Method for reducing FPC cost through bending mode
By creating bridging lines between FPC units and conducting bending tests, the problem of high FPC production costs was solved, achieving efficient testing and material utilization, and reducing overall production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-01
- Publication Date
- 2026-03-31
AI Technical Summary
FPC production costs are high, especially testing costs, and traditional bending processes increase costs and are inefficient.
By creating pre-defined bridging lines between FPC units to form bent bridges, and weakening them in the middle to form bent hinges, the electrical performance testing is integrated. The common circuit network formed by the bent bridges is used for one-time testing, and the bridging lines are then cut to obtain independent units.
It improved testing efficiency, reduced labor costs, simplified the production process, achieved efficient use of materials, and reduced overall production costs.
Abstract
Description
Technical Field
[0001] This invention belongs to the field of flexible circuit board manufacturing technology, specifically relating to a method for reducing FPC costs through bending. Background Technology
[0002] Flexible printed circuit boards (FPCs) are widely used in consumer electronics, automotive electronics, and medical devices due to their advantages such as bendability, light weight, and small size. However, the production cost of FPCs, especially the testing cost, has remained high.
[0003] In existing manufacturing processes, after FPCs complete processes such as pattern etching and lamination, they are typically tested for electrical performance in panel form or after being punched into separate individual FPC units. The former requires the creation of expensive and complex dedicated test fixtures for each different panel layout, resulting in high costs and cumbersome fixture management; the latter requires separate loading, positioning, testing, and unloading of each unit, leading to low efficiency and high labor costs.
[0004] Furthermore, traditional FPC bending processes are merely reactive and costly follow-up steps designed to meet the final product's assembly requirements. Therefore, this invention provides a method for reducing FPC costs through bending, thereby simplifying the manufacturing process and lowering overall testing and production costs. Summary of the Invention
[0005] To achieve the above objectives, the present invention provides the following technical solution: a method for reducing FPC costs through bending, comprising the following steps:
[0006] S1: On the board material of the flexible circuit board, at least one FPC bridge line with a preset routing form is made between adjacent FPC units. The FPC bridge line connects the test points of two independent FPC units at the circuit level to form a bent bridge, and the structure is weakened in the middle of the bridge line to form a preset bent hinge.
[0007] S2: The entire sheet metal with the bending bridge structure is precisely bent along the bending hinge, and the bent FPC unit is kept in a stable test configuration by a temporary fixing structure.
[0008] S3: The bent assembly formed in step S2 is placed as a whole on a universal test base, and the electrical performance of all series-connected FPC units is tested at once through the common circuit network formed by the bent bridge.
[0009] S4: After the test is completed, the temporary fixation is released, the FPC is unfolded, and the bent bridge is cut to obtain an independent FPC unit that has passed the test.
[0010] As a preferred method of reducing FPC costs through bending according to the present invention, the "preset wiring pattern" in S1 is a Z-shaped or U-shaped wiring.
[0011] As a preferred method of reducing FPC costs through bending according to the present invention, the structural weakening is achieved through laser weakening or precision depth-controlled cutting processes.
[0012] As a preferred method of reducing FPC costs through bending according to the present invention, the temporary fixing structure in S2 is a self-adhesive dot or mechanical buckle structure set on the bending fixture. When the FPC is bent to a predetermined angle, a specific part of the FPC unit contacts and is fixed with the temporary fixing structure.
[0013] As a preferred method of reducing FPC costs through bending according to the present invention, the universal test base in S3 is provided with a probe array corresponding to the test points of all the bending bridges on the bending assembly.
[0014] As a preferred method of reducing FPC costs through bending according to the present invention, the bent bridge is cut off by laser cutting or micro-stamping process in step S4.
[0015] Compared with the prior art, the beneficial effects of the present invention are:
[0016] 1. This invention achieves integrated testing through a "bending bridge," eliminating the need for independent testing of each FPC board, thereby improving efficiency and saving labor and reducing production costs.
[0017] 2. This invention integrates the multi-step, discrete process of "punching-individual testing-assembly preparation" in the prior art into a continuous, integrated process of "connection-bending-synchronous testing-separation", thereby reducing the complexity of material handling and production management;
[0018] 3. This invention maximizes the utilization of materials and enhances their value by assigning key temporary electrical functions to the waste area of the board. Detailed Implementation
[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.
[0020] Example 1:
[0021] The following explanation uses the small FPC used inside the charging case of TWS earphones as an example:
[0022] First, in the scrap area or reserved area of the FPC panel, miniature FPC bridging lines connecting adjacent FPC units are fabricated using existing laser cutting or CNC milling machines. These bridging lines employ bending-resistant routing such as "Z" or "U" shapes, and their key test points are connected to the corresponding test points of the two FPC units. In the middle of the bridging line, a precise bending hinge is formed through laser weakening or controlled-depth cutting to ensure stress concentration during bending, protecting the conductors.
[0023] Using a specialized bending fixture, the entire panel is bent along the hinge of the bending bridge in one motion. The fixture integrates miniature self-adhesive dots or mechanical clips to secure the entire panel. When the FPC is bent to a predetermined angle, such as 90° or 180°, the FPC unit combines with these temporary fixing structures to form a stable, three-dimensional test assembly, preventing it from springing open or shifting during testing.
[0024] A universal test base with a probe array perfectly corresponds to the test points of the bent bridges exposed on the bent assembly. By placing the entire assembly into the base at once, parallel electrical performance tests (such as open circuit, short circuit, and impedance tests) can be performed on all connected FPC units through the circuit network formed by the bent bridges.
[0025] After testing, the assembly is removed from the base, the temporary fixation is released, and it is flattened. Finally, the bending bridge is cut off from its connection with the FPC body using a laser or a micro punch, separating multiple independent, confirmed good-quality small FPC units.
[0026] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A method for reducing the cost of FPC by bending, characterized by, The method comprises the following steps: S1: on the board of the flexible circuit board, at least one FPC bridge circuit with a preset trace form is made between adjacent FPC units, the test points of two independent FPC units are connected by the FPC bridge circuit on the circuit layer to form a bending bridge, and structural weakening is performed at the middle position of the bridge circuit to form a preset bending hinge; S2: the whole board with the bending bridge structure is accurately bent once along the bending hinge, and the bent FPC unit is kept in a stable test configuration by a temporary fixing structure; S3: the bending assembly formed in step S2 is placed on a general test base as a whole, and the electrical performance of all the series-connected FPC units is tested at one time through the common circuit network formed by the bending bridge; S4: after the test, the temporary fixing is released, the FPC is unfolded, and the bending bridge is cut off to obtain independent FPC units that have passed the test.
2. The method of claim 1, wherein the FPC is bent. The preset trace form in S1 is a Z-shaped or U-shaped trace.
3. The method of claim 1, wherein the FPC is bent. The structural weakening is performed by a laser weakening or precise depth control cutting process.
4. The method of claim 1, wherein the FPC is bent. The temporary fixing structure in S2 is a self-adhesive dot or a mechanical buckle structure arranged on the bending jig, when the FPC is bent to a predetermined angle, the specific part of the FPC unit contacts and is fixed by the temporary fixing structure.
5. The method of claim 1, wherein the method further comprises: The general test base in S3 is provided with a probe array corresponding to the test points of all the bending bridges on the bending assembly. 6. The method of claim 1, wherein the method further comprises: The bending bridge is cut off by a laser cutting or micro-stamping process in S4.