Lighted keyboard

Abstract

The present application provides a light-emitting keyboard, which comprises a heat-dissipating key, a backlight module, a heat-conducting sheet and a through channel. The backlight module is located below the heat-dissipating key. The backlight module comprises a lamp plate, a light guide plate and a light shielding plate arranged in a stack. The heat-conducting sheet is located below the backlight module. The heat-conducting sheet covers the lamp plate. The through channel is located within the range of the keycap projection area of the heat-dissipating key. The through channel penetrates the light shielding plate, the light guide plate, the lamp plate and the heat-conducting sheet.

Description

Technical Field

[0001] This invention relates to an illuminated keyboard, and more particularly to an illuminated keyboard that facilitates heat dissipation. Background Technology

[0002] With the development of technology, keyboard designs are becoming increasingly diverse. When choosing a keyboard, users consider not only its basic input functions but also its visual appeal. Currently, backlit keyboards are available on the market, which not only attract users visually but also allow for use at night or in low-light conditions. However, when these backlit keyboards are applied to thin computing devices, the large number of components crammed into the device's limited space exacerbates heat dissipation issues. Therefore, to improve the cooling efficiency of computing devices, the embedded keyboard module also needs corresponding adjustments. Summary of the Invention

[0003] One of the objectives of this invention is to provide an illuminated keyboard that can improve heat dissipation efficiency.

[0004] According to one aspect of the present invention, the proposed illuminated keyboard includes heat-dissipating keys, a backlight module, a heat-conducting sheet, and a through-channel. The backlight module is located below the heat-dissipating keys. The backlight module includes a lamp panel, a light guide plate, and a light shield stacked vertically. The heat-conducting sheet is located below the backlight module. The heat-conducting sheet covers the lamp panel. The through-channel is located within the projection area of ​​the keycap of the heat-dissipating keys. The through-channel passes through the light shield, the light guide plate, the lamp panel, and the heat-conducting sheet.

[0005] This invention provides an illuminated keyboard, the illuminated keyboard comprising:

[0006] Cooling button;

[0007] The backlight module is located below the heat dissipation button and includes stacked lamp panels, light guide plates and light shields.

[0008] A heat-conducting sheet, located below the backlight module and covering the lamp panel; and

[0009] A through-channel is located within the projection area of ​​the keycap of the heat dissipation button and passes through the light shield, the light guide plate, the lamp plate and the heat conduction sheet.

[0010] As an optional technical solution, the illuminated keyboard also includes:

[0011] The base plate is located above the backlight module, and the through-channel passes through the base plate, which is in direct contact with the heat-conducting sheet.

[0012] As an optional technical solution, the base plate has a base plate recess, the heat-conducting sheet has a heat-conducting sheet recess, the base plate recess and the heat-conducting sheet recess are located outside the range of the keycap projection area and protrude in a direction away from the heat dissipation key, the base plate recess covers the light shield and the light guide plate, and the heat-conducting sheet recess contacts the base plate recess.

[0013] As an optional technical solution, the backlit keyboard also includes:

[0014] A button circuit board is located above the base plate, and the through-channel passes through the button circuit board.

[0015] An additional through-channel is located outside the projection area of ​​the keycap and extends through the key circuit board, the base plate, and the heat-conducting sheet.

[0016] As an optional technical solution, the base plate has a base plate recess, the heat-conducting sheet has a heat-conducting sheet recess, the base plate recess and the heat-conducting sheet recess are located outside the range of the keycap projection area and protrude in a direction away from the heat dissipation key, and the additional through channel passes through the base plate recess and the heat-conducting sheet recess.

[0017] As an optional technical solution, the heat-conducting sheet has a heat-conducting sheet protrusion located outside the projection area of ​​the keycap and protruding in the direction toward the heat dissipation key. The heat-conducting sheet protrusion covers the light shield and the light guide plate, and the additional through channel passes through the heat-conducting sheet protrusion.

[0018] As an optional technical solution, the light panel also includes:

[0019] A reflective layer, the through-channel penetrating the reflective layer, the reflective layer having a reflective layer protrusion;

[0020] The reflective layer protrusion is located outside the projection area of ​​the keycap and protrudes in the direction toward the heat dissipation key. The reflective layer protrusion covers the light shield and the light guide plate, and the reflective layer protrusion contacts the base plate.

[0021] As an optional technical solution, the heat-conducting sheet has a heat-conducting sheet protrusion, which is located outside the projection area of ​​the keycap and protrudes in the direction toward the heat dissipation key. The heat-conducting sheet protrusion contacts the reflective layer protrusion and the base plate.

[0022] As an optional technical solution, the illuminated keyboard also includes a heat insulation sheet, which is covered by a heat-conducting sheet.

[0023] As an optional technical solution, the heat insulation sheet partially overlaps the projection area of ​​the keycap.

[0024] As an optional technical solution, the through-channel does not penetrate the heat insulation sheet.

[0025] As an optional technical solution, the heat insulation sheet is a composite material containing nano-porous silica and carbon.

[0026] As an optional technical solution, the heat-conducting sheet is a multilayer composite material made of acrylic, copper foil, graphite and polyethylene terephthalate.

[0027] Compared with existing technologies, this invention designs a heat-conducting sheet, a heat-insulating sheet, and / or additional through-channels in the illuminated keyboard. In addition to heat dissipation through the through-channels within the keycap projection area, the heat-conducting sheet, heat-insulating sheet, and additional through-channels outside the keycap projection area can also dissipate heat from the backlight module or the heat-generating components below it, further improving the heat dissipation effect of the illuminated keyboard, reducing its surface temperature, and optimizing the user experience.

[0028] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of an illuminated keyboard according to an embodiment of the present invention.

[0030] Figure 2 for Figure 1 A partial cross-sectional view of the backlit keyboard.

[0031] Figure 3 for Figure 1 A partial explosion diagram of the backlit keyboard.

[0032] Figure 4 for Figure 1 A partial top view of the backlit keyboard.

[0033] Figure 5 for Figure 1 A partial top view of the backlit keyboard.

[0034] Figure 6 for Figure 1 A partial top view of the backlit keyboard.

[0035] Figure 7 This is a schematic diagram of an illuminated keyboard according to an embodiment of the present invention.

[0036] Figure 8 for Figure 7 A partial cross-sectional view of the backlit keyboard.

[0037] Figure 9A for Figure 7 A partial cross-sectional view of the backlit keyboard.

[0038] Figure 9B for Figure 7 A partial cross-sectional view of the backlit keyboard. Detailed Implementation

[0039] To provide a further understanding of the purpose, structure, features and functions of the present invention, detailed descriptions are provided below with reference to embodiments.

[0040] Please see Figure 1 , Figure 1 This is a schematic diagram of an illuminated keyboard according to an embodiment of the present invention.

[0041] like Figure 1 As shown, a heat-generating element HE (e.g., an integrated circuit or electronic component), a fan F, and a heat pipe HP are located below the backlit keyboard LKB. The heat-generating area HR, where the heat-generating element HE, fan F, and heat pipe HP overlap with the backlit keyboard LKB, requires heat dissipation. The backlit keyboard LKB includes a backlight module BLM and multiple heat-dissipating buttons KS. A base plate SUP is mounted on the backlight module BLM, and the multiple heat-dissipating buttons KS are mounted on the base plate SUP. Generally, the multiple heat-dissipating buttons KS may include square keys and multiplication keys (e.g., space keys). It should be noted that the number, size, and arrangement of the heat-dissipating buttons KS can be determined according to the actual application and are not limited to the embodiment shown in the figure. The backlight module BLM includes a lamp board LCB, a light guide plate LGP, and a light shield SS. The lamp board LCB, light guide plate LGP, and light shield SS are stacked vertically, that is, the light guide plate LGP is mounted on the lamp board LCB, and the light shield SS is mounted on the light guide plate LGP.

[0042] Please continue reading. Figures 2 to 3 , Figure 2 for Figure 1 A partial cross-sectional view of the backlit keyboard in the diagram; 3 is... Figure 1 A partial explosion diagram of the backlit keyboard. Figure 3 The support device SSR, trigger TE, and reset device RE are omitted from the drawing.

[0043] In this embodiment, each heat-dissipating button KS on the backlit keyboard LKB corresponds to one or more light-emitting units (LEDs, e.g., light-emitting diodes) on the lamp board LCB of the backlight module BLM. In other feasible embodiments, multiple heat-dissipating buttons KS on the backlit keyboard LKB may correspond to a light bar on the lamp board LCB of the backlight module BLM. The backlight module BLM may have multiple through channels PC to symmetrically correspond to multiple heat-dissipating buttons KS respectively. The through channels PC pass through the lamp board LCB, the light guide plate LGP, and the light shield SS. Figure 2As shown, a single heat dissipation button KS corresponds to two through-channel PCs, but this is not a limitation. The through-channel PCs also penetrate the button circuit board MEM, the base plate SUP, and the reflective layer REF. That is, the through-channel PCs are formed by stacking perforations along the Z-direction of each layer of the button circuit board MEM, the base plate SUP, the light shield SS, the light guide plate LGP, the reflective layer REF, and the lamp board LCB, where each perforation at least partially overlaps. The perforations in the light guide plate LGP can be larger than the perforations in the reflective layer REF and the light shield SS. This allows the through-channel PCs to serve as a heat dissipation channel for the heat-generating area HR.

[0044] The heat-dissipating keycap KS comprises a keycap KCC, a support structure SSR, a key circuit board MEM, and a base plate SUP. The keycap KCC is positioned relative to the base plate SUP. The keycap KCC has an internal light-transmitting area KC0, allowing light from the LED light-emitting unit to illuminate the characters on the keycap KCC. The keycap KCC also has multiple external light-shielding areas KC1 adjacent to the internal light-transmitting area KC0. (The text abruptly ends here.) Figure 2 As shown, the position of the external light-blocking area KC1 corresponds to the position of the through-channel PC, so that the through-channel PC is located below the opaque area, thereby improving upward light leakage. The support device SSR is located between the keycap KCC and the base plate SUP. When the keycap KCC is pressed, it moves vertically towards the base plate SUP along with the support device SSR. Furthermore, a reset element RE is provided between the keycap KCC and the base plate SUP; the reset element RE can be, for example, a rubber dome, but is not limited to this. The main bodies of each component, including the keycap KCC, support device SSR, reset element RE, key circuit board MEM, and base plate SUP, can be made of non-reflective / low-reflective materials or light-absorbing materials, thereby reducing downward reflection.

[0045] The button circuit board MEM is positioned above the backlight module BLM. The button circuit board MEM has a switch pad SP corresponding to the trigger element TE of the heat dissipation button KS. The switch pad SP is, for example, a membrane switch, but is not limited thereto. In this embodiment, the button circuit board MEM includes a circuit section EC, multiple circuit board holes MEMH, and the switch pad SP. The circuit board holes MEMH form part of the through-channel PC. The switch pad SP is connected to the circuit section EC and located between these circuit board holes MEMH. Furthermore, the button circuit board MEM can be coated with a light-absorbing material around the through-channel PC to improve upward light leakage.

[0046] Each heat dissipation button KS includes a portion of a base plate SUP, which is positioned between the button circuit board MEM and the backlight module BLM. In this embodiment, the base plate SUP may include annular ribs Sr0, multiple bridging ribs Sr1, and a support frame Sf. These bridging ribs Sr1 connect the annular ribs Sr0 and the support frame Sf, and multiple base plate holes SUPH are formed between the bridging ribs Sr1, the annular ribs Sr0, and the support frame Sf. The base plate holes SUPH on both sides of the annular rib Sr0 constitute a portion of the through channel PC. The switch pads SP of the button circuit board MEM are positioned corresponding to the base plate holes SUPH at the center of the base plate SUP, allowing the switch pads SP to partially enter the base plate holes SUPH at the center of the base plate SUP without interfering with the light-shielding plate SS and the LED light-emitting units below it.

[0047] A light-shielding plate SS is disposed below the base plate SUP. In this embodiment, the light-shielding plate SS has multiple light-shielding through holes SSH, multiple light-reducing patterns LRP, and a light-shielding frame SSF. These light-shielding through holes SSH are respectively located within these light-reducing patterns LRP, and the light-shielding frame SSF corresponds to the support frame Sf of the base plate SUP. The light-shielding through holes SSH form part of the through-channel PC. Thereby, light-reducing patterns LRP of the light-shielding plate SS are formed around the periphery of the through-channel PC to block light, wherein the light-reducing pattern LRP can be a ring-shaped black paint applied to the upper or lower surface of the light-shielding plate SS.

[0048] A light guide plate (LGP) is disposed below a light shield (SS). In this embodiment, the light guide plate (LGP) has a light guide hole (L0), multiple light guide plate through holes (LGPH), and multiple diffusion patterns (DP). The light-emitting unit (LED) can be located within the light guide hole (L0). The top and / or bottom surfaces of the light guide plate (LGP) near the light guide hole (L0) may have adhesive surrounding the light guide hole (L0) to respectively adhere the light shield (SS) and / or the lamp plate (LCB). The light guide plate through holes (LGPH) correspond to the positions of the light shield (SSH) and form part of the through channel (PC). The diffusion patterns (DP) of the light guide plate (LGP) can be composed of microstructure regions and correspond to the positions of the bottom plate holes (SUPH) of the base plate (SUP) to guide the light transmitted in the light guide plate (LGP) upwards. Viewed from above along the Z direction, the diffusion patterns (DP) of the light guide plate (LGP) can be disposed adjacent to the light-reducing pattern (LRP) of the light shield (SS) to guide the light from the light-emitting unit (LED) to illuminate the corresponding heat dissipation button (KS). In addition, the light-reducing pattern LRP can be a ring of black paint applied to the upper or lower surface of the light guide plate LGP to be set around the periphery of the through channel PC, or light-absorbing material can be applied to the hole wall of the light guide plate through hole LGPH, or adhesive can be applied to the upper and lower surfaces of the light guide plate through hole LGPH near the periphery of the through channel PC to improve the upward or downward light leakage of the light guide plate LGP in the through channel PC.

[0049] The LCB (Light Bulb Board) is positioned below the LGP (Light Guide Plate) and may include a REF (Reflective Layer). In this embodiment, the LCB has light-emitting units (LEDs), multiple LCBH (Light Bulb Through Holes), multiple light-reducing patterns (LRPs) and diffusion patterns (DPs), and multiple main conductors (HTs) and sub-conductors (STs). The LEDs are connected between two sub-conductors (STs), and are also connected between two main conductors (HTs) via the two sub-conductors (STs). In this embodiment, the main conductors (HTs) and sub-conductors (STs) constitute the lighting circuit of the LEDs. The two main conductors (HTs) are the main driving lines for the LEDs, while the two sub-conductors (STs) are the sub-driving lines for the LEDs. The LEDs can be white LEDs or a combination of red, green, and blue LEDs, depending on the application. Generally, the main conductors (HTs) are conductors with a large cross-sectional area, capable of spanning multiple heat dissipation buttons (KS). The LCBHs correspond to the positions of the LGP (Light Guide Plate Through Holes) and SSH (Light Shielding Plate Through Holes), and also form part of the through-channel (PC). The light-reducing pattern LRP can be a ring of black paint formed on the reflective layer REF and positioned around the periphery of the through-channel PC. The diffusion pattern DP can also be composed of microstructure regions and formed on the reflective layer REF, with the diffusion pattern DP positioned around the light-reducing pattern LRP to guide the light from the light-inducing unit LED to illuminate the corresponding heat dissipation button KS. That is, the diffusion pattern DP can be formed on the light guide plate LGP and / or the lamp board LCB.

[0050] Please continue reading. Figure 4 , Figure 4 for Figure 1 A top view of a portion of the backlit keyboard, omitting the keycaps KCC, support SSR, trigger TE, and reset element RE.

[0051] The two heat dissipation buttons KS in the local area T1 each have a keycap projection area KCCP of the keycap KCC, and the circuit sections EC of the button circuit board MEM extend across the range of each keycap projection area KCCP. Furthermore, according to... Figures 3-4 As shown, the ribs of the base plate SUP (including the annular rib Sr0 and the bridging rib Sr1) extend across the projection area KCCP of each keycap. The single heat dissipation button KS corresponding to the through-channel PC can include a left through-channel PC-L and a right through-channel PC-R. The left through-channel PC-L and the right through-channel PC-R corresponding to the single heat dissipation button KS can be symmetrically arranged. For example... Figure 4As shown, the two left through-channels PC-L correspond to two heat dissipation buttons KS respectively and pass through the lamp panel LCB, light guide plate LGP, and light shield SS; while the two right through-channels PC-R also correspond to two heat dissipation buttons KS respectively and pass through the lamp panel LCB, light guide plate LGP, and light shield SS. The periphery of each of the two left through-channels PC-L has a left light-reducing pattern LRP-L, and two left diffusion patterns DP-L are arranged on the upper and lower adjacent sides of each left light-reducing pattern LRP-L; similarly, the periphery of each of the two right through-channels PC-R has a right light-reducing pattern LRP-R, and two right diffusion patterns DP-R are arranged on the upper and lower adjacent sides of each right light-reducing pattern LRP-R. That is, a single heat dissipation button KS corresponding to a light-reducing pattern LRP can include both a left light-reducing pattern LRP-L and a right light-reducing pattern LRP-R, and a single heat dissipation button KS corresponding to a diffusion pattern DP can include both a left diffusion pattern DP-L and a right diffusion pattern DP-R. That is, each light-reducing pattern LRP has two diffusion patterns DP on its adjacent side. When viewed from above along the Z direction, each light-reducing pattern LRP is located between the two diffusion patterns DP on its adjacent side.

[0052] The left light-reducing pattern LRP-L and the left diffusion pattern DP-L can form the left heat-reducing optical pattern group OPG-L, while the right light-reducing pattern LRP-R and the right diffusion pattern DP-R can form the right heat-reducing optical pattern group OPG-R. In this embodiment, the backlight module BLM has two through channels PC (i.e., the left through channel PC-L and the right through channel PC-R) corresponding to each heat dissipation button KS. The left heat-reducing optical pattern group OPG-L and the right heat-reducing optical pattern group OPG-R corresponding to each heat dissipation button KS are symmetrically located on opposite sides of the keycap projection area KCCP. In this embodiment, the two left heat-reducing optical pattern groups corresponding to two heat dissipation buttons KS have the same pattern, and the two right heat-reducing optical pattern groups OPG-R corresponding to two heat dissipation buttons KS also have the same pattern. In practical applications, since the circuit section EC of the keypad circuit board MEM may be opaque and should not pass above the diffusion pattern DP, the longitudinally extending portion of the circuit section EC is preferably located between the left heat-reducing optical pattern group OPG-L and the right heat-reducing optical pattern group OPG-R corresponding to the single heat-reducing key KS. In practical applications, since the ribs (including the annular rib Sr0 and the bridging rib Sr1) of the base plate SUP of the keypad may be opaque and should not pass above the diffusion pattern DP, the annular rib Sr0 and the bridging rib Sr1 of the base plate SUP are preferably located between the left heat-reducing optical pattern group OPG-L and the right heat-reducing optical pattern group OPG-R corresponding to the single heat-reducing key KS. That is, when viewed from above along the Z direction, the left light-reducing pattern LRP-L and the left light-diffusing pattern DP-L are located on the same side of the circuit section EC and on the same side of the ribs (including the annular rib Sr0 and the bridging rib Sr1) of the base plate SUP, while the right light-reducing pattern LRP-R and the right light-diffusing pattern DP-R are located on the same side of the circuit section EC and on the same side of the ribs (including the annular rib Sr0 and the bridging rib Sr1). Furthermore, when viewed from above along the Z direction, the left light-reducing pattern LRP-L and the right light-reducing pattern LRP-R are located on opposite sides of the circuit section EC and on opposite sides of the ribs (including the annular rib Sr0 and the bridging rib Sr1) of the base plate SUP, while the left light-diffusing pattern DP-L and the right light-diffusing pattern DP-R are located on opposite sides of the circuit section EC and on opposite sides of the ribs (including the annular rib Sr0 and the bridging rib Sr1) of the base plate SUP.

[0053] Please continue reading. Figure 5 , Figure 5 for Figure 1 The diagram shows a partial top view of the backlit keyboard, omitting the keycaps KCC, support SSR, trigger TE, and reset element RE. The four heat-dissipating keys KS within partial area T2 can also utilize the technical features described earlier, and will not be repeated here. Regarding... Figure 5 The description mainly focuses on the technical features of the heat dissipation keys KS in different rows of the backlit keyboard LKB.

[0054] like Figure 5 As shown, the cooling button KS located to the left of ROW1 in the upper column and the cooling button KS located to the left of ROW2 in the middle column are adjacent in the Y direction but offset in the X direction. Similarly, the cooling button KS located to the right of ROW1 in the upper column and the cooling button KS located to the right of ROW2 in the middle column are adjacent in the Y direction but offset in the X direction. The right cooling optical pattern group OPG-R (formed by its right subtractive pattern LRP-R and right diffuser pattern DP-R) corresponding to the cooling button KS located to the left of ROW1 in the upper column at least partially overlaps in the Y direction with the left cooling optical pattern group OPG-L (formed by its left subtractive pattern LRP-L and left diffuser pattern DP-L) corresponding to the cooling button KS located to the left of ROW2 in the middle column. These two partially overlapping cooling optical pattern groups form a connecting line C1. Furthermore, the right heat-reducing optical pattern group OPG-R (formed by its right light-reducing pattern LRP-R and right diffusion pattern DP-R) corresponding to the heat dissipation button KS located to the right of ROW1 in the upper column at least partially overlaps in the Y direction with the left heat-reducing optical pattern group OPG-L (formed by its left light-reducing pattern LRP-L and left diffusion pattern DP-L) corresponding to the heat dissipation button KS located to the right of ROW2 in the middle column. That is, these two partially overlapping heat-reducing optical pattern groups also form a connecting line C1.

[0055] Furthermore, the left heat-reducing optical pattern group OPG-L (formed by its left light-reducing pattern LRP-L and left diffusion pattern DP-L) corresponding to the heat dissipation button KS located to the right of ROW1 in the upper column at least partially overlaps in the Y direction with the right heat-reducing optical pattern group OPG-R (formed by its right light-reducing pattern LRP-R and right diffusion pattern DP-R) corresponding to the heat dissipation button KS located to the left of ROW2 in the middle column. That is, these two partially overlapping heat-reducing optical pattern groups form a connecting line C2. According to the above, connecting line C1 is formed by the right heat-reducing optical pattern group OPG-R located in the higher column and the left heat-reducing optical pattern group OPG-L located in the lower column, corresponding to two heat dissipation buttons KS that are adjacent in the Y direction but staggered in the X direction. Connecting line C2 is formed by the left heat-reducing optical pattern group OPG-L located in the higher column and the right heat-reducing optical pattern group OPG-R located in the lower column, corresponding to two heat dissipation buttons KS that are adjacent in the Y direction but staggered in the X direction. Figure 5 The image shows a special layout where the heat dissipation buttons KS in two adjacent columns of the backlit keyboard LKB are misaligned at the center.

[0056] Please continue reading. Figure 6 , Figure 6 for Figure 1The diagram shows a partial top view of the backlit keyboard, omitting the keycaps KCC, support SSR, trigger TE, and reset element RE. The four heat-dissipating keys KS within partial area T3 can also utilize the technical features described earlier, and will not be repeated here. Regarding... Figure 6 The description mainly focuses on the technical features of the heat dissipation keys KS in different rows of the backlit keyboard LKB.

[0057] like Figure 6 As shown, the heat dissipation button KS located to the left of ROW2 in the middle column is adjacent to the heat dissipation button KS located to the left of ROW3 below in the Y direction but offset in the X direction. Similarly, the heat dissipation button KS located to the right of ROW2 in the middle column is adjacent to the heat dissipation button KS located to the right of ROW3 below in the Y direction but offset in the X direction. The right heat-reducing optical pattern group OPG-R (formed by its right subtraction pattern LRP-R and right diffusion pattern DP-R) corresponding to the heat dissipation button KS located to the left of ROW2 in the middle column at least partially overlaps the switch pad SP corresponding to the heat dissipation button KS located to the left of ROW3 below in the Y direction. That is, these partially overlapping right heat-reducing optical pattern groups OPG-R and the switch pad SP form a connection line D1. Furthermore, the right heat-reducing optical pattern group OPG-R (formed by its right light-reducing pattern LRP-R and right light-diffusing pattern DP-R) of the heat dissipation button KS located on the right side of ROW2 in the middle column at least partially overlaps in the Y direction with the switch pad SP corresponding to the heat dissipation button KS located on the right side of ROW3 below. That is, these partially overlapping right heat-reducing optical pattern groups OPG-R and switch pad SP also form a connection line D1.

[0058] Furthermore, the left heat-reducing optical pattern group OPG-L (formed by its left light-reducing pattern LRP-L and left light-diffusing pattern DP-L) of the heat dissipation button KS located on the right side of ROW2 in the middle column at least partially overlaps in the Y direction with the button gap area G outside the heat dissipation buttons KS located on the left / right sides of ROW3 below. That is, these partially overlapping left heat-reducing optical pattern groups OPG-L and button gap areas G form a connection line D2. According to the above, connection line D1 is formed by the right heat-reducing optical pattern group OPG-R located in the higher column corresponding to two heat dissipation buttons KS that are adjacent in the Y direction but staggered in the X direction and the corresponding switch pad SP located in the lower column. Connection line D2 is formed by the left heat-reducing optical pattern group OPG-L located in the higher column corresponding to two heat dissipation buttons KS that are adjacent in the Y direction but staggered in the X direction and the corresponding button gap area G located in the lower column. Figure 6 The image shows another special layout where the heat dissipation buttons KS in two adjacent columns of the backlit keyboard LKB are misaligned at the center of the buttons.

[0059] In summary, as described in the above embodiments, the present invention designs one or more through channels in the illuminated keyboard and the backlight module thereon. This allows for heat dissipation of the heat-generating area below the heat-dissipating keys via the through channels, thereby improving the heat dissipation efficiency of the illuminated keyboard. Furthermore, the present invention also designs a light-reducing pattern around the periphery of the through channels to block light, and a diffusion pattern on its adjacent sides to guide light to illuminate the heat-dissipating keys, thereby improving the overall consistency of illumination and solving the problem of upward / downward light leakage that may exist in the through channels.

[0060] Furthermore, when the backlight module of the illuminated keyboard or the heat-generating element beneath it generates excessive heat, the surface temperature of the keyboard will rise, thus affecting the user experience. Therefore, the technical features of the embodiments described below focus on further improving the heat dissipation effect of the illuminated keyboard.

[0061] Please continue reading. Figure 7 , Figure 7 This is a schematic diagram of an illuminated keyboard according to another embodiment of the present invention.

[0062] In this embodiment, the backlit keyboard LKB includes a heat-conducting sheet TCS, which is positioned below the backlight module BLM. The heat-conducting sheet TCS allows for planar heat dissipation of the backlit keyboard LKB, transferring heat elsewhere and reducing the surface temperature of the keyboard. In this embodiment, the backlit keyboard LKB includes an additional through-channel APC, located in the gap between the heat-dissipating keys KS (i.e., the corresponding key gap area G). Compared to... Figures 1-6 In this embodiment, the through-channel PC is located within the keycap projection area of ​​the heat dissipation button KS, while the additional through-channel APC is located outside the keycap projection area of ​​the heat dissipation button KS.

[0063] Please continue reading. Figure 8 , Figure 8 for Figure 7 A cross-sectional schematic diagram of a portion of the backlit keyboard.

[0064] like Figure 8As shown, the thermal conductive sheet (TCS) is located below the backlight module (BLM) and covers the lamp board (LCB). The thermal conductive sheet (TCS) can be composed of layers L1 to L4. For example, layer L1 is acrylic; layer L2 is copper foil; layer L3 is graphite; and layer L4 is polyethylene terephthalate (PET). That is, the thermal conductive sheet (TCS) is a multilayer composite material made of acrylic, copper foil, graphite, and polyethylene terephthalate, and is a graphite copper foil heat dissipation film. The through-channel (PC) is located within the keycap projection area (KCCP) of the heat dissipation button (KS). It not only penetrates the button circuit board (MEM), the base plate (SUP), and the backlight module (BLM)'s light shield (SS), light guide plate (LGP), and lamp board (LCB) (and its reflective layer (REF)), but also penetrates the thermal conductive sheet (TCS). Therefore, the through-channel PC can serve as a heat dissipation channel for the heat-generating area HR beneath the heat-conducting pad TCS. The additional through-channel APC is located outside the keycap projection area KCCP of the heat-conducting button KS and penetrates the button circuit board MEM, the base plate SUP, and the heat-conducting pad TCS. Specifically, the base plate SUP has a base plate recess SUPcc, and the heat-conducting pad TCS has a heat-conducting pad recess TCScc. Both the base plate recess SUPcc and the heat-conducting pad recess TCScc are located outside the keycap projection area KCCP and protrude in a direction away from the heat-conducting button KS (-Z-axis direction); while the additional through-channel APC penetrates the base plate recess SUPcc of the base plate SUP and the heat-conducting pad recess TCScc of the heat-conducting pad TCS. That is, both the base plate recess SUPcc and the heat-conducting pad recess TCScc have openings / holes. In addition to serving as a heat dissipation channel, the additional through-channel APC can also be used to pass through and secure a fixing post (Boss, omitted from illustration). The hole walls of each layer of the button circuit board MEM, the base plate recess SUPcc, and the heat-conducting sheet recess TCScc can directly contact this fixing post. Figure 8 As shown, the base plate recess SUPcc covers the light shield SS and the light guide plate LGP, and the heat conduction sheet recess TCScc contacts (e.g., by adhesive bonding or direct contact) the base plate recess SUPcc, thereby preventing light leakage from the light-emitting unit LED through the additional through-channel APC.

[0065] In addition, the backlit keyboard LKB may also include a heat insulation sheet TI. For example... Figure 8As shown, the heat shield TI is located longitudinally (parallel to the Z-axis) between the reflective layer REF and the heat conductor TCS, which wraps around the heat shield TI from below. The heat shield TI partially overlaps the keycap projection area KCCP. Laterally (parallel to the X-axis), the heat shield TI is located between the through-channel PC and the additional through-channel APC, neither of which penetrates the heat shield TI. The heat shield TI corresponds to the internal component IE below it in the longitudinal (parallel to the Z-axis) position. The internal component IE is, for example, the computing chip, display chip, or heat sink of a notebook computer using an illuminated keyboard LKB. By setting the heat shield TI, the thickness of the corresponding internal component IE at that location can be increased, thereby preventing direct heat transfer from the internal component IE to the backlight module BLM. For example, the heat shield TI is a composite material containing nanoscale porous silica and carbon, which has low thermal conductivity (e.g., a thermal conductivity coefficient of 0.009 W / m·K).

[0066] Please continue reading. Figure 9A , Figure 9A for Figure 7 A cross-sectional schematic diagram of a portion of the backlit keyboard. Figure 9A The illustrated cross-sectional structure of the backlit keyboard LKB, which is related to... Figure 8 The difference between the LKB cross-sectional structures of the backlit keyboards lies in the structural configuration of the additional through-channel APC, which will be explained below. Other similar explanations can be found in the section on... Figure 8 The content described herein will not be repeated here.

[0067] The additional through-channel APC in the local area T5 is located outside the keycap projection area KCCP of the heat dissipation button KS, and penetrates the button circuit board MEM, the base plate SUP, and the heat-conducting sheet TCS. Specifically, the heat-conducting sheet TCS has a heat-conducting sheet protrusion TCScv, and the reflective layer REF has a reflective layer protrusion REFcv. Both the heat-conducting sheet protrusion TCScv and the reflective layer protrusion REFcv are located outside the keycap projection area KCCP and protrude in the direction towards the heat dissipation button KS (+Z axis direction). The heat-conducting sheet protrusion TCScv contacts (e.g., through adhesive bonding or direct contact) the reflective layer protrusion REFcv and the base plate SUP. The additional through-channel APC penetrates the heat-conducting sheet protrusion TCScv of the heat-conducting sheet TCS. That is, the heat-conducting sheet protrusion TCScv has an opening / hole. Figure 9AAs shown, the hole wall of the additional through-channel APC corresponding to the heat-conducting pad protrusion TCScv can be aligned / cut flush with the hole wall of the additional through-channel APC corresponding to the button circuit board MEM and the base plate SUP. In addition to serving as a heat dissipation channel, the additional through-channel APC in the local area T5 can also be used to fix a fixing post (Boss, not shown) through which it passes, and the hole walls of each layer of the button circuit board MEM, the base plate and the heat-conducting pad protrusion TCScv can directly contact this fixing post.

[0068] like Figure 9A As shown, the reflective layer protrusion REFcv covers the light-shielding plate SS and the light guide plate LGP. The reflective layer protrusion REFcv contacts (e.g., through adhesive bonding or direct contact) the base plate SUP. In this way, the reflective layer protrusion REFcv reflects the light transmitted in the light guide plate LGP, preventing light leakage from the LED unit through the additional through-channel APC. However, this is not the only embodiment. In another embodiment, the reflective layer REF may not have a bent reflective layer protrusion REFcv. Instead, a heat-conducting sheet protrusion TCScv covers the light-shielding plate SS and the light guide plate LGP. In this way, the heat-conducting sheet protrusion TCScv reflects the light transmitted in the light guide plate LGP, preventing light leakage from the LED unit through the additional through-channel APC.

[0069] Please continue reading. Figure 9B , Figure 9B for Figure 7 A cross-sectional schematic diagram of a portion of the backlit keyboard. Figure 9B The illustrated cross-sectional structure of the backlit keyboard LKB, which is related to... Figure 9A The difference between the cross-sectional structures of the LKB backlit keyboard lies in the location of the reflective layer protrusion REFcv and the heat-conducting plate protrusion TCScv, which will be explained below. Other similar explanations can be found in the section on... Figure 8 , Figure 9A The content described herein will not be repeated here.

[0070] The local area T6 corresponds to the side of the backlit keyboard LKB, where there is no additional through-channel APC as mentioned above. The heat-conducting sheet TCS has a heat-conducting sheet protrusion TCScv, and the reflective layer REF has a reflective layer protrusion REFcv. Both the heat-conducting sheet protrusion TCScv and the reflective layer protrusion REFcv are located outside the keycap projection area KCCP and protrude in the direction (+Z axis direction) towards the heat dissipation key KS. The heat-conducting sheet protrusion TCScv contacts (e.g., through adhesive bonding or direct contact) the reflective layer protrusion REFcv and the base plate SUP, thereby covering the edges of the backlight module BLM and the base plate SUP. Figure 9BAs shown, the reflective layer protrusion REFcv covers the light-shielding plate SS and the light guide plate LGP. The reflective layer protrusion REFcv contacts (e.g., through adhesive bonding or direct contact) the base plate SUP, thereby reflecting the light transmitted in the light guide plate LGP and preventing light leakage from the sides of the illuminated keyboard LKB. However, this is not the only embodiment. In another embodiment, the reflective layer REF may not have a bent reflective layer protrusion REFcv. Instead, a heat-conducting sheet protrusion TCScv covers the light-shielding plate SS and the light guide plate LGP, thereby reflecting the light transmitted in the light guide plate LGP and preventing light leakage from the sides of the illuminated keyboard LKB. Figure 9B As shown, the heat-conducting plate protrusion TCScv can be aligned / cut flush with the sidewall of the backlit keyboard LKB corresponding to the key circuit board MEM and the base plate SUP corresponding to the sidewall of the backlit keyboard LKB.

[0071] In summary, as described in the above embodiments, the present invention designs a heat-conducting sheet, a heat-insulating sheet, and / or additional through-channels in the illuminated keyboard. Therefore, in addition to heat dissipation through the through-channels within the keycap projection area, heat dissipation can also be achieved through the heat-conducting sheet, heat-insulating sheet, and additional through-channels outside the keycap projection area to dissipate heat from the backlight module or the heat-generating components below it, further improving the heat dissipation effect of the illuminated keyboard, reducing its surface temperature, and optimizing the user experience.

[0072] Although the invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to illustrate preferred embodiments of the invention and should not be construed as limiting the invention. The scale in the schematic drawings does not represent the actual proportions of the components, in order to clearly describe the required parts.

[0073] The present invention has been described in the above-described embodiments; however, these embodiments are merely examples for implementing the present invention. It must be noted that the disclosed embodiments do not limit the scope of the present invention. Conversely, any modifications and refinements made without departing from the spirit and scope of the present invention are within the scope of patent protection of the present invention.

Claims

1. A backlit keyboard, characterized in that, The backlit keyboard includes: Cooling button; The backlight module is located below the heat dissipation button and includes stacked lamp panels, light guide plates and light shields. A heat-conducting sheet, located below the backlight module and covering the lamp panel; and A through-channel is located within the projection area of ​​the keycap of the heat dissipation button and passes through the light shield, the light guide plate, the lamp plate and the heat conduction sheet.

2. The illuminated keyboard as described in claim 1, characterized in that, The backlit keyboard also includes: The base plate is located above the backlight module, and the through-channel passes through the base plate, which is in direct contact with the heat-conducting sheet.

3. The illuminated keyboard as described in claim 2, characterized in that, The base plate has a base plate recess, and the heat-conducting sheet has a heat-conducting sheet recess. The base plate recess and the heat-conducting sheet recess are located outside the projection area of ​​the keycap and protrude in a direction away from the heat dissipation key. The base plate recess covers the light shield and the light guide plate, and the heat-conducting sheet recess contacts the base plate recess.

4. The illuminated keyboard as described in claim 2, characterized in that, The backlit keyboard also includes: A button circuit board is located above the base plate, and the through-channel passes through the button circuit board. An additional through-channel is located outside the projection area of ​​the keycap and extends through the key circuit board, the base plate, and the heat-conducting sheet.

5. The illuminated keyboard as described in claim 4, characterized in that, The base plate has a base plate recess, the heat-conducting sheet has a heat-conducting sheet recess, the base plate recess and the heat-conducting sheet recess are located outside the range of the keycap projection area and protrude in a direction away from the heat dissipation key, and the additional through channel passes through the base plate recess and the heat-conducting sheet recess.

6. The illuminated keyboard as described in claim 4, characterized in that, The heat-conducting sheet has a heat-conducting sheet protrusion located outside the projection area of ​​the keycap and protruding in the direction toward the heat dissipation key. The heat-conducting sheet protrusion covers the light shield and the light guide plate, and the additional through channel passes through the heat-conducting sheet protrusion.

7. The illuminated keyboard as described in claim 2, characterized in that, The light panel also includes: A reflective layer, the through-channel penetrating the reflective layer, the reflective layer having a reflective layer protrusion; The reflective layer protrusion is located outside the projection area of ​​the keycap and protrudes in the direction toward the heat dissipation key. The reflective layer protrusion covers the light shield and the light guide plate, and the reflective layer protrusion contacts the base plate.

8. The illuminated keyboard as described in claim 7, characterized in that, The heat-conducting sheet has a heat-conducting sheet protrusion that is located outside the projection area of ​​the keycap and protrudes in the direction toward the heat dissipation key. The heat-conducting sheet protrusion contacts the reflective layer protrusion and the base plate.

9. The illuminated keyboard as described in claim 1, characterized in that, The illuminated keyboard also includes a heat insulation sheet, which is covered by a heat-conducting sheet.

10. The illuminated keyboard as described in claim 9, characterized in that, The heat insulation sheet partially overlaps with the projection area of ​​the keycap.

11. The illuminated keyboard as described in claim 9, characterized in that, The through-passage does not penetrate the insulation sheet.

12. The illuminated keyboard as described in claim 9, characterized in that, The heat insulation sheet is a composite material containing nano-porous silica and carbon.

13. The illuminated keyboard as described in claim 1, characterized in that, The heat-conducting sheet is a multilayer composite material made of acrylic, copper foil, graphite and polyethylene terephthalate.

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