Self-adaptive positioning and clamping mechanism and positioning method for wafer detection equipment

Abstract

This application provides an adaptive positioning clamping mechanism and positioning method for wafer inspection equipment, relating to the field of wafer inspection equipment technology. It includes a conical support platform, multiple lifting support assemblies, and a pneumatic control assembly. The conical support platform includes a support body with multiple annular stepped positioning surfaces of gradually changing diameters along its height to accommodate wafers of different sizes. The lifting support assembly includes a sliding tube and a sliding rod slidably disposed within the sliding tube. An air guide channel is provided inside the sliding rod, and supporting airflow is output to the wafer through a top airflow outlet hole, placing the wafer in an air-bearing support state. The pneumatic control assembly adjusts the pneumatic pressure of the lifting support assembly, allowing the sliding rod to switch between an air-bearing support state and a support positioning state, and corrects the wafer position through regionalized pneumatic pressure adjustment. This application can adapt to wafers of different sizes, reduce wafer contact damage, and improve wafer positioning stability and inspection accuracy.

Description

Technical Field

[0001] This application relates to the field of wafer inspection equipment technology, and in particular to an adaptive positioning clamping mechanism and positioning method for wafer inspection equipment. Background Technology

[0002] With the continuous development of semiconductor manufacturing processes, wafer inspection equipment faces increasingly higher requirements for wafer positioning accuracy, stability, and compatibility. During wafer inspection, the wafer needs to be accurately positioned within the inspection area to ensure that the inspection mechanism can inspect the wafer surface according to a preset path. Currently, wafer inspection equipment typically uses vacuum adsorption platforms, mechanical grippers, or fixed positioning fixtures to hold and position the wafer.

[0003] However, existing wafer positioning methods still have certain shortcomings. On the one hand, existing support platforms are usually designed for wafers of a single size. When inspecting wafers of different sizes, it is necessary to change to a support fixture of the corresponding size, resulting in poor equipment adaptability and affecting inspection efficiency. On the other hand, when using mechanical clamping to position wafers, the clamping components are prone to contact pressure with the wafer edge, which may not only cause edge damage but also easily introduce particulate contamination. While using air flotation to support wafers can reduce contact damage, the wafer is susceptible to airflow disturbances and placement deviations when suspended, causing the wafer to shift and making it difficult to guarantee positioning accuracy during the inspection process.

[0004] In addition, existing positioning mechanisms can usually only achieve fixed support of wafers and cannot be dynamically adjusted according to wafer size, position deviation and support status, resulting in insufficient positioning adaptability between wafers of different specifications.

[0005] Therefore, there is an urgent need for an adaptive positioning clamping mechanism and positioning method for wafer inspection equipment that can adapt to wafers of different specifications and achieve automatic adjustment and stable positioning of wafers while reducing mechanical contact. Summary of the Invention

[0006] To address the aforementioned technical problems, this application provides an adaptive positioning clamping mechanism and positioning method for wafer inspection equipment.

[0007] In a first aspect, this application provides an adaptive positioning clamping mechanism for a wafer inspection device, with the following technical solution: An adaptive positioning clamping mechanism for a wafer inspection device includes: A conical support platform, comprising a support body extending in a conical shape, wherein the support body is provided with multiple annular stepped positioning surfaces with gradually changing diameters along the height direction, and each annular stepped positioning surface is used to match and support wafers of different specifications and sizes; Multiple lifting support components are disposed within the annular stepped positioning surface. The multiple lifting support components are distributed circumferentially along the annular stepped positioning surface. Each lifting support component includes a sliding tube fixedly disposed within the bearing body, a sliding rod slidably disposed within the sliding tube, and a pneumatic drive chamber communicating with the sliding tube. The sliding rod has an internal air guide channel, and the top of the sliding rod has an air output hole that communicates with the air guide channel. The air output hole is used to output supporting airflow to the bottom of the wafer when the sliding rod is extended, so that an air film gap is formed between the wafer and the annular stepped positioning surface. A pneumatic control component, connected to multiple pneumatic drive chambers, is used to control the lifting and lowering movement of the sliding rod, and to switch the sliding rod between a wafer air-float support state and a load-bearing positioning state by adjusting the air pressure state in the pneumatic drive chambers. The air pressure control component controls the extension of the sliding rod to form a wafer support point, and uses the airflow output from the airflow outlet to provide floating support and radial guidance for the wafer; when the air pressure changes, the sliding rod drives the wafer to slowly descend towards the corresponding annular stepped positioning surface to complete the wafer positioning and bearing.

[0008] Furthermore, The airflow outlet hole is inclined circumferentially along the top of the sliding rod, so that the output airflow forms a guide airflow with a radial component relative to the bottom surface of the wafer, thereby driving the wafer to move toward the center of the conical support platform, while preventing the wafer from blocking the airflow outlet hole.

[0009] Furthermore, The pneumatic control component includes a pressure regulating valve, which is used to reduce the pneumatic pressure entering the pneumatic drive chamber, causing the sliding rod to descend under the action of wafer pressure, and continuously discharge gas through the airflow output hole to reduce the descent speed of the sliding rod.

[0010] The airflow output hole is located in the central or eccentric region of the top of the sliding rod, and the airflow output holes on the multiple sliding rods form an annular airflow distribution so that the output airflow forms a uniform supporting gas film at the bottom of the wafer.

[0011] Furthermore, The multiple lifting support components are divided into multiple control areas along the annular stepped positioning surface. Each control area is connected to an independent air pressure control channel to correct the wafer eccentricity by adjusting the air pressure output difference in different areas.

[0012] Furthermore, The lifting support assembly is equipped with a pressure detection unit, which is used to detect the pressure difference between the wafer and different sliding rods, and adjust the air pressure output of the corresponding control area according to the pressure difference.

[0013] Furthermore, The top of the sliding rod is provided with a flexible support part, which includes an elastic support layer or a rolling support component, used to flexibly support the edge or bottom surface of the wafer during the wafer descent process, thereby reducing the impact between the wafer and the positioning structure.

[0014] Furthermore, The lifting support assembly also includes a sealing ring disposed between the sliding rod and the sliding tube. The sealing ring is used to drive the sliding rod to move axially due to changes in air pressure in the pneumatic drive chamber and to prevent gas leakage.

[0015] Furthermore, The air pressure control component is configured to determine the offset direction of the wafer relative to the center of the conical support platform based on the support state differences among the plurality of lifting support components, and control the lifting support component located on one side of the wafer offset direction to reduce the air pressure, so that the sliding rod on the corresponding side descends before the sliding rods in other positions. Under the influence of the height difference of the sliding rod, the wafer tends to tilt towards the center of the conical support platform, and moves radially towards the center under the guidance of the conical surface of the conical support platform, so as to achieve adaptive centering positioning of the wafer.

[0016] Secondly, this application also discloses a positioning method for the above-mentioned positioning clamping mechanism, comprising the following steps: S1. Move the wafer to be tested above the conical support platform, so that the wafer and the annular stepped positioning surface maintain a preset distance; S2. The air pressure control component inputs gas into the lifting support component, causing the sliding rod to extend and form multiple support points for the wafer; S3. Airflow is output to the bottom of the wafer through the airflow output hole at the top of the sliding rod, so that the wafer is in an air-floating support state, and the position of the wafer relative to the conical support platform is adjusted by the airflow. S4. Based on the wafer size, lower the wafer along the conical support platform to the corresponding diameter of the annular stepped positioning surface area. S5. Adjust the output state of the air pressure control component so that some airflow is discharged through the airflow output hole, causing the sliding rod to slowly descend and drive the wafer down to the annular stepped positioning surface; S6. By compensating for the positional deviation of the wafer through the difference in the support state of multiple sliding rods, the wafer completes the pre-inspection positioning.

[0017] In summary, this application includes at least one of the following beneficial technical effects: 1. By setting a tapered support body and setting multiple annular stepped positioning surfaces with gradually changing diameters on the support body, wafers of different sizes can be matched with the corresponding positioning areas, eliminating the need for frequent replacement of the support fixture and improving the adaptability of the testing equipment to wafers of different sizes.

[0018] 2. By setting up a lifting support assembly, the sliding rod can extend under air pressure to support the wafer. At the same time, the air outlet hole at the top of the sliding rod outputs the supporting airflow, forming an air film gap between the wafer and the support platform. This reduces the direct contact between the wafer and the positioning structure, thereby reducing the risk of wafer damage and contamination.

[0019] 3. By adjusting the air pressure in the air pressure drive cavity, the sliding rod can switch between the air-float support state and the load-bearing positioning state, allowing the wafer to be positioned in the air-float state and slowly descend to the corresponding stepped positioning surface after the air pressure decreases, thus improving the stability of the wafer placement process.

[0020] 4. By dividing multiple lifting support components into different control areas and independently adjusting the air pressure output of different areas, the support state can be adjusted according to the wafer's stress state, causing the wafer to move towards the center position in a compensatory manner, thereby improving the wafer positioning accuracy.

[0021] 5. By utilizing pneumatic drive to integrate the support, adjustment, and slow descent processes, the same set of lifting support components can perform load-bearing, guiding, and positioning functions, simplifying the equipment structure and improving the reliability of the mechanism. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0023] Explanation of reference numerals in the attached drawings: 1. Conical bearing platform; 2. Bearing body; 3. Annular stepped positioning surface; 4. Sliding tube; 5. Sliding rod; 6. Pneumatic drive chamber; 7. Air guide channel. Detailed Implementation

[0024] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” and “one or more” refer to one, two, or more than two. The term “and / or” is used to describe the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can indicate: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0025] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0026] The present application will be further described in detail below with reference to the accompanying drawings.

[0027] This embodiment provides an adaptive positioning clamping mechanism for wafer inspection equipment. This mechanism is applied in wafer inspection equipment to complete wafer bearing, centering, and stable positioning before the wafer enters the inspection area. The mechanism combines air-bearing support with mechanical bearing to ensure the wafer is in a low-contact state during the initial placement stage. Utilizing the radial driving force generated by airflow and the guiding effect of the conical surface, the wafer can automatically move towards the center area. Simultaneously, an adjustable height-adjustable lifting support structure enables adaptive bearing of wafers of different sizes.

[0028] The mechanism includes a conical load-bearing platform 1, multiple lifting support components, and a pneumatic control component.

[0029] A conical support platform 1 is positioned below the inspection station of the wafer inspection equipment to form a wafer positioning reference. The conical support platform 1 includes a support body 2, which has an overall conical extension structure. The height of the central region is lower than that of the outer periphery, creating an inclined guide surface on the upper surface of the support body 2 that gradually decreases in height from the outside in. Multiple annular stepped positioning surfaces 3 are arranged along the height direction of the support body 2. These annular stepped positioning surfaces 3 are distributed sequentially in descending order of diameter, and each annular stepped positioning surface 3 corresponds to a wafer support position within a specific size range.

[0030] Specifically, the annular stepped positioning surface 3 can be formed by machining an annular stepped structure on the surface of the conical support platform 1. Each level of the annular stepped positioning surface 3 includes a horizontal support area and an inclined transition area connected to the adjacent area. The horizontal support area is used to form a stable support with the bottom of the wafer, and the inclined transition area is used to provide radial guidance during the wafer's descent, enabling the wafer to gradually move from a larger diameter area to a positioning area that matches its own size.

[0031] By setting multiple annular stepped positioning surfaces 3 with gradually changing diameters, the same positioning mechanism can be used for wafers of different sizes without changing the fixture. When a larger wafer is placed on the conical support platform 1, the wafer can descend to the outer annular stepped positioning surface 3 with a larger diameter; when a smaller wafer is placed, it can continue to descend to the inner annular stepped positioning surface 3 with a smaller diameter, thereby improving the compatibility of the testing equipment with different product models.

[0032] Multiple lifting support components are respectively disposed inside the annular stepped positioning surface 3, and are evenly and spaced apart along the circumference of the annular stepped positioning surface 3. The multiple lifting support components together form a ring-shaped dynamic support area, so that the bottom of the wafer can obtain multiple distributed support points.

[0033] Each lifting support assembly includes a sliding tube 4, a sliding rod 5, and a pneumatic drive chamber 6.

[0034] The sliding tube 4 is fixedly installed inside the supporting body 2 and extends vertically. An axial sliding space is formed inside the sliding tube 4, and the sliding rod 5 is installed inside the sliding tube 4 and can reciprocate along the axial direction of the sliding tube 4. The outer diameter of the sliding rod 5 matches the inner diameter of the sliding tube 4, so that the sliding rod 5 maintains stable guidance during movement and avoids tilting and swaying during wafer support.

[0035] The top of the sliding rod 5 is provided with a flexible support part, which includes an elastic support layer or a rolling support component, and is used to flexibly support the edge or bottom surface of the wafer during the wafer descent process, thereby reducing the impact between the wafer and the positioning structure.

[0036] The lifting support assembly also includes a sealing ring disposed between the sliding rod 5 and the sliding tube 4. The sealing ring is used to drive the sliding rod 5 to move axially due to changes in air pressure in the pneumatic drive chamber 6 and to prevent gas leakage.

[0037] The pneumatic drive chamber 6 is located inside the sliding tube 4 or at the bottom of the sliding tube 4, and is connected to the interior of the sliding tube 4. The pneumatic drive chamber 6 is used to receive external input air pressure, and the change in air pressure drives the sliding rod 5 to move up and down.

[0038] When the pneumatic control component inputs gas with a certain pressure into the pneumatic drive chamber 6, the gas acts on the bottom of the sliding rod 5, causing the sliding rod 5 to overcome its own weight and reset resistance and move upward, extending out from inside the annular stepped positioning surface 3 and forming the initial support position of the wafer.

[0039] When the air pressure decreases, the weight of the wafer itself acts on the top of the sliding rod 5, causing the sliding rod 5 to retract into the sliding tube 4. At the same time, since the air pressure driving cavity 6 still maintains a certain gas pressure, the sliding rod 5 will not descend rapidly, but will move slowly under the buffering effect of air pressure, thereby avoiding the wafer from directly hitting the annular stepped positioning surface 3.

[0040] An air guide channel 7 is provided inside the sliding rod 5, extending axially along the sliding rod 5 and communicating with the pneumatic drive chamber 6. An air outlet hole is provided at the top of the sliding rod 5, communicating with the air guide channel 7.

[0041] After some of the gas in the pneumatic drive chamber 6 enters the gas guide channel 7, it is released to the bottom of the wafer through the airflow output hole. When multiple lifting support components work simultaneously, each airflow output hole forms a distributed airflow region at the bottom of the wafer, creating a continuous or intermittent air film gap between the bottom of the wafer and the annular stepped positioning surface 3.

[0042] The air film gap reduces the direct contact area between the wafer and the support structure, keeping the wafer in a low-friction state during adjustment. This reduces frictional damage between the wafer edge and the positioning structure, and also reduces particle contamination on the wafer surface, improving the cleanliness of the wafer inspection process.

[0043] The pneumatic control component is connected to multiple pneumatic drive chambers 6, and is used to control the working status of multiple lifting support components in a unified or regional manner.

[0044] The pneumatic control component includes a gas supply module, a pressure regulating valve, and a control channel.

[0045] The air supply module provides a stable pressurized air source. A pressure regulating valve is located between the air supply module and the pneumatic drive chamber 6 to adjust the gas pressure entering different pneumatic drive chambers 6. The control channel connects to multiple pneumatic drive chambers 6, enabling the lifting support components at different positions to achieve different lifting states according to control requirements.

[0046] During the wafer placement stage, the pneumatic control assembly first increases the pressure inside the pneumatic drive chamber 6, causing the sliding rods 5 to extend synchronously. The tops of the multiple sliding rods 5 form multiple support points, lifting the wafer and maintaining a gap between the bottom of the wafer and the annular stepped positioning surface 3.

[0047] Subsequently, airflow is continuously output through the airflow outlet, causing the wafer to enter an air-float support state. In the air-float state, the wafer is subjected to airflow from multiple directions, which reduces the frictional resistance between the wafer and the support structure, enabling the wafer to move slightly.

[0048] Once the wafer size and initial position are detected, the pneumatic control component adjusts the output pressure to gradually lower the wafer to the corresponding size of the annular stepped positioning surface 3.

[0049] During the descent, the air pressure control component does not directly release the air pressure. Instead, it reduces the pressure entering the air pressure drive chamber 6 through a pressure regulating valve, creating a slow depressurization state inside the air pressure drive chamber 6. At this time, the sliding rod 5 gradually descends under the action of wafer pressure, while the airflow outlet continues to output gas, creating air pressure damping for the descent of the sliding rod 5.

[0050] The descent speed of the wafer is controlled by the air pressure damping effect, which avoids the wafer from being impacted by inertia, and at the same time ensures that the wafer can be smoothly attached to the corresponding annular stepped positioning surface 3.

[0051] The airflow outlet is inclined around the top of the sliding rod 5, so that the airflow outlet direction forms an inclined angle with respect to the bottom surface of the wafer.

[0052] The tilted airflow has not only a vertical support component but also a radial driving component along the wafer. When multiple lifting support components output tilted airflow simultaneously, the airflow at each position works together to subject the wafer to a radial driving force toward the center region of the conical support platform 1, while also cleaning the wafer surface.

[0053] Because the conical bearing platform 1 has a conical surface structure with a low center and a high periphery, when the wafer is pushed by radial airflow, the wafer can gradually move towards the center along the conical surface, realizing an automatic centering process that does not require direct pushing by mechanical grippers.

[0054] Meanwhile, the tilted airflow can prevent the wafer from directly covering the airflow outlet hole, ensuring that gas always flows around the airflow outlet hole and improving the stability of air flotation.

[0055] Based on the aforementioned adaptive positioning clamping mechanism for wafer inspection equipment, this embodiment also provides a method for achieving adaptive wafer positioning using this mechanism. This method forms dynamic support through a lifting support assembly, forms an air flotation adjustment area through an airflow output hole, and combines the conical guide effect of the conical bearing platform 1 to achieve automatic matching and positioning of wafers of different sizes.

[0056] Specifically, the following steps are included: S1. Move the wafer to be tested above the conical support platform 1, so that the wafer and the annular stepped positioning surface 3 maintain a preset distance.

[0057] Before wafer inspection, the wafer to be inspected is transported to the top of the conical support platform 1 by a robotic arm, a handling robot, or a wafer transfer mechanism.

[0058] At this time, the air pressure control component is in the preset initial working state, and the corresponding sliding rod 5 in the lifting support component is in the extended preparation state or the low-position standby state, so that a certain gap is formed between the bottom surface of the wafer and the annular stepped positioning surface 3.

[0059] The preset distance is set according to the wafer size and the maximum adjustment stroke of the lifting support assembly. It usually ensures that the wafer can cover the height difference range of multiple annular step positioning surfaces 3 during the descent, so that the wafer can select the corresponding bearing position according to its own size.

[0060] Since the wafer does not directly contact the conical support platform 1 in its initial state, the wafer edge is prevented from impacting the positioning structure due to positional errors during mechanical handling, thus improving the safety of wafer placement.

[0061] S2. The control air pressure control component inputs gas into the lifting support component, causing the sliding rod 5 to extend and form multiple support points for the wafer.

[0062] After the wafer is moved above the conical support platform 1, the pneumatic control component starts the gas supply module and inputs pressurized gas into multiple pneumatic drive chambers 6 through the control channel.

[0063] The gas entering the pneumatic drive chamber 6 acts on the bottom of the sliding rod 5, causing the sliding rod 5 to move upward along the sliding tube 4 axis.

[0064] Since multiple lifting support components are evenly arranged along the circumference of the annular stepped positioning surface 3, multiple sliding rods 5 can extend synchronously and form annular distributed support points at the bottom of the wafer.

[0065] Multiple support points work together to support the weight of the wafer, keeping it in a suspended and supported state.

[0066] Compared to traditional fixed-height support structures, this method can change the support position by adjusting the extension height of the sliding rod 5, so that wafers of different sizes can obtain stable support.

[0067] Meanwhile, the space formed between multiple sliding rods 5 can provide a flow area for subsequent airflow adjustment, enabling the wafer to have micro-adjustment capabilities during the positioning process.

[0068] S3. Airflow is output to the bottom of the wafer through the airflow output hole at the top of the sliding rod 5, so that the wafer is in an air-floating support state, and the position of the wafer relative to the conical support platform 1 is adjusted by the airflow.

[0069] After the sliding rod 5 extends, the pneumatic control component continues to maintain the gas input in the pneumatic drive chamber 6.

[0070] Some of the gas enters the gas guide channel 7 inside the sliding rod 5 and is released to the bottom of the wafer through the gas flow output hole.

[0071] Since the airflow outlet is inclined along the top of the sliding rod 5, the output airflow has both a vertical support component and a radial pushing component.

[0072] When multiple lifting support components simultaneously output inclined airflow, the airflow from all directions forms a composite airflow field at the bottom of the wafer.

[0073] When there is a deviation between the center of the wafer and the center of the conical support platform 1, the airflow resistance and airflow pressure distribution on both sides of the eccentric region are different, causing the wafer to be subjected to an adjustment force toward the central region.

[0074] Meanwhile, due to the air film gap between the wafer and the annular stepped positioning surface 3, the friction between the wafer and the support platform is reduced, enabling the aforementioned radial adjustment force to drive the wafer to make a slight movement.

[0075] The airflow guides the wafer to complete the initial alignment without mechanical clamping contact.

[0076] S4. Based on the wafer size, lower the wafer along the conical support platform 1 to the corresponding diameter of the annular stepped positioning surface 3 area.

[0077] After the initial position adjustment is completed, the pneumatic control component selects the corresponding control mode based on the wafer size information obtained by the wafer inspection system.

[0078] When the wafer diameter is large, the outer region lifting support assembly is kept at a high support height, so that the wafer is lowered to the outer large-size annular stepped positioning surface 3.

[0079] When the wafer diameter is small, the lifting support assembly is lowered as a whole, and the wafer continues to move towards the center along the inclined surface of the conical bearing platform 1 until it descends to the annular stepped positioning surface 3 of the corresponding size.

[0080] During the descent, the inclined surface of the conical support platform 1 exerts radial constraint on the wafer, preventing the wafer from shifting randomly.

[0081] By matching the annular stepped positioning surface 3 with the wafer size, wafers of different specifications can obtain the corresponding bearing reference.

[0082] S5. Adjust the output state of the air pressure control component so that some airflow is discharged through the airflow output hole, causing the sliding rod 5 to slowly descend and drive the wafer to descend to the annular stepped positioning surface 3.

[0083] Once the wafer has moved to the target positioning area, the pneumatic control component reduces the internal pressure of the pneumatic drive chamber 6 through the pressure regulating valve.

[0084] As the weight of the wafer itself acts on the top of the sliding rod 5, the sliding rod 5 begins to retract into the sliding tube 4.

[0085] At this time, the gas guide channel 7 inside the sliding rod 5 still maintains gas flow, so that the gas output hole continuously outputs gas to the bottom of the wafer.

[0086] The airflow output creates a reverse damping effect, reducing the descent speed of the sliding rod 5, and gradually transforming the wafer from an air-floating state to a mechanically supported state.

[0087] At the end of the descent, the bottom of the wafer contacts the annular stepped positioning surface 3, achieving stable positioning.

[0088] Because the descent process is controlled by air pressure buffering, it can avoid the impact vibration generated during traditional mechanical descent, thus improving detection stability.

[0089] S6. By using the different support states of multiple sliding rods 5, the positional deviation of the wafer is compensated, so that the wafer can complete the pre-inspection positioning.

[0090] During the wafer descent process, multiple lifting support components detect the force status at corresponding positions.

[0091] When the wafer is eccentric, the pressure on the sliding rod 5 at different positions is different.

[0092] The pressure detection unit collects the pressure changes of each sliding rod 5 and feeds the detection results back to the pneumatic control component.

[0093] The air pressure control component determines the wafer offset direction based on the pressure difference.

[0094] For example, when the wafer shifts to one side, the pressure on the lifting support component on that side increases, and the control system reduces the air pressure output in that area, causing the corresponding sliding rod 5 to descend in advance; the relative area maintains a higher support height, causing the wafer to tilt towards the center.

[0095] Under the guidance of the conical bearing platform 1, the wafer is finely adjusted radially towards the center.

[0096] After multiple pressure tests and air pressure compensations, the center of the wafer gradually coincides with the center of the conical support platform 1.

[0097] Finally, the wafer is positioned in a stable state on the corresponding annular stepped positioning surface 3, providing an accurate reference for subsequent wafer inspection.

[0098] The above are merely preferred embodiments of this application. The scope of protection of this application is not limited to the above embodiments. Any equivalent modifications or changes made by those skilled in the art based on the content disclosed in this application should be included within the scope of protection recorded in the claims.

Claims

1. An adaptive positioning clamping mechanism for a wafer inspection device, characterized in that, include: A conical support platform (1) includes a support body (2) extending in a conical shape. The support body (2) has multiple annular stepped positioning surfaces (3) with gradually changing diameters along the height direction. Each annular stepped positioning surface (3) is used to match and support wafers of different sizes. Multiple lifting support components are disposed within the annular stepped positioning surface (3). The multiple lifting support components are distributed circumferentially along the annular stepped positioning surface (3). Each lifting support component includes a sliding tube (4) fixedly disposed within the bearing body (2), a sliding rod (5) slidably disposed within the sliding tube (4), and a pneumatic drive chamber (6) communicating with the sliding tube (4). The sliding rod (5) is provided with an air guide channel (7) inside. The top of the sliding rod (5) is provided with an airflow output hole that communicates with the air guide channel (7). The airflow output hole is used to output supporting airflow to the bottom of the wafer when the sliding rod (5) is extended, so that an air film gap is formed between the wafer and the annular stepped positioning surface (3). The pneumatic control component is connected to multiple pneumatic drive chambers (6) and is used to control the lifting and lowering movement of the sliding rod (5). By adjusting the pneumatic pressure state in the pneumatic drive chamber (6), the sliding rod (5) can switch between the wafer air-float support state and the load-bearing positioning state. The air pressure control component controls the extension of the sliding rod (5) to form a wafer support point, and uses the airflow output from the airflow outlet to generate floating support and radial guidance for the wafer; when the air pressure changes, the sliding rod (5) drives the wafer to slowly descend towards the corresponding annular stepped positioning surface (3) to complete the wafer positioning and bearing.

2. The adaptive positioning clamping mechanism for a wafer inspection device according to claim 1, characterized in that: The airflow output hole is inclined around the top of the sliding rod (5) so that the output airflow forms a guide airflow with a radial component relative to the bottom surface of the wafer, thereby driving the wafer to move toward the center of the conical support platform (1) and preventing the wafer from blocking the airflow output hole.

3. The adaptive positioning clamping mechanism for a wafer inspection device according to claim 2, characterized in that: The pneumatic control component includes a pressure regulating valve, which reduces the pneumatic pressure entering the pneumatic drive chamber (6), causing the sliding rod (5) to descend under wafer pressure and continuously discharge gas through the airflow output hole to reduce the descent speed of the sliding rod (5). The airflow output hole is located in the central or eccentric region of the top of the sliding rod (5), and multiple airflow output holes on the sliding rod (5) form an annular airflow distribution to ensure that the output airflow forms a uniform supporting gas film at the bottom of the wafer.

4. The adaptive positioning clamping mechanism for a wafer inspection device according to claim 3, characterized in that: The multiple lifting support components are divided into multiple control areas along the annular stepped positioning surface (3). Each control area is connected to an independent air pressure control channel to correct the wafer eccentricity by adjusting the air pressure output difference in different areas.

5. The adaptive positioning clamping mechanism for a wafer inspection device according to claim 4, characterized in that: The lifting support assembly is equipped with a pressure detection unit, which is used to detect the pressure difference between the wafer and different sliding rods (5), and adjust the air pressure output of the corresponding control area according to the pressure difference.

6. The adaptive positioning clamping mechanism for a wafer inspection device according to claim 5, characterized in that: The top of the sliding rod (5) is provided with a flexible support part, which includes an elastic support layer or a rolling support member, used to flexibly support the edge or bottom surface of the wafer during the wafer descent process, thereby reducing the impact between the wafer and the positioning structure.

7. The adaptive positioning clamping mechanism for a wafer inspection device according to claim 6, characterized in that: The lifting support assembly also includes a sealing ring disposed between the sliding rod (5) and the sliding tube (4). The sealing ring is used to drive the sliding rod (5) to move axially due to changes in air pressure in the pneumatic drive chamber (6) and to prevent gas leakage.

8. The adaptive positioning clamping mechanism for a wafer inspection device according to claim 7, characterized in that: The air pressure control component is configured to determine the offset direction of the wafer relative to the center of the conical support platform (1) based on the support state difference between the multiple lifting support components, and control the lifting support component located on one side of the wafer offset direction to reduce the air pressure, so that the sliding rod (5) on the corresponding side descends before the sliding rods (5) at other positions. Under the influence of the height difference of the sliding rod (5), the wafer tends to tilt toward the center of the conical support platform (1), and moves radially toward the center under the guidance of the conical surface of the conical support platform (1) to achieve adaptive centering positioning of the wafer.

9. A positioning method using the adaptive positioning clamping mechanism of the wafer inspection equipment according to any one of claims 1-8, characterized in that, Includes the following steps: S1. Move the wafer to be tested above the conical support platform (1) to maintain a preset distance between the wafer and the annular stepped positioning surface (3); S2. The control air pressure control component inputs gas into the lifting support component, causing the sliding rod (5) to extend and form multiple support points for the wafer; S3. Airflow is output to the bottom of the wafer through the airflow output hole at the top of the sliding rod (5) so that the wafer is in an air-floating support state, and the position of the wafer relative to the conical support platform (1) is adjusted by the airflow. S4. According to the wafer size, the wafer is lowered along the conical support platform (1) to the area of ​​the annular stepped positioning surface (3) with the corresponding diameter; S5. Adjust the output state of the air pressure control component so that some airflow is discharged through the airflow output hole, so that the sliding rod (5) slowly descends and drives the wafer to descend to the annular stepped positioning surface (3). S6. By using the difference in the support state of multiple sliding rods (5), the position deviation of the wafer is compensated, so that the wafer can complete the pre-inspection positioning.

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