Chip electrical property high-efficiency test equipment

Abstract

The invention discloses efficient chip electrical property testing equipment, a stock bin assembly comprises at least one upper material box and at least two lower material boxes, and a plurality of chip material trays arranged in the vertical direction are arranged in the upper material boxes and the lower material boxes; a test plate communicated with an upper computer and a chip carrier plate electrically connected with the test plate are sequentially arranged above the test carrier plate, a plurality of chip seats are arranged on the upper surface, opposite to the test plate, of the chip carrier plate, and a plurality of pressure heads corresponding to the chip seats are arranged on the lower surface of a pressure plate arranged above the chip carrier plate; the multiple pressing heads are arranged to form at least two pressing head rows, the multiple pressing heads in each pressing head row are arranged at intervals in the X direction, and a strip-shaped through hole extending in the X direction is formed in the position, located between any two adjacent pressing head rows, of the upper surface of the pressing plate. According to the invention, stable pressing of each chip and double-axis multi-angle rotation of a plurality of chips can be realized through the pressing head in the test process, and the stress stability and consistency of the chips in the whole test process can be ensured.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and more particularly to high-efficiency electrical testing equipment for chips. Background Technology

[0002] In recent years, the miniaturization trend of MEMS chips has become increasingly apparent, and the demand for MEMS chip testing is also constantly increasing. MEMS are diverse, with hundreds of millions consumed globally each year, and are widely used in smartphones, automotive electronics, smart manufacturing, and other fields. Furthermore, the market share of MEMS chips largely depends on their quality. Quality testing of MEMS chips typically requires the use of appropriate test fixtures to control their quality. However, existing products for MEMS chip testing are too expensive to manufacture, hindering large-scale adoption and practical application. This significantly increases manufacturing costs and testing cycles for MEMS chip manufacturers, thus negatively impacting their economic efficiency. Summary of the Invention

[0003] The purpose of this invention is to provide a high-efficiency chip electrical testing device. This device can perform batch testing of multiple chips, ensure the stability and consistency of chip stress throughout the testing process, and quickly pick up and place chips in the chip holder through the strip-shaped through-hole, thereby improving production testing efficiency and ensuring testing accuracy.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is: a high-efficiency chip electrical testing device, comprising: a frame and a material bin assembly, a loading / unloading assembly, and a testing assembly respectively mounted on the frame. The loading / unloading assembly includes: an X-axis drive module, a Y-axis drive module movably mounted on the X-axis drive module, a Z-axis drive module movably mounted on the Y-axis drive module, and a plurality of pick-up nozzles for picking up chips. The vertically arranged nozzles are movably mounted on the Z-axis drive module. The material bin assembly includes at least one loading box and at least two unloading boxes, and each loading box and unloading box contains a plurality of chips arranged vertically. The test assembly, located on one side of the hopper assembly and below the loading and unloading assembly, includes: a marble substrate horizontally mounted on a frame, a first support plate and a second support plate vertically mounted on the upper surface of the marble substrate, and a test carrier plate disposed between the first support plate and the second support plate. The test carrier plate is mounted on a rotating part of a first turntable that can rotate around a first direction. The fixed part of the first turntable is mounted on a rotating base. One end of the rotating base is rotatably connected to the first support plate, and the other end of the rotating base is mounted on a rotating part of a second turntable that can rotate around a second direction. The fixed part of the second turntable is mounted on the second support plate. Above the test carrier board, a test board communicating with a host computer and a chip carrier board electrically connected to the test board are arranged sequentially. The chip carrier board has several chip holders on its upper surface opposite to the test board. A pressure plate positioned above the chip carrier board has several pressure heads corresponding to the chip holders on its lower surface. These pressure heads are arranged to form at least two pressure head rows. The pressure heads in each row are spaced apart along the X-direction. A strip-shaped through-hole extending along the X-direction is opened on the upper surface of the pressure plate between any two adjacent pressure head rows. At least one horizontal cylinder that can extend and retract along the Y-direction perpendicular to the X-direction is mounted on the upper surface of the test carrier board. A movable plate connected to the piston rod of the horizontal cylinder is slidably disposed above the test carrier board. At least two vertical cylinders are mounted on the movable plate. The piston rod of each vertical cylinder is connected to the pressure plate. When the pressure head on the pressure plate moves with the horizontal cylinder to above the chip holder and the piston rod of the vertical cylinder is in a retracted state, the pressure head makes contact with the chip in the chip holder. A limiting plate is provided on the outer side of the upper surface of the support plate and at the corners of both ends of the top plate. Several chip trays stacked on the upper surface of the top plate are located in the area enclosed by the four vertically extending limiting plates. A first push block is provided on the outer side of each end of any long side of the uppermost chip tray, and a second push block is provided on the outer side of any short side of the chip tray. The two first push blocks that can move along the short side of the chip tray are each connected to the piston rod of a first cylinder, and the second push blocks that can move along the long side of the chip tray are connected to the piston rod of a second cylinder.

[0005] The following are further improvements to the above technical solution: 1. In the above scheme, the first direction and the second direction intersect perpendicularly and their intersection point coincides with the center of gravity of the test component.

[0006] 2. In the above scheme, each of the first turntable and the second turntable is equipped with a rotary motor and a slip ring for driving the rotation of its rotating part.

[0007] 3. In the above scheme, the second push block is disposed on the outside of at least one limiting plate, and the limiting plate is provided with a clearance through hole for the second push block to pass through.

[0008] 4. In the above scheme, the first cylinder and the second cylinder are each installed on the inner wall of the loading box and the unloading box or on the limiting plate.

[0009] 5. In the above scheme, the two first cylinders are respectively set on the outer sides of both ends of the chip tray. The first push block is an L-shaped push block. The vertical part of the L-shaped push block is connected to the piston rod of the first cylinder, the horizontal part is located on the uppermost chip tray, and the inner wall of the unloading box is provided with a clearance hole for the horizontal part of the L-shaped push block to be inserted.

[0010] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: 1. The present invention provides a high-efficiency chip electrical testing device, wherein the testing component, located on one side of the hopper assembly and below the loading and unloading assembly, comprises: a marble substrate horizontally mounted on a frame, a first support plate and a second support plate vertically mounted on the upper surface of the marble substrate, and a test carrier plate disposed between the first support plate and the second support plate. The test carrier plate is mounted on a rotating part of a first turntable rotatable in a first direction. The fixed part of the first turntable is mounted on a rotating base. The other end of the rotating base, one end of which is rotatably connected to the first support plate, is mounted on a rotating part of a second turntable rotatable in a second direction. Above the test carrier plate, a test board communicating with a host computer and a chip carrier plate electrically connected to the test board are sequentially arranged. The chip carrier plate has a plurality of chip holders disposed on its upper surface opposite to the test board. A pressure plate disposed above the chip carrier plate has a plurality of pressure points corresponding to the chip holders on its lower surface. The test plate consists of several pressure heads arranged to form at least two pressure head rows. Each pressure head row contains several pressure heads spaced apart along the X-axis. A strip-shaped through-hole extending along the X-axis is formed on the upper surface of the test plate between any two adjacent pressure head rows. At least one transverse cylinder capable of extending and retracting along the Y-axis perpendicular to the X-axis is mounted on the upper surface of the test plate. A movable plate connected to the piston rod of the transverse cylinder is slidably positioned above the test plate. At least two vertical cylinders are mounted on the movable plate, with the piston rod of each vertical cylinder connected to the pressure plate. This design allows for stable pressure on individual chips and dual-axis, multi-angle rotation of multiple chips during testing, enabling batch testing of multiple chips. It also ensures the stability and consistency of chip stress throughout the testing process and allows for rapid chip placement and removal from the chip holder through the strip-shaped through-hole, improving production testing efficiency and ensuring testing accuracy.

[0011] 2. The present invention provides a high-efficiency chip electrical testing device. One surface of a vertically movable carrier plate is mounted on a Z-axis drive module. A pitch-changing module is mounted on the other surface of the movable carrier plate. Each pitch-changing slider in the pitch-changing module is equipped with a support bar. The lower end of each support bar, whose upper end is connected to the pitch-changing slider, is equipped with a suction nozzle. This allows for the simultaneous picking and handling of multiple chips between the hopper assembly and the testing assembly. Furthermore, adjusting the distance between the suction nozzles compensates for the chip positional differences between the hopper assembly and the testing assembly, improving chip transport and testing efficiency. Additionally, each support bar is equipped with a... There is a blade cylinder, and the upper end of each suction nozzle is connected to the corresponding blade cylinder. The chip can be independently picked up and placed by retracting the blade cylinder without affecting the chips on other suction nozzles. In addition, a vertically set retraction cylinder is also installed on its movable carrier plate. The lower end of the piston rod of the retraction cylinder is connected to a horizontally set suction plate. Several suction holes on the lower surface of the suction plate are connected to a vacuum pump or vacuum generator through pipelines. When the piston rod of the retraction cylinder is in the extended state, the lower surface of the suction plate is lower than the lower end face of the suction nozzle, which can adsorb and transport the entire chip tray without interfering with or damaging the suction nozzles during the transportation process. Attached Figure Description

[0012] Appendix Figure 1 This is a schematic diagram of the overall structure of the high-efficiency chip electrical testing equipment of the present invention; Appendix Figure 2 This is a schematic diagram of the rotating test stage structure of the chip electrical high-efficiency testing equipment of the present invention; Appendix Figure 3 This is a partial structural diagram of the rotating test stage of the chip electrical high-efficiency testing equipment of the present invention; Appendix Figure 4 for Figure 3 Enlarged view of the structure at point A in the middle; Appendix Figure 5 This is a partial first-view schematic diagram of the loading structure of the high-efficiency chip electrical testing equipment of the present invention; Appendix Figure 6 This is a partial second-view schematic diagram of the loading structure of the chip electrical high-efficiency testing equipment of the present invention; Appendix Figure 7 This is a schematic diagram of the material hopper structure of the chip electrical high-efficiency testing equipment of the present invention; Appendix Figure 8 for Figure 4 Enlarged view of the structure at point B in the middle; Appendix Figure 9 This is a schematic diagram of the internal structure of the material hopper in the high-efficiency chip electrical testing equipment of the present invention; Appendix Figure 10 This is an enlarged view of a portion of the internal structure of the material hopper of the chip electrical high-efficiency testing equipment of the present invention.

[0013] In the attached diagrams: 100, frame; 200, chip; 300, chip tray; 1, marble substrate; 2, first support plate; 3, second support plate; 4, test carrier plate; 51, first turntable; 52, second turntable; 53, rotary motor; 54, cable routing slip ring; 6, rotating base; 7, test plate; 8, chip carrier plate; 9, chip holder; 10, pressure plate; 11, pressure head; 12, vertical cylinder; 13, horizontal cylinder; 14, movable plate; 15, strip-shaped through hole; 21, X-axis drive module; 22, Y-axis drive module; 221, vision bracket; 222, camera; 223, light source; 23, Z-axis drive module; 24, suction nozzle; 25, movable carrier plate; 26, variable pitch module; 261, variable pitch. 262. Slider; 27. Bracket; 28. Support bar; 29. ​​Blade cylinder; 30. Retraction cylinder; 31. Adsorption plate; 32. Adsorption hole; 33. Loading box; 34. Unloading box; 35. Bottom plate; 361. Partition; 37. Material box area; 38. Hopper slide rail; 39. Hopper slider; 40. Baffle; 41. Guide post; 42. Guide sleeve; 43. Support plate; 441. Lead screw; 45. Top plate; 462. Motor; 47. Nut; 48. Vertical support plate; 49. Slide rail; 40. Slider; 41. Slider; 42. Slider; 43. Movable block; 461. Guide post; 462. Guide sleeve; 47. Bearing seat; 48. Limiting plate; 49. First push block; 50. Second push block; 51. First cylinder; 52. Second cylinder. Detailed Implementation

[0014] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0015] Example 1: A high-efficiency chip electrical testing device, comprising: a frame 100 and a material bin assembly, a loading / unloading assembly, and a testing assembly respectively mounted on the frame 100. The loading / unloading assembly includes: an X-axis drive module 21, a Y-axis drive module 22 movably mounted on the X-axis drive module 21, a Z-axis drive module 23 movably mounted on the Y-axis drive module 22, and a plurality of suction nozzles 24 for picking up chips 200. The vertically arranged suction nozzles 24 are movably mounted on the Z-axis drive module 23. The material bin assembly includes at least one loading box 31 and at least two unloading boxes 32. Both the loading box 31 and the unloading box 32 are provided with a plurality of chip trays 300 arranged vertically. The test assembly, located on one side of the hopper assembly and below the loading and unloading assembly, comprises: a marble substrate 1 horizontally mounted on the frame 100, a first support plate 2 and a second support plate 3 vertically mounted on the upper surface of the marble substrate 1, and a test carrier plate 4 disposed between the first support plate 2 and the second support plate 3. The test carrier plate 4 is mounted on the rotating part of a first turntable 51 that can rotate around a first direction. The fixed part of the first turntable 51 is mounted on a rotating base 6. The other end of the rotating base 6, which is rotatably connected to the first support plate 2 at one end, is mounted on the rotating part of a second turntable 52 that can rotate around a second direction. The fixed part of the second turntable 52 is mounted on the second support plate 3. Above the test carrier board 4, a test board 7 communicating with a host computer and a chip carrier board 8 electrically connected to the test board 7 are sequentially arranged. The chip carrier board 8 has several chip holders 9 arranged on its upper surface opposite to the test board 7. A pressure plate 10, positioned above the chip carrier board 8, has several pressure heads 11 corresponding to the chip holders 9 on its lower surface. These pressure heads 11 are arranged to form at least two pressure head rows. The pressure heads 11 within each row are spaced apart along the X-direction. A strip extending along the X-direction is formed on the upper surface of the pressure plate 10 between any two adjacent pressure head rows. Through hole 15, at least one transverse cylinder 13 that can extend and retract along the Y direction perpendicular to the X direction is installed on the upper surface of the test carrier plate 4. A movable plate 14 connected to the piston rod of the transverse cylinder 13 is slidably disposed above the test carrier plate 4. At least two vertical cylinders 12 are installed on the movable plate 14. The piston rod of each vertical cylinder 12 is connected to the pressure plate 10. When the pressure head 11 on the pressure plate 10 moves with the transverse cylinder 13 to the top of the chip holder 9 and the piston rod of the vertical cylinder 12 is in the retracted state, the pressure head 11 makes contact with the chip 200 in the chip holder 9. A limiting plate 48 is provided on the upper surface of the support plate 38 and on the outer side of the corners at both ends of the top plate 40. Several chip trays 300 stacked on the upper surface of the top plate 40 are located in the area enclosed by the four vertically extending limiting plates 48. A first push block 49 is provided on the outer side of each end of any long side of the uppermost chip tray 300, and a second push block 50 is provided on the outer side of any short side of the chip tray 300. The two first push blocks 49 that can move along the short side of the chip tray 300 are each connected to the piston rod of a first cylinder 51, and the second push block 50 that can move along the long side of the chip tray 300 is connected to the piston rod of a second cylinder 52.

[0016] Example 2: A high-efficiency chip electrical testing device, comprising: a frame 100 and a material bin assembly, a loading / unloading assembly, and a testing assembly respectively mounted on the frame 100. The loading / unloading assembly includes: an X-axis drive module 21, a Y-axis drive module 22 movably mounted on the X-axis drive module 21, a Z-axis drive module 23 movably mounted on the Y-axis drive module 22, and a plurality of suction nozzles 24 for picking up chips 200. The vertically arranged suction nozzles 24 are movably mounted on the Z-axis drive module 23. The material bin assembly includes at least one loading box 31 and at least two unloading boxes 32. Both the loading box 31 and the unloading box 32 are provided with a plurality of chip trays 3 arranged vertically. 00, the test assembly, located on one side of the hopper assembly and below the loading and unloading assembly, includes: a marble substrate 1 horizontally mounted on the frame 100, a first support plate 2 and a second support plate 3 vertically mounted on the upper surface of the marble substrate 1, and a test carrier plate 4 disposed between the first support plate 2 and the second support plate 3. The test carrier plate 4 is mounted on the rotating part of a first turntable 51 that can rotate around a first direction. The fixed part of the first turntable 51 is mounted on a rotating base 6. The other end of the rotating base 6, which is rotatably connected to the first support plate 2 at one end, is mounted on the rotating part of a second turntable 52 that can rotate around a second direction. The fixed part of the second turntable 52 is mounted on the second support plate 3. Above the aforementioned test carrier board 4, a test board 7 communicating with a host computer and a chip carrier board 8 electrically connected to the test board 7 are sequentially arranged. The chip carrier board 8 has several chip holders 9 disposed on its upper surface opposite to the test board 7. A pressure plate 10 disposed above the chip carrier board 8 has several pressure heads 11 corresponding to the chip holders 9 on its lower surface. These pressure heads 11 are arranged to form at least two pressure head rows. The pressure heads 11 within each row are spaced apart along the X-direction. A strip extending along the X-direction is formed on the upper surface of the pressure plate 10 between any two adjacent pressure head rows. Through hole 15, at least one transverse cylinder 13 that can extend and retract along the Y direction perpendicular to the X direction is installed on the upper surface of the test carrier plate 4. A movable plate 14 connected to the piston rod of the transverse cylinder 13 is slidably disposed above the test carrier plate 4. At least two vertical cylinders 12 are installed on the movable plate 14. The piston rod of each vertical cylinder 12 is connected to the pressure plate 10. When the pressure head 11 on the pressure plate 10 moves with the transverse cylinder 13 to the top of the chip holder 9 and the piston rod of the vertical cylinder 12 is in the retracted state, the pressure head 11 makes contact with the chip 200 in the chip holder 9.

[0017] The aforementioned hopper assembly further includes: a base plate 33 and a plurality of partitions 34 spaced apart and mounted on the upper surface of the base plate 33. A hopper area 35 is formed between adjacent partitions 34 and the base plate 33, into which an upper hopper 31 or a lower hopper 32 can be inserted. The bottom surface of each of the aforementioned upper hopper 31 and lower hopper 32 is slidably connected to the upper surface of the corresponding base plate 33 in the hopper area 35 via at least one set of hopper slide rails 361 and hopper sliders 362.

[0018] A baffle 37 is connected between the ends of several partitions 34 that are close to the test component. At least two sets of cooperating guide posts 371 and guide sleeves 372 are provided between each of the above-mentioned loading boxes 31, unloading boxes 32 and baffles 37.

[0019] The aforementioned pressure head 11 is a silicone pressure head.

[0020] First, the piston rods of the vertical cylinder and the horizontal cylinder of the test component are placed in the first state, so that the pressure head that moves with the vertical cylinder moves away from the chip holder in the vertical direction, and the strip through hole on the pressure plate that moves with the horizontal cylinder moves to the top of the chip holder, so as to facilitate the chip being placed into the chip holder. The chip to be tested is picked up from the top chip tray in the loading box of the hopper component by the suction nozzle of the loading and unloading component. Then, the chip to be tested is transported to the chip holder of the test component by the combination of X, Y and Z axis movement in the loading and unloading component. When picking up the chips to be tested from the loading box, the distance between adjacent pitch sliders on the pitch module is consistent with the distance between adjacent chips in the loading box. Before placing the chip to be tested on the nozzle into the chip holder of the test component, the distance between adjacent pitch sliders is adjusted by the pitch module to make it consistent with the distance between adjacent chip holders. This allows the chip to be tested on each nozzle to be placed into the chip holder simultaneously. The pitch module adjusts the distance between the nozzles to compensate for the chip position difference between the hopper component and the test component, improving the chip transport efficiency and testing efficiency. The pitch module is purchased externally and falls within the scope of existing technology, so it will not be described in detail here. The piston rods of the horizontal cylinder and the vertical cylinder of the test component are switched from the first state to the second state, so that the pressure head row on the pressure plate that moves with the horizontal cylinder moves to the top of the chip to be tested in the chip holder, and the pressure head that moves with the vertical cylinder approaches the chip holder in the vertical direction and presses the chip to be tested. The first and second turntables are driven to rotate by a rotary motor, thereby causing the chip under test in the chip holder to rotate in two directions. During this process, the performance of the chip is tested, and the chip is classified according to the test results. The specific test process and test software are not part of the inventive point of this application and will not be described here. After the test is completed, the first and second turntables are reset, and the piston rods of the vertical and horizontal cylinders of the test component are switched from the second state back to the first state. This causes the pressure head, which moves with the vertical cylinder, to move away from the chip holder in the vertical direction, and the strip-shaped through hole on the pressure plate, which moves with the horizontal cylinder, to move above the chip holder. This facilitates the picking up of the chips that have been tested in the chip holder and the placement of the next batch of chips to be tested into the chip holder. The loading and unloading assembly uses a nozzle to pick up tested chips from the chip holder. The assembly then moves along the X, Y, and Z axes to transport the tested chips to the top of the hopper assembly. Based on the chip grade determined during testing, different grades are placed into chip trays within different loading boxes. For example, grade A chips are placed in tray A, and grade B chips in tray B. When a tested chip needs to be placed into its corresponding tray, the nozzle holding the chip is moved along the X, Y, and Z axes to the top of the tray. A blade cylinder then drives the nozzle downwards to place the chip into the tray. During this process, chips on other nozzles are not subject to interference, collisions, or detachment. After all the tested chips in the test assembly are moved to the chip tray in the unloading box, the suction nozzle of the loading and unloading assembly picks up the chip to be tested from the chip tray on the top layer of the loading box of the hopper assembly. Then, through the combination of X, Y and Z axis movement in the loading and unloading assembly, the chip to be tested is transported to the chip holder of the test assembly for the next round of testing, and so on. After all the chips to be tested in the chip tray at the top of the loading box of the hopper assembly have been picked up, the Z-axis of the loading and unloading assembly is moved to a high position. Then, the adsorption plate is moved above the empty chip tray by the combined movement of the X and Y directions in the loading and unloading assembly. Next, the piston rod of the shrink cylinder is placed in the extended state so that the lower surface of the adsorption plate is in contact with the upper surface of the empty chip tray. The vacuum pump or vacuum generator is started to adsorb the empty chip tray. Then, the empty chip tray is transported to the stacking area of ​​empty trays by the combined movement of the X and Y directions in the loading and unloading assembly. Next, the top plate is driven to move upward by the motor, so that the chip trays stacked on the surface of the top plate and containing the chips to be tested are moved upward to fill the position, and the chip trays on the top layer are moved to the loading position; then the first cylinder and the second cylinder are started to drive the first push block and the second push block to position the chip trays on the top layer from two directions, thereby improving the positional accuracy of the chip trays on the top layer and thus improving the accuracy of subsequent chip loading.

[0021] When using the aforementioned high-efficiency chip electrical testing equipment, it can stably hold each chip during testing and rotate multiple chips in a dual-axis, multi-angle manner, enabling batch testing of multiple chips. It also ensures the stability and consistency of chip stress throughout the testing process. Furthermore, it allows for rapid picking and placing of chips within the chip holder through the strip-shaped through-hole, improving production testing efficiency and ensuring testing accuracy. It can simultaneously pick up and transport multiple chips between the hopper assembly and the testing assembly. Adjusting the distance between the nozzles compensates for chip position differences between the hopper and testing assemblies, improving chip transport and testing efficiency. The retraction of the blade cylinder allows for independent picking and placing of chips without affecting chips on other nozzles. Additionally, it can adsorb and transport the entire chip tray without interfering with or damaging the nozzles during transport.

[0022] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A high-efficiency electrical testing device for chips, comprising: The equipment includes a frame (100) and a hopper assembly, a loading / unloading assembly, and a testing assembly, all mounted on the frame (100). The loading / unloading assembly includes an X-axis drive module (21), a Y-axis drive module (22) movably mounted on the X-axis drive module (21), a Z-axis drive module (23) movably mounted on the Y-axis drive module (22), and several nozzles (24) for picking up chips (200). The vertically arranged nozzles (24) are movably mounted on the Z-axis drive module (23). The hopper assembly includes at least one loading box (31) and at least two unloading boxes (32). Both the loading box (31) and the unloading box (32) contain several chip trays (300) arranged vertically. The equipment is characterized by: the hopper assembly... The test assembly located on one side of the assembly and below the loading and unloading assembly includes: a marble substrate (1) horizontally mounted on the frame (100), a first support plate (2) and a second support plate (3) vertically mounted on the upper surface of the marble substrate (1), and a test carrier plate (4) disposed between the first support plate (2) and the second support plate (3). The test carrier plate (4) is mounted on the rotating part of a first turntable (51) that can rotate around a first direction. The fixed part of the first turntable (51) is mounted on a rotating base (6). The other end of the rotating base (6), which is rotatably connected to the first support plate (2), is mounted on the rotating part of a second turntable (52) that can rotate around a second direction. The fixed part of the second turntable (52) is mounted on the second support plate (3). Above the test substrate (4), a test board (7) communicating with a host computer and a chip substrate (8) electrically connected to the test board (7) are arranged in sequence. The chip substrate (8) has a plurality of chip holders (9) on its upper surface opposite to the test board (7). A pressure plate (10) above the chip substrate (8) has a plurality of pressure heads (11) corresponding to the chip holders (9) on its lower surface. The plurality of pressure heads (11) are arranged to form at least two pressure head columns. The plurality of pressure heads (11) in each pressure head column are arranged at intervals along the X direction. A strip-shaped through hole (1) extending along the X direction is opened on the upper surface of the pressure plate (10) between any two adjacent pressure head columns. 5) At least one transverse cylinder (13) that can extend and retract along the Y direction perpendicular to the X direction is installed on the upper surface of the test carrier (4). A movable plate (14) connected to the piston rod of the transverse cylinder (13) is slidably disposed above the test carrier (4). At least two vertical cylinders (12) are installed on the movable plate (14). The piston rod of each vertical cylinder (12) is connected to the pressure plate (10). When the pressure head (11) on the pressure plate (10) moves with the transverse cylinder (13) to the top of the chip holder (9) and the piston rod of the vertical cylinder (12) is in the retracted state, the pressure head (11) is pressed into contact with the chip (200) in the chip holder (9). A limiting plate (48) is provided on the upper surface of the support plate (38) and on the outer side of the corners at both ends of the top plate (40). Several chip trays (300) stacked on the upper surface of the top plate (40) are located in the area enclosed by the four vertically extending limiting plates (48). A first push block (49) is provided on the outer side of each of the two long sides of the uppermost chip tray (300). A second push block (50) is provided on the outer side of each of the short sides of the chip tray (300). The two first push blocks (49) that can move along the short side of the chip tray (300) are each connected to the piston rod of a first cylinder (51). The second push block (50) that can move along the long side of the chip tray (300) is connected to the piston rod of a second cylinder (52).

2. The high-efficiency chip electrical testing equipment according to claim 1, characterized in that: The first direction intersects the second direction perpendicularly, and their intersection point coincides with the center of gravity of the test component.

3. The high-efficiency chip electrical testing equipment according to claim 1, characterized in that: Each of the first and second turntables has a rotary motor and a slip ring installed on its fixed part to drive the rotation of its rotating part.

4. The high-efficiency chip electrical testing equipment according to claim 1, characterized in that: The second push block (50) is disposed on the outside of at least one limiting plate (48), which has a clearance through hole for the second push block (50) to pass through.

5. The high-efficiency chip electrical testing equipment according to claim 1, characterized in that: The first cylinder (51) and the second cylinder (52) are each installed on the inner wall of the loading box (31) and the unloading box (32) or on the limiting plate (48).

6. The high-efficiency chip electrical testing equipment according to claim 1, characterized in that: Two first cylinders (51) are respectively set on the outer sides of both ends of the chip tray (300). The first push block (49) is an L-shaped push block. The vertical part of the L-shaped push block is connected to the piston rod of the first cylinder (51), and the horizontal part is located on the outer sides of both ends of the long side of the uppermost chip tray (300). The inner walls of the upper box (31) and the lower box (32) are provided with clearance holes for the horizontal part of the L-shaped push block to be inserted.

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