Sample processing device and LIBS detection device

Abstract

The invention discloses a sample processing device and an LIBS detection device, and relates to the technical field of mechanical automation, the sample processing device comprises a bearing assembly, a liquid dropping assembly, a heating device, a taking and placing assembly and a control system; during working, the taking and placing assembly places a clean silicon wafer substrate on an initial station of the rotary table, and the rotary table conveys the clean silicon wafer substrate to a liquid dropping station, a heating station and a detection station in sequence; the liquid dropping assembly automatically completes quantitative extraction, mixing and dropping of liquid to be detected and a thickening agent; a heating device is used for curing; the cured sample is detected by an LIBS spectrometer; and finally, the silicon wafer substrate is put back by the pick-and-place assembly to form a closed loop. According to the device, the traditional manual operation is replaced by mechanical automation, so that the high consistency and repeatability of the sample preparation process are ensured, and the efficiency and the sample quality are remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of mechanical automation technology, specifically to a sample processing device and a LIBS detection device. Background Technology

[0002] In facility agriculture and precision agriculture, accurate and rapid online monitoring of the composition of agricultural water, such as nutrient solutions for hydroponics, is a key requirement for improving production management. Laser-induced breakdown spectroscopy (LIBS) technology has advantages such as simultaneous multi-element detection and fast analysis speed, and has application potential in this field. However, when LIBS technology directly detects liquid samples, the detection accuracy is affected by factors such as liquid flowability, splashing, and surface tension. To overcome this problem, the liquid-solid conversion pretreatment method (dry drop method) is widely used. By mixing the liquid sample with a thickener and then forming a solid film on a silicon wafer substrate, liquid detection is transformed into more stable solid detection, thereby improving the analytical performance of LIBS.

[0003] Currently, the closest approach to dry-drop pretreatment of liquid samples in LIBS testing relies on manual operation using discrete tools such as pipettes, mixing containers, and heating plates. This includes manual preparation of the mixture, drop addition, heating and solidification, sample transfer, and cleaning. While this method offers some flexibility, the overall process is loose and lacks automation. Manual operation inevitably introduces errors in mixing ratios, drop placement, and heating time, leading to poor sample preparation consistency and affecting the accuracy of spectral data. Therefore, there is an urgent need for a device that can fully automate the dry-drop sample preparation process with high consistency and efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a sample processing device and a LIBS detection device to solve the problems existing in the prior art, which can automatically and efficiently complete the "dry drop method" sample preparation process with high consistency.

[0005] To achieve the above objectives, the present invention provides the following solution: This invention provides a sample processing apparatus, including a carrier component, a liquid-dispensing component, a heating device, a pick-and-place component, and a control system. The carrier component includes a rotatable carrier turntable and an initial station, a liquid-dispensing station, a heating station, and a detection station arranged sequentially around its circumference. The carrier turntable is used to fix a silicon wafer substrate and transport the silicon wafer substrate sequentially to each station for processing by rotation. The liquid-dispensing component is used to quantitatively extract and mix the liquid to be tested with a thickener, and then drop the mixture onto the silicon wafer substrate at the liquid-dispensing station. The heating device is used to heat the silicon wafer substrate at the heating station. The pick-and-place component is used to transfer the silicon wafer substrate between the substrate storage area and the initial station. The control system is communicatively connected to the carrier component, the liquid-dispensing component, the heating device, and the pick-and-place component to control the operation of each component.

[0006] In some embodiments, the droplet assembly includes a first storage unit, a second storage unit, a first delivery unit, a second delivery unit, a third delivery unit, a mixing unit, and a droplet unit; the first storage unit stores the liquid to be tested; the second storage unit stores a thickener; the inlet of the first delivery unit is connected to the first storage unit, and the outlet of the first delivery unit is connected to the mixing unit, for delivering the liquid to be tested from the first storage unit to the mixing unit; the inlet of the second delivery unit is connected to the second storage unit, and the outlet of the second delivery unit is connected to the mixing unit, for delivering the thickener from the second storage unit to the mixing unit; the inlet of the third delivery unit is connected to the mixing unit, and the outlet of the third delivery unit is connected to the droplet unit, for delivering the mixed liquid to the droplet unit; the mixing unit receives and mixes the liquid to be tested and the thickener; the droplet unit is capable of dropping the mixed liquid onto the silicon substrate located at the droplet station.

[0007] In some embodiments, the dripping unit includes: an injection assembly for dripping liquid onto a silicon substrate at the dripping station; a fluid conduit including a main conduit and a four-way connector; the main conduit connecting the outlet of the third delivery unit to a first interface of the four-way connector; a second interface of the four-way connector connecting to the injection assembly; and a cleaning assembly including a liquid cleaning valve and a gas purging valve; the liquid cleaning valve being connected to a third interface of the four-way connector for controlling the inflow of cleaning liquid to flush the fluid conduit, the injection assembly, and the mixing unit; the gas purging valve being connected to a fourth interface of the four-way connector for controlling the inflow of compressed gas to purge residual fluid from the fluid conduit and the injection assembly; wherein the control system is configured to coordinate the control of the liquid cleaning valve and the gas purging valve to perform a preset conduit cleaning and purging operation.

[0008] In some embodiments, the injection assembly includes: an injection needle and an injection tube communicating with each other, the injection tube communicating with a second interface of the four-way connector; a fixing device for fixing the injection tube; and a rotary drive mechanism, the rotary output end of which is connected to the fixing device for driving the injection needle to switch between a dripping position toward the dripping station and a draining position toward a waste liquid collection container. In some embodiments, the second storage unit is provided with a heating plate for heating the thickener.

[0009] In some embodiments, the pick-and-place assembly includes: a rotary drive mechanism for providing horizontal rotational motion; a lifting drive mechanism mounted at the output end of the rotary drive mechanism for providing vertical lifting motion; a telescopic drive mechanism mounted at the output end of the lifting drive mechanism for providing horizontal telescopic motion; and a vacuum adsorption component mounted at the output end of the telescopic drive mechanism for picking up and releasing the silicon wafer substrate.

[0010] In some embodiments, the carrier turntable is provided with slots or vacuum adsorption structures for positioning and fixing the silicon wafer substrate.

[0011] In some embodiments, the substrate storage area includes a first storage area and a second storage area; both the first and second storage areas are provided with multiple independent accommodating positions; the accommodating positions in the first storage area are used to accommodate unused clean silicon wafer substrates; the accommodating positions in the second storage area are used to accommodate silicon wafer substrates after testing; the control system is also used to mark and manage the status of the silicon wafer substrates in each accommodating position.

[0012] In some embodiments, an imaging station is also included, located around the carrier turntable; the imaging station is located after the inspection station and is used to record images of the silicon wafer substrate after inspection.

[0013] The present invention also provides a LIBS detection device, characterized in that it includes the sample processing device as described in any one of the above claims.

[0014] The present invention achieves the following technical effects compared to the prior art: This invention provides a sample processing device, comprising a carrier component, a dispensing component, a heating device, a pick-and-place component, and a control system. The control system instructs the pick-and-place component to pick up a clean silicon wafer substrate from the substrate storage area and place it on the initial station of the carrier turntable. Subsequently, the carrier turntable rotates, transporting the silicon wafer substrate to the dispensing station, where the dispensing component automatically completes the quantitative extraction, mixing, and dispensing of the test liquid and thickener. Next, the carrier turntable continues to rotate, sending the dispensed silicon wafer substrate to the heating station for programmed heating and curing. After curing, the sample is transferred to the detection station for analysis by a LIBS spectrometer. Finally, the carrier turntable returns the tested silicon wafer substrate to the initial station, where the pick-and-place component moves it back to the storage area, completing one cycle. The entire process is fully automated, completely replacing the traditional manual, discrete, step-by-step operation mode. The mechanical precision ensures high consistency and repeatability in each step of liquid quantification, mixing, dispensing, and heating and curing, fundamentally solving the core problem of poor sample consistency caused by errors introduced by manual operation, while significantly improving sample preparation efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the sample processing device in some embodiments; Figure 2 for Figure 1 Top view; Figure 3 This is a schematic diagram of the structure of the carrier component in some implementation methods; Figure 4 This is a schematic diagram of the structure of the dripping assembly removing the dripping unit in some embodiments; Figure 5 for Figure 4 Side view; Figure 6 for Figure 4 Top view; Figure 7 This is a schematic diagram of the structure of the droplet unit in some embodiments; Figure 8 This is a schematic diagram of the pick-and-place component in some implementation methods; Figure 9 This is a partial cross-sectional view of the pick-and-place component in some embodiments; In the diagram: 1-Bearing component; 11-Bearing turntable; 12-Initial station; 13-Drip station; 14-Heating station; 15-Detection station; 16-Photographing station; 17-Heating device; 18-First drive motor; 2-Drip component; 21-First storage unit; 22-Second storage unit; 23-First conveying unit; 24-Second conveying unit; 25-Mixing unit; 26-Third conveying unit; 27-Heating plate; 28-Stirring motor; 29-Main pipeline; 210-Four-way connector; 21 1-Injection needle; 212-Injection tube; 213-Fixing device; 214-Liquid cleaning valve; 215-Cleaning fluid conduit; 216-Gas purging valve; 217-Air inlet conduit; 218-Controllable solenoid valve; 219-Drainage pipeline; 220-Rotary drive motor; 3-Pick-and-place assembly; 31-Rotary drive mechanism; 311-Rotary platform; 32-Lifting drive mechanism; 33-Telescopic drive mechanism; 34-Vacuum adsorption component; 4-First storage area; 5-Second storage area; 6-Waste liquid collection container. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] The purpose of this invention is to provide a sample processing device and a LIBS detection device to solve the problems existing in the prior art, which can automatically and efficiently complete the "dry drop method" sample preparation process with high consistency.

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] Example 1 Combination Figures 1 to 9This embodiment provides a sample processing device, including a carrier component 1, a dripping component 2, a heating device 17, a pick-and-place component 3, and a control system. The carrier component 1 includes a rotatable carrier turntable 11 and an initial station 12, a dripping station 13, a heating station 14, and a detection station 15 arranged sequentially around its circumference. The carrier turntable 11 is used to fix the silicon wafer substrate and transport the silicon wafer substrate to each station for processing by rotation. The dripping component 2 is used to quantitatively extract and mix the liquid to be tested and the thickener, and drip the mixture onto the silicon wafer substrate on the dripping station 13. The heating device 17 is used to heat the silicon wafer substrate on the heating station 14. The pick-and-place component 3 is used to transfer the silicon wafer substrate between the substrate storage area and the initial station 12. The control system is communicatively connected to the carrier component 1, the dripping component 2, the heating device 17, and the pick-and-place component 3 to control the operation of each component.

[0021] In this embodiment, the control system controls the pick-and-place component 3 to pick up a clean silicon wafer substrate from the substrate storage area and place it on the initial station 12 of the carrier turntable 11. Subsequently, the carrier turntable 11 rotates, transporting the silicon wafer substrate to the dispensing station 13, where the dispensing component 2 automatically completes the quantitative extraction, mixing, and dispensing of the test liquid and thickener. Next, the carrier turntable 11 continues to rotate, sending the dispensed silicon wafer substrate to the heating station 14 for programmed heating and curing. After curing, the sample is transferred to the detection station 15 for detection by the LIBS spectrometer. Finally, the carrier turntable 11 returns the detected silicon wafer substrate to the initial station 12, where the pick-and-place component 3 moves it back to the storage area, completing one cycle. The entire process is fully automated, completely replacing the traditional manual, discrete, step-by-step operation mode. The precision of the machinery ensures high consistency and repeatability in each step of liquid quantification, mixing, dispensing, and heating curing, fundamentally solving the core problem of poor sample consistency caused by errors introduced by manual operation, while significantly improving sample preparation efficiency.

[0022] Understandably, the rotating disk 11 is controlled to rotate by the first drive motor 18.

[0023] In some examples, combined Figures 4 to 7The dripping assembly 2 includes a first storage unit 21, a second storage unit 22, a first conveying unit 23, a second conveying unit 24, a third conveying unit 26, a mixing unit 25, and a dripping unit. The first storage unit 21 stores the liquid to be tested. The second storage unit 22 stores a thickener. The inlet of the first conveying unit 23 is connected to the first storage unit 21, and the outlet of the first conveying unit 23 is connected to the mixing unit 25, for conveying the liquid to be tested from the first storage unit 21 to the mixing unit 25. The inlet of the second conveying unit 24 is connected to the second storage unit 22, and the outlet of the second conveying unit 24 is connected to the mixing unit 25, for conveying the thickener from the second storage unit 22 to the mixing unit 25. The inlet of the third conveying unit 26 is connected to the mixing unit 25, and the outlet of the third conveying unit 26 is connected to the dripping unit, for conveying the mixed liquid to the dripping unit. The mixing unit 25 receives and mixes the liquid to be tested and the thickener. The dripping unit can drip the mixed liquid onto the silicon substrate at the dripping station 13.

[0024] In this embodiment, the first delivery unit 23 and the second delivery unit 24 are a peristaltic pump for the test liquid and a peristaltic pump for the thickener, respectively. The first storage unit 21 is connected to one end of the peristaltic pump for the test liquid, and the second storage unit 22 is connected to one end of the peristaltic pump for the thickener. The mixing unit 25 is connected to the other end of both the peristaltic pump for the test liquid and the peristaltic pump for the thickener. By controlling the rotation of the peristaltic pump, the test liquid and the thickener are mixed in the mixing unit 25.

[0025] Understandably, the mixing unit 25 is equipped with a stirring rod driven by the stirring motor 28.

[0026] In a preferred embodiment, the first conveying unit 23 and the second conveying unit 24 are driven by the same controller to precisely control the conveying ratio of the two liquids; the mixing unit 25 may also be a static mixer.

[0027] In some examples, combined Figure 7As shown, the dripping unit includes: an injection assembly for dripping liquid onto a silicon wafer substrate at dripping station 13; a fluid pipeline including a main pipeline 29 and a four-way connector 210; the main pipeline 29 connects the outlet of the third delivery unit 26 to the first interface of the four-way connector 210; the second interface of the four-way connector 210 connects to the injection assembly; and a cleaning assembly including a liquid cleaning valve 214 and a gas purging valve 216; one end of the liquid cleaning valve 214 is connected to the third interface of the four-way connector 210, and the other end is connected to a cleaning liquid conduit 215, for controlling the inflow of cleaning liquid to flush the fluid pipeline, the injection assembly, and the mixing unit 25; one end of the gas purging valve 216 is connected to the fourth interface of the four-way connector 210, and the other end is connected to an air inlet conduit 217, for controlling the inflow of compressed gas to purge residual fluid in the fluid pipeline and the injection assembly; wherein, the control system is configured to coordinate the control of the liquid cleaning valve 214 and the gas purging valve 216 to perform a preset pipeline cleaning and purging operation.

[0028] This embodiment provides a specific structure for a dripping unit. This unit uses a four-way connector 210 as the core of the flow path, integrating delivery, dripping, and automatic cleaning functions. The injection assembly can switch between the dripping position and the alignment with the waste liquid collection container 6 via a rotary drive motor 220.

[0029] Its working process is as follows: During dripping, the peristaltic pump of the mixed liquid delivers the mixed liquid through the four-way connector 210 to the injection needle 211 at the dripping position to complete the dripping of the silicon wafer substrate; during cleaning, the needle is first rotated to the drain position, and then the control system sequentially opens the liquid cleaning valve 214 and the gas purging valve 216 to drive the cleaning liquid (such as distilled water) and compressed gas to flush and purge the inside of the mixing unit 25 and the entire flow path from the outlet of the mixing unit 25 to the injection needle 211. The waste liquid is discharged into the waste liquid collection container 6.

[0030] Understandably, the cleaning fluid can be supplied by an external power source, while the purging gas is supplied by a pressurized air source. Residual liquid within the mixing unit 25 can be pumped out by a peristaltic pump or treated separately.

[0031] This embodiment achieves a fully automated cycle from dripping to cleaning within a compact space. Through the precise coordination of mechanical motion and fluid control, it not only ensures the accuracy and consistency of sample preparation but also completely eliminates cross-contamination, ensuring the continuous and reliable operation of the device.

[0032] In some examples, the injection assembly includes: an injection needle 211 and an injection tube 212, which are connected to each other to form the final outflow channel of the mixture; and the injection tube 212 is connected to the second interface of the four-way connector 210; a fixing device 213 is used to fix the injection tube 212 to ensure its stability during operation; the rotation output end of the rotary drive motor 220 is connected to the fixing device 213, which can drive the injection needle 211 to switch between two preset positions. One is the dripping position, where the injection needle 211 is precisely aligned with the center of the silicon substrate on the dripping position 13 to perform dripping; the other is the discharge position, where the needle rotates at a certain angle so that its outlet is aligned with the dedicated waste liquid collection container 6 so as to discharge waste liquid during the cleaning stage. This structure achieves accurate and reliable switching of the flow path terminal direction through simple mechanical rotation, which not only ensures the consistency and repeatability of the dripping point, but also provides the necessary structural foundation for subsequent automatic cleaning and prevention of cross-contamination.

[0033] In some examples, a drain line 219 connected to the injection tube 212 is also included. A controllable solenoid valve 218 is also provided on the drain line 219 to control the opening and closing of the drain line 219. The outlet end of the drain line 219 is parallel to the injection needle 211 and faces the waste liquid collection container 6. When the cleaning command is executed, the controllable solenoid valve 218 is automatically opened. At this time, the drain line 219 and the injection needle 211 simultaneously discharge waste liquid, which helps to enhance the drainage efficiency.

[0034] In some examples, the second storage unit 22 is equipped with a heating plate 27 for heating the thickener.

[0035] This embodiment, by setting up a heating plate 27, can moderately heat the thickener in a low-temperature environment to reduce its viscosity, increase its fluidity, and ensure the accuracy of quantitative extraction.

[0036] In some examples, combined with diagrams Figures 8 to 9 As shown, the pick-and-place assembly 3 includes: a rotary drive mechanism 31 for providing horizontal rotational motion; a lifting drive mechanism 32, installed at the output end of the rotary drive mechanism 31 for providing vertical lifting motion; a telescopic drive mechanism 33, installed at the output end of the lifting drive mechanism 32 for providing horizontal telescopic motion; and a vacuum adsorption component 34, installed at the output end of the telescopic drive mechanism 33 for picking up and releasing the silicon wafer substrate.

[0037] In this embodiment, the rotary drive mechanism 31 is a servo motor, and the output end of the servo motor is provided with a rotary platform 311 for setting up the lifting drive mechanism 32; the lifting drive mechanism 32 is a lifting servo electric cylinder; the telescopic drive mechanism 33 is a telescopic servo electric cylinder.

[0038] The three-axis coordinated mechanical structure of the pick-and-place assembly 3, combined with the vacuum adsorption end, enables the adsorption component to move flexibly and precisely in three-dimensional space through the precise coordination of three degrees of freedom: rotation, lifting, and extension. This fully covers the complex transfer path from the substrate storage area to each station on the carrier turntable 11. Secondly, the vacuum adsorption pick-and-place method avoids scratches or stress damage to the brittle silicon wafer substrate that may be caused by mechanical clamping, while also adapting to its smooth surface characteristics.

[0039] It should be noted that the vacuum pump and vacuum adsorption component 34 are connected by a pipeline, and the silicon wafer substrate is picked up by controlling the vacuum pump to turn on and off.

[0040] The sequence and logic of the operation of the vacuum pump, each servo cylinder and servo motor are coordinated and controlled by a central control system (such as a PLC) based on a preset program and sensor feedback signals.

[0041] In some examples, the carrier turntable 11 is provided with slots or vacuum adsorption structures for positioning and fixing the silicon wafer substrate.

[0042] In some examples, the substrate storage area includes a first storage area 4 and a second storage area 5; both the first storage area 4 and the second storage area 5 are provided with multiple independent accommodating positions; the accommodating positions of the first storage area 4 are used to accommodate unused clean silicon wafer substrates; the accommodating positions of the second storage area 5 are used to accommodate silicon wafer substrates after testing; the control system is also used to mark and manage the status of the silicon wafer substrates in each accommodating position.

[0043] In this embodiment, to achieve precise management and efficient cyclic scheduling of silicon wafer substrates, the system sets a unique program coordinate for each physical storage location in the storage area and tracks and updates its status in real time.

[0044] This control is a routine auxiliary means to realize the mechanical process. It is controlled by the control system according to a preset program, and its control logic is as follows: Status markers: Each coordinate position has three states: "unused" (containing a clean silicon wafer substrate), "used" (the silicon wafer substrate has been removed), or "empty" (the position is available).

[0045] Retrieval Logic: When the automatic pick-and-place component 3 needs to retrieve a silicon wafer substrate, the control system automatically locates and prioritizes retrieving the silicon wafer substrate from the coordinate position marked as "unused". After the silicon wafer substrate is retrieved, the coordinate status is immediately updated to "used".

[0046] Storage logic: When a silicon substrate at a certain coordinate position is removed, its status is simultaneously updated to "empty". When the automatic pick-and-place component 3 retrieves a substrate that has completed inspection from the turntable, the system guides it to prioritize storing the substrate at the coordinate position marked as "empty", thereby realizing the recycling of storage resources.

[0047] Some examples also include a photo-taking station 16 located around the carrier turntable 11; the photo-taking station 16 is located after the inspection station 15 and is used to record images of the processed silicon wafer substrate. By automatically recording images of the inspected silicon wafer substrate, the system can retain visual evidence of the results and provide a traceable quality file for each silicon wafer. This not only helps to monitor process consistency and product surface condition in real time, but also allows for quick location of problem links when quality abnormalities occur, supporting closed-loop feedback and continuous optimization of the production process.

[0048] It should be noted that the carrier turntable 11 in this embodiment adopts a multi-station layout, allowing processes such as dripping, heating, detection, and imaging to be performed in parallel in space and in a continuous flow in time. The mechanical pick-and-place assembly 3 and the dripping assembly 2 can work independently or collaboratively, compressing multiple processing steps of a sample into a compact mechanical cycle. The single sample processing cycle is significantly shortened, and the equipment can operate continuously, resulting in an order-of-magnitude increase in overall throughput, which can meet the timeliness requirements of high-throughput screening or online monitoring.

[0049] It should be noted that this control system is communicatively connected to each drive motor, pump, valve, and sensor in the device, and is used to receive commands, process signals, and coordinate the sequential actions of all actuators (such as start-stop, speed regulation, and position control). Those skilled in the art will understand that such a control system can be implemented using conventional automation equipment such as programmable logic controllers (PLCs), industrial computers, or embedded controllers, and its specific programming and configuration are known technical means for implementing the aforementioned mechanical processes and management logic.

[0050] Example 2 This embodiment also provides a LIBS detection device, including the sample processing device in Embodiment 1. The LIBS detection device is used for qualitative and quantitative analysis of the elemental composition in the sample.

[0051] Understandably, testing station 15 corresponds to the testing end of the LIBS testing device.

[0052] In the description of this invention, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0053] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings of this specification are only used to complement the content disclosed in the specification, so as to enable those skilled in the art to understand and read them, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0054] It should be noted that, for those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of the present invention is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all changes falling within the meaning and scope of the equivalents of the claims be included within the present invention.

[0055] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A sample processing device, characterized in that, include: The carrier assembly includes a rotatable carrier turntable and an initial station, a dripping station, a heating station, and a detection station arranged sequentially around its circumference; the carrier turntable is used to fix the silicon wafer substrate and to transport the silicon wafer substrate to each station for processing by rotating it. The droplet assembly is used to quantitatively extract and mix the liquid to be tested and the thickener, and then drop the mixture onto the silicon substrate at the droplet station. A heating device for heating the silicon wafer substrate at the heating station; A pick-and-place assembly for transferring the silicon wafer substrate between the substrate storage area and the initial work station; as well as The control system is communicatively connected to the bearing component, the dripping component, the heating device, and the pick-and-place component, and is used to control the actions of each component.

2. The sample processing apparatus according to claim 1, characterized in that, The droplet assembly includes a first storage unit, a second storage unit, a first delivery unit, a second delivery unit, a third delivery unit, a mixing unit, and a droplet unit. The first storage unit stores the liquid to be tested. The second storage unit stores a thickener. The inlet of the first delivery unit is connected to the first storage unit, and the outlet of the first delivery unit is connected to the mixing unit, for delivering the liquid to be tested from the first storage unit to the mixing unit. The inlet of the second delivery unit is connected to the second storage unit, and the outlet of the second delivery unit is connected to the mixing unit, for delivering the thickener from the second storage unit to the mixing unit. The inlet of the third delivery unit is connected to the mixing unit, and the outlet of the third delivery unit is connected to the droplet unit, for delivering the mixed liquid to the droplet unit. The mixing unit receives and mixes the liquid to be tested and the thickener. The droplet unit can drop the mixed liquid onto the silicon substrate located at the droplet station.

3. The sample processing apparatus according to claim 2, characterized in that, The droplet unit includes: An injection assembly for dripping liquid onto a silicon wafer substrate at the dripping station; A fluid pipeline, including a main pipeline and a four-way connector; the main pipeline connects the outlet of the third delivery unit to the first interface of the four-way connector; the second interface of the four-way connector connects to the injection assembly; and The cleaning assembly includes a liquid cleaning valve and a gas purging valve; the liquid cleaning valve is connected to the third port of the four-way connector and is used to control the inflow of cleaning liquid to flush the fluid lines, the injection assembly, and the mixing unit; the gas purging valve is connected to the fourth port of the four-way connector and is used to control the inflow of compressed gas to purge the fluid lines and residual fluid in the injection assembly. The control system is configured to coordinate the control of the liquid cleaning valve and the gas purging valve to perform preset pipeline cleaning and purging operations.

4. The sample processing apparatus according to claim 3, characterized in that, The injection assembly includes: The injection needle and the injection tube are connected to each other, and the injection tube is connected to the second interface of the four-way connector; A fixing device for fixing the injection tube; and A rotary drive mechanism, whose rotary output end is connected to the fixed device, is used to drive the injection needle to switch between a dripping position toward the dripping station and a draining position toward a waste liquid collection container.

5. The sample processing apparatus according to claim 4, characterized in that, The second storage unit is equipped with a heating plate for heating the thickener.

6. The sample processing apparatus according to claim 1, characterized in that, The pick-and-place component includes: A rotary drive mechanism for providing horizontal rotary motion; A lifting drive mechanism is installed at the output end of the rotary drive mechanism to provide vertical lifting motion; A telescopic drive mechanism, installed at the output end of the lifting drive mechanism, is used to provide horizontal telescopic movement; and A vacuum adsorption component is installed at the output end of the telescopic drive mechanism and is used to pick up and release the silicon wafer substrate.

7. The sample processing apparatus according to claim 1, characterized in that, The carrier turntable is provided with slots or vacuum adsorption structures for positioning and fixing the silicon wafer substrate.

8. The sample processing apparatus according to claim 7, characterized in that, The substrate storage area includes a first storage area and a second storage area; both the first and second storage areas are provided with multiple independent accommodating positions; the accommodating positions in the first storage area are used to accommodate unused clean silicon wafer substrates; the accommodating positions in the second storage area are used to accommodate silicon wafer substrates after testing; the control system is also used to mark and manage the status of the silicon wafer substrates in each accommodating position.

9. The sample processing apparatus according to claim 8, characterized in that, It also includes a photographing station located around the carrier turntable; the photographing station is located after the inspection station and is used to record images of the silicon wafer substrate after inspection.

10. A LIBS detection device, characterized in that, Includes the sample processing apparatus according to any one of claims 1-9.

Images