Composite laser processing mechanism and laser processing device

Abstract

The utility model relates to the technical field of laser processing, in particular to a composite laser processing mechanism and a laser processing device. The composite laser processing mechanism comprises a rack, a workbench and a laser processing system, the workbench is arranged on the rack, the laser processing system comprises a plurality of galvanometer scanning assemblies and a plurality of lasers, the wavelengths of laser beams emitted by the lasers are different, the galvanometer scanning assemblies are arranged above the workbench, and the galvanometer scanning assemblies are arranged on the workbench. Each galvanometer scanning assembly is connected with a laser, and the galvanometer scanning assemblies can deflect laser beams emitted by the lasers so as to machine workpieces to be machined on the workbench. According to the utility model, functions of a plurality of devices are integrated, and badness and efficiency loss caused by process circulation can be reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of laser processing, in particular to a composite laser processing mechanism and a laser processing device. Background Art

[0002] Printed circuit boards (PCBs) are providers of electrical connections for electronic components. PCBs are mainly sandwich structures consisting of two types of materials: insulating substrates and conductors. Conductor materials usually use copper, and insulating materials include polypropylene (PP), polytetrafluoroethylene (PTFE), hydrocarbon resins, polyphenylene ether (PPO / PPE), resin materials (BT), Ajinomoto deposited film (ABF), ceramics, etc. With the development of circuit boards, the number of layers is increasing and the applications are becoming more and more extensive. For circuit boards for high-end applications, more and more traditional mechanical conversions are being made to laser drilling and cutting. Different material properties have different absorption rates for different laser wavelengths and pulse widths, that is, different processability. Different laser light sources will be used in the processing of such a circuit board.

[0003] In the prior art, when laser processing is performed on a circuit board, multiple processes of laser drilling or laser cutting are generally implemented by circulating on multiple devices, which is inefficient. Utility Model Content

[0004] The technical problem to be solved by the utility model is: in view of the problem of low efficiency in laser processing of circuit boards in the prior art, a composite laser processing mechanism and a laser processing device are provided.

[0005] In order to solve the above technical problems, on the one hand, an embodiment of the utility model provides a composite laser processing mechanism, including a frame, a workbench and a laser processing system, the workbench is arranged on the frame, the laser processing system includes multiple galvanometer scanning assemblies and multiple lasers, the wavelengths of the laser beams emitted by the multiple lasers are different from each other, the multiple galvanometer scanning assemblies are arranged above the workbench, each of the galvanometer scanning assemblies is connected to one of the lasers, and the galvanometer scanning assemblies can deflect the laser beam emitted by the laser to process the workpiece to be processed on the workbench.

[0006] Optionally, there are multiple workbenches, and multiple galvanometer scanning assemblies are provided above each of the workbenches, and the multiple workbenches can be slidably mounted on the frame.

[0007] Optionally, it also includes a beam splitter, which is arranged on the output light path of the laser and is used to split the laser beam emitted by the laser into multiple beams. Each of the galvanometer scanning components deflects a laser beam split by the beam splitter.

[0008] Optionally, the composite laser processing mechanism also includes a first direction driving unit and a second direction driving unit, the first direction driving unit is installed on the second direction driving unit, and the second direction driving unit can drive the first direction driving unit to move along the second direction; multiple workbenches are arranged on the first direction driving unit in sequence along the first direction, and the first direction driving unit can drive the workbenches to move along the first direction.

[0009] Optionally, the composite laser processing mechanism further includes a visual positioning component for positioning, and the visual positioning component is arranged above the workbench.

[0010] Optionally, the galvanometer scanning assembly includes a first galvanometer, a second galvanometer and a mounting base, the mounting base is mounted on the frame, the first galvanometer and the second galvanometer are arranged in the mounting base, and the first galvanometer and the second galvanometer form a galvanometer group, and the galvanometer group processes the workpiece to be processed by deflecting the laser beam emitted by the laser.

[0011] Optionally, the composite laser processing mechanism further comprises a composite laser processing mechanism third direction driving unit, and the third direction driving unit can drive the galvanometer scanning assembly to move along the third direction.

[0012] Optionally, a focusing assembly for focusing is further included, and each of the galvanometer scanning assemblies is provided with one of the focusing assemblies.

[0013] Optionally, there are multiple third-direction drive units, and each of the galvanometer scanning components is connected to one third-direction drive unit.

[0014] According to the composite laser processing mechanism provided by the present embodiment, by arranging multiple galvanometer scanning assemblies and multiple lasers above the workbench, the wavelengths emitted by the multiple lasers are different from each other, and each galvanometer scanning assembly is correspondingly connected to a laser, so that the wavelength of the laser beam deflected by each galvanometer scanning assembly in the present embodiment is different, that is, the galvanometer scanning assembly of the present application has different processing performance. The present application arranges multiple galvanometer scanning assemblies with different processing performances on the workbench, so that when processing the workpiece to be processed, the circulation process on different equipment can be reduced. The present embodiment can complete multiple processing procedures for the workpiece to be processed by one device, so that the processing mechanism of the present embodiment integrates the functions of multiple devices, thereby reducing the defects and efficiency losses caused by the process flow. The workpiece to be processed in the present embodiment can be a PCB board or other workpieces.

[0015] On the other hand, an embodiment of the utility model provides a laser processing device, which is used for processing HDI boards, carrier-like boards and carrier boards, including the above-mentioned composite laser processing mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of a composite laser processing mechanism provided by an embodiment of the utility model;

[0017] Figure 2 yes Figure 1 A magnified image of A;

[0018] Figure 3 yes Figure 1 Enlarged view of B.

[0019] The reference numerals in the specification are as follows:

[0020] 1. Frame; 2. Workbench; 3. Galvanometer scanning assembly; 4. First direction drive unit; 5. Second direction drive unit; 6. Visual positioning assembly; 7. Third direction drive unit. DETAILED DESCRIPTION

[0021] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] like Figures 1 to 3 As shown, an embodiment of the utility model provides a composite laser processing mechanism, including a frame 1, a workbench 2 and a laser processing system, the workbench 2 is arranged on the frame 1, the laser processing system includes a plurality of galvanometer scanning components 3 and a plurality of lasers, the wavelengths of the laser beams emitted by the plurality of lasers are different from each other, the plurality of galvanometer scanning components 3 are arranged above the workbench 2, each galvanometer scanning component 3 is connected to a laser, and the galvanometer scanning component 3 can deflect the laser beam emitted by the laser to process the workpiece to be processed on the workbench 2.

[0023] In one embodiment, there are multiple workbenches 2, and multiple galvanometer scanning assemblies 3 are provided above each workbench 2, and the multiple workbenches 2 can be slidably mounted on the frame 1. In this embodiment, two workbenches 2 are preferably provided, and two galvanometer scanning assemblies 3 are provided on each workbench 2, and the two galvanometer scanning assemblies 3 on each workbench 2 correspond to two lasers emitting laser beams of different wavelengths. The four galvanometer scanning assemblies 3 on the two workbenches 2 of this embodiment can be processed simultaneously, which greatly improves the processing efficiency and increases the equipment production capacity. In this embodiment, the multiple workbenches 2 are connected together end to end in a certain direction. Preferably, the multiple workbenches 2 are connected together end to end in a first direction.

[0024] In one embodiment, a spectroscope is also included, and the spectroscope is used to divide the laser beam emitted by the laser into multiple beams. The spectroscope is arranged on the exit optical path of the laser, and each galvanometer scanning assembly 3 deflects a laser beam separated by the spectroscope. In this embodiment, the galvanometer scanning assembly 3 above different workbenches 2 can deflect the laser beam emitted by the same laser, and the different galvanometer scanning assemblies 3 above each workbench 2 deflect the laser beam emitted by different lasers. In this embodiment, the laser is used to generate continuous laser to process the workpiece to be processed, and each spectroscope preferably separates two laser beams. In this embodiment, the laser includes a first laser pump and gain device and two total reflection mirrors. The spectroscope is arranged at the intersection of the optical path of the two total reflection mirrors, and the spectroscope and the two total reflection mirrors constitute a laser resonant cavity, so that when the laser oscillates in the cavity, two laser beams are output on the spectroscope. Of course, without using a spectroscope, each galvanometer scanning assembly 3 is connected to a laser, and the scheme of connecting different galvanometer scanning assemblies 3 to emit lasers of different wavelengths is also within the protection scope of this embodiment.

[0025] In one embodiment, the composite laser processing mechanism further includes a first direction driving unit 4 and a second direction driving unit 5, wherein the first direction driving unit 4 is mounted on the second direction driving unit 5, and the second direction driving unit 5 can drive the first direction driving unit 4 to move along the second direction; a plurality of workbenches 2 are sequentially arranged on the first direction driving unit 4 along the first direction, and the first direction driving unit 4 can drive the workbenches 2 to move along the first direction. In this embodiment, the first direction driving unit can drive the workbenches 2 to move through structures such as motors and screws. The second direction driving unit 5 can drive the first direction driving unit 4 to move through structures such as motors and screws. The structures of the first direction driving unit 4 and the second direction driving unit 5 are prior art and will not be described in detail here. In this embodiment, the first direction is preferably perpendicular to the second direction. The first direction is preferably the X direction, and the second direction is preferably the Y direction.

[0026] In one embodiment, the composite laser processing mechanism further includes a visual positioning component 6 for positioning, and a visual positioning component 6 is arranged above the workbench 2. In this embodiment, the visual positioning component 6 includes a CCD camera, a mounting plate and a lifting rod, and the CCD camera is mounted on the mounting plate. The lifting rod can drive the mounting plate to move up and down, and is mainly used for positioning, detecting and identifying the workpiece on the workbench 2. When there are multiple workbenches 2, a visual positioning component 6 is arranged above each workbench 2. In this embodiment, each workbench 2 preferably has two galvanometer scanning components 3, and the two galvanometer scanning components 3 share a visual positioning component 6, so that the overlap of the two galvanometer scanning components 3 can be high, and the alignment error increased by multiple alignments of multiple devices can be reduced.

[0027] In one embodiment, the galvanometer scanning assembly 3 includes a first galvanometer, a second galvanometer and a mounting base, the mounting base is mounted on the frame 1, the first galvanometer and the second galvanometer are arranged in the mounting base, and the first galvanometer and the second galvanometer form a galvanometer group, and the galvanometer group processes the workpiece to be processed by the laser beam emitted by the laser. In this embodiment, the axial direction of the first galvanometer is perpendicular to the axial direction of the second galvanometer, the first galvanometer is preferably an X-axis galvanometer, and the second galvanometer is preferably a Y-axis galvanometer. The main working principle of the galvanometer scanning assembly 3 is to make the laser beam incident on the two reflectors (scanning mirrors) of the galvanometer group, and these two reflectors can scan along the X and Y axes respectively, so as to achieve the deflection of the laser beam.

[0028] In one embodiment, the composite laser processing mechanism further includes a third direction driving unit 7, which can drive the galvanometer scanning assembly 3 to move along the third direction. The third direction driving unit 7 can drive the galvanometer scanning assembly 3 to move through a cylinder, a screw, or other devices. In this embodiment, the third direction is perpendicular to the plane where the first direction and the second direction are located. The first direction is preferably the X direction, and the second direction is preferably the Y direction. The third direction is preferably the Z direction.

[0029] In one embodiment, a focusing component is further included, and each galvanometer scanning component 3 is provided with a focusing component. In this embodiment, the focusing component includes a focusing mirror, and the function of the focusing mirror is to focus the laser on the entire workpiece marking plane. In this embodiment, the two galvanometer scanning components 3 on each workbench 2 share a visual positioning component 6, and the two galvanometer scanning components 3 on each workbench 2 respectively have a focusing component, and each galvanometer scanning component 3 can be moved up and down by a third directional driving unit 7 to adjust the laser focal length.

[0030] In one embodiment, there are multiple third-direction drive units, and each galvanometer scanning assembly 3 is connected to a third-direction drive unit 7 .

[0031] In one embodiment, the galvanometer scanning assembly 3 includes at least one of an ultraviolet nanosecond galvanometer scanning assembly 3, a green light picosecond galvanometer scanning assembly 3, and an infrared picosecond galvanometer scanning assembly 3. In this embodiment, the device can complete more than two processes on one machine according to the processed material. For example, the copper window can be opened by ultraviolet nanoseconds and the medium can be removed by picosecond laser, thereby achieving the functions of opening the copper window and removing the medium on one machine at the same time. At the same time, the processing of second-order or multi-order holes can be realized, reducing the problem of increased alignment errors caused by using different equipment for multiple processes.

[0032] According to the composite laser processing mechanism provided in this embodiment, by arranging multiple galvanometer scanning assemblies 3 and multiple lasers above the workbench 2, the wavelengths emitted by the multiple lasers are different from each other, and each galvanometer scanning assembly 3 is connected to a corresponding laser, so that the wavelength of the laser beam deflected by each galvanometer scanning assembly 3 in this embodiment is different, that is, the galvanometer scanning assembly 3 of the present application has different processing performance. The present application arranges multiple galvanometer scanning assemblies 3 with different processing performances on the workbench 2, so that when processing the workpiece to be processed, the circulation process on different equipment can be reduced. In this embodiment, a variety of processing procedures for the workpiece to be processed can be completed by one device, so that the processing mechanism of this embodiment integrates the functions of multiple devices, thereby reducing the defects and efficiency losses caused by the process flow. The workpiece to be processed in this embodiment can be a PCB board or other workpieces.

[0033] In addition, an embodiment of the present invention provides a laser processing device, which is used to process HDI boards, carrier-like boards and carrier boards, including the composite laser processing mechanism of the above embodiment.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A composite laser processing mechanism, characterized in that: It includes a frame, a workbench and a laser processing system. The workbench is arranged on the frame. The laser processing system includes multiple galvanometer scanning components and multiple lasers. The wavelengths of laser beams emitted by the multiple lasers are different from each other. The multiple galvanometer scanning components are arranged above the workbench. Each of the galvanometer scanning components is connected to one of the lasers. The galvanometer scanning components can deflect the laser beam emitted by the laser to process the workpiece to be processed on the workbench.

2. The composite laser processing mechanism according to claim 1, characterized in that: There are multiple workbenches, and multiple galvanometer scanning assemblies are arranged above each of the workbenches. The multiple workbenches can be slidably mounted on the frame.

3. The composite laser processing mechanism according to claim 2, characterized in that: It also includes a beam splitter, which is arranged on the outgoing light path of the laser and is used to split the laser beam emitted by the laser into multiple beams. Each of the galvanometer scanning components deflects a laser beam split by the beam splitter.

4. The composite laser processing mechanism according to claim 2, characterized in that: It also includes a first direction driving unit and a second direction driving unit, the first direction driving unit is installed on the second direction driving unit, and the second direction driving unit can drive the first direction driving unit to move along the second direction; multiple workbenches are arranged on the first direction driving unit in sequence along the first direction, and the first direction driving unit can drive the workbenches to move along the first direction.

5. The composite laser processing mechanism according to claim 1, characterized in that: It also includes a visual positioning component for positioning, and the visual positioning component is arranged above the workbench.

6. The composite laser processing mechanism according to claim 1, characterized in that: The galvanometer scanning assembly includes a first galvanometer, a second galvanometer and a mounting base, the mounting base is mounted on the frame, the first galvanometer and the second galvanometer are arranged in the mounting base, and the first galvanometer and the second galvanometer form a galvanometer group, and the galvanometer group processes the workpiece to be processed by deflecting the laser beam emitted by the laser.

7. The composite laser processing mechanism according to claim 1, characterized in that: It also includes a third direction driving unit, which can drive the galvanometer scanning assembly to move along the third direction.

8. The composite laser processing mechanism according to claim 1, characterized in that: It also includes a focusing component for focusing, and each of the galvanometer scanning components is provided with a focusing component.

9. The composite laser processing mechanism according to claim 7, characterized in that: There are multiple third-direction drive units, and each of the galvanometer scanning components is connected to one third-direction drive unit.

10. A laser processing device, used for processing HDI boards, carrier-like boards and carrier boards, characterized in that: A composite laser processing mechanism comprising any one of claims 1-9.

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