Temperature control method and device of storage device and electronic equipment
By detecting the operating temperature of the storage device and controlling the CPU to perform self-heating, the problem of performance degradation of the storage device in low-temperature environments is solved, achieving precise temperature control and device stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DAPUSTOR CORP
- Filing Date
- 2025-12-04
- Publication Date
- 2026-05-05
AI Technical Summary
In existing technologies, storage devices experience performance degradation in low-temperature environments, leading to data loss or hard drive damage. Furthermore, external heating methods cannot precisely control the temperature, are costly, and cannot be integrated.
By detecting the operating temperature of the storage device, determining the self-heating intensity based on the temperature and a preset threshold, and controlling the CPU to execute matching heating operations, autonomous temperature control is achieved.
Without relying on external hardware, it automatically detects and controls the temperature of the storage device to prevent low temperatures from affecting device reliability and ensure performance and stability.
Smart Images
Figure CN121979367A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of computer technology, and more particularly to a method, apparatus and electronic device for temperature control of a storage device. Background Technology
[0002] Storage devices such as solid-state drives (SSDs) are widely used in personal computers, enterprise servers, and other devices due to their high-speed read / write speeds and shock resistance. However, storage devices face certain stability issues in low-temperature environments, especially NAND flash memory chips, whose performance degrades significantly at low temperatures. This can lead to problems such as write failures, data loss, and slower response times, affecting data read / write stability and potentially causing data loss or hard drive damage.
[0003] To address this issue, related technologies have attempted to improve the performance of storage devices at low temperatures by adding heating elements or external heating devices. However, these heating methods often require external power and are bulky, making direct integration into the hard drive impossible. Therefore, not only are the hardware costs high, but the storage device temperature cannot be precisely controlled, resulting in poor temperature control performance.
[0004] Therefore, there is an urgent need for a convenient and accurate solution for controlling the temperature of storage devices. Summary of the Invention
[0005] This application provides a method, apparatus, and electronic device for temperature control of a storage device, in order to alleviate or solve one or more technical problems existing in the prior art.
[0006] In a first aspect, embodiments of this application provide a temperature control method for a storage device, including: Detect the operating temperature of the storage device; When the operating temperature is lower than a preset temperature threshold, the first self-heating intensity of the storage device is determined based on the operating temperature and the preset temperature threshold. The CPU (Central Processing Unit) of the storage device is controlled to perform a heating operation that matches the first self-heating intensity.
[0007] Secondly, embodiments of this application provide a temperature control device for a storage device, including: The detection module is used to detect the operating temperature of the storage device; A determining module is configured to determine the first self-heating intensity of the storage device based on the operating temperature and the preset temperature threshold when the operating temperature is lower than the preset temperature threshold. The control module is used to control the central controller CPU of the storage device to perform a heating operation that matches the first self-heating intensity.
[0008] Thirdly, embodiments of this application provide an electronic device, including a memory, a processor, and a computer program stored in the memory, wherein the processor implements any of the methods of embodiments of this application when executing the computer program.
[0009] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the method of any one of the embodiments of this application.
[0010] Fifthly, embodiments of this application provide a computer program product, including a computer program, which, when executed by a processor, implements any of the methods described in the embodiments of this application.
[0011] According to the technical solution of this application embodiment, by detecting the operating temperature of the storage device, and when the operating temperature is lower than a preset temperature threshold, a first self-heating intensity of the storage device is determined based on the operating temperature and the preset temperature threshold. This allows the central controller CPU of the storage device to execute a heating operation matching the first self-heating intensity. Therefore, without external hardware devices, it is possible to automatically detect whether the storage device is in a low-temperature environment, and to automatically control the CPU to execute a heating operation matching the current self-heating intensity when the storage device is in a low-temperature environment. This achieves the effect of automatically controlling the operating temperature of the storage device without relying on external components, effectively preventing the problem of device reliability being affected by excessively low storage device temperatures, and ensuring the performance and stability of the storage device.
[0012] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description
[0013] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments according to this application and should not be construed as limiting the scope of this application.
[0014] Figure 1 A flowchart of a temperature control method for a storage device provided in an embodiment of this application is shown; Figure 2 A flowchart of a temperature control method for a storage device according to another embodiment of this application is shown; Figure 3 A flowchart of a temperature control method for a storage device according to another embodiment of this application is shown; Figure 4 A block diagram of a temperature control device for a storage device provided in an embodiment of this application is shown; Figure 5 A block diagram of an electronic device provided in an embodiment of this application is shown. Detailed Implementation
[0015] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the concept or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.
[0016] To facilitate understanding of the technical solutions of the embodiments of this application, the relevant technologies of the embodiments of this application are described below. The following relevant technologies are optional solutions and can be combined with the technical solutions of the embodiments of this application in any way, and all of them fall within the protection scope of the embodiments of this application.
[0017] The technical solution of this application and how it solves the aforementioned technical problems are described in detail below with specific embodiments. The listed specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0018] Figure 1 A flowchart of a temperature control method for a storage device provided in an embodiment of this application is shown, such as... Figure 1 As shown, the method may include steps S101, S102, and S103. In this embodiment, the storage device is a solid-state drive.
[0019] Step S101: Detect the operating temperature of the storage device.
[0020] In some embodiments, step S101 may be performed as follows: first, obtaining the component temperature of at least one specified component in the storage device; second, calculating the operating temperature of the storage device based on the component temperature of the at least one specified component. The operating temperature of the storage device may be the lowest component temperature among the at least one component temperatures, or the operating temperature may be the average temperature of the at least one component temperatures.
[0021] Optionally, the component temperature of different designated components can be collected using multiple temperature sensors installed in the storage device. Designated components may include, but are not limited to, the following: CPU, NAND flash memory, PCIe (PCI Express, high-speed peripheral component interconnect) slots, chassis, etc. Each temperature sensor can collect the component temperature of one or more designated components.
[0022] Step S102: When the operating temperature is lower than the preset temperature threshold, determine the first self-heating intensity of the storage device based on the operating temperature and the preset temperature threshold.
[0023] The first self-heating intensity is used to represent the difference between the operating temperature of the storage device and a preset temperature threshold. The larger the difference, the higher the first self-heating intensity. The specific method for determining the first self-heating intensity will be described in detail in the following embodiments.
[0024] Step S103: The central controller CPU of the control storage device executes a heating operation that matches the first self-heating intensity.
[0025] In some embodiments, during the process of controlling the CPU to perform a heating operation matching a first self-heating intensity, the operating temperature of the storage device is detected in real time or at a fixed frequency; this operating temperature is the real-time temperature. If the real-time temperature of the storage device is detected to be higher than or equal to a preset temperature threshold, the CPU is controlled to stop the heating operation.
[0026] According to the technical solution of this application embodiment, by detecting the operating temperature of the storage device, and when the operating temperature is lower than a preset temperature threshold, a first self-heating intensity of the storage device is determined based on the operating temperature and the preset temperature threshold. This allows the central controller CPU of the storage device to execute a heating operation matching the first self-heating intensity. Therefore, without external hardware devices, it is possible to automatically detect whether the storage device is in a low-temperature environment, and to automatically control the CPU to execute a heating operation matching the current self-heating intensity when the storage device is in a low-temperature environment. This achieves the effect of automatically controlling the operating temperature of the storage device without relying on external components, effectively preventing the problem of device reliability being affected by excessively low storage device temperatures, and ensuring the performance and stability of the storage device.
[0027] In some embodiments, determining the first self-heating intensity of the storage device based on the operating temperature and a preset temperature threshold can be performed as steps A1 and A2.
[0028] Step A1: Calculate the error parameters between the operating temperature and the preset temperature threshold; the error parameters include at least one of the following: difference (i.e., error), cumulative error, and error change rate.
[0029] Step A2: Determine the first self-heating intensity based on the error parameters.
[0030] The first self-heating intensity is positively correlated with the error parameter. That is, the larger the value of the error parameter, the higher the first self-heating intensity.
[0031] Optionally, the error parameter includes cumulative error, which can be understood as the sum of errors within a preset time period. The preset time period can be pre-configured so that when the detection time of the working temperature reaches the preset time period, the sum of errors within the preset time period is calculated.
[0032] Optionally, the error parameter includes the error change rate, which can be understood as the rate of change of the temperature difference within a preset time period. The error change rate is calculated as follows: within the preset time period, each time the working temperature is detected, the error (i.e., the difference) between the working temperature and the preset temperature threshold is calculated. Then, the difference between this error and the previously calculated error is calculated. The difference between two adjacent calculated errors reflects the change in error. Thus, when the detection time reaches the preset time period, the error change rate within the preset time period is obtained.
[0033] The mapping relationship between error parameters and self-heating intensity can be pre-configured. Based on this mapping relationship, the first self-heating intensity can be determined.
[0034] In this embodiment, the first self-heating intensity is determined based on the error parameter between the operating temperature and the preset temperature threshold, so that the CPU can perform heating operations in a controlled manner according to the first self-heating intensity, avoiding the situation where overheating or underheating affects the working performance of the storage device.
[0035] In some embodiments, the CPU controlling the storage device performs a heating operation matching the first self-heating intensity, which may involve steps B1 and B2: Step B1: Determine the first calculated load type that matches the first self-heating intensity based on the matching relationship between the self-heating intensity and the calculated load type.
[0036] Step B2: Control the CPU to perform calculations according to the first computing load type.
[0037] The system pre-configures various computational load types and the matching relationships between different self-heating intensities and computational load types. Optionally, the computational load types include, but are not limited to, the following: encryption / decryption computation type, prime number test computation type, matrix operation load type, and scientific computation load type.
[0038] The following examples illustrate several matching relationships between self-heating intensity and calculated load type: When the self-heating intensity is low (0-30%), the appropriate computational load type is encryption / decryption computation. Since the core requirement under low heating demand is "not affecting normal system operation," encryption / decryption computation is chosen. This type offers balanced memory access, has minimal impact on the system, and can meet the needs of mild heating.
[0039] When the self-heating intensity is medium (31%~60%), the matching computational load type is the prime number test calculation type. The core of medium heating demand is "uniform heat distribution". The prime number test calculation method is computationally intensive and provides stable heat output without "fluctuations", thus meeting medium heating requirements.
[0040] When the self-heating intensity is high (61%~80%), the matching computational load type is matrix operation load type. High-intensity heating requires "rapid and large-volume heat generation," therefore the matrix operation load type is selected. This type has extremely high computational density, can heat up quickly, and can rapidly reach the preset temperature threshold.
[0041] When the self-heating intensity is 81%~100% (extremely high intensity), the appropriate computing load type is scientific computing. The core requirement under extremely high intensity is to "maximize heat." Since scientific computing can almost fully utilize all CPU resources, allowing the hardware to run at extremely high intensity, the scientific computing load type is selected. This type can heat at full capacity, maximizing heat output and meeting the heating requirements of extremely high intensity.
[0042] Optionally, the selection of an appropriate computing load type and CPU core strategy can be combined to achieve a self-heating effect. The CPU core strategy refers to selecting an appropriate number of CPU cores to participate in the computation. Therefore, step B2 can be executed as follows: steps B21, B22, and B23. Step B21: Determine the first number of CPU cores that matches the first self-heating intensity based on the matching relationship between the self-heating intensity and the number of CPU cores.
[0043] Step B22: Determine the target CPU core in the CPU that matches the number of the first CPU cores.
[0044] Step B23: Assign the computing load task corresponding to the first computing load type to the target CPU core so that the target CPU core can execute the computing load task.
[0045] When there are multiple target CPU cores, the multiple target CPU cores run in a multi-core parallel manner.
[0046] For example, at a low intensity (0-30% self-heating level), select the encryption / decryption calculation type and determine the first CPU core count as 25%-30% of the total cores. At a medium intensity (31%-60% self-heating level), select the prime number test calculation type and determine the first CPU core count as 50%-60% of the total cores. At a high intensity (61%-80% self-heating level), select the matrix operation load type and determine the first CPU core count as 70%-80% of the total cores. At an extremely high intensity (81%-100% self-heating level), select the scientific computing load type and determine the first CPU core count as 90%-100% of the total cores (e.g., all cores in parallel).
[0047] In some embodiments, the CPU controlling the storage device to perform a heating operation matching the first self-heating intensity can also be performed in the following ways: During the process of controlling the CPU to perform heating operations, a second self-heating intensity of the storage device is determined based on the real-time temperature of the storage device and a preset temperature threshold, and a second computing load type matching the second self-heating intensity is determined. The CPU's computing load type is then adjusted from a first computing load type to a second computing load type, so that the CPU performs calculations according to the second computing load type.
[0048] In this embodiment, during the CPU's heating operation, the operating temperature of the storage device (i.e., real-time temperature) is monitored in real time, and a second self-heating intensity is determined based on this real-time temperature. This, in turn, determines a second computing load type that matches the second self-heating intensity. This ensures that the CPU does not employ a fixed computing load type during heating, but rather dynamically adjusts the computing load type according to the real-time temperature of the storage device. This allows the CPU to maintain a balance between temperature increase and system performance at all times. For example, if the real-time temperature decreases, the CPU's self-heating intensity decreases accordingly, and the computing load type is adaptively adjusted to a lower computing density type. Furthermore, the number of CPU cores can be dynamically adjusted based on the real-time calculated second self-heating intensity.
[0049] In some embodiments, the CPU controlling the storage device to perform a heating operation matching the first self-heating intensity can also be performed in the following ways: Based on the matching relationship between self-heating intensity and CPU operating parameters, determine the first CPU operating parameters that match the first self-heating intensity; the CPU operating parameters include CPU voltage and / or CPU operating frequency. Adjust the current operating parameters of the CPU to the first CPU operating parameters.
[0050] For example, the CPU voltage is in the range of 0.75V to 0.88V. Normally, a CPU voltage of 0.8V is used. When the storage device is detected to be in a low temperature environment (i.e., the operating temperature is lower than the preset temperature threshold), the CPU voltage can be increased to 0.88V to improve CPU power consumption.
[0051] For example, the CPU operating frequency can support a range of 0-2GHz. Under normal circumstances, the CPU operating frequency is between 600MHz and 1.2GHz. When the storage device is detected to be in a low temperature environment, the CPU operating frequency can be increased to 2GHz to improve CPU power consumption.
[0052] Of course, the adjusted values of the CPU operating parameters are not fixed; the matching CPU operating parameters can be determined based on the first self-heating intensity. Optionally, a matching relationship between the self-heating intensity and the CPU operating parameters can be pre-configured, thereby adjusting the current operating parameters of the CPU to an appropriate value, i.e., the first CPU operating parameters, based on this matching relationship.
[0053] In some embodiments, when the operating temperature of the storage device is lower than a preset temperature threshold, bad block information of the superblock of the storage device is obtained. The bad block information is used to indicate the target superblock that belongs to the bad block, and the target superblock is erased and rewritten to achieve the CPU self-heating effect.
[0054] Figure 2 A flowchart of a temperature control method for a storage device according to another embodiment of this application is shown, such as... Figure 2 As shown, the method may include steps S201 to S209.
[0055] Step S201: Detect the operating temperature of the storage device.
[0056] The operating temperature of the storage device can be detected immediately after system initialization, i.e., after the storage device is powered on.
[0057] Step S202: Determine whether the operating temperature is lower than the preset temperature threshold. If yes, proceed to step S203; otherwise, proceed to step S201.
[0058] Step S203: Determine the first self-heating intensity of the storage device based on the operating temperature and the preset temperature threshold.
[0059] Step S204: Control the CPU frequency controller to start and adjust the current operating frequency of the CPU to match the operating frequency of the first self-heating intensity.
[0060] Step S205: Determine the first computing load type that matches the first self-heating intensity, and the first number of CPU cores that matches the first self-heating intensity.
[0061] Step S206: Assign the computing load task corresponding to the first computing load type to the target CPU core of the first number of CPU cores, so that the target CPU core executes the computing load task.
[0062] The target CPU core performs computational workload tasks, which is the process of the CPU performing heating operations.
[0063] Step S207: During the execution of computing load tasks by the target CPU core, the operating temperature of the storage device is detected in real time, and the computing load type of the CPU is dynamically adjusted according to the operating temperature.
[0064] Step S208: Detect whether the operating temperature of the storage device is higher than or equal to a preset temperature threshold; if yes, proceed to step S209; if no, proceed to step S207.
[0065] Step S209: Exit the CPU self-heating process.
[0066] Steps S203 to S207 constitute the CPU self-heating process.
[0067] The technical solution provided in this embodiment detects the operating temperature of the storage device. When the operating temperature is lower than a preset temperature threshold, a first self-heating intensity of the storage device is determined based on the operating temperature and the preset temperature threshold. This allows the CPU of the storage device to execute a heating operation matching the first self-heating intensity. Therefore, without external hardware devices, it is possible to automatically detect whether the storage device is in a low-temperature environment and automatically control the CPU to execute a heating operation matching the current self-heating intensity when the storage device is in a low-temperature environment. This achieves the effect of automatically controlling the operating temperature of the storage device without relying on external components, effectively preventing the problem of low storage device temperature affecting device reliability and ensuring the performance and stability of the storage device. Furthermore, during the process of controlling the CPU to execute the heating operation, the operating temperature of the storage device (i.e., real-time temperature) is detected in real time, and a second self-heating intensity is determined based on the real-time temperature. This, in turn, determines a second computing load type matching the second self-heating intensity. This ensures that the CPU does not adopt a fixed computing load type during heating, but rather dynamically adjusts the computing load type according to the real-time temperature of the storage device, thereby maintaining a balance between CPU heating and system performance at all times.
[0068] Figure 3 A flowchart of a temperature control method for a storage device according to another embodiment of this application is shown, such as... Figure 3 As shown, the method may include steps S301 to S308.
[0069] Step S301: Detect the operating temperature of the storage device.
[0070] The operating temperature of the storage device can be detected immediately after system initialization, i.e., after the storage device is powered on.
[0071] Step S302: Determine whether the operating temperature is lower than the preset temperature threshold. If yes, proceed to step S303; otherwise, proceed to step S301.
[0072] Step S303: Control the CPU frequency controller to start, so as to adjust the current operating frequency of the CPU and increase the CPU voltage.
[0073] The method for adjusting the current operating frequency of the CPU has been described in detail in the above embodiments and will not be repeated here.
[0074] Step S304: Control the CPU to execute the self-heating process.
[0075] In the above embodiments, steps S203 to S207 are the CPU self-heating process, which will not be repeated here.
[0076] Step S305: Obtain bad block information of the superblock of the storage device. The bad block information is used to indicate the target superblock that belongs to the bad block.
[0077] Step S306: Erase and rewrite the target superblock based on the bad block information.
[0078] Step S307: Real-time detection of whether the operating temperature of the storage device is higher than or equal to a preset temperature threshold; if yes, proceed to step S308; if no, proceed to step S306.
[0079] Step S308: Control the CPU to restore the preset operating frequency and voltage.
[0080] The preset operating frequency refers to the operating frequency when the CPU is not executing the self-heating process. The preset voltage refers to the voltage when the CPU is not executing the self-heating process. By controlling the CPU to restore the preset operating frequency and voltage, the CPU self-heating process is terminated.
[0081] In this embodiment, steps S304 and S305~S306 can be executed simultaneously, that is, the CPU self-heating process and the erase and write operation of the super block bad blocks are performed at the same time, so as to improve the CPU temperature rise effect.
[0082] The technical solution provided in this embodiment enables automatic detection of whether the storage device is in a low-temperature environment without external hardware devices. Furthermore, it allows for automatic control of CPU execution and self-heating operations when the storage device is in a low-temperature environment. This achieves automatic temperature control of the storage device without relying on external components, effectively preventing issues related to device reliability caused by excessively low storage device temperatures and ensuring the performance and stability of the storage device. In addition, by erasing and rewriting superblocks that are considered bad blocks in the storage device, the CPU's self-heating effect is further improved.
[0083] Corresponding to the application scenarios and methods provided in the embodiments of this application, the embodiments of this application also provide a temperature control device for a storage device.
[0084] Figure 4 A block diagram of a temperature control device for a storage device provided in an embodiment of this application is shown, such as... Figure 4 As shown, the temperature control device for the storage device includes: Detection module 41 is used to detect the operating temperature of the storage device; The determining module 42 is used to determine the first self-heating intensity of the storage device based on the operating temperature and the preset temperature threshold when the operating temperature is lower than the preset temperature threshold. The control module 43 is used to control the central controller CPU of the storage device to perform a heating operation that matches the first self-heating intensity.
[0085] In some embodiments, when the control module 43 controls the central controller CPU of the storage device to perform a heating operation that matches the first self-heating intensity, it performs the following steps: Based on the matching relationship between self-heating intensity and calculated load type, a first calculated load type that matches the first self-heating intensity is determined; The CPU is controlled to perform calculations according to the first computing load type.
[0086] In some embodiments, when the control module 43 controls the CPU to perform calculations according to the first computing load type, it performs the following steps: Based on the matching relationship between self-heating intensity and the number of CPU cores, determine the first number of CPU cores that matches the first self-heating intensity; Identify the target CPU cores in the CPU that match the number of cores in the first CPU. The computing load task corresponding to the first computing load type is assigned to the target CPU core so that the target CPU core executes the computing load task.
[0087] In some embodiments, when the determining module 42 determines the first self-heating intensity of the storage device based on the operating temperature and the preset temperature threshold, it performs the following steps: Calculate the error parameter between the operating temperature and the preset temperature threshold; the error parameter includes at least one of the following: difference, cumulative error, and error change rate; The first self-heating intensity is determined based on the error parameter; the first self-heating intensity is positively correlated with the error parameter.
[0088] In some embodiments, when the control module 43 controls the central controller CPU of the storage device to perform a heating operation that matches the first self-heating intensity, it performs the following steps: During the process of controlling the CPU to perform the heating operation, the second self-heating intensity of the storage device is determined based on the real-time temperature of the storage device and the preset temperature threshold, and a second computing load type matching the second self-heating intensity is determined. The CPU's computing load type is adjusted from the first computing load type to the second computing load type, so that the CPU performs calculations according to the second computing load type.
[0089] In some embodiments, when the control module 43 controls the central controller CPU of the storage device to perform a heating operation that matches the first self-heating intensity, it further performs the following steps: If the real-time temperature of the storage device is detected to be higher than or equal to the preset temperature threshold, the CPU is controlled to stop the heating operation.
[0090] In some embodiments, when the control module 43 controls the central controller CPU of the storage device to perform a heating operation that matches the first self-heating intensity, it performs the following steps: Based on the matching relationship between the self-heating intensity and the CPU operating parameters, a first CPU operating parameter matching the first self-heating intensity is determined; the CPU operating parameter includes CPU voltage and / or CPU operating frequency; Adjust the current operating parameters of the CPU to the operating parameters of the first CPU.
[0091] In some embodiments, when the detection module 41 detects the operating temperature of the storage device, it performs the following steps: Obtain the component temperature of at least one designated component in the storage device; The operating temperature is calculated based on the component temperature of the at least one specified component; the operating temperature is the lowest component temperature among the at least one component temperatures, or the operating temperature is the average temperature of the at least one component temperatures.
[0092] The apparatus according to an embodiment of this application detects the operating temperature of the storage device. If the operating temperature is lower than a preset temperature threshold, it determines a first self-heating intensity of the storage device based on the operating temperature and the preset temperature threshold. Then, it controls the central controller CPU of the storage device to execute a heating operation matching the first self-heating intensity. Therefore, without external hardware devices, it can automatically detect whether the storage device is in a low-temperature environment and automatically control the CPU to execute a heating operation matching the current self-heating intensity when the storage device is in a low-temperature environment. This achieves the effect of automatically controlling the operating temperature of the storage device without relying on external components, effectively preventing the problem of device reliability being affected by excessively low storage device temperatures, and ensuring the performance and stability of the storage device.
[0093] The functions of each module in each device in the embodiments of this application can be found in the corresponding description in the above method, and they have corresponding beneficial effects, which will not be repeated here.
[0094] Figure 5 This is a block diagram for implementing the electronic device provided in the embodiments of this application. Figure 5 As shown, the electronic device includes a memory 501 and a processor 502. The memory 501 stores a computer program that can run on the processor 502. When the processor 502 executes the computer program, it implements the method described in the above embodiments. The number of memories 501 and processors 502 can be one or more. In a specific implementation, the electronic device may also include a communication interface 503 for communicating with external devices and exchanging data.
[0095] In practical implementation, if the memory 501, processor 502, and communication interface 503 are implemented independently, they can be interconnected via a bus to communicate with each other. This bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. This bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 5 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.
[0096] Optionally, in a specific implementation, if the memory 501, processor 502 and communication interface 503 are integrated on a single chip, the memory 501, processor 502 and communication interface 503 can communicate with each other through an internal interface.
[0097] This application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method provided in this application.
[0098] This application provides a computer program product, including a computer program that, when executed by a processor, implements the method provided in this application.
[0099] This application also provides a chip including a processor for calling and executing instructions stored in a memory, causing a communication device with the chip installed to perform the method provided in this application.
[0100] This application also provides a chip, including: an input interface, an output interface, a processor, and a memory. The input interface, output interface, processor, and memory are connected through an internal connection path. The processor is used to execute code in the memory. When the code is executed, the processor is used to execute the method provided in the application embodiment.
[0101] It should be understood that the aforementioned processor can be a Central Processing Unit (CPU), or other general-purpose processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field-Programmable Gate Arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. General-purpose processors can be microprocessors or any conventional processor. It is worth noting that the processor can be a processor supporting Advanced Reduced Instruction Set Machines (ARM) architecture.
[0102] Further, optionally, the aforementioned memory may include read-only memory and random access memory. The memory may be volatile memory or non-volatile memory, or may include both. Non-volatile memory may include read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory may include random access memory (RAM), which serves as an external cache. By way of example, but not limitation, many forms of RAM are available. Examples include Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Sync Link DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).
[0103] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. A computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions according to this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transferred from one computer-readable storage medium to another.
[0104] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.
[0105] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0106] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process. Furthermore, the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functionality involved.
[0107] The logic and / or steps described in the flowchart or otherwise herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus or device (such as a computer-based system, a processor-included system or other system that can fetch and execute instructions from, an instruction execution system, apparatus or device).
[0108] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. All or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware, the program being stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiments.
[0109] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. This storage medium can be a read-only memory, a disk, or an optical disk, etc.
[0110] The above description is merely an exemplary embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope described in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A temperature control method for a storage device, characterized in that, include: Detect the operating temperature of the storage device; When the operating temperature is lower than a preset temperature threshold, the first self-heating intensity of the storage device is determined based on the operating temperature and the preset temperature threshold. The central controller CPU of the storage device executes a heating operation that matches the first self-heating intensity.
2. The method according to claim 1, characterized in that, The central controller CPU that controls the storage device to perform a heating operation matching the first self-heating intensity includes: Based on the matching relationship between self-heating intensity and calculated load type, a first calculated load type that matches the first self-heating intensity is determined; The CPU is controlled to perform calculations according to the first computing load type.
3. The method according to claim 2, characterized in that, The step of controlling the CPU to perform calculations according to the first computing load type includes: Based on the matching relationship between self-heating intensity and the number of CPU cores, determine the first number of CPU cores that matches the first self-heating intensity; Identify the target CPU cores in the CPU that match the number of cores in the first CPU. The computing load task corresponding to the first computing load type is assigned to the target CPU core so that the target CPU core executes the computing load task.
4. The method according to claim 1, characterized in that, Determining the first self-heating intensity of the storage device based on the operating temperature and the preset temperature threshold includes: Calculate the error parameter between the operating temperature and the preset temperature threshold; the error parameter includes at least one of the following: difference, cumulative error, and error change rate; The first self-heating intensity is determined based on the error parameter; the first self-heating intensity is positively correlated with the error parameter.
5. The method according to claim 2, characterized in that, The central controller CPU that controls the storage device to perform a heating operation matching the first self-heating intensity includes: During the process of controlling the CPU to perform the heating operation, the second self-heating intensity of the storage device is determined based on the real-time temperature of the storage device and the preset temperature threshold, and a second computing load type matching the second self-heating intensity is determined. The CPU's computing load type is adjusted from the first computing load type to the second computing load type, so that the CPU performs calculations according to the second computing load type.
6. The method according to claim 5, characterized in that, The central controller CPU that controls the storage device to perform a heating operation matching the first self-heating intensity further includes: If the real-time temperature of the storage device is detected to be higher than or equal to the preset temperature threshold, the CPU is controlled to stop the heating operation.
7. The method according to claim 1, characterized in that, The central controller CPU that controls the storage device to perform a heating operation matching the first self-heating intensity includes: Based on the matching relationship between the self-heating intensity and the CPU operating parameters, a first CPU operating parameter matching the first self-heating intensity is determined; the CPU operating parameter includes CPU voltage and / or CPU operating frequency; Adjust the current operating parameters of the CPU to the operating parameters of the first CPU.
8. The method according to claim 1, characterized in that, The operating temperature of the detection storage device includes: Obtain the component temperature of at least one designated component in the storage device; The operating temperature is calculated based on the component temperature of the at least one specified component; the operating temperature is the lowest component temperature among the at least one component temperatures, or the operating temperature is the average temperature of the at least one component temperatures.
9. A temperature control device for a storage device, characterized in that, include: The detection module is used to detect the operating temperature of the storage device; A determining module is configured to determine the first self-heating intensity of the storage device based on the operating temperature and the preset temperature threshold when the operating temperature is lower than the preset temperature threshold. The control module is used to control the central controller CPU of the storage device to perform a heating operation that matches the first self-heating intensity.
10. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory, wherein the processor, when executing the computer program, implements the method of any one of claims 1 to 8.