Silicon carbide grinding system

Abstract

The silicon carbide grinding system is jointly composed of a grinding assembly, a transfer bin and a sedimentation assembly, silicon carbide slurry forms self-grinding circulation and material recycling circulation in the system, the silicon carbide raw material is 800-2000-mesh silicon carbide, preferably, the D50 particle size is 6.7-14 microns, the silicon carbide raw material is adjusted into silicon carbide slurry in the transfer bin, the silicon carbide slurry is guided into the grinding assembly, and the silicon carbide slurry is recycled. At least 90% of the silicon carbide slurry is ground to reach the process particle size, the ground silicon carbide slurry is settled and layered in the settling assembly, the bottom layer is a recycled material, the upper layer is a process material, the recycled material enters the transfer bin through a material return pipe, the process material is extracted through the extraction opening, and the process material enters the transfer bin. The recycled materials are guided into the transfer bin and then enter a new round of grinding, and finally prepared silicon carbide particles are all process materials, so that the waste of silicon carbide is reduced, and the enterprise cost is greatly reduced.

Description

Technical Field

[0001] The present application relates to the technical field of silicon carbide grinding, and in particular to a silicon carbide grinding system. Background Art

[0002] Silicon carbide is a "three-resistant" material. Because of its corrosion resistance, high temperature resistance, high strength, good thermal conductivity and impact resistance, silicon carbide is widely used. Some companies have special requirements for the grading of silicon carbide micropowders and need to ensure that the particle size of silicon carbide micropowders is uniform.

[0003] In the prior art, a Chinese invention patent with authorization announcement number CN113546728A discloses a silicon carbide micropowder grinding system and a method of using the same, including a storage box, a feed pipe is provided on the lower side wall of the storage box, a first feed pump is installed on the feed pipe, the feed pipe is connected to a grinding mechanism, a discharge pipe is provided between the upper end of the grinding mechanism and the upper end of the storage box, an air inlet pipe is connected to the lower end of the grinding mechanism, a fan is installed on the air inlet pipe, and a plurality of medium storage tanks are installed in parallel on the air inlet pipe between the fan and the grinding mechanism, and different medium storage tanks are used to store silicon carbide media with different particle sizes. A control box is provided on one side of the grinding mechanism, and the control box is connected to a control panel, and the control box is electrically connected to the first feed pump, the grinding mechanism and the fan, respectively. The above-mentioned grinding system grinds silicon carbide by a dry method, but the silicon carbide is not ground sufficiently during the dry grinding process. If silicon carbide of 0.5 um to 0.7 um is to be obtained, silicon carbide will be wasted, thereby increasing enterprise costs. Summary of the invention

[0004] Based on this, the present application provides a silicon carbide grinding system, which solves the technical problem that the silicon carbide grinding is insufficient during the dry grinding process. If you want to obtain 0.5 um to 0.7 um silicon carbide, it will lead to waste of silicon carbide, thereby increasing the cost of the enterprise.

[0005] The technical solution of this application to solve the above technical problems is as follows:

[0006] A silicon carbide grinding system, comprising

[0007] Transfer bin: The transfer bin is provided with a feed pipe and a discharge pipe, and the transfer bin is used to prepare silicon carbide slurry;

[0008] Grinding assembly: The grinding assembly includes a cylinder and a dispersion mechanism disposed in the cylinder, the cylinder is provided with a feed end and a discharge end, the discharge end is connected to the feed pipe, and the feed end is connected to the discharge pipe;

[0009] Sedimentation assembly: the sedimentation assembly is provided with a feed inlet, the feed inlet is connected to the discharge pipe, the bottom of the sedimentation assembly is provided with a return pipe, the return pipe is connected to the feed pipe, and the return pipe is provided with a collection outlet; and

[0010] The ground silicon carbide slurry is settled and layered in the settling component, the bottom layer is the recycled material, the upper layer is the process material, the recycled material enters the transfer bin through the return pipe, and the process material is produced through the production outlet.

[0011] Preferably, the dispersion mechanism comprises a central axis, at least one first dispersion disk is installed on the upper part of the central axis, and a first installation portion is formed between two adjacent first dispersion disks; at least one second dispersion disk is installed on the lower part of the central axis, and a second installation portion is formed between two adjacent second dispersion disks; a third installation portion is provided between the adjacent first dispersion disks and the second dispersion disks; and a plurality of third dispersion disks are installed on the first installation portion, the second installation portion and the third installation portion;

[0012] The first dispersion disk comprises a first disk body, and a plurality of first dispersion components are evenly arranged along the circumferential direction of the edge of the first disk body. The first dispersion component has at least one first flow guiding slope. When the medium collides with the first flow guiding slope, the medium can be subjected to a component force vertically upward and horizontally outward along the first flow guiding slope.

[0013] The second dispersing disk comprises a second disk body, the second disk body is conical, a plurality of second dispersing components are arranged at intervals along the apex of the conical inclined surface, the second dispersing component has at least one second flow guiding inclined surface, when the medium collides with the flow guiding inclined surface, the medium can be subjected to a component force vertically upward and horizontally outward along the flow guiding inclined surface;

[0014] The third dispersing disk comprises a third disk body, on which a plurality of isolation columns are arranged. The isolation columns are arranged on the same circumference. When the isolation columns rotate at a high speed, the grinding liquid forms a double-channel isolation membrane on both sides of the third dispersing disk.

[0015] Preferably, the dispersion mechanism is formed by a plurality of fourth dispersion disks connected end to end in sequence, the fourth dispersion disk comprises a fourth disk body, the fourth disk body comprises an upper disk body and a lower disk body, a plurality of slide grooves are provided on the upper disk body and / or the lower disk body in a radial direction; when the upper disk body is overlapped with the lower disk body, an installation cavity is formed at the slide groove; a variable flow compensation slider is slidably arranged in the installation cavity, and the end of the variable flow compensation slider can extend out of the edge of the disk body; and a variable flow drive component, the variable flow drive component is connected to the variable flow compensation slider, and is used to drive the variable flow compensation slider to reciprocate along the slide groove.

[0016] Preferably, the variable flow drive assembly includes a traction shaft and a plurality of traction links, the traction shaft is vertically arranged to the disk body, one end of the traction link is hingedly connected to the traction shaft, and the other end is hingedly connected to the variable flow compensation slider.

[0017] Preferably, the upper disk body is connected to a first outer shaft, the lower disk body is connected to a second outer shaft, the first outer shaft and the second outer shaft are hollow to form a traction cavity, and the traction shaft is disposed in the traction cavity.

[0018] Preferably, the upper disk body and / or the lower disk body is provided with an avoidance cavity, and the traction link is arranged in the avoidance cavity.

[0019] Preferably, a wear-resistant portion is provided at the end of the variable flow compensation slider.

[0020] Preferably, the number of the variable flow compensation sliders is 3 to 12.

[0021] Preferably, the sedimentation assembly includes a sedimentation barrel, in which at least one grading screen is arranged, the grading screen is inclined, and has a third guide slope and a fourth guide slope that intersect each other, and a guide groove is formed at the intersection of the third guide slope and the fourth guide slope, and the sedimentation barrel is provided with a return port, which is connected to the feed pipe, and the bottom end of the guide groove is opposite to the return port.

[0022] Preferably, it also includes a feed component, which includes a first feed pump and a second feed pump. The feed end is connected to the discharge pipe through the first feed pump, and the feed pipe is connected to the return pipe through the second feed pump.

[0023] The technical solution adopted in this application can achieve the following beneficial effects:

[0024] The silicon carbide grinding system of the present application is composed of a grinding component, a transfer bin and a sedimentation component, so that the silicon carbide slurry forms a self-grinding cycle and a recycling material cycle in the system, and the raw material is 800 mesh to 2000 mesh silicon carbide, preferably D 50 The particle size is 6.7 um to 14 um, which is adjusted into silicon carbide slurry in the transfer bin. In the introduction into the grinding component, at least 90% of the silicon carbide slurry is ground to reach the process particle size. The ground silicon carbide slurry is settled and layered in the sedimentation component, the bottom layer is the recycled material, and the upper layer is the process material. The recycled material enters the transfer bin through the return pipe, and the process material is taken out through the production port (i.e., silicon carbide particles of 0.5 um to 0.7 um). After the recycled material is introduced into the transfer bin, it enters a new round of grinding, and finally all silicon carbide particles are process materials, thereby reducing the waste of silicon carbide and greatly reducing enterprise costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the equipment flow of the silicon carbide grinding system.

[0026] Figure 2 It is a schematic diagram of the three-dimensional structure of the sedimentation component.

[0027] Figure 3 Schematic diagram of the cross-sectional structure of the first embodiment of the sedimentation assembly.

[0028] Figure 4 Schematic diagram of the cross-sectional structure of the second embodiment of the sedimentation assembly.

[0029] Figure 5 This is a schematic diagram of the structure of the first dispersion disk.

[0030] Figure 6 This is a schematic diagram of the structure of the second dispersion disk.

[0031] Figure 7 This is a schematic diagram of the structure of the third dispersion disk.

[0032] Figure 8 It is a schematic diagram of the three-dimensional structure of the fourth dispersion disk.

[0033] Fig. 9 It is a schematic diagram of the cross-sectional structure of the fourth dispersion disk.

[0034] Fig.10 Schematic diagram of the sedimentation component structure.

[0035] Fig.11 It is a schematic diagram of the cross-sectional structure of the sedimentation component.

[0036] Fig.12 Schematic diagram of the graded screen structure.

[0037] Wherein: grinding assembly 100, discharge end 101, feed end 102, cylinder 103, central axis 104, grinding medium feed port 105, first dispersion disc 110, first disc body 111, first flow guide slope 112, second dispersion disc 120, second disc body 121, second flow guide slope 122, third dispersion disc 130, third disc body 131, isolation column 132, fourth dispersion disc 140, fourth disc body 141, upper disc body 142, lower disc body 143, variable flow compensation slider 144, traction Shaft 145, traction connecting rod 146, first outer shaft 147, second outer shaft 148, avoidance chamber 151, traction chamber 152, transfer bin 200, feed pipe 201, discharge pipe 202, sedimentation assembly 300, feed inlet 301, return pipe 302, production outlet 303, return outlet 304, sedimentation barrel 305, transition barrel 306, grading screen 310, third guide slope 311, fourth guide slope 312, guide groove 313, first feed pump 401, second feed pump 402. DETAILED DESCRIPTION

[0038] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0039] It should be noted that when a device is considered to be "connected" to another device, it may be directly connected to the other device or there may be an intermediate device at the same time. The terms "inside", "top", "upper", "lower", "upper", "lower" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0041] The present application is further described below with reference to the accompanying drawings and embodiments.

[0042] Please refer to Figures 1 to 12 , the embodiment of the present application discloses, including a transfer bin 200, a grinding assembly 100 and a sedimentation assembly 300, wherein:

[0043] Transfer bin 200: The transfer bin 200 is provided with a feed pipe 201 and a discharge pipe 202, and the transfer bin 200 is used to prepare silicon carbide slurry; wherein, the transfer bin 200 is a transfer device, which is equipped with a feed pipe 201 and a discharge pipe 202, and is used to prepare silicon carbide slurry, so as to realize the orderly transportation and reasonable distribution of raw materials in the production process.

[0044] Grinding assembly 100: The grinding assembly 100 includes a cylinder 103 and a dispersion mechanism arranged in the cylinder 103, the cylinder 103 is provided with a feed end 102 and a discharge end 101, the discharge end 101 is connected to the feed pipe 201, and the feed end 102 is connected to the discharge pipe 202; wherein, the grinding assembly 100 is a grinding device, the cylinder 103 is provided with a feed end 102 and a discharge end 101, wherein the discharge end 101 is connected to the feed pipe 201 of the transfer bin 200, and the feed end 102 is connected to the discharge pipe 202 of the transfer bin 200, this design can realize the cyclic grinding and effective transmission of materials, and ensure the high efficiency and stability in the production process.

[0045] Sedimentation component 300: The sedimentation component 300 is provided with a feed inlet 301, and the feed inlet 301 is connected to the discharge pipe 202. A return pipe 302 is provided at the bottom of the sedimentation component 300, and the return pipe 302 is connected to the feed pipe 201, and the return pipe 302 is provided with a collection outlet 303; wherein, the sedimentation component 300 is a sedimentation equipment, which is provided with a feed inlet 301 inside, and the feed inlet 301 is connected to the discharge pipe 202 of the transfer bin 200, and the sedimentation component 300 is provided with a return pipe 302 at the bottom, and the return pipe 302 is connected to the feed pipe 201 of the transfer bin 200, and a collection outlet 303 is provided on the return pipe 302. This design makes it convenient to recycle and reuse part of the material during the material sedimentation process, improve resource utilization efficiency, and ensure the economy and environmental protection of the production process.

[0046] Furthermore, the ground silicon carbide slurry is settled and layered in the settling component 300 , the bottom layer is the recycled material, and the upper layer is the process material. The recycled material enters the transfer bin 200 through the return pipe 302 , and the process material is produced through the production port 303 .

[0047] In the specific work: first, silicon carbide slurry is prepared in the transfer bin 200, and the prepared silicon carbide slurry is slowly introduced into the grinding assembly 100 through the discharge pipe 202. After grinding, silicon carbide grinding media is added in small amounts and multiple times, and grinding is continued. During the grinding process, silicon carbide with smaller particle size in the silicon carbide slurry overflows from the discharge end 101 of the grinding assembly 100 and enters the transfer bin 200 through the feed pipe 201. At the same time, the unground silicon carbide slurry in the transfer bin 200 enters the grinding assembly 100 from the discharge pipe 202. , and repeat this cycle until at least 90% of the silicon carbide slurry in the transfer bin 200 is ground to the process particle size; then all the silicon carbide slurry in the transfer bin 200 is introduced into the sedimentation component 300 through the discharge pipe 202. After settling for a preset time, the ground silicon carbide slurry is settled and stratified in the sedimentation component 300, with the bottom layer being the recycled material and the upper layer being the process material. The recycled material is first introduced into the transfer bin 200 through the return pipe 302, and then the process material is taken out through the production port 303.

[0048] For precise quantification, preferably, a transition barrel 306 can be installed between the bottom of the sedimentation component 300 and the return pipe 302, and the recycled material at the bottom of the sedimentation component 300 is first introduced into the transition barrel 306. When the silicon carbide slurry fills the transition barrel 306, that is, all the recycled material is discharged from the sedimentation component 300, the recycled material in the transition barrel 306 is then introduced into the transfer bin 200 through the return pipe 302. The volume ratio of the sedimentation barrel 305 to the transition barrel 306 is (25 to 100):1.

[0049] It should be noted that, firstly, during the grinding process of silicon carbide slurry, since the capacity of the grinding component 100 is relatively small, a transfer bin 200 is provided. The preferred volume capacity ratio of the grinding component 100 to the transfer bin 200 of the present patent is 1:8; secondly, during the sedimentation process of the silicon carbide slurry in the sedimentation component 300, the sedimentation time is 1 h to 200 h, and 24 h is preferred in the present patent. After sedimentation, silicon carbide particles with larger particle size are accumulated at the bottom of the sedimentation component 300. When exporting, a driving valve with metering (flow), preferably a flow valve, can be used, and the remaining is the required silicon carbide particles (i.e., process materials); then, a slurry stirring component is provided in the transfer bin 200, which is used to stir the silicon carbide slurry in the transfer bin 200 to prevent the silicon carbide slurry at the bottom of the transfer bin 200 from being too concentrated or agglomerated into blocks, causing the slurry to be unable to flow.

[0050] The silicon carbide grinding system is adopted so that the silicon carbide slurry forms a self-grinding cycle and a recycling material cycle in the system. The silicon carbide raw material is adjusted into silicon carbide slurry in the transfer bin 200, and the silicon carbide slurry is ground to at least 90% to reach the process particle size in the introduction grinding component 100. The ground silicon carbide slurry is settled and layered in the sedimentation component 300, the bottom layer is the recycling material, and the upper layer is the process material. The recycling material enters the transfer bin 200 through the return pipe 302, and the process material is extracted through the extraction port 303. After the recycling material is introduced into the transfer bin 200, it enters a new round of grinding. The silicon carbide particles finally obtained are all process materials, thereby reducing the waste of silicon carbide and greatly reducing the cost of the enterprise.

[0051] It should be noted that the self-grinding cycle refers to the raw material being silicon carbide particles and the grinding medium being silicon carbide particles, but the particle sizes of the two are different. The biggest advantage of self-grinding is that it can reduce impurities. The recycling material cycle refers to the fact that the large-sized silicon carbide particles that are generally screened out are discarded or useless garbage. In the present application, the large-sized silicon carbide particles that are screened out are returned to the grinding assembly 100 through a pipeline for continued grinding, which greatly reduces the waste of materials.

[0052] Please refer to Figure 2 , 3 , 5, 6, 7, in a specific embodiment, the dispersion mechanism includes a central axis 104, at least one first dispersion disk 110 is installed on the upper part of the central axis 104, and a first installation portion is formed between two adjacent first dispersion disks 110; at least one second dispersion disk 120 is installed on the lower part of the central axis 104, and a second installation portion is formed between two adjacent second dispersion disks 120; a third installation portion is provided between adjacent first dispersion disks 110 and second dispersion disks 120; and a plurality of third dispersion disks 130 are installed on the first installation portion, the second installation portion, and the third installation portion;

[0053] Please refer to Figure 5 The first dispersion disk 110 includes a first disk body 111, and a plurality of first dispersion components are evenly arranged along the edge of the first disk body 111 in a circumferential direction. The first dispersion component has at least one first guide slope 112. When the medium collides with the first guide slope 112, the medium can be subjected to a component force vertically upward and horizontally outward along the first guide slope 112, wherein the inclination angle of the first guide slope 112 is 1° to 89°, and preferably the inclination angle of the guide slope is 30° to 60°.

[0054] Preferably, the first dispersion disk 110 is made of a round cake, namely the first disk body 111, which is evenly cut along the outer edge of the first disk body 111 at equal distances, so that the outer edge of the first disk body 111 forms a plurality of equally spaced saw teeth, and the saw teeth are rectangular or square, and the saw teeth are the first dispersion components of the present application. There are 2 to 12 dispersion components, and a cutting machine is used to cut off an outward corner of the rectangle or square, so that each dispersion component has a guide slope.

[0055] When the cutting machine cuts out the guide slope, it is preferred to cut downward along the diagonal of the rectangle or square of the first dispersing component. The cut guide slope is a quadrilateral, wherein two non-adjacent sides of the quadrilateral are parallel lines, and the quadrilateral as a whole is an oblique trapezoidal shape.

[0056] The first dispersion disk 110 can be installed at the upper part or the middle part of the cylinder 103 when in use, with the first flow guide slope 112 facing downward.

[0057] Please refer to Figure 6 The second dispersion disk 120 includes a second disk body 121, which is conical, and a plurality of second dispersion components are arranged at intervals along the vertex of the conical inclined surface. The second dispersion component has at least one second flow guiding inclined surface 122. When the medium collides with the flow guiding inclined surface, the medium can be subjected to the vertical upward and horizontal outward component along the flow guiding inclined surface; wherein, the second dispersion disk 120 is mainly installed at the bottom of the cylinder 103 to prevent the material from being deposited on the wheel body. Therefore, the second disk body 121 of the second dispersion disk 120 is set to be conical, and the cone angle of the cone is 30° to 180°. ℃, the size of the cone angle is determined by different materials, and the cone angle is different for different materials; a plurality of second dispersing components are arranged at intervals along the apex of the conical slope, and the spacing between the dispersing components constitutes a guide groove, which can prevent the slurry from being deposited on the dispersing disk. The dispersing components can be evenly or unevenly distributed on the dispersing disk. In the present application, it is preferred that the dispersing components are evenly distributed on the second disk body 121, and the number of the dispersing components is 2 to 12.

[0058] The second dispersing component is an irregular polyhedron, one of whose faces is combined with the conical surface of the second disk body 121, one side of the second dispersing component is a plane, and the other side is an inclined surface or an inclined surface plus a straight surface, and the second dispersing component has at least one second guide inclined surface 122, and the inclination angle of the second guide inclined surface 122 is 1° to 89°, and preferably the inclination angle of the guide inclined surface is 30° to 60°.

[0059] Preferably, when the second dispersing component of the second dispersing disk 120 is a right-angled trapezoid, the right-angled trapezoid is equivalent to being inverted on the second disk body 121, and the inclined surface of the trapezoid corresponds to and is combined with the inclined surface of the second disk body 121. At the same time, a inclined surface is cut out on the surface with four right angles as the second guide inclined surface 122.

[0060] Looking directly at the second dispersion disk 120, it can be seen that the dispersion components are arranged at intervals along the circumferential direction of the center of the circle on the second disk body 121, and the dispersion components are in a triangular shape, wherein one corner of the triangle is gathered toward the center, and there is a quadrilateral slope next to the triangle; looking up at the dispersion disk, the second disk body 121 is conical, and the upper surfaces of the dispersion components are on the same horizontal line.

[0061] The second dispersion disk 120 is generally installed at the bottom of the cylinder 103, and the inclined surface of the second guide slope 122 is installed upward, and can be used in conjunction with other dispersion disks. When the material in the cylinder 103 circulates to the bottom with the large circulation, when the guide dispersion disk runs at high speed, when the medium collides with the second guide slope 122, the medium can be subjected to the vertical upward and horizontal outward force along the second guide slope 122, providing a lift for the material, making the rotating flow flow upward, and can drive the material to move upward without remaining at the bottom of the cylinder 103. When the grinding assembly 100 is not working, there will be no material deposition on the guide dispersion disk.

[0062] Please refer to Figure 7 The third dispersion disk 130 includes a third disk body 131, and a plurality of isolation columns 132 are arranged on the third disk body 131. The isolation columns 132 are arranged on the same circumference. When the isolation columns 132 rotate at high speed, the grinding liquid forms a double-channel isolation membrane on both sides of the third dispersion disk 130. Among them, when the isolation columns 132 rotate at high speed, they form a large and a small, one inside and one outside double-channel isolation membrane, which can prevent the random interaction of the internal and external media, and form a turbulent interval inside and a turbulent interval outside, so that the turbulence is orderly and controllable, achieving the purpose of isolation and order. The isolation columns 132 penetrate the third disk body 131, forming an upper isolation column 132 above the third disk body 131, and forming a lower isolation column 132 below the third disk body 131.

[0063] Preferably, the process of the third dispersion disk 130 is as follows: prepare a plurality of isolation columns 132, each of which is cylindrical and of equal size, and grind both ends of the isolation columns 132 into rounded corners; prepare a round cake, namely the third disk body 131, locate the installation position of the isolation column 132 along the same circular trajectory of the third disk body 131, mark each position, and the distance between each position is equal, and punch an isolation hole at the marked position, and the size of the isolation hole is optimal for the isolation column 132 to just pass through; install the prepared isolation column 132 on the third disk body 131 through the isolation hole, the upper part of the third disk body 131 is the upper isolation column 132, and the lower part of the third disk body 131 is the lower isolation column 132.

[0064] The height of the isolation column 132 is 0.5 to 1 times the thickness of the third disk 131, and the diameter of the isolation column 132 is 5% to 20% of the diameter of the third disk 131. For example, when the diameter of the third disk 131 is 40 cm and the thickness is 5 cm, the height of the isolation column 132 is preferably 4 cm and the diameter is 2.5 cm.

[0065] The number of the isolation columns 132 is 2 to 12, preferably 4 to 8. Both ends of the isolation columns 132 are polished into rounded corners, which can improve the wear resistance of the isolation columns 132 and reduce the loss of the third dispersion disk 130. The isolation columns 132 are preferably rounded with a radius of 0 mm to 2 mm.

[0066] Preferably, the third dispersion disk 130 is installed inside the cylinder 103 during use. When the third dispersion disk 130 runs at high speed, the grinding liquid forms two channels, inner and outer, large and small, on both sides of the third dispersion disk 130, so that the medium slurry cannot flow alternately at will, but can only circulate with the turbulent flow in the cylinder 103. Therefore, the turbulence is orderly and controllable, achieving the purpose of isolation and control.

[0067] In one case, for example, a first dispersion disk 110 is installed at the uppermost end of the central axis 104, a second dispersion disk 120 is installed at the lowermost end of the central axis 104, and a plurality of third dispersion disks 130 are installed between the first dispersion disk 110 and the second dispersion disk 120. It is worth emphasizing that in this case, since there is only one first dispersion disk 110 and the second dispersion disk 120 in the cylinder 103, the first mounting portion and the second mounting portion do not exist.

[0068] In another case, when the central axis 104 is longer, in order to further enhance the turbulent velocity, a first dispersion disk 110 is installed at the uppermost end and the middle part of the central axis 104, and a second dispersion disk 120 is installed at the lowermost end of the central axis 104. At this time, the first dispersion disk 110 installed at the uppermost end and the middle part of the central axis 104 constitute a first installation part, and the first dispersion disk 110 installed in the middle part of the central axis 104 and the second dispersion disk 120 at the lowermost end constitute a third installation part. Because there is only one second dispersion disk 120, there is no second installation part, and a plurality of third dispersion disks 130 are installed between the first installation part and the third installation part.

[0069] In another case, in order to further improve the grinding effect of the material, a first dispersion disk 110 is installed at the uppermost end of the central axis 104 from top to bottom; another first dispersion disk 110 is installed at one-quarter of the central axis 104; a second dispersion disk 120 is installed at three-quarters of the central axis 104; and another second dispersion disk 120 is installed at the bottom of the central axis 104; a first mounting portion is formed between two adjacent first dispersion disks 110, a second mounting portion is formed between two adjacent second dispersion disks 120, and a third mounting portion is formed between the first dispersion disk 110 at one-quarter and the second dispersion disk 120 at three-quarters, and a plurality of third dispersion disks 130 are respectively installed on the first mounting portion, the second mounting portion and the third mounting portion.

[0070] The first dispersion disk 110, the second dispersion disk 120, and the third dispersion disk 130 are all provided with an axial hole and a plurality of medium through holes in the center of the disk body. The axial hole is provided with a keyway hole, and the axial hole is any one of polygonal, circular, square, and triangular shapes. When the axial hole is polygonal, square, or triangular, there may be no keyway hole. When the axial hole is circular, there is at least one keyway hole. The present application preferably provides three keyway holes. The medium through holes may be evenly distributed or unevenly distributed. There may be one or more medium through holes. The medium through holes are any one of circular, square, fan-shaped, polygonal, elliptical, and rounded square. The medium through holes are provided to allow the medium to flow fully in the cylinder 103. Combined with the rotation of the dispersion disk, the material can be ground more evenly and the grinding efficiency can be improved.

[0071] It should be noted that a shaft sleeve is also provided on the central axis 104 and is located between two adjacent dispersion discs, so that a certain distance is maintained between the dispersion discs. The size of the distance is determined by the size of the shaft sleeve. At the same time, the central axis 104 can be protected and the impact of the material on the central axis 104 can be reduced.

[0072] In a specific embodiment, for example, when grinding silicon carbide, the prepared silicon carbide raw material is slowly introduced into the cylinder 103 from the raw material feed end 102. After the slurry is fully stirred, the silicon carbide grinding medium is introduced into the grinding assembly 100 in small amounts and multiple times. The grinding assembly 100 continues to operate so that the raw material and the grinding medium are fully ground in the grinding assembly 100. The uppermost end of the central axis 104 is equipped with a first dispersion disc 110, and a sleeve is also sleeved between each dispersion disc to ensure the distance between each dispersion disc. When the grinding assembly 100 is working, when the dispersion discs in the cylinder 103 are running at a high speed, the first dispersion disc 110 arranged at the uppermost end is provided with a first guide slope 112, and the slope is installed downward. The slope can give the material a vertical downward and horizontal outward component force, so that the material moves downward as a whole; the second dispersion disc 120 installed at the lowermost end of the central axis 104 is provided with a second guide slope 122, and the slope is installed upward. The slope can give the material a vertical upward and horizontal outward component force, so that the material moves downward as a whole. The material moves upward under the action of the first dispersion disk 110; the material moving downward under the action of the second dispersion disk 120 meets the material moving upward under the action of the second dispersion disk 120 and collides with each other, forming a vortex to promote the large circulation in the cylinder 103; at the same time, a third dispersion disk 130 is installed between the first dispersion disk 110 and the second dispersion disk 120. Under the influence of the isolation column 132 provided on the third dispersion disk 130, the material on the inner side of the isolation column 132 moves upward and toward the central axis 104, and the material is rebounded when it collides with the sleeve; the material on the outer side of the isolation column 132 moves upward and toward the inner wall of the cylinder 103, and the material is rebounded when it collides with the inner wall, thereby forming small vortex circulations of different sizes inside and outside. Large silicon carbide particles in the circulation are thrown out by centrifugal force and enter the large circulation or small circulation for further grinding, while silicon carbide particles with smaller particle sizes overflow the cylinder 103 through the gap between the central axis 104 and the cover plate and enter the discharge bin, flow out from the raw material discharge end 101, and enter the transfer bin 200 through the feed pipe 201; silicon carbide that does not meet the process standards continues to circulate in the cylinder 103, and under the close cooperation of the small circulation and the large circulation, a variety of violent eddies are formed in the cylinder 103, which greatly increases the collision probability between the medium and the raw material, and between the raw materials, so that the material can be ground more fully and quickly.

[0073] It should be noted that the installation positions of the first dispersing disc 110, the second dispersing disc 120, and the third dispersing disc 130 can be freely combined according to the type of the grinding assembly 100, the size of the cylinder 103, the grinding material, and the working requirements, and are not limited to the above-mentioned installation method.

[0074] Please refer to Figure 2 , 4, 8, 9, in another specific embodiment, the dispersion mechanism is formed by connecting a plurality of fourth dispersion disks 140 end to end in sequence, and the fourth dispersion disk 140 includes a fourth disk body 141, a variable flow compensation slider 144 and a variable flow drive assembly. The fourth disk body 141 includes an upper disk body 142 and a lower disk body 143, and a plurality of slide grooves are provided on the upper disk body 142 and / or the lower disk body 143 along the radial direction. When the upper disk body 142 and the lower disk body 143 are overlapped, an installation cavity is formed at the slide groove. The variable flow compensation slider 144 is slidably arranged in the installation cavity, and the end of the variable flow compensation slider 144 can extend out of the edge of the fourth disk body 141. The variable flow drive assembly is connected to the variable flow compensation slider 144, and is used to drive the variable flow compensation slider 144 to reciprocate along the slide groove.

[0075] Please refer to Figures 8 to 9 In some embodiments, the dispersion mechanism includes a main shaft and a plurality of the fourth dispersion discs 140 mounted on the main shaft. The main shaft is connected to a driving motor, and the driving motor drives the fourth dispersion discs 140 to rotate at a high speed through the main shaft to achieve dispersion of materials. In some other embodiments, the dispersion mechanism is formed by splicing at least two of the fourth dispersion discs 140. For example, sub-axes for connecting to form the main shaft are provided above and below the fourth dispersion disc 140. The sub-axes of the two fourth dispersion discs 140 can be fixedly connected, for example, the sub-axes of the two fourth dispersion discs 140 are welded; or they can be detachably connected, for example, the sub-axes of the two fourth dispersion discs 140 are connected by threaded connection, riveting or snap connection.

[0076] Specifically, the fourth dispersion disk 140 includes an upper disk body 142 and a lower disk body 143 stacked up and down, and at least one of the upper disk body 142 and the lower disk body 143 is provided with a plurality of slide grooves along the radial direction. The variable flow compensation slider 144 is arranged in the slide groove and can slide along the slide groove. The variable flow drive component is connected to the variable flow compensation slider 144, and is used to drive the variable flow compensation slider 144 to reciprocate along the slide groove. For example, the variable flow compensation slider 144 is in the shape of a long strip, and the variable flow drive component is a reciprocating motion mechanism arranged on the upper disk body 142 or the lower disk body 143, such as a reciprocating motor.

[0077] Preferably, the variable flow drive assembly includes a traction shaft 145 and a plurality of traction links 146, wherein the traction shaft 145 is arranged perpendicularly to the upper disk 142, one end of the traction link 146 is hingedly connected to the traction shaft 145, and the other end is hingedly connected to the variable flow compensation slider 144. Specifically, the traction shaft 145320 is arranged perpendicularly to the fourth disk 141 and is coaxial with the fourth disk 141, the upper ends or lower ends of the plurality of traction links 146 are hingedly connected to the traction shaft 145 to form an "umbrella" shape, and the other ends of the plurality of traction links 146 are hingedly connected to the variable flow compensation slider 144. The traction shaft 145 reciprocates vertically to the fourth disk 141, and through the traction link 146, the variable flow compensation slider 144 is pulled to reciprocate along the slide groove.

[0078] In some embodiments, the traction shaft 145 can be independently provided, that is, a traction shaft 145 capable of reciprocating motion is provided in each of the fourth dispersion discs 140. In a preferred embodiment, a first outer shaft 147 is connected to the upper disc body 142, and a second outer shaft 148 is connected to the lower disc body 143. The first outer shaft 147 and the second outer shaft 148 are hollow to form a traction cavity 152, and the traction shaft 145 is provided in the traction cavity 152. At this time, a plurality of traction shafts 145 pass through the traction cavity 152 and are fixedly or detachably connected to form a complete traction shaft 145. At this time, it is only necessary to connect a mechanism for driving the traction shaft 145 to reciprocate up and down at the upper end or the lower end of the complete traction shaft 145, such as a reciprocating motor, a reciprocating gear structure, etc., so that the entire traction shaft 145 can reciprocate up and down, and at the same time drive multiple groups of traction links 146 to drive the variable flow compensation slider 144 to reciprocate along the slide groove.

[0079] On the one hand, the variable flow compensation slider 144 is provided, and the end of the variable flow compensation slider 144 is able to extend out of the outer edge of the upper disk body 142, so that during the rotation of the upper disk body 142, the portion of the variable flow compensation slider 144 extending out of the edge of the upper disk body 142 contacts and collides with the grinding medium and the material, thereby increasing the shear force between the fourth disk body 141 and the ground material, which is beneficial to improving the grinding efficiency; on the other hand, the variable flow compensation slider 144 is provided, and under the action of the variable flow drive assembly, reciprocates along the radial direction of the upper disk body 142, thereby actively changing the turbulent state of the grinding medium and the material near the edge of the upper disk body 142, significantly increasing the collision probability between the grinding medium and the material, and thus significantly improving the grinding efficiency. Compared with the grinding assembly 100 in which the fourth dispersion disk 140 is a fixed structure, the double variable flow grinding assembly 100 provided in the present application has a grinding efficiency for silicon carbide increased by 20% to 40%.

[0080] In some preferred embodiments, the upper disk body 142 and / or the lower disk body 143 are provided with an avoidance cavity 151, and the traction link 146 is arranged in the avoidance cavity 151. That is to say, in order to adapt to the movement trajectory of the traction link 146 and ensure that the traction link 146 is located in a relatively closed environment to prevent the connection of the traction link 146 from being stuck, the middle part of at least one of the upper disk body 142 and the lower disk body 143 is provided with an avoidance cavity 151 that does not affect the movement of the traction link 146, for example, the avoidance cavity 151 is conical or square. The position of the avoidance cavity 151 forms a space for the traction link 146 to move. It is only necessary to disassemble the connection between the upper disk body 142 and the lower disk body 143 to realize the inspection, maintenance and replacement of the variable flow compensation slider 144 and the traction link 146, which is convenient to operate.

[0081] In some embodiments, a wear-resistant portion is provided at the end of the variable flow compensation slider 144 to slow down the wear rate of the variable flow compensation slider 144 and further reduce production costs.

[0082] In some other embodiments, the number of the variable flow compensation sliders 144 is 3 to 12.

[0083] According to a specific embodiment, the upper part of the cylinder 103 is provided with a raw material discharge end 101 and a grinding medium feed port, and the lower part of the cylinder 103 is provided with a raw material feed end 102. The raw material feed end 102 is arranged at the lower end of the cylinder 103 so that the material can enter slowly from the bottom. If the feed end 102 is arranged above the cylinder 103, the material will be affected by gravity when entering the cylinder 103, which will cause impact on the shaft or dispersion disk in the cylinder 103. Long-term impact will damage the shaft and dispersion disk or the dispersion disk will be skewed after being impacted, causing turbulence in the cylinder 103, thereby breaking the circulation system in the cylinder 103 and causing a decrease in grinding quality. The ground slurry will flow out from the raw material discharge end 101 above the cylinder 103 according to the circulation system. A filter screen is also arranged in the raw material discharge end 101 to further ensure the quality of the material. The grinding medium feed port is located above the cylinder 103, and will not affect the central axis 104 or the dispersion disk when feeding, because, firstly, the amount of grinding medium added is less than the raw material, and it is added in small amounts and multiple times; secondly, the raw material is added first, and the grinding medium is added after running for a period of time, so the grinding medium feed port can be placed above the cylinder 103.

[0084] According to a specific embodiment, a cooling device is provided on the outside of the barrel 103, and a cooling medium feed port and a cooling medium discharge port are provided on the cooling device. Since the slurry in the barrel 103 runs at a high speed, a certain amount of heat will be generated. In order to ensure the process temperature in the barrel, a cooling device is provided on the outside of the barrel 103, and a cooling medium feed port and a cooling medium discharge port are provided, so that the cooling medium circulates continuously, thereby ensuring the process temperature of the barrel 103.

[0085] According to a specific embodiment, a cover plate is further provided at the upper end of the cylinder 103 , and a plurality of mounting holes are provided on the cover plate. The cover plate can prevent the material from splashing out and can also facilitate observation and maintenance.

[0086] Please refer to Fig.11 , Fig.12 In a specific embodiment, the sedimentation component 300 includes a sedimentation barrel 305, in which at least one grading screen 310 is arranged, and the grading screen 310 is inclined and has a third guide slope 311 and a fourth guide slope 312 intersecting each other, and a guide groove 313 is formed at the intersection of the third guide slope 311 and the fourth guide slope 312, and the sedimentation barrel 305 is provided with a return port 304, and the return port 304 is connected to the feed pipe 201, and the bottom end of the guide groove 313 is opposite to the return port 304. The silicon carbide slurry is settled in the sedimentation component 300 for a predetermined time, and the silicon carbide with larger particles (i.e., recycled materials, with a particle size of 50 um to 70 um) settles at the bottom of the sedimentation component 300, and the silicon carbide with larger particles (i.e., recycled materials) is introduced into the transition barrel 306, and then enters the transfer bin 200 through the return pipe 302, and then the process particle size in the sedimentation barrel 305 is mined from the mining port 303 through the transition barrel 306, and the large particles of silicon carbide (i.e., recycled materials, with a particle size greater than 200 um) intercepted by the grading screen 310 are introduced into the transfer bin 200 through the return port 304 and the feed pipe 201, and enter the next round of slurry self-grinding cycle.

[0087] It should be noted that, for example, when preparing slurry, because submicron powders have large specific surface area and surface energy, they are very easy to agglomerate, and the powder flowability and dispersion properties are poor. In order to effectively avoid re-agglomeration of the components, experiments have shown that the pH value of the slurry is generally adjusted to 10 before the slurry enters the barrel. At this time, the slurry not only maintains the original uniformity of the slurry, but also the particle size is normally distributed during the sedimentation process, with good fluidity, suitable for continuous automatic molding, and can also improve the uniformity of the green body, which is beneficial to the sintering of ceramics. The slurry enters the settling barrel 305 from the feed port above the settling barrel 305. When the slurry fills the entire barrel (it cannot exceed the upper limit of the water level), it is settled. The settling time is determined by the process and the powder (1 hour to 200 hours). Due to the characteristics of silicon carbide powder, silicon carbide particles with larger particle sizes will settle first. In order to intercept large particles of silicon carbide (i.e., recycled materials) and obtain more uniform silicon carbide particles, a graded screen 310 is set in the settling barrel 305. Here we prefer a two-stage screen to prevent clogging of micropowder particles. The sieve holes are set to a slope that is inclined downward relative to the horizontal plane. When the slurry accumulates at the lower end of the first slope, the slurry can continue to flow downward from the mesh holes at the upper end and enter the second slope. The second slope is set because the silicon carbide micropowder is irregular in shape. First, it is set to filter out a small part of the large particles of silicon carbide micropowder that are missed. Second, the micropowder can be filtered and graded as needed to filter out micropowder particles smaller than the first slope. The inclined design of the grading screen 310 not only increases the filtration area, but also improves the filtration efficiency.

[0088] When sedimentation is completed, the slurry that meets the working standards is discharged from the sedimentation barrel 305, and the large particles of powder remain on the grading screen 310. At this time, the return port 304 corresponding to the grading screen 310 is opened. Because the inclination angle of the grading screen 310 is set according to the repose angle of the powder slurry, the large particles of powder naturally enter the transfer bin 200 from the return port 304 through the feed pipe 201.

[0089] Please refer to Fig.12 In order to prevent the micro-powder slurry from being blocked and to enable it to be better discharged from the sedimentation tank 305, the grading screen 310 includes a third guide slope 311 and a fourth guide slope 312. The third guide slope 311 and the fourth guide slope 312 are spliced ​​to form a guide groove 313. The guide groove 313 is streamlined to make the powder slurry easier to slide.

[0090] Preferably, the mesh number of the grading screen 310 is 400 to 1200 mesh. In actual work, the mesh number of the grading screen 310 can be freely configured according to actual work needs. It can be configured into screens with the same mesh number, or screens with different mesh numbers can be configured as needed. Generally, the mesh number of the upper sieve hole is smaller and the sieve hole is larger. The mesh number of the sieve hole increases and the sieve hole becomes finer as it goes down. The main function of setting the grading screen 310 with different mesh numbers is to remove particles larger than a certain value inside the slurry (because the silicon carbide particles are irregular in shape during the screening process, the screen cannot completely remove particles of the corresponding size).

[0091] Preferably, a conical first pouring cone is provided at the lower part of the settling barrel 305, and the upper part of the settling barrel 305 is preferably cylindrical. The angle of the pouring cone is set according to the repose angle or angle of repose of different powders. Such a setting can reduce friction, increase fluidity, and allow the slurry to slide naturally.

[0092] In actual work, by accurately controlling the sedimentation time, a part of the large particle slurry is settled on the grading screen 310, and a part of the larger particles is settled in the lower part of the sedimentation barrel 305. The middle slurry is the silicon carbide slurry required in actual work, that is, the process material. At this time, the isolation valve is opened, and the larger particle slurry (that is, the recycled material) is poured into the transition barrel 306 through the guide pipe. When the larger particle slurry completely flows into the transition barrel 306, the isolation valve is closed, and the larger particle slurry in the transition barrel 306 is completely introduced into the transfer bin 200 through the return pipe 302. In order to prevent the large particle powder in the transition barrel 306 from remaining, a conical second pouring cone is arranged at the lower part of the transition barrel 306, so that the large particle powder in the transition barrel 306 can be completely discharged. At this time, the isolation valve is opened again, and the obtained process material flows out through the transition barrel 306 into the next process.

[0093] Preferably, a high-pressure cleaning pipe is provided on the sedimentation barrel 305, and a plurality of nozzles are installed on the high-pressure cleaning pipe. The nozzles can rotate freely, and the nozzle spraying route can also be set as needed. The high-pressure cleaning system consists of a high-pressure cleaning pipe surrounding the barrel wall of the sedimentation barrel 305, a plurality of high-pressure nozzles installed on the high-pressure cleaning pipe, and a high-pressure nozzle inserted into the liquid level gauge. Since the silicon carbide slurry has thixotropy and is easy to adhere to the pipe wall or the cylinder wall, when the sedimentation is completed, the residual slurry on the conical barrel, the grading screen 310 and the liquid level gauge can be automatically cleaned by setting up a high-pressure cleaning system, eliminating the need for manual cleaning.

[0094] Preferably, the settling barrel 305 is equipped with a liquid level gauge, the main function of which is to display the real-time position of the slurry. However, due to the long-term sedimentation of the slurry, silicon carbide powder is easily accumulated at the bottom of the liquid level gauge, and the increased viscosity makes it difficult to clean. Therefore, an ultrasonic vibration device is provided near the bottom of the pipeline to prevent slurry blockage.

[0095] It should be noted that, firstly, the silicon carbide slurry may have a problem of insufficient power during the flow process, therefore, the grinding system also includes a feed assembly, the feed assembly includes a first feed pump 401, a second feed pump 402, the feed end 102 is connected to the discharge pipe 202 through the first feed pump 401, and the feed pipe 201 is connected to the return pipe 302 through the second feed pump 402. For example, without the power of the feed assembly, the grinding cycle of the grinding assembly 100 and the transfer bin 200 is slow to feed only by the pressure in the chamber, therefore, the feed end 102 is connected to the discharge pipe 202 through the first feed pump 401 to increase the power, similarly, the feed pipe 201 is connected to the return pipe 302 through the second feed pump 402, secondly, the large-grained silicon carbide and the relatively large-grained silicon carbide in this application need to be introduced into the transfer bin 200 for continued grinding, so they are both called recycled materials.

[0096] The present application also discloses a method for producing silicon carbide micropowder, which is applied to any of the above-mentioned silicon carbide grinding systems. The production method comprises the following steps:

[0097] S1. Prepare silicon carbide slurry in the transfer bin 200, and detect the solid content of the silicon carbide slurry until the solid content of the silicon carbide slurry reaches a preset value; wherein the method for preparing silicon carbide slurry in the transfer bin 200 is to add silicon carbide raw material and water into the transfer bin 200 for mixing, add a pH adjuster, the pH adjuster is at least one of NaOH, KOH, and sodium alcohol, and adjust the pH value to 9 to 12 to obtain alkaline silicon carbide slurry, add a dispersant into the transfer bin 200, the dispersant is TMAH, mix and stir with the alkaline silicon carbide slurry to obtain the silicon carbide slurry, the solid content of the silicon carbide slurry is preferably 10% to 40%, too low solid content is easy to cause waste, and too high solid content affects the fluidity of the slurry.

[0098] S2. Slowly inject the silicon carbide slurry in the transfer bin 200 into the grinding assembly 100 through the discharge pipe 202; wherein, since the grinding assembly 100 is always in operation when the slurry is injected into the grinding assembly 100, if the slurry is injected too quickly, it is easy to impact the dispersion disk in the grinding assembly 100, which may cause the dispersion disk to tilt and affect the grinding efficiency.

[0099] S3. Add grinding media to the grinding component 100, wherein the grinding media are silicon carbide particles, and the particle size of the silicon carbide particles is 1 mm to 10 mm; wherein the raw material and the grinding media in the grinding component 100 are both silicon carbide, self-grinding can reduce the introduction of impurities, and due to the limitation of the capacity of the grinding component 100, when adding the silicon carbide grinding media, it is necessary to add it in small amounts and multiple times to avoid adding too much or too little to affect the grinding efficiency.

[0100] S4. The silicon carbide slurry is ground in the grinding component 100, and the ground silicon carbide slurry overflows from the discharge end 101 of the grinding component 100 and enters the transfer bin 200 through the feed pipe 201, and circulates continuously until at least 90% of the silicon carbide slurry in the transfer bin 200 is ground to the process particle size.

[0101] S5. The silicon carbide slurry in the transfer bin 200 is introduced into the sedimentation component 300 for sedimentation; when all the silicon carbide slurry is ground, some of the silicon carbide slurry has not reached the process particle size, which will affect the quality of the next-level process. Therefore, further sedimentation is required to obtain better quality silicon carbide slurry.

[0102] S6. After settling for a preset time, the ground silicon carbide slurry settles and forms layers in the settling component 300, with the bottom layer being recycled materials and the upper layer being process materials. The recycled materials enter the transfer bin 200 through the return pipe 302, and the process materials are taken out through the production port 303; the materials taken out from the production port 303 are process materials, and the recycled materials are introduced into the transfer bin 200 to enter a new round of grinding cycle. The cycle continues like this, and finally all the silicon carbide slurries taken out are process materials, thereby reducing the waste of silicon carbide.

[0103] In a specific embodiment, the method for producing silicon carbide micropowder comprises the following steps:

[0104] Add silicon carbide raw material and water into the transfer bin 200 for mixing. The silicon carbide raw material is silicon carbide with a mesh size of 800 to 2000, preferably D 50 The particle size is 6.7 um to 14 um, a pH adjuster is added, the pH adjuster is at least one of NaOH, KOH, and sodium alcohol, and the pH value is adjusted to 9 to 12 to obtain an alkaline silicon carbide slurry, a dispersant is added to the transfer bin 200, the dispersant is TMAH, and it is mixed and stirred with the alkaline silicon carbide slurry to obtain the silicon carbide slurry, and the solid content of the silicon carbide slurry is detected to be 10% to 40%.

[0105] The silicon carbide slurry in the transfer bin 200 is slowly injected into the grinding assembly 100 through the discharge pipe 202. After a predetermined amount is injected, a grinding medium is added to the grinding assembly 100 in small amounts and multiple times. The grinding medium is silicon carbide particles, and the particle size of the silicon carbide particles is 1 mm to 10 mm. The ground silicon carbide slurry overflows from the discharge end 101 of the grinding assembly 100 and enters the transfer bin 200 through the feed pipe 201. This cycle continues until the particle size of the silicon carbide particles at the bottom of the grinding assembly 100 is detected to reach 0.5 um to 0.7 um.

[0106] After the silicon carbide slurry is ground by the grinding assembly 100, most of the silicon carbide particles have been ground to the process particle size, but there is still a small amount of silicon carbide particles whose size does not meet the process standards, so further sedimentation is required to intercept the silicon carbide slurry that does not meet the process.

[0107] The silicon carbide slurry in the transfer bin 200 is introduced into the sedimentation component 300 for sedimentation. After a preset sedimentation time, the ground silicon carbide slurry is settled and stratified in the sedimentation component 300. The bottom layer is the recycled material and the upper layer is the process material. The recycled material is introduced into the transfer bin 200 through the return pipe 302 and enters the next round of slurry self-grinding cycle. The process material is extracted from the extraction port 303 of the sedimentation component 300.

[0108] It should be noted that the present application uses BT 9300ST Dandong Better Laser Particle Size Analyzer to measure the particle size of silicon carbide.

[0109] 800 kg of silicon carbide raw material and deionized water are put into the transfer bin 200 in a mass ratio of 1:4, stirred for 0.5 hour, and a pH adjuster is added. The pH adjuster is a mixture of NaOH and KOH, and the mass ratio of NaOH to KOH in the mixture is 1:1. The pH value of the silicon carbide slurry is adjusted to 10, stirred for 1 hour, and then a dispersant TMAH is added. The addition ratio of NaOH, KOH and TMAH is 1:1:2 to obtain a silicon carbide slurry.

[0110] The silicon carbide slurry is introduced into the grinding assembly 100 at a speed of 800 revolutions per minute (r / min). After grinding for 12 hours, silicon carbide grinding media with a particle size of 6 mm is added in small amounts and multiple times. During the grinding process, the ground silicon carbide particles overflow from the grinding assembly 100 and are poured into the transfer bin 200 through the feed pipe 201, and the slurry in the transfer bin 200 is replenished into the grinding assembly 100 through the discharge pipe 202. This cycle is repeated, and the particle size at the bottom of the grinding assembly 100 is detected every 12 hours. When the particle size at the bottom of the grinding assembly 100 is less than 1 mm to 3 mm, the grinding media is added. Until the particle size of the silicon carbide powder reaches 0.5 um to 0.7 um.

[0111] The ground silicon carbide slurry is poured from the transfer bin 200 into the sedimentation component 300 through the discharge pipe 202. After 48 hours of sedimentation, the silicon carbide with larger particles (i.e., recycled materials, with a particle size greater than 50 um) settles at the bottom of the sedimentation component 300. The silicon carbide slurry that does not meet the process particle size at the bottom (i.e., recycled materials) is introduced into the transfer bin 200 through the return pipe 302 and enters the next round of slurry self-grinding cycle. The remaining silicon carbide slurry that meets the process particle size (i.e., process materials) is produced through the production port 303.

[0112] The above-described embodiments only express the way of equipment layout of the present application, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application; it should be pointed out that for ordinary technicians in this field, several adjustments and improvements can be made without departing from the concept of the present application, which all belong to the scope of protection of the present application; therefore, the scope of protection of the patent of this application shall be based on the attached claims.

Claims

1. A silicon carbide grinding system, characterized in that: include Transfer bin: The transfer bin is provided with a feed pipe and a discharge pipe, and the transfer bin is used to prepare silicon carbide slurry; Grinding assembly: The grinding assembly includes a cylinder and a dispersion mechanism disposed in the cylinder, the cylinder is provided with a feed end and a discharge end, the discharge end is connected to the feed pipe, and the feed end is connected to the discharge pipe; Sedimentation assembly: the sedimentation assembly is provided with a feed inlet, the feed inlet is connected to the discharge pipe, the bottom of the sedimentation assembly is provided with a return pipe, the return pipe is connected to the feed pipe, and the return pipe is provided with a collection outlet; and The ground silicon carbide slurry is settled and layered in the settling component, the bottom layer is the recycled material, the upper layer is the process material, the recycled material enters the transfer bin through the return pipe, and the process material is produced through the production outlet.

2. The silicon carbide grinding system according to claim 1, characterized in that: The dispersion mechanism comprises a central axis, at least one first dispersion disk is installed on the upper part of the central axis, and a first installation part is formed between two adjacent first dispersion disks; at least one second dispersion disk is installed on the lower part of the central axis, and a second installation part is formed between two adjacent second dispersion disks; a third installation part is provided between the adjacent first dispersion disk and the second dispersion disk; and a plurality of third dispersion disks are installed on the first installation part, the second installation part and the third installation part; The first dispersion disk comprises a first disk body, and a plurality of first dispersion components are evenly arranged along the circumferential direction of the edge of the first disk body. The first dispersion component has at least one first flow guiding slope. When the medium collides with the first flow guiding slope, the medium can be subjected to a component force vertically upward and horizontally outward along the first flow guiding slope. The second dispersing disk comprises a second disk body, the second disk body is conical, a plurality of second dispersing components are arranged at intervals along the apex of the conical inclined surface, the second dispersing component has at least one second flow guiding inclined surface, when the medium collides with the flow guiding inclined surface, the medium can be subjected to a component force vertically upward and horizontally outward along the flow guiding inclined surface; The third dispersing disk comprises a third disk body, on which a plurality of isolation columns are arranged. The isolation columns are arranged on the same circumference. When the isolation columns rotate at a high speed, the grinding liquid forms a double-channel isolation membrane on both sides of the third dispersing disk.

3. The silicon carbide grinding system according to claim 1, characterized in that: The dispersion mechanism is formed by connecting a plurality of fourth dispersion disks end to end in sequence, wherein the fourth dispersion disk comprises a fourth disk body, wherein the fourth disk body comprises an upper disk body and a lower disk body, wherein the upper disk body and / or the lower disk body are provided with a plurality of slide grooves along a radial direction; when the upper disk body and the lower disk body are overlapped, a mounting cavity is formed at the slide groove; a variable flow compensation slider is slidably arranged in the mounting cavity, and an end of the variable flow compensation slider can extend out of the edge of the disk body; And a variable flow driving component, wherein the variable flow driving component is connected to the variable flow compensation slider and is used to drive the variable flow compensation slider to reciprocate along the slide groove.

4. The silicon carbide grinding system according to claim 3, characterized in that: The variable flow driving assembly includes a traction shaft and a plurality of traction links. The traction shaft is vertically arranged with the disk body. One end of the traction link is hingedly connected to the traction shaft, and the other end is hingedly connected to the variable flow compensation slider.

5. The silicon carbide grinding system according to claim 4, characterized in that: The upper disk body is connected with a first outer shaft, the lower disk body is connected with a second outer shaft, the first outer shaft and the second outer shaft are hollow to form a traction cavity, and the traction shaft is arranged in the traction cavity.

6. The silicon carbide grinding system according to claim 4, characterized in that: The upper disk body and / or the lower disk body is provided with an avoidance cavity, and the traction link is arranged in the avoidance cavity.

7. The silicon carbide grinding system according to claim 3, characterized in that: The end of the variable flow compensation slider is provided with a wear-resistant portion.

8. The silicon carbide grinding system according to claim 3, characterized in that: The number of the variable flow compensation sliders is 3 to 12.

9. The silicon carbide grinding system according to claim 1, characterized in that: The sedimentation component includes a sedimentation barrel, in which at least one grading screen is arranged. The grading screen is inclined and has a third guide slope and a fourth guide slope that intersect each other. A guide groove is formed at the intersection of the third guide slope and the fourth guide slope. The sedimentation barrel is provided with a return port, which is connected to the feed pipe, and the bottom end of the guide groove is opposite to the return port.

10. The silicon carbide grinding system according to claim 1, characterized in that: It also includes a feed component, which includes a first feed pump and a second feed pump. The feed end is connected to the discharge pipe through the first feed pump, and the feed pipe is connected to the return pipe through the second feed pump.

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