Novel multi-material compatible chip test equipment

Abstract

The invention provides novel multi-material compatible chip testing equipment. The novel multi-material compatible chip testing equipment comprises a feeding mechanism, a chip transplanting mechanism, a testing module and a control system, the feeding mechanism comprises a rack, a feeding module, a rotating module, a retesting module and a portal frame module. The chip transplanting mechanism comprises a base frame, a horizontal movement module, a vertical lifting module and a double-layer bearing platform; the test module comprises a plurality of stacked test plates; the control system is electrically connected with the feeding mechanism, the chip transplanting mechanism and the testing module. Efficient compatibility of multiple materials can be achieved, and the testing efficiency is remarkably improved; automatic adjustment and retest are integrated, and high automation is achieved; an innovative double-layer transplanting structure is arranged to optimize material flow, and the efficiency bottleneck is effectively eliminated; and meanwhile, modular design can be carried out, so that maintenance is convenient, and remodeling is flexible.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor testing equipment technology, specifically relating to a novel multi-material compatible chip testing equipment. Background Technology

[0002] In integrated circuit testing equipment, the chip under test (IC) typically needs to be picked up from the tray and fed into the test socket for electrical performance testing. Since the chip's orientation in the tray may differ from its testing orientation in the test socket, traditional equipment requires manual adjustment, leading to low efficiency, cumbersome operation, and a high risk of chip damage or test failure due to human error. Furthermore, during chip transfer, single-layer transfer mechanisms (such as single-layer hooks or suction cup platforms) are commonly used. These mechanisms can only perform one task per stroke: either placing a IC under test into the testing area or removing a tested IC from the testing area. During the return trip or waiting period after completing a task, the mechanism is in an ineffective idle or waiting state, creating a bottleneck in the material flow between the testing area and the loading / unloading areas. This limits further reduction in the overall cycle time of the equipment and affects the throughput of the testing equipment.

[0003] While existing technologies include rotation adjustment mechanisms, they mostly employ single or linked rotation modules, which cannot simultaneously meet the parallel testing requirements of multiple chips and lack integrated retesting capabilities, thus limiting equipment adaptability and testing efficiency.

[0004] Therefore, there is an urgent need for a testing facility with adjustment capabilities that can simultaneously and efficiently process multiple chip models. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention proposes a novel multi-material compatible chip testing device.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] A novel multi-material compatible chip testing device includes a feeding mechanism, a chip transfer mechanism, a testing module, and a control system; The loading mechanism includes a frame, a loading module, a rotating module, a retesting module, and a gantry module. The frame serves as the base of the device and includes a loading area and a testing area. The loading module is located in the loading area and includes several empty loading trays for loading different types of chips to be tested. The rotating module includes several rotating mechanisms of the same number as the empty loading trays, with each rotating mechanism corresponding to an empty loading tray, for rotating the chip from the loading direction to the direction of the testing socket. The retesting module is located in the testing area and downstream of the rotating module, for temporarily storing the chips to be tested after the orientation has been adjusted. The gantry module is mounted above the frame and is equipped with loading and unloading arms for transferring chips between the loading module, the rotating module, and the retesting module. The chip transfer mechanism includes a base frame, a horizontal motion module, a vertical lifting module, and a double-layer support platform. The base frame is mounted on the equipment frame. The horizontal motion module is mounted at the bottom of the base frame and drives the base frame to perform reciprocating linear motion from the loading area to the testing area. The vertical lifting module is mounted inside the base frame and drives the double-layer support platform assembly to move up and down. The double-layer support platform includes an upper support platform and a lower support platform. The two sides of the upper support platform are mounted to the output end of the vertical lifting module and include an upper positioning fixture and an upper hook plate mechanism for positioning and gripping the chip, respectively. The lower support platform is located below the upper support platform, and its two sides are also mounted to the output end of the vertical lifting module, including a lower positioning fixture and a lower hook plate mechanism for positioning and gripping the chip, respectively. The test module includes several stacked test boards; the middle two sides of the test board have test slots along its depth direction for sliding installation of upper and lower positioning fixtures; the bottom of the test board is equipped with a lifting cylinder for lifting; and pressure measuring modules are evenly distributed on the top of the test board. The control system is electrically connected to the feeding mechanism, the chip transfer mechanism, and the testing module.

[0008] Furthermore, the gantry module includes supporting gantry on the left and right sides of the frame, and a loading / unloading arm gantry installed between the two supporting gantry and capable of free movement; the loading / unloading arm is installed vertically downward on the loading / unloading arm gantry via a transfer motor, and includes a pallet clamping mechanism, a chip picking mechanism, a material feeding detection CCD, and a barcode scanner, which are used for pallet distribution and recycling, chip picking, chip positioning, and chip identification, respectively.

[0009] Furthermore, the rotating mechanism includes a rotating bracket, a rotating motor, an angle sensor, and a clamping mechanism; the rotating bracket is vertically installed on one side of the empty feeding tray, and rotating motors are evenly distributed on its top, with each rotating motor's output end vertically connected to a clamping mechanism capable of lifting and lowering; the angle sensor is electrically connected to the control system and is used to detect the chip's rotation angle, and the control system controls the rotation angle of the rotating motor.

[0010] Furthermore, the horizontal motion module includes a linear guide rail, a ball screw pair, and a horizontal motion motor; the linear guide rail is fixed on the equipment frame and is arranged in the direction from the loading area to the testing area; the base frame is slidably fitted on the linear guide rail and is connected to the output end of the horizontal motion motor through the ball screw pair; the vertical lifting module is a screw jack driven by a vertical lifting motor, or a synchronous belt lifting mechanism, or a guide lifting slide driven by a lifting cylinder.

[0011] Furthermore, both the upper and lower hook mechanisms are pneumatic hook mechanisms, whose claws can extend into the slots or below the chip edge for gripping and releasing; both the upper and lower positioning fixtures include a positioning pin assembly and a lateral clamping assembly. The positioning pin assembly is located on the upper part of the upper and lower positioning fixtures, and the lateral clamping assembly is located on the side of the upper and lower positioning fixtures, respectively for positioning and fixing the chip and for lateral clamping.

[0012] Furthermore, floating pressure heads are evenly distributed at the bottom of the pressure measuring module; the floating pressure heads are installed with the pressure head heating plate, and the pressure head heating plate is connected to the heating main control board.

[0013] Furthermore, the bottom of the frame is also equipped with casters and adjustable feet; the number and position of the adjustable feet correspond to the casters, and the bottom of the adjustable feet is also equipped with shock-absorbing pads.

[0014] Furthermore, a loading trolley is also provided in the loading area of ​​the frame.

[0015] Furthermore, the distance between the upper support platform and the lower support platform remains constant.

[0016] Furthermore, the number of empty feeding discs is 6, and the number of rotating mechanisms is also 6.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. Highly compatible with multiple materials, significantly improving testing efficiency: By configuring six independent empty feeding trays and rotating modules, the equipment can process the orientation adjustment and testing tasks of six different chip models in parallel, breaking through the limitation of traditional equipment that can only process a single material at a time, and greatly improving the material compatibility and overall testing efficiency of the equipment. 2. Integrated automatic adjustment and retesting achieve a high degree of automation: Integrating rotation adjustment, rapid transfer, and retest buffer, this design achieves a fully automated closed-loop process for chip assembly, orientation correction, positioning, testing, and retest sorting. This design not only reduces manual intervention and the risk of operational errors and chip damage, but also improves the reliability and consistency of test results through an automated retest mechanism. 3. The double-layer transplanting structure optimizes material flow and eliminates efficiency bottlenecks: Through the innovative double-layer bearing platform and transplanting mechanism, the equipment can simultaneously perform two tasks in one horizontal reciprocating stroke: "sending the test plate in" and "retrieving the test plate out". This effectively eliminates the waiting time of the return empty load of the traditional single-layer transplanting mechanism, optimizes the material flow rhythm, and fundamentally improves the theoretical throughput and operating efficiency of the equipment. 4. Modular design, convenient maintenance and flexible replacement: All functional components in this invention can adopt a standardized, modular kit design, supporting rapid replacement and complete system upgrades. This design greatly enhances the equipment's adaptability to different testing products and process requirements, shortens changeover time, and improves equipment utilization. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the feeding mechanism in this invention; Figure 3 This is a schematic diagram of the loading and unloading arm in this invention; Figure 4 This is a schematic diagram of the rotating mechanism in this invention; Figure 5 This is a schematic diagram of the chip transfer mechanism in this invention; Figure 6 This is a schematic diagram of the upper-level support platform in this invention; Figure 7 This is a schematic diagram of the lower-level support platform in this invention; Figure 8 This is a schematic diagram of the test board in this invention.

[0019] In the diagram: 1. Frame; 2. Empty loading tray; 3. Rotating mechanism; 4. Retesting module; 5. Loading / unloading arm; 6. Base frame; 7. Vertical lifting module; 8. Upper support platform; 9. Lower support platform; 10. Upper positioning fixture; 11. Upper hook plate mechanism; 12. Lower positioning fixture; 13. Lower hook plate mechanism; 14. Test plate; 15. Lifting cylinder; 16. Support gantry; 17. Loading / unloading arm gantry; 18. Transfer motor; 19. Pallet clamping mechanism; 20. Chip picking mechanism; 21. Discharge detection CCD; 22. Barcode scanner; 23. Rotating bracket; 24. Rotating motor; 25. Clamping mechanism; 26. Linear guide rail; 27. Ball screw pair; 28. Positioning pin assembly; 29. ​​Lateral clamping assembly; 30. Floating pressure head; 31. Pressure head heating plate; 32. Angle sensor; 33. Horizontal motion motor; 34. Pressure measuring module; 35. Heating main control board. Detailed Implementation

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The specific implementation methods of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] like Figure 1 The diagram shown is a structural schematic of the present invention. This embodiment is a novel multi-material compatible chip testing device, including a feeding mechanism, a chip transfer mechanism, a testing module, and a control system.

[0022] like Figure 2 As shown, the feeding mechanism includes a frame 1, a feeding module, a rotating module, a retesting module 4, and a gantry module. The frame 1 serves as the base of the device and includes a feeding area and a testing area. The bottom of the frame 1 is also equipped with casters and adjustable feet. The number and position of the adjustable feet correspond to the casters, and the bottom of the adjustable feet is also equipped with anti-vibration pads. A feeding trolley is also provided in the feeding area of ​​the frame 1. The loading module is located in the loading area and includes six empty loading trays 2 for loading different types of chips under test. The rotating module includes six rotating mechanisms 3, each of which is corresponding to an empty loading tray 2, for rotating the chip from the loading direction to the direction of the test socket. The retesting module 4 is located in the testing area and downstream of the rotating module for temporarily storing the chips under test after the orientation has been adjusted. The gantry module is installed above the frame and is equipped with loading and unloading arms 5 for transferring chips between the loading module, the rotating module, and the retesting module 4.

[0023] The gantry module includes supporting gantry 16 located on the left and right sides of the frame 1, and a loading / unloading arm gantry 17 installed between the two supporting gantry 16 and capable of free movement; the loading / unloading arm 5 is vertically mounted downwards on the loading / unloading arm gantry 17 via a transfer motor 18, such as... Figure 3As shown, the loading and unloading arm 5 includes a tray clamping mechanism 19, a chip picking mechanism 20, a material feeding detection CCD 21, and a barcode scanner 22, which are used for tray distribution and recycling, chip picking, chip positioning, and chip identification, respectively.

[0024] like Figure 4 As shown, the rotating mechanism 3 includes a rotating bracket 23, a rotating motor 24, an angle sensor 32, and a clamping mechanism 25. The rotating bracket 23 is vertically installed on one side of the empty feeding tray 2, and the top of it is evenly distributed with rotating motors 24. The output end of each rotating motor 24 is vertically connected to a clamping mechanism 25 that can be lifted and lowered. The angle sensor 32 is electrically connected to the control system and is used to detect the rotation angle of the chip and control the rotation angle of the rotating motor 24 through the control system.

[0025] like Figure 5 As shown, the chip transfer mechanism includes a base frame 6, a horizontal motion module, a vertical lifting module 7, and a double-layer support platform; the base frame 6 is mounted on the frame 1; the horizontal motion module is mounted at the bottom of the base frame 6 and is used to drive the base frame 6 to perform reciprocating linear motion from the loading area to the testing area; the vertical lifting module 7 is mounted inside the base frame 6 and is used to drive the double-layer support platform assembly to move up and down; as shown... Figure 6 , 7 As shown, the double-layer support platform includes an upper support platform 8 and a lower support platform 9 with a constant distance between them; the two sides of the upper support platform 8 are installed with the output ends of the vertical lifting module 7, including an upper positioning fixture 10 and an upper hook plate mechanism 11 for positioning and gripping the chip respectively; the lower support platform 9 is located below the upper support platform 8, and its two sides are also installed with the output ends of the vertical lifting module 7, including a lower positioning fixture 12 and a lower hook plate mechanism 13 for positioning and gripping the chip respectively.

[0026] The horizontal motion module includes a linear guide rail 26, a ball screw pair 27, and a horizontal motion motor 33. The linear guide rail 26 is fixed on the frame 1 and is set in the direction from the loading area to the testing area. The base frame 6 is slidably fitted on the linear guide rail 26 and is connected to the output end of the horizontal motion motor 33 through the ball screw pair 27. The vertical lifting module 7 is a screw jack driven by a vertical lifting motor, or a synchronous belt lifting mechanism, or a guide lifting slide driven by a lifting cylinder.

[0027] Both the upper hook plate mechanism 11 and the lower hook plate mechanism 13 are pneumatic hook plate mechanisms, whose claws can extend into the slots or below the chip edge for gripping and releasing; both the upper positioning fixture 10 and the lower positioning fixture 12 include a positioning pin assembly 28 and a lateral clamping assembly 29. The positioning pin assembly 28 is located on the upper part of the upper positioning fixture 10 and the lower positioning fixture 12, and the lateral clamping assembly 29 is located on the side of the upper positioning fixture 10 and the lower positioning fixture 12, respectively for positioning and fixing the chip and for lateral clamping.

[0028] The test module comprises several stacked test boards 14; such as Figure 8 As shown, test slots are provided on both sides of the middle part of the test plate 14 along its depth direction for sliding installation of the upper positioning fixture 10 and the lower positioning fixture 12. A lifting cylinder 15 for lifting is installed at the bottom of the test plate 14. Pressure measuring modules 34 are evenly distributed on the top of the test plate 14. Floating pressure heads 30 are evenly distributed at the bottom of the pressure measuring modules 34. The floating pressure heads 30 are installed with the pressure head heating plate 31, and the pressure head heating plate 31 is connected to the heating main control board 35.

[0029] The control system is electrically connected to the feeding mechanism, the chip transfer mechanism, and the test module.

[0030] In this embodiment, during operation, the loading trolley in the loading area of ​​the rack 1 is equipped with chips of different models to be retested. First, the chips of different models to be retested are manually placed into the corresponding empty loading trays 2. The gantry module drives the loading and unloading arms 5 to move to the corresponding empty loading trays 2. The loading detection CCD 21 detects the approximate position of the chips to be retested below and confirms it by scanning the code with the barcode scanner 22. The loading and unloading arms 5 descend and the chip picking mechanism 20 picks up the chips. The gantry module transfers the picked-up chips to the rotating module. The rotating mechanism 3 clamps the chips through the lifting clamping mechanism 25. Then, the rotating motor 24 rotates each clamped chip at a certain angle under the control of the angle sensor 32, so that each chip is aligned with the test seat direction. Finally, the gantry module transfers the rotated chips to the retesting module 4 to wait for retesting.

[0031] The horizontal motion module of the chip transfer mechanism reciprocates linearly between the loading area and the testing area to receive the chip to be retested. Simultaneously, the vertical lifting module 7 controls the double-layer support platform to align with the chip to be retested, transferring the chip to the testing area. After the upper support platform 8 and the lower support platform 9 are connected, the entire assembly is moved to the test module for testing. The dual-layer support platform includes an upper support platform 8 and a lower support platform 9 with a constant spacing, ensuring that the upper support platform 8 and the lower support platform 9 do not interfere with each other when in use. Taking the upper support platform 8 as an example, the upper support platform 8 includes an upper positioning fixture 10 for positioning and loading the chip, and an upper hook mechanism 11 for pulling out and gripping the entire upper positioning fixture 10, so that the upper positioning fixture 10 of the entire board can reach the downstream test module; the lower support platform 3 is similar.

[0032] The test board 14 receives the upper positioning fixture 10 or the lower positioning fixture 12. The lifting cylinder 15 lifts the upper positioning fixture 10 or the lower positioning fixture 12 with the chip to be retested as a whole, so that it contacts the pressure testing module 34 for retesting.

[0033] To automate the entire process of chip loading, orientation correction, positioning, and retesting, this embodiment also includes a control system. The control system is electrically connected to the loading mechanism, chip transfer mechanism, and test module to perform precise and intelligent control of the module components, ensuring efficiency while improving retesting accuracy.

[0034] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any other way. Any modifications or equivalent changes made based on the technical essence of the present invention shall still fall within the scope of protection claimed by the present invention.

Claims

1. A novel multi-material compatible chip testing apparatus, characterized by, The device comprises a feeding mechanism, a chip transplanting mechanism, a testing module and a control system. The feeding mechanism comprises a rack, a feeding module, a rotating module, a retesting module and a gantry module; the rack serves as a device base and comprises a feeding area and a testing area; the feeding module is arranged in the feeding area and comprises a plurality of feeding empty trays for loading different types of chips to be tested; the rotating module comprises a plurality of rotating mechanisms with the same number as the feeding empty trays, and each rotating mechanism is arranged correspondingly to the feeding empty tray, for rotating the chips from the feeding direction to the direction consistent with the testing seat; The retesting module is arranged in the testing area and located downstream of the rotating module, for temporarily storing the chips with adjusted direction; the gantry module is installed above the rack and cooperates with a feeding and discharging arm, for transferring the chips between the feeding module, the rotating module and the retesting module; The chip transplanting mechanism comprises a base frame, a horizontal movement module, a vertical lifting module and a double-layer bearing platform; the base frame is installed on the rack; the horizontal movement module is installed at the bottom of the base frame, for driving the base frame to reciprocate linearly from the feeding area to the testing area; the vertical lifting module is installed in the base frame, for driving the double-layer bearing platform assembly to move up and down; the double-layer bearing platform comprises an upper bearing platform and a lower bearing platform; the two sides of the upper bearing platform are installed with the output ends of the vertical lifting module, and the upper bearing platform comprises an upper positioning clamp and an upper hooking plate mechanism for positioning and grabbing the chips respectively; the lower bearing platform is located below the upper bearing platform, and the two sides thereof are also installed with the output ends of the vertical lifting module, and the lower bearing platform comprises a lower positioning clamp and a lower hooking plate mechanism for positioning and grabbing the chips respectively; The testing module comprises a plurality of stacked testing boards; the middle part of each testing board is provided with a testing slot on both sides along the depth direction, for slidingly installing the upper positioning clamp and the lower positioning clamp; the bottom of each testing board is provided with a jacking cylinder for jacking; and the top of each testing board is uniformly provided with a pressure measuring module; The control system is electrically connected with the feeding mechanism, the chip transplanting mechanism and the testing module respectively.

2. A novel multi-material compatible chip testing apparatus according to claim 1, wherein, The gantry module comprises support gantries arranged on the left and right sides of the rack, and a feeding and discharging arm gantry installed between the two support gantries and capable of moving freely; the feeding and discharging arm is vertically downwardly installed on the feeding and discharging arm gantry through a transfer motor and comprises a tray clamping mechanism, a chip sucking mechanism, a discharging detection CCD and a code scanning gun, which are respectively used for distributing and recycling the tray, sucking the chip, positioning the chip and identifying the chip.

3. A novel multi-material compatible chip testing apparatus according to claim 1, wherein, The rotating mechanism comprises a rotating support, a rotating motor, an angle sensor and a clamping mechanism; the rotating support is vertically installed on one side of the feeding empty tray, and the top thereof is uniformly provided with the rotating motor, and the output end of each rotating motor is vertically connected with the clamping mechanism capable of lifting; the angle sensor is electrically connected with the control system, for detecting the rotation angle of the chip and controlling the rotation angle of the rotating motor through the control system.

4. The novel multi-material compatible chip testing apparatus according to claim 1, wherein, The horizontal movement module comprises a linear guide rail, a ball screw pair and a horizontal movement motor; the linear guide rail is fixed on the rack and arranged in the direction from the loading area to the testing area; the base frame is slidingly fitted on the linear guide rail and connected to the output end of the horizontal movement motor through the ball screw pair; the vertical lifting module is a screw lifter driven by a vertical lifting motor, a synchronous belt lifting mechanism or a guide lifting slide driven by a lifting cylinder.

5. The novel multi-material compatible chip testing apparatus according to claim 1, wherein, The upper and lower hooking plate mechanisms are pneumatic hooking plate mechanisms, the hooking claws of which can extend into the notch of the edge of the chip or below to grasp and release the chip; the upper and lower positioning clamps each comprise a positioning pin assembly and a lateral pressing assembly, the positioning pin assembly is arranged on the upper part of the upper and lower positioning clamps, and the lateral pressing assembly is arranged on the side part of the upper and lower positioning clamps, and is respectively used for positioning and fixing the chip and pressing the chip laterally.

6. A novel multi-material compatible chip testing apparatus according to claim 1, wherein, The bottom of the pressure measuring module is uniformly provided with floating pressure heads; the floating pressure heads are mounted with pressure head heating plates, and the pressure head heating plates are connected to a heating main control board.

7. A novel multi-material compatible chip testing apparatus according to claim 1, wherein, The bottom of the rack is further provided with casters and adjustable foot cups; the number and positions of the adjustable foot cups correspond to those of the casters, and the bottom of each adjustable foot cup is further provided with a shockproof foot pad.

8. A novel multi-material compatible chip testing apparatus according to claim 1, wherein, The loading area of the rack is further provided with a loading trolley.

9. A novel multi-material compatible chip testing apparatus according to claim 1, wherein, The distance between the upper and lower bearing platforms is constant.

10. The novel multi-material compatible chip testing apparatus according to claim 1, wherein, The number of the loading empty trays is 6, and the number of the rotating mechanisms is also 6.

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