cooling effect on the sealing ring 150 is always relatively good.

[0041] As described above, after some of the water in the cooling channel 133 forms water vapor which is introduced into the process chamber through the outlet, the amount of water in the cooling channel 133 will decrease accordingly. In this case, a corresponding amount of water can be added to the cooling channel 133 through the inlet to ensure that the water in the cooling channel 133 can always provide the required cooling effect for the sealing ring 150. In order to ensure that the water in the cooling channel 133 can completely surround the sealing ring 150, in a specific embodiment of this application, a level gauge 410 can be installed in the cooling channel 133, and the level gauge 410 can monitor the level in the cooling channel 133. Once the level in the cooling channel 133 is lower than the preset level L1, water can be added to the cooling channel 133 through the inlet. Specifically, the preset liquid level can be higher than the lower surface of the top portion of the cooling channel 133. In this case, by making the liquid level in the cooling channel 133 higher than the lower surface of the top portion of the cooling channel 133, it can be ensured that the water in the cooling channel 133 is a complete ring, thereby ensuring that any part of the sealing ring 150 can be cooled by the water in the cooling channel 133.

[0042] In the above embodiments, the water inlet can be directly connected to the water source through a pipeline. In another embodiment of this application, the steam generating mechanism may also include a water storage tank 160 and a water inlet pipe 210. The water storage tank 160 is connected to the water inlet of the sealing flange through the water inlet pipe 210. At the same time, the water storage tank 160 is also connected to the water source, so that the water source is indirectly connected to the cooling channel 133 of the sealing flange through the water storage tank 160. The water storage tank 160 provides a buffering effect to prevent water with relatively high pressure in the water source from being directly introduced into the cooling channel 133, which would cause a large impact on the original water and steam in the cooling channel 133, thereby improving the reliability of the steam generating mechanism.

[0043] Of course, in the design and assembly process of the steam generating mechanism disclosed in this application embodiment, it is necessary to ensure that a portion of the water storage tank 160 is set higher than the cooling channel 133, so that the water in the water storage tank 160 can flow into the cooling channel 133 under the principle of communicating vessels, so that the liquid level in the cooling channel 133 and the water storage tank 160 are flush, and both are higher than the lower surface of the top portion of the cooling channel 133. Similarly, when the steam generating mechanism is equipped with a water storage tank 160, a level gauge 410 also needs to be set accordingly. Specifically, a level gauge 410 is provided on the water storage tank 160. Correspondingly, the level gauge 410 has a preset liquid level and can detect the actual liquid level in the water storage tank 160. When the liquid level detected by the level gauge 410 is lower than the preset liquid level, the water source is controlled to replenish water to the water storage tank 160.

[0044] More specifically, a first control valve 311 is provided between the water source and the water storage tank 160. The first control valve 311 is connected to the level gauge 410 to control the on / off state between the water source and the water storage tank 160. When the liquid level detected by the level gauge 410 is lower than the preset liquid level, the first control valve 311 is opened to connect the water source and the water storage tank 160, allowing the water source to replenish the water storage tank 160. Of course, to prevent excessive replenishment, the level gauge 410 is also equipped with an alarm liquid level L2. When the alarm liquid level is higher than the preset liquid level, and the liquid level detected by the level gauge 410 exceeds the alarm liquid level, the water source is controlled to stop replenishing the water storage tank 160, that is, the first control valve 311 is closed, thereby disconnecting the connection between the water source and the water storage tank 160. Specifically, the alarm liquid level can be equal to or higher than the upper surface of the top portion of the cooling channel 133. Of course, the alarm liquid level needs to be equal to or lower than the highest liquid level of the water storage tank 160 to prevent the water storage tank 160 from overflowing.

[0045] In addition, to prevent water vapor in the cooling channel 133 from flowing back from the water inlet pipe 210 through the water storage tank 160 to the water source, which would adversely affect the safety of the water vapor generating mechanism, the water vapor generating mechanism disclosed in this application embodiment is also provided with a first one-way valve 321. The first one-way valve 321 is located between the water source and the first control valve 311. More specifically, the water storage tank 160 is connected to the water source through the water supply pipe 260. The first control valve 311 and the first one-way valve 321 are both located on the water supply pipe 260, and the first control valve 311 is located between the first one-way valve 321 and the water storage tank 160.

[0046] As described above, the water in the cooling channel 133 absorbs heat from the sealing flange and turns into water vapor, which can be transported to the process chamber through the air outlet. Considering that the process does not always require water vapor, a second control valve 312 can be installed between the air outlet and the process chamber. The second control valve 312 is used to control the connection between the air outlet and the process chamber. When water vapor is needed, the second control valve 312 is opened, and when water vapor is not needed, the second control valve 312 is closed to disconnect the connection between the air outlet and the process chamber.

[0047] More specifically, the outlet and the process chamber can be connected via a gas supply pipe 280. In this case, the second control valve 312 can be installed on the gas supply pipe 280. Similarly, to prevent process gases in the process chamber from flowing back into the cooling channel 133 via the gas supply pipe 280, the steam generating mechanism disclosed in this embodiment can also include a second check valve 322, which is also installed on the gas supply pipe 280 and positioned between the process chamber and the second control valve 312.

[0048] To further improve the stability of water vapor delivered to the process chamber, in one specific embodiment of this application, the water vapor generating mechanism may further include a storage tank 170, which is connected to an outlet so that the water vapor generated in the cooling channel 133 can be temporarily stored in the storage tank 170. Specifically, the storage tank 170 and the outlet can be connected via an inlet pipe 240. Simultaneously, the storage tank 170 is also connected to the process chamber via a gas delivery pipe 280. This allows the water vapor stored in the storage tank 170 to be delivered to the process chamber when water vapor is required in the process. This improves the stability of the water vapor delivered to the process chamber and also allows the storage tank 170 to regulate the water vapor generated in the cooling channel 133. More specifically, in order to facilitate the connection between the gas storage tank 170 and the gas transmission pipe 280, the top of the gas storage tank 170 may be provided with a connecting joint 180, and one end of the gas transmission pipe 280 may be plugged into the connecting joint 180.

[0049] To further enhance the regulation of water vapor, in this embodiment, the water vapor generating mechanism also includes a condenser pipe 230, and the gas storage tank 170 is also connected to the water storage tank 160 through the condenser pipe 230, which makes the gas storage tank 170, the water storage tank 160, and the cooling pipeline form a closed loop. Specifically, the water vapor generated in the cooling channel 133 can enter the gas storage tank 170. After the water vapor stored in the gas storage tank 170 reaches a certain amount, the water vapor can flow to the water storage tank 160 through the condenser pipe 230. During the flow, it releases heat and condenses into liquid water, replenishing the water storage tank 160. Simultaneously, after some water in the cooling channel 133 is heated and converted into water vapor, the liquid level in the cooling channel 133 drops, and the water in the water storage tank 160 can be replenished under the principle of communicating vessels, thus forming a closed loop of water circulation.

[0050] By adopting the above technical solution, the temperature and pressure of the water vapor stored in the gas storage tank 170 can be controlled according to actual needs, thereby further improving the stability of the water vapor delivered to the process chamber and ensuring that the water vapor temperature is closer to the required temperature, thus improving the process effect. Specifically, based on the saturated vapor pressure characteristics of liquids, in a closed environment with constant temperature, when the amount of liquid vaporization equals the amount of water vapor liquefaction, the pressure of the water vapor is the saturated vapor pressure of the liquid. Of course, the saturated vapor pressure of a liquid differs at different temperatures; in other words, the value of the saturated vapor pressure of a liquid corresponds to its temperature. Therefore, the temperature of the steam can be controlled by controlling the pressure of the steam in a closed environment.

[0051] In the steam generating mechanism disclosed in this application embodiment, when it is not necessary to introduce steam into the process chamber, if the temperature of the steam required in the process is T0, the corresponding saturated steam pressure of pure water at temperature T0 is P0. In the actual process, the pressure in the closed loop can be increased by adding water to the cooling channel 133 through the water inlet. Conversely, the pressure in the closed loop can be reduced by releasing a certain amount of steam through the air outlet, thereby ensuring that the pressure in the closed loop meets P0. In this case, the temperature of the steam in the closed loop is basically at T0. Therefore, when steam is required in the process, steam at temperature T0 can be directly supplied to the process chamber to improve the process effect. Of course, in order to obtain the pressure value in the closed loop, a pressure gauge 420 or other pressure detection device can be installed in the closed loop. The pressure gauge 420 can be specifically installed on the gas storage tank 170.

[0052] To reduce the difficulty of pressure regulation in the closed loop, the steam generating mechanism disclosed in this application may further include a pressure boosting valve 331 and a pressure reducing valve 332, both of which can be installed on the gas storage tank 170. Thus, when it is necessary to regulate the pressure in the closed loop, the actual pressure in the closed loop can be directly changed through the pressure boosting valve 331 and the pressure reducing valve 332. The pressure reducing valve 332 can be directly connected to the atmospheric environment, while the pressure boosting valve 331 needs to be connected to a pressure boosting device, specifically a plant pressure boosting pipeline. This allows the plant pressure boosting pipeline to increase the pressure in the closed loop via the pressure boosting valve 331 when it is necessary to increase the pressure in the closed loop.

[0053] In this case, the pressure in the closed loop can be controlled by the pressure boosting valve 331 and the pressure reducing valve 332. Correspondingly, if it is necessary to change the temperature of the steam when the steam pressure in the closed loop remains constant, the pressure in the closed loop can be controlled by the pressure boosting valve 331 and the pressure reducing valve 332 to achieve the purpose of regulating the temperature of the steam in the closed loop. In addition, the saturated vapor pressure of pure water at different temperatures is shown in the table below.

[0054] Table of Pure Water Saturated Vapor Pressure and Temperature (Partial)

[0055]

[0056] Furthermore, to prevent the pressure in the closed-loop circuit from continuously rising due to the unexpected loss of pressure control capability of the devices in the closed loop, the steam generating mechanism disclosed in this application embodiment may also include a safety relief valve 340, which is connected to the gas storage tank 170. This allows the safety relief valve 340 to reduce the pressure when it exceeds the rated pressure, thereby improving the safety of the steam generating mechanism. More specifically, the safety relief valve 340 may be connected to the plant exhaust system, allowing the steam generated by the pressure relief to be discharged into the plant exhaust system.

[0057] Similarly, to prevent liquid water in the condenser 230 from flowing back into the gas storage tank 170 and adversely affecting the stability of the water vapor in the gas storage tank 170, the water vapor generating mechanism disclosed in this application embodiment may further include a third one-way valve 323, which is connected between the condenser 230 and the gas storage tank 170. Of course, a valve may also be provided between the gas storage tank 170 and the condenser 230, specifically a third control valve 313, which may be located between the third one-way valve 323 and the condenser 230. During normal operation of the process chamber, the third control valve 313 is in the open state to ensure that the water vapor in the gas storage tank 170 can flow to the condenser 230 via the third one-way valve 323 and the third control valve 313. Furthermore, when there is a low pressure in the gas storage tank 170, the third control valve 313 can be closed to ensure that the pressure regulation process in the closed loop can proceed normally.

[0058] As described above, water vapor in the gas storage tank 170 can flow into the condenser tube 230 to release heat and condense, and then be converted into liquid water that flows into the water storage tank 160. To increase the flow rate of water vapor in the condenser tube 230 and improve its heat release and condensation effect, in one specific embodiment of this application, the water vapor generating mechanism may further include a reducing pipe 250, which is connected between the gas storage tank 170 and the condenser tube 230. Simultaneously, by reducing the flow rate of the reducing pipe 250 in the flow direction from the gas storage tank 170 to the condenser tube 230, some of the internal energy of the water vapor in the gas storage tank 170 can be converted into kinetic energy as it flows from the reducing pipe 250 to the condenser tube 230, increasing the flow rate of the water vapor and allowing it to quickly enter the condenser tube 230 for convective heat dissipation.

[0059] Of course, to improve the smoothness of water vapor flow from the storage tank 170 to the condenser tube 230, the flow rate of the reducer tube 250 can be gradually reduced. The range of flow rate variation in the reducer tube 250 is not limited herein and can be flexibly selected according to actual conditions. Furthermore, the structure of the condenser tube 230 can also be flexibly selected according to actual needs. In one specific embodiment of this application, the condenser tube 230 can be a serpentine pipe, thereby improving the condensation effect of the condenser tube 230. Of course, the ability of the condenser tube 230 to dissipate water vapor can also be further improved by installing heat sinks on the outer wall of the condenser tube 230.

[0060] As described above, by including a water storage tank 160, a gas storage tank 170, and a condenser 230 in the steam generating mechanism, these components can form a closed loop with the cooling channel 133. Furthermore, by controlling the pressure within the closed loop, the temperature of the steam in the gas storage tank 170 can be controlled. In this case, if a portion of the steam is used in the process, the pressure in the closed loop will decrease, thereby disrupting the steam balance within the closed loop. In a specific embodiment of this application, water can be continuously converted into steam by replenishing the water storage tank 160 and the cooling channel 133 with water from a water source, replenishing the steam lost in the closed loop until the pressure in the closed loop returns to its original level, and ensuring that the temperature of the steam in the closed loop still meets the required temperature.

[0061] Considering that the rate of water vapor generated by the above technical solution is relatively small and the time required to re-achieve pressure balance in the closed loop is relatively long, in another embodiment of this application, the water vapor generating mechanism may further include a water vapor replenishment flange 140 and a gas replenishment pipe 270. The water vapor replenishment flange 140 may be sleeved outside the cavity 110. The water vapor replenishment flange 140 is provided with a preparation cavity 141 for preparing water vapor. Meanwhile, the first end of the gas supply pipe 270 is connected to the cooling channel 133, and the second end of the gas supply pipe 270 is connected to the preparation chamber 141. The second end is set higher than the first end, and the first end and the second end can be connected intermittently. Thus, after water vapor is used in the process, the liquid water in the cooling channel 133 can flow into the gas supply pipe 270 through the first end of the gas supply pipe 270 and fill the preparation chamber 141 through the second end of the gas supply pipe 270 by connecting the first end and the second end of the gas supply pipe 270. Since the water vapor replenishment flange 140 is also in contact with the cavity 110, the temperature of the water vapor replenishment flange 140 is relatively high. Once the liquid water is filled into the preparation chamber 141 of the water vapor replenishment flange 140, it can absorb heat and be converted into water vapor in a short time. The water vapor then flows back into the gas supply pipe 270 from the second end of the gas supply pipe 270 and flows into the cooling channel 133 through the first end of the gas supply pipe 270, thus achieving the purpose of quickly replenishing the water vapor in the gas storage tank 170.

[0062] Of course, considering that the water in the preparation chamber 141 is introduced from the cooling channel 133, in order to ensure that the water in the cooling channel 133 can be reliably introduced into the preparation chamber 141, the second end of the air supply pipe 270 needs to be lower than the preset liquid level of the cooling channel 133. This ensures that, under the action of the communicating vessel, when the first and second ends of the air supply pipe 270 are connected, the water in the cooling channel 133 can be introduced into the preparation chamber 141, absorb the heat from the water vapor replenishing flange 140, quickly convert it into water vapor, and allow the water vapor to flow back to the cooling channel 133 via the air supply pipe 270 and replenish the air storage tank 170. Furthermore, in the above embodiment, the water inlet can be located at the bottom of the cooling channel 133. In this case, the first end of the air supply pipe 270 can be adjacent to the water inlet on the cooling channel 133, resulting in a relatively large liquid level difference between the first and second ends of the air supply pipe 270, which is beneficial for replenishing water to the preparation chamber 141 via the cooling channel 133.

[0063] Similarly, the on / off relationship between the first and second ends of the air supply pipe 270 can be controlled by installing a control valve on the air supply pipe 270. Specifically, the air supply pipe 270 is equipped with a fourth control valve 314. More specifically, for the convenience of overall control of the process chamber, the aforementioned first control valve 311, second control valve 312, third control valve 313, and fourth control valve 314 can all be pneumatic valves. Of course, other types of valves can be used when other requirements exist, and this article does not limit this.

[0064] As described above, the water vapor generated in the cooling channel 133 can be transported to the process chamber through the outlet and the gas supply pipe 280. To ensure the cleanliness of the generated water vapor, the water introduced into the cooling channel 133 can be pure water. To further improve the cleanliness of the water vapor transported to the process chamber through the outlet, in a specific embodiment of this application, the process chamber may further include a water vapor filter 430, and the water vapor filter 430 may be installed in the gas supply pipe 280, thereby using the water vapor filter 430 to filter the water vapor transported in the gas supply pipe 280, so as to further improve the cleanliness of the water vapor transported to the process chamber to participate in the process, thereby improving the process effect.

[0065] As mentioned above, the process does not continuously require water vapor. To further improve the process effect, the process chamber disclosed in this application embodiment may also include a flow controller 440, which is installed on the gas supply pipe 280. The flow controller 440 can control the flow rate of water vapor delivered from the gas supply pipe 280 to the process chamber, making the amount of water vapor delivered to the process chamber more precise, thereby improving the process effect. Additionally, a second control valve 312 may be provided on the gas supply pipe 280, which can control the opening and closing of the gas supply pipe 280. Therefore, in this application embodiment, the flow controller 440 can be connected to the second control valve 312. When the measured value of the flow controller 440 meets the preset flow rate, the second controller is closed, thereby stopping the delivery of water vapor from the gas supply pipe 280 to the process chamber.

[0066] As described above, during the assembly of the process chamber including the steam generating mechanism, a portion of the sealing flange can be embedded within the cavity 110, and another portion can be fitted outside the cavity 110. The cover 120 can be indirectly connected to the cavity 110 by connecting to the sealing flange. More specifically, in this embodiment, the sealing flange includes a first flange 131 and a second flange 132. Both the first flange 131 and the second flange 132 are provided with a cooling channel 133, an air outlet, and a water inlet. Each water inlet is connected to a water source, and each air outlet is connected to the process chamber. Correspondingly, each air outlet and each water inlet are respectively provided on the first flange 131 and the second flange 132 and are connected to the corresponding cooling channel 133. Of course, each water inlet is directly or indirectly connected to a water source, and each air outlet is directly or indirectly connected to the process chamber. Furthermore, either the first flange 131 or the second flange 132 can be provided with multiple air outlets to improve the steam generation efficiency in the cooling channel 133.

[0067] In this embodiment, by providing air outlets for the cooling channels 133 on both the first flange 131 and the second flange 132, the utilization efficiency of waste heat generated during the process can be further improved. Additionally, the reusability of the current process chamber structure can be further enhanced, and the steam generation efficiency can be increased. Furthermore, in the above embodiment, the steam generating mechanism may include a water storage tank 160, which is connected to the cooling channel 133 via a water inlet pipe 210. When the sealing flanges include the first flange 131 and the second flange 132, the steam generating mechanism may also include a first branch 221 and a second branch 222. One end of each branch 221 and branch 222 is connected to the end of the water inlet pipe 210 away from the water storage tank 160. The other end of the first branch 221 is connected to the water inlet of the first flange 131, and the other end of the second branch 222 is connected to the water inlet of the second flange 132.

[0068] More specifically, the first flange 131 has a groove, and a portion of the cavity 110 can be embedded in the groove, allowing a portion of the first flange 131 to be embedded within the cavity 110, while the remaining portion of the first flange 131 is sleeved outside the cavity 110. The embedded portion completely covers the sealing ring 150, blocking radiant heat transmitted through the cavity 110 to reduce the temperature at the sealing ring 150, thus providing protection. The second flange 132 can be sleeved outside the cavity 110, forming a fixed connection with the first flange 131 via a threaded connection. The flange assembly consisting of the first flange 131 and the second flange 132 contacts the cavity 110 by pressing the sealing ring 150, relying on the friction between the sealing ring 150 and the cavity 110 to form a connection. Of course, to ensure a stable connection between the sealing flange and the cavity 110, for example, for a quartz cavity, a quartz flange can be welded to the cavity opening of the quartz cavity 110, and two sets of metal sealing flanges can be used to clamp the quartz flange, thus forming a fixed connection between the sealing flange and the cavity 110. In this case, the two sealing flanges can be connected to each other using bolts or other fasteners to form a fixed connection.

[0069] Accordingly, to ensure relatively high sealing reliability of the process cavity, a sealing ring 150 can be sandwiched between the second flange 132 and the first flange 131, and a sealing ring 150 can also be sandwiched between the first flange 131 and the cover 120. This utilizes multiple sealing rings 150 to ensure a good sealing fit between the first flange 131 and the second flange 132, as well as between the first flange 131 and the cover 120, thus forming a process cavity with relatively high sealing reliability. Correspondingly, the water flowing through the cooling channels 133 respectively provided on the first flange 131 and the second flange 132 can provide cooling for the corresponding sealing rings 150, ensuring relatively high sealing performance and service life for each sealing ring 150.

[0070] Based on the steam generating mechanism disclosed in any of the above embodiments, this application also provides a process chamber, which includes a cavity, a cover, a sealing ring, and any of the above-mentioned steam generating mechanisms. The sealing flange of the steam generating mechanism is sleeved outside the cavity, the cover and the sealing flange are sealed together by the sealing ring, and the cover, the sealing flange, and the cavity form a process chamber. The outlet of the sealing flange communicates with the process chamber, so that during the process, the steam generated in the cooling channel of the sealing flange can be input into the process chamber through the outlet.

[0071] As described above, the cover 120 can form a sealed connection with the cavity 110 through the sealing flange and sealing ring 150, and the together form a process cavity. The cooling channel 133 of the sealing flange can communicate with the process cavity through its air outlet. In the specific assembly process, the air outlet and the process cavity can be connected by the air supply pipe 280. More specifically, an opening can be provided on the side wall of the cavity 110, and the air supply pipe 280 can be connected between the sealing flange and the cavity 110. In another embodiment of this application, in order to ensure relatively high structural reliability of the cavity 110 and reduce the difficulty of improving the current process cavity, an air inlet can be provided on the cover 120, and one end of the air supply pipe 280 can be connected to the air outlet, and the other end can be connected to the air inlet of the cover 120, so as to realize the purpose of transporting water vapor to the process cavity.

[0072] Based on the process chamber disclosed in any of the above embodiments, this application also discloses a semiconductor process apparatus that includes the above-described process chamber.

[0073] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0074] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A water vapor generating mechanism applied to a process chamber, the process chamber comprising a cavity and a cover, characterized in that, The water vapor generating mechanism comprises a sealing flange, which can be sleeved on the cavity and sealedly connected with the cover to form a process cavity with the cavity; The sealing flange is provided with an annular cooling channel, and is further provided with a water inlet and a gas outlet. The cooling channel is communicated with a water source through the water inlet, so that water entering the cooling channel through the water inlet absorbs heat conducted from the cavity to the sealing flange and is converted into water vapor. The gas outlet is arranged at the top of the cooling channel to output water vapor generated in the cooling channel to the process cavity through the gas outlet.

2. The water vapor generating mechanism according to claim 1, wherein The water vapor generating mechanism further comprises a water storage tank and a water inlet pipe. The water storage tank is communicated with the water inlet through the water inlet pipe, and is further communicated with a water source. The water storage tank is provided with a liquid level gauge. When the detected liquid level of the liquid level gauge is lower than a preset liquid level, the water source is controlled to supplement water to the water storage tank.

3. The water vapor generating mechanism according to claim 2, wherein The water vapor generating mechanism further comprises a gas storage tank and a condensing pipe. The gas storage tank is communicated with the gas outlet, and is further communicated with the process cavity. The gas storage tank is further communicated with the water storage tank through the condensing pipe.

4. The water vapor generating mechanism according to claim 3, wherein The water vapor generating mechanism further comprises a pressure increasing valve and a pressure reducing valve, both of which are arranged in the gas storage tank. The water vapor generating mechanism further comprises a variable diameter pipe, which is connected between the gas storage tank and the condensing pipe. In the flow direction from the gas storage tank to the condensing pipe, the diameter of the variable diameter pipe decreases. The water vapor generating mechanism further comprises a safety pressure relief valve, which is installed in the gas storage tank.

5. The water vapor generating mechanism according to claim 3, wherein The water vapor generating mechanism further comprises a water vapor supplement flange and a gas supplement pipe. The water vapor supplement flange can be sleeved outside the cavity and located on the side of the sealing flange away from the cover. The water vapor supplement flange is provided with a preparation cavity. The first end of the gas supplement pipe is communicated with the cooling channel, and the second end of the gas supplement pipe is communicated with the preparation cavity. The second end is arranged higher than the first end, and the first end and the second end are communicatable.

6. The water vapor generating mechanism according to claim 1, wherein The water vapor generating mechanism further comprises a gas conveying pipe, and the gas outlet is communicated with the process cavity through the gas conveying pipe. The water vapor generating mechanism further comprises a water vapor filter, which is arranged in the gas conveying pipe. The water vapor generating mechanism further comprises a flow controller, which is arranged in the gas conveying pipe.

7. The water vapor generating mechanism according to claim 1, wherein The sealing flange comprises a first flange and a second flange. Both the first flange and the second flange are provided with the cooling channel, the gas outlet and the water inlet. Each water inlet is communicated with a water source, and each gas outlet is communicated with the process cavity. The first flange is provided with a recess, and a part of the cavity can be embedded in the recess. The second flange can be fixed outside the cavity. A sealing ring is clamped between the second flange and the first flange, and a sealing ring is clamped between the first flange and the cover.

8. A process chamber, comprising: The water vapor generating mechanism comprises a cavity, a cover, a sealing ring and the water vapor generating mechanism of any one of claims 1-7, the sealing flange is arranged outside the cavity, the cover is sealingly connected with the sealing flange through the sealing ring, and the cover, the sealing flange and the cavity form a process cavity, and the gas outlet of the sealing flange communicates with the process cavity.

9. The process chamber of claim 8, wherein, The cover is provided with an air inlet, and the gas outlet communicates with the air inlet, so that the water vapor generated in the cooling channel is transported into the process cavity through the air inlet.

10. A semiconductor process apparatus, characterized by, The process chamber comprises the cover and the sealing flange of any one of claims 8 or 9.

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