Design method for reducing whole life cycle cost of electronic hardware equipment
By importing component lists, establishing alternative mapping tables, constructing alternative design scheme sets, conducting reliability assessments and cost calculations, the problems of after-sales maintenance and failure impact costs in electronic device design were solved, achieving optimization of life cycle costs and optimal design selection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
- Filing Date
- 2025-12-24
- Publication Date
- 2026-04-17
AI Technical Summary
Existing technologies have failed to effectively optimize after-sales maintenance costs and failure impact costs in electronic device design, and traditional low-cost designs may miss feasible solutions and fail to fully identify and select the optimal design solution.
By importing a component list, establishing an alternative mapping table, exhaustively combining different design schemes, conducting reliability assessments and life-cycle cost calculations, and selecting the most cost-effective solution.
This enables the reduction of the total life-cycle cost of electronic devices during the design phase, comprehensively optimizes economic efficiency and reliability, and ensures the selection of the optimal design solution.
Smart Images
Figure CN121881618A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic device management technology, and more specifically to a design method for reducing the total life cycle cost of electronic hardware devices. Background Technology
[0002] Product cost is a crucial attribute of electronic devices and a key factor in product competitiveness. While the industry currently focuses heavily on low-cost design for electronic devices and has developed a foundation of low-cost design methodologies, these methods still have certain shortcomings. First, current low-cost design primarily targets manufacturing costs, while after-sales maintenance costs are also a significant component, difficult to optimize within the design framework. Second, as electronic devices play increasingly important roles in various safety and reliability-critical areas, device malfunctions can have serious consequences, potentially impacting a company's market competitiveness. There is a pressing need for methods to guide the comprehensive optimization of costs arising from insufficient reliability and safety in design schemes. Third, as electronic products become increasingly complex, the same function can be achieved through numerous alternative design solutions. Traditional experience-based low-cost design may overlook some feasible technical solutions. A methodology is needed to guide the comprehensive identification of alternative solutions and the selection of the optimal design. Summary of the Invention
[0003] In view of this, embodiments of this application provide a design method for reducing the total life cycle cost of electronic hardware devices, so as to reduce the total life cycle cost of products, consisting of manufacturing costs, maintenance costs and failure impact costs, during the design stage of electronic devices, thereby achieving comprehensive optimization of the economy and reliability of electronic devices.
[0004] This application provides the following technical solution: a design method for reducing the total life cycle cost of electronic hardware devices, comprising: S1: Import the component list of the initial design scheme for electronic hardware equipment; S2: For each component in the component list, determine at least one alternative component to form a component alternative mapping table for the initial design scheme; S3: Based on the component alternative mapping table, exhaustively enumerate all possible component alternative combinations, construct a set of alternative design schemes composed of different component alternative combinations, and output the corresponding component list for each alternative design scheme. S4: Perform a reliability assessment on each alternative design scheme in the set of alternative design schemes to obtain the severity failure rate and the total product failure rate for each alternative design scheme. S5: Based on the results of the reliability assessment, calculate the total life cycle cost of each alternative design scheme, wherein the total life cycle cost includes manufacturing cost, maintenance cost, and failure impact cost; wherein the maintenance cost is calculated based on the total product failure rate, and the failure impact cost is calculated based on the severity level failure rate; S6: Compare the total life cycle costs of all alternative design schemes and select the scheme with the best cost as the final design scheme.
[0005] According to one embodiment of this application, in step S2, establishing the component alternative mapping table includes: for each component model in the component list of the initial design scheme, establishing a list of one or more functionally compatible and replaceable alternative component models.
[0006] According to one embodiment of this application, the reliability assessment in step S4 specifically includes: S41: Component-level failure impact assessment: For each component in the alternative design scheme, identify all failure modes of the component, the failure rate of each failure mode, and classify the severity of the consequences caused by each failure mode. S42: Overall Product-Level Reliability Assessment: Summarize the results of component-level failure impact assessments and calculate the severity failure rate and total product failure rate for each alternative design scheme. The severity level failure rate is the failure rate of the product at different severity levels, and the failure rate of any level is the sum of the failure rates of all components in the design scheme that are rated as that level of failure mode; the total product failure rate is the sum of the failure rates of all severity levels.
[0007] According to one embodiment of this application, in step S5, the total life cycle cost is the sum of the manufacturing cost, maintenance cost, and failure impact cost.
[0008] According to one embodiment of this application, in step S5: Manufacturing cost = Component cost × Manufacturing cost coefficient; Maintenance cost = Total product failure rate × Total expected product operating time × Average cost per repair; Failure impact cost = , This represents the cost of failure impact when a product experiences a failure of severity level k. The severity level failure rate is the failure rate at severity level k, where M is the total number of severity level classifications.
[0009] According to one embodiment of this application, in step S6, the total life cycle cost of all alternative design schemes is compared, including: forming a comparison matrix of the manufacturing cost, maintenance cost, failure impact cost and total life cycle cost of each alternative design scheme, and selecting the corresponding scheme with the smallest target cost item based on the comparison matrix.
[0010] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least: 1. The design method provided in this embodiment of the invention can reduce the total life cycle cost of electronic devices, which consists of manufacturing costs, maintenance costs, and failure impact costs, during the design stage, thereby achieving comprehensive optimization of the economy and reliability of electronic devices; 2. The design method provided in this embodiment of the invention can support the comprehensive identification of alternative design schemes and achieve the optimal selection of design schemes in a simple and convenient manner. Attached Figure Description
[0011] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0012] Figure 1 This is a schematic diagram of a design method for reducing the total life cycle cost of electronic hardware devices according to an embodiment of the present invention. Detailed Implementation
[0013] The embodiments of this application will now be described in detail with reference to the accompanying drawings.
[0014] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0015] like Figure 1As shown, this invention provides a design method for reducing the total lifecycle cost of electronic hardware devices, comprising six steps: importing an initial design component list, establishing component substitution mapping relationships, constructing a set of alternative product design schemes, assessing the reliability of the alternative design scheme set, assessing the lifecycle cost of the alternative design scheme set, and selecting a design scheme. The technical solutions for each step are as follows: Step 1: Import the component list of the initial design scheme for the electronic hardware device; Derive the initial component list from the schematic diagram of the initial design scheme. The initial component list includes the component reference designation and component model information.
[0016] Step 2: Establish component substitution mapping relationships; For each component in the component list, at least one alternative component is identified to form a component alternative mapping table for the initial design scheme; Step 3: Build a set of alternative product design solutions; Based on the component alternative mapping table, all possible component alternative combinations are enumerated to construct a set of alternative design schemes composed of different component alternative combinations, and a corresponding component list is output for each alternative design scheme. Step 4: Reliability assessment of alternative design schemes; For each alternative design scheme in the set of alternative design schemes, a reliability assessment is performed. The reliability assessment is divided into two processes: component-level failure impact assessment and product-level overall reliability assessment. In the component-level fault assessment process, for each component, we identify its existing fault modes and the failure rate of each fault mode, and classify the severity of the fault impact.
[0017] In the overall product-level reliability assessment, assessment index 1 and assessment index 2 are calculated. Assessment index 1 is the severity level failure rate of the product when different severity levels of failure occur. The failure rate of each severity level is calculated by summing the failure rates of all failure modes with the corresponding severity level of failure impact during the component-level failure assessment. Assessment index 2 is the total product failure rate, which is calculated by summing the failure rates of all severity levels of failure.
[0018] Step 5: Lifecycle cost assessment of alternative design options; Based on the results of the reliability assessment, the total life cycle cost of each alternative design is calculated. The total life cycle cost includes manufacturing costs, maintenance costs, and failure impact costs. The maintenance costs are calculated based on the total product failure rate, and the failure impact costs are calculated based on the severity level failure rate. Product life cycle cost = manufacturing cost + maintenance cost + failure impact cost; Manufacturing cost = Component cost × Manufacturing cost coefficient; Maintenance cost = Total product failure rate × Total expected product operating time × Average cost per repair; Failure impact cost = , This represents the cost of failure impact when a product experiences a failure of severity level k. The severity level failure rate is the failure rate at which a failure of severity level k occurs, and M is the total number of severity level classifications for the failure impact.
[0019] Step 6: Design scheme selection; The life-cycle costs of all alternative design schemes are compared, and the scheme with the best cost is selected as the final design scheme. Specifically, the product life-cycle cost, manufacturing cost, maintenance cost, and failure impact cost of all design schemes in the product alternative scheme set are summarized to form a comparison matrix, and the alternative scheme corresponding to the minimum cost type objective is selected.
[0020] To further clarify the embodiments of the present invention, in conjunction with Figure 1 The specific implementation method is further described below: This method includes steps such as importing the initial design scheme component list, establishing component substitution mapping relationships, constructing a product alternative design scheme set, reliability assessment of the alternative design scheme set, life cycle cost assessment of the alternative design scheme set, and selection of the optimal design scheme.
[0021] 1. Import the component list of the initial design scheme Derive the initial component list from the schematic diagram of the initial design scheme. The initial component list includes the component reference designator and component model information. Optionally, the format is as shown in Table 1.
[0022] Table 1 Component List for Initial Design
[0023] 2. Establish component substitution mapping relationships For each component in the initial component list, establish alternative substitution mapping relationships. The alternative substitution mapping relationships for the initial design scheme are shown in Table 2.
[0024] Table 2 Component Substitution Mapping Relationships
[0025] 3. Construct a set of alternative product design solutions. Based on the component substitution mapping relationship, exhaustively list all possible component substitution combinations, construct a set of alternative solutions composed of different component substitution combinations, and output the component list of all design schemes in the set of alternative solutions.
[0026] If any one of the internal components i has With a variety of alternative components, each product can form a unit consisting of... A set of alternative design schemes is generated, and a corresponding component list is output for each alternative scheme to form the component list of the alternative scheme set. The optional formats are shown in Tables 3 and 4.
[0027] Table 3 Component List of Alternative Solutions 1
[0028] Table 4 Component List of Alternative Solutions 2
[0029] 4. Reliability assessment of alternative design schemes For each design scheme in the alternative design scheme set, a reliability assessment is conducted. The reliability assessment is divided into two processes: component-level failure impact assessment and product-level overall reliability assessment.
[0030] In the component-level fault assessment process, for each component, its existing fault modes and the failure rate of each fault mode are identified, and the severity of the fault impact is graded. Optionally, this embodiment divides the severity into four levels from high to low: I, II, III, and IV. The impact of component-level faults can optionally be presented in the form of Table 5, for example, for Scheme 1 in Table 3.
[0031] Table 5 Component-level Failure Impact Assessment Table
[0032] In the overall product-level reliability assessment process, assessment index 1 and assessment index 2 are calculated. Assessment index 1 is the failure rate of the product when it experiences failures of different severity levels. The failure rate of each severity level is calculated by summing the failure rates of all failure modes with the corresponding severity level of failure impact during the component-level failure assessment process. Assessment index 2 is the total product failure rate, which is calculated by summing the failure rates of all severity levels of failure.
[0033] Optionally, corresponding to the four severity levels (I, II, III, IV) of Alternative Solution 1 in this embodiment, the failure rate for each severity level is... , , , The calculation methods are shown in Equations 1 to 4: =3.2×10 -6 / h(1) =2.5×10 -6 / h(2) = 0.8×10 -6 / h(3) = 0.7×10 -6 / h(4) in , , , These represent the components in each design scheme. The sum of failure rates for failure modes classified into four severity levels: I, II, III, and IV. This indicates the total number of components included in each design scheme. Total product failure rate. =7.2×10 -6 / h.
[0034] Schemes 2-12 refer to the steps in Scheme 1 to calculate the failure rate for each severity level. , , , And the overall product failure rate.
[0035] 5. Lifecycle cost assessment of alternative design schemes The lifecycle cost assessment algorithm for the alternative design scheme set in this invention consists of equations 5 to 8: Product life cycle cost = manufacturing cost + maintenance cost + failure impact cost (5) Manufacturing cost = Component cost × Manufacturing cost coefficient (6) Maintenance cost = Total product failure rate × Total expected product operating time × Average cost per maintenance (7) Failure impact cost = (8) In Equation 8, This represents the failure impact cost when a product experiences a failure of severity level k. M represents the failure rate at which a failure of severity level k occurs, and M represents the total number of severity levels of failure impact.
[0036] Optionally, corresponding to the four severity levels I, II, III, and IV of this embodiment, in equation (8), , , , These represent the failure rates of the product in failure modes I, II, III, and IV, respectively. , , , These represent the failure impact costs resulting from the occurrence of failure modes I, II, III, and IV, respectively.
[0037] In this embodiment, the manufacturing cost coefficient in equation (6) is 1.5, the average single repair cost in equation (7) is 1000 yuan, and the failure impact cost caused by failures of severity levels I, II, III, and IV in equation (8) is... , , , The amounts are 10,000 yuan, 5,000 yuan, 2,000 yuan, and 1,000 yuan respectively. The total expected working time in equations (7) and (8) is 1 × 10 5 h.
[0038] Taking Scheme 1 as an example, the cost of each component is shown in Table 6 below.
[0039] Table 6 Cost of Each Component
[0040] Based on equations (5) to (8), the cost of scheme 1 can be calculated as follows: Product manufacturing cost = (500 + 1000 + 100) × 1.5 = 2400 (yuan) Repair cost = 7.2 × 10 -6 / h×1×10 5 h × 1000 = 720 (yuan) Failure impact cost = 3.2 × 10 -6 / h×10 5 h×10000+2.5×10 -6 / h×10 5 h×5000+ 0.8×10 -6 / h×10 5 h×2000+ 0.7×10 -6 / h×10 5 h × 1000 = 4680 yuan Product life cycle cost = manufacturing cost + maintenance cost + failure impact cost = 7800 yuan 6. Design Scheme Selection The product life cycle cost, manufacturing cost A, maintenance cost B, and failure impact cost C of all design schemes in the product alternative scheme set are summarized to form a comparison matrix. The alternative scheme corresponding to the minimum value is selected according to the different cost type objectives.
[0041] Table 7 Cost Comparison of Alternative Solutions
[0042] The present invention provides a design method for optimizing the life cycle cost of electronic products. This method involves six steps: importing an initial design component list, establishing component substitution mapping relationships, constructing a set of alternative design schemes, assessing the reliability of alternative design schemes, assessing the life cycle cost of the alternative design scheme set, and selecting the optimal design scheme. This method can reduce the total life cycle cost of the product.
[0043] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A design method for reducing the total life-cycle cost of electronic hardware devices, characterized in that, include: S1: Import the component list of the initial design scheme for electronic hardware equipment; S2: For each component in the component list, determine at least one alternative component to form a component alternative mapping table for the initial design scheme; S3: Based on the component alternative mapping table, exhaustively enumerate all possible component alternative combinations, construct a set of alternative design schemes composed of different component alternative combinations, and output the corresponding component list for each alternative design scheme. S4: Perform a reliability assessment on each alternative design scheme in the set of alternative design schemes to obtain the severity failure rate and the total product failure rate for each alternative design scheme. S5: Based on the results of the reliability assessment, calculate the total life cycle cost of each alternative design scheme, wherein the total life cycle cost includes manufacturing cost, maintenance cost, and failure impact cost; wherein the maintenance cost is calculated based on the total product failure rate, and the failure impact cost is calculated based on the severity level failure rate; S6: Compare the total life cycle costs of all alternative design schemes and select the scheme with the best cost as the final design scheme.
2. The design method for reducing the total life cycle cost of electronic hardware devices according to claim 1, characterized in that, In step S2, the alternative component mapping table is established, including: for each component model in the component list of the initial design scheme, establishing a list of one or more functionally compatible and replaceable alternative component models.
3. The design method for reducing the total life cycle cost of electronic hardware devices according to claim 1, characterized in that, The reliability assessment described in step S4 specifically includes: S41: Component-level failure impact assessment: For each component in the alternative design scheme, identify all failure modes of the component, the failure rate of each failure mode, and classify the severity of the consequences caused by each failure mode. S42: Overall Product-Level Reliability Assessment: Summarize the results of component-level failure impact assessments and calculate the severity failure rate and total product failure rate for each alternative design scheme. The severity level failure rate is the failure rate of the product at different severity levels, and the failure rate of any level is the sum of the failure rates of all components in the design scheme that are rated as that level of failure mode; the total product failure rate is the sum of the failure rates of all severity levels.
4. The design method for reducing the total life cycle cost of electronic hardware devices according to claim 1, characterized in that, In step S5, the total life cycle cost is the sum of the manufacturing cost, maintenance cost, and failure impact cost.
5. The design method for reducing the total life cycle cost of electronic hardware devices according to claim 4, characterized in that, In step S5: Manufacturing cost = Component cost × Manufacturing cost coefficient; Maintenance cost = Total product failure rate × Total expected product operating time × Average cost per repair; Failure impact cost = , This represents the cost of failure impact when a product experiences a failure of severity level k. The severity level failure rate is the failure rate at severity level k, where M is the total number of severity level classifications.
6. The design method for reducing the total life cycle cost of electronic hardware devices according to claim 1, characterized in that, In step S6, the total life cycle cost of all alternative design schemes is compared, including: forming a comparison matrix of the manufacturing cost, maintenance cost, failure impact cost and total life cycle cost of each alternative design scheme, and selecting the corresponding scheme with the smallest target cost item based on the comparison matrix.