Liquid cooling system and electronic device
By using a parallel cold plate design and optimizing fluid connectivity, the liquid cooling system's heat dissipation capacity for DIMMs has been improved, meeting the needs of higher-performance electronic devices, reducing space occupation, and solving the problem of insufficient heat dissipation in existing liquid cooling systems.
Patent Information
- Application Number
- CN202511860771.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-10
- Publication Date
- 2026-04-07
AI Technical Summary
In the existing technology, liquid cooling heat dissipation system has insufficient heat dissipation capacity for DIMM, especially as the performance requirements of electronic devices increase and the heat generation of DIMM increases, the heat dissipation capacity of existing series cold plates is insufficient.
The parallel cold plate design is adopted, and the liquid inlet shell assembly, the manifold shell assembly and the liquid outlet shell are connected to reduce the flow resistance of the cooling fluid and enhance the heat exchange efficiency. The liquid inlet pipe, liquid inlet nozzle, liquid outlet pipe and liquid outlet nozzle are centrally configured to reduce space occupation.
It improves the heat dissipation capacity of heat sources, adapts to the heat dissipation requirements of higher power heat sources, and reduces the space occupied by the liquid cooling system in electronic devices, thereby increasing the flexibility of the system.
Smart Images
Figure CN121807126A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of computer devices, and particularly relates to a liquid cooling system and an electronic device. BACKGROUND
[0002] The operation of an electronic device is accompanied by the generation of a large amount of heat energy. If the heat energy cannot be effectively removed, the internal electronic components will overheat, resulting in problems such as functional failure or shutdown. Therefore, a corresponding heat dissipation system is usually configured in the electronic device to ensure that the operation of the components does not exceed the preset operating temperature range.
[0003] For example, a dual in-line memory module (DIMM) can be arranged in the electronic device to improve the performance of the system, and a liquid cooling heat dissipation system is arranged to provide better heat dissipation effect for the DIMM. The current liquid cooling heat dissipation system dissipates heat from the DIMM through a series of cold plates. However, as users' demand for the performance of the electronic device gradually increases, the heat generated by the DIMM also gradually increases, so that the heat dissipation capacity of the current series of cold plates for the DIMM is insufficient. Therefore, how to improve the heat dissipation capacity for the DIMM is one of the problems to be solved by researchers. SUMMARY
[0004] The present application provides a liquid cooling system and an electronic device, so as to improve the heat dissipation capacity of the heat source.
[0005] The present application provides a liquid cooling system for thermally coupling to a plurality of heat sources, the liquid cooling system comprising:
[0006] a liquid inlet housing assembly having a shunt flow channel and a liquid inlet, the liquid inlet being in fluid communication with the shunt flow channel;
[0007] a plurality of first cold plates each having a first heat exchange flow channel, one end of the plurality of first heat exchange flow channels being in fluid communication with opposite sides of the shunt flow channel, respectively, and the plurality of first cold plates being used for thermally coupling to at least part of the plurality of heat sources;
[0008] a liquid outlet housing assembly having a liquid outlet and a liquid outlet flow channel, the liquid outlet being in fluid communication with the liquid outlet flow channel, and the other end of the plurality of first heat exchange flow channels being in fluid communication with the liquid outlet flow channel;
[0009] a plurality of second cold plates, the plurality of second cold plates being arranged in a straight line and side by side with the plurality of first cold plates, the plurality of second cold plates being located between the plurality of first cold plates, the plurality of second cold plates each having a second heat exchange flow channel, one end of the plurality of second heat exchange flow channels being in fluid communication with the liquid outlet flow channel, and the plurality of second cold plates being used for thermally coupling to at least another part of the plurality of heat sources;
[0010] an outlet shell member disposed at one end of the plurality of second cold plates and having an outlet opening, another end of the plurality of second heat exchange channels being in fluid communication with the outlet opening, and the outlet opening having a height greater than that of the inlet opening;
[0011] an inlet pipe having one end in fluid communication with the inlet opening, and an outlet pipe having one end in fluid communication with the outlet opening;
[0012] an inlet nozzle disposed at another end of the inlet pipe, and an outlet nozzle disposed at another end of the outlet pipe, and the inlet nozzle and the outlet nozzle being parallel to each other in an extending direction;
[0013] wherein the inlet opening and the outlet opening are located at the same side of the plurality of second cold plates.
[0014] In one embodiment, the liquid cooling system further comprises two first communication pipes, the inlet shell assembly comprises a first shell member having the inlet opening, and two second shell members disposed at one end of the plurality of first cold plates, the outlet shell member is located between the two second shell members, one end of the two first communication pipes is in fluid communication with the first shell member, and another end of the two first communication pipes is in fluid communication with the two second shell members, so that the first shell member, the two second shell members, and the two first communication pipes collectively form the branch flow channel.
[0015] In one embodiment, the liquid cooling system further comprises two second communication pipes, the inlet shell assembly comprises two third shell members disposed at another end of the plurality of first cold plates, and a fourth shell member disposed at another end of the plurality of second cold plates, the fourth shell member is located between the two third shell members, one end of the two second communication pipes is in fluid communication with the two third shell members, and another end of the two second communication pipes is in fluid communication with the fourth shell member, so that the two third shell members, the fourth shell member, and the two second communication pipes collectively form the branch flow channel.
[0016] In one embodiment, the two first communication pipes and the two second communication pipes are flexible pipes.
[0017] In one embodiment, the extending direction of the inlet shell assembly is parallel to the extending direction of the outlet shell member.
[0018] The present application also provides an electronic device comprising:
[0019] a circuit board;
[0020] a plurality of heat sources disposed on the circuit board;
[0021] and a liquid cooling system, comprising:
[0022] a liquid inlet housing assembly having a split flow channel and a liquid inlet port in fluid communication with the split flow channel;
[0023] a plurality of first cold plates each having a first heat exchange channel, one end of the plurality of first heat exchange channels being in fluid communication with opposite sides of the split flow channel, and the plurality of first cold plates being thermally coupled to at least a portion of the plurality of heat sources;
[0024] a liquid outlet housing assembly having a merge flow channel, the other end of the plurality of first heat exchange channels being in fluid communication with the merge flow channel;
[0025] a plurality of second cold plates, the plurality of second cold plates being in line and side by side with the plurality of first cold plates, the plurality of second cold plates being positioned between the plurality of first cold plates, the plurality of second cold plates each having a second heat exchange channel, one end of the plurality of second heat exchange channels being in fluid communication with the merge flow channel, and the plurality of second cold plates being thermally coupled to at least another portion of the plurality of heat sources;
[0026] a liquid outlet housing member positioned at one end of the plurality of second cold plates and having a liquid outlet port, the other end of the plurality of second heat exchange channels being in fluid communication with the liquid outlet port, and the liquid inlet port being closer to the circuit board than the liquid outlet port;
[0027] a liquid inlet tube and a liquid outlet tube, one end of the liquid inlet tube being in fluid communication with the liquid inlet port, and one end of the liquid outlet tube being in fluid communication with the liquid outlet port;
[0028] and a liquid inlet nozzle and a liquid outlet nozzle, the liquid inlet nozzle being positioned at an end of the liquid inlet tube distal from the liquid inlet housing assembly, the liquid outlet nozzle being positioned at an end of the liquid outlet tube distal from the liquid outlet housing member, and the liquid inlet nozzle and the liquid outlet nozzle being parallel to an extension direction thereof;
[0029] wherein the liquid inlet port and the liquid outlet port are on the same side of the plurality of second cold plates.
[0030] In one embodiment, the liquid cooling system further comprises two first communication tubes, the liquid inlet housing assembly comprises a first housing member having the liquid inlet port and two second housing members positioned at one end of the plurality of first cold plates, the liquid outlet housing member being positioned between the two second housing members, one end of the two first communication tubes being in fluid communication with the first housing member, and the other end of the two first communication tubes being in fluid communication with the two second housing members, so that the first housing member, the two second housing members, and the two first communication tubes collectively form the split flow channel.
[0031] In one of the embodiments, the liquid cooling system further comprises two second communication pipes, the current collecting housing assembly comprises two third housing members and a fourth housing member, the two third housing members are arranged at the other ends of the first cold plates, the fourth housing member is arranged at the other ends of the second cold plates, the fourth housing member is located between the two third housing members, one ends of the two second communication pipes are in fluid communication with the two third housing members, the other ends of the two second communication pipes are in fluid communication with the fourth housing member, so that the two third housing members, the fourth housing member and the two second communication pipes jointly form the current collecting flow channel.
[0032] In one of the embodiments, the two first communication pipes and the two second communication pipes are flexible pipes.
[0033] In one of the embodiments, the extension direction of the liquid inlet housing assembly is parallel to the extension direction of the liquid outlet housing member.
[0034] The liquid cooling system and the electronic device, the first cold plates, the second cold plates and the heat sources are arranged in parallel, and are in communication with the liquid inlet housing assembly, the current collecting housing assembly and the liquid outlet housing member, so as to reduce the flow resistance of the cooling fluid, and the first cold plates, the second cold plates and the heat sources can be more fully exchanged. In this way, the heat dissipation capacity of the liquid cooling system for the heat sources can be improved.
[0035] In addition, the liquid inlet pipe, the liquid inlet nozzle, the liquid outlet pipe and the liquid outlet nozzle are located on the same side of the second cold plates and are arranged in an upper and lower manner, so that the liquid inlet pipe, the liquid inlet nozzle, the liquid outlet pipe and the liquid outlet nozzle are concentrated in the same area of the liquid cooling system, and other flow pipes do not need to be additionally arranged to fluidly connect the housing members and the cold plates, thereby reducing the space occupied by the liquid cooling system in the electronic device. In this way, the flexibility of the liquid cooling system arranged in the electronic device can be improved. BRIEF DESCRIPTION OF DRAWINGS
[0036] Figure 1 It is a perspective view of the electronic device according to the embodiments of the present application.
[0037] Figure 2 It is a perspective view of the electronic device according to the embodiments of the present application. Figure 1 It is a side view of the electronic device according to the embodiments of the present application.
[0038] Figure 3 It is a side view of the cooling fluid flowing in the liquid cooling system of the electronic device according to the embodiments of the present application. Figure 1 It is a side view of the cooling fluid flowing in the liquid cooling system of the electronic device according to the embodiments of the present application.
[0039] Figure 4 It is another side view of the cooling fluid flowing in the liquid cooling system of the electronic device according to the embodiments of the present application. Figure 1 It is another side view of the cooling fluid flowing in the liquid cooling system of the electronic device according to the embodiments of the present application.
[0040] Figure 5 It is a side view of the cooling fluid flowing in the liquid cooling system of the electronic device according to the embodiments of the present application.Figure 1 A top view schematic diagram of the liquid cooling system of the electronic device.
[0041] Reference signs:
[0042] 10, electronic device; 11, circuit board; 12, heat source; 13, liquid cooling system; 131, liquid inlet housing assembly; 1311, first housing piece; 1312, second housing piece; 132, first communication pipe; 133, first cold plate; 1331, first heat exchange flow channel; 134, second cold plate; 1341, second heat exchange flow channel; 135, liquid outlet housing assembly; 1351, third housing piece; 1352, fourth housing piece; 136, second communication pipe; 137, liquid outlet housing piece; 138, liquid inlet pipe; 1385, liquid inlet nozzle; 139, liquid outlet pipe; 1395, liquid outlet nozzle;
[0043] A~F, direction; A1, liquid inlet; A2, liquid outlet; C1, branch flow channel; C2, converging flow channel. DETAILED DESCRIPTION
[0044] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a variety of ways beyond the specific embodiments described herein, and it is understood that similar modifications of the present application can be constructed by those skilled in the art without departing from the scope of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.
[0045] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0046] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0047] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0048] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0049] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0050] Please see Figures 1 to 3 . Figure 1 This is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present invention. Figure 2 for Figure 1 A side view of the electronic device. Figure 3 For cooling fluid Figure 1 A side view of the flow within the liquid cooling system of an electronic device.
[0051] The electronic device 10 of this embodiment includes a circuit board 11, multiple heat sources 12, and a liquid cooling system 13. These heat sources 12 are, for example, dual in-line memory modules (DIMMs) and are disposed on the circuit board 11. The liquid cooling system 13 is used to contain cooling fluid (not shown). The cooling fluid is, for example, water, but is not limited thereto. The liquid cooling system 13 includes an inlet housing assembly 131, two first connecting pipes 132, multiple first cold plates 133, multiple second cold plates 134, a manifold housing assembly 135, two second connecting pipes 136, an outlet housing 137, an inlet pipe 138, an inlet nozzle 1385, an outlet pipe 139, and an outlet nozzle 1395.
[0052] The liquid inlet housing assembly 131 includes a first housing 1311 and two second housings 1312. The first housing 1311 has a liquid inlet A1. The two second housings 1312 are disposed at one end of the first cold plates 133. One end of two first connecting pipes 132 is in fluid communication with the first housing 1311. The other end of the two first connecting pipes 132 is in fluid communication with the two second housings 1312, so that the first housing 1311, the two second housings 1312, and the two first connecting pipes 132 together form a diversion channel C1. The liquid inlet A1 is in fluid communication with the diversion channel C1. The first housing 1311 and the two second housings 1312 are made of, for example, stainless steel, and the two first connecting pipes 132 are, for example, flexible hoses.
[0053] Each of these first cold plates 133 has a first heat exchange channel 1331 (please refer to the following for details). Figure 5 One end of each of the first heat exchange channels 1331 is in fluid communication with the opposite sides of the branch channels C1. The first cold plates 133 are thermally coupled to at least a portion of the heat sources 12. The second cold plates 134 are arranged side-by-side with the first cold plates 133, for example, along a straight line, and are located between the first cold plates 133. The material of the first cold plates 133 and the second cold plates 134 is, for example, copper. This increases the structural strength of the first cold plates 133 and the second cold plates 134. Furthermore, the spacing between the first cold plates 133 and the second cold plates 134 can be adjusted according to actual needs during manufacturing.
[0054] The manifold housing assembly 135 includes two third housing members 1351 and a fourth housing member 1352. The two third housing members 1351 are disposed at the other end of the first cold plates 133. The fourth housing member 1352 is disposed at one end of the second cold plates 134. The fourth housing member 1352 is located between the two third housing members 1351. One end of each of the two second connecting pipes 136 is in fluid communication with the two third housing members 1351. The other end of each of the two second connecting pipes 136 is in fluid communication with the fourth housing member 1352, so that the two third housing members 1351, the fourth housing member 1352, and the two second connecting pipes 136 together form a manifold channel C2. The other end of the first heat exchange channel 1331 is in fluid communication with the manifold channel C2. The two third housing members 1351 and the fourth housing member 1352 are made of, for example, stainless steel, and the two second connecting pipes 136 are, for example, flexible hoses.
[0055] Each of these second cold plates 134 has a second heat exchange channel 1341 (please refer to the following for details) Figure 5 One end of each of these second heat exchange channels 1341 is in fluid communication with the confluence channel C2. Each of these second cold plates 134 is thermally coupled to at least another portion of these heat sources 12. The first cold plates 133, the second cold plates 134, and the heat sources 12 are arranged, for example, in parallel.
[0056] A liquid outlet housing 137 is disposed at the other end of these second cold plates 134 and has a liquid outlet A2. The other end of these second heat exchange channels 1341 is in fluid communication with the liquid outlet A2. The extending direction of the liquid inlet housing assembly 131 is, for example, parallel to the extending direction of the liquid outlet housing 137. Furthermore, the liquid inlet A1 is closer to the circuit board 11 than the liquid outlet A2. That is, the height of the liquid outlet A2 is greater than the height of the liquid inlet A1. Moreover, the liquid inlet A1 and the liquid outlet A2 are located on the same side of these second cold plates 134.
[0057] One end of the inlet pipe 138 is in fluid communication with the inlet port A1. The inlet nozzle 1385 is located at the end of the inlet pipe 138 away from the inlet housing assembly 131. One end of the outlet pipe 139 is in fluid communication with the outlet port A2. The outlet nozzle 1395 is located at the end of the outlet pipe 139 away from the outlet housing assembly 137. In summary, the inlet pipe 138, inlet nozzle 1385, outlet pipe 139, and outlet nozzle 1395 are located on the same side of these second cold plates 134 and are arranged vertically. The inlet nozzle 1385 and outlet nozzle 1395 extend in parallel directions.
[0058] Compared to using cold plates arranged in series to dissipate heat from these heat sources, in this embodiment, since the first cold plates 133 and the second cold plates 134 are arranged in parallel with the heat sources 12 and connected to the liquid outlet shell 137 through the liquid inlet shell assembly 131 and the manifold shell assembly 135, the flow resistance of the cooling fluid can be reduced. Therefore, the first cold plates 133 and the second cold plates 134 can exchange heat more fully with the heat sources 12. In this way, the heat dissipation capacity of the liquid cooling system 13 for the heat sources 12 can be improved.
[0059] For example, suppose the flow rate of the cooling fluid is, for instance, 1.2 liters per minute (LPM). When a typical liquid cooling system dissipates heat from a heat source with a power of, for example, 22 watts, the highest temperature of the heat source is, for example, 66.74°C. However, when the liquid cooling system 13 of this embodiment dissipates heat from a heat source with a power of, for example, 40 watts, the highest temperature of the heat source is, for example, 66.835°C. In summary, by reducing the highest temperature of the heat source to, for example, close to 67°C, compared to a typical liquid cooling system that can only dissipate heat from a heat source with a power of 22 watts, the liquid cooling system 13 of this embodiment can further dissipate heat from a heat source with a power of 40 watts. In other words, by changing the series-connected cold plates to parallel-connected cold plates, the liquid cooling system 13 can dissipate heat from heat sources with higher power. In this way, the heat dissipation capacity of the liquid cooling system 13 is improved.
[0060] Furthermore, since the inlet pipe 138, inlet nozzle 1385, outlet pipe 139, and outlet nozzle 1395 are located on the same side of these second cold plates 134 and are arranged vertically, the inlet pipe 138, inlet nozzle 1385, outlet pipe 139, and outlet nozzle 1395 are concentrated in the same area of the liquid cooling system 13. Therefore, there is no need to install other flow pipes to fluidly connect the various housings and cold plates, thereby reducing the space occupied by the liquid cooling system 13 within the electronic device 10. In this way, the flexibility of the liquid cooling system 13 in the electronic device 10 can be improved.
[0061] Please refer to the following: Figures 3 to 5 . Figure 4 For cooling fluid Figure 1 A schematic diagram of the flow within the liquid cooling system of an electronic device from another side. Figure 5 For cooling fluid Figure 1 A top-view schematic diagram of the flow within the liquid cooling system of an electronic device.
[0062] In this embodiment, the cooling fluid circulation in the liquid cooling system 13 is as follows. First, the cooling fluid flows into the inlet pipe 138 from the inlet nozzle 1385, and then... Figure 3 As shown, cooling fluid flows in direction A through the inlet pipe 138 toward the first housing member 1311 of the inlet housing assembly 131. Then, as... Figures 3 to 5As shown, the cooling fluid flows from the first housing 1311 along direction B through two first connecting pipes 132 to two second housings 1312.
[0063] Next, as Figure 3 and Figure 5 As shown, cooling fluid flows from the two second housing members 1312 in direction C through the first heat exchange channels 1331 of the first cold plates 133 towards the two third housing members 1351 of the manifold housing assembly 135. When the cooling fluid flows through these first heat exchange channels 1331, the cooling fluid absorbs heat transferred to these first heat exchange channels 1331 by the heat source 12. Then, as... Figure 5 As shown, the cooling fluid flows from the two third shells 1351 along direction D through the two second connecting pipes 136 toward the fourth shell 1352.
[0064] Next, as Figure 5 As shown, cooling fluid flows from the fourth housing 1352 along direction E through the second heat exchange channels 1341 of the second cold plates 134 toward the outlet housing 137. When the cooling fluid flows through these second heat exchange channels 1341, it absorbs heat transferred from the heat source 12 to these second heat exchange channels 1341. Then, as... Figure 3 and Figure 5 As shown, after the cooling fluid flows from the outlet housing 137 into the outlet pipe 139, the cooling fluid flows in the direction F within the outlet pipe 139 and flows out of the liquid cooling system 13 through the outlet nozzle 1395 to begin the next cooling cycle. In this way, the liquid cooling system 13 can continuously dissipate heat from these heat sources 12.
[0065] According to the liquid cooling system and electronic device of the above embodiments, since the first cold plates, the second cold plates, and the heat sources are arranged in parallel and connected to the liquid outlet shell via the liquid inlet housing assembly, the flow manifold housing assembly, and the liquid outlet shell, the flow resistance of the cooling fluid is reduced, thus allowing the first cold plates, the second cold plates, and the heat sources to exchange heat more fully. In this way, the heat dissipation capacity of the liquid cooling system for the heat sources is improved.
[0066] Furthermore, since the inlet pipe, inlet nozzle, outlet pipe, and outlet nozzle are located on the same side of these second cold plates and are arranged vertically, they are concentrated in the same area of the liquid cooling system. Therefore, there is no need to install additional flow pipes to fluidly connect the various housings and cold plates, thereby reducing the space occupied by the liquid cooling system within the electronic device. This improves the flexibility of the liquid cooling system's placement within the electronic device.
[0067] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0068] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A liquid cooling system for thermally coupling to multiple heat sources, characterized in that, The liquid cooling system includes: The liquid inlet housing assembly has a flow channel and a liquid inlet, wherein the liquid inlet is in fluid communication with the flow channel; Multiple first cold plates, each having a first heat exchange channel, one end of each of the multiple first heat exchange channels being in fluid communication with opposite sides of the branch channel, and the multiple first cold plates being used for thermal coupling to at least a portion of the multiple heat sources; A manifold housing assembly having a manifold channel, wherein the other ends of a plurality of first heat exchange channels are in fluid communication with the manifold channel; A plurality of second cold plates are arranged side by side with a plurality of first cold plates along a straight line, the plurality of second cold plates are located between the plurality of first cold plates, each of the plurality of second cold plates has a second heat exchange channel, one end of the plurality of second heat exchange channels is in fluid communication with the confluence channel, and the plurality of second cold plates are used for thermal coupling to at least another portion of the plurality of heat sources; A liquid outlet shell is disposed at one end of a plurality of second cold plates and has a liquid outlet. The other end of a plurality of second heat exchange channels is in fluid communication with the liquid outlet, and the height of the liquid outlet is greater than the height of the liquid inlet. An inlet pipe and an outlet pipe, wherein one end of the inlet pipe is in fluid communication with the inlet port, and one end of the outlet pipe is in fluid communication with the outlet port; and The inlet and outlet are provided, with the inlet located at one end of the inlet tube and the outlet located at the other end of the outlet tube, and the extension directions of the inlet and outlet are parallel. The liquid inlet and the liquid outlet are located on the same side of the plurality of second cold plates.
2. The liquid cooling system according to claim 1, characterized in that: The liquid cooling system further includes two first connecting pipes. The liquid inlet housing assembly includes a first housing and two second housings. The first housing has the liquid inlet. The two second housings are disposed at one end of the plurality of first cold plates. The liquid outlet housing is located between the two second housings. One end of the two first connecting pipes is in fluid communication with the first housing, and the other end of the two first connecting pipes is in fluid communication with the two second housings, so that the first housing, the two second housings, and the two first connecting pipes together form the diversion channel.
3. The liquid cooling system according to claim 2, characterized in that: The liquid cooling system further includes two second connecting pipes. The manifold housing assembly includes two third housings and a fourth housing. The two third housings are disposed at the other end of the plurality of first cold plates, and the fourth housing is disposed at the other end of the plurality of second cold plates. The fourth housing is located between the two third housings. One end of the two second connecting pipes is in fluid communication with the two third housings, and the other end of the two second connecting pipes is in fluid communication with the fourth housing, so that the two third housings, the fourth housing, and the two second connecting pipes together form the manifold channel.
4. The liquid cooling system according to claim 3, characterized in that: The two first connecting pipes and the two second connecting pipes are flexible tubes.
5. The liquid cooling system according to claim 1, characterized in that: The extension direction of the liquid inlet housing assembly is parallel to the extension direction of the liquid outlet housing.
6. An electronic device, characterized in that, include: Circuit board; Multiple heat sources are disposed on the circuit board; as well as Liquid cooling system, including: The liquid inlet housing assembly has a flow channel and a liquid inlet, wherein the liquid inlet is in fluid communication with the flow channel; Multiple first cold plates, each having a first heat exchange channel, one end of each of the multiple first heat exchange channels being fluidly connected to opposite sides of the branch channel, and the multiple first cold plates being thermally coupled to at least a portion of the multiple heat sources; A manifold housing assembly having a manifold channel, wherein the other ends of a plurality of first heat exchange channels are in fluid communication with the manifold channel; A plurality of second cold plates are arranged side by side with a plurality of first cold plates along a straight line, the plurality of second cold plates are located between the plurality of first cold plates, each of the plurality of second cold plates has a second heat exchange channel, one end of the plurality of second heat exchange channels is in fluid communication with the confluence channel, and the plurality of second cold plates are thermally coupled to at least another portion of the plurality of heat sources; A liquid outlet housing is disposed at one end of a plurality of second cold plates and has a liquid outlet. The other end of a plurality of second heat exchange channels is in fluid communication with the liquid outlet, and the liquid inlet is closer to the circuit board than the liquid outlet. An inlet pipe and an outlet pipe, wherein one end of the inlet pipe is in fluid communication with the inlet port, and one end of the outlet pipe is in fluid communication with the outlet port; and The inlet and outlet are provided, wherein the inlet is located at the end of the inlet pipe away from the inlet housing assembly, and the outlet is located at the end of the outlet pipe away from the outlet housing assembly, and the extension directions of the inlet and outlet are parallel. The liquid inlet and the liquid outlet are located on the same side of the plurality of second cold plates.
7. The electronic device according to claim 6, characterized in that: The liquid cooling system further includes two first connecting pipes. The liquid inlet housing assembly includes a first housing and two second housings. The first housing has the liquid inlet. The two second housings are disposed at one end of the plurality of first cold plates. The liquid outlet housing is located between the two second housings. One end of the two first connecting pipes is in fluid communication with the first housing, and the other end of the two first connecting pipes is in fluid communication with the two second housings, so that the first housing, the two second housings, and the two first connecting pipes together form the diversion channel.
8. The electronic device according to claim 7, characterized in that: The liquid cooling system further includes two second connecting pipes. The manifold housing assembly includes two third housings and a fourth housing. The two third housings are disposed at the other end of the plurality of first cold plates, and the fourth housing is disposed at the other end of the plurality of second cold plates. The fourth housing is located between the two third housings. One end of the two second connecting pipes is in fluid communication with the two third housings, and the other end of the two second connecting pipes is in fluid communication with the fourth housing, so that the two third housings, the fourth housing, and the two second connecting pipes together form the manifold channel.
9. The electronic device according to claim 8, characterized in that: The two first connecting pipes and the two second connecting pipes are flexible tubes.
10. The electronic device according to claim 6, characterized in that: The extension direction of the liquid inlet housing assembly is parallel to the extension direction of the liquid outlet housing.