A testing method, apparatus, electronic device, and storage medium for a testing device.

Abstract

This application provides a testing method, apparatus, electronic device, and storage medium for a testing equipment. The testing method includes: recalling a pre-stored standard image of a defective motherboard based on preset recall conditions; performing optical inspection on the standard image to obtain machine inspection information of the testing equipment; and determining the testing effect of the testing equipment by comparing the machine inspection information with the defect information of the pre-stored defective motherboard. This application automates the testing of the testing effect of the testing equipment, improves testing accuracy and efficiency, and reduces the defect rate caused by missed detections and false detections, thereby improving the production efficiency and quality of motherboards and providing strong support for the automation of the production process.

Description

Technical Field

[0001] This application relates to the field of testing technology, specifically to a testing method, apparatus, electronic device, and storage medium for a testing device. Background Technology

[0002] With the rapid development of electronic technology, the manufacturing process of electronic motherboards is also constantly evolving. Among them, surface mount technology (SMT) is one of the most widely used processes. It encompasses multiple key workstations in the printed circuit board (PCB) process, including printing, mounting, and dispensing. The efficient operation of these workstations directly determines the production efficiency and product quality of electronic motherboards. In the SMT process, the application of optical inspection equipment is crucial, as it enables defect detection of the motherboard at various workstations such as printing, mounting, and dispensing.

[0003] Existing optical inspection equipment faces numerous challenges during the inspection process, such as missed and false positives caused by factors like light source attenuation, adjustment errors, and the subjectivity of human retesting. Unreasonable missed and false positives not only lead to a decline in production quality but also an increase in production costs. To verify the accuracy and reliability of optical inspection equipment, testing is necessary. Traditional testing methods often rely primarily on manual testing, which not only increases labor costs but is also susceptible to the influence of subjective factors by the testers, easily causing errors and failing to guarantee testing accuracy and efficiency, thus failing to meet the requirements of advanced manufacturing processes. Summary of the Invention

[0004] In view of the above, this application provides a testing method, apparatus, electronic device and storage medium for testing equipment, in order to solve the technical problem that traditional testing methods often rely mainly on manual testing, which not only increases labor costs, but is also easily affected by the subjective factors of the testers, which can easily lead to errors, cannot guarantee testing accuracy and efficiency, and cannot meet the technical requirements of advanced process production.

[0005] This application provides a testing method for a testing device, the testing method comprising: The standard image of a faulty motherboard is retrieved based on preset invocation conditions; Optical inspection is performed on the standard image to obtain the machine inspection information of the inspection equipment; The detection effectiveness of the testing equipment is determined by comparing the machine inspection information with the pre-stored defect information of the faulty motherboard.

[0006] In some embodiments, the testing method further includes, before invoking a pre-stored standard image of a faulty motherboard based on preset invocation conditions: Obtain a standard image of the faulty motherboard and store the standard image offline.

[0007] In some embodiments, after comparing the machine inspection information with preset defect information of the faulty motherboard, the testing method further includes: Determine the missed detection information and / or false detection information of the detection equipment; The detection equipment is calibrated based on the missed detection information and / or false detection information.

[0008] In some embodiments, after obtaining the machine inspection information, the testing method further includes: Receive the user's review result of the machine inspection information; The effectiveness of the re-judgment for the user is determined by comparing the re-judgment result with the negative information.

[0009] In some embodiments, the naming content of the standard image includes the name of the detection device, and the method of calling the standard image includes: The corresponding standard image is retrieved based on the name of the detection device.

[0010] In some embodiments, the invocation conditions include at least the set invocation time and / or the set invocation frequency.

[0011] In some embodiments, the machine inspection information includes at least the type of machine inspection defect, the location of the machine inspection defect, and the degree of the machine inspection defect.

[0012] This application embodiment also provides a testing apparatus for a testing device, the testing apparatus comprising: The calling module is used to call a pre-stored standard image of a faulty motherboard based on preset calling conditions; The detection module is used to perform optical inspection on the standard image to obtain the machine inspection information of the detection equipment; The testing module is used to determine the testing effect of the testing equipment by comparing the machine inspection information with the pre-stored defect information of the defective motherboard.

[0013] This application also provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, it implements the steps of the testing method of the detection device as described in the above embodiments.

[0014] This application also provides a readable storage medium storing a computer program, which, when executed by a processor, implements the steps of the testing method of the detection device as described in the above embodiments.

[0015] This application retrieves pre-stored standard images of defective motherboards based on preset recall conditions; further, it performs optical inspection on the standard images using a testing device to obtain machine inspection information; finally, by comparing the machine inspection information with the pre-stored defect information of the defective motherboards, it determines the testing effectiveness of the testing device. Based on this, this application achieves automated testing of the testing effectiveness of the testing device, improving testing accuracy and efficiency, thereby reducing the defect rate caused by missed and false detections, thus improving the production efficiency and quality of motherboards and providing strong support for the automation of the production process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the steps of a testing method for a testing device provided in an embodiment of this application.

[0017] Figure 2 This is a schematic diagram illustrating the composition of the graphical user interface of a detection device provided in an embodiment of this application.

[0018] Figure 3 This is a schematic diagram of the composition of the testing apparatus of a testing device provided in an embodiment of this application.

[0019] Figure 4 This is a schematic diagram of the hardware structure of an electronic device provided in an embodiment of this application.

[0020] Explanation of main component symbols Test device 100 Call module 110 Detection module 120 Test Module 130 Determine module 140 Calibration Module 150 Electronic devices 10 Memory 11 Processor 12 The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0021] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0022] In the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the word "for example" is used to indicate an example, illustration, or description. Any embodiment or design scheme described as "for example" in the embodiments of this application should not be construed as being better or more advantageous than other embodiments or design schemes. Specifically, the use of the word "for example" is intended to present the relevant concepts in a specific manner.

[0023] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. Furthermore, in the description of this application, "a plurality of" means two or more, unless otherwise expressly and specifically defined.

[0025] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0026] Existing optical inspection equipment faces numerous challenges during the inspection process, such as missed and false positives caused by factors like light source attenuation, adjustment errors, and the subjectivity of human retesting. Unreasonable missed and false positives not only lead to a decline in production quality but also an increase in production costs. To verify the accuracy and reliability of optical inspection equipment, testing is necessary. Traditional testing methods often rely primarily on manual testing, which not only increases labor costs but is also susceptible to the influence of subjective factors by the testers, easily causing errors and failing to guarantee testing accuracy and efficiency, thus failing to meet the requirements of advanced manufacturing processes.

[0027] In view of the above, this application provides a testing method, apparatus, electronic device, and storage medium for a testing device to solve the aforementioned technical problems.

[0028] The testing method of the detection device provided in this application embodiment is applied to one or more electronic devices. An electronic device is a device that can automatically perform numerical calculations and / or information processing according to pre-set or stored instructions. Its hardware includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0029] In other embodiments, the electronic device can be communicatively connected to devices such as desktop computers, laptops, PDAs, and cloud servers. The electronic device can interact with the user via a keyboard, mouse, remote control, touchpad, or voice control.

[0030] Please see Figure 1 , Figure 1 This is a schematic diagram of the steps of a testing method for a testing device provided in an embodiment of this application.

[0031] The testing method for the testing equipment provided in this application embodiment is applied to the testing equipment to achieve automated testing of the testing equipment.

[0032] Specifically, the testing method for the testing equipment includes the following steps. Depending on different needs, the order of some steps in the flowchart can be changed, and some steps can be omitted.

[0033] S10 invokes a pre-stored standard image of a faulty motherboard based on preset invocation conditions.

[0034] In some embodiments, the electronic device needs to acquire a standard image of the faulty motherboard in advance and store the standard image offline.

[0035] In some embodiments, workers manually create defective motherboards that conform to preset defect information. This defect information includes, but is not limited to, the defect number, type, location, and severity of the defect. The defect number uniquely identifies each detected defect for easy tracking and management. The defect type categorizes defects, such as appearance defects, functional defects, and performance defects, to quickly identify the problem. The defect location indicates the location of the defect on the motherboard, aiding in timely detection and repair. The defect severity level classifies the defect as critical, moderate, or minor, determining the priority of processing.

[0036] In some embodiments, the inspection device may be an Automatic Optical Inspection (AOI) device. The AOI device includes a high-definition camera with a charge-coupled device (CCD) and a graphical user interface (GUI).

[0037] In some embodiments, the user places the motherboard into the testing equipment, which automatically scans the faulty motherboard using a high-definition CCD camera to obtain standard images of the faulty motherboard. The high-definition CCD camera can capture multiple standard images of the faulty motherboard.

[0038] In some embodiments, after obtaining a standard image of a defective motherboard, the electronic device may further preprocess the standard image of the defective motherboard, including: first, converting the standard image of the defective motherboard to grayscale to reduce data dimensionality; then, denoising the grayscale image to obtain a denoised image to remove interfering noise; and finally, enhancing the contrast of the denoised image to highlight defects and features, thereby obtaining a preprocessed standard image of the defective motherboard.

[0039] In some embodiments, combined with Figure 2 As shown, the testing equipment displays the offline image path option through a graphical user interface, allowing staff to select or input the offline image path. The testing equipment then stores the standard image of the defective board to the corresponding folder according to the offline image path selected or input by the staff, thereby realizing offline storage of standard images. This can improve the subsequent response speed of the testing equipment, reduce the dependence of the testing equipment on the network, and make the testing equipment more robust and easier to maintain.

[0040] In some embodiments, the invocation conditions include at least the set invocation time and / or invocation frequency. (Combined) Figure 2 As shown, the testing equipment can display options for recall time (such as 8:30, 16:00, 20:30, etc.) through a graphical user interface, allowing staff to select or customize the time for recalling standard images of faulty motherboards. The testing equipment can also display options for recall frequency (such as daily, every workday, every rest day, etc.) through the graphical user interface, allowing staff to select or customize the frequency of recalling standard images of faulty motherboards.

[0041] In some embodiments, the naming of the standard image includes the name of the detection device. In some embodiments, the standard image corresponding to the name of the detection device can be retrieved based on the name of the detection device.

[0042] In some embodiments, the naming of a standard image may also include the scanning date, scanning time, and other information.

[0043] Specifically, the naming format for standard images can be the name of the detection device + scan date + scan time, for example, FPC-AP-BOT-NA20231108175352, which means the name of the detection device is FPC-AP-BOT-NA, the scan date is November 8, 2023, and the scan time is 17:53:52.

[0044] S11, optical inspection of standard images is performed using inspection equipment to obtain machine inspection information.

[0045] In some embodiments, the machine inspection information includes at least the defect number, defect type, defect location, and defect severity. The defect number uniquely identifies each detected defect for easy tracking and management. The defect type categorizes defects, such as appearance defects, functional defects, and performance defects, to quickly identify the problem. The defect location indicates the location of the defect on the faulty motherboard, aiding in timely detection and repair. The defect severity classifies the defect's severity, such as severe, moderate, or minor, to determine processing priorities.

[0046] S12, by comparing the machine inspection information with the pre-stored defect information of defective motherboards, the inspection effect of the inspection equipment is determined.

[0047] In some embodiments, electronic devices also need to establish a correlation between the label of a machine-detected defect, the type of a machine-detected defect, the location of a machine-detected defect, and the degree of a machine-detected defect, and a correlation between the label of an actual defect, the type of an actual defect, the location of an actual defect, and the degree of an actual defect.

[0048] In some embodiments, the electronic device uses a string matching algorithm to match machine inspection information and defect information to determine the number of accurately detected defects. Based on the number of accurately detected defects and the total number of defects in the machine inspection information, the accuracy rate of the detection device is calculated. This accuracy rate is then used as an evaluation metric to assess the detection performance of the device. For example, when the accuracy rate of the detection device is greater than 80%, the detection performance is considered excellent; when the accuracy rate is between 50% and 80%, the detection performance is considered moderate; and when the accuracy rate is less than 50%, the detection performance is considered poor.

[0049] The above embodiments retrieve pre-stored standard images of defective motherboards based on preset calling conditions; further, optical inspection is performed on the standard images using a testing device to obtain machine inspection information; finally, the machine inspection information is compared with the defect information of the pre-stored defective motherboards to determine the testing effect of the testing device. Based on this, this application achieves automated testing of the testing effect of the testing device, improving testing accuracy and efficiency, thereby reducing the defect rate caused by missed and false detections, thus improving the production efficiency and quality of motherboards and providing strong support for the automation of the production process.

[0050] In some embodiments, the testing method for the detection device further includes the following steps after step S12: S13, determine the missed detection information and / or false detection information of the testing equipment.

[0051] In some embodiments, the method for determining the missed detection information and / or false detection information of the detection equipment includes: determining the label of the missed detection and / or false detection machine inspection defect, and then determining the type, location, and degree of the machine inspection defect associated with the label of the missed detection and / or false detection machine inspection defect, i.e., the missed detection information and / or false detection information of the detection equipment, based on the label of the missed detection and / or false detection machine inspection defect.

[0052] S14, calibrate the testing equipment based on the missed detection information and / or false detection information.

[0053] In some embodiments, the detection algorithm and detection parameters (such as sensitivity, threshold, etc.) of the detection device are corrected based on the missed detection information and / or false detection information.

[0054] In the above embodiments, by determining the missed detection information and / or false detection information of the testing equipment, the testing equipment is further calibrated based on the missed detection information and / or false detection information. Based on this, this application addresses and optimizes the specific causes of missed and false detections during the calibration process, significantly reducing the subsequent occurrence rate of missed and false detections, thereby improving the accuracy and reliability of the testing equipment, and ultimately contributing to improved production quality and efficiency.

[0055] Please see Figure 3 , Figure 3 This is a diagram showing the composition of a testing apparatus 100 for a testing device provided in an embodiment of this application.

[0056] In this embodiment, based on the same concept as the testing method of the testing equipment in the above embodiments, this application also provides a testing apparatus 100 for the testing equipment, which can be used to perform the testing method of the above-described testing equipment. For ease of explanation, the schematic diagram of the composition of the testing apparatus 100 embodiment only shows the parts related to the embodiments of this application. Those skilled in the art will understand that the illustrated structure does not constitute a limitation on the testing apparatus 100, and may include more or fewer components than illustrated, or combine certain components, or have different component arrangements.

[0057] Specifically, the testing device 100 of the testing equipment provided in this application embodiment includes a calling module 110, a testing module 120, and a testing module 130.

[0058] The calling module 110 is used to call a pre-stored standard image of a faulty motherboard based on preset calling conditions.

[0059] In some embodiments, the electronic device needs to acquire a standard image of the faulty motherboard in advance and store the standard image offline.

[0060] In some embodiments, workers manually create defective motherboards that conform to preset defect information. This defect information includes, but is not limited to, the defect number, type, location, and severity of the defect. The defect number uniquely identifies each detected defect for easy tracking and management. The defect type categorizes defects, such as appearance, function, and performance defects, to quickly identify the problem. The defect location indicates the location of the defect on the motherboard, aiding in timely detection and repair. The severity level classifies the defect's intensity, such as severe, moderate, or minor, to determine processing priorities.

[0061] In some embodiments, the inspection device may be an Automatic Optical Inspection (AOI) device. The AOI device includes a high-definition camera with a charge-coupled device (CCD) and a graphical user interface (GUI).

[0062] In some embodiments, the user places the motherboard into the testing equipment, which automatically scans the faulty motherboard using a high-definition CCD camera to obtain standard images of the faulty motherboard. The high-definition CCD camera can capture multiple standard images of the faulty motherboard.

[0063] In some embodiments, after obtaining a standard image of a defective motherboard, the electronic device may further preprocess the standard image of the defective motherboard, including: first, converting the standard image of the defective motherboard to grayscale to reduce data dimensionality; then, denoising the grayscale image to obtain a denoised image to remove interfering noise; and finally, enhancing the contrast of the denoised image to highlight defects and features, thereby obtaining a preprocessed standard image of the defective motherboard.

[0064] In some embodiments, combined with Figure 2 As shown, the testing equipment displays the offline image path option through a graphical user interface, allowing staff to select or input the offline image path. The electronic device then stores the standard image of the defective board to the corresponding folder according to the offline image path selected or input by the staff, thereby realizing offline storage of standard images. This can improve the subsequent response speed of the testing equipment, reduce the dependence of the testing equipment on the network, and make the testing equipment more robust and easier to maintain.

[0065] In some embodiments, the invocation conditions include at least the set invocation time and / or invocation frequency. (Combined) Figure 2 As shown, the testing equipment can display options for recall time (such as 8:30, 16:00, 20:30, etc.) through a graphical user interface, allowing staff to select or customize the time for recalling standard images of faulty motherboards. The testing equipment can also display options for recall frequency (such as daily, every workday, every rest day, etc.) through the graphical user interface, allowing staff to select or customize the frequency of recalling standard images of faulty motherboards.

[0066] In some embodiments, the naming of the standard image includes the name of the detection device. In some embodiments, the standard image corresponding to the name of the detection device can be retrieved based on the name of the detection device.

[0067] In some embodiments, the naming of a standard image may also include the scanning date, scanning time, and other information.

[0068] Specifically, the naming format for standard images can be the name of the detection device + scan date + scan time, for example, FPC-AP-BOT-NA20231108175352, which means the name of the detection device is FPC-AP-BOT-NA, the scan date is November 8, 2023, and the scan time is 17:53:52.

[0069] The detection module 120 is used to perform optical inspection on the standard image to obtain the machine inspection information of the inspection equipment.

[0070] In some embodiments, the machine inspection information includes at least the defect number, defect type, defect location, and defect severity. The defect number uniquely identifies each detected defect for easy tracking and management. The defect type categorizes defects, such as appearance defects, functional defects, and performance defects, to quickly identify the problem. The defect location indicates the location of the defect on the faulty motherboard, aiding in timely detection and repair. The defect severity classifies the defect's severity, such as severe, moderate, or minor, to determine processing priorities.

[0071] The testing module 130 is used to determine the testing effect of the testing equipment by comparing the machine inspection information with the defect information of the pre-stored defective motherboards.

[0072] In some embodiments, electronic devices also need to establish a correlation between the label of a machine-detected defect, the type of a machine-detected defect, the location of a machine-detected defect, and the degree of a machine-detected defect, and a correlation between the label of an actual defect, the type of an actual defect, the location of an actual defect, and the degree of an actual defect.

[0073] In some embodiments, the electronic device uses a string matching algorithm to match machine inspection information and defect information to determine the number of accurately detected defects. Based on the number of accurately detected defects and the total number of defects in the machine inspection information, the accuracy rate of the detection device is calculated. This accuracy rate is then used as an evaluation metric to assess the detection performance of the device. For example, when the accuracy rate of the detection device is greater than 80%, the detection performance is considered excellent; when the accuracy rate is between 50% and 80%, the detection performance is considered moderate; and when the accuracy rate is less than 50%, the detection performance is considered poor.

[0074] The above embodiments retrieve pre-stored standard images of defective motherboards based on preset calling conditions; further, optical inspection is performed on the standard images using a testing device to obtain machine inspection information; finally, the machine inspection information is compared with the defect information of the pre-stored defective motherboards to determine the testing effect of the testing device. Based on this, this application achieves automated testing of the testing effect of the testing device, improving testing accuracy and efficiency, thereby reducing the defect rate caused by missed and false detections, thus improving the production efficiency and quality of motherboards and providing strong support for the automation of the production process.

[0075] In some embodiments, the testing apparatus 100 of the detection equipment provided in this application further includes a determination module 140 and a calibration module 150.

[0076] The determination module 140 is used to determine the missed detection information and / or false detection information of the detection equipment.

[0077] In some embodiments, the method for determining the missed detection information and / or false detection information of the detection equipment includes: determining the label of the missed detection and / or false detection machine inspection defect, and then determining the type, location, and degree of the machine inspection defect associated with the label of the missed detection and / or false detection machine inspection defect, i.e., the missed detection information and / or false detection information of the detection equipment, based on the label of the missed detection and / or false detection machine inspection defect.

[0078] The calibration module 150 is used to calibrate the detection equipment based on the missed detection information and / or false detection information.

[0079] In some embodiments, the detection algorithm and detection parameters (such as sensitivity, threshold, etc.) of the detection device are corrected based on the missed detection information and / or false detection information.

[0080] In the above embodiments, by determining the missed detection information and / or false detection information of the testing equipment, the testing equipment is further calibrated based on the missed detection information and / or false detection information. Based on this, this application addresses and optimizes the specific causes of missed and false detections during the calibration process, significantly reducing the subsequent occurrence rate of missed and false detections, thereby improving the accuracy and reliability of the testing equipment, and ultimately contributing to improved production quality and efficiency.

[0081] Please see Figure 4 , Figure 4 This is a schematic diagram of the hardware structure of an electronic device 10 provided in an embodiment of this application.

[0082] In some embodiments, the electronic device 10 includes, but is not limited to, a memory 11, a processor 12, and a computer program stored in the memory 11 and executable on the processor 12, such as a test program for the detection device.

[0083] Those skilled in the art will understand that the schematic diagram is merely an example of the electronic device 10 and does not constitute a limitation on the electronic device 10. It may include more or fewer components than shown, or combine certain components, or different components. For example, the electronic device 10 may also include input / output devices, network access devices, buses, etc.

[0084] Processor 12 acquires the operating system and various installed applications of electronic device 10. Processor 12 acquires these applications to implement the steps in the test method embodiments of the various detection devices described above, for example... Figure 1 The steps are shown.

[0085] For example, a computer program may be divided into one or more modules / units, one or more of which are stored in memory 11 and retrieved by processor 12 to complete this application. One or more modules / units may be a series of computer program instruction segments capable of performing a specific function, which describe the process of retrieving the computer program from electronic device 10.

[0086] In some embodiments, the electronic device 10 includes a device capable of automatically performing numerical calculations and / or information processing according to pre-set or stored instructions. The hardware of the electronic device 10 includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0087] In some embodiments, the network in which the electronic device 10 is located includes, but is not limited to: the Internet, a wide area network, a metropolitan area network, a local area network, a virtual private network (VPN), etc.

[0088] In some embodiments, the memory 11 is used to store program code and various data, such as the test apparatus 100 of the testing device installed in the electronic device 10, and to enable high-speed and automatic access to programs or data during the operation of the electronic device 10. The memory 11 may include read-only memory (ROM), random access memory (RAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), one-time programmable read-only memory (OTPROM), electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, disk storage, magnetic tape storage, or any other computer-readable medium capable of carrying or storing data.

[0089] In some embodiments, memory 11 may also be external memory and / or internal memory of electronic device 10. Further, memory 11 may be a physical memory, such as a memory module, a TF card (Trans-flash Card), etc.

[0090] In some embodiments, processor 12 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor. Processor 12 is the computational core and control center of electronic device 10, connecting various parts of the entire electronic device 10 through various interfaces and lines, and calling data stored in memory 11 to execute various functions of electronic device 10 and process data, such as performing testing functions of the testing equipment.

[0091] In some embodiments, the processor 12 is used to acquire the operating system of the electronic device 10 and various installed applications. For example, the processor 12 acquires the test program for the testing device to implement the testing method of the testing device described in the above embodiments, for example... Figure 1 The steps are shown.

[0092] In one embodiment of this application, the electronic device 10 may further include a power supply (not shown) for supplying power to various components. Preferably, the power supply can be logically connected to the processor 12 through a power management device, thereby enabling functions such as charging, discharging, and power consumption management through the power management device. The power supply may also include one or more DC or AC power supplies, recharging devices, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components. The electronic device 10 may also include various sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0093] In one embodiment of this application, if the modules / submodules integrated in the electronic device 10 are implemented as software functional submodules and sold or used as independent components, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when the computer program is acquired by the processor 12, it can implement the above... Figure 1 The steps of the various method embodiments shown.

[0094] In one embodiment of this application, a computer program may include computer program code, which may be in the form of source code, object code, a downloadable file, or some intermediate form. A computer-readable medium may include any entity or device capable of carrying computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, or a read-only memory (ROM).

[0095] The memory 11 in the electronic device 10 stores multiple instructions to implement a testing method for a detection device, and the processor 12 can acquire multiple instructions to implement the testing method for the detection device described in the above embodiment.

[0096] Specifically, the processor 12's implementation method for the above instructions can be found in [reference needed]. Figure 1 The descriptions of the relevant steps in the corresponding embodiments are not repeated here.

[0097] In the several embodiments provided in this application, it should be understood that the disclosed methods and apparatus can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and there may be other division methods in actual implementation.

[0098] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0099] In the various embodiments of this application, the functional modules can be integrated into one processing submodule, or each submodule can exist physically separately, or two or more submodules can be integrated into one submodule. The integrated submodules described above can be implemented in hardware or in a combination of hardware and software functional modules.

[0100] Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application. No appended diagram markings in the claims should be construed as limiting the scope of the claims.

[0101] Furthermore, it is clear that the word "comprising" does not exclude other submodules or steps, and the singular does not exclude the plural. Multiple submodules or devices described in this application may also be implemented by a single submodule or device through software or hardware.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A testing method for a testing device, characterized in that, The testing method includes: The standard image of a faulty motherboard is retrieved based on preset invocation conditions; Optical inspection is performed on the standard image to obtain the machine inspection information of the inspection equipment; The detection effectiveness of the testing equipment is determined by comparing the machine inspection information with the pre-stored defect information of the faulty motherboard.

2. The testing method of the testing equipment as described in claim 1, characterized in that, The testing method, before invoking a pre-stored standard image of a faulty motherboard based on preset invocation conditions, further includes: Obtain a standard image of the faulty motherboard and store the standard image offline.

3. The testing method of the testing equipment as described in claim 1, characterized in that, The testing method, after comparing the machine inspection information with the preset defect information of the faulty motherboard, further includes: Determine the missed detection information and / or false detection information of the detection equipment; The detection equipment is calibrated based on the missed detection information and / or false detection information.

4. The testing method of the testing equipment as described in claim 1, characterized in that, After obtaining the machine inspection information, the testing method further includes: Receive the user's review result of the machine inspection information; The effectiveness of the re-judgment for the user is determined by comparing the re-judgment result with the negative information.

5. The testing method of the testing equipment as described in claim 1, characterized in that, The naming content of the standard image includes the name of the detection device, and the method for accessing the standard image includes: The corresponding standard image is retrieved based on the name of the detection device.

6. The testing method of the testing equipment as described in claim 1, characterized in that, The invocation conditions include at least the set invocation time and / or the set invocation frequency.

7. The testing method of the testing equipment as described in claim 1, characterized in that, The machine inspection information includes at least the type of machine inspection defect, the location of the machine inspection defect, and the degree of the machine inspection defect.

8. A testing device for a testing equipment, characterized in that, The testing apparatus includes: The calling module is used to call a pre-stored standard image of a faulty motherboard based on preset calling conditions; The detection module is used to perform optical inspection on the standard image to obtain the machine inspection information of the detection equipment; The testing module is used to determine the testing effect of the testing equipment by comparing the machine inspection information with the pre-stored defect information of the defective motherboard.

9. An electronic device, characterized in that, The electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the steps of the testing method of the detection device as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the testing method of the detection device as described in any one of claims 1 to 7.

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