Shielding oil quantity determination method, shielding oil quantity control method, shielding oil quantity determination device, shielding oil quantity control device and electronic equipment

Abstract

The invention discloses a shielding oil quantity determination method, a shielding oil quantity control method, a shielding oil quantity determination device and electronic equipment, and belongs to the field of metallized film evaporation. Firstly, a cover plate with a preset opening width is selected, the opening of the cover plate is used for spraying shielding oil by a spraying device in the evaporation process, so that a screen belt is formed at the shielding oil during subsequent metallized film evaporation, and after evaporation is completed, the water drop angle of the shielding oil at the opening of the cover plate, namely the screen belt, is measured; therefore, the oil quantity of the sprayed shielding oil can be determined based on the water drop angle, the oil quantity of the shielding oil is expressed through the water drop angle, the oil quantity of the sprayed shielding oil is quantified, the oil quantity of the sprayed shielding oil does not need to be determined according to experience, and it is guaranteed that the oil quantity of the sprayed shielding oil can meet user requirements; and the evaporation quality of the metallized film is improved.

Description

Technical Field

[0001] This application relates to the field of metallization thin film evaporation technology, and in particular, to a method, control method, apparatus, and electronic device for determining the amount of shielding oil. Background Technology

[0002] Metallized film capacitors are capacitors made by winding organic plastic films as dielectrics and metallized films as electrodes (except for laminated structures). The films used in metallized film capacitors include polyethylene, polypropylene, and polycarbonate.

[0003] Metallized film capacitors are made by depositing a metal film onto the surface of a polyester film, replacing metal foil as the electrode. Because the thickness of the metallized film is much smaller than that of the metal foil, the overall volume after winding is also much smaller than that of a metal foil capacitor. The biggest advantage of metallized film capacitors is their "self-healing" characteristic. This self-healing characteristic means that if the dielectric film breaks down due to a defect at a certain point or under overvoltage, the metallized layer at the breakdown point can instantly melt and evaporate under the action of an electric arc, forming a small metal-free area. This allows the two electrodes of the capacitor to re-insulate each other and continue to operate, thus greatly improving the reliability of the capacitor.

[0004] Metallized film capacitors are widely used in various home appliances, photovoltaics, energy storage, and new energy fields. The lifespan of metallized film capacitors has always been a focus of industry attention. The metallization process mainly involves a substrate, a metal coating, and a shielding oil. The amount of shielding oil added during the evaporation process has a significant and close relationship with the diffusion of the metallized film coating and the shaping gap between the films, thus affecting the lifespan of the capacitor.

[0005] However, the amount of shielding oil added during the current metallization film evaporation process is mainly determined based on experience. This method makes it impossible to quantify the amount of shielding oil in the evaporated metallization film shield, and it is difficult to determine whether the uniformity of the shielding oil amount is appropriate during evaporation. Summary of the Invention

[0006] To overcome the shortcomings of the prior art, this application provides a method, control method, apparatus and electronic device for determining the amount of shielding oil, in order to solve the problem that the amount of shielding oil added during the evaporation of metallized thin films is mainly determined by experience. This method makes it impossible to quantify the amount of shielding oil in the evaporated metallized thin film shield, and it is difficult to determine whether the uniformity of the amount of shielding oil is appropriate during the evaporation process.

[0007] The technical solution adopted by this application to solve its technical problem is:

[0008] Firstly, a method for determining the amount of shielding oil is provided, applied to metallization thin film evaporation, the method comprising:

[0009] Select a cover plate with a preset opening width, the opening of which is used for the spraying device to spray shielding oil;

[0010] Perform vapor deposition of metallized thin films;

[0011] Measure the water droplet angle of the shielding oil at the opening of the cover plate;

[0012] The amount of shielding oil to be sprayed is determined based on the water droplet angle.

[0013] Further, determining the amount of shielding oil sprayed based on the water droplet angle includes:

[0014] The amount of shielding oil to be sprayed is determined based on the opening width and the water droplet angle. For the same opening width, the larger the water droplet angle, the more shielding oil is sprayed.

[0015] Furthermore, it also includes:

[0016] When performing vapor deposition of metallized thin films, target parameters are obtained, including at least one of the following: oil temperature of the coating machine, size of the shielding oil nozzle cover plate, and film winding speed.

[0017] The spraying amount of the spraying device is determined based on the target parameters;

[0018] Metallization films are deposited by vapor deposition based on the amount of coating applied.

[0019] Furthermore, the preset opening width is greater than or equal to 6mm.

[0020] Furthermore, measuring the water droplet angle of the shielding oil at the opening of the cover plate also includes:

[0021] According to the measurement requirements, the metallized thin film after vapor deposition is cut into thin film samples of a preset size, and the thin film samples include screen strips;

[0022] The water droplet angle was obtained by measuring the shielding oil at the screen band of the thin film sample.

[0023] Further, the measurement of the water droplet angle at the shielding oil at the screen band of the thin film sample includes:

[0024] The water droplet angle was obtained by measuring the shielding oil at the screen band of the thin film sample using a water droplet angle measuring instrument.

[0025] Secondly, a method for controlling the amount of shielding oil is provided, including:

[0026] Perform vapor deposition testing;

[0027] The amount of shielding oil sprayed during the test vapor deposition is determined according to the above-described method for determining the amount of shielding oil.

[0028] If the amount of shielding oil sprayed during the test vapor deposition is equal to the preset amount, then the amount of shielding oil sprayed during the test vapor deposition is kept unchanged and the formal vapor deposition is carried out.

[0029] Thirdly, a device for determining the amount of shielding oil is provided, applied to metallization thin film evaporation, the device comprising:

[0030] The cover plate selection module is used to select a cover plate with a preset opening width, and the opening of the cover plate is used for the spraying device to spray shielding oil.

[0031] Thin film evaporation module, used for evaporating metallized thin films;

[0032] A water droplet angle measurement module is used to measure the water droplet angle of the shielding oil at the opening of the cover plate;

[0033] The oil volume calculation module is used to determine the amount of shielding oil to be sprayed based on the water droplet angle.

[0034] Fourthly, a shielded oil volume control device is provided, comprising:

[0035] The vapor deposition test module is used to perform vapor deposition tests.

[0036] The oil quantity determination module is used to determine the amount of shielding oil sprayed during the test vapor deposition according to the above-mentioned shielding oil quantity determination method.

[0037] The formal vapor deposition module is used to maintain the amount of shielding oil sprayed during the test vapor deposition unchanged and perform formal vapor deposition if the amount of shielding oil sprayed during the test vapor deposition is equal to the preset amount of oil.

[0038] Fifthly, an electronic device is provided, comprising:

[0039] At least one processor and at least one memory;

[0040] The memory stores the executable instructions of the processor;

[0041] The processor is configured to execute the above-described method for determining the amount of shielding oil or the above-described method for controlling the amount of shielding oil.

[0042] Beneficial effects:

[0043] This application provides a method, control method, apparatus, and electronic device for determining the amount of shielding oil. This solution is applied to metallization thin film evaporation. First, a cover plate with a preset opening width is selected. During the evaporation process, the opening of the cover plate is used to spray shielding oil. This creates a shielding band at the shielding oil location during subsequent metallization thin film evaporation. After evaporation, the water droplet angle of the shielding oil at the cover plate opening (i.e., the shielding band) is measured. Because for the same opening width, the more shielding oil sprayed, the larger the water droplet angle, the amount of shielding oil sprayed can be determined based on the water droplet angle. By representing the amount of shielding oil through the water droplet angle, the amount of shielding oil sprayed is quantified, eliminating the need to determine the amount of shielding oil based on experience. This ensures that the amount of shielding oil sprayed meets user requirements and improves the quality of metallization thin film evaporation. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a flowchart of a method for determining the amount of shielding oil provided in an embodiment of this application;

[0046] Figure 2 This is a schematic diagram of a cover plate structure provided in an embodiment of this application;

[0047] Figure 3 This is provided by the embodiments of this application. Figure 2 Enlarged diagram of the opening at point A;

[0048] Figure 4 This is a schematic diagram of an optical contact angle measuring instrument provided in an embodiment of this application;

[0049] Figure 5 This is a schematic diagram of a water droplet angle provided in an embodiment of this application;

[0050] Figure 6 This is a flowchart of a shielding oil quantity control method provided in an embodiment of this application;

[0051] Figure 7 This is a schematic diagram of a shielding oil quantity determination device provided in an embodiment of this application;

[0052] Figure 8 This is a schematic diagram of a shielded oil volume control device provided in an embodiment of this application;

[0053] Figure 9This is a schematic diagram of an electronic device structure provided in an embodiment of this application. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be described in detail below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0055] Existing metallization thin film deposition methods all employ vacuum evaporation, also known as vacuum evaporation coating. This method involves evacuating a vacuum chamber containing a substrate to a pressure below 10⁻² Pa to heat the coating material, causing its atoms or molecules to vaporize and escape from the surface, forming a vapor stream that is incident on the substrate surface and condenses to form a solid thin film.

[0056] 1. Vacuum Evaporation Principle

[0057] (1) Evaporation characteristics of the film material under vacuum. The mass of material evaporated per unit area of ​​the film material per unit time is called the evaporation rate. The ideal maximum rate Gm (unit: kg / (m·s)): Gm = 4.38 × 10⁻³ Ps(Ar / T)¹ / ², where T is the thermodynamic temperature of the evaporation surface in K, Ps is the saturated evaporation pressure of the material at temperature T in Pa, and Ar is the relative atomic mass or relative molecular mass of the film material. Therefore, the required heating temperature for a known evaporation material can be estimated.

[0058] (2) Spatial distribution of vapor particles. The spatial distribution of vapor particles significantly affects the deposition rate of evaporation particles on the substrate and the film thickness distribution on the substrate. This is related to the shape and size of the evaporation source. The simplest ideal evaporation source can be either a point or a small plane.

[0059] 2. Vacuum evaporation method

[0060] (1) Resistance heating evaporation. This method uses a wire or sheet-like high-melting-point metal evaporator of appropriate shape. The film material is placed inside, and a power source is applied to heat the film material through resistance, causing it to evaporate. The basic requirements for the evaporator material are a high melting point, low vapor pressure, and the ability to not chemically react or miscibly dissolve with the film material at the evaporation temperature, while also possessing a certain level of mechanical strength. In addition, resistance heating requires that the evaporator material and the film material be easily wetted to ensure stable evaporation. Commonly used evaporator materials include tungsten, molybdenum, tantalum, graphite, and boron nitride.

[0061] 2) Electron beam evaporation. In resistance heating, the film material is in direct contact with the evaporation source material, which can easily lead to mixing, a problem that needs to be avoided for coating semiconductor substrates and other components. Electron beam heating solves this problem. Its evaporation source is an e-shaped electron gun. The film material is placed in a water-cooled copper crucible, and the electron beam is emitted from the source. A magnetic field coil focuses and deflects the electron beam, causing the electron trajectory to be magnetically deflected by 270°, thus bombarding and heating the film material.

[0062] (3) High-frequency heating. This method involves placing an alumina or graphite crucible inside a high-frequency induction coil to heat the film material using high-frequency induction heating. The induction coil is typically made of water-cooled copper tubing. This method is mainly used for the large-scale evaporation of aluminum.

[0063] (4) Laser heating. This method involves irradiating the surface of the film material with a laser to heat and evaporate it. Since different materials absorb laser light in different wavelength ranges, a suitable laser needs to be selected. After focusing, the power density of this method can reach 106 W / cm², which can evaporate any high-melting-point material that can absorb laser light energy. The evaporation rate is extremely high, and the composition of the resulting film is almost the same as that of the material.

[0064] 3. Vacuum evaporation process

[0065] Vacuum evaporation deposition process is determined according to product requirements. Generally, the process flow of non-continuous deposition is: pre-deposition preparation - vacuuming - ion bombardment - baking - preheating - evaporation - part removal - post-deposition treatment - inspection - finished product.

[0066] Pre-plating preparation includes workpiece cleaning, evaporation source preparation and cleaning, vacuum chamber and workpiece rack cleaning, evaporation source installation, film material cleaning and placement, and workpiece loading. These steps are crucial as they directly affect coating quality. Different cleaning methods are used for different substrates or components. For example, glass should be rinsed or brushed with water after removing surface dirt and oil, then rinsed with pure water, and finally dried or wiped dry with anhydrous alcohol; metal should be rinsed with water and then washed with acid or alkali, followed by rinsing with water and drying; for rougher surfaces and porous substrates, ultrasonic cleaning should be performed simultaneously with water or alcohol cleaning. Plastic workpieces are prone to static electricity during molding; if not eliminated, this can cause pinholes in the film and reduce film adhesion, so static electricity often needs to be removed first.

[0067] After the workpiece is placed in the vacuum chamber, it is first evacuated to a vacuum level of 1-0.1 Pa for ion bombardment. This involves applying a high-voltage current to an aluminum rod within the vacuum chamber, generating a glow discharge that causes electrons to reach high speeds. The workpiece surface quickly acquires a negative charge, attracting positive ions that bombard the surface. A chemical reaction occurs between the workpiece's adsorbed layer and the active gas, further cleaning the workpiece surface. After ion bombardment for a certain time, the high-voltage current is turned off, and the vacuum level is increased while heating and baking are performed at a controlled temperature to allow the gas adsorbed on the workpiece and its holder to escape rapidly. Once a certain vacuum level is reached, a low-power current is applied to the evaporation source to preheat or pre-melt the film material. Then, a current of a specified power is applied to rapidly evaporate the film material. After evaporation, evacuation is stopped, the chamber is refilled, and the vacuum chamber is opened to remove the workpiece. Some films, such as aluminized films, are soft and prone to oxidation and discoloration, requiring a topcoat for protection.

[0068] The above describes the general process of vacuum evaporation. Depending on the specific composition of the film, there are alloy evaporation, compound evaporation, and high-melting-point compound evaporation. Depending on the process, there are also ion beam assisted evaporation, laser beam assisted evaporation, single crystal evaporation, and amorphous evaporation methods.

[0069] Depending on the user's required metal coating width, a blank edge of a certain width is reserved on one side of the metal coating, called a shielding strip. The blank edge area must be clear and free of coating, and the connection between the blank edge area and the metal coating must be clear, without any blurry buffer zones. In production, an oil-coating shielding method is usually used, that is, before thin film evaporation, a layer of oil film is sprayed on the corresponding blank edge area to prevent metal adhesion during evaporation.

[0070] Shielding oil is a crucial material in the metallization coating process, ensuring the deposition of a high-precision aluminum-zinc layer on the base film. It is a colorless and transparent liquid with low surface tension, minimal evaporation loss under vacuum conditions, good viscosity-temperature characteristics, high dielectric constant, and excellent insulation. Therefore, it is used in the vapor deposition process of fully-film capacitors, primarily affecting the adhesion of the deposited material and acting as an insulator between the polypropylene film and the metal coating, thus controlling the process specifications and shape requirements of the metal film. Improper selection or operation of the shielding oil, depending on the specific requirements of the coating process, can affect the metal coating effect, generally leading to the following problems:

[0071] First, improper selection of products in the low-temperature range and high-temperature range can cause the coating process to fail to meet the requirements or severely damage the film, thereby affecting the quality of the coated products. At the same time, improper selection under certain process requirements can also increase production costs.

[0072] Secondly, if the oil temperature is too low when operating the same product, the blank edges will be unclear.

[0073] Third, excessively high oil temperature can cause oil stains, preventing the vapor-deposited material from being deposited or causing the vapor-deposited metal film to fail to meet process requirements in terms of size and shape.

[0074] Fourth, if the effective evaporation temperature range of the same product is too large, it will bring many uncertainties to the operators in actual work, which will increase the difficulty of operation and make it difficult to dynamically control the quality of coated products during the production process.

[0075] Fifth, physical intrusion during the product storage period after production.

[0076] Existing shielding oils are generally applied using spraying equipment. Among these, the oil shielding cover plate is an essential component of high vacuum coating equipment. Shielding oil vapor is continuously sprayed onto a continuously moving thin film through nozzles on the oil shielding cover plate. During coating, the oil adhering to the film is preheated and evaporates. Where there is oil vapor shielding, metal atoms cannot adhere and deposit, forming the so-called "blank zone," or shielding zone. The distance between two adjacent shielding zones is one specification width. Similarly, the distance between adjacent nozzles on the cover plate is also one specification width.

[0077] However, existing spraying equipment can only adjust the amount of shielding oil sprayed, but cannot determine the amount of shielding oil sprayed. Therefore, the amount of shielding oil added during the current metallization film evaporation is mainly determined by experience. This method makes it impossible to quantify the amount of shielding oil in the evaporated metallization film shield, and it is difficult to determine whether the uniformity of the shielding oil amount is appropriate during evaporation.

[0078] To solve this problem, refer to Figure 1 This application provides a method for determining the amount of shielding oil, applied to metallization thin film evaporation, the method comprising:

[0079] S11: Select the cover plate with the preset opening width, such as... Figure 2 and Figure 3 As shown, the opening of the cover plate is used for spraying shielding oil by the spraying device; wherein, the preset opening width is not less than 6mm. Because if the opening width is less than 6mm, it will be too narrow, which will make it impossible to measure the water droplet angle later. Therefore, a cover plate with a preset opening width is selected to ensure convenient measurement of the water droplet angle.

[0080] S12: Perform vapor deposition of metallized thin films;

[0081] Among them, when performing vapor deposition of metallized thin films, target parameters are obtained, including at least one of the following: oil temperature of the coating machine, size of the shielding oil nozzle cover plate, and film winding speed.

[0082] The spraying amount of the spraying device is determined based on the target parameters;

[0083] Metallization films are deposited by vapor deposition based on the amount of coating applied.

[0084] In the process of vapor deposition of metallized thin films, the approximate amount of oil to be sprayed by the spraying device is first determined based on target parameters such as the oil temperature of the coating machine, the size of the shielding oil nozzle cover, and the film winding speed. This is to avoid spraying too much or too little shielding oil during vapor deposition.

[0085] The specific vapor deposition process has not been improved in this application, so it will not be described in detail here.

[0086] S13: Measure the water droplet angle of the shielding oil at the opening of the cover plate;

[0087] As an optional implementation of this application, the method of measuring the water droplet angle of the shielding oil at the opening of the cover plate further includes:

[0088] According to the measurement requirements, the metallized film after vapor deposition is cut into film samples of a preset size, the film samples including the screen strip; for example, the metallized film after vapor deposition is cut into film samples with an area of ​​approximately 100 x 100 mm (including the screen strip); cutting facilitates measurement. Of course, if the metallized film after vapor deposition is small, it can also be cut directly.

[0089] The water droplet angle was obtained by measuring the shielding oil at the screen band of the thin film sample.

[0090] The step of measuring the water droplet angle at the shielding oil at the screen band of the thin film sample includes:

[0091] The water droplet angle is obtained by measuring the shielding oil at the screen band of the thin film sample using a water droplet angle measuring instrument. The water droplet angle measuring instrument can be an optical contact angle measuring instrument or other measuring equipment; this application does not specifically limit its use. Figure 4 As shown, the optical contact angle measuring instrument includes a sample stage for holding a thin film sample or a metallized thin film to be measured for the angle of a water droplet, an injection unit, a data acquisition system, and a light source.

[0092] S14: Determine the amount of shielding oil to be sprayed based on the water droplet angle.

[0093] The amount of shielding oil to be sprayed is determined based on the opening width and the water droplet angle, with reference to... Figure 5 For the same opening width, the larger the water droplet angle, the more shielding oil is sprayed.

[0094] The shielding oil quantity determination method provided in this application embodiment is applied to metallization thin film evaporation. First, a cover plate with a preset opening width is selected. During the evaporation process, the opening of the cover plate is used for spraying shielding oil with a spraying device. In this way, when the metallization thin film is subsequently evaporated, a shielding band is formed at the shielding oil. After the evaporation is completed, the water droplet angle of the shielding oil at the opening of the cover plate, i.e. the shielding band, is measured. Because for the same opening width, the more shielding oil sprayed, the larger the water droplet angle, the amount of shielding oil sprayed can be determined based on the water droplet angle. By using the water droplet angle to represent the amount of shielding oil, the amount of shielding oil sprayed is quantified. It is not necessary to determine the amount of shielding oil sprayed based on experience, ensuring that the amount of shielding oil sprayed meets the user's needs and improving the quality of metallization thin film evaporation.

[0095] Based on the same inventive concept, such as Figure 6 As shown, this application also provides a method for controlling the amount of shielded oil, including:

[0096] S21: Perform vapor deposition testing;

[0097] S22: Determine the amount of shielding oil sprayed during the test vapor deposition according to the shielding oil quantity determination method provided in the above embodiment;

[0098] S23: If the amount of shielding oil sprayed during the test vapor deposition is equal to the preset amount of oil, then keep the amount of shielding oil sprayed during the test vapor deposition unchanged and proceed with the formal vapor deposition.

[0099] If the amount of shielding oil sprayed during the test vapor deposition is less than the preset amount, the test vapor deposition should be performed again, and the amount of shielding oil sprayed should be increased during the new test vapor deposition. Then, the increased amount of shielding oil should be determined again. If the increased amount of shielding oil equals the preset amount, the amount of shielding oil sprayed during this test vapor deposition should remain unchanged, and the formal vapor deposition should be performed.

[0100] If the amount of shielding oil sprayed during the test vapor deposition exceeds the preset amount, the test vapor deposition should be performed again, and the amount of shielding oil sprayed should be reduced during the new test vapor deposition. Then, the amount of shielding oil after reduction should be determined again. If the amount of shielding oil after reduction is equal to the preset amount, the amount of shielding oil sprayed during this test vapor deposition should remain unchanged, and the formal vapor deposition should be performed.

[0101] This application provides a method for controlling the amount of shielding oil. First, a test vapor deposition is performed. Then, the amount of shielding oil sprayed during the test vapor deposition is determined according to the shielding oil amount determination method provided in the above embodiment. When the amount of shielding oil sprayed during the test vapor deposition is equal to the preset amount, the amount of shielding oil sprayed during the test vapor deposition is kept unchanged and the formal vapor deposition is performed, ensuring that the amount of shielding oil during the formal vapor deposition is the preset amount, thereby improving the quality of metallization film vapor deposition.

[0102] Based on the same inventive concept, such as Figure 7 As shown, this application also provides a shielding oil quantity determination device 70, applied to metallization thin film evaporation, the shielding oil quantity determination device 70 comprising:

[0103] The cover plate selection module 71 is used to select a cover plate with a preset opening width, and the opening of the cover plate is used for the spraying device to spray shielding oil.

[0104] Thin film evaporation module 72 is used for evaporating metallized thin films;

[0105] Water droplet angle measurement module 73 is used to measure the water droplet angle of the shielding oil at the opening of the cover plate;

[0106] The oil quantity calculation module 74 is used to determine the amount of shielding oil sprayed based on the water droplet angle.

[0107] This application provides a device for determining the amount of shielding oil. First, a cover plate with a preset opening width is selected. During the vapor deposition process, the opening of the cover plate is used for spraying shielding oil with a spraying device. In this way, when the metallized film is subsequently deposited, a shielding band is formed at the shielding oil. After the vapor deposition is completed, the water droplet angle of the shielding oil at the opening of the cover plate, i.e. the shielding band, is measured. Because for the same opening width, the more shielding oil is sprayed, the larger the water droplet angle is, the amount of shielding oil sprayed can be determined based on the water droplet angle. By using the water droplet angle to represent the amount of shielding oil, the amount of shielding oil sprayed is quantified, eliminating the need to determine the amount of shielding oil sprayed based on experience. This ensures that the amount of shielding oil sprayed meets the user's needs and improves the quality of metallized film vapor deposition.

[0108] Based on the same inventive concept, such as Figure 8 As shown, this application also provides a shielded oil volume control device 80, comprising:

[0109] The vapor deposition test module 81 is used to perform vapor deposition tests.

[0110] The oil quantity determination module 82 is used to determine the amount of shielding oil sprayed during the test vapor deposition according to the shielding oil quantity determination method provided in the above embodiment.

[0111] The formal vapor deposition module 83 is used to maintain the amount of shielding oil sprayed during the test vapor deposition unchanged and perform formal vapor deposition if the amount of shielding oil sprayed during the test vapor deposition is equal to the preset amount of oil.

[0112] The shielding oil quantity control device provided in this application first performs a test vapor deposition, and then determines the quantity of shielding oil sprayed during the test vapor deposition according to the shielding oil quantity determination method provided in the above embodiment. When the quantity of shielding oil sprayed during the test vapor deposition is equal to the preset quantity, the quantity of shielding oil sprayed during the test vapor deposition is kept unchanged and the formal vapor deposition is performed, ensuring that the quantity of shielding oil during the formal vapor deposition is the preset quantity, thereby improving the quality of metallization film vapor deposition.

[0113] Based on the same inventive concept, such as Figure 9 As shown, this application also provides an electronic device 90, comprising:

[0114] At least one processor 91 and at least one memory 92;

[0115] The memory stores the executable instructions of the processor;

[0116] The processor is configured to execute the shielding oil quantity determination method or the shielding oil quantity control method provided in the above embodiments.

[0117] The electronic device provided in this application embodiment stores executable instructions of the processor in a memory. When the executable instructions are executed, the processor can execute the shielding oil quantity determination method or the shielding oil quantity control method provided in the above embodiment. In this way, a cover plate with a preset opening width is selected. During the vapor deposition process, the opening of the cover plate is used for spraying shielding oil by a spraying device. In this way, when the metallization film is subsequently vapor deposited, a shielding band is formed at the shielding oil. After the vapor deposition is completed, the water droplet angle of the shielding oil at the opening of the cover plate, i.e. the shielding band, is measured. Because under the same opening width, the more shielding oil is sprayed, the larger the water droplet angle is, the amount of shielding oil sprayed can be determined based on the water droplet angle. The amount of shielding oil sprayed is quantified by using the water droplet angle to represent the amount of shielding oil sprayed. It is not necessary to determine the amount of shielding oil sprayed based on experience, ensuring that the amount of shielding oil sprayed meets the user's needs and improving the quality of metallization film vapor deposition.

[0118] It should be noted that in the description of this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means at least two.

[0119] It is understood that the same or similar parts in the above embodiments can be referred to each other, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

Claims

1. A method for determining the amount of shielding oil, characterized in that, The method, applied to metallization thin film evaporation, includes: Select a cover plate with a preset opening width, the opening of which is used for the spraying device to spray shielding oil; Perform vapor deposition of metallized thin films; Measure the water droplet angle of the shielding oil at the opening of the cover plate; The amount of shielding oil to be sprayed is determined based on the water droplet angle.

2. The method according to claim 1, characterized in that: The determination of the amount of shielding oil to be sprayed based on the water droplet angle includes: The amount of shielding oil to be sprayed is determined based on the opening width and the water droplet angle. For the same opening width, the larger the water droplet angle, the more shielding oil is sprayed.

3. The method according to claim 1, characterized in that, Also includes: When performing vapor deposition of metallized thin films, target parameters are obtained, including at least one of the following: oil temperature of the coating machine, size of the shielding oil nozzle cover plate, and film winding speed. The spraying amount of the spraying device is determined based on the target parameters; Metallization films are deposited by vapor deposition based on the amount of coating applied.

4. The method according to claim 1, characterized in that: The preset opening width is greater than or equal to 6mm.

5. The method according to claim 1, characterized in that: Measuring the water droplet angle of the shielding oil at the opening of the cover plate also includes: According to the measurement requirements, the metallized thin film after vapor deposition is cut into thin film samples of a preset size, and the thin film samples include screen strips; The water droplet angle was obtained by measuring the shielding oil at the screen band of the thin film sample.

6. The method according to claim 5, characterized in that: The step of measuring the water droplet angle at the shielding oil at the screen band of the thin film sample includes: The water droplet angle was obtained by measuring the shielding oil at the screen band of the thin film sample using a water droplet angle measuring instrument.

7. A method for controlling the amount of shielded oil, characterized in that, include: Perform vapor deposition testing; The method according to any one of claims 1-6 determines the amount of shielding oil sprayed during the test vapor deposition; If the amount of shielding oil sprayed during the test vapor deposition is equal to the preset amount, then the amount of shielding oil sprayed during the test vapor deposition is kept unchanged and the formal vapor deposition is carried out.

8. A device for determining the amount of shielding oil, characterized in that, The apparatus, used for metallization thin film evaporation, includes: The cover plate selection module is used to select a cover plate with a preset opening width, and the opening of the cover plate is used for the spraying device to spray shielding oil. Thin film evaporation module, used for evaporating metallized thin films; A water droplet angle measurement module is used to measure the water droplet angle of the shielding oil at the opening of the cover plate; The oil volume calculation module is used to determine the amount of shielding oil to be sprayed based on the water droplet angle.

9. A shielded oil volume control device, characterized in that, include: The vapor deposition test module is used to perform vapor deposition tests. An oil quantity determination module is used to determine the oil quantity of the shielding oil sprayed during the test vapor deposition according to any one of claims 1-6. The formal vapor deposition module is used to maintain the amount of shielding oil sprayed during the test vapor deposition unchanged and perform formal vapor deposition if the amount of shielding oil sprayed during the test vapor deposition is equal to the preset amount of oil.

10. An electronic device, characterized in that, include: At least one processor and at least one memory; The memory stores the executable instructions of the processor; The processor is configured to perform the method of any one of claims 1-6 or the method of claim 7.

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