Microwave chip test fixture with efficient heat dissipation

Abstract

The invention relates to the technical field of chip testing, and particularly discloses an efficient heat dissipation microwave chip testing clamp which comprises a bearing frame and a protective cover rotationally connected to the bearing frame, a testing groove is formed in the protective cover, and a bearing table used for placing a chip is vertically and slidably connected to the interior of the bearing frame. The interior of the bearing frame is slidably connected with a clamping piece used for clamping a chip. A power mechanism used for driving the bearing table to vertically slide is further arranged in the bearing frame, the power mechanism is in transmission connection with the clamping piece, and the protective cover is connected with the power mechanism through a synchronous piece. A driving source does not need to be independently arranged to drive the clamping piece to move, passive implementation is achieved in the stroke of upward movement of the bearing table, energy and energy consumption can be saved, meanwhile, use of a control system can be reduced, and the effect of controlling the cost can be achieved to a great extent; and meanwhile, later-stage overhaul and maintenance of the clamp can be facilitated, and the effect is excellent.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to a microwave chip testing fixture with high-efficiency heat dissipation. Background Technology

[0002] With the rapid development of integrated circuit manufacturing processes and the rapid improvement of design capabilities, designers are able to integrate increasingly complex functions onto a single silicon wafer, and many functional components have achieved chip-level processes.

[0003] Radio frequency (RF) devices are crucial for signal transmission, especially in the design of 5G-related products, where high integration requirements often necessitate the use of RF chips. The core component of an RF chip is the filter chip, which removes signals outside the target frequency band. Currently, high-performance filters are categorized into SAW (Surface Acoustic Wave) filters and BAW (Bulk Acoustic Wave) filters.

[0004] In order to achieve efficient chip production, chips need to be fixed in fixtures for testing. Chip testing fixtures are devices used to fix the processed individual chips so that testing equipment can test them. They are widely used in the field of chip testing.

[0005] Existing technology, such as the Chinese patent with authorization announcement number CN106093483B entitled "A Chip Test Fixture and Chip Test System," discloses a chip test fixture including a base and a fine-tuning structure. The base has a receiving structure for placing a calibration component and a chip tray, enabling the calibration component to contact the chip tray. The surface of the chip tray is used to solder the microwave chip under test. The fine-tuning structure is mounted on the base and is used to adjust and fix the position of the calibration component and the chip tray. The chip test fixture and chip test system in the above patent can adjust and fix the position of the calibration component and the chip tray through the receiving structure and the fine-tuning structure. Therefore, after aligning the calibration component with the microwave chip under test on the chip tray and fixing the calibration component to the chip tray, the calibration component and the microwave chip under test can be kept in a fixed state without manual operation.

[0006] For example, Chinese patent application publication number CN119024014A, entitled "A Chip Testing Fixture," discloses a chip testing fixture comprising: an upper cover and a lower cover, the lower cover being rotatably mounted on the upper cover; a pin mold assembly, the pin mold assembly being mounted on the lower cover, the pin mold assembly including a test pin extending towards the side near the upper cover; a pressing assembly, the pressing assembly being mounted on the upper cover, the pressing assembly including a pressure block, the pressure block pressing the chip against the test pin; and a fixing assembly, the fixing assembly including a fastener plate, the fastener plate being rotatably mounted on the upper cover, the other end of which fastens to the lower cover.

[0007] Therefore, in existing technologies such as the aforementioned patents, during chip testing, the fixture cover is first opened, and then the chip is placed inside the chip holder. To improve stability during chip testing, a fixing device is used to secure the chip in a predetermined position before subsequent chip testing. After the chip testing is completed, the fixing device must first be unlocked, and then the chip inside the fixture must be removed using tools such as tweezers. This process is overly cumbersome.

[0008] Therefore, it is evident that how to passively drive the fixing component to unlock the chip during the opening process of the cover in the fixture is a technical problem that urgently needs to be solved. Summary of the Invention

[0009] The purpose of this invention is to provide a microwave chip test fixture with high-efficiency heat dissipation to solve the problems mentioned in the background art.

[0010] To achieve the above objectives, the present invention provides the following technical solution: a high-efficiency heat dissipation microwave chip test fixture, comprising a carrier frame and a protective cover rotatably connected to the carrier frame, the protective cover having a test slot, a carrier platform for placing a chip being vertically slidably connected inside the carrier frame, and a clamping member for holding the chip being slidably connected inside the carrier frame; and a power mechanism for driving the carrier platform to slide vertically is also provided inside the carrier frame, the power mechanism being drively connected to the clamping member, and the protective cover being connected to the power mechanism via a synchronization member; when the test operation is completed, during the stroke of the power mechanism opening the protective cover via the synchronization member, the clamping member is driven to slide away from the carrier platform, thereby driving the carrier platform to move the chip upward.

[0011] Furthermore, the clamping member includes a clamping plate slidably connected inside the support frame, and multiple sets of clamping springs are provided between the clamping plate and the support frame.

[0012] Furthermore, the power mechanism includes an intermittent rack slidably connected inside the support frame, with a drive frame fixedly connected to the intermittent rack; a rotating rod is rotatably connected inside the support frame, with a long gear mounted on the rotating rod, and the intermittent rack intermittently meshing with the long gear; a drive rack is fixedly connected to the bottom of the support platform, with the long gear meshing with the drive rack; and a pressure application part is provided between the intermittent rack and the clamping plate.

[0013] Furthermore, the pressure-applying part includes a drive rod fixedly connected to the intermittent rack via a connecting rod, a drive block is mounted on the drive rod, and a transmission frame is fixedly connected to the clamping plate. The transmission frame has a power groove adapted to the drive block inside, and the drive block intermittently abuts against the power groove.

[0014] Furthermore, the protective cover is rotatably connected to the support frame via a rotating shaft, and the synchronizing element is disposed between the rotating rod and the rotating shaft.

[0015] Furthermore, a guide rod is fixedly connected to the bottom of the support frame, the guide rod is slidably connected to the support frame, and a blocking element is provided between the intermittent rack and the guide rod.

[0016] Furthermore, the blocking member includes a locking rod fixedly connected to the intermittent rack, and a locking groove is provided on the guide rod, with the locking rod intermittently abutting against the locking groove; a connector is also provided between the locking rod and the guide rod.

[0017] Furthermore, the snap-fit ​​component includes a plug rod slidably connected inside the locking rod, the guide rod has a slot that communicates with the locking groove, and a positioning spring is provided between the locking rod and the plug rod, the elastic force of the positioning spring driving the plug rod to snap into the slot.

[0018] Furthermore, the drive frame is provided with an unlocking part for driving the insertion rod to slide out of its slot; the unlocking part includes an unlocking block slidably connected to the drive frame, a connecting frame is fixedly connected to the insertion rod, a force-bearing block adapted to the unlocking block is fixedly connected to the connecting frame, a mounting spring is provided between the unlocking block and the drive frame, and the elastic force of the mounting spring drives the unlocking block away from the force-bearing block; and an unlocking rod is slidably connected to the drive frame.

[0019] Furthermore, the carrier frame is provided with a cooling mechanism for cooling the carrier platform. The cooling mechanism includes a cooling system installed inside the carrier frame, a cooling plate installed on the cooling system, and an adapter slot adapted to the cooling plate is opened at the bottom of the carrier platform. During chip testing, the cooling plate is located in the adapter slot inside the carrier platform to cool the carrier platform.

[0020] Compared with the prior art, the beneficial effects of the present invention are: the high-efficiency heat dissipation microwave chip test fixture, through the cooperation between the carrier frame, protective cover, carrier platform, clamping parts, power mechanism, etc., when working, the drive mechanism drives the carrier platform to move the tested chip upward, thereby making the chip located inside the carrier frame move upward until the chip is transported from the carrier frame to the top of the carrier frame, thereby facilitating the subsequent chip unloading and improving the working efficiency of the fixture.

[0021] Furthermore, since the drive mechanism is connected to the clamping component, during the upward movement of the carrier platform driven by the drive mechanism, the clamping component will be driven to move away from the chip. That is, the clamping component will gradually slide away from the carrier platform until it is completely disengaged from the carrier platform, thus avoiding motion interference when the carrier platform moves upward. In this process, there is no need to set a separate drive source to drive the clamping component to move. Instead, it is passively achieved by utilizing the upward movement of the carrier platform. This not only saves energy and energy consumption, but also reduces the use of the control system, which can greatly save costs.

[0022] Furthermore, during the upward movement of the support platform, the protective cover can be rotated via a synchronizing mechanism. Therefore, when the operator removes the chip, the protective cover has already been passively opened, eliminating the need to open it separately before removing the chip. This reduces workflow and improves efficiency. More specifically, in the above operation, simply manually or electrically driving the drive mechanism allows the clamping component to slide away from the support platform, preventing motion interference during the upward movement of the support platform. The support platform then moves upward, and the protective cover opens via the synchronizing mechanism during its upward movement.

[0023] Therefore, in the above operation, there is no need to set a separate drive source to drive the clamping parts and protective cover to move. Instead, it is passively achieved by utilizing the upward movement of the bearing platform. This not only saves energy and energy consumption, but also reduces the use of the control system, which can greatly control costs. At the same time, it also facilitates the inspection and maintenance of the fixture in the later stage, with excellent results. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0025] Figure 1 This is a schematic diagram of the overall structure provided for an embodiment of the present invention; Figure 2This is a schematic diagram of the protective cover in its unfolded state according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the hidden state structure of the carrier frame provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the internal structure of the support frame provided in an embodiment of the present invention from another perspective; Figure 5 This is a schematic diagram of the installation method of the power mechanism provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the fastener structure provided in an embodiment of the present invention; Figure 7 This is a partial structural diagram of the power mechanism provided in an embodiment of the present invention; Figure 8 A schematic diagram of the guide rod and locking rod in a separated state is provided for an embodiment of the present invention; Figure 9 This is a schematic diagram of the insertion rod installation position structure provided in an embodiment of the present invention; Figure 10 This is a partial structural diagram of the fastener provided in an embodiment of the present invention; Figure 11 This is a partial structural diagram of the guide rod provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of the internal structure of the locking rod provided in an embodiment of the present invention; Figure 13 for Figure 12 A schematic diagram of the enlarged structure of region A in the middle.

[0026] Explanation of reference numerals in the attached drawings: 1. Bearing frame; 2. Protective cover; 21. Test slot; 3. Bearing platform; 4. Clamping component; 41. Clamping plate; 42. Clamping spring; 5. Power mechanism; 51. Intermittent rack; 511. Toothless part; 512. Toothed part; 52. Rotating rod; 53. Long gear; 54. Drive rack; 55. Connecting rod; 56. Drive rod; 57. Drive block; 58. Transmission frame; 59. Power slot; 6. Rotating shaft; 7. Synchronizer; 8. Guide rod; 9. Locking rod; 10. Locking slot; 11. Insert rod; 12. Slot; 13. Positioning spring; 14. Connecting frame; 15. Unlocking part; 151. Unlocking block; 152. Force-bearing block; 153. Mounting spring; 154. Unlocking rod; 16. Cooling system; 17. Cooling plate; 18. Adaptor slot. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Please see Figures 1-13 This invention provides a technical solution: a high-efficiency heat dissipation microwave chip test fixture, including a support frame 1 and a protective cover 2 rotatably connected to the support frame 1. The protective cover 2 has a test slot 21. A support platform 3 for placing chips is vertically slidably connected inside the support frame 1, and a clamping member 4 for holding chips is slidably connected inside the support frame 1. The support frame 1 also has a power mechanism 5 for driving the support platform 3 to slide vertically. The power mechanism 5 and the clamping member 4 are connected by transmission. The protective cover 2 and the power mechanism 5 are connected by a synchronization member 7. When the test is completed, during the stroke of the power mechanism 5 opening the protective cover 2 through the synchronization member 7, the clamping member 4 is driven to slide away from the support platform 3, which in turn drives the support platform 3 to move the chip upward.

[0029] Specifically, this high-efficiency heat dissipation microwave chip test fixture includes a carrier frame 1 and a protective cover 2 rotatably connected to the carrier frame 1. The protective cover 2 has a test slot 21. A carrier platform 3 for placing chips is vertically slidably connected inside the carrier frame 1. Therefore, when a chip needs to be tested, it enters the carrier frame 1 through the test slot 21 to perform the testing operation. The carrier frame 1 is compatible with the chip testing equipment. After placing the chip on the carrier platform 3, the carrier frame 1 is placed in the designated chip testing area, and then the chip testing operation can be performed. Specifically, the carrier platform 3 is made of thermally conductive materials such as thermal grease, thermal gel, or a metal thermal pad to meet the heat dissipation needs during subsequent chip testing.

[0030] Specifically, the carrier frame 1 has a slidingly connected clamping member 4 for holding the chip. The clamping member 4 can position the chip to improve its stability during the testing process, thereby improving the accuracy of chip testing and meeting work requirements. Preferably, there are two clamping members 4, respectively arranged on both sides of the carrier frame 1, which can further improve the chip testing effect.

[0031] Furthermore, the support frame 1 is equipped with a power mechanism 5 to drive the support platform 3 to slide vertically, providing power for the sliding of the support platform 3. Specifically, the power mechanism 5 is connected to the clamping component 4, so when the power mechanism 5 moves, it will drive the clamping component 4 to move as well. The protective cover 2 is connected to the power mechanism 5 through a synchronizing component 7, that is, when the power mechanism 5 moves, it will drive the protective cover 2 to rotate through the synchronizing component 7, thereby improving the overall linkage of the test fixture and making the use effect better.

[0032] During chip testing, the chip is located inside the carrier frame 1. After testing, the tested chip needs to be removed from the carrier frame 1. The first step in removal is to open the protective cover 2 on the carrier frame 1. More specifically, upon completion of testing, the power mechanism 5, through the synchronizing member 7, opens the protective cover 2, causing the clamping member 4 to slide away from the carrier platform 3, which in turn drives the carrier platform 3 to move the chip upwards. During this process, the drive mechanism drives the carrier platform 3 to move the tested chip upwards, thus moving the chip inside the carrier frame 1 upwards until it is transported from the carrier frame 1 to its top, facilitating subsequent chip unloading and improving the fixture's efficiency. Because the drive mechanism is connected to the clamping member 4, during the upward movement of the support platform 3 driven by the drive mechanism, the clamping member 4 is driven to move away from the chip. That is, the clamping member 4 gradually slides away from the support platform 3 until it is completely disengaged from the support platform 3. This avoids motion interference when the support platform 3 moves upward. In this process, there is no need for a separate drive source to move the clamping member 4; instead, it is passively achieved during the upward movement of the support platform 3. This not only saves energy and energy consumption but also reduces the use of the control system, significantly reducing costs. Furthermore, during the upward movement of the support platform 3, the protective cover 2 can also be rotated via the synchronizing member 7. Therefore, when the operator removes the chip, the protective cover 2 is already passively opened, eliminating the need to open the protective cover 2 separately before removing the chip. This reduces the workflow and improves work efficiency.

[0033] More specifically, in the above operation, the clamping component 4 can slide away from the support platform 3 simply by manually or electrically driving the drive mechanism, thus avoiding motion interference when the support platform 3 moves upward. The support platform 3 will then move upward, and during its upward stroke, the protective cover 2 will open via the synchronizing component 7. In this operation, there is no need to separately drive the clamping component 4 and the protective cover 2; instead, the movement is passively achieved during the upward stroke of the support platform 3. This not only saves energy and reduces energy consumption but also reduces the use of the control system, significantly controlling costs. Furthermore, it facilitates subsequent inspection and maintenance of the fixture, resulting in excellent performance.

[0034] In the embodiments provided by this invention, specifically, the clamping member 4 includes a clamping plate 41 slidably connected inside the support frame 1. Multiple sets of clamping springs 42 are provided between the clamping plate 41 and the support frame 1. The elastic force of the clamping springs 42 drives the clamping plate 41 to abut against the chip, thereby fixing the chip. Preferably, a limiting telescopic rod is provided between the support frame 1 and the clamping plate 41, thereby improving the stability of the clamping plate 41 when sliding inside the support frame 1. Furthermore, the number of limiting telescopic rods can be multiple, and can be designed according to the needs of the working environment.

[0035] In the embodiments provided by the present invention, the power mechanism 5 includes an intermittent rack 51 slidably connected inside the support frame 1. Specifically, the intermittent rack 51 includes a toothed portion 512 and a toothless portion 511. A drive frame is fixedly connected to the intermittent rack 51. In use, the drive frame drives the intermittent rack 51 to slide horizontally inside the support frame 1. A rotating rod 52 is rotatably connected inside the support frame 1. A long gear 53 is mounted on the rotating rod 52. The intermittent rack 51 and the long gear 53 intermittently mesh. That is, in the initial state, the intermittent rack 51 and the long gear 53 do not mesh. The toothless portion 511 on the intermittent rack 51 is located below the long gear 53. After the intermittent rack 51 slides a certain distance, the toothed portion 512 on the intermittent rack 51 begins to mesh with the long gear 53. A drive rack 54 is fixedly connected to the bottom of the support platform 3. The long gear 53 meshes with the drive rack. A pressure application part is provided between the intermittent rack 51 and the clamping plate 41. The pressure application part includes a drive rod 56 fixedly connected to the intermittent rack 51 via a connecting rod 55. A drive block 57 is mounted on the drive rod 56, and a transmission frame 58 is fixedly connected to the clamping plate 41. The transmission frame 58 has a power groove 59 adapted to the drive block 57 inside. The drive block 57 and the power groove 59 intermittently abut against each other. Specifically, both the drive block 57 and the power groove 59 are wedge-shaped.

[0036] In this embodiment, when the support platform 3 needs to be driven to move upward, the intermittent rack 51 is driven by the drive frame to slide inside the support frame 1. When the intermittent rack 51 first slides horizontally inside the support frame 1, the intermittent rack 51 and the long gear 53 are not engaged, that is, the toothless part 511 on the intermittent rack 51 is located below the long gear 53. After the intermittent rack 51 slides for a certain distance, the toothed part 512 on the intermittent rack 51 begins to engage with the long gear 53. When the intermittent rack 51 slides, it will drive the drive rod 56 to slide through the connecting rod 55, and then drive the drive block 57 to slide towards the side closer to the power groove 59 through the drive block 57. When the drive block 57 abuts against the power groove 59, the drive block 57 continues to slide inside the power groove 59, and will drive the clamping plate 41 to slide inside the support frame 1 through the transmission frame 58 until the clamping plate 41 is completely disengaged from the support platform 3, thereby avoiding motion interference when the support platform 3 moves upward. Subsequently, as the intermittent rack 51 continues to slide, the toothed portion 512 on the intermittent rack 51 begins to mesh with the long gear 53. That is, when the intermittent rack 51 continues to slide, it will mesh with the long gear 53 through the toothed portion 512, causing the long gear 53 to rotate. The rotation of the long gear 53 drives the drive rack 54 to move vertically upward, thereby driving the support platform 3 and the chip on the support platform 3 to move upward, meeting the working requirements. At this time, when the support platform 3 moves upward, the clamping plate 41 has retracted to the inside of the support frame 1, meaning that the upward movement of the support platform 3 is not affected by the clamping member 4.

[0037] In the embodiments provided by the present invention, the protective cover 2 is rotatably connected to the bearing frame 1 via the rotating shaft 6, and the synchronizing element 7 is disposed between the rotating rod 52 and the rotating shaft 6. Specifically, the synchronizing element 7 is the prior art, which can be a synchronous belt, a synchronous pulley assembly or a pulley assembly, which will not be described in detail here.

[0038] In the embodiments provided by the present invention, a guide rod 8 is fixedly connected to the bottom of the support frame 1, and the guide rod 8 is slidably connected to the support frame 1, thus further improving the stability of the support platform 3 when sliding vertically. At the same time, a blocking element is provided between the intermittent rack 51 and the guide rod 8, so that the guide rod 8 can be locked, thus realizing the locking of the support platform 3, which facilitates the subsequent chip unloading operation and improves the performance.

[0039] In the embodiments provided by this invention, the blocking component includes a locking rod 9 fixedly connected to the intermittent rack 51, and a locking groove 10 is provided on the guide rod 8. The locking rod 9 intermittently abuts against the locking groove 10. A connector is also provided between the locking rod 9 and the guide rod 8. Specifically, when the power frame drives the intermittent rack 51 to slide inside the bearing frame 1, it will drive the locking rod 9 to slide together. At the same time, when the bearing platform 3 slides upward, it will also drive the guide rod 8 to move upward. When the locking rod 9 is engaged inside the locking groove 10, it cannot slide out of the locking groove 10 due to the limitation of the blocking component. That is, at this time, the top of the locking groove 10 inside the guide rod 8 will abut against the locking rod 9. Therefore, the bearing platform 3 is also restricted and cannot return to its original position. At this time, the self-locking effect of the bearing platform 3 is achieved. Therefore, in the above operation, it is not necessary to set a separate locking component to actively lock the state of the bearing platform 3. Instead, after the bearing platform 3 slides upward to a certain position, the power mechanism 5 itself performs passive locking. At this moment, the carrier platform 3 is in the locked state. The carrier platform 3 has already transported the chip to the top of the carrier frame 1, which facilitates the unloading of the chip and makes the use effect better.

[0040] In the embodiments provided by the present invention, the snap-fit ​​component includes a plug rod 11 slidably connected inside the locking rod 9, a slot 12 communicating with the locking groove 10 is provided inside the guide rod 8, and a positioning spring 13 is provided between the locking rod 9 and the plug rod 11. The elastic force of the positioning spring 13 drives the plug rod 11 to snap into the slot 12. The plug rod 11 is a wedge-shaped rod. Therefore, during use, when the plug rod 11 is inserted into the slot 12, the locking rod 9 cannot slide out from the locking groove 10, thereby achieving passive fixation of the support platform 3 and meeting the working requirements.

[0041] In the embodiments provided by the present invention, the drive frame is provided with an unlocking part 15 for driving the insertion rod 11 to slide out of the slot 12. The unlocking part 15 includes an unlocking block 151 slidably connected to the drive frame, a connecting frame 14 fixedly connected to the insertion rod 11, a force-receiving block 152 adapted to the unlocking block 151 fixedly connected to the connecting frame 14, a mounting spring 153 provided between the unlocking block 151 and the drive frame, the elastic force of the mounting spring 153 driving the unlocking block 151 away from the force-receiving block 152; and an unlocking rod 154 slidably connected to the drive frame. Therefore, during use, when it is necessary to re-drive the support platform 3 downward into the support frame 1, the unlocking rod 154 drives the unlocking block 151 to slide into the drive frame. At this time, the unlocking block 151 overcomes the elastic force of the mounting spring 153 and abuts against the force-bearing block 152. As the unlocking block 151 continues to apply pressure to the force-bearing block 152, the drive frame drives the insertion rod 11 to slide away from the slot 12 until the insertion rod 11 is completely slid out of the slot 12. At this time, under the influence of the clamping spring 42 and the gravity of the support platform 3, the drive frame tends to slide towards the support frame 1 and begins to slide inside the support frame 1 until the locking rod 9 slides out from the locking groove 10. At this time, with the restriction of the locking rod 9 released, the support platform 3 will move downward under the influence of gravity, causing the support platform 3 to reset. Preferably, a reset spring is provided between the support platform 3 and the support frame 1, which can further improve the stability of the support platform 3 when resetting.

[0042] In the embodiments provided by this invention, a cooling mechanism for cooling the carrier platform 3 is provided inside the carrier frame 1. The cooling mechanism includes a cooling system 16 installed inside the carrier frame 1. Specifically, the cooling system 16 can be air-cooled, water-cooled, etc., and also includes other electronic components used for cooling, which will not be described in detail here. A cooling plate 17 is installed on the cooling system 16. The cooling system 16 cools and dissipates heat from the cooling plate 17, thereby cooling the carrier platform 3 and greatly improving the heat dissipation efficiency of the chip. An adapter slot 18 adapted to the cooling plate 17 is opened at the bottom of the carrier platform 3. During chip testing, the cooling plate 17 is located in the adapter slot 18 inside the carrier platform 3 to cool the carrier platform 3. At this time, when the chip is being tested, the cooling system 16 cools and dissipates heat from the cooling plate 17, thereby keeping the carrier platform 3 in a relatively cool state. This achieves heat dissipation for the chip on the carrier platform 3, protecting the chip and preventing the chip from being affected by the high temperature generated during the test, thus improving the practicality of the test fixture.

[0043] It should be noted that all electrical equipment involved in this application can be powered by batteries or external power sources.

[0044] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0045] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A microwave chip test fixture with high heat dissipation, comprising a bearing frame (1) and a protective cover (2) rotatably connected to the bearing frame (1), the protective cover (2) being provided with a test slot (21), and a bearing table (3) for placing a chip being slidably connected to the bearing frame (1), characterized in that: a clamping piece (4) for clamping the chip is slidably connected to the bearing frame (1); and a power mechanism (5) for driving the bearing table (3) to vertically slide is further arranged in the bearing frame (1), the power mechanism (5) being drivingly connected to the clamping piece (4), and the protective cover (2) being connected to the power mechanism (5) through a synchronizer (7); when the test operation is completed, the power mechanism (5) drives the clamping piece (4) to slide away from the bearing table (3) in the opening stroke of the protective cover (2), and then drives the bearing table (3) and the chip to move upward. The clamping piece (4) comprises a clamping plate (41) slidably connected to the bearing frame (1), and a plurality of clamping springs (42) are arranged between the clamping plate (41) and the bearing frame (1). The power mechanism (5) comprises an intermittent rack (51) slidably connected to the bearing frame (1), and a driving frame is fixedly connected to the intermittent rack (51). A rotating rod (52) is rotatably connected to the bearing frame (1), a long gear (53) is installed on the rotating rod (52), and the intermittent rack (51) is intermittently engaged with the long gear (53).

2. The microwave chip test fixture of claim 1, wherein: A driving rack (54) is fixedly connected to the bottom of the bearing table (3), the long gear (53) is engaged with the driving rack (54), and a pressing part is arranged between the intermittent rack (51) and the clamping plate (41).

3. The microwave chip test fixture of claim 2, wherein: The pressing part comprises a driving rod (56) fixedly connected to the intermittent rack (51) through a connecting rod (55), a driving block (57) is installed on the driving rod (56), a transmission frame (58) is fixedly connected to the clamping plate (41), a power groove (59) matching the driving block (57) is formed in the transmission frame (58), and the driving block (57) and the power groove (59) are intermittently in contact. The protective cover (2) is rotatably connected to the bearing frame (1) through a rotating shaft (6), and the synchronizer (7) is arranged between the rotating rod (52) and the rotating shaft (6). A guide rod (8) is fixedly connected to the bottom of the bearing frame (1), the guide rod (8) is slidably connected to the bearing frame (1), and a blocking piece is arranged between the intermittent rack (51) and the guide rod (8).

4. The microwave chip test fixture of claim 3, wherein: The blocking piece comprises a locking rod (9) fixedly connected to the intermittent rack (51), a locking groove (10) is formed in the guide rod (8), and the locking rod (9) and the locking groove (10) are intermittently in contact.

5. The high-efficiency heat-dissipation microwave chip test fixture of claim 3, wherein: An inserting piece is further arranged between the locking rod (9) and the guide rod (8).

6. The high-efficiency heat-dissipation microwave chip test fixture of claim 3, wherein: ​ 7. The high-efficiency heat-dissipation microwave chip test fixture of claim 6, wherein: ​ ​ 8. The high-efficiency heat-dissipation microwave chip test fixture of claim 7, wherein: The clamping piece comprises an insertion rod (11) slidingly connected inside the locking rod (9), the guide rod (8) is provided with an insertion slot (12) in communication with the locking slot (10), and a positioning spring (13) is arranged between the locking rod (9) and the insertion rod (11), and the elastic force of the positioning spring (13) drives the insertion rod (11) to clamp in the insertion slot (12).

9. The high-efficiency heat-dissipating microwave chip test fixture of claim 8, wherein: An unlocking portion (15) is arranged on the driving frame to slide the insertion rod (11) out of the insertion slot (12); The unlocking portion (15) comprises an unlocking block (151) slidingly connected on the driving frame, the insertion rod (11) is fixedly connected with a connecting frame (14), the connecting frame (14) is fixedly connected with a stress block (152) matched with the unlocking block (151), a mounting spring (153) is arranged between the unlocking block (151) and the driving frame, the elastic force of the mounting spring (153) drives the unlocking block (151) to move away from the stress block (152), and the driving frame is slidingly connected with an unlocking rod (154).

10. The high-efficiency heat-dissipating microwave chip test fixture of claim 1, wherein: The bearing frame (1) is internally provided with a cooling mechanism for cooling the bearing table (3); The cooling mechanism comprises a cooling system (16) mounted inside the bearing frame (1), and the cooling system (16) is mounted with a cooling plate (17), and the bottom of the bearing table (3) is provided with an adaptive slot (18) matched with the cooling plate (17); During the chip testing operation, the cooling plate (17) is located in the adaptive slot (18) inside the bearing table (3) to cool the bearing table (3).

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