Film coating device for semiconductor film production

Abstract

The invention discloses a film coating device for semiconductor film production. The invention relates to the technical field of semiconductor manufacturing equipment. The device comprises a box body, a heating box, a harmful gas collecting assembly, a filtering and replacing assembly and a coating heat dissipation assembly; the harmful gas collecting assembly and the filtering and replacing assembly cooperatively treat waste gas and deposited carbon, and the environmental protection property is high; the heating box accurately controls the temperature, the fan group efficiently dissipates heat, and the film quality is guaranteed; the transmission rollers are matched with the motor set to achieve continuous workpiece conveying. The problems that an existing device is poor in environmental protection property, unstable in film quality and low in production efficiency are solved, and efficient, environment-friendly and accurate production of the semiconductor film is achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor thin film production equipment technology, specifically a coating apparatus for semiconductor thin film production. Background Technology

[0002] Semiconductor thin films, due to their excellent electrical and optical properties, are widely used in the manufacture of electronic devices such as chips, photovoltaic cells, and sensors. Coating is the core process in semiconductor thin film production, requiring precise temperature control to achieve uniform film deposition. Traditional semiconductor coating equipment often suffers from limited functionality; the direct emission of harmful gases generated during coating can easily cause environmental pollution, and there is a lack of efficient collection and treatment structures. Furthermore, carbon deposits and impurities easily remain inside the equipment after coating, making cleaning and maintenance cumbersome and affecting the quality of subsequent coatings. In addition, the workpiece temperature can easily become too high during coating, and insufficient heat dissipation can lead to unstable film performance. Moreover, the transmission structure has poor adjustment flexibility, making it difficult to adapt to the coating requirements of workpieces of different sizes.

[0003] Existing coating equipment has obvious defects: Although a semiconductor coating equipment disclosed in patent number CN202221678901.5 has basic coating functions, it lacks targeted harmful gas treatment and carbon deposit collection components, resulting in insufficient environmental protection; moreover, the heat dissipation structure is fixed, the heat dissipation efficiency is limited, and it cannot be dynamically adjusted according to the coating temperature; at the same time, the coordination between the workpiece transmission and the coating device is poor, resulting in insufficient uniformity of thin film deposition.

[0004] Existing coating equipment for semiconductor thin film production generally suffers from the following problems: 1. Harmful gases are directly emitted, polluting the environment, and there is a lack of efficient filtration and collection structures, which does not meet environmental protection requirements; 2. It is inconvenient to clean carbon deposits and impurities inside the equipment, affecting coating accuracy and equipment lifespan; 3. Poor heat dissipation, excessively high workpiece temperature leading to unstable film performance, poor adaptability of transmission structure, and difficulty in meeting the precise transmission requirements of workpieces of different sizes. Summary of the Invention

[0005] The purpose of this invention is to provide a coating apparatus for semiconductor thin film production, so as to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: including a box body, a heating box detachably connected to both sides of the box body surface, a harmful gas collection assembly disposed on the box body surface, a filter replacement assembly disposed inside the box body and the exhaust box, and a coating heat dissipation assembly disposed on the box body. The harmful gas collection assembly includes an air inlet on the surface of the housing, a horizontal plate connected to the surface of the air inlet, a baffle detachably connected to the inside of the horizontal plate, a filter plate connected to the inside of the horizontal plate, an opening inside the horizontal plate, first connecting holes at the four corners of the surface of the air inlet, and second connecting holes at the four corners of the surface of the horizontal plate. The filter replacement assembly includes a turbine detachably connected to the inside of the housing, a duct connected to one end of the turbine, a connection port at one end of the duct, a connecting pipe connected to the inside of the connection port, an extension pipe fixedly connected to one end of the connecting pipe, an exhaust box connected to the top of the housing, an exhaust port inside the exhaust box, a slot on the surface of the exhaust box, a collection box detachably connected to the inside of the slot, and a handle fixedly connected to one end of the collection box. The coating heat dissipation assembly includes an inlet at one end of the housing, an outlet at the other end of the housing surface, a transmission roller connected to the inlet and outlet, a motor unit detachably connected to the housing surface, an air inlet at the bottom of the outlet, an air duct at the bottom inside the outlet, a fan unit connected to the bottom of the air duct, and a coating device detachably connected to the top of the housing. The air inlet and air duct are internally connected, and the motor unit is connected to the transmission roller.

[0007] Preferably, the heating boxes are symmetrically distributed on both sides of the box body, and the heating boxes are connected to the inside of the box body to regulate the coating temperature inside the box body.

[0008] Preferably, the first connecting hole and the second connecting hole have the same diameter, and the horizontal plate is fixedly connected to the air inlet by bolts, and the filter plate covers the inside of the opening.

[0009] Preferably, the turbine is connected to an extension pipe via a duct and a connecting pipe, with the extension pipe facing the interior of the exhaust box to guide the gas flow to the collection box.

[0010] Preferably, the collection box and the slot are connected by a sliding fit, and the collection box is used to collect carbon deposits and impurities generated during the coating process.

[0011] Preferably, there are multiple transmission rollers, which are evenly distributed along the length of the inlet and outlet. The motor unit drives the transmission rollers to rotate for transporting the workpiece to be coated.

[0012] Preferably, the fan assembly is connected to the air duct, drawing in cold air through the air inlet and blowing it onto the workpiece through the air duct to achieve heat dissipation.

[0013] Preferably, the coating device is located at the center of the top of the housing, and the coating range of the coating device covers the transmission path of the drive roller, for depositing a thin film on the surface of the workpiece.

[0014] Preferably, the filter plate has a multi-layer filter structure, and the exhaust port is connected to an external waste gas treatment device for discharging purified gas.

[0015] A method of using a coating apparatus for semiconductor thin film production, characterized by comprising the following steps: Step 1: Equipment Assembly and Debugging: Install the heating box on both sides of the box body, fix the horizontal plate to the air inlet through the first and second connecting holes, and install the baffle and filter plate; connect the turbine, duct, connecting pipe and extension pipe, and insert the collection box into the slot of the exhaust box; install the drive roller and motor set, and ensure that the motor set drives the drive roller to rotate smoothly; check the connection status of the fan set and coating unit to ensure normal operation. Step 2, workpiece feeding and preheating: Place the workpiece to be coated onto the transmission roller through the feeding port, start the motor unit, and the transmission roller drives the workpiece to be transported into the chamber; start the heating chamber, adjust the temperature inside the chamber to the preset coating temperature, and at the same time start the fan unit to preheat the workpiece through the air inlet and air outlet. Step 3, Coating Operation: Start the coating machine to deposit a thin film on the workpiece conveyed by the drive roller; during the coating process, start the turbine, and the generated harmful gases are filtered through the air inlet and filter plate, and then introduced into the exhaust box through the duct, connecting pipe and extension pipe, while carbon deposits and impurities are collected by the collection box. Step 4, Heat Dissipation and Discharge: After coating is completed, the workpiece continues to move towards the discharge port with the transmission rollers. The fan group continuously blows air to dissipate heat and ensure that the workpiece temperature drops to a safe range. The workpiece is discharged through the discharge port and enters the next process. Step 5: Equipment Cleaning and Maintenance: Turn off the power to all components, remove the collection box, and clean the internal carbon deposits and impurities; disassemble the horizontal plate and replace or clean the filter plate; check the operating status of the drive roller and motor unit to ensure there is no jamming. Step 6, Equipment Storage: After maintenance, reinsert the collection box into the slot and fix the horizontal plate in place; close the protective covers of the inlet and outlet, and store the equipment in a dry and ventilated place to prevent the parts from getting damp.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. Integrated treatment of harmful gases and carbon deposits, with outstanding environmental protection: This device uses a combination of a harmful gas collection component and a filter replacement component. Harmful gases generated during coating enter through the inlet, are initially filtered by the filter plate, and then guided to the exhaust box by a turbine. The collection box can efficiently collect carbon deposits and residual impurities, avoiding direct emissions that pollute the environment. The collection box is detachably connected via a slot, and can be quickly pulled out for cleaning by holding the handle. It is easy to operate, reduces environmental risks, and minimizes the impact of impurities accumulating inside the equipment on coating quality, meeting the requirements of green production.

[0017] 2. Precise temperature control and efficient heat dissipation work together to ensure film quality: The heating chambers are symmetrically distributed on both sides of the chamber, which can precisely adjust the coating temperature inside the chamber, providing a stable environment for semiconductor thin film deposition; in the coating heat dissipation component, the fan group draws in cold air through the air inlet and blows it directionally to the workpiece through the air outlet, realizing continuous heat dissipation during and after coating, avoiding excessive workpiece temperature that could lead to film cracking and performance degradation; the synergistic design of temperature control and heat dissipation improves the uniformity of thin film deposition by more than 30%, significantly ensuring the electrical and optical properties of semiconductor thin films.

[0018] 3. Strong transmission adaptability and improved production efficiency: The transmission rollers in the coating and heat dissipation assembly are driven by a motor. Multiple transmission rollers are evenly distributed along the inlet and outlet, which can smoothly transport semiconductor workpieces of different sizes and adapt to diverse production needs. The transmission rollers work together with the coating unit and heat dissipation assembly to realize continuous operation of "feeding-preheating-coating-heat dissipation-discharge", which does not require frequent manual intervention and greatly improves production efficiency. At the same time, the modular design of each component of the equipment makes disassembly and maintenance convenient, reduces downtime, and further ensures production continuity. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a coating apparatus for semiconductor thin film production according to the present invention; Figure 2 This is a schematic diagram of the internal structure of a turbine in a coating apparatus for semiconductor thin film production according to the present invention; Figure 3 This is a schematic diagram of the internal structure of the horizontal plate of a coating apparatus for semiconductor thin film production according to the present invention. Figure 4 This is a schematic diagram of the extension tube structure of a coating apparatus for semiconductor thin film production according to the present invention; Figure 5 This is a schematic diagram of the collection box structure of a coating apparatus for semiconductor thin film production according to the present invention; Figure 6 This is a schematic diagram of the drive roller structure of a coating apparatus for semiconductor thin film production according to the present invention.

[0020] In the diagram: 1. Box body; 2. Heating box; 3. Harmful gas collection assembly; 301. Air inlet; 302. First connecting hole; 303. Horizontal plate; 304. Second connecting hole; 305. Opening; 306. Baffle; 307. Filter plate; 4. Filter replacement assembly; 401. Turbine; 402. Conduit; 403. Connecting port; 404. Connecting pipe; 405. Extension pipe; 406. Exhaust box; 407. Exhaust port; 408. Slot; 409. Collection box; 410. Handle; 5. Coating and heat dissipation assembly; 501. Feed inlet; 502. Discharge port; 503. Drive roller; 504. Motor assembly; 505. Air inlet; 506. Air duct; 507. Fan assembly; 508. Coating device. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0022] Please see Figure 1-6 As shown, a schematic diagram of the overall structure of a coating apparatus for semiconductor thin film production includes a housing 1, a heating box 2 detachably connected to both sides of the surface of the housing 1, a harmful gas collection assembly 3 disposed on the surface of the housing 1, a filter replacement assembly 4 disposed inside the housing 1 and the exhaust box 406, and a coating heat dissipation assembly 5 disposed on the housing 1. The harmful gas collection assembly 3 includes an air inlet 301 on the surface of the housing 1, a horizontal plate 303 connected to the surface of the air inlet 301, a baffle 306 detachably connected to the inside of the horizontal plate 303, a filter plate 307 connected to the inside of the horizontal plate 303, an opening 305 on the inside of the horizontal plate 303, first connecting holes 302 at the four corners of the surface of the air inlet 301, and second connecting holes 304 at the four corners of the surface of the horizontal plate 303. The filter replacement assembly 4 includes a turbine 401 detachably connected to the inside of the housing 1, a conduit 402 connected to one end of the turbine 401, a connection port 403 opened at one end of the conduit 402, a connecting pipe 404 connected to the inside of the connection port 403, an extension pipe 405 fixedly connected to one end of the connecting pipe 404, an exhaust box 406 connected to the top of the housing 1, an exhaust port 407 opened inside the exhaust box 406, a slot 408 opened on the surface of the exhaust box 406, a collection box 409 detachably connected to the inside of the slot 408, and a handle 410 fixedly connected to one end of the collection box 409. The coating heat dissipation assembly 5 includes an inlet 501 at one end of the housing 1, an outlet 502 at the other end of the surface of the housing 1, a transmission roller 503 connected to the inside of the inlet 501 and the outlet 502, a motor assembly 504 detachably connected to the surface of the housing 1, an air inlet 505 at the bottom of the outlet 502, an air duct 506 at the bottom inside the outlet 502, a fan assembly 507 connected to the bottom of the air duct 506, and a coating device 508 detachably connected to the top of the housing 1. The air inlet 505 and the air duct 506 are internally connected, and the motor assembly 504 is connected to the transmission roller 503.

[0023] This invention integrates a heating chamber, a coating unit, a hazardous gas collection component, and a filter replacement component into a single enclosure, creating a sealed or controllable production environment. The hazardous gas collection component actively extracts harmful gases generated during the process from the inlet and performs preliminary treatment via a filter plate, effectively preventing leakage. Simultaneously, the filter replacement component is rationally designed, forming an efficient exhaust path through a turbine, duct, and detachable connecting pipes and extension pipes. In particular, the slots on the exhaust box and the handle-equipped collection box design make the collection, cleaning, or replacement of the final filter material extremely convenient, greatly reducing equipment maintenance difficulty and time costs.

[0024] Specifically, the heating chambers 2 are symmetrically distributed on both sides of the chamber 1, and are connected to the interior of the chamber 1 to regulate the coating temperature inside the chamber 1. The symmetrical distribution of the heating chambers on both sides and their connection to the interior allows for even heating of the interior from both sides, effectively eliminating the problem of uneven thermal field that may result from unilateral heating. This provides a constant and uniformly distributed temperature environment for semiconductor thin film deposition, which is beneficial for improving the thickness consistency and material properties of the thin film.

[0025] Specifically, the first connecting hole 302 and the second connecting hole 304 have the same diameter, and are fixedly connected to the horizontal plate 303 and the air inlet 301 by bolts. The filter plate 307 covers the inside of the opening 305. The air inlet and the horizontal plate are fixed by bolts and matching connecting holes, ensuring a firm connection and good sealing to prevent harmful gases from leaking from the interface. The filter plate covering the inside of the opening forms the first effective filtration barrier for harmful gases entering the collection system, which can pre-intercept larger particles and reduce the load on the downstream filtration components.

[0026] Specifically, the turbine 401 is connected to the extension pipe 405 via the conduit 402 and the connecting pipe 404. The extension pipe 405 faces the interior of the exhaust box 406 and is used to guide the gas flow to the collection box 409. The turbine forms a continuous gas delivery channel through the conduit, connecting pipe, and extension pipe. The design of the extension pipe facing directly into the exhaust box can guide the pre-treated gas to the collection box area in a directional and smooth manner, ensuring the efficiency of gas collection and delivery and reducing airflow turbulence or residue.

[0027] Specifically, the collection box 409 and the slot 408 are slidably connected, and the collection box 409 is used to collect carbon deposits and impurities generated during the coating process.

[0028] Specifically, there are multiple transmission rollers 503, which are evenly distributed along the length of the feed inlet 501 and the discharge outlet 502. The motor unit 504 drives the transmission rollers 503 to rotate, which is used to transport the workpiece to be coated.

[0029] Specifically, the fan assembly 507 is connected to the air duct 506, and draws in cold air through the air inlet 505 and blows it toward the workpiece through the air duct 506 to achieve heat dissipation.

[0030] Specifically, the coating device 508 is located at the top center of the housing 1, and the coating range of the coating device 508 covers the transmission path of the drive roller 503, for depositing a thin film on the surface of the workpiece.

[0031] The collection box and the exhaust box are connected by a sliding fit. The handle allows the collection box, which contains carbon deposits and impurities generated during the coating process, to be quickly extracted for cleaning or replacement without stopping the machine or only pausing it briefly. This greatly improves the convenience of equipment maintenance and the efficiency of continuous production.

[0032] Multiple drive rollers are evenly distributed along the feed-to-discharge direction and are uniformly driven by a motor unit, forming a stable transmission platform. This design ensures that the workpiece to be coated (especially brittle semiconductor substrates) is subjected to uniform force, without vibration or jamming during transmission, achieving continuous and stable operation from feed to discharge, which is the foundation for automated and efficient production.

[0033] The fan assembly works directly with the air vents, actively drawing in cool air from the inlet and directing it through the vents onto the surface of the hot workpiece that has just been coated. This directional forced air cooling method has high heat dissipation efficiency and a clear airflow path, enabling the workpiece to cool down quickly and evenly, which is beneficial for rapid film setting and reduces thermal stress damage. The coating unit is located at the top center of the housing, and its coating area covers the entire transmission path of the drive rollers. This ensures that as the workpiece passes through at a constant speed, all points on its surface receive uniform coating material deposition from directly above, effectively avoiding uneven coating at the edges or center areas, and significantly improving the uniformity of film coverage and product quality.

[0034] Specifically, the filter plate 307 has a multi-layer filter structure, and the exhaust port 407 is connected to an external waste gas treatment device to discharge purified gas.

[0035] The coating heat dissipation assembly enables continuous production of semiconductor thin films, with drive rollers automating material transport driven by a motor. Its unique heat dissipation design, through the coordination of air inlets, outlets, and a fan assembly, provides directional forced cooling in the post-coating discharge area. This timely heat dissipation helps the film solidify quickly, reduces thermal stress, and may positively impact film uniformity, adhesion, and product yield.

[0036] The entire device features a compact layout, with all functional modules organically integrated around the enclosure. The hazardous gas collection and filtration replacement components work in tandem to achieve closed-loop management of process exhaust gases, encompassing "collection-preliminary filtration-deep treatment / collection." Simultaneously, the heat dissipation function directly targets the post-coating stage, without affecting the temperature environment of the coating reaction zone, demonstrating the high efficiency of functional zoning and synergy.

[0037] A method of using a coating apparatus for semiconductor thin film production includes the following steps: Step 1: Equipment Assembly and Debugging: Install the heating box 2 on both sides of the box body 1. The horizontal plate 303 is fixed to the air inlet 301 through the first connecting hole 302 and the second connecting hole 304. Install the baffle 306 and the filter plate 307. Connect the turbine 401, duct 402, connecting pipe 404 and extension pipe 405. Insert the collection box 409 into the slot 408 of the exhaust box 406. Install the drive roller 503 and the motor set 504, ensuring that the motor set 504 drives the drive roller 503 to rotate smoothly. Check the connection status of the fan set 507 and the coating device 508 to ensure normal operation. Step 2, workpiece feeding and preheating: Place the workpiece to be coated onto the transmission roller 503 through the feed port 501, start the motor group 504, and the transmission roller 503 drives the workpiece to be transported into the chamber 1; start the heating chamber 2, adjust the temperature inside the chamber 1 to the preset coating temperature, and at the same time start the fan group 507 to preheat the workpiece through the air inlet 505 and the air outlet 506. Step 3, Coating operation: Start the coating machine 508 to deposit a thin film on the workpiece conveyed by the drive roller 503; during the coating process, start the turbine 401, and the harmful gas generated is filtered through the air inlet 301 and the filter plate 307, and then introduced into the exhaust box 406 through the conduit 402, the connecting pipe 404, and the extension pipe 405. The carbon deposits and impurities are collected by the collection box 409. Step 4, Heat Dissipation and Discharge: After the coating is completed, the workpiece continues to move towards the discharge port 502 along with the transmission roller 503. The fan group 507 continuously blows air to dissipate heat and ensure that the workpiece temperature drops to a safe range. The workpiece is discharged through the discharge port 502 and enters the next process. Step 5: Equipment Cleaning and Maintenance: Turn off the power to all components, remove the collection box 409, and clean the internal carbon deposits and impurities; disassemble the horizontal plate 303, and replace or clean the filter plate 307; check the operating status of the transmission roller 503 and the motor unit 504 to ensure there is no jamming. Step 6, Equipment Storage: After maintenance, reinsert the collection box 409 into the slot 408 and reset and fix the horizontal plate 303; close the protective covers of the inlet 501 and outlet 502, and store the equipment in a dry and ventilated place to avoid moisture damage to the parts.

[0038] Working principle: This device works in concert with the harmful gas collection component 3 and the filter replacement component 4. The harmful gases generated during coating enter through the air inlet 301, are initially filtered by the filter plate 307, and then guided to the exhaust box 406 by the turbine 401. The collection box 409 can efficiently collect carbon deposits and residual impurities, avoiding direct emissions that pollute the environment. The collection box 409 is detachably connected through the slot 408 and can be quickly pulled out for cleaning by holding the handle 410. It is easy to operate, reduces environmental risks, and minimizes the impact of impurity accumulation inside the equipment on coating quality, meeting the requirements of green production. The heating box 2 is symmetrically distributed on both sides of the box 1, which can precisely adjust the coating temperature inside the box 1, providing a stable environment for semiconductor thin film deposition.

[0039] In the coating heat dissipation component 5, the fan group 507 draws in cool air through the air inlet 505 and blows it directionally onto the workpiece through the air guide 506, achieving continuous heat dissipation during and after the coating process, avoiding excessive workpiece temperature that could lead to film cracking and performance degradation. The synergistic design of temperature control and heat dissipation improves the uniformity of film deposition, significantly ensuring the electrical and optical properties of semiconductor films. The drive rollers 503 in the coating heat dissipation component 5 are driven by the motor group 504. Multiple drive rollers 503 are evenly distributed along the feed inlet 501 and the discharge outlet 502, which can smoothly transport semiconductor workpieces of different sizes to meet diverse production needs. The drive rollers 503 work in conjunction with the coating unit 508 and the heat dissipation component to achieve continuous operation of "feeding-preheating-coating-heat dissipation-discharge", eliminating the need for frequent manual intervention and greatly improving production efficiency. At the same time, the modular design of each component of the equipment makes disassembly and maintenance convenient, reducing downtime and further ensuring production continuity.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A coating apparatus for semiconductor thin film production, characterized in that: It includes a housing (1), a heating box (2) detachably connected to both sides of the surface of the housing (1), a harmful gas collection assembly (3) set on the surface of the housing (1), a filter replacement assembly (4) set inside the housing (1) and the exhaust box (406), and a coating heat dissipation assembly (5) set on the housing (1). The harmful gas collection assembly (3) includes an air inlet (301) on the surface of the housing (1), a horizontal plate (303) connected to the surface of the air inlet (301), a baffle (306) detachably connected to the inside of the horizontal plate (303), a filter plate (307) connected to the inside of the horizontal plate (303), an opening (305) on the inside of the horizontal plate (303), first connecting holes (302) at the four corners of the surface of the air inlet (301), and second connecting holes (304) at the four corners of the surface of the horizontal plate (303). The filter replacement assembly (4) includes a turbine (401) detachably connected to the inside of the housing (1), a conduit (402) connected to one end of the turbine (401), a connection port (403) opened at one end of the conduit (402), a connecting pipe (404) connected to the inside of the connection port (403), an extension pipe (405) fixedly connected to one end of the connecting pipe (404), an exhaust box (406) connected to the top of the housing (1), an exhaust port (407) opened inside the exhaust box (406), a slot (408) opened on the surface of the exhaust box (406), a collection box (409) detachably connected to the inside of the slot (408), and a handle (410) fixedly connected to one end of the collection box (409). The coating heat dissipation assembly (5) includes an inlet (501) at one end of the housing (1), an outlet (502) at the other end of the surface of the housing (1), a transmission roller (503) connected to the inside of the inlet (501) and the outlet (502), a motor assembly (504) detachably connected to the surface of the housing (1), an air inlet (505) at the bottom of the outlet (502), an air guide (506) at the bottom of the inner side of the outlet (502), a fan assembly (507) connected to the bottom of the air guide (506), and a coating device (508) detachably connected to the top of the housing (1). The air inlet (505) and the air guide (506) are connected internally, and the motor assembly (504) is connected to the transmission roller (503).

2. The coating apparatus for semiconductor thin film production according to claim 1, characterized in that: The heating boxes (2) are symmetrically distributed on both sides of the box body (1). The heating boxes (2) are connected to the inside of the box body (1) and are used to adjust the coating temperature inside the box body (1).

3. The coating apparatus for semiconductor thin film production according to claim 2, characterized in that: The first connecting hole (302) and the second connecting hole (304) have the same diameter. The horizontal plate (303) and the air inlet (301) are fixedly connected by bolts. The filter plate (307) covers the inside of the opening (305).

4. The coating apparatus for semiconductor thin film production according to claim 2, characterized in that: The turbine (401) is connected to the extension pipe (405) via the conduit (402) and the connecting pipe (404). The extension pipe (405) faces the interior of the exhaust box (406) and is used to guide the gas flow to the collection box (409).

5. A coating apparatus for semiconductor thin film production according to claim 4, characterized in that: The collection box (409) and the slot (408) are connected by a sliding fit. The collection box (409) is used to collect carbon deposits and impurities generated during the coating process.

6. The coating apparatus for semiconductor thin film production according to claim 4, characterized in that: The transmission rollers (503) are multiple and are evenly distributed along the length of the feed inlet (501) and the discharge outlet (502). The motor unit (504) drives the transmission rollers (503) to rotate and is used to transport the workpiece to be coated.

7. A coating apparatus for semiconductor thin film production according to claim 6, characterized in that: The fan assembly (507) is connected to the air duct (506) to draw in cold air through the air inlet (505) and blow it toward the workpiece through the air duct (506) to achieve heat dissipation.

8. A coating apparatus for semiconductor thin film production according to claim 7, characterized in that: The coating device (508) is located at the top center of the housing (1), and the coating range of the coating device (508) covers the transmission path of the drive roller (503) for depositing a thin film on the surface of the workpiece.

9. A coating apparatus for semiconductor thin film production according to claim 1, characterized in that: The filter plate (307) has a multi-layer filter structure, and the exhaust port (407) is connected to an external waste gas treatment device for discharging purified gas.

10. A method of using a coating apparatus for semiconductor thin film production according to any one of claims 1-9, characterized in that: Includes the following steps: Step 1, Equipment Assembly and Debugging: Install the heating box (2) on both sides of the box body (1), fix the horizontal plate (303) to the air inlet (301) through the first connecting hole (302) and the second connecting hole (304), and install the baffle (306) and the filter plate (307); connect the turbine (401), the duct (402), the connecting pipe (404) and the extension pipe (405), and insert the collection box (409) into the slot (408) of the exhaust box (406); install the drive roller (503) and the motor set (504), and ensure that the motor set (504) drives the drive roller (503) to rotate smoothly; check the connection status of the fan set (507) and the coating device (508) to ensure normal operation; Step 2, workpiece feeding and preheating: Place the workpiece to be coated onto the transmission roller (503) through the feed port (501), start the motor group (504), and the transmission roller (503) drives the workpiece to be transported into the box (1); start the heating box (2), adjust the temperature inside the box (1) to the preset coating temperature, and at the same time start the fan group (507) to preheat the workpiece through the air inlet (505) and the air guide (506); Step 3, Coating operation: Start the coating machine (508) to deposit a thin film on the workpiece conveyed by the drive roller (503); during the coating process, start the turbine (401), and the generated harmful gas is filtered through the air inlet (301) and filter plate (307) and then introduced into the exhaust box (406) through the conduit (402), connecting pipe (404) and extension pipe (405). Carbon deposits and impurities are collected by the collection box (409); Step 4, heat dissipation and unloading: After the coating is completed, the workpiece continues to move towards the discharge port (502) with the transmission roller (503). The fan group (507) continuously blows air to dissipate heat and ensure that the workpiece temperature drops to a safe range. The workpiece is discharged through the discharge port (502) and enters the next process. Step 5, Equipment Cleaning and Maintenance: Turn off the power to each component, remove the collection box (409), and clean the internal carbon deposits and impurities; disassemble the horizontal plate (303), and replace or clean the filter plate (307); check the operating status of the drive roller (503) and motor unit (504) to ensure there is no jamming; Step 6, Equipment Storage: After maintenance, reinsert the collection box (409) into the slot (408) and fix the horizontal plate (303) in place; close the protective covers of the feed inlet (501) and the discharge outlet (502), and store the equipment in a dry and ventilated place to prevent the parts from getting damp.

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